ISL54209IRUZ-T7A - Intersil

ISL54209

MP3/USB 2.0 High Speed Switch with Negative

Signal Handling and Low Power Shutdown

ISL54209

The Intersil ISL54209 dual SPDT (Single Pole/Double

Throw) switch combines low distortion audio and

accurate USB 2.0 high speed data (480Mbps) signal

switching in the same low voltage device. When

operated with a 2.5V to 5.0V single supply, this analog

switch allows audio signal swings below ground,

allowing for the use of a common USB and audio

headphone connector in Personal Media Players and

other portable battery powered devices.

The ISL54209 logic control pins are 1.8V compatible,

which allows for control via a standard µcontroller.

The ISL54209 has an audio enable control pin to open all

switches and put the part in a low power state. In this

state, the device draws typically 1nA of current.

The ISL54209 is available in a small 10 Ld 1.8mm x

1.4mm or 2.1mmx 1.6mm ultra-thin µTQFN packages

and a 10 Ld 3mmx3mm TDFN package. It operates over

a temperature range of -40°C to +85°C.

Related Literature

• Technical Brief TB363 “Guidelines for Handling and

Processing Moisture Sensitive Surface Mount Devices

(SMDs)”

• Application Note AN1406 “ISL54209EVAL1Z

Evaluation Board User’s Manual”

Features

• High Speed (480Mbps) and Full Speed (12Mbps)

Signaling Capability per USB 2.0

• Low Distortion Negative Signal Capability

• Low Power Shutdown State

• Low Distortion Headphone Audio Signals

-THD+N at 1mW into 32Ω Load. . . . . . .<0.013%

• Crosstalk (100kHz). . . . . . . . . . . . . . . . . . -95dB

• OFF-Isolation (100kHz) . . . . . . . . . . . . . . . 95dB

• Single Supply Operation (VDD) . . . . . 2.5V to 5.0V

• -3dB Bandwidth USB Switch . . . . . . . . . . 736MHz

• Available in µTQFN and TDFN Packages

• COM Pins Over-voltage Tolerant to 5.5V

• Compliant with USB 2.0 Short Circuit Requirements

Without Additional External Components

• Pb-Free (RoHS Compliant)

Applications*(see page 16)

• MP3 and other Personal Media Players

• Cellular/Mobile Phones

•PDAs

• Audio/USB Switching

Application Block Diagram

ISL54209

USB

TRANSCEIVER

HIGH-SPEED

AUDIO

USB/HEADPHONE JACK

COM -

COM +

GND

D-

D+

VDD

CTRL

LOGIC CONTROL µCONTROLLER

4MΩ

CODEC

VBUS

3.3V

50kΩ50kΩ

4MΩ

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

June 10, 2010

FN6627.4

2FN6627.4

June 10, 2010

Pin Configurations (Note 1)

ISL54209

(10 LD 2.1mmx1.6mm µTQFN)

TOP VIEW

ISL54209

(10 LD 3.0mmx3.0mm TDFN)

TOP VIEW

ISL54209

(10 LD 1.8mmx1.4mm µTQFN)

TOP VIEW

NOTE:

1. ISL54209 Switches Shown for IN = Logic “0” and CTRL = Logic “1”.

D-

COM - L

CTRL

8D+

COM + R

GND

VDD LOGIC

CONTROL

50k

D-

COM -

8D+

COM +

VDD 1

GND

10 CTRL

LOGIC

CONTROL

50k

4MΩ

VDD

IN COM -

COM +

D-

D+

GND

CTRL

LOGIC

50k

CONTROL

Truth Table

ISL54209

IN CTRL L, R D+, D-

00OFFOFF

0 1 ON OFF

1XOFFON

IN, CTRL: Logic “0” when ≤ 0.5V or Floating, Logic “1” when

≥ 1.4V with 2.7V to 3.6V Supply.

ISL54209

3FN6627.4

June 10, 2010

Pin Descriptions

TDFN

µTQFN

2.1mmx1.6mm

µTQFN

1.8mmx1.4mm NAME FUNCTION

1 1 10 VDD Power Supply

2 2 1 IN Digital Control Input

3 3 2 COM- Voice and Data Common Pin

4 4 3 COM+ Voice and Data Common Pin

5 5 4 GND Ground Connection

6 6 5 R Audio Right Input

7 7 6 L Audio Left Input

8 8 7 D+ USB Differential Input

9 9 8 D- USB Differential Input

10 10 9 CTRL Digital Control Input (Audio Enable)

PD - - PD Thermal Pad. Tie to Ground or Float

Ordering Information

PART

NUMBER

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL54209IRUZ-T

(Notes 3, 4, 5)

GF -40 to +85 10 Ld 2.1mmx1.6mm µTQFN L10.2.1x1.6A

ISL54209IRU1Z-T

(Notes 3, 4, 5)

U4 -40 to +85 10 Ld 1.8mmx1.4mm µTQFN L10.1.8x1.4A

ISL54209IRTZ-T

(Notes 2, 4, 5)

4209 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A

ISL54209IRTZ

(Notes 2, 5)

4209 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A

ISL54209EVAL1Z ISL54209 Eval Kit

NOTES:

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach

materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both

SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that

meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach

materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free

soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed

the Pb-free requirements of IPC/JEDEC J STD-020.

