MOTOROLA CMOS LOGIC DATA 1
MC14506UB
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The MC14506UB is an expandable AND–OR–INVERT gate with inhibit
and 3–state output. The expand option allows cascading with any other gate,
which may be carried as far as desired as long as the propagation delay
added with each gate is considered. For example, the second AOI gate in
this device may be used to expand the first gate, giving an expanded 4–wide,
2–input AOI gate. This device is useful in data control and digital multiplexing
applications.
3–State Output
Separate Inhibit Line
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol Parameter Value Unit
VDD DC Supply Voltage – 0.5 to + 18.0 V
Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current (DC or Transient),
per Pin ± 10 mA
PDPower Dissipation, per Package† 500 mW
Tstg Storage Temperature – 65 to + 150
_
C
TLLead Temperature (8–Second Soldering) 260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/
_
C From 65
_
C To 125
_
C
Ceramic “L” Packages: – 12 mW/
_
C From 100
_
C To 125
_
C
LOGIC DIAGRAM
AA1
BA2
CA3
DA4
EA5
INH 6
DIS 14
EB13
DB12
CB11
BB10
AB9
3–STATE
OUTPUT DISABLE
15 ZA
7 ZB
VDD = PIN 16
VSS = PIN 8
Z = (AB + CD + E + I)

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3
1/94

L SUFFIX
CERAMIC
CASE 620
ORDERING INFORMATION
MC14XXXUBCP Plastic
MC14XXXUBCL Ceramic
MC14XXXUBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, pre-
cautions must be taken to avoid applications of
any voltage higher than maximum rated volt-
ages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained
to the range VSS
v
(Vin or Vout)
v
VDD.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either VSS
or VDD). Unused outputs must be left open.
TRUTH TABLE
A B C D E Inhibit Disable Z
0 0 0 0 1 0 0 1
0 X 0 X 1 0 0 1
0 X X 0 1 0 0 1
X 0 0 X 1 0 0 1
X 0 X 0 1 0 0 1
1 1 X X X X 0 0
X X 1 1 X X 0 0
X X X X 0 X 0 0
X X X X X 1 0 0
X X X X X X 1 High
Impedance
X = Don’t Care
MOTOROLA CMOS LOGIC DATAMC14506UB
2
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
VDD
Vdc
– 55
_
C 25
_
C 125
_
C
Unit
Characteristic
Symbol
VDD
Vdc
Min Max Min Typ # Max Min Max
Unit
Output Voltage
“0” Level
Vin = VDD or 0
“1” Level
Vin = 0 or VDD
VOL 5.0
10
15
0.05
0.05
0.05
0
0
0
0.05
0.05
0.05
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD
VOH 5.0
10
15
4.95
9.95
14.95
4.95
9.95
14.95
5.0
10
15
4.95
9.95
14.95
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIL 5.0
10
15
1.0
2.0
2.5
2.25
4.50
6.75
1.0
2.0
2.5
1.0
2.0
2.5
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH 5.0
10
15
4.0
8.0
12.5
4.0
8.0
12.5
2.75
5.50
8.25
4.0
8.0
12.5
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH 5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
– 1.7
– 0.36
– 0.9
– 2.4
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
0.51
1.3
3.4
0.88
2.25
8.8
0.36
0.9
2.4
mAdc
Input Current Iin 15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(Vin = 0) Cin 5.0 7.5 pF
Quiescent Current
(Per Package) IDD 5.0
10
15
1.0
2.0
4.0
0.002
0.004
0.006
1.0
2.0
4.0
30
60
120
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT5.0
10
15
IT = (0.6 µA/kHz) f + IDD
IT = (1.1 µA/kHz) f + IDD
IT = (1.7 µA/kHz) f + IDD
µAdc
Three–State Leakage Current ITL 15 ± 0.1 ± 0.0001 ± 0.1 ± 3.0 µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’ s potential performance.
**The formulas given are for the typical characteristics only at 25
_
C.
