TelegesisTM TG-PM-0509-ETRX358x r7 ETRX358x and ETRX358xHR Product Manual ETRX358x ZIGBEE (R) MODULES N ot R ec om m en de d fo r N ew D PRODUCT MANUAL es ig n TelegesisTM is a trademark of Silicon Laboratories Inc. (c)2016 Silicon Labs ETRX358x Product Manual ETRX358x Table of Contents 1 INTRODUCTION ..........................................................................................................5 1.1 2.2 2.3 2.4 2.5 2.6 FCC Approvals ..........................................................................................................6 FCC Labelling Requirements .....................................................................................7 IC (Industry Canada) Approvals .................................................................................7 IC Labelling Requirements ........................................................................................8 European Certification (ETSI) ....................................................................................8 Declarations of Conformity ........................................................................................9 IEEE 802.15.4 ...........................................................................................................9 The ZigBee Protocol ................................................................................................10 D 2.1 es ig n PRODUCT APPROVALS .............................................................................................6 N ew 2 Hardware Description ................................................................................................5 3 MODULE PINOUT......................................................................................................11 4 HARDWARE DESCRIPTION .....................................................................................13 4.1 FIRMWARE DESCRIPTION .......................................................................................14 5.1 5.2 Token Settings ........................................................................................................15 Custom Firmware ....................................................................................................15 ABSOLUTE MAXIMUM RATINGS .............................................................................16 6.1 6.2 m en de d 6 fo r 5 Hardware Interface ..................................................................................................13 Environmental Characteristics .................................................................................16 Recommended Operating Conditions ......................................................................16 7 DC ELECTRICAL CHARACTERISTICS ....................................................................17 8 DIGITAL I/O SPECIFICATIONS .................................................................................19 9 A/D CONVERTER CHARACTERISTICS ...................................................................20 10 AC ELECTRICAL CHARACTERISTICS ....................................................................20 TX Power Characteristics ........................................................................................22 Power Settings for Regulatory Compliance..............................................................24 om 10.1 10.2 PHYSICAL DIMENSIONS ..........................................................................................25 12 RECOMMENDED REFLOW PROFILE ......................................................................26 13 PRODUCT LABEL DRAWING ...................................................................................27 14 RECOMMENDED FOOTPRINT .................................................................................28 N ot R ec 11 14.1 14.2 Recommended Placement ......................................................................................30 Example carrier board .............................................................................................32 15 RELIABILITY TESTS .................................................................................................33 16 APPLICATION NOTES ..............................................................................................33 16.1 16.2 16.3 17 17.1 Safety Precautions ..................................................................................................33 Design Engineering Notes .......................................................................................33 Storage Conditions ..................................................................................................34 PACKAGING ..............................................................................................................34 Embossed Tape ......................................................................................................34 (c)2016 Silicon Labs -2- ETRX358x Product Manual ETRX358x 17.2 17.3 17.4 Component Orientation............................................................................................35 Reel Dimensions .....................................................................................................35 Packaging................................................................................................................37 ORDERING INFORMATION ......................................................................................38 19 ROHS DECLARATION ..............................................................................................39 20 DATA SHEET STATUS..............................................................................................39 21 RELATED DOCUMENTS ...........................................................................................39 N ot R ec om m en de d fo r N ew D es ig n 18 (c)2016 Silicon Labs -3- ETRX358x