Application Specification
114--13000
LOC B
1of 19
E2009 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1--800--722--1111
PRODUCT INFORMATION 1--800--522--6752
This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at www.tycoelectronics.com
Micro MATE- N- LOK* Connectors 10 NOV 09 Rev B
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of Micro MATE--N--LOK connectors for printed circuit
(pc) board, panel mount, and free--hanging applications. Connectors are available in dual row with 2 through 24
contact positions, and single row with 2 through 12 positions on 3.00 mm centerline spacing. End cavities are
marked with a number to provide circuit identification. The pin header is available, for wire--to--board
applications, in vertical or right angle configurations for through hole mount application or surface mount
technology (SMT). The plug housings are available for panel mount or free--hanging wire--to--wire applications.
The receptacle locking latch ensures positive mating of the connectors.
The pin header contains pre--installed solder type contacts with precision formed solder tines. The pin header
is available with integral boardlocks (mechanical or plastic) or surface mount boardlocks (contacts with a board
retention feature). These boardlocks provide stability for connector placement on the pc board. The connectors
are placed on the pc board by hand application tooling or electrically--powered machines. The receptacle
housing accepts only Micro MATE--N--LOK receptacle contacts sizes for 30--26 or 24--20 AWG wire. To ensure
proper placement, the contact orientation barrel aligns with an orientation feature on the receptacle contact
cavity. The contact contains a locking lance designed to engage the housing contact retention shoulder and
prevent backing out during mating of the connector. The contacts are available in loose--piece for terminating
with manual hand--held tools, and in strip form for terminating with semi--automatic or automatic
electrically--powered machines.
The plug housing accepts only Micro MATE--N--LOK plug contacts sizes for 30--26 or 24--20 AWG wire. The
plug contact can be inserted into the plug housing in one of two orientations 180opposite of each other. The
contacts have locking lances that will engage the housing retention shoulder in either contact orientation and
prevent backing out during mating of the connector. When corresponding with Tyco Electronics Personnel, use
the terminology provided in this specification to facilitate your inquiries for information. Basic terms and
features of this product are provided in Figure 1.
Figure 1 (cont’d)
Pin Header Connector
Single Row Surface Mount
(Right--Angle Shown)
Dual Row Vertical
Through Hole Mount
Receptacle
Connector
Plastic Boardlock
(2 Places)
Housing
Dual Row Right--Angle
Through Hole Mount
Through Hole
Contacts
Mechanical
Boardlock
(2 Places)
Locking Tab Polarization
Feature
Contact Board Retention
Feature (End Contacts
Only, 4 Places)
Contact
Cavity
Locking Latch Contact Retention
Shoulder
Polarization Feature
Orientation
Feature
Single Row Panel Mount
Plug Housing
Locking Latch
NOTE
i
Micro MATE- N- LOK Connectors 114- 13000
Rev B2 of 19 Tyco Electronics Corporation
Figure 1 (end)
Receptacle Contact
Locking
Lance
Insulation Barrel
Spring Member
(2 Places)
Wire Barrel
Rear Cutoff
Tab
Orientation Barrel
Front Cutoff
Tab
Box
Plug Contact
Locking
Lance
Insulation Barrel
Wire Barrel
Rear Cutoff
Tab
2. REFERENCE MATERIAL
2.1. Revision Summary
This paragraph is reserved for a revision summary covering the most recent additions and changes made to
this specification which include the following:
SUpdated document to corporate requirements
SNew logo and format
2.2. Customer Assistance
Product Part Number 794618 and Product Code A309 are representative of Micro MATE--N--LOK connectors.
Use of these numbers will identify the product line and expedite your inquiries through a service network
established to help you obtain product and tooling information. Such information can be obtained through a
local Tyco Electronics Representative or, after purchase, by calling the Product Information Center at the
number at the bottom of page 1.
2.3. Drawings
Customer Drawings for specific products are available from the service network. The information contained in
Customer Drawings takes priority if there is a conflict with this specification or with any other technical
documentation supplied by Tyco Electronics.
2.4. Manuals
Manual 402--40 is available upon request and can be used as a guide to soldering. This manual provides
information on various flux types and characteristics with the commercial designation and flux removal
procedures. A checklist is included in the manual as a guide for information on soldering problems.
2.5. Specifications
Product Specification 108--1836 provides product performance and test information.
