Telegesis™
TG-PM-0509-ETRX358x r7
ETRX358x and ETRX358xHR Product Manual
Telegesis™ is a trademark of Silicon Laboratories Inc.
©2016 Silicon Labs ETRX358x Product Manual
ETRX358x ZIGBEE® MODULES
PRODUCT MANUAL
Not Recommended for New Design
ETRX358x
©2016 Silicon Labs - 2 - ETRX358x Product Manual
Table of Cont e nt s
1 INTRODUCTION .......................................................................................................... 5
1.1 Hardware Description ................................................................................................ 5
2 PRODUCT APPROV ALS ............................................................................................. 6
2.1 FCC Approvals .......................................................................................................... 6
FCC Labelling Requirements ..................................................................................... 7
2.2 IC (Industry Canada) Approvals ................................................................................. 7
IC Labelling Requirements ........................................................................................ 8
2.3 European Certification (ETSI) .................................................................................... 8
2.4 Declarations of Conformity ........................................................................................ 9
2.5 IEEE 802.15.4 ........................................................................................................... 9
2.6 The ZigBee Protocol ................................................................................................ 10
3 MODULE PINOUT ...................................................................................................... 11
4 HARDW ARE DESCRIP TION ..................................................................................... 13
4.1 Hardware Interface .................................................................................................. 13
5 FIRMWARE DESCRIPTIO N ....................................................................................... 14
5.1 Token Settings ........................................................................................................ 15
5.2 Custom Firmware .................................................................................................... 15
6 ABSOLUTE MAXIMUM RATINGS ............................................................................. 16
6.1 Environmental Characteristics ................................................................................. 16
6.2 Recommended Operating Conditions ...................................................................... 16
7 DC ELECTRIC AL CH ARACTERISTICS .................................................................... 17
8 DIGITAL I/O SPECIFICATIONS ................................................................................. 19
9 A/D CONVERTER CHARACTERISTICS ................................................................... 20
10 AC ELECTRICAL CHARACTERISTICS .................................................................... 20
10.1 TX Power Characteristics ........................................................................................ 22
10.2 Power Settings for Regulatory Compliance .............................................................. 24
11 PHYSICAL DIMENSIONS .......................................................................................... 25
12 RECOMMENDED REFLOW PROFILE ...................................................................... 26
13 PRODUCT L ABEL DR AWI NG ................................................................................... 27
14 RECOMMENDED FOOTPRINT ................................................................................. 28
14.1 Recommended Placement ...................................................................................... 30
14.2 Example carrier board ............................................................................................. 32
15 REL IABI L I TY TE S TS ................................................................................................. 33
16 APPLICATION NOTES .............................................................................................. 33
16.1 Safety Precautions .................................................................................................. 33
16.2 Design Eng in ee ring Notes ....................................................................................... 33
16.3 Storage Conditions .................................................................................................. 34
17 PACKAGING .............................................................................................................. 34
17.1 Embossed Tape ...................................................................................................... 34
Not Recommended for New Design
ETRX358x
©2016 Silicon Labs - 3 - ETRX358x Product Manual
17.2 Component Orientation ............................................................................................ 35
17.3 Reel Dimensions ..................................................................................................... 35
17.4 Packaging ................................................................................................................ 37
18 ORDE RING INFOR MATION ...................................................................................... 38
19 ROHS DECL ARATION .............................................................................................. 39
20 DATA SHEET STATUS .............................................................................................. 39
21 REL ATED DOCUMENT S ........................................................................................... 39
Not Recommended for New Design
ETRX358x
©2016 Silicon Labs - 4 - ETRX358x Product Manual
The Telegesis ETRX358x and ETRX358xHR series modules are
sm all o u tl ine, lo w po wer 2. 4G H z Zig Bee modules, based o n t he
latest Silicon Labs EM358x family of single chip ZigBee®
solutions.
These 4th generation modules have been designed to be
integrated into any device without the need for RF experience
and expertise. Utilizing the market’s premier EmberZNet
ZigBee® stack, the ETRX358x series enables you to add
powerful wireless networking capability to your products and
quickly bring them to market.
For custom application development the ETRX358x series
integrates with ease into Ember Desktop development
environment.
Image not sho wn act ual size; enlar ge d t o sho w detai l.
Module Featur es
• Small form factor, SMT module 25mm x 19mm
• Same footpr int and pin-out as ETRX 357
• Side Castellations for easy soldering and optical
inspection
• Two antenna option s: Integrated chip antenna or U.FL
coaxial connector
• Based on 32-bit ARM® Cortex-M3
• Operation at 6, 12 or 24MHz
•
Industry standard JTAG Programming and real time
packet tracing via the Ember Debug Port
• Up to 512kB of flash and 64kbytes of RAM
• Lowest Deep Sleep Current of 1µA with retained RAM
and GPIO and m ultiple sleep modes
• Wide supply voltage range (2.1 to 3.6V)
•
Optional 32.768kHz watch crystal can be added
externally
• Can act as an End Device, Router or Coordinator
• 24 general-purpose I/O lines including analogue inputs
(all GPIOs of the EM358x SoC are accessible)
• Firmw are upgrades v ia serial p ort or over the air usi ng the
Ember standal one boot loa der
• Hardware supported encryption (AES-128)
• CE, FCC and IC compliance, FCC modul ar approval
• Operating temperature range: -40°C to +85°C
• Long range version with a link budget of up to 124dB
available in the same form factor
Radio Features
• Based on the Silicon Labs EM358x family of single c hip
ZigBee® SoCs
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +3dBm output power ( +8dBm in boost mode)
• High sensitivity of -100dBm (-102dBm in boost mode)
typically @ 1% packet error rate
• RX Current: 27mA, TX Current: 32mA at 3dBm
•
Robust Wi-Fi and Bluetooth coexistence
Suggested Applications
• ZigBee Smart Energy applications
• Wireless Alarms and Security
• Home/Building Automation
• Wireless Sensor Networks
• M2M Industrial Controls
• Lighting and ventilation control
• Remote monitoring
• Environmental monitoring and control
Development K it
• ETRX3587 Expansion Pack for ETRX357 Development
Kit
• ETRX 357 Dev elopm ent kit co ntain ing ev ery thing
required to s et up a mesh network quickly and evaluate
range and performan ce of the E T RX 357 series and its
long-range version.
