LM385BM-2.5 - Texas Instruments High-Performance Analog

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode

Check for Samples: LM185-2.5-N,LM285-2.5-N,LM385-2.5-N

Careful design of the LM185-2.5-N has made the

1FEATURES device exceptionally tolerant of capacitive loading,

2• ±20 mV (±0.8%) max. Initial Tolerance (A making it easy to use in almost any reference

Grade) application. The wide dynamic operating range allows

• Operating Current of 20 μA to 20 mA its use with widely varying supplies with excellent

regulation.

• 0.6ΩDynamic Impedance (A Grade) The extremely low power drain of the LM185-2.5-N

• Low Temperature Coefficient makes it useful for micropower circuitry. This voltage

• Low Voltage Reference—2.5V reference can be used to make portable meters,

• 1.2V Device and Adjustable Device Also regulators or general purpose analog circuitry with

Available—LM185-1.2 Series and LM185 battery life approaching shelf life. Further, the wide

Series, respectively operating current allows it to replace older references

with a tighter tolerance part. For applications requiring

1.2V see LM185-1.2.

DESCRIPTION

The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are The LM185-2.5-N is rated for operation over a −55°C

micropower 2-terminal band-gap voltage regulator to 125°C temperature range while the LM285-2.5-N is

diodes. Operating over a 20 μA to 20 mA current rated −40°C to 85°C and the LM385-2.5-N 0°C to

range, they feature exceptionally low dynamic 70°C. The LM185-2.5-N/LM285-2.5-N are available in

impedance and good temperature stability. On-chip a hermetic TO package and the LM285-2.5-N/LM385-

trimming is used to provide tight voltage tolerance. 2.5-N are also available in a low-cost TO-92 molded

Since the LM-185-2.5-N band-gap reference uses package, as well as SOIC and SOT-23. The LM185-

only transistors and resistors, low noise and good 2.5-N is also available in a hermetic leadless chip

long term stability result. carrier package.

Connection Diagram

Figure 1. TO-92 Package Figure 2. SOIC Package

(Bottom View) See Package Number D0008A

See Package Number LP0003A

* Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating.

Figure 3. SOT-23

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

Figure 4. LCCC Leadless Chip Carrier Figure 5. TO Package

See Package Number NAJ0020A (Bottom View)

See Package Number NDU0002A

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS(1)(2)(3)

Reverse Current 30 mA

Forward Current 10 mA

LM185-2.5-N −55°C to + 125°C

Operating Temperature Range(4) LM285-2.5-N −40°C to + 85°C

LM385-2.5-N 0°C to 70°C

ESD Susceptibility(5) 2kV

Storage Temperature −55°C to + 150°C

TO-92 Package (10 sec.) 260°C

TO Package (10 sec.) 300°C

Soldering Information Vapor Phase (60 sec.) 215°C

SOIC and SOT-23 Package Infrared (15 sec.) 220°C

See http://www.ti.com for other methods of soldering surface mount devices.

(1) Refer to RETS185H-2.5 for military specifications.

(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4) For elevated temperature operation, TJ MAX is:

LM185-N: 150°C

LM285-N: 125°C

LM385-N: 100°C

See THERMAL CHARACTERISTICS.

(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

LM185 150°C

LM285 125°C

Thermal Resistance SOIC-8 SOT-23

LM385 100°C

TO-92 TO

θja (Junction to Ambient) 180°C/W (0.4″Leads) 440°C/W 165°C/W 283°C/W

170°C/W (0.125″Leads)

θjc (Junction to Case) N/A 80°C/W N/A N/A

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

ELECTRICAL CHARACTERISTICS

LM385A-2.5-N

LM385AX-2.5-N Units

Parameter Conditions Typ (Limits)

LM385AY-2.5-N

Tested Limit(2) Design Limit(3)

Reverse Breakdown IR= 100 μA 2.500 2.480 V(Min)

Voltage 2.520 V(Max)

2.500 2.470 V(Min)

2.530 V(Max)

Minimum Operating 12 18 20 μA

Current (Max)

Reverse Breakdown IMIN ≤IR≤1mA 1 1.5 mV

Voltage Change with (Max)

Current 1 mA ≤IR≤20 mA 10 20 mV

(Max)

Reverse Dynamic IR= 100 μA, 0.2 0.6 Ω

Impedance f = 20 Hz 1.5

Wideband Noise (rms) IR= 100 μA 120 μV

10 Hz ≤f≤10 kHz

Long Term Stability IR= 100 μA, T = 1000 Hr, 20 ppm

TA= 25°C ±0.1°C

Average Temperature Coefficient(4) IMIN ≤IR≤20 mA

X Suffix 30 ppm/°C

Y Suffix 50 (Max)

All Others 150

(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C.

(2) Specified and 100% production tested.

(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.

