INTEGRATED CIRCUITS DIVISION
Dual Optocouplers, Unidirectional Input
Darlington-Transistor Output
www.ixysic.com
DS-LDA213-R04 1
LDA213
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Pb
Part Number Description
LDA213 8-Pin DIP (50/tube)
LDA213S 8-Pin Surface Mount (50/tube)
LDA213STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 30 VP
Current Transfer Ratio -
CTR (typical)
8500 %
Saturation Voltage - VCE(sat) 1V
Input Control Current - IF1mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Loop Detect
• Ringing Detect
• Current Sensing
• 100mA Continuous Load Rating
• 3750Vrms Input/Output Isolation
• Unidirectional Input
• Small 8-Pin Package, Thru-Hole or Surface Mount
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Packaging Available
LDA213 is a dual unidirectional-input optocoupler
with Darlington-transistor outputs. The LDA213 has a
minimum current transfer ratio (CTR) of 300% with a
typical value of 8500%.
Approvals
1
2
8
7
A
K
C
E
6
5
C
E
3
4
A
K
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R04
LDA213
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Breakdown Voltage 30 VP
Reverse Input Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Power Dissipation
Input Power Dissipation 1150 mW
Phototransistor 2150
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33mW / °C
2 Derate linearly 2mW / °C
Electrical Characteristics @ 25ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage IC = 100µA BVCEO 30 50 - V
Phototransistor Dark Current VCEO = 5V, IF = 0mA ICEO - 50 500 nA
Saturation Voltage IC = 3mA, IF = 1mA VCE(sat) --1V
Current Transfer Ratio IF = 1mA, VCE = 2V CTR 300 8500 30000 %
Output Capacitance 50V, f =1MHz COUT -3-pF
Input Characteristics
Input Control Current IC = 3mA, VCE = 2V IF- 0.07 1 mA
Input Voltage Drop IF = 5mA VF0.9 1.2 1.4 V
Reverse Input Current VR = 5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output - CI/O -3-pF
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton VCC=5V, IF=1mA, RL=5008s
Turn-Off Time toff 345
Switching Characteristics @ 25ºC
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
ton toff
VCE
INTEGRATED CIRCUITS DIVISION
LDA213
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R04
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. Current
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. Current (Log)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
IF=1mA
LED Forward Current (mA)
246810
CTR (%)
0
5000
10000
15000
20000
Typical CTR vs. LED Forward Current
(VCE=5V)
0
-40ºC
85ºC
25ºC
Typical Collector Current
vs. Collector Voltage
Collector Voltage VCE (V)
0123456
Collector Current IC (mA)
0.00
0.05
0.10
0.15
0.20
0.25
IF=10mA
IF=20mA
IF=5mA
IF=1mA
IF=2mA
IF=0.5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
ICE Current (mA)
0
50
100
150
200
250
ICE Current vs. Temperature
(VCE=5V)
IF=10mA
IF=5mA
IF=2mA
IF=1mA
IF=0.5mA
IF=0.2mA
IF=0.1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
VCE(sat) (V)
0.70
0.75
0.80
0.85
0.90
0.95
VCE(sat) vs. Temperature
(IF=1mA, IC=3mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
200
400
600
800
1000
1200
1400
Leakage Current vs. Temperature
VCC=10V
VCC=3V
VCC=5V
Load Resistance (:)
1x1021x1031x1041x105
Turn-On Time (Ps)
6.8
6.9
7.0
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8.0
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V)
Load Resistance (:)
1x1021x1031x1041x105
Turn-Off Time (Ps)
0
5000
10000
15000
Turn-Off Time vs. Load Resistance
(IF=1mA, VCC=5V)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R04
LDA213
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LDA213 / LDA213S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LDA213 / LDA213S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
LDA213
www.ixysic.com 5
R04
LDA213
LDA213S
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
LDA213
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LDA213-R04
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
LDA213STR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