4. Please refer to TB347 for details on reel specifications.

5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54209. For more information on MSL please

see techbrief TB363.

ISL54209

4FN6627.4

June 10, 2010

Absolute Maximum Ratings Thermal Information

VDD to GND. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V

Input Voltages

D+, D- (Note 6) . . . . . . . . . . . . . . . . . . . . . - 2V to 5.5V

L, R (Note 6). . . . . . . . . . . . . . . . - 2V to ((VDD) + 0.3V)

IN, CTRL (Note 6) . . . . . . . . . . . -0.3V to ((VDD) + 0.3V)

Output Voltages

COM-, COM+ (Note 6) . . . . . . . . . . . . . . . . . -2V to 5.5V

Continuous Current (Audio Switches) . . . . . . . . . . ±150mA

Peak Current (Audio Switches)

(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±300mA

Continuous Current (USB Switches) . . . . . . . . . . . . ±40mA

Peak Current (USB Switches)

(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA

ESD Ratings

Human Body Model, I/0 to GND . . . . . . . . . . . . . . . >4kV

Human Body Model, All Other Pins. . . . . . . . . . . . .>3.5kV

Human Body Model, VDD to GND. . . . . . . . . . . . . . >11kV

Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . >250V

Charged Device Model . . . . . . . . . . . . . . . . . . . . . . >2kV

Latch-up Tested per JEDEC: ClassII Level A > . . . . @ +85°C

Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W)

10 Ld 2.1mmx1.6mm µTQFN (Notes 8, 10). .154 100

10 Ld 3mmx3mm TDFN (Notes 7, 9) . . 58 18

10 Ld 1.8mmx1.4mm µTQFN (Notes 8, 10). 160 105

Maximum Junction Temperature (Plastic Package). . +150°C

Maximum Storage Temperature Range. . . . . -65°C to +150°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C

Audio Signal Range . . . . . . . . . . . . . . . . . . . . -1.5V to 1.5V

USB Signal Range . . . . . . . . . . . . . . . . . . . . . . . 0V to VDD

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact

product reliability and result in failures not covered by warranty.

NOTES:

6. Signals on D+, D-, L, R, COM-, COM+, CTRL and IN exceeding VDD or GND by specified amount are clamped. Limit current to

maximum current ratings.

7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”

features. See Tech Brief TB379.

8. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief

TB379 for details.

9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

10. For θJC, the “case temp” location is taken at the package top center.

Electrical Specifications - 2.7V to 3.6V Supply Test C o n ditio n s: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,

VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,

-40°C to +85°C.

PARAMETER TEST CONDITIONS

TEMP

(°C)

MIN

(Notes 12, 13) TYP

MAX

(Notes 12, 13) UNITS

ANALOG SWITCH CHARACTERISTICS

Audio Switches (L, R)

Analog Signal Range,

VANALOG

VDD = 3.3V, IN = 0.5V, CTRL = 1.4V Full -1.5 -1.5 V

ON-Resistance, rON VDD = 3.0V, IN = 0.5V, CTRL = 1.4V,

ICOMx = 40mA, VL or VR = -0.85V to 0.85V

(Figure 3, Note 15)

+25 - 2.5 2.8 Ω

Full --3.4 Ω

rON Matching Between

Channels, ΔrON

VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx

= 40mA, VL or VR = Voltage at max rON over

signal range of -0.85V to 0.85V (Notes 15,

16)

+25 - 0.09 0.25 Ω

Full --0.26 Ω

rON Flatness, rFLAT(ON) VDD = 3.0V, IN = 0.5V, CTRL = 1.4V,

ICOMx = 40mA, VL or VR = -0.85V to 0.85V

(Notes 14, 15)

+25 - 0.02 0.05 Ω

Full --0.07 Ω

ON-Resistance, rON VDD = 5.0V, IN = 0V, CTRL = VDD, ICOMx =

40mA, VL or VR = -0.85V to 0.85V (Figure 3)

25 - 2.3 - Ω

ISL54209

5FN6627.4

June 10, 2010

ON-Resistance, rON VDD = 4.2V, IN = 0V, CTRL = VDD,

ICOMx =40mA, V

L or VR = -0.85V to 0.85V

(Figure 3)

25 - 2.35 - Ω

ON-Resistance, rON VDD = 2.85V, IN = 0V, CTRL = VDD, ICOMx =

40mA, VL or VR = -0.85V to 0.85V (Figure 3)

25 - 2.72 - Ω

Discharge Pull-Down

Resistance, RL, RR

VDD = 3.6V, IN = 0V, CTRL = 1.4V, VCOM- or

VCOM+ = -0.85V, 0.85V, VL or VR = -0.85V,

0.85V, VD+ and VD- = floating; measure

current through the discharge pull-down

resistor and calculate resistance value.