2.6. Instructional Material
The following list includes available instruction sheets (408--series) that provide assembly procedures for
product, operation, maintenance and repair of tooling, as well as setup and operation procedures of
applicators; and customer manuals (409--series) that provide setup, operation, and maintenance procedures of
machines.
Document Number Document Title
408--3295 Preparing Reel of Contacts for Applicator Tooling
408--7424 Checking Terminal Crimp Height
408--7497 Recommended Procedures for “Crush” Crimp Technique
408--8040 Heavy Duty Miniature Quick--Change Applicators (Side--Feed Type)
408--8053 Conversion Guide for Miniature Quick Change Applicators
Micro MATE- N- LOK Connectors 114- 13000
Rev B 3 of 19Tyco Electronics Corporation
Document Number Document Title
408--8059 General Preventive Maintenance for Miniature Quick--Change Applicators
408--8547 CERTI--CRIMP* II Straight Action Hand Tools
408--9816 Handling of Reeled Products
408--9453 Extraction Reset Tool 843996--[ ]
409--5128 AMP--O--LECTRIC* Model “K” Terminating Machine 565435--5
409--5842 AMP--O--LECTRIC Model “G” Terminating Machine 354500--[ ]
409--5852 AMPOMATOR* CLS III--G Lead--Making Machine 122500--[ ]
409--5866 AMPOMATOR CLS IV Lead--Making Machine 217500--[ ]
409--5878 AMPOMATOR CLS IV+ Lead--Making Machine 356500--[ ]
409--10016 Entry Level Terminator (ELT) Machine 1338600--[ ]
409--10027 Stripping Modules 1490500 and 1490502
409--10029 Stripping Modules 1490501 and 1490503
3. REQUIREMENTS
3.1. Safety
Do not stack component packages so high that the shipping containers buckle or deform.
3.2. Material
The receptacle housings are made of flame--retardant black thermoplastic, and the pin header housings are
made of flame retardant high--temperature black thermoplastic to facilitate the soldering process. The
mechanical boardlocks are made of phosphor bronze plated with tin and the plastic boardlocks are made of
plastic. Micro MATE--N--LOK (receptacle) contacts are made of phosphor bronze and the pre--installed solder
type (pin header) contacts are made of brass; both available in duplex 30mgold, 15mgold, or bright tin plating.
3.3. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector
material.
B. Shelf Life
The contacts should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The contacts should be used on a first in, first out basis to avoid storage contamination that
could adversely affect performance.
C. Reeled Contacts
When using reeled contacts, store coil wound reels horizontally and traverse wound reels vertically.
3.4. Chemical Exposure
Do not store connectors or contacts near any chemical listed below as they may cause stress corrosion
cracking in the connectors or contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.5. Panel Mount Layout
Figure 2 provides the dimensions required for panel mounting the connectors. The recommended panel
thickness is 1.57--2.3 mm.
Micro MATE- N- LOK Connectors 114- 13000
Rev B4 of 19 Tyco Electronics Corporation
4.06 +0.10
1.98 +0.20
7.11 +0.10
Dim “B” +0.10
Dim “C” +0.05
8.71 +0.20
3.05 +0.10 3.18 +0.20
4.21 +0.10
5.51 +0.20
Dim “B” +0.10
Dim “C” +0.05/--0.10
PLUG HOUSING - DUAL ROW PLUG HOUSING - SINGLE ROW
NUMBER OF
POSITIONS DIM “B” DIM “C” NUMBER OF
POSITIONS DIM “B” DIM “C”
24.20 7.88 27.20 10.88
47.20 10.88 310.20 13.99
610.20 13.88 413.20 16.88
813.20 16.88 516.20 19.88
10 16.20 19.88 619.20 22.88
12 19.20 22.88 722.20 25.88
14 22.20 25.88 825.20 28.88
16 25.20 28.88 928.20 31.88
18 28.20 31.88 10 31.20 34.88
20 31.20 34.88 11 34.20 37.88
22 34.20 37.88 12 37.20 40.88
24 37.20 40.88 -- -- --
Figure 2
3.6. Wire Selection and Preparation
The contacts will accept stranded wire sizes 30 through 20 AWG with an insulation diameter range of 0.89 to
1.53 mm. Proper strip length is necessary to properly insert the wire into the contact. The strip length of the
wireisshowninFigure3.
Reasonable care must be taken not to nick, scrape, or cut any strands during the stripping operation.