• Custom software development available upon request.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 5 - ETRX358x Product Manual
1 Introduction
This document describes the Telegesis ETRX358x and ETRX358xHR family of ZigBee modules
which have been designed to be easily integr ated into another device and to provide a fast, simple
and low cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform
consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant
EmberZNet meshing stack. The ETRX358x and ETRX358xHR modules represent an ideal platform
for custom firmware development in conjunction with the Silicon Labs ZigBee dev elopment kits.
No RF experience or expertise is required to add thi s powerful wireless networking capability to your
products. T he ETRX358x and ET RX358xHR series of modules offer fast integration opportunities
and the shortest possible time to m arket for your product.
1.1 Hardware Description
The main building blocks of the ETRX358x and ETRX358xHR modules are t he single chip EM358x
SoC from Silicon Labs, a 24MHz ref erence crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL coaxial
connector for attaching external antennae. Modules with the U.FL connector are identified by the
“HR” suffix.
The integrated antenna is an Antenova Rufa, and det ails of the radiation pattern are available fr om
the Antenova website [5].
Module
Chip
RAM
Antenna
USB
ETRX35811
EM3581
32kB
Chip
No
ETRX3581HR1
EM3581
32kB
External
No
ETRX35821
EM3582
32kB
Chip
Yes
ETRX3582HR1
EM3582
32kB
External
Yes
ETRX35851
EM3585
32kB
Chip
No
ETRX3585HR1
EM3585
32kB
External
No
ETRX35861
EM3586
32kB
Chip
Yes
ETRX3586HR1
EM3586
32kB
External
Yes
ETRX3587
EM3587
64kB
Chip
No
ETRX3587HR
EM3587
64kB
External
No
ETRX35881
EM3588
64kB
Chip
Yes
ETRX3588HR1
EM3588
64kB
External
Yes
Table 1: Module Variants
The ETRX358x and ETRX358xHR are used for ZigBee (www.zigbee.org) applications. In case it is
desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop
together with a comprehensive int egrated development environment (IDE), is required.
1 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 6 - ETRX358x Product Manual
2 Product A pprovals
The ETRX358x and ETRX358xHR have been designed to meet all national regulations for world-
wide use. In particular the following certifications have been obtained:
2.1 FCC Appro vals
The Telegesis ETRX358x family integrated Antenna as well as the ETRX358xHR family including
the antennas listed in Table 2 and the power levels listed in section 10.2 have been tested to comply
with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval
as detailed in the FCC public not ice DA00.1407.transm itter.
FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
This module is approved for use in both portable and mobile applications. The module and
associated antenna must be installed to provide a separation distance of at least 0.75cm from all
persons and must not transmit simultaneously with any other antenna or transmitter.
Item
Part No.
Manufacturer
Type
Impedance
Gain
1
BT-Stubby (straight)
EAD Ltd. [6]
¼ Wave
50Ω
0dBi
2
BT-Stubby (right-
angle)
EAD Ltd. [6] ¼ Wave
50Ω
0dBi
3
CJ-2400-6603
Chang Jia
½ Wave
50 Ω
2.0dBi
4 Rufa (on board) Antenova Chip
50Ω
2.1dBi
(peak)
Table 2: Appro ved Antennae
While the applicant for a devi ce into which the ETRX358x or ETRX358xHR with an antenna listed in
Table 2 is installed is not required to obtain a new authorization for the module, this does not preclude
the possibility that some other form of authorization or testing may be required for the end product
depending upon local territoria l r egulations .
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the ETRX358xHR family with approved antennae, it is required to prevent end-users
from replacing them with non-approved ones.
FCC ID: S4GEM358X
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 7 - ETRX358x Product Manual
FCC Labelling Requirements
When integrating the ETRX358x or ETRX358xHR families into a p roduct it must be ensured that the
FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished
product specifying the Telegesis FCC identifier (FCC ID: S4GEM358X) as well as the FCC notice
shown on the previous page. This exterior label can use wor ding such as “Contains Transmitter
Module FCC ID: S4GEM358X” or “Contain s FCC ID: S4GEM358X” although any similar wording
that expresses the same meaning may be used.
2.2 IC (Industry Canada) Approvals
The Telegesis ETRX358x family with integrat ed Antenna as well as the ETRX358xHR family have
been approved by Industry Canada to operate with the antenna types listed in Table 2 with the
maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibited for use with this device.
IC-ID: 8735A-EM358X
• This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
• Under Industry Canada regulations, this radio transmitter may only operate using
an antenna of a type and m aximum (or lesser) gain approved for the transmitter by
Industry Canada. To reduce potential radio interference to other users, the antenna
type and its gain should be so chos en that the equivalent isotropically radiated
power (e.i.r.p.) is not more than that permitted for successful communication.
