DS1344D-33+T&R - Maxim - Datasheet.Live

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

_______________________________________________________________ Maxim Integrated Products 1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,

or visit Maxim’s website at www.maxim-ic.com.

19-5801; Rev 1; 12/11

General Description

The DS1343/DS1344 low-current real-time clocks (RTCs)

are timekeeping devices that provide an extremely low

standby current, permitting longer life from a backup

supply source. The devices also support high-ESR

crystals, broadening the pool of usable crystals for the

devices. The clock/calendar provides seconds, minutes,

hours, day, date, month, and year information. The date

at the end of the month is automatically adjusted for

months with fewer than 31 days, including corrections

for leap year. The clock operates in either 24-hour or

12-hour format with an AM/PM indicator.

Address and data are transferred serially through an

SPI or 3-wire interface. Two programmable time-of-day

alarms are provided. Each alarm can generate an inter-

rupt on a combination of seconds, minutes, hours, and

day. Don’t-care states can be inserted into one or more

fields if it is desired for them to be ignored for the alarm

condition. The time-of-day alarms can be programmed

to assert two different interrupt outputs, or they can be

combined to assert one common interrupt output. Both

interrupt outputs operate when the device is powered by

either VCC or VBAT.

The devices are available in a lead-free/RoHS-compliant,

20-pin TSSOP or 14-pin TDFN package, and support a

-40°C to +85°C extended industrial temperature range.

Applications

Medical

Handheld Devices

Telematics

Embedded Timestamping

Features

S Low Timekeeping Current of 250nA (typ)

S Compatible with Crystal ESR Up to 100kI

S Versions Available to Support Either 6pF or

12.5pF Crystals

S RTC Counts Seconds, Minutes, Hours, Day, Date,

Month, and Year with Leap Year Compensation

Valid Through 2099

S Power-Fail and Switch Circuitry

S Three Operating Voltages

1.8V ±5%

3.0V±10%

3.3V ±10%

S Trickle-Charge Capability

S Maintain Time Down to 1.15V (typ)

S Support Motorola SPI Modes 1 and 3, or Standard

3-Wire Interface

S Burst Mode for Reading/Writing Successive

Addresses in Clock/RAM

S 96-Byte Battery-Backed NV RAM for Data Storage

S Two Time-of-Day Alarms with Two Interrupt

Outputs

S Industrial Temperature Range

S 20-Pin TSSOP or 14-Pin TDFN Package

S Underwriters Laboratories (UL) Recognized

Ordering Information appears at end of data sheet.

Typical Operating Circuit

DS1343

DS1344

INT0

INT1

SCLK

SDI

SDO

VBAT

GNDSERMODE

VCC

INT

RST

3-WIRE

PORT

μP

NOTE: SHOWN IN 3-WIRE I/O CONFIGURATION.

RPU

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Voltage Range on VCC or VBAT

Relative to Ground ............................................-0.3V to +6.0V

Voltage Range on Any Nonpower Pin

Relative to Ground ................................ -0.3V to (VCC + 0.3V)

Operating Temperature Range .......................... -40NC to +85NC

Junction Temperature Maximum .....................................+150NC

Storage Temperature Range ............................ -55NC to +125NC

Lead Temperature (soldering, 10s) ................................+260NC

Soldering Temperature (reflow) ......................................+260NC

RECOMMENDED OPERATING CONDITIONS

(TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

DC ELECTRICAL CHARACTERISTICS

(VCC = VCC(MIN) to +5.5V, VBAT = +1.3V to +5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TSSOP

Junction-to-Ambient Thermal Resistance (BJA) ..........91NC/W

Junction-to-Case Thermal Resistance (BJC) ...............20NC/W

TDFN

Junction-to-Ambient Thermal Resistance (BJA) ..........54NC/W

Junction-to-Case Thermal Resistance (BJC) .................8NC/W

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Operating Voltage Range VCC

DS134_-18 1.71 1.8 5.5

VDS134_-3 2.7 3.0 5.5

DS134_-33 3.0 3.3 5.5

Minimum Timekeeping Voltage VBATTMIN TA = +25NC1.15 1.3 V

Backup Voltage VBAT 1.3 5.5 V

Logic 1 Input VIH 0.7 x

VCC

VCC +

0.3 V

Logic 0 Input VIL -0.3 0.3 x

VCC V

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Power-Supply Active Current ICCA -3 or -33: fSCLK = 4MHz (Note 4) 600 FA

Power-Supply Standby Current

(Note 5) ICCS -33: VCC = 3.63V 120 FA

VCC = VCC(MAX) 160

Backup Leakage Current IBATLKG VCC > VPF -100 +25 +100 nA

Backup Current (Oscillator Off) IBAT TA = +25NC, VCC = 0V, EOSC = 1 100 nA

Backup Current

(Note 6)

DS1343

IBAT1

VBAT = 3V 250

VBAT = VBAT(MAX) 500

DS1344 VBAT = 3V 350

VBAT = VBAT(MAX) 600

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

DC ELECTRICAL CHARACTERISTICS (continued)

(VCC = VCC(MIN) to +5.5V, VBAT = +1.3V to +5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)

AC ELECTRICAL CHARACTERISTICS

(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Backup Current

(Note 7)