Product Manual ETRX358x es ig n The Telegesis ETRX358x and ETRX358xHR series modules are small outline, low power 2.4GHz ZigBee modules, based on the latest Silicon Labs EM358x family of single chip ZigBee(R) solutions. These 4th generation modules have been designed to be integrated into any device without the need for RF experience and expertise. Utilizing the market's premier EmberZNet ZigBee(R) stack, the ETRX358x series enables you to add powerful wireless networking capability to your products and quickly bring them to market. D For custom application development the ETRX358x series integrates with ease into Ember Desktop development environment. * * * * * * * * * * ZigBee Smart Energy applications Wireless Alarms and Security Home/Building Automation Wireless Sensor Networks M2M Industrial Controls Lighting and ventilation control Remote monitoring Environmental monitoring and control Development Kit * ETRX3587 Expansion Pack for ETRX357 Development Kit * ETRX357 Development kit containing everything required to set up a mesh network quickly and evaluate range and performance of the ETRX357 series and its long-range version. * Custom software development available upon request. ot R ec * * * * * * * * * * * * m en de d * Suggested Applications Small form factor, SMT module 25mm x 19mm Same footprint and pin-out as ETRX357 Side Castellations for easy soldering and optical inspection Two antenna options: Integrated chip antenna or U.FL coaxial connector Based on 32-bit ARM(R) Cortex-M3 Operation at 6, 12 or 24MHz Industry standard JTAG Programming and real time packet tracing via the Ember Debug Port Up to 512kB of flash and 64kbytes of RAM Lowest Deep Sleep Current of 1A with retained RAM and GPIO and multiple sleep modes Wide supply voltage range (2.1 to 3.6V) Optional 32.768kHz watch crystal can be added externally Can act as an End Device, Router or Coordinator 24 general-purpose I/O lines including analogue inputs (all GPIOs of the EM358x SoC are accessible) Firmware upgrades via serial port or over the air using the Ember standalone bootloader Hardware supported encryption (AES-128) CE, FCC and IC compliance, FCC modular approval Operating temperature range: -40C to +85C Long range version with a link budget of up to 124dB available in the same form factor om * * * fo r Module Features N ew Image not shown actual size; enlarged to show detail. Radio Features N * Based on the Silicon Labs EM358x family of single chip ZigBee(R) SoCs * 2.4GHz ISM Band * 250kbit/s over the air data rate * 16 channels (IEEE802.15.4 Channel 11 to 26) * +3dBm output power ( +8dBm in boost mode) * High sensitivity of -100dBm (-102dBm in boost mode) typically @ 1% packet error rate * RX Current: 27mA, TX Current: 32mA at 3dBm * Robust Wi-Fi and Bluetooth coexistence (c)2016 Silicon Labs -4- ETRX358x Product Manual ETRX358X 1 Introduction es ig n This document describes the Telegesis ETRX358x and ETRX358xHR family of ZigBee modules which have been designed to be easily integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface. D The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant EmberZNet meshing stack. The ETRX358x and ETRX358xHR modules represent an ideal platform for custom firmware development in conjunction with the Silicon Labs ZigBee development kits. 1.1 N ew No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX358x and ETRX358xHR series of modules offer fast integration opportunities and the shortest possible time to market for your product. Hardware Description m en de d fo r The main building blocks of the ETRX358x and ETRX358xHR modules are the single chip EM358x SoC from Silicon Labs, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL coaxial connector for attaching external antennae. Modules with the U.FL connector are identified by the "HR" suffix. The integrated antenna is an Antenova Rufa, and details of the radiation pattern are available from the Antenova website [5]. Chip EM3581 EM3581 EM3582 EM3582 EM3585 EM3585 EM3586 EM3586 EM3587 EM3587 EM3588 EM3588 ot R ec om Module ETRX3581 1 ETRX3581HR1 ETRX35821 ETRX3582HR1 ETRX35851 ETRX3585HR1 ETRX35861 ETRX3586HR1 ETRX3587 ETRX3587HR ETRX35881 ETRX3588HR1 Flash 256kB 256kB 256kB 256kB 512kB 512kB 512kB 512kB 512kB 512kB 512kB 512kB RAM 32kB 32kB 32kB 32kB 32kB 32kB 32kB 32kB 64kB 64kB 64kB 64kB Antenna Chip External Chip External Chip External Chip External Chip External Chip External USB No No Yes Yes No No Yes Yes No No Yes Yes Table 1: Module Variants N The ETRX358x and ETRX358xHR are used for ZigBee (www.zigbee.org) applications. In case it is desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop together with a comprehensive integrated development environment (IDE), is required. 1 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR (c)2016 Silicon Labs -5- ETRX358x Product Manual ETRX358X 2 Product Approvals The ETRX358x and ETRX358xHR have been designed to meet all national regulations for worldwide use. In particular the following certifications have been obtained: FCC Approvals es ig n 2.1 D The Telegesis ETRX358x family integrated Antenna as well as the ETRX358xHR family including the antennas listed in Table 2 and the power levels listed in section 10.2 have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. N ew FCC statement: This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. fo r FCC ID: S4GEM358X m en de d This module is approved for use in both portable and mobile applications. The module and associated antenna must be installed to provide a separation distance of at least 0.75cm from all persons and must not transmit simultaneously with any other antenna or transmitter. Manufacturer EAD Ltd. [6] Type 1/4 Wave EAD Ltd. [6] 1/4 Wave Chang Jia 1/2 Wave 4 Antenova Chip om Item Part No. 1 BT-Stubby (straight) BT-Stubby (right2 angle) 3 CJ-2400-6603 