2.90--3.53
Wire Strip Length
Conductor
Insulation
C
O
N
T
A
C
T
W
I
R
E
S
I
Z
E
CONTACT WIRE BARREL CRIMP CONTACT INSULATION
CONTACT
S
I
Z
E
WIRE SIZE
(
A
W
G
)
HEIGHT +0.05 WIDTH
C
O
N
T
A
C
T
I
N
S
U
L
A
T
I
O
N
BARREL CRIMP WIDTH
S
I
Z
E
(
A
W
G
)
APPLICATOR HAND TOOL APPLICATOR HAND TOOL APPLICATOR HAND TOOL
30 0.51
30--26 28 0.56 (Recpt)
0.53 (Plug) 0.58 1.07 1.07
3
0
2
6
26 0.61 (Recpt)
0.56 (Plug)
0
.
5
8
1
.
0
7
1
.
0
7
1.78 1.78
24 0.69 0.74
24--20 22 0.79 0.74 1.40 1.40
2
4
2
0
20 0.89 0.89
1
.
4
0
1
.
4
0
Figure 3
CAUTION
!
Micro MATE- N- LOK Connectors 114- 13000
Rev B 5 of 19Tyco Electronics Corporation
3.7. Crimp Requirements
Wire insulation must NOT be cut or broken during the crimping operation. Reasonable care should be taken to provide
undamaged wire terminations.
The contact must be crimped to the wire according to instructions packaged with applicable tooling.
A. Cutoff Tab and Burr
Cutoff tabs are the remaining portion of the carrier strip after the contact is cut from the strip. The following
dimensional requirements will ensure proper application for these contacts.
1. The front cutoff tab must not extend beyond the contact box and the rear cutoff tab must not extend
beyond the insulation barrel more than the limits shown in Figure 4.
2. The burr resulting from the cutoff tab shearing must not exceed the dimension shown in Figure 4.
B. Locking Lance
The height of the locking lances must be within the specified limits shown in Figure 4.
C. Spring Members
There must be no damage or distortion to the spring members of the receptacle contacts or the pin end of
the plug contact. See Figure 4.
D. Orientation Barrel
There must be no damage or distortion to the orientation barrel. See Figure 4.
E. Wire Barrel Crimp
The crimp applied to the wire barrel portion of the contact is the most compressed area and is most critical
in ensuring optimum electrical and mechanical performance of the crimped contact. The wire barrel must
be crimped in the “F” crimp where the tips of the wire barrel turn inward and capture the wire strands. The
wire barrel crimp height and width must be within the dimensions provided in Figure 4.
F. Effective Crimp Length
Effective crimp length is defined as that portion of the wire barrel, excluding bellmouths, fully formed by the
crimping tool. For optimum crimp effectiveness, the crimp must be within the limits shown in Figure 4.
G. Wire Barrel Seam
The seam between the two sides of the wire barrel must be completely closed and there must be no
evidence of loose wire strands or wire strands visible in the seam. Refer to Figure 4.
H. Bellmouths
The front and rear bellmouths caused by extrusion of the contact material during crimping must be within
thelimitsshowninFigure4.
I. Wire Barrel Flash
Wire barrel flash is the formation that may appear on both sides of the wire barrel as the result of crimping.
It must not exceed the dimension provided in Figure 4.
J. Insulation Barrel Crimp
The insulation barrel crimp is crimped to form a support for the insulation. The insulation barrel must be
crimped in the “F” crimp where the tips of the insulation barrel turn inward and capture the wire insulation.
The insulation barrel crimp width must be within the dimension provided in Figure 4.
K. Insulation Barrel Seam
The seam between the two sides of the insulation barrel must be completely closed and grasp the wire
insulation. Refer to Figure 4.
CAUTION
!
Micro MATE- N- LOK Connectors 114- 13000
Rev B6 of 19 Tyco Electronics Corporation
L. Conductor Location
The wire insulation and conductor must be visible within the transition area (between the contact insulation
barrel and wire barrel). The insulation must not enter the wire barrel. The wire conductor ends must be
flush to or extend slightly beyond the wire barrel to the limit provided in Figure 4.