DS1343

IBAT2

VBAT = 3V 300

VBAT = VBAT(MAX) 600

DS1344 VBAT = 3V 400

VBAT = VBAT(MAX) 700

Input Leakage (CE, SERMODE,

SCLK, SDI) IIVIN = 0V to VCC -0.1 +0.1 FA

Output Leakage

(INT0, INT1, PF, SDO) IOCE = VIL, no alarms -0.1 +0.1 FA

Output Logic 1 (PF, SDO) IOH -3 or -33: VOH = 2.4V -1 mA

Output Logic 0, VOL = 0.4V

(INT0, INT1, PF, SDO) IOL VCC R VCC(MIN) 3.0 mA

VBAT R 1.3V R VCC + 0.2V (Note 8) 250 FA

Power-Fail Trip Point VPF

-18 1.51 1.6 1.71

V-3 2.45 2.6 2.70

-33 2.70 2.88 3.0

Switchover Voltage VSW VBAT > VPF VPF V

VBAT < VPF VBAT > VCC

Trickle-Charger Resistors

R1 1

R2 2

R3 4

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

SCLK Frequency fSCLK -18 DC 1 MHz

-3 or -33 DC 4

Data to SCLK Setup tDC 30 ns

SCLK to Data Hold tCDH 30 ns

SCLK to Data Delay tCDD -18 160 ns

-3 or -33 80

SCLK Low Time tCL -18 400 ns

-3 or -33 110

SCLK High Time tCH -18 400 ns

-3 or -33 110

SCLK Rise and Fall tR, tF200 ns

CE to SCLK Setup tCC 400 ns

SCLK to CE Hold tCCH 100 ns

CE Inactive Time tCWH -18 500 ns

-3 or -33 400

CE to Output High-Z tCDZ 40 ns

Oscillator Stop Flag (OSF) Delay tOSF (Note 9) 25 100 ms

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

POWER-UP/DOWN CHARACTERISTICS

(TA = -40°C to +85°C, unless otherwise noted.)

CAPACITANCE

(TA = +25°C, unless otherwise noted.)

CRYSTAL PARAMETERS

Note 2: Voltage referenced to ground.

Note 3: Limits at TA = -40°C are guaranteed by design and not production tested.

Note 4: CE = VCC, VSCLK = VCC to GND, IOUT = 0mA, trickle charger disabled.

Note 5: CE = GND, IOUT = 0mA, EOSC = EGFIL = DOSF = 0, trickle charger disabled.

Note 6: VCC = 0V, EGFIL = 0, DOSF = 1.

Note 7: VCC = 0V, EGFIL = 1, DOSF = 0.

Note 8: Applies to INT0 and INT1.

Note 9: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set.

Note 10: Guaranteed by design; not 100% production tested.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Recovery at Power-Up tREC 20 40 ms

VCC Fall Time (VPF to 0V) tVCCF 150 Fs

VCC Rise Time (0V to VPF) tVCCR 0Fs

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Input Capacitance CI(Note 10) 10 pF

Output Capacitance CO(Note 10) 15 pF

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Nominal Frequency fO32.768 kHz

Series Resistance ESR 100 kI

Load Capacitance CLDS1343 6 pF

DS1344 12.5

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

SPI Write Timing

SPI Read Timing

tCC

tCL

tCDH

tDC

tCH

tCCH

tCWH

tCDH

D0D7A0A6

WRITE DATA BYTEWRITE ADDRESS BYTE

*SCLK CAN BE EITHER POLARITY. TIMING SHOWN FOR CPOL = 1.

SERMODE = VCC.

R/W = 1

SCLK*

SDI

tCC

tCL

tCDH

tDC

tCH

tCDD

tCWH

tCDZ

D0D7

A0A6

READ DATA BYTEWRITE ADDRESS BYTE

*SCLK CAN BE EITHER POLARITY. TIMING SHOWN FOR CPOL = 1.

SERMODE = VCC.

SCLK*

SDI

SDO

R/W = 0

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

3-Wire Write Timing

3-Wire Read Timing

tCC tCL

tCDH tCH

tDC

tCCH

tCWH

D0 D7A0 A1

WRITE DATA BYTEWRITE ADDRESS BYTE

*I/O IS SDI AND SDO CONNECTED TOGETHER.

SERMODE = GND.

R/W = 1

SCLK

I/O*

tCC tCL

tCDH tCH

tDC

tCDD tCDZ

tCWH

D0 D7A0 A1

READ DATA BYTEWRITE ADDRESS BYTE

*I/O IS SDI AND SDO CONNECTED TOGETHER.

SERMODE = GND.

R/W = 0

SCLK

I/O*

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Typical Operating Characteristics

(VCC = +3.3V, TA = +25°C, unless otherwise noted.)