• and must not be co-located or operating in conjunction with any other antenna or
transmitterThis device has been designed to operate with the power levels shown in
section 10.2 with the antennas listed in Table 2, and having a maximum gain of 2.1
dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are strictly
prohibited for use with this device. The required antenna impedance is 50 ohms.
French Statements
• Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain
de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
• Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 8 - ETRX358x Product Manual
OEM Responsibilities
The ETRX358x and ETRX358x families of module hav e been certified for integration into products only by
OEM integrators under the following condition:
1. The transmitter module must not be co-located or operating in conjunction with any other
antenna or transmitter.
As long as the condition above is met, furt her transmitter testing will not be requir ed. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC
peripheral requirements, etc.).
IMPORTANT NOT E: In the event that these conditions can not be met ( for certain configurations or
co-location with another transmitter), then Industry Canada cer tification is no longer considered v alid
and the IC Certification Number can not be used on the final product. In these circumstances, the
OEM integrator will be responsible f or re-evaluating the end product (including the transmitter) and
obtaining a separate Industry Canada authorization.
IC Labelling Requirements
The ETRX358x and ETRX358xHR family modules are labelled with its own IC Certification Number. If the
IC Certification Number is not visible when the module is installed inside another device, then the outside
of the device into which the module is installed must also display a label referring to the enclosed module.
In that case, the final end product must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 8735A-EM358X“
or
“Contains IC: 8735A-EM358X“
The OEM of the ETRX358x and ETRX358xHR family modules must only use the approved antenna(s)
listed above, which have been certified wit h t his module.
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module or change RF related parameters in the user’s manual of the e nd
product.
The user’s manual for the end product must include the fo llowing information in a prominent
location:
“To comply with Industry Canada RF radiation exposure limits for general population, the
transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.”
2.3 European Certification (ETSI)
The ETRX358x and ETRX358xHR families with the power settings defined in section 10.2 are tested
to be compliant to the following standards:
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 9 - ETRX358x Product Manual
• Radio: EN 300 328:V1.9.1
• EMC: EN 301 489-17:V2.2.1
• Safety: EN 60950-1:2006 / A12:2011
If the ETRX358x and ETRX358xHR families of modules are incorporated into an OEM product, the
OEM product manufacturer must ensure compliance of the final product to the European
Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued
for each of these standards and kept on f ile as described in Annex I I of the R&TT E Directive. The
final product must not exceed the specified power ratings, antenna specifications and installation
requirements as specified in this user manual. If any of these specifications are exceeded in the
final product then a submission must be made to a notified body for compliance testing to all of the
required standards.
The ‘CE’ marking must be applied t o a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility
for learning and meeting the required guidelines for each country in their distribution market.
2.4 Declarations of Conformity
Te leg esis (U K) Ltd will issue Declarations of Conformity for all ETRX3 series ZigBee RF Modules,
which cover RoHS, Radio Emissions and Safety. These documents will be available from our
website or on request.
2.5 IEEE 802.15.4
IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 10 - ETRX358x Product Manual
2.6 The ZigBee Protocol
The ZigBee Protocol is a set of s tandards for wireless connectivity for use between any dev ices over
short to medium distances. T he specification was originally ratified in December 2004, paving the
way for companies to start making low-power networ ks a reality.
ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional
layers for networking, security and applications. What makes the specification unique is its use of a
mesh network architecture which, in bucket chain style, passes data from one node to the next until
it lands at its destination. The network is self-healing and adapts its routing as link quality changes
or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers,
but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard enabling
the development of easily deployable low-cost, low-power, monitoring and control products for
homes, commercial buildings and indus trial plant monitoring. In 2007 the ZigBee Alliance introduced
the PRO featureset which offers advantages over earlier versions, including
• Truly self-healing mesh networking
• Messages can now travel up to 30 hops
• Source-Routing for improved point to multipoint message transmission
• Improved security including Trust-Centre link keys
• New message types and options
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 11 - ETRX358x Product Manual
3 Module Pi nout
Figure 1: ETRX3 series Module Pinout (top view)
The table below giv es details about the pin assignment for direct SMD soldering o f the ETRX3 series
modules to the application board. For more information on the alternate functions please refer to
[2].
All GND pads are connected wit hin the module, but for best RF performance all of them should be
grounded externally ideally to a ground plane.
“Important Note: If designers would like to keep open the option of using either standard or long
range modules in the same product please note the following. The ETRX358x series and the
ETRX358x-LRS series of modules are footprint compatible, but on the ETRX358x-LRS series pins
PB0 and PC5 of the EM358x are used internally to control the front-end module and are not available
to the user.”
