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Document No.: 63060
Revision: 25-Jul-2016
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512) (Z Foil)
Ultra High Precision Foil Wraparound Surface Mount Chip Resistor
Ultra High Precision Foil Wraparound Surface Mount Chip Resistor
with TCR of ±0.05 ppm/°C and Power Coefficient of 5 ppm at
Rated Power and Load Life Stability of ±0.005% (50 ppm)
FEATURES
• Temperature coefficient of resistance (TCR):
0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Resistance tolerance: to ±0.01%
• Power coefficient “∆R due to self heating”:
5 ppm at rated power
• Power rating: to 750 mW at +70°C (see table 3)
• Load life stability: to ±0.005% at 70°C, 2000 h
at rated power
• Resistance range: 5 Ω to 125 kΩ (for lower or higher
values, please contact us)
• Bulk Metal Foil resistors are not restricted to standard
values, we can supply specific “as required” values at
no extra cost or delivery (e.g. 1K2345 vs. 1K)
• Thermal stabilization time <1 s (nominal value achieved
within 10 ppm of steady state value)
• Electrostatic discharge (ESD) at least to 25 kV
• Short time overload: ≤0.005%
• Non inductive, non capacitive design
• Rise time: 1 ns effectively no ringing
• Current noise: 0.010 μVRMS/V of applied voltage
(<–40 dB)
• Voltage coefficient <0.1 ppm/V
(resistance values above 10 kΩ)
• Non inductive: <0.08 μH
• Non hot spot design
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Matched sets are available on request
• Screening in accordance with EEE-INST-002 and
MIL-PRF-55342 available (see datasheet resistor
models 303133 to 303138)
• Quick prototype quantities available, please contact
foil@vpgsensors.com
Document No.: 63060
Revision: 25-Jul-2016
Figure 1—Power Derating Curve
100
75
50
25
0
- 75 - 50 - 25 0+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Percent of Rated Power
+ 70 °C
- 55 °C
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512)
(Z Foil)
INTRODUCTION
VSMP Series is the industry’s first device to provide high
rated power and excellent load life stability along with
extremely low TCR – all in one resistor.
One of the most important parameters influencing stability
is the Temperature Coefficient of Resistance (TCR).
Although the TCR of Bulk Metal® Foil is considered
extremely low, this characteristic has been further
refined over the years. The VSMP Series utilizes ultra
high precision Z Foil. The Z Foil technology provides a
significant reduction of the resistive element’s sensitivity
to ambient temperature variations (TCR) and to self
heating when power is applied (Power Coefficient of
Resistance, or PCR). Along with the inherently low PCR
and TCR, Z Foil technology also provides remarkably
improved load life stability, low noise and tight tolerances.
Vishay Foil Resistors’ (VFR) application engineering
department is available to advise and make
recommendations. For non-standard technical
requirements and special applications, please contact
us using the e-mail address in the footer below.
* This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant.
For example, parts with lead (Pb) terminations are not RoHS compliant. Please see the information/tables in this datasheet for details.
Table 1—Tolerance and TCR vs. Resistance
Value(1) (–55°C to +125°C, +25°C Ref.)
Resistance value Tolerance Typical TCR and
max. Spread
250 Ω to 125 kΩ ±0.01% ±0.2 ±1.8 ppm/°C
100 Ω to <250 Ω ±0.02% ±0.2 ±1.8 ppm/°C
50 Ω to <100 Ω ±0.05% ±0.2 ±2.8 ppm/°C
25 Ω to <50 Ω ±0.1% ±0.2 ±3.8 ppm/°C
10 Ω to <25 Ω ±0.25% ±0.2 ±3.8 ppm/°C
5 Ω to <10 Ω ±0.5% ±0.2 ±7.8 ppm/°C
Top View
(for date code print specification please refer to table 2)
(1) For tighter performances and non-standard values lower than
5 Ω and above 125 kΩ, please contact application engineering
using the e-mail addresses in the footer below
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VSMP Series (0603, 0805, 1206, 1506, 2010, 2512) (Z Foil)
For any questions, contact
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Document No.: 63060
Revision: 25-Jul-2016
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512)
(Z Foil)
Figure 2—Trimming to Values
(Conceptual Illustration)
Mutual
inductance
reduction
due to change
in current
direction
Current path
before trimming
Foil shown in black, etched spaces in white
Interloop
capacitance
reduction
in series
Trimming process
removes this material
from shorting strip area
changing current path
and increasing
resistance
Current path after trimming
Note
To acquire a precision resistance value, the Bulk Metal
®
Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked
areas are cut, producing progressively smaller increases in
resistance. This method reduces the effect of “hot spots” and
improves the long-term stability of Bulk Metal Foil resistors.