+25 - 50 - kΩ

USB Switches (D+, D-)

Analog Signal Range,

VANALOG

VDD = 2.7V to 3.6V, IN = 1.4V, CTRL = 1.4V Full 0-VDD V

ON-Resistance, rON

(High-Speed)

VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,

ICOMx = 40mA, VD+ or VD- = 0V to 400mV

(Figure 4, Note 15)

25 - 5 6.5 Ω

Full --7Ω

rON Matching Between

Channels, ΔrON

(High-Speed)

VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx

= 40mA, VD+ or VD- = Voltage at max rON

(Notes 15, 16)

25 - 0.05 0.25 Ω

Full --0.55 Ω

rON Flatness, rFLAT(ON)

(High-Speed)

VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,

ICOMx = 40mA, VD+ or VD- = 0V to 400mV

(Notes 14, 15)

25 - 0.45 0.55 Ω

Full --1.0 Ω

ON-Resistance, rON

(Full-Speed)

VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,

ICOMx = 1mA, VD+ or VD- = 3.3V (Figure 4,

Note 15)

25 - 25 30 Ω

Full --35 Ω

ON-Resistance, rON VDD = 5.0V, IN = VDD, CTRL = VDD, ICOMx =

1mA, VD+ or VD- = 5V (Figure 4)

+25 - 20 - Ω

ON-Resistance, rON VDD = 4.2V, IN = VDD, CTRL = VDD, ICOMx =

1mA, VD+ or VD- = 4.2V (Figure 4)

25 - 22 - Ω

ON-Resistance, rON VDD = 2.85V, IN = VDD, CTRL = VDD, ICOMx

= 1mA, VD+ or VD- = 2.85V (Figure 4)

25 - 28 - Ω

OFF-Leakage Current,

ID+(OFF) or ID-(OFF)

VDD = 3.6V, IN = 0V, CTRL = 3.6V, VCOM- or

VCOM+ = 0.5V, 0V, VD+ or VD- = 0V, 0.5V,

VLand VR = float

25 -5 0.5 5 nA

Full -60 -60 nA

ON-Leakage Current, IDX VDD = 3.6V, IN = VDD, CTRL = 0V or VDD,

VD+ or VD- = 2.7V, VCOM- or VCOM+ =Float,

VL and VR = float

25 -10 2 10 nA

Full -70 -70 nA

DYNAMIC CHARACTERISTICS

USB Turn-ON Time, tON VDD = 3.0V, RL = 50Ω, CL = 10pF (Figure 1) 25 - 52 - ns

USB Turn-OFF Time, tOFF VDD = 3.0V, RL = 50Ω, CL = 10pF (Figure 1) 25 - 20 - ns

Audio Turn-ON Time, tON VDD = 3.0V, RL = 50Ω, CL = 10pF (Figure 1) 25 - 2.5 - µs

Audio Turn-OFF Time,

tOFF

VDD = 3.0V, RL = 50Ω, CL = 10pF (Figure 1) 25 - 50 - ns

Break-Before-Make Time

Delay, tD

VDD = 3.0V, RL = 50Ω, CL = 10pF (Figure 2) 25 - 44 - ns

Electrical Specifications - 2.7V to 3.6V Supply Test C o n ditio n s: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,

VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER TEST CONDITIONS

TEMP

(°C)

MIN

(Notes 12, 13) TYP

MAX

(Notes 12, 13) UNITS

ISL54209

6FN6627.4

June 10, 2010

Skew, tSKEW VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45Ω,

CL = 10pF, tR = tF= 720ps at 480Mbps,

(Duty Cycle = 50%) (Figure 7)

25 - 50 - ps

Tota l Jitter, tJVDD =3.0V, IN = 3V, CTRL = 3V, RL = 50Ω,

CL = 10pF, tR = tF= 750ps at 480Mbps

25 - 210 - ps

Propagation Delay, tPD VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45Ω,

CL = 10pF (Figure 7)

25 - 250 - ps

Audio Crosstalk

R to COM-, L to COM+

VDD = 3.0V, IN = 0V, CTRL = 3.0V,

RL=32Ω, f = 20Hz to 20kHz, VR or

VL= 0.707VRMS (2VP-P) (Figure 6)

25 - -110 - dB

Crosstalk

(Audio to USB, USB to

Audio)

VDD = 3.0V, RL = 50Ω, f = 100kHz

(Figure 6)

25 - -95 - dB

OFF-Isolation VDD = 3.0V, RL = 50Ω, f = 100kHz 25 - 95 - dB

OFF-Isolation VDD = 3.0V, RL = 32Ω, f = 20Hz to 20kHz 25 - 114 - dB

Total Harmonic Distortion f = 20Hz to 20kHz, VDD = 3.0V, IN = 0V,

CTRL = 3.0V, VL or VR = 180mVRMS

(509mVP-P), RL = 32Ω

25 - 0.013 - %

Total Harmonic Distortion f = 20Hz to 20kHz, VDD = 3.0V, IN = 0V,

CTRL = 3.0V, VL or VR = 0.707VRMS (2VP-P),

RL = 32Ω

25 - 0.06 - %

USB Switch -3dB

Bandwidth

Signal = 0dBm, 0.2VDC offset, RL = 50Ω, CL

= 5pF

25 - 736 - MHz

D+/D- OFF-Capacitance,

CDxOFF

f = 1MHz, VDD = 3.0V, IN = 0V, CTRL = 3.0V,

VD- or VD+ = VCOMx = 0V (Figure 5)

