03/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corpor ation . SanDisk Confidenti al, subject to all applicable n on-disclosure agreements.
SanDisk CompactFlash Memory Card
OEM Product Manual
Version 3.0
Document No. 20-10-00038
March 2010
SanDisk Corporation
Corporate Headquar ters
601 McCarthy Boule vard
Milpitas, CA 95035
(408) 801-100 0 Phone
(408) 801-8657 Fax
www.sandisk.com
SanDisk CompactFlash Card OEM Product Manual
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable n on-disclosure agreements.
ii
SanDisk® Corporation general policy does not recommend the use of its products in life support applications
wherein a failure or malfunction of the product may directly threaten life or injury. Without limitation to the
foregoing, SanDisk shall not be liable for any loss, injury or damage caused by use of its products in any of
the following applications:
Special applications such as military related equipment, nuclear reactor control, and aerospace
Control devices for automotive vehicles, train, ship and traffic equipment
Safety system for disaster prevention and crime prevention
Medical-related equipment including medical measurement device
Accordingly, in any use of SanDisk products in life support systems or other applications where failure could
cause damage, injury or loss of life, the products should only be incorporated in systems designed with
appropriate redundancy, fault tolerant or back-up features. Per SanDisk Terms and Conditions of Sale, the
user of SanDisk products in life support or other such applications assumes all risk of such use and agrees to
indemnify, defend and hold harmless SanDisk Corporation and its affiliates against all damages.
Security safeguards, by their nature, are capable of circumvention. SanDisk cannot, and does not, guarantee
that data will not be accessed by unauthorized persons, and SanDisk disclaims any warranties to that effect to
the fullest extent permitted by law.
This document and related material is for information use only and is subject to change without prior notice.
SanDisk Corporation assumes no responsibility for any errors that may appear in this document or related
material, nor for any damages or claims resulting from the furnishing, performance or use of this document or
related material. Absent a written agreement signed by SanDisk Corporation or its authorized representative
to the contrary, SanDisk Corporation explicitly disclaims any express and implied warranties and indemnities
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USER OF THIS DOCUMENT EXPRESSLY WAIVES ALL GUARANTIES AND WARRANTIES OF ANY KIND
ASSOCIATED WITH THIS DOCUMENT AND/OR RELATED MATERIALS, WHETHER EXPRESS OR
IMPLIED, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE OR INFRINGEMENT, TOGETHER WITH ANY LIABILITY OF
SANDISK CORPORATION AND ITS AFFILIATES UNDER ANY CONTRACT, NEGLIGENCE, STRICT
LIABILITY OR OTHER LEGAL OR EQUITABLE THEORY FOR LOSS OF USE, REVENUE, OR PROFIT OR
OTHER INCIDENTAL, PUNITIVE, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES, INCLUDING
WITHOUT LIMITATION PHYSICAL INJURY OR DEATH, PROPERTY DAMAGE, LOST DATA, OR COSTS
OF PROCUREMENT OF SUBSTITUTE GOODS, TECHNOLOGY OR SERVICES.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or
translated into any language or computer language, in any form or by any means, electronic, mechanical,
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All parts of the SanDisk documentation are protected by copyright law and all rights are reserved. SanDisk
and the SanDisk logo are registered trademarks of SanDisk Corporation, registered in the United States and
other countries.
CompactFlash is a U.S. registered trademark of SanDisk Corporation.
Product names mentioned herein are for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
© 2007 - 2009 SanDisk Corporation. All rights reserved.
SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032;
5,095,344; 5,168,465;
5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and
foreign patents awarded and pending.
Document 20-10-00038 Rev. 3.0
Revision History
Date Revision Description
June 2009 1.0
October 2009 2.0 Revision of Operating Temperature for CompactFlash 200x, under section 2.1
Environmental Specifications
March 2010 3.0 Adding 2GB CompactFlash 85x
SanDisk CompactFlash Card OEM Product Manual Table of Contents
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable n on-disclosure agreements.
iii
Table of Contents
1 Introduction.......................................................................................................................... 4
1.1 General Description.............................................................................................................................................4
1.2 Features ..............................................................................................................................................................5
1.3 Scope ..................................................................................................................................................................5
1.4 CompactFlash Standard......................................................................................................................................5
1.5 PCMCIA Standard...............................................................................................................................................5
1.6 Related Documentation.......................................................................................................................................5
1.7 Functional Description.........................................................................................................................................6
2 Product Specifications ......................................................................................................... 8
2.1 System Environmental Specifications .................................................................................................................8
2.2 System Power Requirements..............................................................................................................................8
2.3 System Performance.........................................................................................................................................10
2.4 Physical Specifications......................................................................................................................................11
3 Interface Description...........................................................................................................12
3.1 Physical Description ..........................................................................................................................................12
3.2 Electrical Description.........................................................................................................................................15
3.3 Electrical Specification ......................................................................................................................................22
4 ATA Command Set.............................................................................................................25
5 Identify Device–ECH ..........................................................................................................26
6 CIS Description...................................................................................................................29
Appendix: Ordering Information .................................................................................................47
A1. SanDisk CompactFlash Memory Card ...................................................................................................................47
SanDisk CompactFlash Card OEM Product Manual Introduction
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1 Introduction
1.1 General Description
SanDisk Compa ctF la sh® Memory Ca rd pr oduc ts pro v ide hig h capacity solid-state fla sh m emory
that electrically complies with the Persona l Computer Mem ory Card Internationa l Association
ATA (PC Card ATA) standard. (In Japan, the applica ble sta ndar ds gro up is JEIDA. ) The
CompactFlas h Memory Car d Series also sup por ts a True IDE Mode that is electr ica l ly
compatible with an IDE disk dr ive. The original CF form factor card can be used in an y system
that has a CF slot, and with a Type II PCMCIA adapter can be used in any system that h as a
PCMCIA Type II or Type III socket.
CompactFlash Memory cards use SanDisk F lash memory, which was designed by SanDisk
specifically for use in mass storage applications. In addition to the mass storage-specific flash
memory chips, Compac tF lash Mem ory cards include an on-ca rd intell ige nt contr ol ler that
provides a high level interface to the host computer. This interface allows a host computer to
issue commands to the me mory card to read or write blocks of m emory. The host addresses the
card in 512 byte sectors. Each sector is protected by a powerful Error Correcting Code (EC C).
The on-card intelligent controller in the Com pactFlash Memory Card manages interface
protocols, data storage and retr ieval as well as ECC, defect handlin g and diagnostics, power
managemen t and cloc k control. Once the card has been confi gured b y the host, it appear s to the
host as a standard ATA (IDE) disk drive. Addi tiona l ATA comm ands ha v e been provi ded to
enhance sys tem perform ance.
The host system can support as m any cards as there are CompactFlash and PCMCIA Type II or
III card slots. The original form factor CompactFlash Memory cards require a PCMCIA Type II
Adapter to be used in a PCMCIA Type II or Type III socket.
Figure 1-1 SanDis k CompactFlash Card Bloc k Diagr am
SanDisk CompactFlash Card OEM Product Manual Introduction
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1.2 Features
SanDisk Com pactFlash Memory c ards provide the fo llowing system features:
Up to 64 GB of mass storage data
PC Card ATA protocol compatible
True IDE Mode compatible
Very low CMOS power
Very high performance
Very rugged
Low weight
Noiseless
Low Profile
+3.3 Volts oper a tion +5.0 Volt s Tolerant
Automatic error correction and retry capa bili tie s
Supports power down commands and sleep m odes
Non-volatile storage (no battery required)
1.3 Scope
This document describes the key features and spe cifications of CompactFlash Memory cards, a s
well as the information requ ir ed to interface this product to a host system. Retail CompactFlas h
specifications are not covered in this manual.
1.4 CompactFlash Standard
SanDisk Com pactFlash Memory c ards are fully compatible with the CompactFlash S pecification
published by the CompactFlash Association. Contact the CompactFlash Association for more
information.
CompactFlash Association
P.O. Box 515 37
Palo Alto, CA 94303
USA
Phone: 415- 84 3-122 0
Fax: 415-493-187 1
www.compactflash.org
1.5 PCMCIA Standard
SanDisk CompactFlash Memory cards are fully electrically compatible with the PCMCIA
specifications listed below:
PCMCIA PC Card Standard, 7.0, February 1999
PCMCIA PC Card A T A Specification, 7.0, February 1999
These specifications may be obtained from:
PCMCIA
2635 N. First Street, Suite 209
San Jose, CA 95131
USA
Phone: 408- 43 3-227 3
Fax: 408-433-955 8
1.6 Related Documentation
ATA oper ation is governed by the ATA-4 specification published by ANSI. For more
information, refer to the American National Standard X3.221: AT Attachment for Interface for
Disk Drives document.
SanDisk CompactFlash Card OEM Product Manual Introduction
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Documentat ion can be ordere d from IHS by calli ng 1-80 0-854- 71 7 9 or accessi ng their We b site:
http://global.ihs.com.
1.7 Functional Description
CompactFlash Memory cards contain a high level, intelli gent subsys tem as shown in the block
diagram, F igure 1-1. This intelligen t (microprocessor) subsystem provides many capabilities not
found in other types of memory cards. These capabilities include the follow ing:
Standard ATA register and comm and set (same as found on most magnetic disk
drives).
Host indepe ndence from details of erasin g and programming flash me mory.
Sophisticated system for managing defects (analogous to systems found in ma gnetic
disk drives).
Sophisticate d syste m for err or recovery inclu ding a pow erful err or correcti on code
(ECC).
Power managem e nt for low power operatio n.
Implementation of dynamic and static wear-leveling to extend card’s life.
1.7.1 Technology Independence
The 512-byte sector size of the CompactFlash Memory Card is the same as that in an IDE
magnetic dis k drive. To write or read a sector (or multiple sectors), the host computer software
simply issues a Read or Write command to the card. This command contains the address and the
number of sectors to write/read. The host software then waits for the command to complete.
The host softwar e does not get involve d in the details of how the flash memory is erased,
programmed or read. This is extreme ly important as flash dev ices are expecte d to get more a nd
more complex in the future. Because the CompactFlash Memory Card Series uses a n intelligent
on-board co ntroller, the host system software will not require changi ng as new flash memory
evolves. In other words, systems that support CompactFlash Memory cards now, will be able to
access future SanDisk cards built with new flash technology without having to update or change
host software.
1.7.2 Defect and Error Management
CompactFlash Memory cards contain a sophisticated defect and error management system . This
system is analogous to the systems found in magnetic disk drives and in many cases offers
enhancements. If necessary, the cards will rewrite data from a defective sector to a good sector.