Figure 3—Typical Resistance /
Temperature Curve
+500
+200
+100
0
–100
–200
–300
–500
∆R
R
(ppm) 0.05 ppm/°C
–0.1 ppm/°C0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C –0.16 ppm/°C
–400
+300
+400
Ambient Temperature (°C)
TCR Values for Different Temperature Ranges
–25+250+60 +75+100+125–55
Note
The TCR values for <100 Ω are influenced by the termination
composition and result in deviation from this curve
Table 2—Dimensions and Land Pattern in Inches (Millimeters)
Top View
D
TW
LDate Code2
(Year/Week)
Recommended Land Pattern
Footprint
Z
G
X
Chip Size L
±0.005 (0.13)
W
±0.005 (0.13)
Thickness
Maximum
D
±0.005 (0.13) Z(1) G(1) X(1)
0603 0.063 (1.60) 0.032 (0.81) 0.025 (0.64) 0.011 (0.28) 0.102 (2.59) 0.031 (0.78) 0.031 (0.78)
0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.122 (3.10) 0.028 (0.71) 0.050 (1.27)
1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.175 (4.45) 0.059 (1.50) 0.071 (1.80)
1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.19 9 (5.05) 0.0 83 (2.11) 0.071 (1.80)
2010 0.198 (5.0 3) 0.097 (2.46) 0.025 (0.64) 0.025 (0.64) 0.247 (6.27) 0.115 (2.92) 0.103 (2.62)
2512 0.249 (6.32) 0.127 (3.23) 0.025 (0.64) 0.032 (0.81) 0 . 291 ( 7. 3 9 ) 0.150 (3.81) 0.127 (3.23)
(1) Land Pattern Dimensions are per IPC-7351A
(2) The date code printing applies to all resistor sizes except for 0603
Table 3—Specifications
Chip
Size(1)
Rated
Power at
+70°C
Max. Working
Voltage
(≤√P × R)
Resistance
Range(2)
Maximum
Weight
0603 100 mW 20 V 100 Ω to 5 kΩ 3 mg
0805 200 mW 40 V 5 Ω to 8 kΩ 6 mg
1206 300 mW 87 V 5 Ω to 25 kΩ 11 mg
1506 300 mW 95 V 5 Ω to 30 kΩ 12 mg
2010 500 mW 187 V 5 Ω to 70 kΩ 27 mg
2512 750 mW 220 V 5 Ω to 125 kΩ 40 mg
(1) For size 2018, please contact us using the e-mail address in
the footer below.