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 12 - ETRX358x Product Manual
ETRX358x Pad
Name
Default use
Alternate Functions
1
GND
GND
2
PC5 {1}
TX_ACTIVE
3
PC6
I/O
OSC32B, nTX_ACTIVE
4
PC7
I/O
OSC32A, OSC32_EXT
5
PA7 {4}
I/O
TIM1C4
6
PB3 {2}
I/O, CTS
SC1nCTS, SC1SCLK, TIM2C3
7
nReset {5}
nReset
8
PB4 {2}
I/O, RTS
TIM2C4, SC1nRTS, SC1nSSEL
9
PA0
I/O
TIM2C1, SC2MOSI, USBDM{6]
10
PA1
I/O
TIM2C3, SC2SDA, SC2MISO, USBDP{6}
11
PA2
I/O
TIM2C4, SC2SCL, SC2SCLK
12
PA3
I/O
SC2nSSEL, TIM2C2
13
GND
GND
14
PA4
I/O
ADC4, PTI_EN, TRACEDATA2
15
PA5 {3}
I/O
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
16
PA6 {4}
I/O
TIM1C3
17
PB1
TXD
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
18
PB2
RXD
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
19
GND
GND
20
GND
GND
21
JTCK
SWCLK
22
PC2
I/O
JTDO, SWO, TRACEDATA0
23
PC3
I/O
JTDI, TRACECLK
24
PC4
I/O
JTMS, SWDIO
25
PB0
I/O, IRQ
VREF, IRQA, TRACEDATA2, TIM1CLK, TIM2MSK
26
PC1
I/O
ADC3, TRACEDATA3
27
PC0 {4}
I/O
JRST, IRQD, TRACEDATA1
28
PB7 {4}
I/O
ADC2, IRQC, TIM1C2
29
PB6 {4}
I/O
ADC1, IRQB, TIM1C1
30
PB5
I/O
ADC0, TIM2CLK, TI M1 MSK
31
GND
GND
32
Vcc
Vcc
Table 3: Pin Information
Notes:
{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the
EM358x radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX358x
as this GPIO is used internally as TX_ACTIVE to control the external RF frontend.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively
{3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
{5} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is
low.
{6} ETRX3588, ETRX3586, ETRX3582 and ETRX 3588HR, ET RX 3586HR , ET RX 3582 H R variants only
See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.
Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 13 - ETRX358x Product Manual
4 Hardware Description
24MHz
* Not available on all Types
EM358x
I/O
UART
USB*
I / O
programming
5
JTAG
Vcc
Vreg
RESET
RESET
BALUN
integrated
antenna
U.FL socket
rf
terminal
selection,
filteri ng and
matching
circuitry
LDO
1V8
1,8Vdc
A/D
LDO
1V25
Figure 2: Hardware Diagram
The ETRX358x and ETRX358xHR families ar e based on the Silicon Labs EM358x family of ZigBee
SoCs. The EM358x and EM358xHR are fully integrated 2.4GHz ZigBee transceivers with a 32-bit
ARM® Cortex M3TM microproces sor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM sy stem debug components help to strea mline any custom software development.
In addition to this a numb er o f M A C functions are also implemented in hardware to help maintaining
the strict timing requirements imposed by the ZigBee and IEEE802.15. 4 standards.
The new advanced power management features allow faster wakeup from sleep and new power
down modes allowing this 4th generation module to offer a longer battery life than any 1st and 2nd
generation modules on the market.
The EM358x modules have fully integrated voltage regulators for both required 1.8V and 1.25V
supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset
circuit eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal
can be connected externally to pads 3 and 4 i n case more accurate timing is required. T o utilize the
external watch crystal custom firmware is required.
4.1 Hardware Interface
All GPIO pins of the EM358x chips are accessible on the module’s pads . Whether si gnals are used
as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When
developing custom firmware please refer to the EM358x datasheet [2].
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 14 - ETRX358x Product Manual
5 Firmware Description
By default, the modules will be pre-loaded w i th a standalone bootloader w hich supports ov er-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a har dware trigger pull PA5 to ground and power-
cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure
not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. ( A pull-up is not
required).
Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory.
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The m odule is also able to act as a coordinator and Trus t Cent re through external host control.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 15 - ETRX358x Product Manual
5.1 Token Settings
The ETRX358x Series Modules’ manufacturing tokens will be pre-programmed with the settings
shown in the table below.
Token
Description
TG Default
MFG_CIB_OBS
Option Bytes
<not written>
MFG_CUSTOM_VERSION
Optional Version Number
<not written>
MFG_CUSTOM_EUI_64
Custom EUI
<not written>
MFG_STRING
Device Specific String
TELEGESIS
MFG_BOARD_NAME
Hardware Identifier
<Order Code>
MFG_MANUF_ID
Manufacturer ID
0x1010
MFG_PHY_CONFIG
Default Power Settings
0xFF26
MFG_BOOTLOAD_AES_KEY
Bootloader Key
<not written>
MFG_EZSP_STORAGE
EZSP related
<not written>
MFG_CBKE_DATA
SE Securit y
<not written>
MFG_INSTALLATION_CODE
SE Installation
<not written>
MFG_OSC24M_BIAS_TRIM
Crystal Bia s
<not written>
MFG_SYNTH_FREQ_OFFSET
Frequency offset
<not written>
MFG_OSC24M_SETTLE_DELAY
Crystal Stabilizing Time
<not written>
MFG_SECURITY_CONFIG
Security Settings
<not written>
MFG_CCA_THRESHOLD
CCA Thr esh old
<not written>
MFG_SECURE_BOOTLOADER_KEY
Secure Bootloader Key
<not written>
Table 4. Manufacturing toke ns
5.2 Custom Firmware
The ETRX358x series of modules is an ideal platform for developing custom firmware. In order to
develop custom firmware the Silicon Labs Ember toolchain is required.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 16 - ETRX358x Product Manual
6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
Supply voltage
VCC
-0.3 to +3.6
Vdc
2
Voltage on any Pad
Vin
-0.3 to VCC +0.3
Vdc
3
Voltag e on an y P ad pin (PA4 , PA5,
PB5, PB6, PB7, PC1), when used as an