DS1343 BATTERY CURRENT2

vs. BATTERY VOLTAGE

DS1343/4 toc04

BATTERY VOLTAGE (V)

BATTERY CURRENT (nA)

5.04.51.5 2.0 2.5 3.53.0 4.0

200

220

240

260

280

300

320

340

180

1.0 5.5

EGFIL = 1

DOSF = 0

IOUT = 0mA

TA = +85°C

TA = +25°C

TA = -40°C

DS1344 BATTERY CURRENT2

vs. BATTERY VOLTAGE

DS1343/4 toc06

BATTERY VOLTAGE (V)

BATTERY CURRENT (nA)

5.04.54.03.53.02.52.01.5

290

340

390

440

240

1.0 5.5

EGFIL = 1, DOSF = 0, IOUT = 0mA

TA = +85°C TA = +25°C

TA = -40°C

DS1343 BATTERY CURRENT1

vs. BATTERY VOLTAGE

DS1343/4 toc03

BATTERY VOLTAGE (V)

BATTERY CURRENT (nA)

4.5 5.04.03.53.02.52.01.5

160

180

200

220

240

260

280

140

1.0 5.5

EGFIL = 0

DOSF = 1

IOUT = 0mA

TA = +85°C

TA = +25°C

TA = -40°C

DS1344 BATTERY CURRENT1

vs. BATTERY VOLTAGE

DS1343/4 toc05

BATTERY VOLTAGE (V)

BATTERY CURRENT (nA)

5.04.53.5 4.02.0 2.5 3.01.5

220

240

260

280

300

320

340

360

380

200

1.0 5.5

EGFIL = 0, DOSF = 1, IOUT = 0mA

TA = +85°C

TA = +25°C

TA = -40°C

POWER-SUPPLY CURRENT

vs. POWER-SUPPLY VOLTAGE

DS1343/4 toc02

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (µA)

5.04.53.5 4.0

100

120

110

130

140

3.0 5.5

CE = VIL

IOUT = 0mA

TA = +85°C

TA = +25°C

TA = -40°C

POWER-SUPPLY CURRENT

vs. POWER-SUPPLY VOLTAGE

DS1343/4 toc01

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (µA)

5.04.54.03.5

100

200

300

400

500

600

3.0 5.5

TA = +25°C

CE = VIH

IOUT = 0mA

fSCLK = 4MHz

fSCLK = 1MHz

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Pin Configurations

Pin Descriptions

TOP VIEW

TSSOP

174 N.C.N.C.

183

192 N.C.

N.C.

201 VCC

VBAT

147 SCLK

156 SDIN.C.

138 N.C.N.C.

129 CE

1110 SERMODEGND

165 SDO

DS1343

DS1344

DS1343

DS1344

INT0

INT1

N.C.

INT1

TDFN

(3mm × 3mm)

TOP VIEW

2 4 5

13 11 10

SERMODE

SDO

SDI

INT0

VCC

VBAT

SCLK

CEGND

PIN NAME FUNCTION

TSSOP TDFN-EP

1 1 VBAT

Battery Input for Standard +3V Lithium Cell or Other Energy Source. UL recognized

to ensure against reverse charging current when used in conjunction with a primary

lithium battery.

2, 4, 6, 8,

13, 17, 19 5 N.C. No Connection. N.C. pins can be connected to GND to reduce noise around the

crystal inputs.

3 2 X1 Connections for Standard 32.768kHz Quartz Crystal (see the Crystal Characteristics

table). The devices can also be driven by an external 32.768kHz oscillator. In this

configuration, the X1 pin is connected to the external oscillator and the X2 pin is left

unconnected.

5 3 X2

7 4 INT0

Active-Low Interrupt 0 Output. INT0 is an active-low output that can be used as

an interrupt output to a processor. INT0 can be programmed to be asserted by

only Alarm 0, or can be programmed to be asserted by either Alarm 0 or Alarm 1.

INT0 remains low as long as the status bit causing the interrupt is present and the

corresponding interrupt enable bit is set. INT0 operates when the component is

pullup resistor.

9 6 INT1

Active-Low Interrupt 1 Output. INT1 is an active-low output that can be used either

as an interrupt output to a processor or a 32kHz square-wave output. INT1 can be

programmed to be asserted by Alarm 1 only. INT1 remains low as long as the status

bit causing the interrupt is present and the corresponding interrupt enable bit is set.

INT1 operates when the component is powered by VCC or VBAT. INT1 is an open-

drain output and requires an external pullup resistor.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Pin Descriptions (continued)

Functional Diagram

DS1343

DS1344

CLOCK, CALENDAR, AND

ALARM REGISTERS

OSCILLATOR AND

COUNTDOWN CHAIN INT0

INPUT

SHIFT

CONTROL

REGISTERS

USER RAM

SERIAL

INTERFACE

INT1

SERMODE

SDO

SDI

SCLK

POWER CONTROL

AND

TRICKLE CHARGER

GND

ON_VCC

1Hz

32.768kHz

VBAT

VCC

PIN NAME FUNCTION

TSSOP TDFN-EP

10 7 GND Ground

11 13 SERMODE Serial-Interface Mode Input. When connected to GND, standard 3-wire

communication is selected. When connected to VCC, SPI communication is selected.

12 8 CE Chip Enable. The chip-enable signal must be asserted high during a read or a write

for either 3-wire or SPI communications.

14 9 SCLK Serial-Clock Input. SCLK is used to synchronize data movement on the serial

interface for either 3-wire or SPI communications.

15 10 SDI

Serial-Data Input. When SPI communication is selected, SDI is the serial-data input

for the SPI bus. When 3-wire communication is selected, this pin must be connected

to SDO (SDI and SDO function as a single I/O pin when connected together).

16 11 SDO

Serial-Data Output. When SPI communication is selected, SDO is the serial-data

output for the SPI bus. When 3-wire communication is selected, this pin must be

connected to SDI (SDI and SDO function as a single I/O pin when connected

together).

