October 2011 Doc ID 018564 Rev 1 1/7
7
STPS41H100C-Y
Automotive low drop power Schottky rectifier
Features
Negligible switching losses
Low leakage current
Good trade off between leakage current and
foward voltage drop
Low thermal resistance
Avalanche capability specified
AEC-Q101 qualified
Description
Dual center tab Schottky rectifier suited for switch
mode power supply and high frequency DC to DC
converters.
Packaged in D2PAK, this device is intended for
use in high frequency inverters for automotive
application.
j
Table 1. Device summary
Symbol Value
IF(AV) 2 x 20 A
VRRM 100 V
Tj (max) 175 °C
VF(max) 0.67 V
A1
K
A2
K
A1
A2
D2PAK
STPS41H100CG-Y
www.st.com
Characteristics STPS41H100C-Y
2/7 Doc ID 018564 Rev 1
1 Characteristics
When the diodes 1 and 2 are used simultaneously:
ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
To evaluate the conduction losses use the following equation:
P = 0.58 x IF(AV) + 0.0045 IF2(RMS)
Table 2. Absolute ratings (limiting values, per diode)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V
IF(RMS) Forward rms current 30 A
IF(AV) Average forward current Tc = 50 °C
δ = 0.5
Per diode
Per device
20 A
40
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 220 A
IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 18100 W
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature range(1)
1. condition to avoid thermal runaway for a diode on its own heatsink
-40 to + 175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case Per diode 1.5
°C/WTo t a l 0 . 8
Rth(c) Coupling 0.1
Table 4. Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage
current
Tj = 25 °C VR = VRRM
10 μA
Tj = 125 °C 3 10 mA
VF(1) Forward voltage drop
Tj = 25 °C IF = 20 A 0.80
V
Tj = 125 °C IF = 20 A 0.62 0.67
Tj = 25 °C IF = 40 A 0.90
Tj = 125 °C IF = 40 A 0.70 0.76
dPtot
dTj <1
Rth(j-a)
STPS41H100C-Y Characteristics
Doc ID 018564 Rev 1 3/7
Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
0
2
4
6
8
10
12
14
16
0 5 10 15 20 25
IF(av)(A)
δ= 0.05
δ= 0.1
δ= 0.2
δ= 0.5
δ= 1
PF(av)(W)
T
δ=tp/T tp
0
2
4
6
8
10
12
14
16
18
20
22
0 25 50 75 100 125 150 175
Tamb(°C)
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
IF(av)(A)
T
δ=tp/T tp
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
P(t
p)
P (1µs)
ARM
ARM
t (µs)
p
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
P(T)
P (25 °C)
ARM j
ARM
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
0
50
100
150
200
250
300
1.E-03 1.E-02 1.E-01 1.E+00
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
IM(A)
IM
t
δ=0.5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
Zth(j-c)/Rth(j-c)
T
δ=tp/T tp
Characteristics STPS41H100C-Y
4/7 Doc ID 018564 Rev 1
Figure 7. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 102030405060708090100
VR(V)
Tj=150°C
Tj=125°C
Tj=25°C
Tj=100°C
Tj=75°C
Tj=50°C
IR(mA)
0.1
1.0
10.0
1 10 100
VR(V)
F=1MHz
Vosc =30mV
Tj=25°C
C(nF)
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VFM(V)
Tj=25°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
IFM(A)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
S(cm²)
Rth(j-a)(°C/W)
(epoxy printed board FR4, Cu = 35 µm) - STPS41H100CG only
STPS41H100C-Y Package information
Doc ID 018564 Rev 1 5/7
2 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Footprint (dimensions in mm)
Table 5. D2PAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2
G
L
L3
L2
B
B2
E
* FLAT ZONE NO LESS THAN 2m
m
A
C2
D
R
A2
M
V2
C
A1
*
16.90
10.30
8.90 3.70
5.08
1.30
Ordering information STPS41H100C-Y
6/7 Doc ID 018564 Rev 1
3 Ordering information
4 Revision history
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS41H100CGY-TR STPS41H100CGY D2PAK 1.48 g 1000 Tape and reel
Table 7. Document revision history
Date Revision Changes
21-Oct-2011 1 Initial release.
STPS41H100C-Y
Doc ID 018564 Rev 1 7/7
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