Figure 4
Wire Barrel Crimp
Width (See Table)
0.56--0.69
Locking Lance
HeightH
0.25 Max
Rear Cutoff Tab (See
Detail A) 0.11 Max
Front Cutoff Tab
(See Detail B)
0.13 Max
Burr Allowance
1.80 Min Effective
Crimp Length
0.13 Max
Front Bellmouth
0.13 Min Rear
Bellmouth
A
A
Insulation Does Not
Enter Wire Barrel
No Wire Strands
Shows in Wire
Barrel Seam
Wire Conductor
Ends Flush to or
Extends 1.58 (Max)
Beyond Wire Barrel
0.20 Max Wire
Barrel Flash
Section A- A
Wire Barrel Crimp
Height (See Table)
Insulation Barrel
(“F” Crimp)
Wire Barrel
(“F” Crimp)
Transition Area (Wire
Insulation and Conductors
Must Be Visible Here)
No Damage or Distortion
PermittedinThisArea
Detail A
Insulation Barrel Must
Grasp Wire Insulation
0.13 Max
Burr Allowance
Detail B
No Damage to
Spring Members
NOTE: Receptacle contact shown, plug contact has same dimensions for crimp requirements.
Orientation
Barrel
HNOTE: Locking lance height is different for plug contacts. Refer to
the appropriate customer drawings for specific dimensions.
The developed crimp configurations result from using the specific tooling described in Section 5, TOOLING.
NOTE
i
Micro MATE- N- LOK Connectors 114- 13000
Rev B 7 of 19Tyco Electronics Corporation
M. Straightness
The force applied during crimping may cause some bending between the wire barrel and the mating
portion of the contact. Such deformation is acceptable within the following limits.
1. Up and Down
The crimped portion, including cutoff tab and burr, must not be bent beyond the limits shown in Figure 5.
2. Side--to--Side
The crimped portion must not be bent from one side to the other beyond the limits shown in Figure 5.
Figure 5
Up and Down Alignment
Side- to- Side Alignment
Datum Line
4Max.
4Max.
4Max.
N. Twist and Roll
There should be no twist or roll of the wire barrel or mating portion of the crimped contact beyond the limits
shown in Figure 6.
3_(Max)
Mating Portion
Avoid Twist
and Roll
Datum Line
Figure 6
3_(Max)
3.8. Placement of Crimped Contacts
A. Receptacle Housing
The contact orientation barrel must be aligned with the receptacle contact cavity orientation feature
(located on the back of the receptacle). The contact must be inserted into the housing contact cavity and
snapped into place. When fully inserted, the contact locking lance will engage the receptacle contact
retention shoulder and prevent backing out during mating of the connectors. After inserting contact into
housing, pull back lightly on the wire to ensure contact is fully seated. See Figure 7.
An insertion tool is not required to insert contacts into receptacles.
Receptacle contacts are for use with receptacle housings only. Do not insert receptacle contacts into plug housings.
NOTE
i
CAUTION
!
Micro MATE- N- LOK Connectors 114- 13000
Rev B8 of 19 Tyco Electronics Corporation
Figure 7
Wire
Contact Locking
Lance
Housing
Contact Cavity
Back of Receptacle
Contact Orientation
Barrel
Contact Cavity
Orientation Feature
B. Plug Housing
The plug contact can be aligned in one of two different ways, (180opposite each other) during insertion
into a plug housing. Either alignment is acceptable and will provide engagement of the lances with the
housing locking shelves and prevent backing out during mating of connectors . After inserting contacts into
the housing, pull back lightly on the wire to ensure the contact is fully seated. See Figure 8.
Plug contacts are for use with plug housings only. Do not insert plug contacts into receptacle housings.
Figure 8
Plug Housing
Plug Contact Locking Lance
3.9. Connector Spacing
Care must be used to avoid interference between adjacent connectors and other components. The minimum
allowable distance between pin headers to ensure proper mating is provided in Figure 9.
3.10. PC Board
A. Material and Thickness
The pc board material shall be glass epoxy (FR--4 or G--10). The pc board thickness shall be 1.57 mm.
Contact the Product Information Center at the number listed at the bottom of page 1 for suitability of other board
materials and thicknesses.
B. Tolerance
Maximum allowable bow of the pc board shall be 0.03 mm over the length of the pin header.
CAUTION
!