18 12 PF Active-Low Power-Fail Output. The PF pin is used to indicate loss of the primary

power supply (VCC). When VCC is less than VPF, the PF pin is driven low.

20 14 VCC Power-Supply Input

— — EP Exposed Pad (TDFN Only). Connect to GND or leave unconnected.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Detailed Description

The DS1343/DS1344 low-current real-time clocks (RTCs)

are timekeeping devices that consume an extremely low

timekeeping current and also support high-ESR crystals,

broadening the pool of usable crystals for the device.

The devices provide a full binary-coded decimal (BCD)

clock calendar that is accessed by a simple serial inter-

face. The clock/calendar provides seconds, minutes,

hours, day, date, month, and year information. The date

at the end of the month is automatically adjusted for

months with fewer than 31 days, including corrections

for leap year through 2099. The clock operates in either

a 24-hour or 12-hour format with an AM/PM indicator. In

addition, 96 bytes of NV RAM are provided for data stor-

age. The devices maintain the time and date, provided

that the oscillator is enabled, as long as at least one sup-

ply is at a valid level.

Both devices provide two programmable time-of-day

alarms. Each alarm can generate an interrupt on a pro-

grammable combination of seconds, minutes, hours, and

day. Don’t-care states can be inserted into one or more

fields if it is desired for them to be ignored for the alarm

condition. The time-of day alarms can be programmed

to assert two different interrupt outputs or to assert one

common interrupt output. Both interrupt outputs operate

when the device is powered by VCC or VBAT.

The devices support a direct interface to SPI serial-data

ports or standard 3-wire interface. A straight-forward

address and data format is implemented in which data

transfers can occur one byte at a time or in multiple-byte

burst mode.

The devices have a built-in temperature-compensated

power-sense circuit that detects power failures and

automatically switches to the backup supply. The VBAT

pin can be configured to provide trickle charging of a

rechargeable voltage source, with selectable charging

resistance and diode-voltage drops.

I/O and Power-Switching Operation

The devices operate as slave devices on a 3-wire or SPI

serial bus. Access is obtained by selecting the part by

the CE pin and clocking data into/out of the part using

the SCLK and SDI/SDO pins. Multiple byte transfers

are supported within one CE high period; see the Serial

Peripheral Interface (SPI) section for more information.

The devices are fully accessible and data can be writ-

ten and read when VCC is greater than VPF. However,

when VCC falls below VPF, the internal clock registers

are blocked from any access, and the device power is

switched from VCC to VBAT.

If VPF is less than the voltage on the backup supply, the

device power is switched from VCC to the backup sup-

ply when VCC drops below VPF. If VPF is greater than the

backup supply, the device power is switched from VCC

to the backup supply when VCC drops below the backup

supply. The registers are maintained from the backup

supply source until VCC is returned to nominal levels.

The Functional Diagram illustrates the main elements.

Freshness Seal Mode

When a battery is first attached to the device, the device

does not immediately provide battery-backup power to

the RTC or internal circuitry. After VCC exceeds VPF,

the devices leave the freshness seal mode and provide

battery-backup power whenever VCC subsequently falls

below VBAT. This mode allows attachment of the battery

during product manufacturing, but no battery capacity is

consumed until after the system has been activated for

the first time. As a result, minimum battery energy is used

during storage and shipping.

Oscillator Circuit

The devices use an external 32.768kHz crystal. The

oscillator circuit does not require any external resistors or

capacitors to operate. The DS1343 includes integrated

capacitive loading for a 6pF CL crystal, and the DS1344

includes integrated capacitive loading for a 12.5pF CL

crystal. See the Crystal Parameters table for the external

crystal parameters. The Functional Diagram shows a

simplified schematic of the oscillator circuit. The startup

time is usually less than one second when using a crystal

with the specified characteristics.

Clock Accuracy

When running from the internal oscillator, the accuracy of

the clock is dependent upon the accuracy of the crystal

and the accuracy of the match between the capacitive

load of the oscillator circuit and the capacitive load for

which the crystal was trimmed. Additional error is added

by crystal frequency drift caused by temperature shifts.

External circuit noise coupled into the oscillator circuit

can result in the clock running fast. Figure 1 shows a

typical PCB layout for isolation of the crystal and oscil-

lator from noise. Refer to Application Note 58: Crystal

Considerations with Dallas Real-Time Clocks for detailed

information.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Table 1 shows the devices’ register map. During a mul-

tibyte RTC access, if the address pointer reaches the

end of the register space (1Fh), it wraps around to loca-

tion 00h. During a multibyte RAM access, if the address

pointer reaches the end of the register space (7Fh), it

wraps around to location 20h. On either the rising edge

of CE or an RTC address pointer wrap around, the cur-

rent time is transferred to a secondary set of registers.

The time information is read from these secondary regis-

ters, while the clock continues to run. This eliminates the

need to reread the registers in case the main registers

update during a read.

Clock and Calendar (00h–06h)

The time and calendar information is obtained by reading

the appropriate register bytes. Table 1 shows the RTC

registers. The time and calendar are set or initialized by

writing the appropriate register bytes. The contents of

the time and calendar registers are in the BCD format.

The Day register increments at midnight and rolls over

from 7 to 1. Values that correspond to the day-of-week

are user defined, but must be sequential (i.e., if 1 equals

Sunday, then 2 equals Monday, and so on). Illogical time

and date entries result in undefined operation.