25 - 3 - pF

L/R OFF-Capacitance,

CLOFF

, CROFF

f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V

or 3V, VL or VR = VCOMx = 0V (Figure 5)

25 - 5 - pF

COM ON-Capacitance,

CCOMx(ON)

f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V

or 3V, VD- or VD+ = VCOMx = 0V (Figure 5)

25 - 8 - pF

POWER SUPPLY CHARACTERISTICS

Power Supply Range,

VDD

Full 2.5 5.0 V

Positive Supply Current,

IDD

VDD = 3.6V, IN = 0V or 3.6V, CTRL = 3.6V 25 - 7 13 µA

Full --15 µA

Positive Supply Current,

IDD (Low Power State)

VDD = 3.6V, IN = 0V, CTRL = 0V or float 25 - 1 10 nA

Full --150 nA

Power OFF-Current, IDx

ICOMx

VDD = 0V, VDx = VCOMx = 5.25V, IN = CTRL

= Float

25 - 7 - µA

DIGITAL INPUT CHARACTERISTICS

Voltage Low, VINL,

VCTRLL

VDD = 2.7V to 3.6V Full --0.5 V

Voltage High, VINH,

VCTRLH

VDD = 2.7V to 3.6V Full 1.4 --V

Electrical Specifications - 2.7V to 3.6V Supply Test C o n ditio n s: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,

VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER TEST CONDITIONS

TEMP

(°C)

MIN

(Notes 12, 13) TYP

MAX

(Notes 12, 13) UNITS

ISL54209

7FN6627.4

June 10, 2010

Input Current, IINL,

ICTRLL

VDD = 3.6V, IN = 0V, CTRL = 0V Full -50 20 50 nA

Input Current, IINH VDD = 3.6V, IN = 3.6, CTRL = 0V Full -2 0.9 2µA

Input Current, ICTRLH VDD = 3.6V, IN = 0V, CTRL = 3.6V Full -2 0.9 2µA

CTRL Pull-Down Resistor,

RCTRL

VDD = 3.6V, IN = 0V, CTRL = 3.6V; measure

current through the internal pull-down

resistor and calculate resistance value.

Full -4-MΩ

IN Pull-Down Resistor,

RIN

VDD = 3.6V, IN = 3.6V, CTRL = 3.6V;

measure current through the internal

pull-down resistor and calculate resistance

value.

Full -4-MΩ

NOTES:

11. VLOGIC = Input voltage to perform proper function.

12. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this

data sheet.

13. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established

by characterization and are not production tested.

14. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal

range.

15. Limits established by characterization and are not production tested.

16. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel

with lowest max rON value, between L and R or between D+ and D-.

Electrical Specifications - 2.7V to 3.6V Supply Test C o n ditio n s: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,

VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,

-40°C to +85°C. (Continued)

PARAMETER TEST CONDITIONS

TEMP

(°C)

MIN

(Notes 12, 13) TYP

MAX

(Notes 12, 13) UNITS

ISL54209

8FN6627.4

June 10, 2010

Test Circuits and Waveforms

Logic input waveform is inverted for switches that have the

opposite logic sense.

FIGURE 1A. MEASUREMENT POINTS

Repeat test for all switches. CL includes fixture and stray

capacitance.

FIGURE 1B. TEST CIRCUIT

FIGURE 1. SWITCHING TIMES

FIGURE 2A. MEASUREMENT POINTS Repeat test for all switches. CL includes fixture and stray

capacitance.

FIGURE 2B. TEST CIRCUIT

FIGURE 2. BREAK-BEFORE-MAKE TIME

FIGURE 3. AUDIO rON TEST CIRCUIT FIGURE 4. USB rON TEST CIRCUIT

50%

tr < 20ns

tf < 20ns

tOFF

90%

VINH

VINPUT

VINL

tON

LOGIC

INPUT

SWITCH

INPUT

SWITCH

OUTPUT

90%

VOUT

VOUT V(INPUT)

RLrON

------------------------

SWITCH

INPUT

VIN

VOUT

RL CL

COMx

AUDIO OR USB

50Ω10pF

GND

VDD C

CTRL

VINPUT

90%

VINH

VINL

LOGIC

INPUT

SWITCH

OUTPUT

VOUT

VIN

COMx

RLCL

VOUT

10pF

50Ω

D- OR D+

L OR R

VDD

GND

VINPUT

CTRL

VDD

0V OR FLOAT

L OR R

COMx

GND

VL OR VR

rON = V1/40mA

40mA

Repeat test for all switches.

CTRL

VDD

D- OR D+

COMx

GND

VD- OR VD+

rON = V1/40mA

40mA

Repeat test for all switches.

CTRL

ISL54209

9FN6627.4

June 10, 2010

FIGURE 5. CAPACITANCE TEST CIRCUIT FIGURE 6. AUDIO CROSSTALK TEST CIRCUIT

FIGURE 7A. MEASUREMENT POINTS FIGURE 7B. TEST CIRCUIT

FIGURE 7. SKEW TEST

Test Circuits and Waveforms (Continued)

VDD C

GND

AUDIO OR USB

COMx

IMPEDANCE

ANALYZER 0V OR VDD

Repeat test for all switches.