50 50 2.0dBi 2.1dBi (peak) Table 2: Approved Antennae ec Rufa (on board) Impedance Gain 50 0dBi 50 0dBi ot R While the applicant for a device into which the ETRX358x or ETRX358xHR with an antenna listed in Table 2 is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product depending upon local territorial regulations. N The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the equipment. When using the ETRX358xHR family with approved antennae, it is required to prevent end-users from replacing them with non-approved ones. (c)2016 Silicon Labs -6- ETRX358x Product Manual ETRX358X FCC Labelling Requirements 2.2 es ig n When integrating the ETRX358x or ETRX358xHR families into a product it must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358X) as well as the FCC notice shown on the previous page. This exterior label can use wording such as "Contains Transmitter Module FCC ID: S4GEM358X" or "Contains FCC ID: S4GEM358X" although any similar wording that expresses the same meaning may be used. IC (Industry Canada) Approvals N ew D The Telegesis ETRX358x family with integrated Antenna as well as the ETRX358xHR family have been approved by Industry Canada to operate with the antenna types listed in Table 2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. fo r IC-ID: 8735A-EM358X This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. * Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. om and must not be co-located or operating in conjunction with any other antenna or transmitterThis device has been designed to operate with the power levels shown in section 10.2 with the antennas listed in Table 2, and having a maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. ec * m en de d * N ot R French Statements * Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablissement d'une communication satisfaisante. * Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. (c)2016 Silicon Labs -7- ETRX358x Product Manual ETRX358X OEM Responsibilities The ETRX358x and ETRX358x families of module have been certified for integration into products only by OEM integrators under the following condition: es ig n 1. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. D As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IC Labelling Requirements fo r N ew IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with another transmitter), then Industry Canada certification is no longer considered valid and the IC Certification Number can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Industry Canada authorization. m en de d The ETRX358x and ETRX358xHR family modules are labelled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labelled in a visible area with the following: "Contains Transmitter Module IC: 8735A-EM358X" or "Contains IC: 8735A-EM358X" om The OEM of the ETRX358x and ETRX358xHR family modules must only use the approved antenna(s) listed above, which have been certified with this module. ec The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user's manual of the end product. ot R The user's manual for the end product must include the following information in a prominent location: N "To comply with Industry Canada RF radiation exposure limits for general population, the transmitter must not be co-located or operating in conjunction with any other antenna or transmitter." 2.3 European Certification (ETSI) The ETRX358x and ETRX358xHR families with the power settings defined in section 10.2 are tested to be compliant to the following standards: (c)2016 Silicon Labs -8- ETRX358x Product Manual ETRX358X Radio: EMC: Safety: EN 300 328:V1.9.1 EN 301 489-17:V2.2.1 EN 60950-1:2006 / A12:2011 es ig n * * * N ew D If the ETRX358x and ETRX358xHR families of modules are incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The final product must not exceed the specified power ratings, antenna specifications and installation requirements as specified in this user manual. If any of these specifications are exceeded in the final product then a submission must be made to a notified body for compliance testing to all of the required standards. 2.4 m en de d fo r The `CE' marking must be applied to a visible location on any OEM product. For more information please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Declarations of Conformity IEEE 802.15.4 ec 2.5 om Telegesis (UK) Ltd will issue Declarations of Conformity for all ETRX3 series ZigBee RF Modules, which cover RoHS, Radio Emissions and Safety. These documents will be available from our website or on request. N ot R IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol. (c)2016 Silicon Labs -9- ETRX358x Product Manual ETRX358X 2.6 The ZigBee Protocol es ig n The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality. D ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low-power sleep state. fo r Truly self-healing mesh networking Messages can now travel up to 30 hops Source-Routing for improved point to multipoint message transmission Improved security including Trust-Centre link keys New message types and options N ot R ec om m en de d * * * * * N ew The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO featureset which offers advantages over earlier versions, including (c)2016 Silicon Labs - 10 - ETRX358x Product Manual ETRX358X fo r N ew D es ig n 3 Module Pinout m en de d Figure 1: ETRX3 series Module Pinout (top view) The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series modules to the application board. For more information on the alternate functions please refer to [2]. All GND pads are connected within the module, but for best RF performance all of them should be grounded externally ideally to a ground plane. N ot R ec om "Important Note: If designers would like to keep open the option of using either standard or long range modules in the same product please note