This is completely trans par en t to the host and doe s not con sum e any user data space .
The CompactFlash Memory Card soft error rate specification is much better than the magnetic
disk drive specification. In the extremely rare case a read error does occur, CompactFlash
Memory cards ha ve innovative algorithms to recover the data by using hardware on-the-fly Error
Detection Code/Error Correction Code (EDC/ECC), based on a BCH algorithm.
These defec t and error m anagement systems, coupled with the solid state construction, give
SanDisk CompactFlash cards unparalleled reliability
1.7.3 Wear Leveling
Wear Leveling is an intrinsic pa rt of the erase pooling func t iona lit y of San Disk Compa c tF lash
using NAN D memory. The CF WEAR LEVEL comm and is sup por ted a s a NOP opera tion to
maintain backward compatib ility with exist ing software utilities. Advanced features of dynamic
and static wear-leveling, and automatic block management are used to ensure high data
reliability and maximize fla s h life expectancy.
1.7.4 Using Erase Sector and Write Commands
SanDisk Com pactFlash Memory cards support the CF ERASE SECTOR and WRITE
WITHOUT ERASE commands. In some applications, write operations may be faster if the
addresses bein g written are first erased with the ERASE SECTOR command. WRITE
WITHOUT ERASE behaves as a normal write command and no performance gain results from
its use.
SanDisk CompactFlash Card OEM Product Manual Introduction
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1.7.5 Automatic Sleep Mode
A unique feature of the SanDisk CompactF lash Memory Card is automatic entrance and exit
from sleep mode. Upon completi on of a command, the card will en ter sleep mode to conserve
power if no further commands are received within 5 msec. The host does not have to take any
action for th is to occur. In most systems, the CompactFlash Memory Card is in sleep mode
except when the host is accessing it, thus conserving power. The dela y from command
completion t o entering sleep mode is adjustable.
When the host is ready to access the card and is in sleep mode, any comm and issue d to it will
cause the card to exit sleep and respond. The host does not have to follow the ATA protocol of
issuing a reset first. It may do this if desired, but it is not needed. By not issuing the reset,
performance is improved through the reduction of overhead but th is must be done only for the
SanDisk products as other ATA products m ay not sup port this fea tur e.
1.7.6 Dynamic Adjustment of Performance vs. Power Consumption
This feature is no longer supported. This command will be treated as a NOP (No Operation) to
guarantee backward compatibility.
1.7.7 Power Supply Requirements
This is a dual voltage product, which means it will operate at a voltage range of 3.30 volts ± 5%
or 5.00 volts ± 10%. Per the PCMCIA specification Se ct ion 2.1.1, the hos t system must apply 0
volts in order to change a voltage range. This same procedur e of providing 0 volts to the c ard is
required if the host system appl ies an inpu t volta ge outside t he des ired vol t age by more th an
15%. This means less than 4.25 vol ts for the 5.00-volt range and less t han 2.75 volts for the 3.30
volt range.
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2 Product Specifications
For all the following specific ations, values are defined at ambient temperature and nominal
supply voltage unless o the rwi se sta te d.
2.1 System Environmental Specifications
Table 2-1 contains environm enta l spec ifica t ions which include temperature, humidit y, acoustic
noise, vibration, shock and al titude.
Table 2-1 Environmental Specifications
2.2 System Power Requirement s
All values quot ed in Table 2- 2 are typica l at 25° C and nom ina l suppl y voltage un less o the rwise
stated.
Sleep mode c urrently is specified under the condition that all card inputs are static CMOS levels
and in a "Not Busy" o perating sta te.
Table 2-2 Power Requirements
DC Input Voltage (Vcc)
100 mV max. ripple (p-p) 3.3V +/- 5% 5V +/- 10%
CompactFlash 85x Memory Card
Sleep 1 mA 1.2 mA
Read 75 mA 100 mA
Write 75 mA 100 mA
Memory Subsystema
Read/ Write Peak 75 mA 100 mA
CompactFlash 200x Memory Card
Sleep 1 mA 1.2 mA
Read 500 mA 500 mA
Write 500 mA 500 mA
Memory Subsystema
Read/ Write Peak 500 mA 500 mA
CompactFlash 85x CompactFlash 200x CompactFlash 400x
Temperature Operating:
Non-operating:
-25 º C to 85 º C
-40 º C to 100 º C
-25 º C to 85 º C
-40 º C to 100 º C
-25 º C to 85 º C
-40 º C to 100 º C
Humidity
Operating:
Non-operating:
8% to 95% non-
condensing
8% to 95% non-
condensing
8% to 95% non-
condensing
8% to 95% non-
condensing
8% to 95% non-
condensing
8% to 95% non-
condensing
Acoustic
Noise At 1 meter: 0 dB 0 dB 0 dB
Vibration
Operating:
Non-operating:
15 G peak to peak
maximum
15 G peak to peak
maximum
15 G peak to peak
maximum
15 G peak to peak
maximum
15 G peak to peak
maximum
15 G peak to peak
maximum
Shock Operating:
Non-operating:
2,000 G maximum
2,000 G maximum
2,000 G maximum
2,000 G maximum
2,000 G maximum
2,000 G maximum
Altitude
(relative to
sea level)
Operating:
Non-operating:
80,000 ft. maximum
80,000 ft. maximum
80,000 ft. maximum
80,000 ft. maximum
80,000 ft. maximum
80,000 ft. maximum
SanDisk CompactFlash Card OEM Product Manual Product Specifications
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CompactFlash 400x Memory Card
Sleep 1 mA 1.2 mA
Read 500 mA 500 mA
Write 500 mA 500 mA
Memory Subsystema
Read/ Write Peak 500 mA 500 mA
a. Maximum Average Value.
SanDisk CompactFlash Card OEM Product Manual Product Specifications
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2.3 System Performance
All performance timings assume the Compac tFlash Mem ory Card Series controller is in the
default (i.e., fastest) mode.
Table 2-3 Performance
Compact Fla sh 85x Memory Card
Start-up Times
Sleep to Write
Sleep to Read
Reset to Ready
2.5 ms maximum
20 ms maximum
120 ms typical; 400 ms maximum
Data Tra nsfer Rate To/From Host 25.0 MB/sec burst
Maximum Performanc e
Sequential Read 15MB/s
Sequential Write 13MB/s
Compact Flash 200x Memory Card
Start-up Times
Sleep to Write
Sleep to Read
Reset to Ready
2.5 ms maximum
20 ms maximum
120 ms typical; 400 ms maximum
Data Tra nsfer Rate To/From Host 66.0 MB/sec burst
Maximum Performanc e
Sequential Read 30.0 MB/sec
Sequential Write 30.0 MB/sec
Compact Flash 400x Memory Card
Start-up Times
Sleep to Write
Sleep to Read
Reset to Ready
2.5 ms maximum
20 ms maximum
120 ms typical; 400 ms maximum
Data Tra nsfer Rate To/From Host 100.0 MB/sec burst
Maximum Performanc e
Sequential Read 60.0 MB/sec
Sequential Write 60.0 MB/sec
NOTE: The Sleep to Write and Sle ep to Read time s are the times it takes the CompactFlash
Memory Card to exit sleep mode when any command is issued by the host to when the
card is reading or writing. CompactFlash Memory cards do not require a reset to exit
sleep mode.
SanDisk CompactFlash Card OEM Product Manual Product Specifications
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2.4 Physical Specifications
Refer to Table 2-5 a nd see Figure 2-1 for CompactFlash Memory Card physical specifications
and dimensions.
Table 2-5 CompactFlash Ph ysica l Dim en sions
Weight 11.4 g (.40 oz) typical, 14.2 g (.50 oz) maximum
Length 36.40 ± 0.15 mm (1.433 ± .006 in)
Width 42.80 ± 0.10 mm (1.685 ± .004 in)
Thickness 3.3 mm ± 0.10 mm (.130 ± .004 in) (Excluding Lip)
Figure 2-1 CompactFlash Memory Car d Dimension s
SanDisk CompactFlash Card OEM Product Manual Interface Description
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12
3 Interface Description
3.1 Physical Description
The host connects to SanDisk CompactFlash Memory cards using a standard 50-pin connector
consisting of two rows of 25 female contacts each on 50 mil (1.27 mm) centers.
3.1.1 Pin Assignments and Types
The signal/pin assignm en ts are listed in Tab l e 3-1. Low active signals have a "-" prefix. Pin
types are Input, Output or Input/Output. Sections 3.3.1 and 3.3.2 defi ne the DC charac teristics
for all input and output type structures..
Table 3-1 PC Card Memory Mode Pin Assignments
Pin No. Signal
Name Pin Type I/O Type Pin No. Signal Name Pin Type I/O Type
1 GND Ground 26 -CD1 O Ground
2 D03 I/O I1Z, OZ3 27 D11 I/O I1Z, OZ3
3 D04 I/O I1Z, OZ3 28 D12 I/O I1Z, OZ3
4 D05 I/O I1Z, OZ3 29 D13 I/O I1Z, OZ3
5 D06 I/O I1Z, OZ3 30 D14 I/O I1Z, OZ3
6 D07 I/O I1Z, OZ3 31 D15 I/O I1Z, OZ3
7 -CE1 I I3U 32 -CE2 I I3U
8 A10 I I1Z 33 -VS1 O Ground
-IORD
HSTROBE
9 -OE I I3U 34
-HDMARDY
I I3U
10 A09 I I1Z 35 -IOWR I I3U
11 A08 I I1Z 36 -WE I I3U
12 A07 I I1Z 37 READY O OT1
13 VCC Power 38 VCC Power
14 A06 I I1Z 39 -CSEL I I2Z
15 A05 I I1Z 40 -VS2 O OPEN
16 A04 I I1Z 41 RESET I I2Z
-WAIT
-DDMARDY10
17 A03 I I1Z 42
DSTROBE11
O OT1
-INPACK 18 A02 I I1Z 43
-DMARQ 12
O OT1
-REG 19 A01 I I1Z 44
-DMACK 12
I I3U
20 A00 I I1Z 45 BVD2 O OT1
21 D00 I/O I1Z, OZ3 46 BVD1 O OT1
22 D01 I/O I1Z, OZ3 47 D081 I/O I1Z, OZ3
23 D02 I/O I1Z, OZ3 48 D091 I/O I1Z, OZ3
24 WP O OT3 49 D101 I/O I1Z, OZ3
25 -CD2 O Ground 50 GND Ground
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PC Card I/O Pin Assignments are contained in Tab le 3-2.