NOTE
i
Micro MATE- N- LOK Connectors 114- 13000
Rev B 9 of 19Tyco Electronics Corporation
Figure 9
PC Board
Pin Header 6.35 Min
Allowable Distance
Pin Header
C. Layout for Through Hole Mount Connectors
1. The pc board and lead wires must be solderable in accordance with Test Specification 109--11.
2. The pc board holes for the contact solder tines and boardlocks must be drilled and plated through to
specific dimensions to prevent stubbing during placement of the connector on the pc board and to
ensure optimum continuity for circuits after soldering. The drilled hole size, plating types, and plating
thickness will depend on application requirements. The finished hole size must be as stated to provide
unrestricted insertion and ensure adequate application of solder to the solder tines. See Figure 10.
3. The contact holes and boardlock holes in the pc board must be precisely located to ensure proper
placement and optimum performance of the connector. Design the pc board using the dimensions
provided in Figure 11.
Pad Diameter
(As Required)
Trace Width
(As Required)
Drilled Hole Diameter
(As Required)
Finished Hole Diameter
(After Plating) 0.80+0.05
Drilled Hole Diameter
(Refer to Specific PC Board
Layout, Figure 11)
Boardlock Hole
Contact Solder Tine Hole
Figure 10
D. Layout for Surface Mount Connectors
1. The pc board pads must be solderable in accordance with EIA--638 (Electronic Industries Alliance).
2. The connector boardlock holes on the pc board require precise drilling dimensions and the location of
the circuit pads to these holes is critical to ensure proper placement and optimum performance of the
connector. Recommended pc board pad pattern, dimensions, and tolerances are shown in Figure 11.
Four representative examples of recommended pc board patterns, dimensions, and tolerances are shown in Figure 11.
Consult the customer drawings for specific pc board layouts or part numbers not listed in this document. Component
side shown. See Paragraph 2.3.
NOTE
i
Figure 11 (cont’d)
Dual Row SMT Right- Angle
SMT Holddowns
Dual Row Through Hole
Vertical Metal Through Hole Holddowns
NOTE: Board edge dimensions determined by customer
NOTE: Board edge dimensions determined by customer
Micro MATE- N- LOK Connectors 114- 13000
Rev B10 of 19 Tyco Electronics Corporation
CONN
I
M
Y
O
POSN DIM
Y
24.30
47.30
610.30
813.30
10 16.30
12 19.30
14 22.30
16 25.30
18 28.30
20 31.30
22 34.30
24 37.30
CONN DIMENSION
O
POSN W Z
27.30 --
410.30 3.00
613.30 6.00
816.30 9.00
10 19.30 12.00
12 22.30 15.00
14 25.30 18.00
16 28.30 21.00
18 31.30 24.00
20 34.30 27.00
22 37.30 30.00
24 40.30 33.00
Figure 11 (end)
Single Row SMT Vertical
Metal Thru-Hole Holddowns
Single Row Thru- Hole Right- Angle
Plastic Holddowns
PC Board Layout
for 2--Position
PC Board Layout
for 4--Position
PC Board Layout
for 3--Position
Micro MATE- N- LOK Connectors 114- 13000
Rev B11 of 19Tyco Electronics Corporation
O
DIMENSION
O
POSN V Z
27.40 3.00
310.40 6.00
413.40 9.00
516.40 12.00
619.40 15.00
722.40 18.00
825.40 21.00
928.40 24.00
10 31.40 27.00
11 34.40 30.00
12 37.40 33.00
O
DIMENSION
O
POSN V Z
2-- --
3-- --
44.70 9.00
57.70 12.00
610.70 15.00
713.70 18.00
816.70 21.00
919.70 24.00
10 22.70 27.00
11 25.70 30.00
12 28.70 33.00
Micro MATE- N- LOK Connectors 114- 13000
Rev B12 of 19 Tyco Electronics Corporation
3.11. Soldering Process
After the connector is seated onto the pc board, the mechanical boardlocks must be soldered along with the contacts
during the soldering process. Plastic boardlocks are not soldered.
Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all contacts according to
the following:
A. Recommended Solder Paste Characteristics
1. Alloy type must be 63 Sn/37 Pb or 60 Sn/40 Pb.
2. Flux must be RMA type.
3. Solids by weight must be 85% minimum.
4. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print must be 5¢10% cp (centipoise).
6. Minimum viscosity of stencil print must be 7.5¢10% cp (centipoise).
B. Solder Paste Thickness
Solder paste thickness for the solder tines must be 0.22--0.25 mm.
