1
FEATURES
PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
DESCRIPTION
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008www.ti.com
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVERWITH ± 15-kV IEC ESD PROTECTION
•Qualified for Automotive Applications•Meets or Exceeds the Requirements ofTIA/EIA-232-F and ITU v.28 Standards•Operates With 3-V to 5.5-V V
CC
Supply•Operates up to 250 kbit/s•Two Drivers and Two Receivers•Low Standby Current . . .300 µA Typical•External Capacitors . . . 4 ×0.1 µF•Accepts 5-V Logic Input With 3.3-V Supply•Pin Compatible to Alternative High-SpeedPin-Compatible Device (1 Mbit/s): SNx5C3232
The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with± 15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets therequirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communicationcontroller and the serial-port connector. The charge pump and four small external capacitors allow operation froma single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of30-V/ µs driver output slew rate.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
– 40 °C to 85 °C TSSOP – PW Reel of 2000 MAX3232EIPWRQ1 MB3232I
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
FUNCTION TABLE
EACH DRIVER
(1)
EACH RECEIVER
(1)
INPUT OUTPUT INPUT OUTPUTDIN DOUT RIN ROUT
L H L HH L H LOpen H
(1) H = high level, L = low level, Open = input disconnected or connected driver off
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1 DOUT1
RIN1ROUT1
DIN2 DOUT2
RIN2ROUT2
11
10
12
9
14
7
13
8
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(1)
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
V
CC
Supply voltage range
(2)
– 0.3 to 6 VV+ Positive output supply voltage range
(2)
– 0.3 to 7 VV – Negative output supply voltage range
(2)
0.3 to – 7 VV+ – V – Supply voltage difference
(2)
13 VDrivers – 0.3 to 6 VV
I
Input voltage range
Receivers – 25 to 25 VDrivers – 13.2 to 13.2 VV
O
Output voltage range
Receivers – 0.3 to V
CC
+ 0.3 Vθ
JA
Package thermal impedance
(3) (4)
108 °C/WT
J
Operating virtual junction temperature 150 °CT
stg
Storage temperature range – 65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to network GND.(3) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
see Figure 4
MIN NOM MAX UNIT
V
CC
= 3.3 V 3 3.3 3.6Supply voltage VV
CC
= 5 V 4.5 5 5.5V
CC
= 3.3 V 2 5.5V
IH
Driver high-level input voltage DIN VV
CC
= 5 V 2.4 5.5V
IL
Driver low-level input voltage DIN 0 0.8 VV
I
Receiver input voltage – 25 25 VT
A
Operating free-air temperature MAX3232I – 40 85 °C
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.
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Product Folder Link(s): MAX3232E-Q1
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ELECTRICAL CHARACTERISTICS
DRIVER SECTION – ELECTRICAL CHARACTERISTICS
DRIVER SECTION – SWITCHING CHARACTERISTICS
RECEIVER SECTION – ELECTRICAL CHARACTERISTICS
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS
(1)
MIN TYP
(2)
MAX UNIT
I
CC
Supply current No load, V
CC
= 3.3 V or 5 V 0.3 1 mA
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 °C.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS
(1)
MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = GND 5 5.4 VV
OL
Low-level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = V
CC
– 5 – 5.4 VI
IH
High-level input current V
I
= V
CC
± 0.01 ± 1 µAI
IL
Low-level input current V
I
at GND ± 0.01 ± 1 µAV
CC
= 3.6 V, V
O
= 0 VI
OS
Short-circuit output current
(3)
± 35 ± 60 mAV
CC
= 5.5 V, V
O
= 0 Vr
o
Output resistance V
CC
, V+, and V – = 0 V, V
O
= 2 V 300 10M Ω
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 °C.(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than oneoutput should be shorted at a time.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS
(1)
MIN TYP
(2)
MAX UNIT
C
L
= 1000 pF, One DOUT switching,Maximum data rate 150 250 kbit/sR
L
= 3 k Ω, See Figure 1C
L
= 150 pF to 2500 pF, R
L
= 3 k Ωto 7 k Ω,t
sk(p)
Pulse skew
(3)
300 nsSee Figure 2
C
L
= 150 pF to 1000 pF 6 30Slew rate, transition region R
L
= 3 k Ωto 7 k Ω,SR(tr) v/ µs(see Figure 1 ) V
CC
= 3.3 V
C
L
= 150 pF to 2500 pF 4 30
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 °C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS
(1)
MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage I
OH
= – 1 mA V
CC
– 0.6 V V
CC
– 0.1 V VV
OL
Low-level output voltage I
OL
= 1.6 mA 0.4 VV
CC
= 3.3 V 1.5 2.4V
IT+
Positive-going input threshold voltage VV
CC
= 5 V 1.8 2.4V
CC
= 3.3 V 0.6 1.2V
IT –
Negative-going input threshold voltage VV
CC
= 5 V 0.8 1.5V
hys
Input hysteresis (V
IT+
– V
IT –
) 0.3 Vr
I
Input resistance V
I
= ± 3 V to ± 25 V 3 5 7 k Ω
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 °C.
Copyright © 2005 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3232E-Q1
www.ti.com
RECEIVER SECTION – SWITCHING CHARACTERISTICS
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3 )
PARAMETER TEST CONDITIONS
(1)
TYP
(2)
UNIT
t
PLH
Propagation delay time, low- to high-level output C
L
= 150 pF 300 nst
PHL
Propagation delay time, high- to low-level output C
L
= 150 pF 300 nst
sk(p)
Pulse skew
(3)
300 ns
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 °C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
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Product Folder Link(s): MAX3232E-Q1
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PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
1.5 V 1.5 V
3 V
−3 V
3 V
−3 V
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
tPHL
50% 50%
1.5 V 1.5 V
50 Ω
Generator
(see Note B) RL
RS-232
Output
CL
(see Note A)
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
50%
50%
−3 V
3 V
1.5 V
1.5 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
A. C
L
includes probe and jig capacitance.B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤10 ns,t
f
≤10 ns.
Figure 1. Driver Slew Rate
A. C
L
includes probe and jig capacitance.B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤10 ns,t
f
≤10 ns.
Figure 2. Driver Pulse Skew
A. C
L
includes probe and jig capacitance.B. The pulse generator has the following characteristics: Z
O
= 50 Ω, 50% duty cycle, t
r
≤10 ns, t
f
≤10 ns.
Figure 3. Receiver Propagation Delay Times
Copyright © 2005 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3232E-Q1
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APPLICATION INFORMATION
11
10
8
1
2
3
4
7
ROUT2
DIN2
9
RIN1
16
13
12
15
14
DIN1
5
6
+
−
C3
VCC
C2+
C1
C2
C1+
GND
C1−
ROUT1
C2−
+
−
CBYPASS
= 0.1µF
V+
+
−
+
−
RIN2
C4+
−
VCC C1 C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
VCC vs CAPACITOR V ALUES
DOUT1
DOUT2
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
†
V−
5 kΩ
5 kΩ
MAX3232E-Q1
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
Figure 4. Typical Operating Circuit and Capacitor Values
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Product Folder Link(s): MAX3232E-Q1
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3232EIPWRQ1 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3232E-Q1 :
•Catalog: MAX3232E
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 13-May-2009
Addendum-Page 1
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