input to the general purpose ADC with
the low voltag e range sele ct ed
Vin -0.3 to +2.0 Vdc
4
Module storage temperature range
Tstg
-40 to +105
°C
5
Reel storage temperature range
Tstgreel
0 to 75
°C
6
Operating temperature range
Top
-40 to +85
°C
7
Input RF level
Pmax
15
dBm
8
Reflow temperature
TDeath
Please refer to chapter 12
°C
Table 5: Absolute Maximum Ratings
The absolute maximum ratings given abov e should under no circumstances be violated. Exceeding
one or more of the limiting values m ay cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1 Environmental Characteristics
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
ESD on any pad according to
Human Body Model (HBM) circuit
description
VTHHBM ±2 kV
2
ESD on non-RF pads according to
Charged Device Model (CDM) c ircuit
description
VTHCDM ±400 V
3
ESD on RF terminal according to
Charged Device Model (CDM) c ircuit
description
VTHCDM ±225 V
4
Moisture Sensitivity Level
MSL
MSL3, per J-STD-033
Table 6: Absolute Maximum Ratings
6.2 Recommended Operating Conditions
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1
Supply voltage
VCC
2.1
3.6
Vdc
2
RF Input Frequency
fC
2405
2480
MHz
3
RF Input Power
pIN
0
dBm
4
Operating temperature
range
Top -40 +85 °C
Table 7: Recommended Operating Conditions
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 17 - ETRX358x Product Manual
7 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1
Module supply voltage
VCC
2.1
3.6
Vdc
Deep Sleep Current
2
Quiescent curr ent,
internal RC oscillator
disabled,
4kB RAM
retained ISLEEP 1.0 µA
3
Quiescent curr ent,
internal RC oscillator
enabled
4kB RAM
retained ISLEEP 1.25 µA
4
Quiescent curr ent,
including
32.768kHz oscillator
4kB RAM
retained ISLEEP 1.6 µA
5
Quiescent curr ent
including internal RC
oscillator and 32.768kHz
oscillator
4kB RAM
retained ISLEEP 1.9 µA
6
Additiona l current per
4kB block of RAM
retained
IRAMSLEEP 0,067 µA
Reset Current
7
Quiescent curr ent
nReset asserted
IRESET 2 3 mA
Processor and Peripheral Currents
8
ARM® CortexTM M3,
RAM and flas h memory
25°C, 12MHz
Core clock
IMCU 7.5 mA
9
ARM® CortexTM M3,
RAM and flas h memory
25°C, 24MHz
Core clock
IMCU 8.5 mA
10
ARM® CortexTM M3,
RAM and flas h memory
sleep current
25°C, 12MHz
Core clock IMCU 4.0 mA
11
ARM® CortexTM M3,
RAM and flas h memory
sleep current
25°C, 6MHz Core
clock IMCU 2.5 mA
12 Serial con trol ler curren t
Per serial
controlle r at max .
clock rate
ISC 0.2 mA
13
General purpo se timer
current
Per timer at max.
clock rate
ITIM 0.25 mA
14
General purpo se ADC
current
Max. Sample
rate, DMA
IADC 1.1 mA
15
USB Active Current
IUSB
1
mA
16
USB Suspend Mode
Current
IUSBSUSP 2.5 mA
RX Current
17
Radio receiver MAC and
Baseband
ARM® CortexTM
M3 sleeping.
IRX 23.5 mA
18
Receive curre nt
consumption
Total, 12MHz
clock spe e d
IRX 27 mA
19
Receive curre nt
consumption
Total, 24MHz
clock spe e d
IRX 28 mA
20
Receive curre nt
consumption
BOOST MODE
Total, 12MHz
clock spe e d IRX 29 mA
21
Receive curre nt
consumption
BOOST MODE
Total, 24MHz
clock spe e d IRX 30 mA
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 18 - ETRX358x Product Manual
TX Current
22 T ransmit curr ent
consumption
at +3dBm module
output power,
CPU at 12MHz
ITXVCC 31.5 mA
23
Transmit Current
consumption
BOOST MODE
at +8dBm module
output power,
CPU at 12MHz
ITXVCC 44 mA
24 T ransmit curr ent
consumption
at +0dBm module
output power,
CPU at 12MHz
ITXVCC 29 mA
25 T ransmit curr ent
consumption
at min. module
output power,
CPU at 12MHz
ITXVCC 24 mA
26 T ransmit curr ent
consumption
at +8dBm module
output power,
CPU at 24MHz
ITXVCC 45 mA
26 Wake time from deep
sleep
From wakeup
event to 1st
instruction
110 µs
27 Shutdown time
From last
instruct ion into
deep sleep
5 µs
Table 8: DC Electrical Characteristics
Please Note: The average current consumption during operation is dependent on the firmware and
the network load.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 19 - ETRX358x Product Manual
8 Digital I/O Specifications
The digital I/Os of the ETRX35x module
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1 Low Schmitt switching
threshold
Schmitt input
threshold going
from high to low
VSWIL 0.42 x VCC 0.5 x VCC Vdc
2 High Schmitt switching
threshold
Schmitt input
threshold going
from low to high
VSWIH 0.62 x VCC 0.8 x VCC Vdc
3
Input current for logic 0
IIL
-0.5
µA
4
Input current for logic 1
IIH
0.5
µA
5
Input Pull-up resistor
value
RIPU 24 29 34 kΩ
6
Input Pull-down resistor
value
RIPD 24 29 34 kΩ
7 Output voltage for logic 0
I
OL
= 4mA (8mA) for
standard (high
current) pads
VOL 0 0.18 x VCC V
8 Output voltage for logic 1
I
OH
= 4mA (8mA)for
standard (high
current) pads
VOH 0.82 x VCC VCC V
9 Output Source Current
Standard current
pad
IOHS 4 mA
10 Output Si nk curre nt
Standard current
pad
IOLS 4 mA
11
Output Source Current
High current pad (1)
IOHH
8
mA
12
Output Sink curre nt
High current pad (1)
IOLH
8
mA
13
Total output curren t
IOH + IOL
40
mA
Table 9. Digital I/O Specifications
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1 Low Schmitt switching
threshold
Schmitt input
threshold going
from high to low
VSWIL 0.42 x VCC 0.5 x VCC Vdc
2 High Schmitt switching
threshold
Schmitt input
threshold going
from low to high
VSWIH 0.62 x VCC 0.68 x VCC Vdc
3
Input current for logic 0
IIL
-0.5
µA
4
Input current for logic 1
IIH
0.5
µA
5
Input Pull-up resistor
value
Chip not reset RIPU 24 29 34 kΩ
6
Input Pull-up resistor
value
Chip reset RIPURESET 12 14.5 17 kΩ
Table 10. nReset Pin Specifications
Notes
1) High current pads are PA6, PA7, PB6, PB7, PC0
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 20 - ETRX358x Product Manual
9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to the EM358x datasheet.