To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
DB
EB
DISABLE
ZA
VDD
AB
BB
CB
DA
CA
BA
AA
VSS
ZB
INH
EA
MOTOROLA CMOS LOGIC DATA 3
MC14506UB
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25
_
C)
Characteristic Symbol VDD Min Typ # Max Unit
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH, tTHL 5.0
10
15
100
50
40
200
100
80
ns
Data Propagation Delay Time
tPLH = (1.7 ns/pF) CL + 210 ns
tPLH = (0.66 ns/pF) CL + 77 ns
tPLH = (0.5 ns/pF) CL + 50 ns
tPLH 5.0
10
15
295
110
75
580
225
180
ns
tPHL = (1.7 ns/pF) CL + 185 ns
tPHL = (0.66 ns/pF) CL + 62 ns
tPHL = (0.5 ns/pF) CL + 40 ns
tPHL 5.0
10
15
270
95
65
480
175
140
ns
Expand Propagation Delay Time
tPLH = (1.7 ns/pF) CL + 95 ns
tPLH = (0.66 ns/pF) CL + 42 ns
tPLH = (0.5 ns/pF) CL + 25 ns
tPLH 5.0
10
15
180
75
50
430
160
125
ns
tPHL = (1.7 ns/pF) CL + 115 ns
tPHL = (0.66 ns/pF) CL + 47 ns
tPHL = (0.5 ns/pF) CL + 30 ns
tPHL 5.0
10
15
200
80
55
330
110
90
ns
Inhibit Propagation Delay Time
tPLH = (1.7 ns/pF) CL + 135 ns
tPLH = (0.66 ns/pF) CL + 67 ns
tPLH = (0.5 ns/pF) CL + 40 ns
tPLH 5.0
10
15
220
100
65
500
225
160
ns
tPHL = (1.7 ns/pF) CL + 145 ns
tPHL = (0.66 ns/pF) CL + 62 ns
tPHL = (0.5 ns/pF) CL + 35 ns
tPHL 5.0
10
15
230
95
60
400
175
150
ns
3–State Propagation Delay Time
“1” to High Impedance tPHZ 5.0
10
15
60
45
35
150
110
90
ns
“0” to High Impedance tPLZ 5.0
10
15
90
55
40
225
140
100
ns
High Impedance to “1” tPZH 5.0
10
15
110
50
40
300
125
100
ns
High Impedance to “0” tPZL 5.0
10
15
170
70
50
425
175
125
ns
*The formulas given are for the typical characteristics only at 25
_
C.
#Data labelled “Typ” Is not to be used for design purposes but is intended as an indication of the IC’ s potential performance.
Figure 1. Typical Voltage Transfer Characteristics
(a) Expand Inputs (b) Data Inputs
161412108.06.04.02.00
16
14
12
10
8.0
6.0
4.0
2.0
0
Vin, INPUT VOLTAGE (Vdc)
Vout , OUTPUT VOLTAGE (Vdc)
abc
c
ab
a
bc
VDD = 15 Vdc
10 Vdc
5.0 Vdc
a
b
c
TA = + 125
°
C
TA = + 25
°
C
TA = – 55
°
C
UNUSED INPUTS
CONNECTED TO
VSS
161412108.06.04.02.00
16
14
12
10
8.0
6.0
4.0
2.0
0
Vin, INPUT VOLTAGE (Vdc)
Vout , OUTPUT VOLTAGE (Vdc)
a
b
c
TA = + 125
°
C
TA = + 25
°
C
TA = – 55
°
C
A AND B CONNECTED TO Vin
ENABLE INPUT CONNECTED TO
VDD. OTHER INPUTS CONNECTED
TO VSS.
VDD = 15 Vdc
10 Vdc
5.0 Vdc
bc
a
b
ac
bc
a
MOTOROLA CMOS LOGIC DATAMC14506UB
4
Figure 2. Typical Output Source
Characteristics Test Circuit Figure 3. Typical Output Sink
Characteristics Test Circuit
EXTERNAL
POWER
SUPPLY
IOH
VOH
VDD
16
VSS
8
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
VDD
16
VOL
IOL
EXTERNAL
POWER
SUPPLY
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
VSS
8
Figure 4. 3–State Leakage Current
Test Circuit Figure 5. Typical Power Dissipation
Test Circuit
VDD
VDD
ITL
16
VSS
8
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
PULSE
GENERATOR
50% DUTY CYCLE
0.01
µ
F
CERAMIC
VDD 16
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
VSS
8CLCL
IDD
500
µ
F
B
A
MOTOROLA CMOS LOGIC DATA 5
MC14506UB
Figure 6. Switching Time Test Circuit and Waveforms
(Data Inputs)
16
VSS
8
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
PULSE
GENERATOR
CL
VDD
CL
20 ns 20 ns
VDD
VSS
VOH
VOL
OUTPUT
INPUT 90%
50%
10%
tPHL tPLH
50%
90%
10%
tTHL tTLH
VDD Vout VDD
16
ZA
ZB
INH
AA
BA
CA
DA
EA
AB
BB
CB
DB
EB
DIS
VSS
8
PULSE
GENERATOR
B
A
CL1 k
A
B
S2
20 ns 20 ns
DISABLE
INPUT 90%
50%
10%
tPLZ tPZL VOH
VOL
10%
tPZH
tPHZ
90%
10% 90%
OUTPUT
2.5 V @ VDD = 5 V,
10 V AND 15 V
2 V @ VDD = 5 V
6 V @ VDD = 10 V
10 V @ VDD = 15 V
S1
*To test other side of circuit connect to this output and
change switch (S1) to other expand input (E).
SWITCH POSITIONS
TEST S1 S2
tPLZ A A
tPHZ B B
tPZL A A
tPZH B B
Figure 7. Switching Time Test Circuit and Waveforms
(For 3–State Output)
MOTOROLA CMOS LOGIC DATAMC14506UB
6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
MOTOROLA CMOS LOGIC DATA 7
MC14506UB
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
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and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided
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MC14506UB/D
*MC14506UB/D*