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Choose the Ampro by ADLINK™ COM 840 for …
Modular, ultra high performance applications that require
high end graphics.
Description
The Ampro by ADLINK™ COM 840 is an ultra high
performance module featuring the Intel® Core™2 Duo
processor with Gigabit Ethernet and high end chipset
graphics or PCI Express x16 graphics on the baseboard.
Specifications
Core System
Choice of
- 1.6GHz Core™2 Duo L7500
- 1.06GHz ULV Core™2 Duo U7500
Cache – 4MB, 1MB Level 2
DRAM – Up to 4GB DDR2 667 SODIMM
Chipset – Intel® GME965/ICH8-M
FSB – 800MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Watchdog Timer
Bus Interface
PCIe x16, 5 PCIe x1 PCI and LPC
I/O
PATA – Single Ultra DMA 66/100 IDE interface, supports up to two hard drives
SATA 3 Gb/s – 2 ports
USB – 8 USB 2.0 ports
Audio – High Denition Audio
GPIO - Eight general-purpose digital I/O pins
Network Interface
Ethernet - One Intel® 82566 Gigabit port
Video Interface
Intel® GMA X3100, 384MB (DVMT 4.0)
3D and 2D engine, HW rotation
Intel® Clear Video Technology: MPEG-2 HW acceleration and decoding
WMV9 HW acceleration, sharpness enhancement, lm mode detection
Dual panel display with independent pipes, HDTV support, supports PCIe x16 and
SDVO graphics
CRT resolution up to 2048 x 1536 @ 60Hz
Software & Development Tools
OS Support – Linux®, Windows® CE 6.0/5.0/XP/XPe, VxWorks® 6.6
BIOS – AMI with ACPI 2.0 including S3
Mechanical and Environmental
Size – 125 x 95 mm (4.9 x 3.7”); COM ExpressTM Basic form factor, Type 2 pinout
Power Requirements (with 2GB RAM, 100% loading)
-1.6GHz 1.8A @ 12V
-1.06GHz 0.8A @ 12V
Temperature (with adequate thermal solution and air ow)
• Standard: –20°C to +70°C
• Extended: –40°C to +85°C
• Storage: –55°C to +85°C
Board Thickness – .093” (2.36 mm)
Ordering Information
COM Express™ Module with Intel® Core™2 Duo
Processor and GME965/ICH8-M Chipset
COM 840
Features
Up to 4GB DDR2 memory
True PICMG COM ExpressTM COM.0 compliance
PCI Express, SATA 3 Gb/s
ACPI 2.0 with S3 support
PCI Express x16 graphics (on baseboard)
50% thicker PCB
Model Number Description/Configuration
COM-840-R-32 COM 840, 1.6GHz Core™2 Duo CPU, 4MB L2 Cache, PCI
Express, PCI, LPC
COM-840-R-12 COM 840, 1.06GHz ULV Core™2 Duo CPU, 4MB L2
Cache, PCI Express, PCI, LPC, 2 SODIMM sockets
COM-840-R-11 COM 840, 1.06GHz ULV Core™2 Duo CPU, 4MB L2
Cache, PCI Express, PCI, LPC, 1 SODIMM socket
COM-840-L-32 1.6GHz QuickStart Kit (R-32 Module, 2GB RAM, software,
documentation, COM Express Baseboard, heatsink w/ fan)
COM-840E-L-32 1.6GHz QuickStart Kit (R-32 Module, 2GB RAM, software,
documentation, EBX Baseboard, heatsink w/ fan)
COM-840E-L-12 1.06GHz QuickStart Kit (R-12 Module, 2GB RAM, software,
documentation, EBX Baseboard, heatsink w/ fan)