The devices can be run in either 12-hour or 24-hour

mode. Bit 6 of the Hours register is defined as the 12- or

24-hour mode-select bit. When high, the 12-hour mode

is selected. In the 12-hour mode, bit 5 is the AM/PM bit,

with a content of 1 being PM. In the 24-hour mode, bit 5

is the 20-hour field. Changing the 12/24 mode-select bit

requires that the Hours data subsequently be reentered,

including the Alarm register (if used). The Century bit (bit

7 of Month) is toggled when the Years register rolls over

from 99 to 00. On a power-on reset (POR), the time and

date are set to 00:00:00 01/01/00 (hh:mm:ss DD/MM/YY),

and the Day register is set to 01.

Alarms (07h–0Eh)

The devices contains two time-of-day/date alarms. Alarm

0 can be set by writing to registers 07h–0Ah. Alarm 1 can

be set by writing to registers 0Bh–0Eh. The alarms can

be programmed to activate the INT0 or INT1 outputs on

an alarm match condition (see Table 2). Bit 7 of each

of the time of day/date alarm registers are mask bits.

When all the mask bits for each alarm are 0, an alarm

only occurs when the values in the timekeeping registers

00h–06h match the values stored in the alarm registers.

The alarms can also be programmed to repeat every

second, minute, hour, or day. Configurations not listed

in the table result in illogical operation. POR values are

undefined.

When the RTC register values match alarm register

settings, the corresponding alarm flag bit (IRQF0 or

IRQF1) is set to 1 in the Status register. If the corre-

sponding alarm interrupt enable bit (A0IE or A1IE) is

also set to 1 in the Control register, the alarm condition

activates the output(s) defined by the INTCN bit. Upon

an active alarm, clearing the associated IRQF[1:0] bit

deasserts the selected interrupt output while leaving

the alarm enabled for the next occurrence of a match.

Alternatively, clearing the A_IE bit deasserts the output

and inhibits further output activations.

The alarm flags are always active, fully independent of

the A_IE bit states. All alarm registers should be written

to logic zero to disable the alarm matching.

Figure 1. Layout Example

LOCAL GROUND PLANE (LAYER 2)

CRYSTAL

GND

NOTE: AVOID ROUTING SIGNAL LINES

IN THE CROSSHATCHED AREA

(UPPER LEFT QUADRANT) OF

THE PACKAGE UNLESS THERE IS

A GROUND PLANE BETWEEN THE

SIGNAL LINE AND THE DEVICE PACKAGE.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Table 1. Register Map

Table 2. Alarm Mask Bits

Note: Bits listed as 0 always read back as 0 and cannot be written to 1.

ADDRESS BIT 7

MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

LSB FUNCTION RANGE

00h 0 10 Seconds Seconds Seconds 00–59

01h 0 10 Minutes Minutes Minutes 00–59

02h 0 12/24

AM/PM 10

Hours Hour Hours

1–12 +

AM/PM

00–23

Hours

03h 0 0 0 0 0 Day Day 1–7

04h 0 0 10 Date Date Date 01–31

05h Century 0 0 10

Month Month Month/

Century

01–12 +

Century

06h 10 Year Year Year 00–99

07h A0M1 10 Seconds Seconds Alarm 0

Seconds 00–59

08h A0M2 10 Minutes Minutes Alarm 0

Minutes 00–59

09h A0M3 12/24

AM/PM 10

Hours Hour Alarm 0 Hours

1–12 +

AM/PM

00–23

Hours

0Ah A0M4 0 0 0 Day Alarm 0 Day 1–7

0Bh A1M1 10 Seconds Seconds Alarm 1

Seconds 00–59

0Ch A1M2 10 Minutes Minutes Alarm 1

Minutes 00–59

0Dh A1M3 12/24

AM/PM 10

Hours Hour Alarm 1 Hours

1–12 +

AM/PM

00–23

Hours

0Eh A1M4 0 0 0 Day Alarm 1 Day 1–7

0Fh EOSC X DOSF EGFIL SQW INTCN A1IE A0IE Control —

10h OSF 0 0 0 0 0 IRQF1 IRQF0 Status —

11h TCS3 TCS2 TCS1 TCS0 DS1 DS0 RS1 RS0 Trickle

Charger —

12h–1Fh Reserved Reserved —

20h–7Fh User RAM User RAM 00h–FFh

ALARM REGISTER MASK BITS (BIT 7) ALARM RATE

A_M4 A_M3 A_M2 A_M1

1 1 1 1 Alarm once a second

1 1 1 0 Alarm when seconds match

1 1 0 0 Alarm when minutes and seconds match

1 0 0 0 Alarm when hours, minutes, and seconds match

0 0 0 0 Alarm when day, hours, minutes, and seconds match

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Control Register (0Fh)

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

EOSC X DOSF EGFIL SQW INTCN A1IE A0IE

1 0 0 0 0 0 0 0

BIT 7

EOSC: Enable oscillator. During battery backup, when EOSC is set to 0, the oscillator is enabled during back-

up operation. When set to 1, the oscillator is stopped when the device is powered by the backup supply. This

bit is set to logic 1 on the initial application of power.

BIT 6 Not used.

