Type 2
http://www.adlinktech.com/Computer-on-Module
Express-CB/CBE
Specifications
Core System
CPU
Intel® Core™ i7-610E Processor (4M Cache, 2.53 GHz) 35 W
Intel® Core™ i5-520E Processor (3M Cache, 2.40 GHz) 35 W
Intel® Core™ i7-620LE Processor (4M Cache, 2.00 GHz) 25 W
Intel® Core™ i7-620UE Processor (4M Cache, 1.06 GHz) 18 W
Intel® Core™ i3-330E Processor (3M Cache, 2.13 GHz) 35W
Intel® Celeron® Processor P4505 (2M Cache, 1.86 GHz) 35 W
Intel® Celeron® Processor U3405 (2M Cache, 1.06GHz) 18W
Memory Dual channel 800/1066 MHz DDR3 memory up to 8 GB in
dual stacked SODIMM socket; ECC memory for CBE series
only
Chipset Mobile Intel® QM57 Express Chipset
L2 Cache 2 MB (Celeron® M), 4/3 MB (Intel® Core™ i7 / i5)
BIOS AMI EFI with CMOS backup in 16 Mbit SPI ash
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses PCI Express x16 bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or
Embedded Display Port (eDP)
7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is
occupied by GbE; can be optionally congured as 1 PCIe x4
(on 0/1/2/3) and 2 PCIe x1 (4/5)
32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters
LPC bus, SMBus (system) , I2C (user)
Video
Integrated in Gen 5.75 with 12 execution units
Processor
Integrated Video DirectX 10 and OpenGL 2.1
Feature Support Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
Video capture via x1 concurrent PCI Express port
PAVP (Protected Audio-Video Path) support for Protected
Intel HD Audio Playback
High performance MPEG-2 decoding
WMV9 (VC-1) and H.264 (AVC) support
Hardware acceleration for MPEG2 VLD/iDCT
Microsoft DirectX 10 support
OpenGL 2.1 support
Blu-ray support @ 40 Mb/s
Hardware motion compensation
Intermediate Z in classic rendering
VGA Analog VGA support by 300 MHz DAC
Analog monitor support up to QXGA ( 2048 X 1536)
LVDS Single / Dual channel 18/24-bit panels
Audio
Chipset Integrated in Intel® PCH QM57
Audio Codec On Express-BASE carrier (ALC886)
Ethernet
Chipset Integrated in Mobile QM57 with 82577LM PHY
Interface 10/100/1000 Mbps Ethernet
I/O Interfaces
Chipset Integrated on Intel® PCH QM57
USB Supports up to eight ports USB v. 2.0
SATA Four ports SATA 3 Gb/s with optional support for RAID
0,1,5,10
PATA SATA to PATA bridge on SATA channel 1, Master only
Super I/O
Connected to LPC bus on carrier if needed
TPM (optional)
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power
Input Power
AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 21 W with Core™ i7-620UE at 1.2 GHz and 2 GB memory
typical
Smart Battery Support Yes
Mechanical and Environmental
Dimension Basic size: 125 mm x 95 mm
Operating Temperature Standard: 0°C to +60°C
Storage Temperature -20°C to +80°C
Humidity 90% at +60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility
COM Express
®
Type 2, Basic form factor 125 mm x 95 mm
Certication CE, FCC
Operating Systems
Standard Support Windows XP(e), Vista, Windows 7, Linux
Extended Support (BSP) Embedded XP support package, Linux 2.6.x BSP, VxWorks
6.x BSP, AIDI Library for Windows and Linux
COM Express® Basic Size Type 2 Module with
Intel® Core i7/i5/i3 Processor
Features
Intel® Core™ i7/i5/i3 Processor with Mobile
Intel® QM57 Express Chipset
Up to 8 GB Dual Channel DDR3 SDRAM at
1066 MHz (optional ECC)
Six PCIe x1, one PCIe x16 for graphics
(or general purpose x8/4/1)
18/24-bit LVDS and Embedded DisplayPort
SATA 3 Gb/s IDE (PATA), Gigabit Ethernet,
USB 2.0