No.
Item
1
A/D resolution
Up to 14 bits
2
A/D sample time for 7-bit conversion
5.33µs (188kHz)
3
A/D sample time for 14-bit conversion
682µs
4
Reference Voltage
1.2V
Table 11. A/D Converter Characteristics
10 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω term inal load connected to the U.FL socket
No. Receiver Value Unit
Min
Typ
Max
1
Frequency range
2400
2500
MHz
2
Sensitivity for 1% Packet Error Rate (PER)
-100
-94
dBm
3
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
-102
-96
dBm
4
Saturation ( max imum inp ut lev el for corr ect operation)
0
dBm
5
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
35 dB
6
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
35 dB
7
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
46 dB
8
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
46 dB
9
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
40 dB
10
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
36 dB
11
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
-6 dBc
12
Relative frequency error
(2x40ppm required by [1])
-120 120 ppm
13
Relative tim ing error
(2x40ppm required by [1])
-120 120 ppm
14
Linear RSSI range
40
dB
15
Output power at highest power setting
NORMAL MODE
BOOST MODE
0
3
8 dBm
16
Output power at lowest power setting
-55
dBm
17
Error vector magnitude as per IE EE 802.1 5.4
5
15
%
18
Carrier frequency error
-40
40
ppm
19
PSD mask relative
3.5MHz distance from carrier
-20 dB
20
PSD mask absolute
3.5MHz distance from carrier
-30 dBm
Table 12. RF Electrical Characteristics
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 21 - ETRX358x Product Manual
Please Note: For the relationship between EM358x power settings and module output power please
relate to chapter 10.1 of this document. When developing custom firmware the output power settings
described in this document relate directly to the EM358x power settings accessible via the Ember
stack API.
No.
Synthesiser Characteristics
Limit
Unit
Min
Typ
Max
22
Frequency range
2400
2500
MHz
23
Frequency resolution
11.7
kHz
24
Lock time from off state, with correct VCO DAC settings
100
µs
25
Relock time, channel change or Rx/ Tx turnaround
100
µs
26
Phase noise at 100kHz offset
-75dBc/Hz
27
Phase noise at 1MHz offset
-100dBc/Hz
28
Phase noise at 4MH z offset
-108dBc/Hz
29
Phase noise at 10M Hz offset
-114dBc/Hz
Table 13: Synthesiser Characteristics
No.
Power On Reset (POR) Specific ations
Limit
Unit
Min
Typ
Max
30
VCC POR release
0.62
0.95
1.2
Vdc
31
VCC POR assert
0.45
0.65
0.85
Vdc
Table 14: Power On Reset Specifications
No.
nRESET Spec ifications
Limit
Unit
Min
Typ
Max
32
Reset Filter Time constant
2.1
12
16
µs
33
Reset Pulse width to guarantee a reset
26
µs
34
Reset Pulse width guaranteed not to cause reset
0
1
µs
Table 15: nReset Specifications
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 22 - ETRX358x Product Manual
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on module
EM3588 power setting. Power settings above 3dBm have Boost Mode enabled. Please note that
the output power is independent of the supply voltage as the radio is supplied by an internally
regulated voltage.
Figure 3: Output Power vs. Power Setting (BOOST mode activated from Power setting of 4 upw ards)
-30.0
-25.0
-20.0
-15.0
-10.0
-5.0
0.0
5.0
10.0
-30 -25 -20 -15 -10 -5 0 5 10
Transmit Power [dBm]
Power Setting
Output Power vs. Power Setting at 25°C
Channel
11
Channel
19
Channel
26
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 23 - ETRX358x Product Manual
Figure 4: Module Current vs. Power Setting (BOOST mode activated from Power setting of 4 upwards)
0
5
10
15
20
25
30
35
40
45
50
-30 -25 -20 -15 -10 -5 0 5 10
Transmit Cur rent [mA]
Power Setting
Transmit Current vs. Power Setting at 25°C
Channel
11
Channel
19
Channel
26
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 24 - ETRX358x Product Manual
10.2 Power Settings for Regulatory Compliance
Due to national restrictions the m aximum power levels of the ETRX358x and ETRX358xHR family
of modules need to be adjusted as shown in the tables below. The default power setting of the
EmberZNet stack is +3dBm.