(2) For non-standard values please contact application engineering
Table 4—Load Life Stability (+70°C for 2000 h)
Chip Size ∆R Limits
0603 ±0.005% at 50 mW
±0.01% at 100 mW
0805 ±0.005% at 100 mW
±0.01% at 200 mW
1206, 1506 ±0.005% at 150 mW
±0.01% at 300 mW
2010 ±0.005% at 200 mW
±0.01% at 500 mW
2512 ±0.005% at 500 mW
±0.01% at 750 mW
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Document No.: 63060
Revision: 25-Jul-2016
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512)
(Z Foil)
Table 5—Performances
Test or Conditions MIL-PRF-55342
Characteristic E ∆R Limits Typical ∆R Limits Performance
∆R Limits(1)
Thermal Shock, 100 × (–65°C to +150°C) ±0.1% ±0.005% (50 ppm) ±0.01% (100 ppm)
Low Temperature Operation, –65°C, 45 min at Pnom ±0.1% ±0.005% (50 ppm) ±0.01% (100 ppm)
Short Time Overload, 6.25 × Rated Power, 5 s ±0.1% ±0.005% (50 ppm) ±0.01% (100 ppm)
High Temperature Exposure, +150°C, 100 h ±0.1% ±0.01% (100 ppm) ±0.02% (200 ppm)
Resistance to Soldering Heat ±0.2% ±0.005% (50 ppm) ±0.01% (100 ppm)
Moisture Resistance ±0.2% ±0.005% (50 ppm) ±0.02% (200 ppm)
Load Life Stability +70°C for 2000 h at Rated Power ±0.5% ±0.005% (50 ppm) ±0.01% (100 ppm)
(1) As shown +0.01 Ω to allow for measurement errors at low values
Figure 4—Recommended Mounting
*
1. IR and vapor phase reflow are recommended.
2. Avoid the use of cleaning agents that attack epoxy resins, which form part of the
resistor construction.
3. Vacuum pick up is recommended for handling.
4. If the use of a soldering iron becomes necessary, precautionary measures should be
taken to avoid any possible damage/overheating of the resistor.
* Recommendation: The solder fillet profile should be such as to avoid running over the
top metallization.
Figure 5—VSMP0603 100 Cycle Thermal
Shock –65°C to 150°C, 10 Units Each Value
100
∆R/R (ppm)
80
60
40
20
0
- 20
- 40
VSMP0603
100R
VSMP0603
5K
VSMP0603
1K
Figure 6—Load Life Test for
10,000 hrs @0.3 W, +70°C; Vsmp 1206, N=40
-500
-400
-300
-200
-100
0
100
200
300
400
500
0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
R
(ppm)
Time (hrs)
10R
1K
12K
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VSMP Series (0603, 0805, 1206, 1506, 2010, 2512) (Z Foil)
For any questions, contact
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Document No.: 63060
Revision: 25-Jul-2016
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512)
(Z Foil)
PULSE TEST
Test Description
All parts are baked at +125°C for 1 hour and allowed
to cool at room temperature for 1 hour, prior to testing.
By using an electrolytic 0.01 μF capacitor charged to
1200VDC, a single pulse was performed on 30 units of
1206, 10 kΩ of Surface Mount Bulk Metal® Foil resistor and
Thin Film resistor. The units were allowed time to cool down,
after which the resistance measurements were taken and
displayed in ppm deviation from the initial reading.
Test Results
Figure 7—Pulse Test Description
Pulse Test
Test Description
All parts baked at +125ْC for 1 hr and allowed to cool at room temperature for 1 hr, prior to
testing. By using an electrolytic 0.01μF capacitor charged to 1000 VDC, a single pulse was
performed on 20 units of 1206: 100 , 1K and 10K of Surface Mount Vishay Foil Resistor andΩΩ Ω
Thin Film Resistor. The unit was allowed time to cool down, after which the resistance
measurement was taken and displayed in ppm deviation from the initial reading.
Test Results
Value Voltage τ= RC Average Deviation (%)
Foil Thin Film
100R
1000VDC
1μsec
<0.001
Open
1K 10 μsec >35
10K 100 μsec >0.008
Rx
1200
VDC
0.01µF
Figure 8—Pulse Test Results at 1200 VDC*
-20000
0
20000
40000
60000
80000
100000
120000
140000
0510 15 20 25 30
∆R (ppm)
Resistor #
Size: 1206
Value: 10K
n = 30
Thin Film
Bulk Metal® Foil
Note: Average of 30 units yielded deviation of 30,723 ppm of the Thin Film vs. –14 ppm for the Bulk Metal® Foil
* Note Average of 30 units yielded deviation of 30,723 ppm of
the Thin Film vs. –14 ppm for the Bulk Metal® Foil
ELECTROSTATIC DISCHARGE (ESD)
ESD can be categorized into three types of damages:
Parametric Failure – occurs when the ESD event alters
one or more device parameters (resistance in the case of
resistors), causing it to shift from its required tolerance.
