EA2532KA08-16.000M TR REGULATORY COMPLIANCE (Data Sheet downloaded on Nov 27, 2017) 2011/65 + 2015/863 174 SVHC ITEM DESCRIPTION Quartz Crystal Resonator 2.5mm x 3.2mm x 0.8mm 4 Pad Ceramic Surface Mount (SMD) 16.000MHz 15ppm at 25C, 30ppm over -20C to +70C 08pF Parallel Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency 16.000MHz Frequency Tolerance/Stability 15ppm at 25C, 30ppm over -20C to +70C Aging at 25C 3ppm/Year Maximum Load Capacitance 08pF Parallel Resonant Shunt Capacitance (C0) 5pF Maximum Equivalent Series Resistance 80 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 100Watts Maximum Crystal Cut AT-Cut Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm) Storage Temperature Range -40C to +150C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 1 of 5 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA2532KA08-16.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 2.50 0.10 0.70 0.10 MARKING ORIENTATION 3.20 0.10 4 1.00 0.10 (X4) 1 1.20 0.10 3 0.80 MAX PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground LINE MARKING 1 E16.0 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 2 0.90 0.10 (X4) Note: Chamfer not shown. Seam Sealed Terminal Plating Thickness: Gold (0.3 to 1.0m) over Nickel (1.27 to 8.89m). Suggested Solder Pad Layout All Dimensions in Millimeters 1.30 (X4) 1.30 (X4) Solder Land (X4) 0.80 0.40 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 2 of 5 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EA2532KA08-16.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 0.05 1.75 0.10 3.50 0.05 MARKING ORIENTATION 8.00 0.30 DIA 1.00 MIN 4.00 0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 14.40 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 8.40 +1.50/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 3 of 5 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA2532KA08-16.000M TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 4 of 5 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA2532KA08-16.000M TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 245C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 30 - 60 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 2 Times / 230C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 5 of 5 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200