Antenna
Channels 11-18
Channels 19-24
Channel 25
Channel 26
1/2 Wave
8dBm boost
8dBm boost
8dBm boost
8dBm boost
1/4 Wave
8dBm boost
8dBm boost
8dBm boost
8dBm boost
On Board
8dBm boost
8dBm boost
8dBm boost
8dBm boost
Table 10: Maximum Power Settings for European Compliance
Finally Table 11 lists the maximum Power settings for FCC, IC and C-Tick compliance.
Antenna
Channels 11-18
Channels 19-24
Channel 25
Channel 26
1/2 Wave
8dBm boost
8dBm boost
7dBm boost
-8dBm normal
1/4 Wave
8dBm boost
8dBm boost
7dBm boost
-8dB normal
On Board
8dBm boost
8dBm boost
7dBm boost
-8dB normal
Table 11: Maximum Power Settings for FCC, IC Compliance
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 25 - ETRX358x Product Manual
11 Ph ysical Dimensions
Figure 5: ETRX3 Physical Dimensions
Symbol
Explanation
Typical Distance
L
Length of the module
25.0mm
W
Width of the module
19.0mm
H
Height of the module
3.8mm
A1
Distance centre of pad PCB edge
0.9mm
A2
Pitch
1.27mm
R1
Keep-out Zone from corner of PCB
17.5mm
R2
Keep-out Zone from corner of PCB
4.1mm
X1
Distance centre of Antenna connector PCB edge
3.8mm
X2
Distance centre of Antenna connector PCB edge
2.8mm
Table 12: ETRX3 Physical Dimensions
For ideal RF performance when using the on-boar d antenna, the antenna should be located at the
corner of the carrier PCB. There should be no co mponents, tracks or copper planes in the keep-out
area which should be as large as possible. When using t he U.FL RF connector the keep-out area
does not have to be obeyed. Note: The modules’ transmit/receive range w ill depend on the antenna
used and also the housing of the finished product.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 26 - ETRX358x Product Manual
12 Recomme nde d Re f low Profile
Recommended temperature profile
for reflow solde r i ng
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 200°C
90 ±30s
60 +60-20s
Figure 6. Recommended Reflow Profile
Use of “No -Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensur e no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
Please Note:
Maximum nu mb er of refl ow c ycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 27 - ETRX358x Product Manual
13 Product La be l Drawing
Figure 7: Product Label
The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals
used during a typical manufacturing process.
Example imprint
Description
ETRX358xHR
Module Order code Possible codes are:
- ETRX3581
- ETRX3581HR
- ETRX3582
- ETRX3582HR
- ETRX3585
- ETRX3585HR
- ETRX3586
- ETRX3586HR
- ETRX3587
- ETRX3587HR
- ETRX3588
- ETRX3588HR
000001
Indication for the serial number.
090101
Production Date Code in the format YYMMDD, e.g. 090602
01
Indication for batch number
02 Indication for the production location (first character) and the hardware revision (second
character)
FCC ID: S4GEM358X
FCC ID code for this product
IC: 8735A-EM358X
The IC ID
CE
The CE Mark
2D-Barcode
Information in the Datamatrix 2D-Barcode are the seri al number [6 characters], the Part-
Order code [12 characters], identifier for the batch number [2 c haracters], the identif ier for
the hardware release [2 characters] and the production date code in the format Year-Month-
Day [6 characters], all separated by a semicolon.
Table 13: ETRX358x Labe l Detai ls
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 28 - ETRX358x Product Manual
14 Recomme nde d Foot print
In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 11, and ensure
that this keep-out area is free of components, cop per tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
underside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductance in the ground path.
Figure 8: Recommended Footprint
The land pattern dimensions above serve as a g uideline.
W e recommend that you use the same pad dim ensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm.
Figure 9 shows the typical pad dimensions of the module and Figure 10-Figure 12 in section 14.1
show examples of how to align the module on its host PCB.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 29 - ETRX358x Product Manual
Although the undersides of the E TRX3 series modul es are fully coated, no ex posed copper, such as
uncovered through-hole vias, planes or tracks on your board component layer, should be located
below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer
PCB containing an inner RF shielding ground plane, therefore there is no n eed to have an additional
copper plane directly under the ETRX3 series module.
Figure 9. Typical pad dimensions
Finally it is recommende d to u se no clean flux when soldering the ETRX358x family of modules and
to not use a washing process after reflow. If the process does require washing then care must be
taken that no washing agent is trapped underneath the shielding can after the drying process has
completed.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 30 - ETRX358x Product Manual
14.1 Recommended Pl a ce m ent
When placing the module please either locate the antenna in the corner as shown in Figure 10 so
that the recommended antenna keepout zone is being followed, or add a no copper zone as
indicated in Figure 12.
Figure 10. Typical placement
Figure 11. How to not place the Module
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 31 - ETRX358x Product Manual
Figure 12. Adding a no copper / no component area
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 32 - ETRX358x Product Manual
14.2 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 13 shows the reference carrier board which
was used during testing by Telegesis.
Figure 13. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice,
but degradation in radio performance could be the result.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 33 - ETRX358x Product Manual
15 Reli a bility Tests
The measurements below have been conducted on random samples out of mass production and
passed after the module has been exposed to standard room temperature and humidity for 1 hour.