Table 3-2 PC Card I/O Mode Pin Assignments
Pin
No. Signal
Name Pin
Type I/O Type Pin No. Signal
Name Pin Type I/O Typ e
1 GND Ground 26 -CD1 O Ground
2 D03 I/O I1Z, OZ3 27 D11 I/O I1Z, OZ3
3 D04 I/O I1Z, OZ3 28 D12 I/O I1Z, OZ3
4 D05 I/O I1Z, OZ3 29 D13 I/O I1Z, OZ3
5 D06 I/O I1Z, OZ3 30 D14 I/O I1Z, OZ3
6 D07 I/O I1Z, OZ3 31 D15 I/O I1Z, OZ3
7 -CE1 I I3U 32 -CE2 I I3U
8 A10 I I1Z 33 -VS1 O Ground
-IORD
HSTROBE
9 -OE I I3U 34
-HDMARDY
I I3U
-IOWR 10 A09 I I1Z 35
STOP
I I3U
11 A08 I I1Z 36 -WE I I3U
12 A07 I I1Z 37 READY O OT1
13 VCC Power 38 VCC Power
14 A06 I I1Z 39 -CSEL5 I I2Z
15 A05 I I1Z 40 -VS2 O OPEN
16 A04 I I1Z 41 RESET I I2Z
-WAIT
-DDMARDY
17 A03 I I1Z 42
DSTROBE
O OT1
-INPACK 18 A02 I I1Z 43
-DMARQ
O OT1
-REG 19 A01 I I1Z 44
-DMACK
I I3U
20 A00 I I1Z 45 BVD2 O OT1
21 D00 I/O I1Z, OZ3 46 BVD1 O OT1
22 D01 I/O I1Z, OZ3 47 D08 I/O I1Z, OZ3
23 D02 I/O I1Z, OZ3 48 D09 I/O I1Z, OZ3
24 WP O OT3 49 D10 I/O I1Z, OZ3
25 -CD2 O Ground 50 GND Ground
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True IDE Mode Pin A ssigments are contained in Table 3-3.
Table 3-3 True IDE Mode Pin Assignments
Pin No. Signal
Name Pin
Type I/O Type Pin No. Signal
Name Pin Type I/O Type
1 GND Ground 26 -CD1 O Ground
2 D03 I/O I1Z, OZ3 27 D11 I/O I1Z, OZ3
3 D04 I/O I1Z, OZ3 28 D12 I/O I1Z, OZ3
4 D05 I/O I1Z, OZ3 29 D13 I/O I1Z, OZ3
5 D06 I/O I1Z, OZ3 30 D14 I/O I1Z, OZ3
6 D07 I/O I1Z, OZ3 31 D15 I/O I1Z, OZ3
7 -CS0 I I3Z 32 -CS1 I I3Z
8 A10 I I1Z 33 -VS1 O Ground
-IORD
HSTROBE
9 -ATA SEL I I3U 34
-HDMARDY
I I3Z
-IOWR 10 A09 I I1Z 35
STOP
I I3Z
11 A08 I I1Z 36 -WE I I3U
12 A07 I I1Z 37 INTRQ O OZ1
13 VCC Power 38 VCC Power
14 A06 I I1Z 39 -CSEL I I2U
15 A05 I I1Z 40 -VS2 O OPEN
16 A04 I I1Z 41 -RESET I I2Z
IORDY ON1
-DDMARDY
17 A03 I I1Z 42
DSTROBE
O
OT1
18 A02 I I1Z 43 DMARQ O OZ1
19 A01 I I1Z 44 -DMACK I I3U
20 A00 I I1Z 44 -DMACK I I3U
21 D00 I/O I1Z, OZ3 46 -PDIAG I/O I1U,ON1
22 D01 I/O I1Z, OZ3 45 -DASP I/O I1U, ON1
23 D02 I/O I1Z, OZ3 46 -PDIAG I/O I1U, ON1
24 -IOCS16 O ON3 47 D08 I/O I1Z, OZ3
25 -CD2 O Ground 48 D09 I/O I1Z, OZ3
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3.2 Electrical Description
The CompactFlash Memory Card Series is optimized for operation with hosts, which support the
PCMCIA I/O interface standa rd conforming to the PC Card ATA specification. However, the
card may also be configured to operate in systems that support onl y the memory interfac e
standard. The CompactFlash card configuratio n is controlled using the standard PCMCIA
configuratio n register s startin g at address 200h in the Attrib ute Memory sp ace of the card.
Table 3-4 describes the I/O signals. Signals whose so urce is the host are designated as inputs
while signa ls that the card sources are outputs. SanDisk CompactFlash Memory Card logic
levels conform to those specified in Section 3.3 of the PCMCIA Release 2.1 Specification.
NOTE: The sleep-to-write and sleep-to-re ad times are the time it takes the card to exit sleep
mode when any command is issued by the host to when the card is re ading or writing.
CompactFlash Memory cards do not require a reset to exit sleep mode.
The SanDisk CompactFlash Memory Card signals are described in Table 3-4.
Table 3-4 Signal Desc ription
Signal Name Dir. Pin Description
A10 – A00
(PC Card Memory Mode)
I 8,10,11,12,
14,15,16,17,
18,19,20
These address lines along with the -REG
signal are used to select the following:
The I/O port address registers within the
CompactFlash Storage Card or CF+ Card,
the memory mapped port address
registers within the CompactFlash Storage
Card or CF+ Card, a byte in the card's
information structure and its configuration
control and status registers.
A10 – A00
(PC Card I/O Mode)
This signal is the same as the PC Card
Memory Mode signal.
A02 - A00
(True IDE Mode)
I 18,19,20 In True IDE Mode, only A [02:00] are used
to select the one of eight registers in the
Task File, the remaining address lines
should be grounded by the host.
BVD1
(PC Card Memory Mode)
I/O 46 This signal is asserted high, as BVD1 is
not supported.
-STSCHG
(PC Card I/O Mode)
Status Changed
This signal is asserted low to alert the host
to changes in the READY and Write
Protect states, while the I/O interface is
configured. Its use is controlled by the
Card Config and Status Register.
-PDIAG
(True IDE Mode)
In the True IDE Mode, this input / output is
the Pass Diagnostic signal in the Master /
Slave handshake protocol.
BVD2
(PC Card Memory Mode)
I/O 45 This signal is asserted high, as BVD2 is
not supported.
-SPKR
(PC Card I/O Mode)
This line is the Binary Audio output from
the card. If the Card does not support the
Binary Audio function, this line should be
held negated.
-DASP
(True IDE Mode)
In the True IDE Mode, this input/output is
the Disk Active/Slave Present signal in the
Master/Slave handshake protocol.
-CD1, -CD2
(PC Card Memory Mode)
O 26,25 These Card Detect pins are connected to
ground on the CompactFlash Storage
Card or CF+ Card. They are used by the
host to determine that the CompactFlash
Storage Card or CF+ Card is fully inserted
into its socket.
-CD1, -CD2
(PC Card I/O Mode)
This signal is the same for all modes.
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Signal Name Dir. Pin Description
-CD1, -CD2
(True IDE Mode)
This signal is the same for all modes.
-CE1, -CE2
(PC Card Memory Mode)
Card Enable
I 7,32 These input signals are used both to
select the card and to indicate to the card
whether a byte or a word operation is
being performed. -CE2 always accesses
the odd byte of the word. -CE1 accesses
the even byte or the Odd byte of the word
depending on A0 and -CE2. A multiplexing
scheme based on A0, -CE1, -CE2 allows
8 bit hosts to access all data on D0-D7.
While (-) DMACK is asserted, -CE1 and
-CE2 shall be held negated and the width
of the transfers shall be 16 bits.
-CE1, -CE2
(PC Card I/O Mode)
Card Enable
This signal is the same as the PC Card
Memory Mode signal.
-CS0, -CS1
(True IDE Mode)
In the True IDE Mode, -CS0 is the
address range select for the task file
registers while -CS1 is used to select the
Alternate Status Register and the Device
Control Register.
While –DMACK is asserted, -CS0 and –
CS1 shall be held negated and the width
of the transfers shall be 16 bits.
-CSEL
(PC Card Memory Mode)
I 39 This signal is not used for this mode, but
should be connected by the host to PC
Card A25 or grounded by the host.
-CSEL
(PC Card I/O Mode)
This signal is not used for this mode, but
should be connected by the host to PC
Card A25 or grounded by the host.
-CSEL
(True IDE Mode)
This internally pulled up signal is used to
configure this device as a Master or a
Slave when configured in the True IDE
Mode. When this pin is grounded, this
device is configured as a Master. When
the pin is open, this device is configured
as a Slave.
D15 - D00
(PC Card Memory Mode)
I/O 31,30,29,28,
27,49,48,47,
6,5,4,3,2,
23, 22, 21
These lines carry the Data, Commands
and Status information between the host
and the controller. D00 is the LSB of the
Even Byte of the Word. D08 is the LSB of
the Odd Byte of the Word.
D15 - D00
(PC Card I/O Mode)
This signal is the same as the PC Card
Memory Mode signal.
D15 - D00
(True IDE Mode)
In True IDE Mode, all Task File operations
occur in byte mode on the low order bus
D[7:0] while all data transfers are 16 bit
using D[15:0].
GND
(PC Card Memory Mode)
-- 1,50 Ground.
GND
(PC Card I/O Mode)
This signal is the same for all modes.
GND
(True IDE Mode)
This signal is the same for all modes.
-INPACK
(PC Card Memory Mode
except Ultra DMA Protocol
Active)
O 43 This signal is not used in this mode.
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Signal Name Dir. Pin Description
-INPACK
(PC Card I/O Mode except
Ultra DMA Protocol
Active)
Input Acknowledge
The Input Acknowledge signal is asserted
by the CompactFlash Storage Card or
CF+ Card when the card is selected and
responding to an I/O read cycle at the
address that is on the address bus. This
signal is used by the host to control the
enable of any input data buffers between
the CompactFlash Storage Card or CF+
Card and the CPU.
Hosts that support a single socket per
interface logic, such as for Advanced
Timing Modes and Ultra DMA operation
may ignore the –INPACK signal from the
device and manage their input buffers
based solely on Card Enable signals.
-DMARQ
(PC Card Memory Mode -
Ultra DMA Protocol
Active)
-DMARQ
(PC Card I/O Mode - Ultra
DMA Protocol Active)
DMARQ
(True IDE Mode)
This signal is a DMA Request that is used
for DMA data transfers between host and
device. It shall be asserted by the device
when it is ready to transfer data to or from
the host. For Multiword DMA transfers, the
direction of data transfer is controlled by
-IORD and -IOWR. This signal is used in a
handshake manner with (-) DMACK, i.e.,
the device shall wait until the host asserts
(-) DMACK before negating (-) DMARQ,
and re-asserting (-) DMARQ if there is
more data to transfer.