C. Stencil
Stencil aperture is determined by the size of the circuit pad and thickness of the stencil. Generally, thinner
stencils will need larger apertures to maintain a given volume of solder paste. Stencil thickness must range
from 0.20 to 0.25 mm. Typically, a stencil thickness of 0.22 mm with apertures slightly smaller than the pad
layout will provide satisfactory results. Solder deposition should be within each pad area.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away, producing a weak solder joint.
If a hold--down aperture is used, the design must ensure that the connector housing will not sit on the solder deposit.
D. Solder Volume
Minimum solder volume (before curing) for each solder pad and boardlock pad is calculated by multiplying
the pad length by the pad width by the stencil thickness. Recommended solder volume deposit (wet paste
per solder pad) must be:
0.71 mm3per contact solder tine for vertical pin header connectors
0.81 mm3per contact solder tine for right angle pin header connectors
1.24 mm3per boardlock
Solder volume may vary depending on solder paste composition.
E. Solder Mask
Solder mask is recommended between all pads. If a trace is run between adjacent pads on the solder side
of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of solder
away from the contact solder tines. Additionally, there should be solder mask covering any traces in the
area of the boardlock (if applicable) solder deposit. Liquid photo imageable or dry film solder masks are
recommended.
NOTE
i
CAUTION
!
CAUTION
!
NOTE
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Micro MATE- N- LOK Connectors 114- 13000
Rev B13 of 19Tyco Electronics Corporation
F. Flux Selection
Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the
flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call
Product Information Center at the number at the bottom of page 1 for consideration of other types of flux.
Flux that is compatible with these pin headers are provided in Figure 12.
F
L
X
T
Y
P
E
T
I
V
I
T
Y
E
S
I
E
COMMERCIAL DESIGNATION
F
L
X
T
Y
P
E
T
I
V
I
T
Y
E
S
I
E
KESTER ALPHA
RMA Mild Noncorrosive 186 611
Figure 12
G. Connector Placement
If connectors are placed on the board manually, the connector should be handled only by the housing to avoid
deformation, contamination, or damage to the contact solder tines and boardlocks.
1. Surface Mount Connectors
Optimally, the contact solder tines should be centered on the pc board circuit pads. However, slight
misalignment is permissible as shown in Figure 13.
PC Board
Contact Solder Tine Centered on
PC Board Circuit Pad Preferred
Contact Solder Tine Overhang
Up to 50% is Permissible
Figure 13
2. Through Hole Mount Connectors
When placing through hole mount connectors on the pc board, make sure that the contact solder tines
are aligned and started into the matching holes before seating the connector onto the pc board.
H. Technique
The connectors can be soldered using wave, non--focused infrared (IR) reflow soldering, or equivalent
soldering technique. It is recommended using SN60 or SN62 solder for these connectors. The
temperatures and exposure time must be as specified in Figure 14.
SOLDERING PROCESS TEMPERATURE (Max) TIME (Max)
Wave 260_C [500_F] 5 Seconds
IR 225_C [378_F] 90 Seconds
Figure 14
CAUTION
!
Micro MATE- N- LOK Connectors 114- 13000
Rev B14 of 19 Tyco Electronics Corporation
I. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. The following is a list of common cleaning solvents that will not the affect connectors for the
time and temperature specified. See Figure 15.
Even when using “no clean” solder paste, it is imperative that the contact interface be kept clean of flux and residue,
since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore,
cleaning is necessary.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. It is not
recommended using Trichloroethylene and Methylene Chloride because of harmful occupational and environmental
effects. Both are carcinogenic (cancer--causing).
If you have a particular solvent that is not listed, contact the Product Information Center at the number at the bottom of
page 1.
CLEANER TIME
(
M
i
n
u
t
e
s
)
TEMPERATURES
(Maximum)
NAME TYPE (Minutes
)
CELSIUS FAHRENHEIT
ALPHA 2110 Aqueous 1132 270
BIOACT EC--7 Solvent 5100 212
Butyl CARBITOL Solvent 1Room Ambient
Isopropyl Alcohol Solvent 5100 212
KESTER 5778 Aqueous 5100 212
KESTER 5779 Aqueous 5100 212
LONCOTERGE 520 Aqueous 5100 212
LONCOTERGE 530 Aqueous 5100 212
Terpene Solvent Solvent 5100 212
Figure 15
J. Drying
When drying cleaned assemblies, make certain that temperature limitations are not exceeded: --40_to
105_C[--68_to 221_F]. Excessive temperatures may cause housing degradation or plating deterioration.
