
Bel Fuse Inc.
206 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: belfuse@belfuse.com
Website: www.belfuse.com
Specifications subject to change without notice
Electrical Characteristics (23
0
C)
RoHS6 Compliant
1. Recommended reflow methods; IR , vapor
phase oven, hot air oven.
2. The 0ZCD Series is suitable for wave solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices are compatible with standard industry cleaning solvents and methods.
Caution
If reflow temperature/dwell times exceed the recommended Profile, the electrical performance of the PTC
may be affected.
Rework
Use standard industry practices.
Surface Mount PTC
0ZCD Series
0ZCD1006D may200#A44
Application
All high-density boards
Product Features
2920 Chip Size, Fast Trip Time, High Hold
Currents
Operating (Hold Current) Range
300mA ~ 2.5A
Maximum Voltage
16 ~ 60V (per table)
Temperature Range
-40°C to 85°C
Agency Approval
UL Component (E305051)
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A 0300DCZ0 03.0 6.0 5.1 0.3 01 06 5.1 000.1 000.2 008.4
B 0500DCZ0 05.0 0.1 5.2 0.4 01 06 5.1 003.0 007.0 004.1
C 5700DCZ0 57.0 5.1 0.8 3.0 04 33 5.1 081.0 013.0 000.1
D 0110DCZ0 01.1 2.2 0.8 5.0 04 33 5.1 090.0 071.0 014.0
E 5210DCZ0 52.1 5.2 0.8 0.2 04 33 5.1 050.0 131.0 052.0
F 0510DCZ0 05.1 0.3 0.8 0.2 04 33 5.1 050.0 801.0 032.0
G 5810DCZ0 58.1 7.3 0.8 5.2 04 33 5.1 040.0 670.0 051.0
H 0020DCZ0 00.2 0.4 0.8 5.4 04 61 5.1 530.0 560.0 021.0
I 0520DCZ0 05.2 0.5 0.8 0.61 04 61 5.1 520.0 140.0 580.0
IHHold current-maximum current at which the device will not trip in still air at 23°C.
ITTrip current-minimum current at which the device will always trip in still air at 23°C.
Imax Maximum fault current device can withstand without damage at rated voltage (Vmax).
Vmax Maximum voltage device can withstand without damage at its rated current.
PdTypical power dissipated from device when in the tripped state in 23°C still air environment.
Rmin Minimum device resistance at 23°C.
Rmax Maximum device resistance at 23°C.
R1max Maximum device resistance at 23°C, 1 hour after initial device trip.
Termination pad materials
Tin-plated copper
Termination pad characteristics
* Due to “lead free/RoHS6” construction of these PTC
devices, the required Temperature and Dwell Time
in the “Soldering” zone of the reflow profile are
greater than those used for non-RoHS devices.
Solder Reflow
AlanimoN BlanimoN ClanimoN
mm hcni mm hcni mm hcni
01.5 8002.0 03.2 6090.0 06.5 5022.0
The dimensions in the table below provide the recommended pad layout for
each 0ZCD device
B B
A
C
Pad Layout, Solder Reflow and Rework Recommendations
Preheating Soldering Cooling
300
50 - 90 sec 30 - 50 sec120 sec
250
200
150
100
50
0
Temperature (
o
C)
All dimensions
in mm
Product Dimensions
B
TOP VIEW
D
A
Marking
SIDE VIEW
C
traP
rebmuN
ABCD
niMxaMniMxaMniMxaMniM
0300DCZ037.689.78.444.56.051.153.0
0500DCZ037.689.78.444.56.051.153.0
5700DCZ037.689.78.444.56.051.153.0
0110DCZ037.689.78.444.54.00.153.0
5210DCZ037.689.78.444.54.09.053.0
0510DCZ037.689.78.444.54.09.053.0
5810DCZ037.689.78.444.53.09.053.0
0020DCZ037.689.78.444.53.09.053.0
0520DCZ037.689.78.444.53.09.053.0
Standard Package
2,000 fuses in 7 inches dia. reel, 8mm wide
tape, 4mm pitch, per EIA-481 (equivalent
IEC-286 part 3). P/N code - 2C.
“bel” or “b”, IH code.
PTC Marking
2920 Chip