In PCMCIA I/O Mode, the -DMARQ shall
be ignored by the host while the host is
performing an I/O Read cycle to the
device. The host shall not initiate an I/O
Read cycle while -DMARQ is asserted by
the device.
In True IDE Mode, DMARQ shall not be
driven when the device is not selected in
the Drive-Head register.
While a DMA operation is in progress,
-CS0 (-CE1) and -CS1 (-CE2) shall be
held negated and the width of the
transfers shall be 16 bits.
If there is no hardware support for True
IDE DMA mode in the host, this output
signal is not used and should not be
connected at the host. In this case, the
BIOS must report that DMA mode is not
supported by the host so that device
drivers will not attempt DMA mode
operation.
A host that does not support DMA mode
and implements both PC Card and True
IDE modes of operation need not alter the
PC Card mode connections while in True
IDE mode as long as this does not prevent
proper operation in any mode.
-IORD
(PC Card Memory Mode
except Ultra DMA Protocol
Active)
I 34 This signal is not used in this mode.
-IORD
(PC Card I/O Mode except
Ultra DMA Protocol
Active)
This is an I/O Read strobe generated by
the host. This signal gates I/O data onto
the bus from the CompactFlash Storage
Card or CF+ Card when the card is
configured to use the I/O interface.
-IORD
(True IDE Mode – Except
Ultra DMA Protocol
Active)
In True IDE Mode, while Ultra DMA mode
is not active, this signal has the same
function as in PC Card I/O Mode.
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Signal Name Dir. Pin Description
-HDMARDY
(All Modes - Ultra DMA
Protocol DMA Read)
In all modes when Ultra DMA mode DMA
Read is active, this signal is asserted by
the host to indicate that the host is ready
to receive Ultra DMA data-in bursts. The
host may negate –HDMARDY to pause an
Ultra DMA transfer.
HSTROBE
(All Modes - Ultra DMA
Protocol DMA Write)
In all modes when Ultra DMA mode DMA
Write is active, this signal is the data out
strobe generated by the host. Both the
rising and falling edge of HSTROBE
cause data to be latched by the device.
The host may stop generating HSTROBE
edges to pause an Ultra DMA data-out
burst.
-IOWR
(PC Card Memory Mode –
Except Ultra DMA
Protocol Active)
I 35 This signal is not used in this mode.
-IOWR
(PC Card I/O Mode –
Except Ultra DMA
Protocol Active)
The I/O Write strobe pulse is used to clock
I/O data on the Card Data bus into the
CompactFlash Storage Card or CF+ Card
controller registers when the
CompactFlash Storage Card or CF+ Card
is configured to use the I/O interface.
The clocking shall occur on the negative
to positive edge of the signal (trailing
edge).
-IOWR
(True IDE Mode – Except
Ultra DMA Protocol
Active)
In True IDE Mode, while Ultra DMA mode
protocol is not active, this signal has the
same function as in PC Card I/O Mode.
When Ultra DMA mode protocol is
supported, this signal must be negated
before entering Ultra DMA mode protocol.
STOP
(All Modes – Ultra DMA
Protocol Active)
In All Modes, while Ultra DMA mode
protocol is active, the assertion of this
signal causes the termination of the Ultra
DMA data burst.
-OE
(PC Card Memory Mode) I 9 This is an Output Enable strobe generated
by the host interface. It is used to read
data from the CompactFlash Storage Card
or CF+ Card in Memory Mode and to read
the CIS and configuration registers.
-OE
(PC Card I/O Mode)
In PC Card I/O Mode, this signal is used
to read the CIS and configuration
registers.
-ATA SEL
(True IDE Mode)
To enable True IDE Mode this input
should be grounded by the host.
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Signal Name Dir. Pin Description
READY
(PC Card Memory Mode)
O 37 In Memory Mode, this signal is set high
when the CompactFlash Storage Card or
CF+ Card is ready to accept a new data
transfer operation and is held low when
the card is busy.
At power up and at Reset, the READY
signal is held low (busy) until the
CompactFlash Storage Card or CF+ Card
has completed its power up or reset
function. No access of any type should be
made to the CompactFlash Storage Card
or CF+ Card during this time.
Note, however, that when a card is
powered up and used with RESET
continuously disconnected or asserted,
the Reset function of the RESET pin is
disabled. Consequently, the continuous
assertion of RESET from the application
of power shall not cause the READY
signal to remain continuously in the busy
state.
-IREQ
(PC Card I/O Mode)
I/O Operation – After the CompactFlash
Storage Card or CF+ Card has been
configured for I/O operation, this signal is
used as -Interrupt Request. This line is
strobed low to generate a pulse mode
interrupt or held low for a level mode
interrupt.
INTRQ
(True IDE Mode)
In True IDE Mode signal is the active high
Interrupt Request to the host.
-REG
(PC Card Memory Mode –
Except Ultra DMA
Protocol Active)
Attribute Memory Select
I 44 This signal is used during Memory Cycles
to distinguish between Common Memory
and Register (Attribute) Memory
accesses. High for Common Memory, Low
for Attribute Memory.
In PC Card Memory Mode, when Ultra
DMA Protocol is supported by the host
and the host has enabled Ultra DMA
protocol on the card the, host shall keep
the -REG signal
negated during the execution of any DMA
Command by the device.
-REG
(PC Card I/O Mode –
Except Ultra DMA
Protocol Active)
The signal shall also be active (low) during
I/O Cycles when the I/O address is on the
Bus.
In PC Card I/O Mode, when Ultra DMA
Protocol is supported by the host and the
host has enabled Ultra DMA protocol on
the card the, host shall keep the -REG
signal asserted during the execution of
any DMA Command by the device.
-DMACK
(PC Card Memory Mode
when Ultra DMA Protocol
Active)
DMACK
(PC Card I/O Mode when
Ultra DMA Protocol
Active)
-DMACK
(True IDE Mode)
This is a DMA Acknowledge signal that is
asserted by the host in response to (-)
DMARQ to initiate DMA transfers.
In True IDE Mode, while DMA operations
are not active, the card shall ignore the (-)
DMACK signal, including a floating
condition.
If DMA operation is not supported by a
True IDE Mode only host, this signal
should be driven high or connected to
VCC by the host.
A host that does not support DMA mode
and implements both PC Card and True-
IDE modes of operation need not alter the
PC Card mode connections while in True-
IDE mode as long as this does not prevent
proper operation all modes.
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Signal Name Dir. Pin Description
RESET
(PC Card Memory Mode)
I 41 The CompactFlash Storage Card or CF+
Card is Reset when the RESET pin is high
with the following important exception:
The host may leave the RESET pin open
or keep it continually high from the
application of power without causing a
continuous Reset of the card. Under
either of these conditions, the card shall
emerge from power-up having completed
an initial Reset.
The CompactFlash Storage Card or CF+
Card is also Reset when the Soft Reset bit
in the Card Configuration Option Register
is set.
RESET
(PC Card I/O Mode)
This signal is the same as the PC Card
Memory Mode signal.
-RESET
(True IDE Mode)
In the True IDE Mode, this input pin is the
active low hardware reset from the host.
VCC
(PC Card Memory Mode)
-- 13,38 +5 V, +3.3 V power.
VCC
(PC Card I/O Mode)
This signal is the same for all modes.
VCC
(True IDE Mode)
This signal is the same for all modes.
-VS1
-VS2
(PC Card Memory Mode)
O 33
40
Voltage Sense Signals. -VS1 is grounded
on the Card and sensed by the Host so
that the CompactFlash Storage Card or
CF+ Card CIS can be read at 3.3 volts
and -VS2 is reserved by PCMCIA for a
secondary voltage and is not connected
on the Card.
-VS1
-VS2
(PC Card I/O Mode)
This signal is the same for all modes.
-VS1
-VS2
(True IDE Mode)
This signal is the same for all modes.
-WAIT
(PC Card Memory Mode –
Except Ultra DMA
Protocol Active)
O 42 The -WAIT signal is driven low by the
CompactFlash Storage Card or CF+ Card
to signal the host to delay completion of a
memory or I/O cycle that is in progress.
-WAIT
(PC Card I/O Mode –
Except Ultra DMA
Protocol Active)
This signal is the same as the PC Card
Memory Mode signal.
IORDY
(True IDE Mode – Except
Ultra DMA Protocol
Active)
In True IDE Mode, except in Ultra DMA
modes, this output signal may be used as
IORDY.
-DDMARDY
(All Modes – Ultra DMA
Write Protocol Active)
In all modes, when Ultra DMA mode DMA
Write is active, this signal is asserted by
the device during a data burst to indicate
that the device is ready to receive Ultra
DMA data out bursts. The device may
negate -DDMARDY to pause an Ultra
DMA transfer.
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Signal Name Dir. Pin Description
DSTROBE
(All Modes – Ultra DMA
Read Protocol Active)
In all modes, when Ultra DMA mode DMA
Read is active, this signal is the data in
strobe generated by the device. Both the
rising and falling edge of DSTROBE
cause data to be latched by the host. The
device may stop generating DSTROBE
edges to pause an Ultra DMA data in
burst.
-WE
(PC Card Memory Mode) I 36 This is a signal driven by the host and
used for strobing memory write data to the
registers of the CompactFlash Storage
Card or CF+ Card when the card is
configured in the memory interface mode.
It is also used for writing the configuration
registers.
-WE
(PC Card I/O Mode)
In PC Card I/O Mode, this signal is used
for writing the configuration registers.
-WE
(True IDE Mode)
In True IDE Mode, this input signal is not
used and should be connected to VCC by
the host.
WP
(PC Card Memory Mode)
Write Protect
O 24 Memory Mode – The CompactFlash
Storage Card or CF+ Card does not have
a write protect switch. This signal is held
low after the completion of the reset
initialization sequence.
-IOIS16
(PC Card I/O Mode)
I/O Operation – When the CompactFlash
Storage Card or CF+ Card is configured
for I/O Operation Pin 24 is used for the
-I/O Selected is 16 Bit Port (-IOIS16)
function. A Low signal indicates that a 16
bit or odd byte only operation can be
performed at the addressed port.
-IOCS16
(True IDE Mode)
In True IDE Mode this output signal is
asserted low when this device is expecting
a word data transfer cycle.