3.12. Checking Installed Connector
All solder joints should conform to the requirements specified in this document and those specified in the
following: Workmanship Specification 101--21 for surface mount connectors
Test Specification 109--11 for through hole mount connectors
Solder must be evenly distributed and not cracked. The connector standoffs must be seated on the pc board,
and the housing not exceeding the dimension shown in Figure 16.
CAUTION
!
DANGER
NOTE
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Micro MATE- N- LOK Connectors 114- 13000
Rev B15 of 19Tyco Electronics Corporation
Figure 16
Through Hole Mount
Pin Header Connector
Surface Mount
Pin Header Connector
Solder Joint
PC Board
0.13 (Max)
0.13 (Max)
PC Board
Solder Joint
Standoff
(4 Places) Standoff
(2 Places)
3.13. Polarization
The design of each contact cavity assures polarization for mating connectors.
3.14. Mating Connectors
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact
solder tines.
The receptacle has an integral locking latch that should be fully seated and latched to the pin header locking
tab after mating. The locking latch and locking tab ensures positive mating of connectors. The distance
between mating connectors must be considered when determining location of connectors to ensure full mating.
The mated dimension of the receptacle housing to the pin header housing is provided in Figure 17.
Receptacles will mate only with the appropriate pin headers or plug housings; the receptacle and pin header or plug
housing must have identical number of circuit positions and rows.
Figure 17
17.3GMax
Distance
Pin Header (Right Angle
Surface Mount Shown)
Receptacle
Locking Latch Fully
Seated onto Locking Tab
GDimension applies to both through hole and surface mount,
and right angle and vertical pin headers when mated.
PC Board
3.15. Strain Relief and Wire Dress
If required, wires can be bundled together and supported with cable ties. Wires must not be stretched or
confined in any way that would restrict the floating action of the contacts. Therefore, the wires must remain
perpendicular to the connector and avoid an excessively sharp bend radius. The minimum distance for the
cable tie, measured from the wire end of the connector to the cable tie is shown in Figure 18.
CAUTION
!
NOTE
i
Micro MATE- N- LOK Connectors 114- 13000
Rev B16 of 19 Tyco Electronics Corporation
F
i
gu
r
e1
8
Cable Tie
76.2 Min
Distance
Wires
3.16. Repair
Damaged connectors must be removed, discarded, and replaced.
1. The connectors must be unmated by releasing the locking latch on the receptacle from the locking tab
on the pin header and pulling the receptacle straight out.
2. Damaged or worn crimp type contacts may be replaced provided there is sufficient slack, after
restripping the wire, to insert the new contact into the receptacle. An extraction tool must be used to
remove individual contacts from the receptacle.
3. Pin headers will require standard de--soldering of all contact solder tines. Individual solder type
contacts cannot be replaced.
4. QUALIFICATION
Micro MATE--N--LOK connectors are Recognized by Underwriters Laboratories Inc. (UL) in File E28476, and
Certified by the CSA International in File LR7189.
5. TOOLING
Tooling part numbers and instructional material packaged (if available) with the tooling are shown in Figure 19.
5.1. Extraction and Lance Reset Tool
The extraction and lance reset tool is designed to remove contacts from the receptacles by releasing the
contact locking lance from the housing without overstressing the contact. This tool can also be used to reset
locking lances that have been deformed.
5.2. Hand Crimping Tool
The hand crimping tools accommodate the full wire size range for terminating crimp type contacts. These tools
are designed for prototype and low--volume application of loose piece form contacts.
5.3. Robotic Equipment
For automatic machine placement, a pc board support must be used to prevent bowing of the pc board during
the placement of contacts and boardlocks on the board. It should have flat surfaces with holes or a channel
large enough and deep enough to receive the contacts and boardlocks. The robotic equipment must have a
true position accuracy tolerance to properly locate the contacts. This includes gripper and fixture tolerances as
well as equipment repeatability. It must use the contact datum surfaces detailed on the customer drawing to
ensure reliable placement.
5.4. Power Unit
Modified designs and additional tooling concepts may be available to meet other application requirements. Machines
have been designed for a variety of application requirements. For assistance in setting up prototype and production
line equipment, call the Tooling Assistance Center at the number at the bottom of page 1.
