Technical Data 4118 Effective October 2015
Supersedes April 2013
Product description
•Low profile high current inductors
•Inductance range 0.1μh to 15μh
•Design utilizes high temperature iron powder
alloy material with a non-organic binder to
eliminate thermal aging
•7.25 x 6.7mm footprint surface mount package
in a 3.0mm height
•Magnetically shielded, low EMI
•Current rating up to 34.7Adc (Higher peak cur-
rents may be attained with a greater rolloff, see
rolloff curve)
•Frequency range up to 2MHz
Applications
•Voltage Regulator Modules (VRMs)
•Multi-phase regulators
•Desktop and server VRMs and EVRDs
•Notebook and laptop regulators
•Battery power systems
•Graphics cards
•Point-of-load modules
Environmental data
•Storage temperature range (component):
-40°C to +155°C
•Operating temperature range: -40°C to
+155°C (ambient plus self temperature rise)
•Solder reflow temperature: J-STD-020D
FP3
High current, low profile inductors
Pb
2
Technical Data 4118
Effective October 2015
FP3
High current, low profile inductors
www.eaton.com/elx
Product specifications
Part number6
OCL (uH)
± 15% lrms
2 amps lsat
3 amps 10% lsat
4 amps 15%
DCR mOhms
@ 20°C typ
DCR mOhms
@ 20°C max K-factor5
FP3-R10-R 0.10 19.0 27 34.7 1.00 1.21 803
FP3-R20-R 0.22 15.3 16 20.8 1.54 1.88 482
FP3-R47-R 0.44 10.9 11.6 14.9 3.05 3.67 344
FP3-R68-R 0.72 9.72 9.0 11.6 3.85 4.63 268
FP3-1R0-R 1.10 6.26 7.4 9.5 9.40 11.2 219
FP3-1R5-R 1.50 5.78 6.2 8.0 10.0 13.1 185
FP3-2R0-R 2.00 5.40 5.4 6.9 11.5 15.0 161
FP3-3R3-R 3.20 3.63 4.3 5.5 24.5 30.0 127
FP3-4R7-R 4.70 3.23 3.5 4.2 34.9 40.0 105
FP3-8R2-R 8.5 2.91 2.6 3.4 61.6 74.0 78
FP3-100-R 10.9 2.30 2.3 3.0 84.2 101 69
FP3-150-R 14.9 2.22 2.0 2.5 106.0 127 59
1. OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2. Irms DC current for an approximate ΔT of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3. Isat Amps Peak for approximately 10% rolloff @ 20°C
4. Isat Amps Peak for approximately 15% rolloff @ 20°C
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*ΔI.
Bpp: (Gauss), K: (K factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple
current in Amps).
6. Part number definition:
FP3 = product code and size
xxx = inductance value in μH
R = decimal point (if no “R” is present, then last character equals the number of zeros)
“-R” suffix = RoHS complaint
Dimensions–mm
RECOMMENDED PAD LAYOUT
2
SCHEMATIC
1
XXX
YWWL
2
FP3
1
Part marking: FP3 (Product code and size), xxx=(inductance value in μH),
R=decimal point (if no “R” is present, then last character equals the number of zeroes, YWW=Date code, L=Location code
Packaging information (mm)
Supplied in tape and reel packaging, 1700 parts per 13” diameter reel
4.0
2.0
12.0
16.0
+/-0.3
7.5
1.75
A
2
1
A
1.5 Dia 1.5 Dia
Direction of Feed
SECTION A-A
7.5
6.9
3.2
FP3
XXX
YWWL
2.80 ±0.25
(2x)
2.80 ±0.25
(2x)
3.00 Max
6.70
Max
7.25
Max 7.50
4.50 (2x)
2.50 (2x)
1.0 min.
(2x)
3
Technical Data 4118
Effective October 2015
FP3
High current, low profile inductors
www.eaton.com/elx
Inductance characteristics
OCL vs. Isat
0
10
20
30
40
50
60
70
80
90
100
020406080100 120140 160180 200
% of Isat
% of OCL
Frequency (kHz)
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
250500 750100012501500175020002250
B
p-p (Gauss)
Core Loss (W)
200
300
400
500
600
700
800
900
1000
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.12 0.24 0.36 0.48 0.61 0.73 0.85 0.97 1.09 1.21 1.33 1.45 1.57
Total Loss (W)
Te
mperature Rise (°C
)
Core loss
Temperature rise vs. total loss
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4118 BU-SB13475
October 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
FP3
High current, low profile inductors
Technical Data 4118
Effective October 2015
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