(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between

the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

ELECTRICAL CHARACTERISTICS LM185-2.5-N LM385B-2.5-N

LM185BX-2.5-N

LM185BY-2.5-N LM385BX-2.5-N LM385-2.5-N

LM285-2.5-N Units

Parameter Conditions Typ (Limit)

LM285BX-2.5-N LM385BY-2.5-N

LM285BY-2.5-N

Tested Limit(1)(2) Design Tested Design Tested Design

Limit(3) Limit(1) Limit(3) Limit(1) Limit(3)

Reverse Breakdown TA= 25°C, 2.5 2.462 2.462 2.425 V(Min)

Voltage 20 μA≤IR≤20 mA 2.538 2.538 2.575 V(Max)

Minimum Operating 13 20 30 20 30 20 30 μA

Current (Max)

LM385M3-2.5-N 15 20

Reverse Breakdown 20 μA≤IR≤1 mA 1 1.5 2.0 2.5 2.0 2.5 mV

Voltage Change (Max)

with Current 1 mA ≤IR≤20 mA 10 20 20 25 20 25 mV

(Max)

Reverse Dynamic IR= 100 μA, 1 Ω

Impedance f = 20 Hz

Wideband Noise IR= 100 μA, 120 μV

(rms) 10 Hz ≤f≤10 kHz

Long Term Stability IR= 100 μA,

T = 1000 Hr, 20 ppm

TA= 25°C ±0.1°C

Average IR= 100 μA

Temperature X Suffix 30 30 ppm/°C

Coefficient(4) Y Suffix 50 50 ppm/°C

All Others 150 150 150 ppm/°C

(Max)

(1) Specified and 100% production tested.

(2) A military RETS electrical specification available on request.

(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.

(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between

the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

TYPICAL PERFORMANCE CHARACTERISTICS

Reverse Characteristics Reverse Characteristics

Figure 6. Figure 7.

Forward Characteristics Temperature Drift

Figure 8. Figure 9.

Reverse Dynamic Reverse Dynamic

Impedance Impedance

Figure 10. Figure 11.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Noise Voltage Filtered Output Noise

Figure 12. Figure 13.

Response Time

Figure 14.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

APPLICATIONS

Figure 15. Wide Input Range Reference Figure 16. Micropower Reference from 9V Battery

LM385-2.5-N Applications

IQ≃30 μA standby current

IQ≃40 μAFigure 17. Micropower 5V Reference Figure 18. Micropower 10V Reference

PRECISION 1 μA to 1 mA CURRENT SOURCES

Figure 19.

METER THERMOMETERS

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

Calibration

Calibration 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 μA/°K

1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1μA/°K. 2. Remove short, adjust R2 for correct reading in °F

2. Remove short, adjust R2 for correct reading in centigrade

Figure 20. 0°C–100°C Thermomemter Figure 21. 0°F–50°F Thermomemter

Adjustment Procedure

1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck

coefficient.

2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.

Figure 22. Micropower Thermocouple Cold Junction Compensator

Thermocouple Type(1) Seebeck R1 R2 Voltage Across R1 Voltage Across R2

Coefficient (Ω) (Ω) @25°C (mV)

(μV/°C) (mV)

J 52.3 523 1.24k 15.60 14.32

T 42.8 432 1k 12.77 11.78

K 40.8 412 953Ω12.17 11.17

S 6.4 63.4 150Ω1.908 1.766

(1) Typical supply current 50 μA

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

Figure 23. Improving Regulation of Adjstable Regulators

Schematic Diagram

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

REVISION HISTORY

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ............................................................................................................ 9

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM185BXH-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185BXH2.5

LM185BXH-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS

& no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BXH2.5

LM185BYH-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185BYH2.5

LM185BYH-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS

& no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BYH2.5

LM285BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX

M2.5

LM285BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX

M2.5

LM285BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 285BX

Z2.5

LM285BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY

M2.5

LM285BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY

M2.5

LM285BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 285BY

Z2.5

LM285M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285

M2.5

LM285MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285

M2.5

LM285Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM LM285

Z-2.5

LM285Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM285

Z-2.5

LM385BM-2.5 ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385

BM2.5

LM385BM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

BM2.5

LM385BMX-2.5 ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385

BM2.5

PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM385BMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

BM2.5

LM385BXM-2.5 ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 385BX

M2.5

LM385BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX

M2.5

LM385BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX

M2.5

LM385BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 385BX

Z-2.5

LM385BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY

M2.5

LM385BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY

M2.5

LM385BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 385BY

Z-2.5

LM385BZ-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM LM385

BZ2.5

LM385BZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 LM385

BZ2.5

LM385M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

M2.5

LM385M3-2.5 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R12

LM385M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R12

LM385M3X-2.5 ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 R12

LM385M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R12

LM385MX-2.5 ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385

M2.5

LM385MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

M2.5

LM385Z-2.5/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM LM385

Z2.5

PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM385Z-2.5/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM LM385

Z2.5

LM385Z-2.5/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM LM385

Z2.5

LM385Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM LM385

Z2.5

LM385Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SNCU Level-1-NA-UNLIM 0 to 70 LM385

Z2.5

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

Addendum-Page 4

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM285BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BMX-2.5 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385M3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3X-2.5 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385MX-2.5 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM285BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BMX-2.5 SOIC D 8 2500 367.0 367.0 35.0

LM385BMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385M3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3X-2.5 SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM385MX-2.5 SOIC D 8 2500 367.0 367.0 35.0

LM385MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

Pack Materials-Page 2

MECHANICAL DATA

NDU0002A

www.ti.com

H02A (Rev F)

IMPORTANT NOTICE

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