NOTE
i
Micro MATE- N- LOK Connectors 114- 13000
Rev B17 of 19Tyco Electronics Corporation
A. Applicator
The applicators are designed to crimp strip form contacts onto pre--stripped wire, and provides for high
volume, heavy duty production requirements. These applicators accept interchangeable crimping dies and
must be installed onto a power unit.
B. Semi- Automatic Machine
The AMP--O--LECTRIC machine is an electrical power unit designed for terminating pre--stripped wires to
reel--fed contacts. It is designed to be bench mounted and used for high volume applications.
C. Automatic Machine
These power units provide the force required to drive applicators for crimping tape--mounted contacts.
They can be set up to automatically measure, cut, strip, and terminate wire. They provide for high volume,
heavy duty production requirements. The AMPOMATOR CLS IV+ machine is an electrical power unit
designed to be floor standing.
WIRE
APPLICATOR (408--8040) for
W
I
E
SIZE
RANGE
(AWG)
HAND
CRIMPING
TOOL
AMP--O--LECTRIC
Model “K”
Terminating Machine
AMP--O--LECTRIC
Model “G” and ELT
Terminating Machines
AMPOMATOR
CLS
Lead--Making Machines
3
0
2
6
9
1
5
0
2
1
680894--2 (Recept) 680894--3 (Recept) Z680894--1Z(Recept)
30--26 91502--1 1385377--2 (Plug) 1385377--3 (Plug) 1385377--1 (Plug)
2
4
2
0
9
1
5
0
1
1
680893--2 (Recept) 680893--3 (Recept) 680893--1 (Recept)
24--20 91501--1 1385194--2 (Plug) 1385194--3 (Plug) 1385194--1 (Plug)
Figure 19 (cont’d)
ZProcesseswiresize26AWGonly.
Micro MATE- N- LOK Connectors 114- 13000
Rev B18 of 19 Tyco Electronics Corporation
PC Board Support
(Must Be Custom Made)
AMP--O--LECTRIC Model “K”
Terminator Machine
565435--5
Hand Crimping Tool
(See Table)
Heavy Duty Miniature
Quick--Change
Applicators (Side--Feed
Type) (See Table)
Extraction and Lance
Reset Tool 843996--6
Robotic
Equipment
AMPOMATOR CLS
Lead--Making Machines
122500--[ ]; 217500--[ ];
356500--[ ]
AMP--O--LECTRIC Model “G”
Terminating Machine 354500--[ ]
with Optional Stripping Module
ELT Machine 1338600--[ ]
with Optional Stripping
Module
Figure 19 (end)
Micro MATE- N- LOK Connectors 114- 13000
Rev B19 of 19Tyco Electronics Corporation
6. VISUAL AID
Figure 20 shows a typical application of Micro MATE--N--LOK connectors. This illustration should be used by
production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should
be inspected using the information in the preceding pages of this specification and in the instructional material
shipped with the product or tooling.
FIGURE 20. VISUAL AID
HOUSING MUST
NOT BE CRACKED
OR BROKEN
CONNECTOR MUST BE
SEATEDONPCBOARD
CONTACTS MUST BE
LOCKED IN PLACE
SOLDER FILLET MUST BE
FORMED EVENLY AROUND
CONTACT SOLDER TINES
AND MECHANICAL
BOARDLOCKS
LOCKING LATCH MUST BE
FULLY SEATED ONTO
LOCKING TAB
INSULATION BARREL (“F” CRIMP)
MUST BE FOLDED INWARD AND
GRASP WIRE INSULATION
LOCKING
LANCE MUST
NOT BE
DEFORMED
WIRE BARREL (“F” CRIMP) MUST BE
FOLDED INWARD WITH NO PROTRUDING
OR VISIBLE WIRE STRANDS
WIRE INSULATION
AND CONDUCTORS
MUST BE VISIBLE IN
TRANSITION AREA
CONTACT MUST
BE STRAIGHT AND
NOT DEFORMED
IN ANY WAY
SOLDER TINES MUST
BE CENTERED ON
CIRCUIT PADS (SLIGHT
MISALIGNMENT IS
ALLOWED)
ORIENTATION BARREL MUST
NOT BE DEFORMED
SPRING MEMBER MUST
NOT BE DAMAGED OR
DISTORTED
LOCKING LATCH MUST BE
FULLY SEATED ONTO
LOCKING TAB
CONNECTORS
MUST BE FULLY
MATED