the following. The ETRX358x series and the ETRX358x-LRS series of modules are footprint compatible, but on the ETRX358x-LRS series pins PB0 and PC5 of the EM358x are used internally to control the front-end module and are not available to the user." (c)2016 Silicon Labs - 11 - ETRX358x Product Manual ETRX358X TX_ACTIVE OSC32B, nTX_ACTIVE OSC32A, OSC32_EXT TIM1C4 SC1nCTS, SC1SCLK, TIM2C3 I/O I/O I/O I/O, CTS nReset I/O, RTS I/O I/O I/O I/O GND I/O I/O I/O TXD RXD GND GND I/O I/O I/O I/O, IRQ I/O I/O I/O I/O I/O GND Vcc Alternate Functions es ig n Default use GND TIM2C4, SC1nRTS, SC1nSSEL TIM2C1, SC2MOSI, USBDM{6] TIM2C3, SC2SDA, SC2MISO, USBDP{6} TIM2C4, SC2SCL, SC2SCLK SC2nSSEL, TIM2C2 D ADC4, PTI_EN, TRACEDATA2 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3 TIM1C3 SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1 SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2 N ew EM358x Pin GND 11 13 14 18 19 12 20 21 22 24 25 GND 26 27 29 30 31 GND GND 32 33 34 35 36 38 40 41 42 43 GND Vcc SWCLK JTDO, SWO, TRACEDATA0 JTDI, TRACECLK JTMS, SWDIO VREF, IRQA, TRACEDATA2, TIM1CLK, TIM2MSK ADC3, TRACEDATA3 JRST, IRQD, TRACEDATA1 ADC2, IRQC, TIM1C2 ADC1, IRQB, TIM1C1 ADC0, TIM2CLK, TIM1MSK fo r Name GND PC5 {1} PC6 PC7 PA7 {4} PB3 {2} nReset {5} PB4 {2} PA0 PA1 PA2 PA3 GND PA4 PA5 {3} PA6 {4} PB1 PB2 GND GND JTCK PC2 PC3 PC4 PB0 PC1 PC0 {4} PB7 {4} PB6 {4} PB5 GND Vcc m en de d ETRX358x Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Table 3: Pin Information Notes: om {1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the EM358x radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX358x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend. {2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively ec {3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader ot R {4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8) {5} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is low. N {6} ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only See also the table "Module pads and functions" in the ETRX357 Development Kit Product Manual. Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names. (c)2016 Silicon Labs - 12 - ETRX358x Product Manual ETRX358X 4 Hardware Description Vcc I/O LDO 1V8 1,8Vdc integrated antenna A/D UART LDO 1V25 EM358x USB* rf terminal selection, filtering and matching circuitry 24MHz JTAG programming * Not available on all Types fo r U.FL socket RESET N ew 5 I/O D RESET BALUN es ig n Vreg m en de d Figure 2: Hardware Diagram The ETRX358x and ETRX358xHR families are based on the Silicon Labs EM358x family of ZigBee SoCs. The EM358x and EM358xHR are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM(R) Cortex M3TM microprocessor, flash and RAM memory, and peripherals. The industry standard serial wire and JTAG programming and debugging interfaces together with the standard ARM system debug components help to streamline any custom software development. om In addition to this a number of MAC functions are also implemented in hardware to help maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards. ec The new advanced power management features allow faster wakeup from sleep and new power down modes allowing this 4th generation module to offer a longer battery life than any 1st and 2nd generation modules on the market. N ot R The EM358x modules have fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the external watch crystal custom firmware is required. 4.1 Hardware Interface All GPIO pins of the EM358x chips are accessible on the module's pads. Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When developing custom firmware please refer to the EM358x datasheet [2]. (c)2016 Silicon Labs - 13 - ETRX358x Product Manual ETRX358X 5 Firmware Description By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-air bootloading as well as serial bootloading of new firmware. es ig n In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and powercycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10k. (A pull-up is not required). D Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. A router is typically a mains powered device whilst a sleepy end device (SED) can be battery powered. N ot R ec om m en de d fo r N ew The module is also able to act as a coordinator and Trust Centre through external host control. (c)2016 Silicon Labs - 14 - ETRX358x Product Manual ETRX358X 5.1 Token Settings D TG Default <not written> <not written> <not written> TELEGESIS <Order Code> 0x1010 0xFF26 <not written> <not written> <not written> <not written> <not written> <not written> <not written> <not written> <not written> <not written> fo r N ew Description Option Bytes Optional Version Number Custom EUI Device Specific String Hardware Identifier Manufacturer ID Default Power Settings Bootloader Key EZSP related SE Security SE Installation Crystal Bias Frequency offset Crystal Stabilizing Time Security Settings CCA Threshold Secure Bootloader Key m en de d Token MFG_CIB_OBS MFG_CUSTOM_VERSION MFG_CUSTOM_EUI_64 MFG_STRING MFG_BOARD_NAME MFG_MANUF_ID MFG_PHY_CONFIG MFG_BOOTLOAD_AES_KEY MFG_EZSP_STORAGE MFG_CBKE_DATA MFG_INSTALLATION_CODE MFG_OSC24M_BIAS_TRIM MFG_SYNTH_FREQ_OFFSET MFG_OSC24M_SETTLE_DELAY MFG_SECURITY_CONFIG MFG_CCA_THRESHOLD MFG_SECURE_BOOTLOADER_KEY es ig n The ETRX358x Series Modules' manufacturing tokens will be pre-programmed with the settings shown in the table below. Table 4. Manufacturing tokens 5.2 Custom Firmware N ot R ec om The ETRX358x series of modules is an ideal platform for developing custom firmware. In order to develop custom firmware the Silicon Labs Ember toolchain is required. (c)2016 Silicon Labs - 15 - ETRX358x Product Manual ETRX358X 6 Absolute Maximum Ratings Item Symbol Absolute Maximum Ratings Unit 1 2 Supply voltage Voltage on any Pad Voltage on any Pad pin (PA4, PA5, PB5, PB6, PB7, PC1), when