BIT 5

DOSF: Disable oscillator stop flag. When the DOSF bit is set to 1, sensing of the oscillator conditions that

would set the OSF bit are disabled. OSF remains at 0 regardless of what happens to the oscillator. This bit is

cleared (0) on the initial application of power.

BIT 4 EGFIL: Enable glitch filter. When the EGFIL bit is 1, the 5Fs glitch filter at the output of crystal oscillator is

enabled. The glitch filter is disabled when this bit is 0. This bit is cleared (0) on the initial application of power.

BIT 3 SQW: Enable square wave. When the SQW bit is set to 1, a 32kHz square wave is output on the INT1 output.

This bit is cleared (0) on the initial application of power.

BIT 2

INTCN: Interrupt control. This bit controls the relationship between the two time-of-day alarms and the two

interrupt output pins. When the INTCN bit is 1, a match between the timekeeping registers and the Alarm

0 registers activates the INT0 output (provided A0IE = 1), and a match between the timekeeping registers

and the Alarm 1 registers activates the INT1 output (provided A1IE = 1). When the INTCN bit is 0, a match

between the timekeeping registers and either the Alarm 0 registers or Alarm 1 registers activates the INT0 out-

put (provided A0IE = A1IE = 1). The INT1 output has no function when INTCN = 0. The INTCN bit is cleared

(0) on the initial application of power.

BIT 1

A1IE: Alarm 1 interrupt enable. When A1IE is set to 0, the Alarm 1 interrupt function is disabled. When A1IE

is 1, the Alarm 1 interrupt function is enabled and is routed to either INT0 (if INTCN = 0) or INT1 (if INTCN

= 1). Regardless of the state of A1IE, a match between the timekeeping registers and the Alarm 1 registers

(0Bh–0Eh) sets the interrupt request 1 flag bit (IRQF1). The A1IE bit is cleared (0) when power is first applied.

BIT 0

A0IE: Alarm 0 interrupt enable. When A0IE is set to 0, the Alarm 0 interrupt function is disabled. When A0IE

is 1, the Alarm 0 interrupt function is enabled and is routed to INT0. Regardless of the state of A0IE, a match

between the timekeeping registers and the Alarm 0 registers (07h–0Ah) sets the interrupt register 0 flag bit

(IRQF0). The A0IE bit is cleared (0) when power is first applied.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Status Register (10h)

Trickle Charger Register (11h)

acteristics. The simplified schematic of Figure 2 shows

the basic components of the trickle charger. The trickle-

charge select (TCS[3:0]) bits (bits 7:4) control the

selection of the trickle charger. To prevent accidental

enabling, only a pattern of 1010 enables the trickle

charger; all other patterns disable the trickle charger.

On the initial application of power, the devices power

up with the trickle charger disabled. The diode-select

(DS[1:0]) bits (bits 3:2) select whether or not a diode is

connected between VCC and VBAT. The resistor-select

(RS[1:0]) bits (bits 1:0) select the resistor that is con-

nected between VCC and VBAT. The RS and DS bits

select the resistor and diodes, as shown in Table 3. The

user determines diode and resistor selection according

to the maximum current desired for secondary battery or

super cap charging. The maximum charging current can

be calculated using the equation that follows.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

OSF 0 0 0 0 0 IRQF1 IRQF0

1 0 0 0 0 0 0 0

BIT 7

OSF: Oscillator stop flag. If the OSF bit is 1, the oscillator either has stopped or was stopped for some period

and could be used to judge the validity of the clock and calendar data. This bit is edge triggered and is set to

1 when the internal circuitry senses the oscillator has transitioned from a normal run state to a stop condition.

This bit remains at logic 1 until written to logic 0. Attempting to write OSF to 1 leaves the value unchanged.

The following are examples of conditions that can cause the OSF bit to be set:

1) The first time power is applied.

2) The voltage present on VCC is insufficient to support oscillation.

3) The EOSC bit is a logic one during battery backup.

4) External influences on the crystal (i.e., noise, leakage, etc.).

BIT 1

IRQF1: Interrupt request 1 flag. A logic 1 in the IRQF1 bit indicates that the time matched the Alarm 1 reg-

isters. This flag can be used to generate an interrupt on either INT0 or INT1 depending on the status of the

INTCN bit in the Control register. If the INTCN bit is 0 and IRQF1 is 1 (and the A1IE bit is also 1), INT0 goes

low. If the INTCN bit is 1 and IRQF1 is 1 (and the A1IE bit is also 1), INT1 goes low. IRQF1 is cleared when

the address pointer is set to any of the Alarm 1 registers during an I/O transaction. The IRQF1 bit can also

be cleared by writing it to 0. This bit can only be written to 0. Attempting to write the IRQF1 bit to 1 leaves the

value unchanged.

BIT 0

IRQF0: Interrupt request 0 flag. A logic 1 in the IRQF0 bit indicates that the time matched the Alarm 0 regis-

ters. If the A0IE bit is also 1, INT0 goes low. IRQF0 is cleared when the address pointer is set to any of the

Alarm 0 registers during an I/O transaction. The IRQF0 bit can also be cleared by writing it to 0. This bit can

only be written to 0. Attempting to write the IRQF0 bit to 1 leaves the value unchanged.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

TCS3 TCS2 TCS1 TCS0 DS1 DS0 RS1 RS0

0 0 0 0 0 0 0 0

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Assume, for the purposes of the example, that a system

power supply of 5V is applied to VCC and a super cap is

connected to VBAT. Also assume that the trickle charger

has been enabled with one diode and resistor R1. The

maximum current IMAX would be calculated as follows:

IMAX = (5.0V - diode drop)/R1 ≈ (5.0V - 0.6V)/2kΩ ≈

2.2mA

As the super cap charges, the voltage drop between

VCC and VBAT decreases, and therefore, the charge

current decreases.