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3.3 Electrical Specification
All D.C. Characteris tics for the CompactF las h Memor y Card Ser ies are define d as follow s:
Typical conditions unless otherwise stated:
VCC = 5V +/- 10% Tolerant
VCC = 3.3V +/- 5%
Ta = 0° C to 60° C
Absolute Maximum Conditions:
VCC = -0.3V min. to 6.5V max.
V* = 0.5V min. to VCC + 0.5V max.
*Voltage on any pin except VCC with respect to GND.
3.3.1 Input Leakage Control and Input Characteristics
In Table 3-5, “x” refers to the characteristics described in Table 3-6. For example–"I1U"
indicates a pull-up resistor with a Type 1 input characteristic.
Table 3-5 Input Leakage Control
Type Parameter Symbol Conditions MIN MAX Unit
lxZ Input Leakage Current IL Vih=VCC/Vil=GND -1 1 uA
IxU Pull Up Resistor RPU1 VCC=5.0V 50k 500k Ohm
IxD Pull Down Resistor RPD1 VCC=5.0V 50k 500k Ohm
NOTE: The minimum pul l-up resistor input leakage is 50k ohms rather than the 10k ohms
stated in the PCMCIA PC Card specification.
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Table 3-6 defines the input characteristics of the parameters in Table 3-5.
Table 3-6 Input Characteristics
Min. Typ. Max. Min. Typ. Max.
Type Parameter Symbol VCC=3.3V VCC=5.0V Unit
1 Input Voltage
CMOS
Vih
Vil
2.0
0.8
2.0
0.8
Volts
2 Input Voltage
CMOS
Vih
Vil
2.0
0.8
2.0
0.8
Volts
3 Input Voltage
CMOS
Schmitt Trigger
Vt+(Vp)1
Vt-(Vn)2
Vh(ΔVt)3
0.9
0.7
0.2
2.1
1.9
1.4
0.9
0.7
0.2
2.1
1.9
1.4
Volts
Notes:
1) Vt+(Vp) is the positive going threshold voltage.
2) Vt-(Vn) is the negative going threshold voltage.
3) Vh(ΔVt) is the hysteresis voltage
In UDMA mode s greater than 4, the following c haracteristics apply. Voltage output high and
low values shall be met at the source connector to include the effect of series termination.
Table 3-7 Input Characteristics (UDMA Mode > 4)
Parameter Symbol MIN MAX Units
DC supply voltage to receivers VDD3 3.3 - 8% 3.3 + 8% Volts
Low to high input threshold V+ 1.5 2.0 Volts
High to low input threshold V 1.0 1.5 Volts
Difference between input thresholds:
((V+current value) (Vcurrent value))
VHYS 320 mV
Average of thresholds: ((V+current value) +
(Vcurrent value))/2
VTHRAVG 1.3 1.7 Volts
3.3.2 Output Drive Type and Characteristics
In Table 3-8 "x" re fers to the characteristics described in Table 3-8. For example–"OT 3" refers
to Totempole output with a Type 3 output drive characteristi c.
Table 3-8 Output Drive Type
Type Output Type Valid Conditions
OTx Totempole loh & lol
OZx Tri-state N-P Channel loh & lol
OPx P-Channel Only loh only
ONx N-Channel Only loh Only
Table 3-9 Output Drive Characteristics
Type Parameter Symbol Conditions Min. Typ. Max. Unit
1 Output Voltage Voh
Vol
Ioh = -4 mA
Iol = 4 mA
2.4V
0.4V
Volts
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2 Output Voltage Voh
Vol
Ioh = -4 mA
Iol = 4 mA
2.4V
0.4V
Volts
3 Output Voltage Voh
Vol
Ioh = -4 mA
Iol = 4 mA
2.4V
0.4V
Volts
X Tri-State
Leakage Current
Ioz Vol = Gnd
Voh = Vcc
-10 10 µA
In UDMA modes greater than 4, the characteristics specified in the following table apply. Voltage
output high and low values shall be met at the source connector to include the effect of series
termination.
Table 3-10 Output Drive Character istics (UDMA Mode > 4)
Parameter Symbol MIN MAX Units
DC supply voltage to drivers VDD3 3.3 - 8% 3.3 + 8% Volts
Voltage output high at -6 mA to +3 mA
(at VoH2 the output shall be able to
supply and sink current to VDD3)
VoH2 VDD3 - 0.51 VDD3 +
0.3
Volts
Voltage output low at 6 mA VoL2 0.51 Volts
Notes:
1) IoLDASP shall be 12 mA minimum to meet legacy timing and signal integrity.
2) IoH value at 400 μA is insufficient in the case of DMARQ that is pulled low by a 5.6 kΩ resistor.
3) Voltage output high and low values shall be met at the source connector to include the effect of series
termination.
4) A device shall have less than 64 μA of leakage current into a 6.2 KΩ pull-down resistor while the INTRQ
signal is in the released state.
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4 ATA Command Set
The following table defines the complete list of commands supported by the CompactFlash card. Specifics
of each command’s operation can be fou nd in the CF+ & CF SPECIFICATION REV. 4.1.
Table 5-1 Primary and S econdary I/O Decoding
Class Command Code
1 Check Power Mode E5h or 98h
1 Execute Drive Diagnostic 90h
1 Erase Sector(s)a C0h
2 Format Track 50h
1 Identify Device ECh
1 Idle E3h or 97h
1 Idle Immediate E1h or 95h
1 Initialize Drive Parameters 91h
1 Read Buffer E4h
1 Read DMA C8 or C9
1 Read Multiple C4h
1 Read Sector(s) 20h or 21h
1 Read Verify Sector(s) 40h or 41h
1 Recalibrate 1Xh
1 Request Senseb 03h
1 Seek 7Xh
1 Set Features EFh
1 Set Multiple Mode C6h
1 Set Sleep Mode E6h or 99h
1 Stand By E2h or 96h
1 Stand By Immediate E0h or 94h
1 Translate Sector 87h
1 Wear Level F5h
2 Write Buffer E8h
2 Write DMA CA or CB
3 Write Multiple C5h
3 Write Multiple w/o Erase CDh
2 Write Sector(s) 30h or 31h
2 Write Sector(s) w/o Erase 38h
2 Write Verify 3Ch
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5 Identify Device–ECH
The following table defines the specifics of the Identify Data returned by the CompactFlash card. Specifics of
each word can be found in the CF+ & CF SPECIFICATION REV. 4.1.
Table 5-8 Identify Devic e In formation
Word
Address Default Value Total Bytes Data Field Type Information
848Ah 2 General configuration bit-significant
information
0XXX 2 General configuration – Bit Significant with
ATA-4 definitions.
0
044Ah 2 Fixed Drive
1 XXXXh 2 Default number of cylinders
2 0000h 2 Reserved
3 00XXh 2 Default number of heads
4 0000h 2 Obsolete
5 0000h 2 Obsolete
6 XXXXh 2 Default number of sectors per track
7-8 XXXXh 4 Number of sectors per card (Word 7 = MSW,
Word 8 = LSW)
9 XXXXh 2 Obsolete
10-19 aaaa 20 Serial number in ASCII (right justified)
20 0000h 2 Obsolete
21 0000h 2 Obsolete
22 0004h 2 Number of ECC bytes passed on Read/Write
Long Commands
23-26 aaaa 8 Firmware revision in ASCII (Rev M.ms) set by
code Big Endian Byte Order in Word
27-46 aaaa 40 Model number in ASCII (left justified) Big
Endian Byte Order in Word
47 000Xh 2 Maximum of 1 sector on Read/Write Multiple
command
48 0000h 2 Reserved
49 XX00h 2 Capabilities
50 0000h 2 Reserved
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Table 5-8 Identify Devic e In formation
Word
Address Default Value Total Bytes Data Field Type Information
51 0200h 2 PIO data transfer cycle timing mode
52 0000h 2 Single word DMA data transfer cycle timing
mode (not supported)
53 0003h 2 Field validity
54 XXXXh 2 Current number of cylinders
55 XXXXh 2 Current number of heads
56 XXXXh 2 Current sectors per track
57-58 XXXXh 4 Current capacity in sectors (LBAs) (Word 57
= LSW, Word 58 = MSW)
59 010Xh 2 Multiple sector setting is valid
60-61 XXXXh 4 Total number of sectors addressable in LBA
Mode
62 0000h 2 Single word DMA transfer (not supported)
63 0X07h 2 0-7: Multiword DMA modes supported
15-8: Multiword DMA mode active
64 0003h 2 Advanced PIO modes supported
65 0078h
(IDE Mode only)
2 Minimum multiword DMA transfer cycle time
per word in ns
66 0078h
(IDE Mode only)
2 Recommended multiword DMA transfer cycle
time per word in ns
67 0078h 2 Minimum PIO transfer without flow control
68 0078h 2 Minimum PIO transfer with IORDY flow control
69-79 0000h 20 Reserved
80 00XXh 2 Major ATA version
81 0000h 2 Minor ATA version
82 00X0h 2 Features/command sets supported
83 4004h 2 Features/command sets supported
84 4000h 2 Features/command sets supported
85 0000h 2 Features/command sets enabled
86 0004h 2 Features/command sets enabled
87 4000h 2 Features/command sets enabled
88 XXXXh 2 Ultra DMA Mode supported and selected
89 XXXXh 2 Time required for security erase-unit
completion
90 0000h 2 Time required for enhanced security erase-unit
completion
91 XXXXh 2 Current advanced power management value
92-127 0000h 72 Reserved
128-159 0000h 64 Reserved vendor-unique bytes
160 0000h 2 Power requirement description
161 0000h 2 Reserved for assignment by the CFA
162 0000h 2 Key management schemes supported
SanDisk CompactFlash Card OEM Product Manual Identify Device–ECH
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
28
Table 5-8 Identify Devic e In formation
Word
Address Default Value Total Bytes Data Field Type Information
163 XXXXh 2 CF Advanced True IDE Timing Mode
Capability and Setting
164 XXXXh 2 CF Advanced PCMCIA I/O and Memory
Timing Mode Capability
165-175 0000h 22 Reserved for assignment by the CFA
176-255 0000h 140 Reserved
a. Multiword DMA is supported by SanDisk PCMCIA. For all unsupported cases, 0100H is reported in word
49, and 0000H is reported in words 52, 63, and 65. CompactFlash products will support multi-word.
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
29
6 CIS Description
This section descr ibes the Car d Informat ion Struc ture (CIS) for SanD isk Com pactF la sh Mem ory
cards.