used as an input to the general purpose ADC with the low voltage range selected Module storage temperature range Reel storage temperature range Operating temperature range Input RF level Reflow temperature VCC Vin -0.3 to +3.6 -0.3 to VCC +0.3 Vdc Vdc Vin -0.3 to +2.0 Tstg Tstgreel Top Pmax TDeath -40 to +105 0 to 75 -40 to +85 15 Please refer to chapter 12 4 5 6 7 8 Vdc D 3 es ig n No. C C C dBm C N ew Table 5: Absolute Maximum Ratings The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device. No. 1 2 3 Item ESD on any pad according to Human Body Model (HBM) circuit description ESD on non-RF pads according to Charged Device Model (CDM) circuit description ESD on RF terminal according to Charged Device Model (CDM) circuit description Moisture Sensitivity Level ot R ec 4 Environmental Characteristics om 6.1 m en de d fo r Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage. N 6.2 No. Symbol Absolute Maximum Ratings Unit VTHHBM 2 kV VTHCDM 400 V VTHCDM 225 V MSL MSL3, per J-STD-033 Table 6: Absolute Maximum Ratings Recommended Operating Conditions Item Condition / Remark Symbol Value Min 1 2 3 4 Supply voltage RF Input Frequency RF Input Power Operating temperature range Typ Unit Max VCC fC pIN 2.1 2405 3.6 2480 0 Vdc MHz dBm Top -40 +85 C Table 7: Recommended Operating Conditions (c)2016 Silicon Labs - 16 - ETRX358x Product Manual ETRX358X 7 DC Electrical Characteristics VCC = 3.0V, TAMB = 25C, NORMAL MODE (non-Boost) unless otherwise stated Symbol Value Min VCC om ec ot R N (c)2016 Silicon Labs Typ 2.1 ISLEEP 1.25 ISLEEP 1.6 A A 1.9 A 0,067 A fo r IRAMSLEEP Vdc A N ew 1.0 ISLEEP Max 3.6 ISLEEP IRESET 2 IMCU 7.5 mA IMCU 8.5 mA IMCU 4.0 mA IMCU 2.5 mA ISC 0.2 mA ITIM 0.25 mA IADC 1.1 mA IUSB 1 mA m en de d 1 Module supply voltage Deep Sleep Current Quiescent current, 4kB RAM 2 internal RC oscillator retained disabled, Quiescent current, 4kB RAM 3 internal RC oscillator retained enabled Quiescent current, 4kB RAM 4 including retained 32.768kHz oscillator Quiescent current including internal RC 4kB RAM 5 oscillator and 32.768kHz retained oscillator Additional current per 6 4kB block of RAM retained Reset Current Quiescent current 7 nReset asserted Processor and Peripheral Currents ARM(R) CortexTM M3, 25C, 12MHz 8 RAM and flash memory Core clock ARM(R) CortexTM M3, 25C, 24MHz 9 RAM and flash memory Core clock ARM(R) CortexTM M3, 25C, 12MHz 10 RAM and flash memory Core clock sleep current (R) TM ARM Cortex M3, 25C, 6MHz Core 11 RAM and flash memory clock sleep current Per serial 12 Serial controller current controller at max. clock rate General purpose timer Per timer at max. 13 current clock rate General purpose ADC Max. Sample 14 current rate, DMA 15 USB Active Current USB Suspend Mode 16 Current RX Current Radio receiver MAC and ARM(R) CortexTM 17 Baseband M3 sleeping. Receive current Total, 12MHz 18 consumption clock speed Receive current Total, 24MHz 19 consumption clock speed Receive current Total, 12MHz 20 consumption clock speed BOOST MODE Receive current Total, 24MHz 21 consumption clock speed BOOST MODE Unit es ig n Condition / Remark Item D No. IUSBSUSP 3 2.5 mA mA IRX 23.5 mA IRX 27 mA IRX 28 mA IRX 29 mA IRX 30 mA - 17 - ETRX358x Product Manual ETRX358X TX Current Transmit Current consumption BOOST MODE 24 Transmit current consumption 25 Transmit current consumption 26 Transmit current consumption 26 Wake time from deep sleep 27 Shutdown time ITXVCC 31.5 mA ITXVCC 44 mA ITXVCC 29 ITXVCC 24 ITXVCC 45 es ig n 23 at +3dBm module output power, CPU at 12MHz at +8dBm module output power, CPU at 12MHz at +0dBm module output power, CPU at 12MHz at min. module output power, CPU at 12MHz at +8dBm module output power, CPU at 24MHz From wakeup event to 1st instruction From last instruction into deep sleep mA mA mA D Transmit current consumption 110 s N ew 22 5 s fo r Table 8: DC Electrical Characteristics N ot R ec om m en de d Please Note: The average current consumption during operation is dependent on the firmware and the network load. (c)2016 Silicon Labs - 18 - ETRX358x Product Manual ETRX358X 8 Digital I/O Specifications The digital I/Os of the ETRX35x module No. Condition / Remark Item Symbol Value 2 High Schmitt switching threshold 3 4 Input current for logic 0 Input current for logic 1 Input Pull-up resistor value Input Pull-down resistor value 5 6 Output voltage for logic 0 8 Output voltage for logic 1 9 Output Source Current 10 Output Sink current 11 12 13 Output Source Current Output Sink current Total output current VSWIL 0.42 x VCC 0.5 x VCC Vdc VSWIH 0.62 x VCC 0.8 x VCC Vdc -0.5 0.5 A A IIL IIH IOL = 4mA (8mA) for standard (high current) pads IOH = 4mA (8mA)for standard (high current) pads Standard current pad Standard current pad High current pad (1) High current pad (1) RIPU 24 29 34 k RIPD 24 29 34 k VOL 0 0.18 x VCC V VCC V IOHS 4 mA IOLS 4 mA IOHH IOLH IOH + IOL 8 8 40 mA mA mA VOH 0.82 x VCC m en de d 7 Max N ew Low Schmitt switching threshold Typ fo r 1 Unit D Min Schmitt input threshold going from high to low Schmitt input threshold going from low to high es ig n VCC = 3.0V, TAMB = 25C, NORMAL MODE unless otherwise stated Table 9. Digital I/O Specifications Item om No. Low Schmitt switching threshold 2 High Schmitt switching threshold Input current for logic 0 Input current for logic 1 Input Pull-up resistor value Input Pull-up resistor value ot R 3 4 ec 1 5 N 6 Condition / Remark Symbol Value Min Schmitt input threshold going from high to low Schmitt input threshold going from low to high Unit Typ Max VSWIL 0.42 x VCC 0.5 x VCC Vdc VSWIH 0.62 x VCC 0.68 x VCC Vdc -0.5 0.5 A A IIL IIH Chip not reset RIPU 24 29 34 k Chip reset RIPURESET 12 14.5 17 k Table 10. nReset Pin Specifications Notes 1) High current pads are PA6, PA7, PB6, PB7, PC0 (c)2016 Silicon Labs - 19 - ETRX358x Product Manual ETRX358X 9 A/D Converter