Serial Port Operation

The devices offer the flexibility to choose between two

serial-interface modes. The component can commu-

nicate with the SPI interface or with a standard 3-wire

interface. The interface method used is determined by

SERMODE. When SERMODE is connected to VCC, SPI

communication is selected. When SERMODE is con-

nected to ground, standard 3-wire communication is

selected.

Figure 2. Trickle Charger Block Diagram

Table 3. Trickle-Charger Resistor and Diode Select

X = Don’t care.

1kΩ

2kΩ

4kΩ

VCC VBAT

1 0F 18 SELECT

NOTE: ONLY 1010 CODE ENABLES CHARGER

1 OF 2

SELECT

1 OF 3

SELECT TCS = TRICKLE-CHARGER SELECT

DS = DIODE SELECT

RS = RESISTOR SELECT

TRICKLE

CHARGER

TCS

BIT 7

TCS

BIT 6

TCS

BIT 5

TCS

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

TCS3 TCS2 TCS1 TCS0 DS1 DS0 RS1 RS0 FUNCTION

X X X X X X 0 0 Disabled

X X X X 0 0 X X Disabled

X X X X 1 1 X X Disabled

1 0 1 0 0 1 0 1 No diode, 1kI

1 0 1 0 0 1 1 0 No diode, 2kI

1 0 1 0 0 1 1 1 No diode, 4kI

1 0 1 0 1 0 0 1 One diode, 1kI

1 0 1 0 1 0 1 0 One diode, 2kI

1 0 1 0 1 0 1 1 One diode, 4kI

0 0 0 0 0 0 0 0 Initial power-on state—disabled

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Serial Peripheral Interface (SPI)

The serial peripheral interface (SPI) is a synchronous

bus for address and data transfer, and is used when

interfacing with the SPI bus on specific Motorola micro-

controllers, such as the 68HC05C4 and the 68HC11A8.

The SPI mode of serial communication is selected by

connecting SERMODE to VCC. Four pins are used for the

SPI. The four pins are SDO (serial-data out), SDI (serial-

data in), CE (chip enable), and SCLK (serial clock). The

IC is the slave device in an SPI application, with the

microcontroller being the master.

SDI and SDO are the serial-data input and output pins,

respectively, for the device. The CE input is used to

initiate and terminate a data transfer. SCLK is used to

synchronize data movement between the master (micro-

controller) and the slave (IC) devices.

The input clock (SCLK), which is generated by the micro-

controller, is active only during address and data transfer

to any device on the SPI bus. The inactive clock polarity

is programmable in some microcontrollers. The device

determines the clock polarity by sampling SCLK when

CE becomes active. Therefore, either SCLK polarity can

be accommodated. Input data (SDI) is latched on the

internal strobe edge and output data (SDO) is shifted out

on the shift edge (Figure 3). There is one clock for each

bit transferred. Address and data bits are transferred in

groups of eight, MSB first.

Address and Data Bytes

Address and data bytes are shifted MSB first into the

serial-data input (SDI) and out of the serial-data output

(SDO). Any transfer requires the address of the byte to

specify a write or read to either a RTC or RAM location,

followed by one or more bytes of data. Data is trans-

ferred out of the SDO for a read operation and into the

SDI for a write operation (Figure 4 and Figure 5).

The address byte is always the first byte entered after CE

is driven high. The most significant bit (R/W) of this byte

determines if a read or write takes place. If R/W is 0, one

or more read cycles occur. If R/W is 1, one or more write

cycles occur.

Data transfers can occur 1 byte at a time or in multiple-

byte burst mode. After CE is driven high an address is

written to the device. After the address, one or more data

bytes can be written or read. For a single-byte transfer,

1 byte is read or written and then CE is driven low. For

a multiple-byte transfer, however, multiple bytes can

be read or written to the device after the address has

been written. Each read or write cycle causes the RTC

Incrementing continues until the device is disabled.

When the RTC address space is selected, the address

wraps to 00h after incrementing from 1Fh. When the

RAM address space is selected, the address wraps to

20h after incrementing from 7Fh.

Figure 3. Serial Clock as a Function of Microcontroller Clock Polarity (CPOL)

SCLK

CPOL = 1

CPOL = 0

SHIFT DATA OUT (READ)

DATA LATCH (WRITE)

SHIFT DATA OUT (READ)

NOTE 1: CPHA BIT POLARITY (IF APPLICABLE) MAY NEED TO BE SET ACCORDINGLY.

NOTE 2: CPOL IS A BIT THAT IS SET IN THE MICROCONTROLLER’S CONTROL REGISTER.

NOTE 3: SDO REMAINS AT HIGH-Z UNTIL 8 BITS OF DATA ARE READY TO BE SHIFTED OUT DURING A READ.

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Figure 4. SPI Single-Byte Write

Figure 5. SPI Single-Byte Read

Figure 6. SPI Multibyte Burst Transfer

D0D1D2D3D4D5D6D7A0A1A2A3A4A5A61

SCLK*

SDI

SDO HIGH-Z

*SCLK CAN BE EITHER POLARITY.