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
000h 01h CISTPL_DEVICE Device Info Tuple Tuple Code
002h 04h
Link is 4 bytes Link to next
tuple
004h DFh
Dev ID Type Dh =
I/O W
1 Speed 7h = Ext I/O Device, Wait State,
Extended Speed Device ID,
WPS, Speed
006h 12h X Speed Mantissa = 2h Speed Exponent = 2h 120 ns if no wait Extended
Speed
79h
Extreme III X Speed Mantissa = Fh Speed Exponent = 1h 80 ns if no wait Extended
Speed
008h 01h
# Address Unit – 1 = 1x Side Code = 2k units (One) 2 kB of Address
Space Device Size
00Ah FFh
List End Marker End of Devices End Marker
00Ch 1Ch
CISTPL_DEVICE_OC Other Conditions
Info Tuple Tuple Code
00Eh 04h
Link is 4 Bytes Link to Next
Tuple
010h 03h
Reserved = 0 VCC
W
A
I
T
Conditions: 3V
operation is allowed
and WAIT is used
3 V
Operation,
Wait Function
012h D9h
Dev ID Type Dh
= I/O W
1 Speed = 1h I/O Device, WPS,
Speed = 250 ns Device ID,
WPS, Speed
014h 01h
# Address Unit – 1 = 1x Side Code = 2k units 2 kB of Address Space Device Size
016h FFh
List End Marker End of Devices End Marker
018h 18h
CISTPL_JEDEC_C JEDEC ID Common
Memory Tuple Code
01Ah 02h
Link is 2 bytes Link Length
01Ch DFh
PCMCIA JEDEC Manufacturer’s ID First byte of JEDEC ID
for SanDisk PC Card
ATA 12V
Byte 1,
JEDEC ID of
Device 1 (0-
2K)
01Eh 01h
PCMCIA Code for PC Card-ATA No Vpp Required Second Byte of
JEDEC ID Byte 2,
JEDEC ID
020h 20h
CISTPL_MANFID Manufacturer’s ID
Tuple Tuple Code
022h 04h
Link is 4 bytes Link Length
024h 45h
Low Byte of PCMCIA Manufacturer’s Code SanDisk JEDEC
Manufacturer’s ID
Low Byte of
PCMCIA Mfg
ID
SanDisk CompactFlash Card OEM Product Manual CIS Description
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30
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
026h 00h High Byte of PCMCIA Manufacturer’s Code High Byte of
PCMCIA
Code of 0 because
other byte is JEDEC 1
byte Manufacturer’s ID Mfg ID
028h 01h Low Byte of Product Code SanDisk Code for SDP
Series Low Byte
Product Code
02Ah 04h High Byte of Product Code SanDisk Code for
PC Card ATA High Byte
Product Code
02Ch 15h CISTPL_VER_1 Level 1
Version/Product Info Tuple Code
02Eh 17h
Link to next tuple is
23 bytes Link Length
030h 04h TPPLV1_MAJOR PCMCIA 2.0/JEIDA 4.1 Major Version
032h 01h TPPLV1_MINOR PCMCIA 2.0/JEIDA 4.1 Minor Version
034h 53h ASCII Manufacturer String ‘S’ String 1
036h 61h ‘a’a
038h 6Eh ‘n’
03Ah 44h ‘D’
03Ch 69h ‘i’
03Eh 73h ‘s’
040h 6Bh ‘k’
042h 00h End of Manufacturer String Null Terminator
044h 53h ASCII Product Name String ‘S’ Info String 2
046h 44h ‘D’
048h 50h ‘P’
04Ah 00h End of Product Name String Null Terminator
04Ch 35h ‘5’ Info String 3
04Eh 2Fh ‘/’
050h 33h ‘3’
052h 20h
054h 30h SanDisk Card CIS Revision Number ‘0’
056h 2Eh ‘.’
058h 36h ‘6’
05Ah 00h End of CIS Revision Number Null Terminator
05Ch FFh End of List Marker FFh List Terminator No Info
String 4
05Eh 80h CISTPL_VEND_SPECIF_80
SanDisk Parameters
Tuple Tuple Code
060h 03h (Field Bytes 3-4 taken as 0) Link Length is 3 Bytes Link to Next
Tuple and
Length of Info
in this Tuple
SanDisk CompactFlash Card OEM Product Manual CIS Description
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31
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
062h 14h W 12 NI PP P R I A R I R SP No Wear Level & NO SanDisk
D Fields, 1 to 4
N Bytes limited
0 0 1 1
A
0 1 0 0
Vpp
W: No Wear Level
12: Vpp not used on
Write by link length
NI: -INPACK
connected
PP: Programmable
Power
PDNA: Pwr Down
Not
Abort--Cmd
RIA: RBsy, ATBsy
connected
RIR: RBsy Inhibited
at Reset
SP: No Security
Present
This definition
applies
only to cards with
Manufacturer's ID
tuple
1st 3 bytes 45 00 01.
064h 08h R R R R E TPR TAR R8
R8: 8 bit ROM
present
0 0 0 0 1 0 0 0
TAR: Temp Bsy on
AT Reset
TPR: Temp Bsy on
SanDisk
Fields, 1 to 4
bytes limited
by link length
PCMCIA Reset
E: Erase Ahead
Avail-
able
R: Reserved, 0 for
now
This definition
applies
only to cards with
Manufacturer's ID
tuple
1st 3 bytes 45 00 01.
066h 00h For specific
platform
use only
068h 21h CISTPL_FUNCID Function ID Tuple Tuple Code
06Ah 02h
Link Length is 2
Bytes Link to Next
Tuple
06Ch 04h Function Type Code Disk Function Function
Code
06Eh 01h
R
0 R
0 R
0 R
0 R
0 R
0 R
0 P
1 Attempt installation
at POST:
P: Install at POST
R: Reserved (0)
070h 22h CISTPL_FUNCE Function
Extension Tuple Tuple Code
072h 02h
Link Length is 2
Bytes Link to Next
Tuple
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
32
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
074h 01h Disk Function Extension Tuple Type Extension Tuple Extension
describes the Interface Tuple Type
Protocol for Disk
076h 01h Interface Type Code
PC Card–ATA
Interface Extension Info
078h 22h CISTPL_FUNCE
Function Extension
tuple Tuple Code
07Ah 03h Tuple has 3 Info Bytes Link Length
07Ch 02h Disk Function Extension Tuple Type Basic PCMCIA-ATA Extension
Extension Tuple Tuple Type
for Disk
07Eh 0Ch
R
0 R
0 R
0 R
0 U
1 S
1 V
0
Unique Manufacturer/
Serial Number
combined string: Basic ATA
Option
Parameters
V = 0: No Vpp
Required
V = 1: Vpp on Modified
Media
V = 2: Vpp on Any
Operation
V = 3: Vpp Continuous
S: Silicon, else
Rotating Drive
U: ID Drive Mfg/SN
Unique
080h 0Fh
R
0 I
0 E
0 N
0 P3
1 P2
1 P1
1 P0
1
All power-down modes
and power commands
are not needed to
Extended
ATA Option
Parameters
minimize power.
P0: Sleep Mode
Supported
P1: Standby Mode
Supported
P2: Idle Mode
Supported
P3: Drive Auto Power
Control
N: Some Config
Excludes 3X7
E: Index Bit is
Emulated
I: Twin–-IOis16 Data
Reg Only
082h 1Ah CISTPL_CONF Configuration Tuple Tuple Code
084h 05h Link Length is 5 Bytes Link to Next
Tuple
SanDisk CompactFlash Card OEM Product Manual CIS Description
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33
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
086h 01h RFS
00 RMS
00 RAS
01 Size of
Reserved Field Size of Fields
Byte
(TPCC_SZ)
is 0 Bytes
Size of Register
Mask is 1 Byte
Size of Config
Base Address is
2 Bytes
RFS: Bytes in
Reserved Field
RMS: Bytes in
Reg Mask–1
RAS: Bytes in
Base Addr–1
088h
07h TPCC_LAST
Entry with
Config Index
07h is final entry
in table
Last Entry of
Config. Table
08Ah 00h TPCC_RADR (LSB)
08Ch 02h TPCC_RADR (MSB)
Configuration
Registers
located at 200h
in Reg. Space
Location of
Config.
Registers
08Eh 0Fh R
0 R
0 R
0 R
0 S
1 P
1 C
1 I
1 First (4)
Configuration
Registers are
present:
TPCC_RMSK
I: Configuration
Index
C: Conf iguration
and Status
P: Pin
Replacement
S: Socket and
Copy
R: Reserved for
futur e use
090h 1Bh CISTPL_CE Configuration
Entry Tuple
Tuple Code
092h 0Bh Link to
Next Tuple
Link to Next
Tuple is 11
Bytes. Also
limits size of
this tuple to 13
bytes.
094h C0h I
1 D 1 Configuration Index
0
Memory
Mapped I/O
Configuration
TPCE_INDX
Configuration
Index for
this entry is 0.
Interface
Byte follows this
byte .
Default
Configuration,
so is not
dependent on
previous Default
Configuration.
D: Default
Configuration
I: Interface Byte
follows
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
34
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
096h C0h W
1 R
1 P
0 B
0 Interface Type Memory Only
Interface(0), Bvd's and
wProt not used,
TPCE_IF
Ready/-Busy and Wait
for memory cycles
active.
B: Battery Volt
Detects Used
P: Write Protect Used
R: Ready/-Busy Used
W: Wait Used for
Memory Cycles
098h A1h M MS IR IO T P VCC only Power; TPCE_FS
1 1 0 0 0 1 No Timing, I/O, or
IRQ;
2 Byte Memory Space
Length;
Misc Entry Present.
P: Power Info type
T: Timin Info present
IO: I/O Port Info
present
IR: Interrupt Info
present
MS: Mem Space Info
type
M: Misc Info Byte(s)
present
09Ah 27h R DI PI AI SI HV LV NV Nominal Voltage
follows: Power
0 0 1 0 0 1 1 1 NV: Nominal Voltage
LV: Mimimum Voltage Parameters
for VCC
HB: Maximum Voltage
SI: Static Current
AI: Average Current
PI: Peak Current
DI: Power Down
Current
09Ch 55h X
0 Mantissa
Ah = 5.0 Exponent 5h
= 1V VCC Nominal is 5 V VCC Nominal
Value
09Eh 4Dh X
0 Mantissa
9h = 4.5 Exponent 5h
= 1V VCC Nominal is 4.5 V VCC Min.
Value
0A0h 5Dh X
0 Mantissa
Bh = 5.5 Exponent 5h
= 1V VCC Nominal is 5.5 V VCC Max.