Characteristics Item A/D resolution A/D sample time for 7-bit conversion A/D sample time for 14-bit conversion Reference Voltage Up to 14 bits 5.33s (188kHz) 682s 1.2V D No. 1 2 3 4 es ig n The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer to the EM358x datasheet. Table 11. A/D Converter Characteristics N ew 10 AC Electrical Characteristics VCC = 3.0V, TAMB = 25C, NORMAL MODE measured at 50 terminal load connected to the U.FL socket Receiver Value fo r No. Min 7 8 9 10 11 12 ot R 13 m en de d 6 14 N 15 16 17 18 19 20 Typ Max -100 -102 2500 -94 -96 2400 0 om 5 Frequency range Sensitivity for 1% Packet Error Rate (PER) Sensitivity for 1% Packet Error Rate (PER) BOOST MODE Saturation (maximum input level for correct operation) High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Channel Rejection for all other channels (1% PER and desired signal -82dBm acc. to [1]) 802.11g rejection centred at +12MHz or -13MHz (1% PER and desired signal -82dBm acc. to [1]) Co-channel rejection (1% PER and desired signal -82dBm acc. to [1]) Relative frequency error (2x40ppm required by [1]) Relative timing error (2x40ppm required by [1]) Linear RSSI range Output power at highest power setting NORMAL MODE BOOST MODE Output power at lowest power setting Error vector magnitude as per IEEE802.15.4 Carrier frequency error PSD mask relative 3.5MHz distance from carrier PSD mask absolute 3.5MHz distance from carrier ec 1 2 3 4 Unit MHz dBm dBm dBm 35 dB 35 dB 46 dB 46 dB 40 dB 36 dB -6 dBc -120 120 ppm -120 120 ppm 40 0 dB 3 8 -55 5 -40 dBm 15 40 dBm % ppm -20 dB -30 dBm Table 12. RF Electrical Characteristics (c)2016 Silicon Labs - 20 - ETRX358x Product Manual ETRX358X No. Synthesiser Characteristics Limit Typ Min Max 2400 11.7 2500 MHz kHz 100 s 100 s D Frequency range Frequency resolution Lock time from off state, with correct VCO DAC settings Relock time, channel change or Rx/Tx turnaround Phase noise at 100kHz offset Phase noise at 1MHz offset Phase noise at 4MHz offset Phase noise at 10MHz offset Unit -75dBc/Hz -100dBc/Hz -108dBc/Hz -114dBc/Hz N ew 22 23 24 25 26 27 28 29 es ig n Please Note: For the relationship between EM358x power settings and module output power please relate to chapter 10.1 of this document. When developing custom firmware the output power settings described in this document relate directly to the EM358x power settings accessible via the Ember stack API. fo r Table 13: Synthesiser Characteristics 30 31 Power On Reset (POR) Specifications VCC POR release VCC POR assert m en de d No. Min Limit Typ Max Unit 0.62 0.45 0.95 0.65 1.2 0.85 Limit Typ Max Vdc Vdc Table 14: Power On Reset Specifications No. om Reset Filter Time constant Reset Pulse width to guarantee a reset Reset Pulse width guaranteed not to cause reset Min 2.1 26 0 12 Unit 16 1 s s s Table 15: nReset Specifications N ot R ec 32 33 34 nRESET Specifications (c)2016 Silicon Labs - 21 - ETRX358x Product Manual ETRX358X 10.1 TX Power Characteristics D Output Power vs. Power Setting at 25C N ew 10.0 5.0 fo r -5.0 -10.0 -15.0 om -20.0 -30.0 Channel 11 Channel 19 m en de d Transmit Power [dBm] 0.0 -25.0 es ig n The diagrams below show the typical output power and module current in dependency on module EM3588 power setting. Power settings above 3dBm have Boost Mode enabled. Please note that the output power is independent of the supply voltage as the radio is supplied by an internally regulated voltage. -25 -20 -15 -10 -5 0 5 10 Power Setting ot R ec -30 Channel 26 N Figure 3: Output Power vs. Power Setting (BOOST mode activated from Power setting of 4 upwards) (c)2016 Silicon Labs - 22 - ETRX358x Product Manual ETRX358X Transmit Current vs. Power Setting at 25C es ig n 50 45 40 D 30 N ew Transmit Current [mA] 35 25 20 Channel 19 Channel 26 fo r 15 Channel 11 5 0 -30 -25 m en de d 10 -20 -15 -10 -5 0 5 10 Power Setting N ot R ec om Figure 4: Module Current vs. Power Setting (BOOST mode activated from Power setting of 4 upwards) (c)2016 Silicon Labs - 23 - ETRX358x Product Manual ETRX358X 10.2 Power Settings for Regulatory Compliance Channels 11-18 8dBm boost 8dBm boost 8dBm boost Channels 19-24 8dBm boost 8dBm boost 8dBm boost Channel 25 8dBm boost 8dBm boost 8dBm boost Channel 26 8dBm boost 8dBm boost 8dBm boost D Antenna 1/2 Wave 1/4 Wave On Board es ig n Due to national restrictions the maximum power levels of the ETRX358x and ETRX358xHR family of modules need to be adjusted as shown in the tables below. The default power setting of the EmberZNet stack is +3dBm. N ew Table 10: Maximum Power Settings for European Compliance Finally Table 11 lists the maximum Power settings for FCC, IC and C-Tick compliance. Channels 11-18 8dBm boost 8dBm boost 8dBm boost Channels 19-24 8dBm boost 8dBm boost 8dBm boost Channel 25 7dBm boost 7dBm boost 7dBm boost fo r Antenna 1/2 Wave 1/4 Wave On Board Channel 26 -8dBm normal -8dB normal -8dB normal N ot R ec om m en de d Table 11: Maximum Power Settings for FCC, IC Compliance (c)2016 Silicon Labs - 24 - ETRX358x Product Manual ETRX358X m en de d fo r N ew D es ig n 11 Physical Dimensions Figure 5: ETRX3 Physical Dimensions Explanation L W H A1 A2 R1 R2 X1 X2 Length of the module Width of the module Height of the module Distance centre of pad PCB edge Pitch Keep-out Zone from corner of PCB Keep-out Zone from corner of PCB Distance centre of Antenna connector PCB edge Distance centre of Antenna connector PCB edge Typical Distance 25.0mm 19.0mm 3.8mm 0.9mm 1.27mm 17.5mm 4.1mm 3.8mm 2.8mm Table 12: ETRX3 Physical Dimensions ot R ec om Symbol N For ideal RF performance when using the on-board antenna, the antenna should be located at the corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-out area which should be as large as possible. When using the U.FL RF connector the keep-out area does not have to be obeyed. Note: The modules' transmit/receive range will depend on the antenna used and also the housing of the finished product. (c)2016 Silicon Labs - 25 - ETRX358x Product Manual ETRX358X 12 Recommended Reflow Profile Recommended temperature profile for reflow soldering 60 +60-20s es ig n Temp.