SERMODE = VCC.

R/W

A0A1A2A3A4A5A60

SCLK*

SDI

SDO HIGH-Z D7 D6 D5 D4 D3 D2 D1 D0

*SCLK CAN BE EITHER POLARITY.

SERMODE = VCC.

R/W

ADDRESS

BYTE

DATA

BYTE 0

DATA

BYTE 1

DATA

BYTE N

ADDRESS

BYTE

SCLK

SDI

SDO

WRITE

READ

DATA

BYTE 0

DATA

BYTE 1

DATA

BYTE N

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Reading and Writing in Burst Mode

Burst mode is similar to a single-byte read or write,

except that CE is kept high and additional SCLK cycles

are sent until the end of the burst. The clock registers

and the user RAM can be read or written in burst mode.

The address pointer wraps around to 00h after reaching

1Fh (RTC), and the address pointer wraps around to 20h

after reaching 7Fh (RAM). See Figure 6.

3-Wire Interface

The 3-wire interface mode operates similarly to the SPI

mode. However, in 3-wire mode there is one I/O instead

of separate data-in and data-out signals. The 3-wire

interface consists of the I/O (SDI and SDO pins con-

nected together), CE, and SCLK pins. In 3-wire mode,

each byte is shifted in LSB first, unlike SPI mode, where

each byte is shifted in MSB first.

As is the case with the SPI mode, an address byte is

written to the device followed by a single data byte or

multiple data bytes. Figure 7 illustrates a write cycle, and

Figure 8 illustrates a read cycle. In 3-wire mode, data is

input on the rising edge of SCLK and output on the falling

edge of SCLK.

Applications Information

Power-Supply Decoupling

To achieve the best results when using the devices,

decouple the VCC power supply with a 0.01µF and/or

0.1µF capacitor. Use a high-quality, ceramic, surface-

mount capacitor if possible. Surface-mount components

minimize lead inductance, which improves performance,

and ceramic capacitors tend to have adequate high-

frequency response for decoupling applications.

Using Open-Drain Outputs

The INT0 and INT1 outputs are open drain and therefore

require external pullup resistors to realize a logic-high

output level.

Battery Charge Protection

The devices contain Maxim’s redundant battery-charge

protection circuit to prevent any charging of an external

battery. The DS1343 and DS1344 are recognized by

Underwriters Laboratories (UL) under file E141114.

Figure 7. 3-Wire Single-Byte Write

Figure 8. 3-Wire Single-Byte Read

D7D6D5D4D3D2D1D01A6A5A4A3A2A1A0

SCLK

I/O*

*I/O IS SDI AND SDO CONNECTED TOGETHER.

SERMODE = GND.

HIGH-Z

R/W

A6A5A4A3A2A1A0

SCLK

HIGH-Z

*I/O IS SDI AND SDO CONNECTED TOGETHER.

SERMODE = GND

I/O* 0 D0 D1 D2 D3 D4 D5 D6 D7

R/W

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Ordering Information

+Denotes a lead(Pb)-free/RoHS-compliant package.

*Future product—Contact factory for availability.

**EP = Exposed pad.

Chip Information

SUBSTRATE CONNECTED TO GROUND

Package Information

For the latest package outline information and land patterns

(footprints), go to www.maxim-ic.com/packages. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PART TEMP RANGE TYP OPERATING

VOLTAGE (V)

OSC CL

(pF) PIN-PACKAGE

DS1343E-18+* -40NC to +85NC1.8 6 20 TSSOP

DS1343E-3+* -40NC to +85NC3.0 6 20 TSSOP

DS1343E-33+ -40NC to +85NC3.3 6 20 TSSOP

DS1343D-18+* -40NC to +85NC1.8 6 14 TDFN-EP**

DS1343D-3+* -40NC to +85NC3.0 6 14 TDFN-EP**

DS1343D-33+ -40NC to +85NC3.3 6 14 TDFN-EP**

DS1344E-18+* -40NC to +85NC1.8 12.5 20 TSSOP

DS1344E-3+* -40NC to +85NC3.0 12.5 20 TSSOP

DS1344E-33+ -40NC to +85NC3.3 12.5 20 TSSOP

DS1344D-18+* -40NC to +85NC1.8 12.5 14 TDFN-EP**

DS1344D-3+* -40NC to +85NC3.0 12.5 14 TDFN-EP**

DS1344D-33+ -40NC to +85NC3.3 12.5 14 TDFN-EP**

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

20 TSSOP U20+1 21-0066 90-0116

14 TDFN-EP T1433+2 21-0137 90-0063

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.

Maxim reserves the right to change the circuitry and specifications without notice at any time.

20 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

DS1343/DS1344

Low-Current SPI/3-Wire RTCs

Revision History

REVISION

NUMBER

REVISION

DATE DESCRIPTION PAGES

CHANGED

0 3/11 Initial release —

1 12/11

Removed future status from several DS1344 parts in the Ordering Information table;

added UL recognized to the Features and Battery Charge Protection sections;

added IBATLKG and DS1344 IBAT1, IBAT2 specs to the DC Electrical Characteristics

section; added DS1344 Typical Operating Characteristics graphs

1, 2, 7, 18, 19