Value
0A2h 75h X Mantissa Exponent Max. Average Current Max. Average
0 Eh = 8.0 5h = 10 over 10 ms is 80 mA Current
0A4h 08h Length in 256 Bytes Pages (LSB) Length of Memory
Space is 2 kB TPCE_MS
Length LSB
0A6h 00h Length in 256 Bytes Pages (MSB) Start at 0 on card TPCE_MS
Length MSB
SanDisk CompactFlash Card OEM Product Manual CIS Description
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35
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
0A8h 21h X
0 R
0 P
1 RO
0 A
0 T
1 Power-Down and
Twin Card. TPCE_MI
T: Twin Cards Allowed
A: Audio Supported
RO: Read Only Mode
P: Power Down
Supported
R: Reserved
X: More
Miscellaneous
Fields Bytes
0AAh 1Bh CISTPL_CE
Configuration Entry
Tuple Tuple Code
0ACh 06h
Link to Next Tuple is 6 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 8 bytes.
0AEh 00h I D Configuration Index
Memory Mapped I/O TPCE_INDX
0 0 0
3.3V Configuration.
0B0h 01h M MS IR IO T P
P: Power Info type TPCE_FS
0 0 0 0 0 1
0B2h 21h R DI PI AI SI H LV NV
PI: Peak Current TPCE_PD
0 0 1 0 0 0 0 1 NV: Nominal
Operation
Supply Voltage
0B4h B5h X
1 Mantissa
6h = 3.0 Exponent
5h = 10 Nominal Operation
Supply Voltage = 3.0V Nominal
Operation
Supply
Voltage
0B6h 1Eh
X 1Eh +.30
Nominal
0 Operation
Supply
Voltage
Extension
Byte
0B8h 4Dh
X
0
Mantissa 9h = 4.5 Exponent 5h
= 10 Max. Average Current
over 10 ms is 45 mA Max. Average
Current
0BAh 1Bh CISTPL_CE Configuration Entry
Tuple Tuple Code
0BCh 0Dh Link to
Next Tuple
Link to Next Tuple is
13 Bytes. Also limits
size of this tuple to 15
bytes.
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
36
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
0BEh C1h I
1 D
1 Configuration Index
1
I/O Mapped
Contiguous 16
Registers
Configuration.
TPCE_INDX
Configuration Index
for this entry is 1.
Interface Byte follows
this byte.
Default Configuration,
therefore is not
dependent on
previous Default
Configuration.
D: Default
Configuration
I: Inter fa c e B yt e
follows
0C0h 41h W
0 R
1 P
0 B
0 Interface Type
1 I/O Interface(1), Bvd's
and wProt not used;
Ready/-Busy active
but Wait not used for
memory cycles.
TPCE_IF
B: Battery Volt
Detects Used
P: Write Protect Used
R: Ready/-Busy Used
W: Wait Used for
Memory Cycles
0C2h 99h M
1 MS
0 IR
1 IO
1 T
0 P
1 V
CC Only Power TPCE_FS
Descriptors; No
Timing; I/O and IRQ
present; No Memory
Space; Misc Entry
Present
P: Power Info type
T: Timing Info present
IO :I/O Port Info
present
IR: Inter r u p t In fo
present
MS: Memory Space
Info
type
M: Misc Info Byte(s)
present
0C4h 27h R
0 DI
0 PI
1 AI
0 SI
0 HV
1 LV
1 NV
1 Nominal Voltage
Follows Power
NV: Nominal Voltage
LV: Mimimum Voltage Parameters
for VCC
HB: Maximum Voltage
SI: Static Current
AI: Average Current
PI: Peak Current
DI: Power Down
Current
0C6h 55h X Mantissa Exponent
VCC Nominal is 5V VCC Nominal
0 Ah = 5.0 5h = 1V Value
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
37
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3
2 1 0 Content
Description CIS
Function
0C8h 4Dh X Mantissa
Exponent VCC Nominal is 4.5V VCC Min.
0
9h = 4.5 5h = 1V Value
0CAh 5Dh X
Mantissa Exponent VCC Nominal is 5.5V VCC Max.
0
Bh = 5.5 5h = 1V Value
0CCh 75h X
Mantissa Exponent Max. Average Current Max. Average
0
Eh = 8.0 5h = 10 over 10 ms is 80 mA Current
0CEh 64h R
0 S
1 E
1 IO AddeLines 4 Supports both 8 and
16 bit I/O hosts. 4
Address lines & no
range so 16 registers
and host must do all
of the selection
decoding.
TPCE_IO
IO AddrLines:#lines
decoded.
E: 8-bit Only Hosts
Supported
S: 16-bit Hosts
Supported
R: Range follows
0D0h F0h S
1 P
1 L
1 M
1 V
0 B
0 I
0 N
0 IRQ Sharing Logic
Active in Card
Control & Status
TPCE_IR
Register, Pulse and
Level Mode Interrupts
supported,
Recommended IRQ's
any of 0 through 15(F)
S: Share Logic Active
P: Pulse Mode IRQ
Supported
L: Level Mode IR Q
Supported
M: Bit Mask of IRQs
Present
V: Vendor Unique IRQ
B: Bus Error IRQ
I: IO Check IRQ
N: Non-Maskable IRQ
0D2h FFh 7
1 6
1 5
1 4
1 3
1 2
1 1
1 0
1 IRQ Levels to be
routed 0 - 15
recommended.
TPCE_IR
Mask
Extension
Byte 1
0D4h FFh F
1 E
1 D
1 C
1 B
1 A
1 9
1 8
1 Recommended
routing to any
"normal, maskable"
IRQ.
TPCE_IR
Mask
Extension
Byte 2
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
38
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
0D6h 21h X
0 R
0 P
1 RO
0 A
0 T
1 Power-Down and
Twin Card. TPCE_MI
T: Twin Cards Allowed
A: Audio Supported
RO: Read Only Mode
P: Power Down
Supported
R: Reserved
X: More Misc Fields
Bytes
0D8h 1Bh CISTPL_CE
Configuration Entry
Tuple
Tuple Code
0DAh 06h
Link to Next Tuple is 6 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 8 bytes.
0DCh 01h I
0 D
0 Configuration Index
1 I/O Mapped
Contiguous 16 3.3V
Configuration
TPCE_INDX
0DEh 01h M MS IR IO T P: Power Info type TPCE_FS
0 0 0 0 0
P
1
0E0h 21h R
0 DI
0 PI
1 AI
0 SI
0 HV
0 LV
0 NV
1 PI: Peak Current
NV: Nominal
Operation Supply
Voltage
Power
Parameters
for VCC
0E2h B5h
X Mantissa Exponent Nominal Operation Nominal
1 6h = 3.0 5h = 1 Supply Voltage = 3.0V Operation
Supply
Voltage
0E4h 1Eh
X 1Eh +.30 Nominal
0 Operation
Supply
Voltage
Extension
Byte
0E6h 4Dh
X
0
Mantissa
9h = 4.5 Exponent
5h = 10 Max. Average Current
over 10 ms is 45 mA Max. Average
Current
0E8h 1Bh CISTPL_CE
Configuration Entry
Tuple
Tuple Code
0EAh 12h Link to Next Tuple is
18 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 20 bytes
0ECh C2h I
1 D
1 Configuration Index
2 AT Fixed Disk Primary
I/O Address
Configuration
TPCE_INDX
Configuration Index
for this entry is 2.
Interface Byte follows
this b yte.
Default Configuration
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
39
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
0EEh
41h W
0 R
1 P
0 B
0 Interface
Type 1 I/O Interface(1), Bvd's
and wProt not used;
Ready/-Busy active
but Wait not used for
memory cycles
TPCE_IF
.
B: Battery Volt
Detects Used
P: Write Protect Used
R: Ready/-Busy Used
W: Wait Used for
Memory Cycles
0F0h 99h M MS IR IO T P
VCC Only Power TPCE_FS
1 0 1 1 0 1 Description; No
Timing; I/O and IRQ
present; No Memory
Space; Misc Entry
present.
P: Power Info type
T: Timing Info present
IO: I/O Port Info
present
IR: Interrupt Info
present
MS: Memory Space
Info
type
M: Misc Info Byte(s)
present
0F2h 27h R DI PI AI SI HV LV NV Nominal Voltage
follows: Power
0 0 1 0 0 1 1 1
NV: Nominal Voltage
LV: Mimimum Voltage
Parameters
for VCC
HB: Maximum Voltage
SI: Static Current
AI: Average Current
PI: Peak Current
DI: Power Down
Current
0F4h 55h
X Mantissa Exponent VCC Nominal is 5V VCC Nominal
0 Ah = 5.0 5h = 1V Value
0F6h 4Dh
X Mantissa Exponent VCC Nominal is 4.5V VCC Min.
0 9h = 4.5 5h = 1V Value
0F8h 5Dh
X Mantissa Exponent VCC Nominal is 5.5V VCC Max.
0 Bh = 5.5 5h = 1V Value
0FAh 75h
X Mant iss a Exponent Max. Average Current Max. Average
0 9h = 4.5 5h = 10 over 10 ms is 80 mA Current
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
40
Table 6-1 Card Information Structure
Attribute Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
0FCH EAh R
1 S
1 E
1 IO AddeLines Ah = 10 Supports both 8- and
16-bit I/O hosts. 10
Address Lines with
TPCE_IO
range so card will
respond only to
indicated (1F0-1F7,
3F6-3F7) on A9
through A0 for I/O
cycles. IO
AddrLines:#lines
decoded
E: 8-bit Only Hosts
Supported
S: 16-bit Hosts
Supported
R: Range follows
0FEh 61h LS
1 AS
2 N Ranges - 1
1 Number of Ranges is
2; Size of each
address is 2 bytes;
size of each length is
1 byte.
I/O Range
Format
Description
AS: Size of
Addresses
0: No Address
Present
1: 1Byte (8 bit)
Addresses
2: 2Byte (16 bit)
Addresses
3: 4Byte (32 bit)
Addresses
LS: Size of length
0: No Lengths
Present
1: 1Byte (8 bit)
Lengths
2: 2Byte (16 bit)
Lengths
3: 4Byte (32 bit)
Lengths
100h F0h 1st I/O Base Address (isb)
102h 01h 1st I/O Base Address (msb) First I/O Range Base
is 1F0h
104h 07h 1st I/O Range Length – 1 8 Bytes Total Î
1F0-1F7h
I/O Length -1
106h F6h 2nd I/O Base Address (isb)
108h 03h 2nd I/O Base Address (msb) 2nd I/o Range base is
3F6h
10Ah 01h 2nd I/O Range Length – 1 2 Bytes Total Î
3F6-3F7h
I/O Length-1
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
41
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
10Ch EEh S
1 P
1 L
1 M 0 Recommend IRQ Level
Eh = 14 TPCE_IR
IRQ Sharing Logic
Active in Card Control
& Status Register,
Pulse and Level Mode
Interrupts supported,
Recommended IRQ's
any of 0 through 15(F)
S: Share Logic Active
P: Pulse Mode IRQ
Supported
L: Level Mode IRQ
Supported
M: Bit Mask of IRQs
Present
M=0 so bits 3-0 are
single level, binary
encoded
10Eh 21h X
0 R
0 P
1 RO
0 A
0 T
1 Power-Down and
Twin Card.