[C] 230C -250C max. 220C N ew D 150C - 200C 90 30s fo r Time [s] Figure 6. Recommended Reflow Profile m en de d Use of "No-Clean" solder paste is recommended to avoid the requirement for a cleaning process. Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other residuals are remaining underneath the shielding can as well as in the gap between the module and the host board. N ot R ec om Please Note: Maximum number of reflow cycles: 2 Opposite-side reflow is prohibited due to the module's weight. (i.e. you must not place the module on the bottom / underside of your PCB and re-flow). (c)2016 Silicon Labs - 26 - ETRX358x Product Manual ETRX358X N ew Figure 7: Product Label D es ig n 13 Product Label Drawing Description 000001 090101 01 ec 02 Indication for the serial number. Production Date Code in the format YYMMDD, e.g. 090602 Indication for batch number Indication for the production location (first character) and the hardware revision (second character) FCC ID code for this product The IC ID The CE Mark Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the PartOrder code [12 characters], identifier for the batch number [2 characters], the identifier for the hardware release [2 characters] and the production date code in the format Year-MonthDay [6 characters], all separated by a semicolon. om ETRX358xHR Module Order code Possible codes are: - ETRX3581 - ETRX3581HR - ETRX3582 - ETRX3582HR - ETRX3585 - ETRX3585HR - ETRX3586 - ETRX3586HR - ETRX3587 - ETRX3587HR - ETRX3588 - ETRX3588HR m en de d Example imprint fo r The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals used during a typical manufacturing process. ot R FCC ID: S4GEM358X IC: 8735A-EM358X CE N 2D-Barcode (c)2016 Silicon Labs Table 13: ETRX358x Label Details - 27 - ETRX358x Product Manual ETRX358X 14 Recommended Footprint es ig n In order to surface mount an ETRX3 series module, we recommend that you use pads which are 1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 11, and ensure that this keep-out area is free of components, copper tracks and/or copper planes/layers. You must also ensure that there is no exposed copper on your layout which may contact with the underside of the ETRX3 series module. Figure 8: Recommended Footprint ot R ec om m en de d fo r N ew D For best RF performance it is required to provide good ground connections to the ground pads of the module. It is recommended to use multiple vias between each ground pad and a solid ground plane to minimize inductance in the ground path. The land pattern dimensions above serve as a guideline. N We recommend that you use the same pad dimensions for the solder paste screen as you have for the copper pads. However these sizes and shapes may need to be varied depending on your soldering processes and your individual production standards. We recommend a paste screen thickness of 120m to 150m. Figure 9 shows the typical pad dimensions of the module and Figure 10-Figure 12 in section 14.1 show examples of how to align the module on its host PCB. (c)2016 Silicon Labs - 28 - ETRX358x Product Manual ETRX358X m en de d fo r N ew D es ig n Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as uncovered through-hole vias, planes or tracks on your board component layer, should be located below the ETRX3 series module in order to avoid `shorts'. All ETRX3 series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional copper plane directly under the ETRX3 series module. om Figure 9. Typical pad dimensions N ot R ec Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules and to not use a washing process after reflow. If the process does require washing then care must be taken that no washing agent is trapped underneath the shielding can after the drying process has completed. (c)2016 Silicon Labs - 29 - ETRX358x Product Manual ETRX358X 14.1 Recommended Placement fo r N ew D es ig n When placing the module please either locate the antenna in the corner as shown in Figure 10 so that the recommended antenna keepout zone is being followed, or add a no copper zone as indicated in Figure 12. Figure 11. How to not place the Module N ot R ec om m en de d Figure 10. Typical placement (c)2016 Silicon Labs - 30 - ETRX358x Product Manual N ew D es ig n ETRX358X N ot R ec om m en de d fo r Figure 12. Adding a no copper / no component area (c)2016 Silicon Labs - 31 - ETRX358x Product Manual ETRX358X 14.2 Example carrier board m en de d fo r N ew D es ig n Since the RF performance of the module with the on board antenna is strongly dependent on the proper location of the module on its carrier board, Figure 13 shows the reference carrier board which was used during testing by Telegesis. Figure 13. Reference Board om For best performance it is recommended to locate the antenna towards the corner of the carrier board and to respect the recommended keep-out areas as described in section 11. N ot R ec Finally to provide a good reference ground to the on board antenna, the carrier board should have a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice, but degradation in radio performance could be the result. (c)2016 Silicon Labs - 32 - ETRX358x Product Manual ETRX358X 15 Reliability Tests No Item Limit es ig n The measurements below have been conducted on random samples out of mass production and passed after the module has been exposed to standard room temperature and humidity for 1 hour. Condition Vibration test Electrical parameter should be in specification 2 Shock test the same as the above 3 Heat cycle test the same as the above 5 6 Low temp. test High temp. test the same as the above the same as the above Dropped onto hard wood from height of 50cm for 10 times -40C for 30min. and +85C for 30min.; each temperature 300 cycles -40C, 300h +85C, 300h N ew D 1 Freq.:40Hz,Amplitude:1.5mm 20min. / cycle,1hrs. each of X and Y axis Table 14: Reliability Tests 16.1 Safety Precautions fo r 16 Application Notes m en de d These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate the module's operation when mounted on your products. Abide by these specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum: (1) om (2) Ensure the safety of the whole system by installing a protection circuit and a protection device. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. ec 16.2 Design Engineering Notes Heat is the major cause of shortening the life of the modules. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum allowable. Failure to do so may result in degrading of the product's functions and damage to the product. If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products. These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. In direct sunlight, outdoors, or in a dusty environment ot R (1) (2) N (3) (4) (5) (6) (c)2016 Silicon Labs - 33 - ETRX358x Product Manual ETRX358X In an environment where condensation occurs. In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) (9) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. (10) Mechanical stress during assembly of the board and operation has to be avoided. (11) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted. es ig n (7) (8) (3) 17 Packaging m en de d fo r (4) The module must not be stressed mechanically during storage. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected: Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided. N ew (1) (2) D 16.3 Storage Conditions 17.1 Embossed Tape Dimensions of the tape N ot R ec om (1) (c)2016 Silicon Labs - 34 - ETRX358x Product Manual ETRX358X (2) Cover tape peel force Force direction Speed = 300mm/min. es ig n = 10deg Cover tape peel force =0.0980.68N (1070g) Empty pockets fo r N ew D (3) NB: Empty pockets in the populated area will be less than two per reel and those empty pockets will not be consecutive. m en de d 17.2 Component Orientation Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape om Component Orientation ec Part No. (top view) Direction 17.3 Reel Dimensions Quantity per reel: 600 pieces Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on the reel N ot R (4) (5) (c)2016 Silicon Labs - 35 - ETRX358x Product Manual N ot R ec om m en de d fo r N ew D es ig n ETRX358X (c)2016 Silicon Labs - 36 - ETRX358x Product Manual ETRX358X 17.4 Packaging Each reel will be packed in a hermetically-sealed bag Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following label Description Imprint Internal use Internal use Telegesis Module Order Code. Quantity of modules inside the reel/carton Six digit unique Reel number counting up from 000001 m en de d MFG P/N: 99X902DL Lot: 00 P/N:ETRX3587 Quantity:600 Reel No: 000001 fo r N ew D es ig n (6) (7) Date Code in the format YYMMDD, e.g. 120824 Date:120824 P/C: ETRX3587-R308 N ot R ec om 2D-Barcode Module product code with reference to firmware/module type selected during ATE. If needed multiline. Information in the 32x32 Datamatrix 2D-Barcode are and identifier "!REEL" [5 characters], the reel number [6 characters], the Module Order code [max 18 characters ], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6 characters] and the product code [max 40 characters] , all separated by a semicolon. (c)2016 Silicon Labs - 37 - ETRX358x Product Manual ETRX358X 18 Ordering Information Description ETRX3581 2 ETRX35822 ETRX35852 ETRX35862 ETRX3587 ETRX35882 Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology: ETRX3581HR2 ETRX3582HR2 ETRX3585HR2 ETRX3586HR2 ETRX3587HR ETRX3588HR2 Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology: ETRX357DVK Telegesis Development Kit with: Based on Silicon Labs EM358x SoC Integrated 2.4GHz Antenna Based on Silicon Labs EM358x SoC U.FL coaxial Antenna Connector fo r * * N ew D * * es ig n Ordering/Product Code 3 x ETRX3DVK Development Boards 3 x USB cables 2 x ETRX357 on carrier boards 2 x ETRX357HR on carrier boards 2 x ETRX357-LRS on carrier boards 2 x ETRX357HR-LRS on carrier boards 1 x ETRX3USB USB stick 2 x 1/2-wave antennae2 x 1/4-wave antennae * * * * 2 x ETRX3587 on carrier boards 2 x ETRX3587HR on carrier boards 2 x ETRX3587-LRS on carrier boards 2 x ETRX3587HR-LRS on carrier boards om m en de d * * * * * * * * ec ETRX3587 Expansion Pack N ot R Notes: * Customers' PO's must state the Ordering/Product Code. * There is no "blank" version of the ETRX358x modules available. 2 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR (c)2016 Silicon Labs - 38 - ETRX358x Product Manual ETRX358X 19 RoHS Declaration Declaration of environmental compatibility for supplied products: D Lead and lead compounds Mercury and mercury compounds Chromium (VI) PBB (polybrominated biphenyl) category PBDE (polybrominated biphenyl ether) category N ew * * * * * es ig n Hereby we declare based on the declaration of our suppliers that this product does not contain any of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for: And a maximum concentration of 0.01% by weight in homogeneous materials for: Cadmium and cadmium compounds 20 Data Sheet Status fo r * m en de d Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. 21 Related Documents [2] [3] N ot R ec [4] [5] [6] IEEE Standard 802.15.4 -2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs) Datasheet EM358x, Silicon Labs. (www.silabs.com) Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height The ZigBee specification (www.zigbee.org) Specification for Antenova Rufa Antenna (www.antenova.com) Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com) om [1] (c)2016 Silicon Labs - 39 - ETRX358x Product Manual