CTRL

ANALYZER

VDD C

L OR R

SIGNAL

GENERATOR

GND

COMx 32Ω

COMx R OR L

Signal direction through switch is reversed, worst case values

are recorded. Repeat test for all switches.

CTRL

DIN+

DIN-

OUT+

OUT-

50%

90%

10%

90%

50%

90%

50%

tri

tfitro

tf0

tskew_i

tskew_o

OUT+

COM-

D+

GND

VDD C

D-

COM+

OUT-

DIN+

DIN-

|tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals.

|tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals.

|tskew_0| Change in Skew through the Switch for Output Signals.

|tskew_i| Change in Skew through the Switch for Input Signals.

15.8Ω

143Ω

45Ω

CTRL

VDD

ISL54209

10 FN6627.4

June 10, 2010

Typical Application Block Diagrams

FIGURE 8. LOGIC CONTROL VIA MICRO-PROCESSOR

FIGURE 9. LOGIC CONTROL VIA VBUS VOLTAGE FROM COMPUTER OR USB HUB

50kΩ

ISL54209

USB

TRANSCEIVER

HIGH-SPEED

AUDIO

USB/HEADPHONE JACK

COM -

COM +

GND

D-

D+

VDD

CTRL

LOGIC CONTROL

µCONTROLLER

4MΩ

CODEC

VBUS

3.3V

50kΩ

4MΩ

ISL54209

USB

TRANSCEIVER

HIGH-SPEED

AUDIO

USB/HEADPHONE JACK

COM -

COM +

GND

D-

D+

VDD

CTRL

LOGIC CONTROL

µCONTROLLER

4MΩ

CODEC

VBUS

3.3V

50kΩ

4MΩ

500kΩ

ISL54209

11 FN6627.4

June 10, 2010

Detailed Description

The ISL54209 device is a dual single pole/double throw

(SPDT) analog switch that operates from a single DC

power supply in the range of 2.5V to 5.0V. It was

designed to function as a dual 2 to 1 multiplexer to select

between USB differential data signals and audio L and R

stereo signals. It comes in tiny µTQFN and TDFN

packages for use in MP3 players, PDAs, cellular phones

and other personal media players.

The part consists of two 2.5Ω audio switches and two 5Ω

USB switches. The audio switches can accept signals that

swing below ground. They were designed to pass audio

left and right stereo signals, that are ground referenced,

with minimal distortion. The USB switches were designed

to pass high-speed USB differential data signals with

minimal edge and phase distortion.

The ISL54209 was specifically designed for MP3 players,

personal media players and cellular phone applications

that need to combine the audio headphone jack and the

USB data connector into a single shared connector,

thereby saving space and component cost. “Typical

Application Block Diagrams” on page 10 of this

functionality are shown in Figures 8 and 9.

The ISL54209 has a single logic control pin (IN) that

selects between the audio switches and the USB

switches. This pin can be driven Low or High to switch

between the audio CODEC drivers and USB transceiver of

the MP3 player or cellular phone. The ISL54209 also

contains a logic control pin (CTRL) that when driven Low

while IN is Low, opens all switches and puts the part into

a low power state, drawing typically 1nA of IDD current.

Detailed descriptions of the two types of switches are

provided in the following sections.

Audio Switches

The two audio switches (L, R) are 2.5Ω switches that can

pass signals that swing below ground by as much as

1.5V. They were designed to pass ground reference

stereo signals with minimal insertion loss and very low

distortion over a ±1V signal range.

Crosstalk between the audio channels is -110dB over the

audio band. Crosstalk between the audio channel and

USB channel is -95dB at 100kHz. These switches have

excellent OFF-isolation, 114dB, over the audio band with

a 32Ω load.

Over a signal range of ±1V (0.707VRMS) with

VDD > 2.7V, these switches have an extremely low rON

resistance variation. They can pass ground referenced

audio signals with very low distortion (<0.06% THD+N)

when delivering 15.6mW into a 32Ω headphone speaker

load. See Figures 10 and 11.

These switches are bi-directional switches. In typical

applications, the audio drivers would be connected at the

L and R side of the switch and the speaker loads would

be connected at the COM side of the switch.

The audio switches are active (turned ON) whenever the

IN voltage is ≤ 0.5V or floating and the CTRL voltage ≥ to

1.4V.

USB Switches

The two USB switches (D+, D-) are bidirectional switches

that can pass rail-to-rail signals. When powered with a

3.3V supply, these switches have a nominal rON of 5Ω

over the signal range of 0V to 400mV with a rON flatness

of 0.45Ω. The rON matching between the D+ and D-

switches over this signal range is only 0.05Ω ensuring

minimal impact by the switches to USB high speed signal

transitions. As the signal level increases, the rON

resistance increases. At a signal level of 3.3V, the switch

resistance is nominally 25Ω.

The USB switches were specifically designed to pass USB

2.0 high-speed (480Mbps) differential signals typically in

the range of 0V to 400mV. They have low capacitance

and high bandwidth to pass the USB high-speed signals

with minimum edge and phase distortion to meet USB

2.0 high speed signal quality specifications. See

Figure 12.