TPCE_MI
T: Twin Cards Allowed
A: Audio Supported
RO: Read Only Mode
P: Power Down
Supported R:
Reserved
X: More Misc Fields
Bytes
110h 1Bh CISTPL_CE Configuration Entry
Tuple Tuple Code
112h 06h Link to Next Tuple is 6 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 8 bytes.
114h 02h
I D Configuration Index AT Fixed Disk Primary TPCE_INDX
0 0 2 I/O 3.3V Configuration
116h 01h M MS IR IO T P P: Power Info type TPCE_FS
0 0 0 0 0 1
118h 21h R
0 DI
0 PI
1 AI
0 SI
0 HV
0 LV
NV
1 PI: Peak Current NV:
Nominal Operation
Supply Voltage
Power
Parameters
for VCC
11AH B5h
X Mantissa Exponent Nominal Operation Nominal
1 6h = 3.0 5h = 1 Supply Voltage = 3.0V Operation
Supply
Voltage
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
42
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
11Ch 1Eh X 1Eh +.30 Nominal
0 Operation
Supply
Voltage
Extension
Byte
11Eh 4Dh X Mantissa Exponent Max. Average Current Max. Average
0 9h = 4.5 5h = 10 over 10 ms is 45 mA Current
120h 1Bh CISTPL_CE Configuration Entry
Tuple Tuple Code
122h 12h Link to Next Tuple is
18 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 20 bytes.
124h C3h I
1 D 1 Configuration Index 3 AT Fixed Disk
Secondary I/O
Address Configuration
TPCE_INDX
Configuration Index for
this entry is 3.
Interface Byte follows
this b yte.
Default Configuration
126h 41h W
0 R 1 P
0 B 0 Interface Type 1 I/O Interface(1), Bvd's
and wProt not used;
Ready/-Busy active
but Wait not used for
memory cycles.
TPCE_IF
B: Battery Volt Detects
Used
P: Write Protect Used
R: Ready/-Busy Used
W: Wait Used for
Memory Cycles
128h 99h M MS IR IO T P
VCC-Only Power TPCE_FS
1 0 1 1 0 1 Descriptors; No
Timing; I/O and IRQ
present; No Memory
Space; Misc Entry
Present.
P: Power Info type
T: Timing Info present
IO: I /O Port Info
present
IR: Interrupt Info
present
MS: Memory Space
Info
type
M: Misc Info Byte(s)
present
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
43
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
12Ah 27h R DI PI AI SI HV LV NV Nominal Voltage
Follows Power
0 0 1 0 0 1 1 1
NV: Nominal Voltage
LV: Mimimum Voltage
Parameters
for VCC
HB: Maximum Voltage
SI: Static Current
AI: Average Current
PI: Peak Current
DI: Power Down
Current
12Ch 55h X Mantissa Exponent
VCC Nominal is 5V VCC Nominal
0 Ah = 5.0 5h = 1V Value
12Eh 4Dh X Mantissa Exponent
VCC Nominal is 4.5V VCC Min.
0 9h = 4.5 5h = 1V Value
130h 5Dh X Mantissa Exponent
VCC Nominal is 5.5V VCC Max.
0 Bh = 5.5 5h = 1V Value
132h 75h X
0 Mantissa
Eh = 1.0 Exponent
5h = 10 Max. Average Current
over 10 ms is 80 mA Max. Average
Current
134h EAh R
1 S
1 E
1 IO AddeLines
\Ah = 10 Supports both 8- and
16-bit I/O hosts. 10
Address Lines with
TPCE_IO
Range so card will
respond only to
indicated (170-177,
376377) on A9
through A0 for I/O
cycles. IO
AddrLines:#lines
decoded
E: 8-bit Only Hosts
Supported
S: 16-bit Hosts
Supported
R: Range follows
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
44
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content Description CIS
Function
136h 61h LS
1 AS
2 N Ranges–1
1 Number of Ranges is 2; Size of
each address is 2 bytes; size of
each length is 1 byte.
I/O Range
Format
Description
AS: Size of Addresses
0: No Address Present
1: 1Byte (8 bit) Addresses
2: 2Byte (16 bit) Addresses
3: 4Byte (32 bit) Addresses
LS: Size of length
0: No Lengths Present
1: 1Byte (8 bit) Lengths
2: 2Byte (16 bit) Lengths
3: 4Byte (32 bit) Lengths
138h 70h
1st I/O Base Address (LSB)
13Ah 01h 1st I/O Base Address (MSB) First I/O Range Base is 170h
13Ch 07h 1st I/O Range Length -1 8 Bytes Total Î170—177h I/O Length-
1
13Eh 76h 2nd I/O Base Address (LSB)
140h 03h 2nd I/O Base Address (MSB) Second I/O Range Base is 376h
142h 01h 2nd I/O Range Length-1 2 Bytes Total Î3766-377 I/O Length-
1
144h EEh S
1 P
1 L
1 M
0 Recommend
IRQ Level
Eh = 14
IRQ Sharing Logic Active in Card
Control & Status Register, Pulse
and Level Mode
Interrupts supported,
Recommended IRQ’s
any of 0 through 15(F).
S: Share Logic Active
P: Pulse Mode IRQ
Supported
L: Level Mode IRQ
Supported
M: Bit Mask of IRQs
Present
M=0 therefore bits 3-0
are single level, binary encoded
TPCE_IR
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
45
Table 6-1 Card Information Structure
Attribute
Offset Da ta 7 6 5 4 3 2 1 0 Content
Description CIS
Function
146h 21h X
0 R 0 P
1 RO
0 A 0 T
1 Power-Down, and
Twin Card. TPCE_MI
T: Twin Cards Allowed
A: Audio Supported
RO: Read Only Mode
P: Power Down
Supported
R: Reserved
X: More Misc Fields
Bytes
148h 1Bh CISTPL_CE Configuration Entry
Tuple Tuple Code
14Ah 06h Link to Next Tuple is 6 Link to
Bytes. Also limits size
of Next Tuple
this tuple to 8 bytes.
14Ch 03h I D Configuration Index AT Fixed Disk TPCE_INDX
0 0 3 Secondary I/O
3.3V Configuration
14Eh 01h M MS IR IO T P P: Power Info type TPCE_FS
0 0 0 0 0 1
150h 21h R
0 DI
0 PI
1 AI 0 SI
0 HV
0 LV 0 NV
1 PI: Peak Current NV:
Nominal Operation
Supply Voltage
Power
Parameters
for VCC
152h B5h X Mantissa Exponent Nominal Operation Nominal
1 6h = 3.0 5h = 1 Supply Voltage = 3.0V Operation
Supply
Voltage
154h 1Eh X 1Eh 0.3 Nominal
0 Operation
Supply
Voltage
Extension
Byte
156h 4Dh X Mantissa Exponent Max. Average Current Max. Average
0 9h = 4.5 5h = 10 over 10 ms is 45 mA Current
158H 1Bh CISTPL_CE Configuration Entry
Tuple Tuple Code
15Ah 04h Link to Next Tuple Link to
is 4 bytes Next Tuple
15Ch 07h I D Configuration Index AT Fixed Disk TPCE_INDX
0 0 7 Secondary I/O
3.3V Configuration
15Eh 00h M MS IR IO T P P: Power Info type TPCE_FS
0 0 0 0 0 0
160h 028h SanDisk Code Reserved
162h 0D3h SanDisk Code Reserved
SanDisk CompactFlash Card OEM Product Manual CIS Description
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
46
Table 6-1 Card Information Structure
Attribute
Offset Data 7 6 5 4 3 2 1 0 Content
Description CIS
Function
164h 014h CISTPL_NO_LINK Prevent scan of
common memory Tuple Code
166h 000h No Bytes following Link Length is 0 Bytes Link to Next
Tuple
168h 0FFh End of Tuple Chain End of CIS Tuple Code
a. Legacy CompactFlash products may report “SunDisk” as the ASCII manufacture string
SanDisk CompactFla sh Memory Card Appendix: Ordering Informati on
02/09, Rev. 1.0 ii © 2007 - 2009 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements.
47
Appendix: Ordering Information
A1. SanDisk CompactFlash Memory Card1
SanDisk products directly from SanDisk, call (408) 801-10 00.
Part Number Product Capacity
Capacity
(formatted in
bytes) Sectors/Card
(Max. LBA+1) No. of
Heads
No. of
Sectors/
Tracks No. of
Cylinders
SDCFAA-002G CF85x 2GB 2,011,226,112 3,928,176 16 63 3,897
SDCFAA-004G CF200x 4GB 4,011,614,208 7,835,184 16 63 7,773
SDCFAA-008G CF200x 8GB 8,012,309,400 15,649,200 16 63 15,525
SDCFAA-016G CF200x 16GB 16,013,942,784 31,277,232 16 63 31,029
SDCFAB-008G CF400x 8GB 8,012,309,400 15,649,200 16 63 15,525
SDCFAB-016G CF400x 16GB 16,013,942,784 31,277,232 16 63 31,029
SDCFAB-032G CF400x 32GB 32,017,047,552 62,553,296 16 63 62,037
SDCFAB-064G CF400x 64GB 64,023,257,088 125,045,424 16 63 65,535
Fixed Drives* Product Capacity
Capacity
(formatted in
bytes) Sectors/Card
(Max. LBA+1) No. of
Heads
No. of
Sectors/
Tracks No. of
Cylinders
SDCFAA-002G-F CF85x 2GB 2,011,226,112 3,928,176 16 63 3,897
SDCFAA-004G-F CF200x 4GB 4,011,614,208 7,835,184 16 63 7,773
SDCFAB-008G-F CF400x 8GB 8,012,309,400 15,649,200 16 63 15,525
SDCFAB-016G-F CF400x 16GB 16,013,942,784 31,277,232 16 63 31,029
*Fixed Drives enables booting from the CF Card. No software tool required.
1 1 megabyte (MB) = 1 million byte s; 1 giga byte (GB) = 1 billion byte s. Some of the listed capacity is used for formatting and other
functions, and thus is not available for data storage.