This failure does not directly pertain to functionality; thus
a parametric failure may be present while the device is
still functional.
Catastrophic Damage – occurs when the ESD event
causes the device to immediately stop functioning. This
may occur after one or a number of ESD events with
diverse causes, such as human body discharge or the
mere presence of an electrostatic field.
Latent Damage – occurs when the ESD event causes
moderate damage to the device, which is not noticeable,
as the device appears to be functioning correctly.
However, the load life of the device has been dramatically
reduced, and further degradation caused by operating
stresses may cause the device to fail during service.
Latent damage is the source for greatest concern, since it
is very difficult to detect by re-measurement or by visual
inspection, because damage may have occurred under
the external coating.
Test Description
By using an electrolytic 500 pF capacitor charged up to
4500 V, pulses were performed on 10 units of 1206,
10 kΩ of three different Surface Mount Chip Resistors
technologies, with an initial voltage spike of 2500 V (Figure
10). The units were allowed time to cool down, after which
the resistance measurements were taken and displayed
in ppm deviation from the initial readings. Readings were
then taken in 500 V increments up to 4500 V.
Figure 9—ESD Test Description
2500 V to 4500 V
Rx
500 pF
DMM
1 MΩ
Table 6—ESD Test Results
(Average of 10 Units)
∆R
Thick Film Thin Film Bulk Metal Foil
2500 V –2.7% 97% <0.005%
3000 V –4.2% 366% <0.005%
3500 V –6.2% Open <0.005%
4000 V –7. 4% Open <0.005%
4500 V –8.6% Open <0.005%
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Document No.: 63060
Revision: 25-Jul-2016
VSMP Series (0603, 0805, 1206, 1506, 2010, 2512)
(Z Foil)
Table 7—Global Part Number Information(1)
NEW GLOBAL PART NUMBER: Y162612K7560T9R (preferred part number format)
DENOTES PRECISION VALUE CHARACTERISTICS
Y R = Ω
K = kΩ
0 = standard
9 = lead (Pb)-free
1 to 999 = custom
PRODUCT CODE RESISTANCE TOLERANCE PACKAGING
1636 = VSMP0603
1624 = VSMP0805
1625 = VSMP1206
1626 = VSMP1506
1627 = VSMP2010
1637 = VSMP2018(2)
1628 = VSMP2512
T= ±0.01%
Q= ±0.02%
A= ±0.05%
B= ± 0.10 %
C= ±0.25%
D= ±0.5%
F= ±1.0%
R= tape and reel
W= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1626 12K7560 T 9 R:
TYPE: VSMP1506
VALUES: 12.7560 kΩ
ABSOLUTE TOLERANCE: 0.01%
TERMINATION: lead (Pb)-free
PACKAGING: tape and reel
HISTORICAL PART NUMBER: VSMP1506 12K756 TCR0.2 T S T (will continue to be used)
VSMP1506 12K756 TCR0.2 T S T
MODELRESISTANCE
VALUE
TCR
CHARACTERISTICSTOLERANCE TERMINATION PACKAGING
VSMP0603
VSMP0805
VSMP1206
VSMP1506
VSMP2010
VSMP2018(2)
VSMP2512
12.756 kΩT= ±0.01%
Q= ±0.02%
A= ±0.05%
B= ± 0.10 %
C= ±0.25%
D= ±0.5%
F= ±1.0%
S= lead (Pb)-free
B= tin/lead
T= tape and reel
W= waffle pack
6261 K 7 52Y 1 T 96 R0
(1) For non-standard requests, please contact application engineering.
(2) For size 2018, please contact us
PRECISION CENTER
Precision centers are located around the world to provide in any ohmic value (no MOQ) local, short run, quick delivery of
Bulk Metal® Foil resistors.
Since Bulk Metal Foil is not restricted to standard values and each resistor is trimmed to the precise value ordered, the
unique chain of Precision Centers brings these precise values as close as possible to the circuit designers in the shortest
time possible.
For your local Precision Center please click here.
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Document No.: 63999
Revision: 15-Jul-2014
Disclaimer
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