Data sheet
Creation date September 28, 2018 6:08:21 AM CEST
Catalogue status 14.09.2018 / We reserve the right to make technical changes. 1
OMNIMATE Signal - series B2C/S2C 3.50 - 2-row
S2C-SMT 3.50/08/90G 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
General ordering data
Type S2C-SMT 3.50/08/90G 3.2SN BK BX
Order No. 1289280000
Version PCB plug-in connector, male header, closed side,
THT/THR solder connection, 3.50 mm, No. of
poles: 8, 90°, Solder pin length (l): 3.2 mm, tinned,
Black, Box
GTIN (EAN) 4050118081596
Qty. 120 pc(s).
Product data IEC: 200 V / 13.4 A
UL: 150 V / 10 A
Packaging Box
High-temperature-resistant male header
• Finger-safe
• Can be plugged into female plug B2CF 3.50 PUSH IN
•Plug-in direction is perpendicular or parallel to
the circuit board (180° / 90°)
• Housing variants: closed (G) and with
solder flange (LF)
•Packed either in a box (BX) or on anti-static tape-
on-reel (RL)
• Suitable for reflow and wave soldering
applications
• Pin length of either 1.5 mm or 3.2 mm
Data sheet
OMNIMATE Signal - series B2C/S2C 3.50 - 2-row
S2C-SMT 3.50/08/90G 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date September 28, 2018 6:08:21 AM CEST
Catalogue status 14.09.2018 / We reserve the right to make technical changes. 2
Dimensions and weights
Width 15.4 mm Width (inches) 0.606 inch
Height 14 mm Height (inches) 0.551 inch
Height of lowest version 10.8 mm Depth 14.2 mm
Depth (inches) 0.559 inch Net weight 3.01 g
System specifications
Product family OMNIMATE Signal - series
B2C/S2C 3.50 - 2-row
Type of connection
Board connection
Mounting onto the PCB THT/THR solder
connection
Pitch in mm (P)
3.5 mm
Pitch in inches (P) 0.138 inch Outgoing elbow 90°
No. of poles 8 Number of solder pins per pole 1
Solder pin length (l) 3.2 mm Tolerance of solder pin position ± 0.1 mm
Solder pin dimensions d = 1.0 mm, Octagonal Solder eyelet hole diameter (D) 1.3 mm
Solder eyelet hole diameter tolerance (D)+ 0,1 mm Outside diameter of solder pad 2.1 mm
Template aperture diameter 1.9 mm L1 in mm 10.5 mm
L1 in inches 0.413 inch Number of rows 1
Pin series quantity
2
Touch-safe protection acc. to DIN VDE
57 106
touch-safe on connector
face, safe to back of hand
above the printed circuit
board
Touch-safe protection acc. to DIN VDE
0470 IP 20
Can be coded
Yes
Plugging cycles 25 Plugging force/pole, max. 3 N
Pulling force/pole, max. 3 N
Material data
Insulating material LCP GF Colour Black
Colour chart (similar) RAL 9011 Insulating material group IIIb
CTI ≥ 175 Insulation resistance ≥ 108 Ω
Moisture Level (MSL) 1 UL 94 flammability rating V-0
Contact material Copper alloy Contact surface tinned
Layer structure of solder connection 1-3 µm Ni / 2-5 µm Sn
matt
Storage temperature, min.
-25 °C
Storage temperature, max. 55 °C Max. relative humidity during storage 80 %
Operating temperature, min. -50 °C Operating temperature, max. 120 °C
Temperature range, installation, min. -40 °C Temperature range, installation, max. 120 °C
Rated data acc. to IEC
tested acc. to standard
IEC 60664-1, IEC 61984
Rated current, min. no. of poles
(Tu=20°C) 13.4 A
Rated current, min. no. of poles
(Tu=40°C) 12 A
Rated voltage for surge voltage class /
pollution degree II/2 200 V
Rated voltage for surge voltage class /
pollution degree III/2 160 V
Rated voltage for surge voltage class /
pollution degree III/3 80 V
Rated impulse voltage for surge voltage
class/ pollution degree II/2 2.5 kV
Rated impulse voltage for surge voltage
class/ pollution degree III/2 2.5 kV
Rated impulse voltage for surge voltage
class/ contamination degree III/3 2.5 kV
Short-time withstand current resistance
3 x 1s with 80 A
Data sheet
OMNIMATE Signal - series B2C/S2C 3.50 - 2-row
S2C-SMT 3.50/08/90G 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date September 28, 2018 6:08:21 AM CEST
Catalogue status 14.09.2018 / We reserve the right to make technical changes. 3
Rated data acc. to CSA
Institute (CSA) Certificate No. (CSA)
200039-1121690
Rated voltage (Use group B) 150 V Rated voltage (Use group C) 50 V
Rated voltage (use group D) 150 V Rated current (use group B) 9.5 A
Rated current (use group C) 9.5 A Rated current (use group D) 9.5 A
Reference to approval values Specifications are
maximum values, details -
see approval certificate.