The USB switches can also pass USB full-speed signals

(12Mbps) with minimal distortion and meet all the USB

requirements for USB 2.0 full-speed signaling. See

Figure 13 for Full-speed Eye Pattern taken with switch in

the signal path.

The USB switches are active (turned ON) whenever the

IN voltage is ≥ to 1.4V.

COM+, COM-, 1D-, 1D+, 2D-, AND 2D+ ARE

OVERVOLTAGE TOLERANT UP TO 5.5V AND

DOWN TO -1.5V

For normal operation, the signal range for the USB

switches is from -1V to VDD. During normal operation,

the signal voltage at D- and D+ should not be allowed

to exceed the VDD voltage rail or go below ground by

more than -1.0V. However, the ISL54209, with a VDD

supply voltage in the range of 0V to 5.0V, can

withstand an overvoltage of up to 5.5V or down to

-1.5V applied at its COM pins (COM-, COM+) and/or

USB signal pins (1D-, 1D+, 2D-, 2D+) without

damage. In this overvoltage condition, the part draws

<1mA of current and causes no stress to the IC.

Note: When in the overvoltage state, the fault voltage

at a COM pin will pass thru the USB switch to the signal

side of the switch, so the media player’s USB

transceiver must have protection circuitry to protect it

from damage.

ISL54209 Operation

The following will discuss using the ISL54209 in the

“Typical Application Block Diagrams” on page 10 shown

in Figures 8 and 9.

VDD SUPPLY

The DC power supply connected at VDD pin provides the

required bias voltage for proper switch operation. The

ISL54209

12 FN6627.4

June 10, 2010

part can operate with a supply voltage in the range of

2.5V to 5.0V.

In a typical USB/Audio application for portable battery

powered devices, the VDD voltage will come from a

battery or an LDO and be in the range of 2.7V to 3.6V.

For best possible USB full-speed operation (12Mbps), it is

recommended that the VDD voltage be ≥ 2.5V in order to

get a USB data signal level above 2.5V.

LOGIC CONTROL

The state of the ISL54209 device is determined by the

voltage at the IN pin and the CTRL pin. These logic pins

are 1.8V logic compatible when VDD is in the range of

2.7V to 3.6V and can be controlled by a standard

microprocessor. The part has three states or modes of

operation. The Audio Mode, USB Mode and the Low

Power Mode. Refer to the “Truth Table” on page 2.

The IN and CTRL pins are internally pulled low through a

4MΩ resistor to ground and can be left floating or

tri-stated by the microprocessor. The CTRL control pin is

only active when IN is logic “0”.

Logic control voltage levels:

IN = Logic “0” (Low) when VIN ≤ 0.5V or Floating.

IN = Logic “1” (High) when VIN ≥ 1.4V

CTRL = Logic “0” (Low) when ≤ 0.5V or Floating.

CTRL = Logic “1” (High) when ≥ 1.4V

Audio Mode

If the IN pin = Logic “0” and CTRL pin = Logic “1”, the

part will be in the Audio mode. In Audio mode, the L

(left) and R (right) 2.5Ω audio switches are ON and the

D- and D+ 5Ω switches are OFF (high impedance).

When nothing is plugged into the common connector or a

headphone is plugged into the common connector, the

µprocessor will sense that there is no voltage at the VBUS

pin of the connector and will drive and hold the IN control

pin of the ISL54209 low. As long as CTRL = Logic “1,” the

ISL54209 part will be in the audio mode and the audio

drivers of the media player can drive the headphones

and play music.

USB Mode

If the IN pin = Logic “1” and the CTRL pin = Logic “0” or

Logic “1”, the part will go into USB mode. In USB mode,

the D- and D+ 5Ω switches are ON and the L and R 2.5Ω

audio switches are OFF (high impedance).

When a USB cable from a computer or USB hub is

connected at the common connector, the µprocessor will

sense the presence of the 5V VBUS and drive the IN pin

voltage high. The ISL54209 part will go into the USB

mode. In USB mode, the computer or USB hub

transceiver and the MP3 player or cell phone USB

transceiver are connected and digital data will be able to

be transmitted back and forth.

When the USB cable is disconnected, the µprocessor will

sense that the 5V VBUS voltage is no longer connected

and will drive the IN pin low and put the part back into

the Audio or Low Power Mode.

Low Power Mode

If the IN pin = Logic “0” and CTRL pin = Logic “0”, the

part will be in the Low Power mode. In the Low Power

mode, the audio switches and the USB switches are OFF.

In this state, the device draws typically 1nA of current.

In Low Power mode, the OFF-isolation and crosstalk

between switch cells is minimal for negative swinging

signals. Care should be taken to avoid negative swinging

signals in this mode of operation. In typical applications,

the Low Power state will be applied to the ISL54209 part

when the portable media player is in its sleep or

hibernate mode to conserve battery power. In the sleep

mode, no audio or USB signals are applied to the part.

