REGULATORY COMPLIANCE (Data Sheet downloaded on Nov 27, 2017)
2011/65 +
2015/863 174 SVHC
EA2532KA08-16.000M TR
ITEM DESCRIPTION
Quartz Crystal Resonator 2.5mm x 3.2mm x 0.8mm 4 Pad Ceramic Surface Mount (SMD) 16.000MHz ±15ppm at 25°C, ±30ppm
over -20°C to +70°C 08pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 16.000MHz
Frequency Tolerance/Stability ±15ppm at 25°C, ±30ppm over -20°C to +70°C
Aging at 25°C ±3ppm/Year Maximum
Load Capacitance 08pF Parallel Resonant
Shunt Capacitance (C0) 5pF Maximum
Equivalent Series Resistance 80 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 100µWatts Maximum
Crystal Cut AT-Cut
Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm)
Storage Temperature Range -40°C to +150°C
Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 1 of 5
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EA2532KA08-16.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
±0.10
2.50
±0.10
0.80 MAX
Note: Chamfer not shown.
Seam Sealed
Terminal Plating Thickness: Gold (0.3 to 1.0µm) over Nickel (1.27 to 8.89µm).
0.70 ±0.10
1.20
±0.10
MARKING
ORIENTATION
1
2
3
4
0.90 ±0.10 (X4)
1.00
±0.10
(X4)
PIN CONNECTION
1 Crystal
2 Cover/Ground
3 Crystal
4 Cover/Ground
LINE MARKING
1E16.0
E=Ecliptek Designator
2XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
0.80
0.40
1.30 (X4)
1.30 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 2 of 5
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Tape & Reel Dimensions
All Dimensions in Millimeters
Compliant to EIA-481
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
Direction of Unreeling
MARKING
ORIENTATION
EA2532KA08-16.000M TR
8.00 ±0.30
3.50 ±0.05
DIA 1.00 MIN
4.00 ±0.10
2.00 ±0.05
4.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
14.40 MAX
Quantity Per Reel: 1,000 units
360 MAX
8.40 +1.50/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 3 of 5
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EA2532KA08-16.000M TR
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/Second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 4 of 5
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EA2532KA08-16.000M TR
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/Second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision D 10/27/2016 | Page 5 of 5
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