No
Item
Limit
Condition
1 Vibration test Electrical param eter sho uld be
in specific ation
Freq.:40Hz,Amplitude:1.5mm
20min. / cyc l e,1hrs. each of X and Y axis
2 Shock test the same as the above
Dropped onto hard wood from height of
50cm for 10 times
3 Heat cycle test the same as the above
-40°C for 30min. and +85°C for 30min.;
each temperat ure 300 cy cle s
5
Low temp. tes t
the same as the above
-40°C, 300h
6
High temp. test
the same as the above
+85°C, 300h
Table 14: Reliability Tes ts
16 Applic a t ion Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate the module’s operation when mounted on your products. Abide
by these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit
occurs, then provide the following failsafe functions as a minimum:
(1) Ensure the safety of the whole system by installing a protection c ircuit and a protection
device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1) Heat is the major cause of shortening the life of the modules. Avoid assem bly and use
of the target equipment in conditions where the product’s temperature may exceed the
maximum allowable.
(2) Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3) If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
(4) These products are not intended for other uses, other than under t he special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in pl aces where liquid
may splash.
(6) In direct sunlight, outdoors, or in a dusty envir onm ent
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 34 - ETRX358x Product Manual
(7) In an environment where condensation occurs.
(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, a n d NOx)
(9) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1) The module must not be s t r essed mechanically during storage.
(2) Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance, may wel l be adversely affected:
(3) Storage in salty air or in an env ironment with a high concen tration of co rrosive gas, such
as Cl2, H2 S, NH3 , SO 2, or NOX
(4) Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3) have
been met, should be avoided.
17 Packaging
17.1 Embossed Tape
(1) Dimensions of t he t ape
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 35 - ETRX358x Product Manual
(2) Cover tape peel force
Force direction
Speed = 300mm/m in.
Cover tape peel force
=0.098～0.68N ( 10～70g)
θ= 10deg
(3) Empty pockets
NB: Empty pockets in the populated area will be less than two per reel and those empty pockets
will not be consecutive.
17.2 Component Orientation
Top cover tape will not obstruct the car rier tape holes and will not extend beyond the edges of
the carrier tape
17.3 Reel Dimensions
(4) Quantity per reel: 600 pieces
(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
(top view)
Component Orientation
Part No.
Direction
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 36 - ETRX358x Product Manual
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 37 - ETRX358x Product Manual
17.4 Packaging
(6) Each reel will be packed in a hermetically-sealed bag
(7) Marking: Reel / Antistatic Packaging / Reel Box and outer Box will c ar r y the following
label
Imprint
Description
MFG P/N: 99X902DL
Internal use
Lot: 00
Internal use
P/N:ETRX3587
Telegesis Module Order Code.
Quantity:600
Quantity of modules inside the reel/carton
Reel No: 000001
Six digit unique Reel number counting up from 000001
Date:120824
Date Code in the format YYMMDD, e.g. 120824
P/C: ETRX3587-R308
Module product code with reference to firmware/module type selected during ATE. If
needed multiline.
2D-Barcode
Information in the 32x32 Datamatrix 2D-Barcode are and identifier “!REEL” [5
characters], the reel number [6 characters], the Module Order code [max 18 characters
], the quantity [max 4 charac ters] , the date code in the format Year-Month-Day [6
characters] and the product code [max 40 characters] , all separated by a semicolon.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 38 - ETRX358x Product Manual
18 Ordering Inf orma ti on
2 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR
Ordering/Product Code
Description
ETRX35812
ETRX35822
ETRX35852
ETRX35862
ETRX3587
ETRX35882
Telegesis Wireless Mesh Networking Module w ith Silicon Labs
ZigBee Technology:
• Based on Silicon Labs EM358 x SoC
• Integrated 2.4GHz Antenna
ETRX3581HR2
ETRX3582HR2
ETRX3585HR2
ETRX3586HR2
ETRX3587HR
ETRX3588HR2
Telegesis Wireless Mesh Networking Module w ith Silicon Labs
ZigBee Technology:
• Based on Silicon Labs EM358 x SoC
• U.FL coaxial Antenna Connector
ETRX357DVK
Telegesis Development Kit with:
• 3 x ETRX3DVK Development Boards
• 3 x USB cables
• 2 x ETRX357 on carrier boards
• 2 x ETRX357HR on carrier boards
• 2 x ETRX357-LRS on carrier boards
• 2 x ETRX357HR-LRS on carrier boards
• 1 x ETRX3USB USB stick
• 2 x ½-wave antennae2 x ¼-wave ant ennae
ETRX3587 Expansion Pack
• 2 x ETRX3587 on carrier boards
• 2 x ETRX3587HR on carrier boards
• 2 x ETRX3587-LRS on carrier boards
• 2 x ETRX3587HR-LRS on carrier boards
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of t he ETRX358x modules available.
Not Recommended for New Design
ETRX358X
©2016 Silicon Labs - 39 - ETRX358x Product Manual
19 RoHS Decl a ration
Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain any
of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a
maximum concentration of 0,1% by weig ht in homogeneous materials for:
• Lead and lead compounds
• Mercury and mercury compounds
• Chromium (VI)
• PBB (polybrominated biphenyl) category
• PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
• Cadmium and cadmium compounds
20 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to chan ge t he specification without notice, in order to i mprove
the design and supply the bes t possible p roduct. Pl ease consult the m ost recently issued data sheet
before initiating or completing a design.
21 Relat e d Doc um e nts
[1] IEEE Standard 802.15.4 –2003 Wireless Medium Acces s Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-
WPANs)
[2] Datasheet EM358x, Silicon Labs. (www.silabs.com)
[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -
Low Profile 1.9mm or 2.4mm Mat ed Height
[4] The ZigBee specification (www.zigbee.org)
[5] Specification for Antenova Rufa Antenna (www.antenova.com)
[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
Not Recommended for New Design