USING THE COMPUTER VBUS VOLTAGE TO DRIVE

THE “IN” PIN

Rather than using a microprocessor to control the IN

logic pin, one can directly drive the IN pin using the 5V

VBUS voltage from the computer or USB hub. See

Figure 9 “Typical Application Block Diagrams” on

page 10.

When a headphone or nothing is connected at the

common connector, the internal 4MΩ pull-down will pull

the IN pin low, putting the ISL54209 in the Audio or Low

Power mode, depending on the condition of the CTRL pin.

When a USB cable is connected at the common

connector, the voltage at the IN pin will be driven to 5V

and the part will automatically go into the USB mode.

When the USB cable is disconnected from the common

connector, the voltage at the IN pin will be pulled low by

the pull-down resistor and return to the Audio or Low

Power mode, depending on the condition of the CTRL pin.

Note: The ISL54209 contains an internal diode between

the IN pin and VDD pin. Whenever the IN voltage is

greater than the VDD voltage by more than 0.7V, current

will flow through this diode into the VDD power supply

bus. An external series resistor in the range of 100kΩ to

500kΩ is required at the IN logic pin to limit the current

when driving it with the VBUS voltage. This allows the

VBUS voltage from a computer or USB hub (4.4V to

5.25V) to drive the IN pin while the VDD voltage is in the

range of 2.5V to 3.6V. A 500kΩ resistor will limit the

current to 2.76µA and still allow the IN logic voltage to go

to around 3.67V, which is will above the required VINH

level of 1.4V. A smaller series resistor can be used but

more current will flow.

ISL54209

13 FN6627.4

June 10, 2010

Typical Performance Curves TA = +25°C, Unless Otherwise Specified.

FIGURE 10. THD+N vs SUPPLY VOLTAGE vs

FREQUENCY

FIGURE 11. THD+N vs SIGNAL LEVELS vs FREQUENCY

FIGURE 12. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH

THD+N (%)

FREQUENCY (Hz)

20 200 2k 20k

RLOAD = 32Ω

VLOAD = 0.707VRMS

0.04

0.05

0.06

0.07

0.08

0.09

0.10

0.11

VDD = 2.6V

VDD = 2.7V

VDD = 3.6V

VDD = 3V

THD+N (%)

FREQUENCY (Hz)

20 200 2k 20k

RLOAD = 32Ω

VDD = 3V

0.02

0.04

0.06

0.08

0.10

2VP-P

1VP-P

3VP-P

2.5VP-P

TIME SCALE (0.2ns/DIV)

VOLTAGE SCALE (0.1V/DIV)

ISL54209

14 FN6627.4

June 10, 2010

FIGURE 13. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH

FIGURE 14. FREQUENCY RESPONSE FIGURE 15. OFF-ISOLATION USB SWITCHES

Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)

TIME SCALE (10ns/DIV)

VOLTAGE SCALE (0.5V/DIV.)

VDD = 3.3V

FREQUENCY (Hz)

-1

NORMALIZED GAIN (dB)

1M 10M 100M 1G

-2

-3

-4

USB SWITCH

RL = 50Ω

VSIGNAL = 0.2VP-P TO 2VP-P

FREQUENCY (Hz)

-60

NORMALIZED GAIN (dB)

0.01M 0.1M 1M 500M

-80

-40

-100

-120

-20

10M0.001M 100M

VSIGNAL = 0.2VP-P TO 2VP-P

RL = 50Ω

VDCOFFSET = 1.5VDC

ISL54209

15 FN6627.4

June 10, 2010

FIGURE 16. OFF-ISOLATION AUDIO SWITCHES

Die Characteristics

SUBSTRATE AND TDFN THERMAL PAD

POTENTIAL (POWERED UP):

GND

TRANSISTOR COUNT:

PROCESS:

Submicron CMOS

Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)

FREQUENCY (Hz)

-60

NORMALIZED GAIN

)

0.01M 0.1M 1M 500M

-80

-40

-100

-120

-20

10M0.001M 100M

VSIGNAL = 0.2VP-P TO 2VP-P

RL = 50Ω

ISL54209

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

in the quality certifications found at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications

at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by

Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any

infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any

patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6627.4

June 10, 2010

For additional products, see www.intersil.com/product_tree

Products

Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The

Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,

handheld products, and notebooks. Intersil's product families address power management and analog signal

processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.

*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device

information page on intersil.com: ISL54209

To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff

FITs are available from our website at http://rel.intersil.com/reports/search.php

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to

web to make sure you have the latest Rev.

DATE REVISION CHANGE

3/8/10 FN6627.4 Made correction to Tjc in Thermal information and corresponding notes as follows: 2.1x1.6

uTQFN package from “48.3” to “100” and 1.8x1.4 uTQFN package from “61.9” to “105”. Added

note that is "not direct attach" for both uTQFN packages.

Added Latchup to Abs Max Ratings.

Updated POD L10.2.1X1.6A to most recent rev. Changes were to convert to new format by

moving dimensions from table onto drawing (no dimension changes)

Updated POD L10.3X3A to most recent rev. Changes were to convert to new format by moving

dimensions from table onto drawing (no dimension changes)

11/24/09 FN6627.3 Added 10 Ld 1.8x1.4 µTQFN option

Added MSL note to Ordering Information

Added “Boldface limits apply...” to common conditions of Electrical Specifications table. Bolded

full temperature specs in spec table.