Rated data acc. to UL 1059
Institute (cURus) Certificate No. (cURus)
E60693
Rated voltage (use group B) 150 V Rated voltage (use group C) 50 V
Rated current (use group B) 10 A Rated current (use group C) 10 A
Reference to approval values Specifications are
maximum values, details -
see approval certificate.
Packaging
Packaging Box VPE length 30 mm
VPE width 135 mm VPE height 350 mm
Classifications
ETIM 4.0 EC002637 ETIM 5.0 EC002637
ETIM 6.0 EC002637 eClass 6.2 27-26-07-04
eClass 7.1 27-44-04-02 eClass 8.1 27-44-04-02
eClass 9.0 27-44-04-02 eClass 9.1 27-44-04-02
Notes
Notes • Gold-plated contact surfaces on request
• Rated current related to rated cross-section & min. No. of poles.
• Spacing between rows: see hole layout
• P on drawing = pitch
• Rated data refer only to the component itself. Clearance and creepage distances to other components are to
be designed in accordance with the relevant application standards.
IPC conformity Conformity: The products are developed, manufactured and delivered according international recognized
standards and norms and comply with the assured properties in the data sheet resp. fulfill decorative properties
in accordance with IPC-A-610 "Class 2". Further claims on the products can be evaluated on request.
Data sheet
OMNIMATE Signal - series B2C/S2C 3.50 - 2-row
S2C-SMT 3.50/08/90G 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date September 28, 2018 6:08:21 AM CEST
Catalogue status 14.09.2018 / We reserve the right to make technical changes. 4
Approvals
Approvals
ROHS Conform
Downloads
Approval/Certificate/Document of
Conformity Declaration of the Manufacturer
Brochure/Catalogue FL DRIVES EN
MB SMT EN
FL DRIVES DE
MB DEVICE MANUF. EN
CAT 2 PORTFOLIOGUIDE EN
FL BUILDING SAFETY EN
FL APPL LED LIGHTING EN
FL INDUSTR.CONTROLS EN
FL MACHINE SAFETY EN
FL HEATING ELECTR EN
FL APPL_INVERTER EN
FL_BASE_STATION_EN
FL ELEVATOR EN
FL POWER SUPPLY EN
FL 72H SAMPLE SER EN
PO OMNIMATE EN
Engineering Data EPLAN, WSCAD
Engineering Data STEP
SMT white paper Download Whitepaper
Data sheet
OMNIMATE Signal - series B2C/S2C 3.50 - 2-row
S2C-SMT 3.50/08/90G 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Drawings
Creation date September 28, 2018 6:08:21 AM CEST
Catalogue status 14.09.2018 / We reserve the right to make technical changes. 5
Dimensional drawing
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
260
240
220
200
180
160
140
120
100
80
60
40
20
00 20 40 60 80 100 120 140 160 180 200 220 240
time [s]
Temperature [°C]
Preheating
Cooling rate < 6 °K/s
250 °C
260 °C
Heating rate < 3 °K/s
255 °C
Typical process
Process limits
Temperature on board
Total contact time max. 10 sec.
appr. 150°C
260
240
220
200
180
160
140
120
100
80
60
40
20
00 20 40 60 80 100 120 140 160 180 200 220 240
time [s]
Temperature [°C]
Preheating
Cooling rate < 6 °K/s
250 °C
260 °C
Contact time appr. 3 sec.
Typical process
Prozess limits
Temperature on board
Heating rate < 3 °K/s
255 °C
appr. 150 °C
Wave soldering profiles
Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included
two recommendations for practical wave soldering profiles, with which Weidmüller PCB terminals and connectors are
qualified.
When choosing a suitable profile for your application, the following factors also need to be considered:
- PCB thickness
- Proportion of Cu in the layers
- Single/double-sided assembly
- Product range
- Heating and cooling rates
The single and double wave profiles each indicate the recommended operating range, including the maximum
soldering temperature of 260°C. In practice, the maximum soldering temperature is quite often well below the above
maximum profile.
Wave Solder Profile
Recommended wave solderding profiles
We reserve the right to make technical changes.
Single Wave:
Double Wave:
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
300
250
217
200
150
100
50
0
0 50 100 150 200 250 300 350
Time [sec]
Temperature [°C]
preheating
Melting point lead-free solder paste
Heating rate: < 3 °K/s
Cooling rate: < 6 °K/s
180 °C
190 °C
235 °C
245 °C
254 °C
approx.
60 s > 217 °C
Continuous line: Typical process
Dotted line: Process limits
Recommended reflow soldering profile
Reflow Solder Profile
We reserve the right to make technical changes.
Reflow soldering profile
The perfect soldering profile for SMT Surface Mount Technology is one the most exiting question in SMT production.
But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of
solder paste and to maximum load of components.
We have to consider the following parameters:
• Time for pre heating
• Maximum temperature
• Time above melting point
• Time for cooling
• Maximum heating rate
• Maximum cooling rate
We recommend a typical solder profile with associated process limits. With preheating components and board are
prepared smoothly for the solder phase. Heating rate is typically ≤ +3K/s. In parallel the solder paste is ‚activated’. The
time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum
temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at ≥ -6K/s solder is
cured. Board and components cool down while avoiding cold cracks.