Added Revision History and Products section

Added L10.1.8x1.4A package outline drawing

Under thermal information for the 2.1 x 1.6 µTQFN & the 1.8 x 1.4 µTQFN, added new boiler

plate note for theta JC indicating measurement taken at center of top of package. Moved

Note 8 down to 3x3 TDFN.

7/1/08 FN6627.2 Added eval part # to ordering info and updated ESD HBM rating.

Applied Intersil standards: Updated pb-free Note 2 to match format, updated over-temp note

4/3/08 FN6627.1 -P2, added Note 3 to order info per Mark Kwoka's new verbiage based on lead finish. Update

cross refs accordingly

-P3, changed ESD and added apps info for the VBUS control

-P5, Note 10 revised to: "Parts are 100% tested at +25°C. Temperature limits established by

characterization and are not production tested." from "Parts are 100% tested at +25°C. Over-

temperature limits established by characterization and are not production tested."

12/20/07 FN6627.0 Initial Release

ISL54209

17 FN6627.4

June 10, 2010

ISL54209

Package Outline Drawing

L10.1.8x1.4A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

Rev 5, 3/10

located within the zone indicated. The pin #1 identifier may be

Unless otherwise specified, tolerance : Decimal ± 0.05

JEDEC reference MO-255.

The configuration of the pin #1 identifier is optional, but must be

between 0.15mm and 0.30mm from the terminal tip.

Dimension applies to the metallized terminal and is measured

Dimensions in ( ) for Reference Only.

Dimensioning and tolerancing conform to ASME Y14.5m-1994.

either a mold or mark feature.

Dimensions are in millimeters.1.

NOTES:

BOTTOM VIEW

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

0.08

SEATING PLANE

0.10 C

SEE DETAIL "X"

MAX. 0.55

0 .1 27 REF

0-0.05

0.10

1.40

1.80

6X 0.40

0.10

MAB

0.70

PIN #1 ID

INDEX AREA

PIN 1

0.50

10X 0.20

4X 0.30

0.05

9 X 0.40

(6X 0.40)

(0.70)

10 (0.70)

(10X 0.20)

(4X 0.30)

(9 X 0.60)

PACKAGE OUTLINE

18 FN6627.4

June 10, 2010

ISL54209

Package Outline Drawing

L10.2.1x1.6A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

Rev 5, 3/10

BOTTOM VIEW

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

0.10

1.60

2.10

INDEX AREA

PIN 1

(6X 0.50 )

(10 X 0.20)

(0.10 MIN.)

(0.05 MIN)

(10X 0.60)

PACKAGE

(2.00) (0.80)

(1.30)

(2.50)

0.08

SEATING PLANE

0.10 C

SEE DETAIL "X"

MAX. 0.55

0 . 125 REF

0-0.05

6X 0.50

10 X 0.20 4

0.10

MAB

0.80

PIN #1 ID

0.10 MIN.

0.05 MIN.

4X 0.20 MIN.

10X 0.40

OUTLINE

Lead width dimension applies to the metallized terminal and is measured

The configuration of the pin #1 identifier is optional, but must be located within

the zone indicated. The pin #1 identifier may be either a mold or mark feature.

Dimensioning and tolerancing conform to ASME Y14.5M-1994.

Unless otherwise specified, tolerance : Decimal ± 0.05

All Dimensions are in millimeters. Angles are in degrees.

Dimensions in ( ) for Reference Only.

between 0.15mm and 0.30mm from the terminal tip.

Maximum package warpage is 0.05mm.

NOTES:

Maximum allowable burrs is 0.076mm in all directions.6.

Same as JEDEC MO-255UABD except:7.

No lead-pull-back, MIN. Package thickness = 0.45 not 0.50mm

Lead Length dim. = 0.45mm max. not 0.42mm.

19 FN6627.4

June 10, 2010

ISL54209

Package Outline Drawing

L10.3x3A

10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

Rev 5, 3/10

located within the zone indicated. The pin #1 identifier may be

Unless otherwise specified, tolerance : Decimal ± 0.05

Tiebar shown (if present) is a non-functional feature.

The configuration of the pin #1 identifier is optional, but must be

between 0.15mm and 0.30mm from the terminal tip.

Dimension applies to the metallized terminal and is measured

Dimensions in ( ) for Reference Only.

Dimensioning and tolerancing conform to ASME Y14.5m-1994.

either a mold or mark feature.

Dimensions are in millimeters.1.

NOTES:

BOTTOM VIEW

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

INDEX AREA

(10 X 0.50)

(2.90)

( 8X 0 .50 )

( 10X 0.25 )

(1.50)

0 . 05 MAX.

0 . 00 MIN.

0 . 2 REF

(4X)

( 2.30 )

3.00

0.15

0 .80 MAX

2.30

SEE DETAIL "X"

0.10 C

1.50

INDEX AREA

3.00 A

PIN 1

2.0 REF

8X 0.50 BSC

SEATING PLANE

C0.08

0.10 M A

10 X 0.25

M0.05 C

10X 0 . 30

Angular ±2.50°

Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm).