PIC18F4431-I/PT - MICROCHIP

 2010 Microchip Technology Inc. DS39616D

PIC18F2331/2431/4331/4431

Data Sheet

28/40/44-Pin Enhanced Flash

Microcontrollers with nanoWatt Technology,

High-Performance PWM and A/D

DS39616D-page 2  2010 Microchip Technology Inc.

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ISBN: 978-1-60932-490-2

Note the following details of the code protection feature on Microch ip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

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• Microchip is willing to work with the customer who is concerned about the integrity of their code.

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mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

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Microchip received ISO/TS-16949:2002 certification for its worldwide

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 2010 Microchip Technology Inc. DS39616D-page 3

14-Bit Power Control PWM Module:

• Up to 4 Channels with Complementary Outputs

• Edge or Center-Aligned Operation

• Flexible Dead-Band Generator

• Hardware Fault Protection Inputs

• Simultaneous Update of Duty Cycle and Period:

- Flexible Special Event Trigger output

Motion Feedback Module:

• Three Independent Input Capture Channels:

- Flexible operating modes for period and

pulse-width measurement

- Special Hall sensor interface module

- Special Event Trigger output to other modules

• Quadrature Encoder Interface:

- 2-phase inputs and one index input from

encoder

- High and low position tracking with direction

status and change of direction interrupt

- Velocity measurement

High -Speed , 20 0 k sps 10 - Bit A/D Co nv ert er :

• Up to 9 Channels

• Simultaneous, Two-Channel Sampling

• Sequential Sampling: 1, 2 or 4 Selected Channels

• Auto-Conversion Capability

• 4-Word FIFO with Selectable Interrupt Frequency

• Selectable External Conversion Triggers

• Programmable Acquisition Time

Flexible Oscil lator Struc ture:

• Four Crystal modes up to 40 MHz

• Two External Clock modes up to 40 MHz

• Internal Oscillator Block:

- 8 user-selectable frequencies: 31 kHz to 8 MHz

- OSCTUNE can compensate for frequency drift

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor:

- Allows for safe shutdown of device if clock fails

Power-Managed Modes:

• Run: CPU on, Peripherals on

• Idle: CPU off, Peripherals on

• Sleep: CPU off, Peripherals off

• Ultra Low, 50 nA Input Leakage

• Idle mode Currents Down to 5.8 A, Typical

• Sleep Current Down to 0.1 A, Typical

• Timer1 Oscillator, 1.8 A, Typical, 32 kHz, 2V

• Watchdog Timer (WDT), 2.1 A, typical

• Oscillator Two-Speed Start-up

- Fast wake from Sleep and Idle, 1 s, typical

Peripheral Highl ight s:

• High-Current Sink/Source 25 mA/25 mA

• Three External Interrupts

• Two Capture/Compare/PWM (CCP) modules

• Enhanced USART module:

- Supports RS-485, RS-232 and LIN/J2602

- Auto-wake-up on Start bit

- Auto-Baud Detect

S pecial Microcontroller Features:

• 100,000 Erase/Write Cycle Enhanced Flash

Program Memory, Typical

• 1,000,000 Erase/Write Cycle Data EEPROM

Memory, Typical

• Flash/Data EEPROM Retention: 100 Years

• Self-Programmable under Software Control

• Priority Levels for Interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT):

- Programmable period from 41 ms to 131s

• Single-Supply In-Circuit Serial Programming™

(ICSP™) via Two Pins

• In-Circuit Debug (ICD) via Two Pins:

- Drives PWM outputs safely when debugging

Device

Progra m Memory Dat a Memor y

I/O 10-Bit

A/D (ch) CCP

SSP

EUSART

Quadrature

Encoder

14-Bit

PWM

(ch)

Timers

8/16-Bit

Flash

(bytes) # Single-Word

Instructions SRAM

(bytes) EEPROM

(bytes) SPI Slav e

I2C™

PIC18F2331 8192 4096 768 256 24 5 2 Y Y Y Y 6 1/3

PIC18F2431 16384 8192 768 256 24 5 2 Y Y Y Y 6 1/3

PIC18F4331 8192 4096 768 256 36 9 2 Y Y Y Y 8 1/3

PIC18F4431 16384 8192 768 256 36 9 2 Y Y Y Y 8 1/3

28/40/4 4-Pin En hanc e d Flash Microcontrollers with

nanoWatt Technology, High-Performance PWM and A/D

PIC18F2331/2431/4331/4431

DS39616D-page 4  2010 Microchip Technology Inc.

Pin Diag r ams

28-Pin SPDIP, SOIC

MCLR/VPP

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CAP1/INDX

RA3/AN3/VREF+/CAP2/QEA

RA4/AN4/CAP3/QEB

AVDD

AVSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2/FLTA

RC2/CCP1

RC3/T0CKI/T5CKI/INT0

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PWM4/PGM

RB4/KBI0/PWM5

RB3/PWM3

RB2/PWM2

RB1/PWM1

RB0/PWM0

VDD

VSS

RC7/RX/DT/SDO

RC6/TX/CK/SS

RC5/INT2/SCK/SCL

RC4/INT1/SDI/SDA

PIC18F2331/2431

28-Pin QFN(1)

PIC18F2331

RC0/T1OSO/T1CKI

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PWM4/PGM

RB4/KBI0/PWM5

RB3/PWM3

RB2/PWM2

RB1/PWM1

RB0/PWM0

VDD

VSS

RC7/RX/DT/SDO

RC6/TX/CK/SS

RC5/INT2/SCK/SCL

RC4/INT1/SDI/SDA

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CAP1/INDX

RA3/AN3/VREF+/CAP2/QEA

RA4/AN4/CAP3/QEB

AVDD

AVSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC1/T1OSI/CCP2/FLTA

RC2/CCP1

RC3/T0CKI/T5CKI/INT0

PIC18F2431

MCLR/VPP

Note 1: For the QFN package, it is recommended that the bottom pad be connected to VSS.

 2010 Microchip Technology Inc. DS39616D-page 5

PIC18F2331/2431/4331/4431

Pin Diagrams (Continued)

40-Pin PDIP

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PWM4/PGM

RB4/KBI0/PWM5

RB3/PWM3

RB2/PWM2

RB1/PWM1

RB0/PWM0

VDD

VSS

RD7/PWM7

RD6/PWM6

RD5/PWM4(3)

RD4/FLTA(2)

RC7/RX/DT/SDO

RC6/TX/CK/SS

RC5/INT2/SCK(1)/SCL(1)

RC4/INT1/SDI(1)/SDA(1)

RD3/SCK/SCL

RD2/SDI/SDA

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CAP1/INDX

RA3/AN3/VREF+/CAP2/QEA

RA4/AN4/CAP3/QEB

RA5/AN5/LVDIN

RE0/AN6

RE1/AN7

RE2/AN8

AVDD

AVSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2/FLTA

RC2/CCP1/FLTB

RC3/T0CKI(1)/T5CKI(1)/INT0

RD0/T0CKI/T5CKI

RD1/SDO

PIC18F4331/4431

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 6  2010 Microchip Technology Inc.

Pin Diagrams (Continued)

44-Pin TQFP

PIC18F4331

RA3/AN3/VREF+/CAP2/QEA

RA2/AN2/VREF-/CAP1/INDX

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PWM4/PGM

RB4/KBI0/PWM5

RC6/TX/CK/SS

RC5/INT2/SCK(1)/SCL(1)

RC4/INT1/SDI(1)/SDA(1)

RD3/SCK/SCL

RD2/SDI/SDA

RD1/SDO

RD0/T0CKI/T5CKI

RC3/T0CKI(1)/T5CKI(1)/INT0

RC2/CCP1/FLTB

RC1/T1OSI/CCP2/FLTA

RC0/T1OSO/T1CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

AVSS

AVDD

RE2/AN8

RE1/AN7

RE0/AN6

RA5/AN5/LVDIN

RA4/AN4/CAP3/QEB

RC7/RX/DT/SDO

RD4/FLTA(2)

RD5/PWM4(3)

RD6/PWM6

RD7/PWM7

VSS

VDD

RB0/PWM0

RB1/PWM1

RB2/PWM2

RB3/PWM3

PIC18F4431

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

 2010 Microchip Technology Inc. DS39616D-page 7

PIC18F2331/2431/4331/4431

Pin Diagrams (Continued)

44-Pin QFN(2)

PIC18F4331

RA3/AN3/VREF+/CAP2/QEA

RA2/AN2/VREF-/CAP1/INDX

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB3/PWM3

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PWM4/PGM(2)

RB4/KBI0/PWM5

RC6/TX/CK/SS

RC5/INT2/SCK(1)/SCL(1)

RC4/INT1/SDI(1)/SDA(1)

RD3/SCK/SCL

RD2/SDI/SDA

RD1/SDO

RD0/T0CKI/T5CKI

RC3/T0CKI(1)/T5CKI(1)/INT0

RC2/CCP1/FLTB

RC1/T1OSI/CCP2/FLTA

RC0/T1OSO/T1CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

VSS

AVDD

VDD

RE2/AN8

RE1/AN7

RE0/AN6

RA5/AN5/LVDIN

RA4/AN4/CAP3/QEB

RC7/RX/DT/SDO

RD4/FLTA(3)

RD5/PWM4(4)

RD6/PWM6

RD7/PWM7

VSS

VDD

AVDD

RB0/PWM0

RB1/PWM1

RB2/PWM2

PIC18F4431

AVSS

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL.

2: For the QFN package, it is recommended that the bottom pad be connected to VSS.

3: RD4 is the alternate pin for FLTA.

4: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 8  2010 Microchip Technology Inc.

Table of Contents

1.0 Device Overview ........................................................................................................................................................................ 11

2.0 Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 25

3.0 Oscillator Configurations ............................................................................................................................................................ 29

4.0 Power-Managed Modes ............................................................................................................................................................. 39

5.0 Reset .......................................................................................................................................................................................... 47

6.0 Memory Organization ................................................................................................................................................................. 61

7.0 Data EEPROM Memory ............................................................................................................................................................. 79

8.0 Flash Program Memory.............................................................................................................................................................. 85

9.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 95

10.0 Interrupts .................................................................................................................................................................................... 97

11.0 I/O Ports ................................................................................................................................................................................... 113

12.0 Timer0 Module ......................................................................................................................................................................... 127

13.0 Timer1 Module ......................................................................................................................................................................... 131

14.0 Timer2 Module ......................................................................................................................................................................... 136

15.0 Timer5 Module ......................................................................................................................................................................... 139

16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 145

17.0 Motion Feedback Module ......................................................................................................................................................... 151

18.0 Power Control PWM Module .................................................................................................................................................... 173

19.0 Synchronous Serial Port (SSP) Module ................................................................................................................................... 205

20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217

21.0 10-Bit High-Speed Analog-to-Digital Converter (A/D) Module ................................................................................................. 239

22.0 Low-Voltage Detect (LVD)........................................................................................................................................................ 257

23.0 Special Features of the CPU.................................................................................................................................................... 263

24.0 Instruction Set Summary .......................................................................................................................................................... 283

25.0 Development Support............................................................................................................................................................... 325

26.0 Electrical Characteristics .......................................................................................................................................................... 329

27.0 Packaging Information.............................................................................................................................................................. 363

Appendix A: Revision History............................................................................................................................................................. 375

Appendix B: Device Differences......................................................................................................................................................... 375

Appendix C: Conversion Considerations ........................................................................................................................................... 376

Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 376

Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 377

Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 377

INDEX ................................................................................................................................................................................................ 379

The Microchip Web Site..................................................................................................................................................................... 389

Customer Change Notification Service .............................................................................................................................................. 389

Customer Support .............................................................................................................................................................................. 389

Reader Response .............................................................................................................................................................................. 390

Product Identification System............................................................................................................................................................. 391

 2010 Microchip Technology Inc. DS39616D-page 9

PIC18F2331/2431/4331/4431

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Customer No tific atio n Syst em

PIC18F2331/2431/4331/4431

DS39616D-page 10  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 11

PIC18F2331/2431/4331/4431

1.0 DEVICE OVERVIEW

This document contains device-specific information for

the following devices:

This family offers the advantages of all PIC18

microcontrollers – namely, high computational

performance at an economical price, with the addition of

high-endurance enhanced Flash program memory and a

high-speed 10-bit A/D Converter. On top of these

features, the PIC18F2331/2431/4331/4431 family

introduces design enhancements that make these micro-

controllers a logical choice for many high-performance,

power control and motor control applications. These

special peripherals include:

• 14-Bit Resolution Power Control PWM module

(PCPWM) with Programmable Dead-Time Insertion

• Motion Feedback Module (MFM), including a

3-Channel Input Capture (IC) module and

Quadrature Encoder Interface (QEI)

• High-Speed 10-Bit A/D Converter (HSADC)

The PCPWM can generate up to eight complementary

PWM outputs with dead-band time insertion. Overdrive

current is detected by off-chip analog comparators or

the digital Fault inputs (FLTA, FLTB).

The MFM Quadrature Encoder Interface provides

precise rotor position feedback and/or velocity

measurement. The MFM 3x input capture or external

interrupts can be used to detect the rotor state for

electrically commutated motor applications using Hall

sensor feedback, such as BLDC motor drives.

PIC18F2331/2431/4331/4431 devices also feature

Flash program memory and an internal RC oscillator

with built-in LP modes.

1.1 New Core Features

1.1.1 nanoWatt Technology

All of the devices in the PIC18F2331/2431/4331/4431

family incorporate a range of features that can signifi-

cantly reduce power consumption during operation.

Key items include:

•Alternate Run Modes: By clocking the controller

from the Timer1 source or the internal oscillator

block, power consumption during code execution

can be reduced by as much as 90%.

•Multiple Idle Modes: The controller can also run

with its CPU core disabled, but the peripherals are

still active. In these states, power consumption

can be reduced even further, to as little as 4% of

normal operation requirements.

•On-t he-F ly Mode Switching: The power-

managed modes are invoked by user code

during operation, allowing the user to incorporate

power-saving ideas into their application’s

software design.

•Lower Consumption in Key Modules: The

power requirements for both Timer1 and the

Watchdog Timer have been reduced by up to

80%, with typical values of 1.1 and 2.1 A,

respectively.

1.1.2 MULTIPLE OSCILLATOR OPTIONS

AND FEATURES

All of the devices in the PIC18F2331/2431/4331/4431

family offer nine different oscillator options, allowing

users a wide range of choices in developing application

hardware. These include:

• Four Crystal modes, using crystals or ceramic

resonators.

• Two External Clock modes, offering the option of

using two pins (oscillator input and a divide-by-4

clock output) or one pin (oscillator input, with the

second pin reassigned as general I/O).

• Two External RC Oscillator modes, with the same

pin options as the External Clock modes.

• An internal oscillator block, which provides an

8 MHz clock and an INTRC source (approxi-

mately 31 kHz, stable over temperature and VDD),

as well as a range of 6 user-selectable clock

frequencies (from 125 kHz to 4 MHz) for a total of

8 clock frequencies.

• A Phase Lock Loop (PLL) frequency multiplier,

available to both the High-Speed Crystal and

Internal Oscillator modes, which allows clock

speeds of up to 40 MHz. Used with the internal

oscillator, the PLL gives users a complete selection

of clock speeds, from 31 kHz to 32 MHz – all

without using an external crystal or clock circuit.

•Fail-Safe Clock Monitor: This option constantly

monitors the main clock source against a

reference signal provided by the internal

oscillator. If a clock failure occurs, the controller is

switched to the internal oscillator block, allowing

for continued low-speed operation or a safe

application shutdown.

•Two-Speed S tart-up: This option allows the

internal oscillator to serve as the clock source

from Power-on Reset, or wake-up from Sleep

mode, until the primary clock source is available.

• PIC18F2331 • PIC18LF2331

• PIC18F2431 • PIC18LF2431

• PIC18F4331 • PIC18LF4331

• PIC18F4431 • PIC18LF4431

PIC18F2331/2431/4331/4431

DS39616D-page 12  2010 Microchip Technology Inc.

1.2 Other Special Features

•Memory Endurance: The enhanced Flash cells

for both program memory and data EEPROM are

rated to last for many thousands of erase/write

cycles – up to 100,000 for program memory and

1,000,000 for EEPROM. Data retention without

refresh is conservatively estimated to be greater

than 100 years.

•Self-Programmability: These devices can write

to their own program memory spaces under inter-

nal software control. By using a bootloader routine

located in the protected boot block at the top of

program memory, it becomes possible to create

an application that can update itself in the field.

•Power Control PWM Module : In PWM mode,

this module provides 1, 2 or 4 modulated outputs

for controlling half-bridge and full-bridge drivers.

Other features include auto-shutdown on Fault

detection and auto-restart to reactivate outputs

once the condition has cleared.

•Enhanced Addressable USART: This serial

communication module is capable of standard

RS-232 operation and provides support for the

LIN/J2602 bus protocol. Other enhancements

include automatic baud rate detection and a 16-bit

Baud Rate Generator for improved resolution.

When the microcontroller is using the internal

oscillator block, the EUSART provides stable

operation for applications that talk to the outside

world without using an external crystal (or its

accompanying power requirement).

•Extended Watchdog Timer (WDT): This

enhanced version incorporates a 16-bit prescaler,

allowing an extended time-out range that is stable

across operating voltage and temperature. See

Section 26.0 “Electrical Characteristics” for

time-out periods.

•High-Speed 10-Bit A/D Converter: This module

incorporates programmable acquisition time,

allowing for a channel to be selected and a

conversion to be initiated without waiting for a

sampling period and thus, reducing code

overhead.

•Motion Feedback Module (MFM): This module

features a Quadrature Encoder Interface (QEI)

and an Input Capture (IC) module. The QEI

accepts two phase inputs (QEA, QEB) and one

index input (INDX) from an incremental encoder.

The QEI supports high and low precision position

tracking, direction status and change of direction

interrupt and velocity measurement. The input

capture features 3 channels of independent input

capture with Timer5 as the time base, a Special

Event Trigger to other modules and an adjustable

noise filter on each IC input.

•Extended Watchdog Timer (WDT): This

enhanced version incorporates a 16-bit prescaler,

allowing a time-out range from 4 ms to over

2 minutes, that is stable across operating voltage

and temperature.

 2010 Microchip Technology Inc. DS39616D-page 13

PIC18F2331/2431/4331/4431

1.3 Details on Indivi dual Family

Members

Devices in the PIC18F2331/2431/4331/4431 family are

available in 28-pin (PIC18F2331/2431) and 40/44-pin

(PIC18F4331/4431) packages. The block diagram for

the two groups is shown in Figure 1-1.

The devices are differentiated from each other in three

ways:

1. Flash program memory (8 Kbytes for

PIC18F2331/4331 devices, 16 Kbytes for

PIC18F2431/4431).

2. A/D channels (5 for PIC18F2331/2431 devices,

9 for PIC18F4331/4431 devices).

3. I/O ports (3 bidirectional ports on PIC18F2331/

2431 devices, 5 bidirectional ports on

PIC18F4331/4431 devices).

All other features for devices in this family are identical.

These are summarized in Ta b l e 1 - 1 .

The pinouts for all devices are listed in Table 1 -2 and

Table 1-3.

Like all Microchip PIC18 devices, members of the

PIC18F2331/2431/4331/4431 family are available as

both standard and low-voltage devices. Standard

devices with Enhanced Flash memory, designated with

an “F” in the part number (such as PIC18F2331),

accommodate an operating VDD range of 4.2V to 5.5V.

Low-voltage parts, designated by “LF” (such as

PIC18LF2331), function over an extended VDD range

of 2.0V to 5.5V.

TABLE 1-1: DEVICE FEATURES

Features PIC18F2331 PIC18F2431 PIC18F4331 PIC18F4431

Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz

Program Memory (Bytes) 8192 16384 8192 16384

Program Memory (Instructions) 4096 8192 4096 8192

Data Memory (Bytes) 768 768 768 768

Data EEPROM Memory (Bytes) 256 256 256 256

Interrupt Sources 22 22 34 34

I/O Ports Ports A, B, C Ports A, B, C Ports A, B, C, D, E Ports A, B, C, D, E

Timers 4 4 4 4

Capture/Compare/PWM modules 2 2 2 2

14-Bit Power Control PWM (6 Channels) (6 Channels) (8 Channels) (8 Channels)

Motion Feedback Module

(Input Capture/Quadrature

Encoder Interface)

1 QEI

3x IC

1 QEI

3x IC

1 QEI

3x IC

1 QEI

3x IC

Serial Communications SSP,

Enhanced USART

SSP,

Enhanced USART

SSP,

Enhanced USART

SSP,

Enhanced USART

10-Bit High-Speed

Analog-to-Digital Converter module

5 Input Channels 5 Input Channels 9 Input Channels 9 Input Channels

Resets (and Delays) POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

Programmable Low-Voltage Detect Yes Yes Yes Yes

Programmable Brown-out Reset Yes Yes Yes Yes

Instruction Set 75 Instructions 75 Instructions 75 Instructions 75 Instructions

Packages 28-pin SPDIP

28-pin SOIC

28-pin QFN

28-pin SPDIP

28-pin SOIC

28-pin QFN

40-pin PDIP

44-pin TQFP

44-pin QFN

40-pin PDIP

44-pin TQFP

44-pin QFN

PIC18F2331/2431/4331/4431

DS39616D-page 14  2010 Microchip Technology Inc.

FIGURE 1-1: PIC18F 2331/ 2431 (28- PIN) BL OCK DI AGRAM

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

Instruction

Decode &

Control

OSC1/CLKI

OSC2/CLKO

MCLR/VPP

VDD, VSS

PORTA

PORTB

PORTC

RA4/AN4/CAP3/QEB

RB0/PWM0

RB5/KBI1/PWM4/PGM

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2/FLTA

RC2/CCP1

RC4/INT1/SDI/SDA

RC5/INT2/SCK/SCL

RC6/TX/CK/SS

RC7/RX/DT/SDO

Brown-out

Reset

EUSART

Data EE Synchronous

Timer0 Timer1 Timer2

Serial Port

RA3/AN3/VREF+/CAP2/QEA

RA2/AN2/VREF-/CAP1/INDX

RA1/AN1

RA0/AN0

PCPWM

Timing

Generation

4x PLL

HS 10-Bit

ADC

RB1/PWM1

Data Latch

Data RAM

(768 bytes)

Address Latch

Address<12>

Bank 0, F

BSR FSR0

FSR1

FSR2

inc/dec

logic

Decode

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

BITOP

ALU<8>

Address Latch

Program

Data Latch

Table Pointer<21>

inc/dec logic

Data Bus<8>

Table Latch

ROM Latch

Timer5

PORTE

CCP1

RB2/PWM2

RB3/PWM3

T1OSI

T1OSO

PCLATU

PCU

OSC2/CLKO/RA6

Precision

Reference

Band Gap

RB4/KBI0/PWM5

RB6/KBI2/PGC

RB7/KBI3/PGD

RC3/T0CKI/T5CKI/INT0

CCP2

MCLR/VPP

OSC1/CLKI/RA7

Power-Managed

INTRC

OSC

AVDD, AVSS

Mode Logic

MFM

Memory

 2010 Microchip Technology Inc. DS39616D-page 15

PIC18F2331/2431/4331/4431

FIGURE 1- 2 : PIC18F 43 31/443 1 ( 40/ 44 -PIN ) BLOC K DIAGR AM

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

Instruction

Decode &

Control

OSC1/CLKI

OSC2/CLKO

MCLR/VPP

VDD, VSS

PORTA

PORTB

PORTC

RA4/AN4/CAP3/QEB

RA5/AN5/LVDIN

RB0/PWM0

RB5/KBI1/PWM4/PGM

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2/FLTA

RC2/CCP1/FLTB

RC4/INT1/SDI/SDA(3)

RC5/INT2/SCK/SCL(3)

RC6/TX/CK/SS

RC7/RX/DT/SDO

Brown-out

Reset

Note 1: RE3 is available only when MCLR is disabled.

2: RD4 is the alternate pin for FLTA.

3: RC3, RC4 and RC5 are alternate pins for T0CKI/T5CKI, SDI/SDA, SCK/SCL, respectively.

4: RD5 is the alternate pin for PWM4.

EUSART

Data EE Synchronous

Timer0 Timer1 Timer2

Serial Port

RA3/AN3/VREF+/CAP2/QEA

RA2/AN2/VREF-/CAP1/INDX

RA1/AN1

RA0/AN0

Timing

Generation

4x PLL

HS 10-Bit

ADC

RB1/PWM1

Data Latch

Data RAM

(768 bytes)

Address Latch

Address<12>

Bank 0, F

BSR FSR0

FSR1

FSR2

inc/dec

logic

Decode

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

BITOP

ALU<8>

Address Latch

Program Memory

Data Latch

Table Pointer<21>

inc/dec logic

Data Bus<8>

Table Latch

ROM Latch

Timer5

PORTE

RE0/AN6

RE1/AN7

RE2/AN8

CCP1

RB2/PWM2

RB3/PWM3

T1OSI

T1OSO

PCLATU

PCU

OSC2/CLKO/RA6

Precision

Reference

Band Gap

RB4/KBI0/PWM5

RB6/KBI2/PGC

RB7/KBI3/PGD

RC3/T0CKI/T5CKI/INT0(3)

CCP2

MCLR/VPP/RE3(1)

OSC1/CLKI/RA7

Power-Managed

INTRC

OSC

AVDD, AVSS

Mode Logic

PORTD RD0/IT0CKI/T5CKI

RD1/SDO

RD2/SDI/SDA

RD3/SCK/SCL

RD4/FLTA(2)

RD5/PWM4(4)

RD6/PWM6

RD7/PWM7

PCPWM MFM

PIC18F2331/2431/4331/4431

DS39616D-page 16  2010 Microchip Technology Inc.

TABLE 1-2: PIC18F2331/2431 PINOUT I/O DESCRIPTIONS

Pin Name

Pin Number Pin

Type Buffer

Type Description

SPDIP,

SOIC QFN

MCLR/VPP

MCLR

VPP

126

Master Clear (input) or programming voltage (input).

Master Clear (Reset) input. This pin is an active-low

Reset to the device.

High-voltage ICSP™ programming enable pin.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

I/O

CMOS

TTL

Oscillator crystal or external clock input.

Oscillator crystal input or external clock source input.

ST buffer when configured in RC mode; CMOS otherwise.

External clock source input. Always associated with pin

function OSC1. (See related OSC1/CLKI, OSC2/CLKO

pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

10 7

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal or

resonator in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO, which has 1/4

the frequency of OSC1 and denotes the instruction

cycle rate.

General purpose I/O pin.

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

227

I/O

TTL

Analog

Digital I/O.

Analog Input 0.

RA1/AN1

RA1

AN1

328

I/O

TTL

Analog

Digital I/O.

Analog Input 1.

RA2/AN2/VREF-/CAP1/INDX

RA2

AN2

VREF-

CAP1

INDX

I/O

TTL

Analog

Digital I/O.

Analog Input 2.

A/D reference voltage (low) input.

Input Capture Pin 1.

Quadrature Encoder Interface index input pin.

RA3/AN3/VREF+/CAP2/QEA

RA3

AN3

VREF+

CAP2

QEA

I/O

TTL

Analog

Digital I/O.

Analog Input 3.

A/D reference voltage (high) input.

Input Capture Pin 2.

Quadrature Encoder Interface Channel A input pin.

RA4/AN4/CAP3/QEB

RA4

AN4

CAP3

QEB

I/O

TTL

Analog

Digital I/O.

Analog Input 4.

Input Capture Pin 3.

Quadrature Encoder Interface Channel B input pin.

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

 2010 Microchip Technology Inc. DS39616D-page 17

PIC18F2331/2431/4331/4431

PORTB is a bidirectional I/O port. PORTB can be software

programmed for internal weak pull-ups on all inputs.

RB0/PWM0

RB0

PWM0

21 18

I/O

TTL

Digital I/O.

PWM Output 0.

RB1/PWM1

RB1

PWM1

22 19

I/O

TTL

Digital I/O.

PWM Output 1.

RB2/PWM2

RB2

PWM2

23 20

I/O

TTL

Digital I/O.

PWM Output 2.

RB3/PWM3

RB3

PWM3

24 21

I/O

TTL

Digital I/O.

PWM Output 3.

RB4/KBI0/PWM5

RB4

KBI0

PWM5

25 22

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

PWM Output 5.

RB5/KBI1/PWM4/PGM

RB5

KBI1

PWM4

PGM

26 23

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

PWM Output 4.

Single-Supply ICSP™ Programming entry pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

27 24

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming clock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

28 25

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming data pin.

TABLE 1-2: PIC18F2331/2431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type Buffer

Type Description

SPDIP,

SOIC QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

PIC18F2331/2431/4331/4431

DS39616D-page 18  2010 Microchip Technology Inc.

PORTC is a bidirectional I/O port.

RC0/T1OSO/T1CKI

RC0

T1OSO

T1CKI

11 8

I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1 external clock input.

RC1/T1OSI/CCP2/FLTA

RC1

T1OSI

CCP2

FLTA

12 9

I/O

Analog

Digital I/O.

Timer1 oscillator input.

Capture 2 input, Compare 2 output, PWM2 output.

Fault interrupt input pin.

RC2/CCP1

RC2

CCP1

13 10

I/O

Digital I/O.

Capture 1 input/Compare 1 output/PWM1 output.

RC3/T0CKI/T5CKI/INT0

RC3

T0CKI

T5CKI

INT0

14 11

I/O

Digital I/O.

Timer0 alternate clock input.

Timer5 alternate clock input.

External Interrupt 0.

RC4/INT1/SDI/SDA

RC4

INT1

SDI

SDA

15 12

I/O

I2C

Digital I/O.

External Interrupt 1.

SPI data in.

I2C™ data I/O.

RC5/INT2/SCK/SCL

RC5

INT2

SCK

SCL

16 13

I/O

I2C

Digital I/O.

External Interrupt 2.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C mode.

RC6/TX/CK/SS

RC6

17 14

I/O

—

TTL

Digital I/O.

EUSART asynchronous transmit.

EUSART synchronous clock (see related RX/DT).

SPI slave select input.

RC7/RX/DT/SDO

RC7

SDO

18 15

I/O

—

Digital I/O.

EUSART asynchronous receive.

EUSART synchronous data (see related TX/CK).

SPI data out.

VSS 8, 19 5, 16 P — Ground reference for logic and I/O pins.

VDD 7, 20 4, 17 P — Positive supply for logic and I/O pins.

TABLE 1-2: PIC18F2331/2431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type Buffer

Type Description

SPDIP,

SOIC QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

 2010 Microchip Technology Inc. DS39616D-page 19

PIC18F2331/2431/4331/4431

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

MCLR/VPP/RE3

MCLR

VPP

RE3

11818

Master Clear (input) or programming voltage (input).

Master Clear (Reset) input. This pin is an active-low

Reset to the device.

Programming voltage input.

Digital input. Available only when MCLR is disabled.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

13 30 32

I/O

CMOS

TTL

Oscillator crystal or external clock input.

Oscillator crystal input or external clock source input.

ST buffer when configured in RC mode; CMOS otherwise.

External clock source input. Always associated with pin

function OSC1. (See related OSC1/CLKI, OSC2/CLKO

pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

14 31 33

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal or resonator

in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO, which has 1/4 the

frequency of OSC1 and denotes the instruction cycle rate.

General purpose I/O pin.

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 20  2010 Microchip Technology Inc.

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

21919

I/O

TTL

Analog

Digital I/O.

Analog Input 0.

RA1/AN1

RA1

AN1

32020

I/O

TTL

Analog

Digital I/O.

Analog Input 1.

RA2/AN2/VREF-/CAP1/

INDX

RA2

AN2

VREF-

CAP1

INDX

42121

I/O

TTL

Analog

Digital I/O.

Analog Input 2.

A/D reference voltage (low) input.

Input Capture Pin 1.

Quadrature Encoder Interface index input pin.

RA3/AN3/VREF+/

CAP2/QEA

RA3

AN3

VREF+

CAP2

QEA

52222

I/O

TTL

Analog

Digital I/O.

Analog Input 3.

A/D reference voltage (high) input.

Input Capture Pin 2.

Quadrature Encoder Interface Channel A input pin.

RA4/AN4/CAP3/QEB

RA4

AN4

CAP3

QEB

62323

I/O

TTL

Analog

Digital I/O.

Analog Input 4.

Input Capture Pin 3.

Quadrature Encoder Interface Channel B input pin.

RA5/AN5/LVDIN

RA5

AN5

LVDIN

72424

I/O

TTL

Analog

Digital I/O.

Analog Input 5.

Low-Voltage Detect input.

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

 2010 Microchip Technology Inc. DS39616D-page 21

PIC18F2331/2431/4331/4431

PORTB is a bidirectional I/O port. PORTB can be software

programmed for internal weak pull-ups on all inputs.

RB0/PWM0

RB0

PWM0

33 8 9

I/O

TTL

Digital I/O.

PWM Output 0.

RB1/PWM1

RB1

PWM1

34 9 10

I/O

TTL

Digital I/O.

PWM Output 1.

RB2/PWM2

RB2

PWM2

35 10 11

I/O

TTL

Digital I/O.

PWM Output 2.

RB3/PWM3

RB3

PWM3

36 11 12

I/O

TTL

Digital I/O.

PWM Output 3.

RB4/KBI0/PWM5

RB4

KBI0

PWM5

37 14 14

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

PWM Output 5.

RB5/KBI1/PWM4/

PGM

RB5

KBI1

PWM4

PGM

38 15 15

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

PWM Output 4.

Single-Supply ICSP™ Programming entry pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

39 16 16

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming clock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

40 17 17

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming data pin.

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 22  2010 Microchip Technology Inc.

PORTC is a bidirectional I/O port.

RC0/T1OSO/T1CKI

RC0

T1OSO

T1CKI

15 32 34

I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1 external clock input.

RC1/T1OSI/CCP2/

FLTA

RC1

T1OSI

CCP2

FLTA

16 35 35

I/O

CMOS

Digital I/O.

Timer1 oscillator input.

Capture 2 input, Compare 2 output, PWM2 output.

Fault interrupt input pin.

RC2/CCP1/FLTB

RC2

CCP1

FLTB

17 36 36

I/O

Digital I/O.

Capture 1 input/Compare 1 output/PWM1 output.

Fault interrupt input pin.

RC3/T0CKI/T5CKI/

INT0

RC3

T0CKI(1)

T5CKI(1)

INT0

18 37 37

I/O

Digital I/O.

Timer0 alternate clock input.

Timer5 alternate clock input.

External Interrupt 0.

RC4/INT1/SDI/SDA

RC4

INT1

SDI(1)

SDA(1)

23 42 42

I/O

I2C

Digital I/O.

External Interrupt 1.

SPI data in.

I2C™ data I/O.

RC5/INT2/SCK/SCL

RC5

INT2

SCK(1)

SCL(1)

24 43 43

I/O

I2C

Digital I/O.

External Interrupt 2.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C mode.

RC6/TX/CK/SS

RC6

25 44 44

I/O

—

Digital I/O.

EUSART asynchronous transmit.

EUSART synchronous clock (see related RX/DT).

SPI slave select input.

RC7/RX/DT/SDO

RC7

SDO(1)

26 1 1

I/O

—

Digital I/O.

EUSART asynchronous receive.

EUSART synchronous data (see related TX/CK).

SPI data out.

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

 2010 Microchip Technology Inc. DS39616D-page 23

PIC18F2331/2431/4331/4431

PORTD is a bidirectional I/O port.

RD0/T0CKI/T5CKI

RD0

T0CKI

T5CKI

19 38 38

I/O

Digital I/O.

Timer0 external clock input.

Timer5 input clock.

RD1/SDO

RD1

SDO(1)

20 39 39

I/O

—

Digital I/O.

SPI data out.

RD2/SDI/SDA

RD2

SDI(1)

SDA(1)

21 40 40

I/O

Digital I/O.

SPI data in.

I2C™ data I/O.

RD3/SCK/SCL

RD3

SCK(1)

SCL(1)

22 41 41

I/O

Digital I/O.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C mode.

RD4/FLTA

RD4

FLTA(2)

27 2 2

I/O

Digital I/O.

Fault interrupt input pin.

RD5/PWM4

RD5

PWM4(3)

28 3 3

I/O

TTL

Digital I/O.

PWM Output 4.

RD6/PWM6

RD6

PWM6

29 4 4

I/O

TTL

Digital I/O.

PWM Output 6.

RD7/PWM7

RD7

PWM7

30 5 5

I/O

TTL

Digital I/O.

PWM Output 7.

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 24  2010 Microchip Technology Inc.

PORTE is a bidirectional I/O port.

RE0/AN6

RE0

AN6

82525

I/O

Analog

Digital I/O.

Analog Input 6.

RE1/AN7

RE1

AN7

92626

I/O

Analog

Digital I/O.

Analog Input 7.

RE2/AN8

RE2

AN8

10 27 27

I/O

Analog

Digital I/O.

Analog Input 8.

VSS 12,

6, 29 6, 30,

P — Ground reference for logic and I/O pins.

VDD 11,

7, 28 7, 8,

28, 29

P — Positive supply for logic and I/O pins.

NC — 12, 13,

33, 34

13 NC NC No connect.

TABLE 1-3: PIC18F4331/4431 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin

for SCK/SCL; RC7 is the alternate pin for SDO.

2: RD4 is the alternate pin for FLTA.

3: RD5 is the alternate pin for PWM4.

 2010 Microchip Technology Inc. DS39616D-page 25

PIC18F2331/2431/4331/4431

2.0 GUIDELINES FOR GETTING

STARTED WITH PIC18F

MICROCONTROLLERS

2.1 Basic Connection Requirements

Getting started with the PIC18F2331/2431/4331/4431

family of 8-bit microcontrollers requires attention to a

minimal set of device pin connections before

proceeding with development.

The following pins must always be connected:

•All V

DD and VSS pins

(see Section 2.2 “Power Supply Pins”)

•All AV

DD and AVSS pins, regardless of whether or

not the analog device features are used

(see Section 2.2 “Power Supply Pins”)

•MCLR

(see Section 2.3 “Master Clear (MCLR) Pin”)

These pins must also be connected if they are being

used in the end application:

• PGC/PGD pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.4 “ICSP Pins”)

• OSCI and OSCO pins when an external oscillator

source is used

(see Section 2.5 “External Oscillator Pins”)

Additionally, the following pins may be required:

•V

REF+/VREF- pins are used when external voltage

reference for analog modules is implemented

The minimum mandatory connections are shown in

Figure 2-1.

FIGURE 2-1: RECOMMENDED

MINIMUM CONNECTIONS

Note: The AVDD and AVSS pins must always be

connected, regardless of whether any of

the analog modules are being used.

PIC18FXXXX

VDD

VSS

VDD

VSS

VDD

AVDD

AVSS

VDD

VSS

VDD

MCLR

C2(1)

C3(1)

C4(1)

C5(1)

C6(1)

Key (all values are recommendations):

C1 through C6: 0.1 µF, 20V ceramic

R1: 10 kΩ

R2: 100Ω to 470Ω

Note 1: The example shown is for a PIC18F device

with five VDD/VSS and AVDD/AVSS pairs.

Other devices may have more or less pairs;

adjust the number of decoupling capacitors

appropriately.

PIC18F2331/2431/4331/4431

DS39616D-page 26  2010 Microchip Technology Inc.

2.2 Power Supply Pins

2.2.1 DECOUPLING CAPACITORS

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

AVSS, is required.

Consider the following criteria when using decoupling

capacitors:

•Value and type of capacitor: A 0.1 F (100 nF),

10-20V capacitor is recommended. The capacitor

should be a low-ESR device, with a resonance

frequency in the range of 200 MHz and higher.

Ceramic capacitors are recommended.

•Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is no greater

than 0.25 inch (6 mm).

•Handling high-frequency noise: If the board is

experiencing high-frequency noise (upward of

tens of MHz), add a second ceramic type capaci-

tor in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 F to 0.001 F. Place this

second capacitor next to each primary decoupling

capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible

(e.g., 0.1 F in parallel with 0.001 F).

•Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum, thereby reducing PCB trace

inductance.

2.2.2 TANK CAPACITORS

On boards with power traces running longer than

six inches in length, it is suggested to use a tank capac-

itor for integrated circuits, including microcontrollers, to

supply a local power source. The value of the tank

capacitor should be determined based on the trace

resistance that connects the power supply source to

the device, and the maximum current drawn by the

device in the application. In other words, select the tank

capacitor so that it meets the acceptable voltage sag at

the device. Typical values range from 4.7 F to 47 F.

2.2.3 CONSIDERATIONS WHEN USING

BOR

When the Brown-out Reset (BOR) feature is enabled,

a sudden change in VDD may result in a spontaneous

BOR event. This can happen when the microcontroller

is operating under normal operating conditions, regard-

less of what the BOR set point has been programmed

to, and even if VDD does not approach the set point.

The precipitating factor in these BOR events is a rise or

fall in VDD with a slew rate faster than 0.15V/s.

An application that incorporates adequate decoupling

between the power supplies will not experience such

rapid voltage changes. Additionally, the use of an

electrolytic tank capacitor across VDD and VSS, as

described above, will be helpful in preventing high slew

rate transitions.

If the application has components that turn on or off,

and share the same VDD circuit as the microcontroller,

the BOR can be disabled in software by using the

SBOREN bit before switching the component. After-

wards, allow a small delay before re-enabling the BOR.

By doing this, it is ensured that the BOR is disabled

during the interval that might cause high slew rate

changes of VDD.

Note: Not all devices incorporate software BOR

control. See Section 5.0 “Reset” for

device-specific information.

 2010 Microchip Technology Inc. DS39616D-page 27

PIC18F2331/2431/4331/4431

2.3 Master Clear (MCLR) Pin

The MCLR pin provides two specific device

functions: Device Reset, and Device Programming

and Debugging. If programming and debugging are

not required in the end application, a direct

connection to VDD may be all that is required. The

addition of other components, to help increase the

application’s resistance to spurious Resets from

voltage sags, may be beneficial. A typical

configuration is shown in Figure 2-1. Other circuit

designs may be implemented, depending on the

application’s requirements.

During programming and debugging, the resistance

and capacitance that can be added to the pin must be

considered. Device programmers and debuggers drive

the MCLR pin. Consequently, specific voltage levels

(VIH and VIL) and fast signal transitions must not be

adversely affected. Therefore, specific values of R1

and C1 will need to be adjusted based on the

application and PCB requirements. For example, it is

recommended that the capacitor, C1, be isolated from

the MCLR pin during programming and debugging

operations by using a jumper (Figure 2-2). The jumper

is replaced for normal run-time operations.

Any components associated with the MCLR pin

should be placed within 0.25 inch (6 mm) of the pin.

FIGURE 2-2: EXAMPLE OF MCLR PIN

CONNECTIONS

2.4 ICSP Pins

The PGC and PGD pins are used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes. It

is recommended to keep the trace length between the

ICSP connector and the ICSP pins on the device as

short as possible. If the ICSP connector is expected to

experience an ESD event, a series resistor is recom-

mended, with the value in the range of a few tens of

ohms, not to exceed 100Ω.

Pull-up resistors, series diodes, and capacitors on the

PGC and PGD pins are not recommended as they will

interfere with the programmer/debugger communica-

tions to the device. If such discrete components are an

application requirement, they should be removed from

the circuit during programming and debugging. Alter-

natively, refer to the AC/DC characteristics and timing

requirements information in the respective device

Flash programming specification for information on

capacitive loading limits and pin input voltage high (VIH)

and input low (VIL) requirements.

For device emulation, ensure that the “Communication

Channel Select” (i.e., PGCx/PGDx pins) programmed

into the device matches the physical connections for

the ICSP to the Microchip debugger/emulator tool.

For more information on available Microchip

development tools connection requirements, refer to

Section 25.0 “Development Support”.

Note 1: R1  10 k is recommended. A suggested

starting value is 10 k. Ensure that the

MCLR pin VIH and VIL specifications are met.

2: R2  470 will limit any current flowing into

MCLR from the external capacitor, C, in the

event of MCLR pin breakdown, due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

VDD

MCLR

PIC18FXXXX

PIC18F2331/2431/4331/4431

DS39616D-page 28  2010 Microchip Technology Inc.

2.5 External Oscillator Pins

Many microcontrollers have options for at least two

oscillators: a high-frequency primary oscillator and a

low-frequency secondary oscillator (refer to

Section 3.0 “Oscillator Configurations” for details).

The oscillator circuit should be placed on the same

side of the board as the device. Place the oscillator

circuit close to the respective oscillator pins with no

more than 0.5 inch (12 mm) between the circuit

components and the pins. The load capacitors should

be placed next to the oscillator itself, on the same side

of the board.

Use a grounded copper pour around the oscillator cir-

cuit to isolate it from surrounding circuits. The

grounded copper pour should be routed directly to the

MCU ground. Do not run any signal traces or power

traces inside the ground pour. Also, if using a two-sided

board, avoid any traces on the other side of the board

where the crystal is placed.

Layout suggestions are shown in Figure 2-4. In-line

packages may be handled with a single-sided layout

that completely encompasses the oscillator pins. With

fine-pitch packages, it is not always possible to com-

pletely surround the pins and components. A suitable

solution is to tie the broken guard sections to a mirrored

ground layer. In all cases, the guard trace(s) must be

returned to ground.

In planning the application’s routing and I/O assign-

ments, ensure that adjacent port pins and other signals

in close proximity to the oscillator are benign (i.e., free

of high frequencies, short rise and fall times, and other

similar noise).

For additional information and design guidance on

oscillator circuits, please refer to these Microchip

Application Notes, available at the corporate web site

(www.microchip.com):

•AN826, “Crystal Oscillator Ba sics and Crystal

Selection for rfPIC™ and PICmicro® Devices”

• AN849, “Basic PICmicro® Oscillator Design”

• AN943, “Practical PICmicro® Oscillator An alysis

and Design”

• AN949, “Making Your Oscillator Work”

2.6 Unused I/Os

Unused I/O pins should be configured as outputs and

driven to a logic low state. Alternatively, connect a 1 kΩ

to 10 kΩ resistor to VSS on unused pins and drive the

output to logic low.

FIGURE 2-3: SUGGESTED PLACEMENT

OF THE OSCILLATOR

CIRCUIT

GND

OSC1

OSC2

T1OSO

T1OS I

Copper Pour Primary Oscillator

Crystal

Timer1 Oscillator

Crystal

DEVICE PINS

Primary

Oscillator

T1 Oscillator: C1 T1 Oscillator: C2

(tied to ground)

Single-Sided and In-Line La youts:

Fine-Pitch (Dual-Sided) Layouts:

GND

OSCO

OSCI

Bottom Layer

Copper Pour

Oscillator

Crystal

Top Layer Copper Pour

DEVICE PINS

(tied to ground)

 2010 Microchip Technology Inc. DS39616D-page 29

PIC18F2331/2431/4331/4431

3.0 OSCILLATOR

CONFIGURATIONS

3.1 Oscillator Types

The PIC18F2331/2431/4331/4431 devices can be

operated in 10 different oscillator modes. The user can

program the Configuration bits, FOSC<3:0>, in

Configuration Register 1H to select one of these

10 modes:

1. LP Low-Power Crystal

2. XT Crystal/Resonator

3. HS High-Speed Crystal/Resonator

4. HSPLL High-Speed Crystal/Resonator

with PLL Enabled

5. RC External Resistor/Capacitor with

FOSC/4 Output on RA6

6. RCIO External Resistor/Capacitor with

I/O on RA6

7. INTIO1 Internal Oscillator with FOSC/4

Output on RA6 and I/O on RA7

8. INTIO2 Internal Oscillator with I/O on RA6

and RA7

9. EC External Clock with FOSC/4 Output

10. ECIO External Clock with I/O on RA6

3.2 Crystal Oscill a tor/Ceramic

Resonators

In XT, LP, HS or HSPLL Oscillator modes, a crystal or

ceramic resonator is connected to the OSC1 and

OSC2 pins to establish oscillation. Figure 3-1 shows

the pin connections.

The oscillator design requires the use of a parallel

resonant crystal.

FIGURE 3-1: CRYSTAL/CERAMIC

RESONATOR OPERATION

(XT, LP, HS OR HS PLL

CONFIGURATION)

T ABLE 3-1: CAP ACITOR SELECTION FOR

CERAMIC RESONATORS

Note: Use of a series resonant crystal may give

a frequency out of the crystal

manufacturers’ specifications.

Typical Capacitor Values Used:

Mode Freq OSC1 OSC2

XT 455 kHz

2.0 MHz

4.0 MHz

56 pF

47 pF

33 pF

56 pF

47 pF

33 pF

HS 8.0 MHz

16.0 MHz

27 pF

22 pF

27 pF

22 pF

Capacitor values are for design guidance only.

These capacitors were tested with the resonators

listed below for basic start-up and operation. These

values are not optimi zed.

Different capacitor values may be required to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following Tab l e 3-2 for additional

information.

Resonators Used:

455 kHz 4.0 MHz

2.0 MHz 8.0 MHz

16.0 MHz

Note 1: See Table 3-1 and Ta b le 3 - 2 for initial values of

C1 and C2.

2: A series resistor (RS) may be required for AT

strip resonant crystals.

3: RF varies with the oscillator mode chosen.

C1(1)

C2(1)

XTAL

OSC2

OSC1

RF(3)

Sleep

Logic

PIC18FXXXX

RS(2)

Internal

PIC18F2331/2431/4331/4431

DS39616D-page 30  2010 Microchip Technology Inc.

TABLE 3-2: CAPACITOR SELECTION FOR

CRYSTAL OSCILLATOR

An external clock source may also be connected to the

OSC1 pin in the HS mode, as shown in Figure 3-2.

FIGURE 3-2: EXTERNAL CLOCK INPUT

OPERATION (HS OSC

CONFIGURATION)

3.3 PLL Frequency Multiplier

A Phase Locked Loop (PLL) circuit is provided as an

option for users who wish to use a lower frequency

oscillator circuit or to clock the device up to its highest

rated frequency from a crystal oscillator. This may be

useful for those concerned with EMI from high-

frequency crystals or users requiring higher clock

speeds from an internal oscillator.

3.3.1 HSPLL OSCILLATOR MODE

The HSPLL mode uses the HS Oscillator mode for

frequencies up to 10 MHz. A PLL circuit then multiplies

the oscillator output frequency by four to produce an

internal clock frequency up to 40 MHz. The PLLEN bit

is not available in this oscillator mode.

The PLL is only available to the crystal oscillator when

the FOSC<3:0> Configuration bits are programmed for

HSPLL mode (‘0110’).

FIGU RE 3-3 : PL L BLOC K DIAGR AM

Osc Type Crystal

Freq

Typical Cap acitor V alues

Tested:

C1 C2

LP 32 kHz 33 pF 33 pF

200 kHz 15 pF 15 pF

XT 1 MHz 33 pF 33 pF

4 MHz 27 pF 27 pF

HS 4 MHz 27 pF 27 pF

8 MHz 22 pF 22 pF

20 MHz 15 pF 15 pF

Capacitor values are for design guidance only.

These capacitors were tested with the crystals listed

below for basic start-up and operation. These val ues

are not optimized.

Different capacitor values may be required to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following this table for additional

information.

Crystals Used:

32 kHz 4 MHz

200 kHz 8 MHz

1 MHz 20 MHz

Note 1: Higher capacitance increases the

stability of oscillator, but also increases

the start-up time.

2: When operating below 3V VDD, or when

using certain ceramic resonators at any

voltage, it may be necessary to use the

HS mode or switch to a crystal oscillator.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: Rs may be required to avoid overdriving

crystals with low drive level specification.

5: Always verify oscillator performance over

the VDD and temperature range that is

expected for the application.

OSC1

OSC2

Open

Clock from

Ext. System PIC18FXXXX

(HS Mode)

MUX

VCO

Loop

Filter

Crystal

Osc

OSC2

OSC1

PLL Enable

FIN

FOUT

SYSCLK

Phase

Comparator

HS Osc Enable

4

(from Configuration Register 1H)

HS Mode

 2010 Microchip Technology Inc. DS39616D-page 31

PIC18F2331/2431/4331/4431

3.4 External Clock Input

The EC and ECIO Oscillator modes require an external

clock source to be connected to the OSC1 pin. There is

no oscillator start-up time required after a Power-on

Reset or after an exit from Sleep mode.

In the EC Oscillator mode, the oscillator frequency

divided by 4 is available on the OSC2 pin. This signal

may be used for test purposes or to synchronize other

logic. Figure 3-4 shows the pin connections for the EC

Oscillator mode.

FIGURE 3-4: EXTERNAL CLOCK INPUT

OPERATION

(EC CONFIGURATION)

The ECIO Oscillator mode functions like the EC mode,

except that the OSC2 pin becomes an additional

general purpose I/O pin. The I/O pin becomes bit 6 of

PORTA (RA6). Figure 3-5 shows the pin connections

for the ECIO Oscillator mode.

FIGURE 3-5: EXTERNAL CLOCK INPUT

OPERATION

(EC IO CON FIGUR ATI ON)

3.5 RC Oscillator

For timing-insensitive applications, the “RC” and “RCIO”

device options offer additional cost savings. The actual

oscillator frequency is a function of several factors:

• Supply voltage

• Values of the external resistor (REXT) and capacitor

(CEXT)

• Operating temperature

Given the same device, operating voltage and tempera-

ture, and component values, there will also be unit-to-unit

frequency variations. These are due to factors, such as:

• Normal manufacturing variation

• Difference in lead frame capacitance between

package types (especially for low CEXT values)

• Variations within the tolerance of limits of REXT

and CEXT

In the RC Oscillator mode (Figure 3-6), the oscillator

frequency divided by 4 is available on the OSC2 pin.

This signal may be used for test purposes or to

synchronize other logic.

FIGU RE 3-6 : RC OSCI LLA TOR MODE

The RCIO Oscillator mode (Figure 3-7) functions like

the RC mode, except that the OSC2 pin becomes an

additional general purpose I/O pin. The I/O pin

becomes bit 6 of PORTA (RA6).

FIGURE 3-7: RCIO OSCILLATOR MODE

OSC1/CLKI

OSC2/CLKO

FOSC/4

Clock from

Ext. System PIC18FXXXX

OSC1/CLKI

I/O (OSC2)

RA6

Clock from

Ext. System PIC18FXXXX

OSC2/CLKO

CEXT

REXT

PIC18FXXXX

OSC1

FOSC/4

Internal

Clock

VDD

VSS

Recommended values: 3 k  REXT  100 k

CEXT > 20 pF

CEXT

REXT

PIC18FXXXX

OSC1 Internal

Clock

VDD

VSS

Recommended values: 3 k  REXT  100 k

CEXT > 20 pF

I/O (OSC2)

RA6

PIC18F2331/2431/4331/4431

DS39616D-page 32  2010 Microchip Technology Inc.

3.6 Internal Oscillator Block

The PIC18F2331/2431/4331/4431 devices include an

internal oscillator block, which generates two different

clock signals; either can be used as the system’s clock

source. This can eliminate the need for external

oscillator circuits on the OSC1 and/or OSC2 pins.

The main output (INTOSC) is an 8 MHz clock source,

which can be used to directly drive the system clock. It

also drives a postscaler, which can provide a range of

clock frequencies from 125 kHz to 4 MHz. The

INTOSC output is enabled when a system clock

frequency from 125 kHz to 8 MHz is selected.

The other clock source is the internal RC oscillator

(INTRC), which provides a 31 kHz output. The INTRC

oscillator is enabled by selecting the internal oscillator

block as the system clock source, or when any of the

following are enabled:

• Power-up Timer

• Fail-Safe Clock Monitor

• Watchdog Timer

• Two-Speed Start-up

These features are discussed in greater detail in

Section 23.0 “Special Features of the CPU”.

The clock source frequency (INTOSC direct, INTRC

direct or INTOSC postscaler) is selected by configuring

the IRCF bits of the OSCCON register (Register 3-2).

3.6.1 INTIO MODES

Using the internal oscillator as the clock source can

eliminate the need for up to two external oscillator pins,

which can then be used for digital I/O. Two distinct

configurations are available:

• In INTIO1 mode, the OSC2 pin outputs FOSC/4,

while OSC1 functions as RA7 for digital input and

output.

• In INTIO2 mode, OSC1 functions as RA7 and

OSC2 functions as RA6, both for digital input and

output.

3.6.2 INTRC OUTPUT FREQUENCY

The internal oscillator block is calibrated at the factory

to produce an INTOSC output frequency of 8.0 MHz.

This changes the frequency of the INTRC source from

its nominal 31.25 kHz. Peripherals and features that

depend on the INTRC source will be affected by this

shift in frequency.

3.6.3 OSCTUNE REGISTER

The internal oscillator’s output has been calibrated at the

factory, but can be adjusted in the user’s application.

This is done by writing to the OSCTUNE register

(Register 3-1). Each increment may adjust the FRC

frequency by varying amounts and may not be mono-

tonic. The next closest frequency may be multiple steps

apart.

When the OSCTUNE register is modified, the INTOSC

and INTRC frequencies will begin shifting to the new

frequency. Code execution continues during this shift.

There is no indication that the shift has occurred. Oper-

ation of features that depend on the INTRC clock

source frequency, such as the WDT, Fail-Safe Clock

Monitor and peripherals, will also be affected by the

change in frequency.

3.6.4 INTOSC FREQUENCY DRIFT

The factory calibrates the internal oscillator block out-

put (INTOSC) for 8 MHz. This frequency, however, may

drift as the VDD or temperature changes, which can

affect the controller operation in a variety of ways.

The INTOSC frequency can be adjusted by modifying

the value in the OSCTUNE register. This has no effect

on the INTRC clock source frequency.

Tuning the INTOSC source requires knowing when to

make an adjustment, in which direction it should be

made, and in some cases, how large a change is

needed. Three compensation techniques are discussed

in Section 3.6.4.1 “Compensating with the

EUSART”, Section 3.6.4.2 “Compensating with the

Timers” and Section 3.6.4.3 “Compensating with the

CCP Module in C apture Mode”, but other techniques

may be used.

 2010 Microchip Technology Inc. DS39616D-page 33

PIC18F2331/2431/4331/4431

3.6.4.1 Compensating with the EUSART

An adjustment may be required when the EUSART

begins generating framing errors or receives data with

errors while in Asynchronous mode. Framing errors

frequently indicate that the device clock frequency is

too high. To adjust for this, decrement the value in the

OSCTUNE register to reduce the clock frequency.

Conversely, errors in data may suggest that the clock

speed is too low; to compensate, increment the

OSCTUNE register to increase the clock frequency.

3.6.4.2 Compensating with the Timers

This technique compares the device clock speed to

that of a reference clock. Two timers may be used: one

timer clocked by the peripheral clock and the other by

a fixed reference source, such as the Timer1 oscillator.

Both timers are cleared, but the timer clocked by the

reference generates interrupts. When an interrupt

occurs, the internally clocked timer is read and both

timers are cleared. If the internally clocked timer value

is greater than expected, the internal oscillator block is

running too fast. To adjust for this, decrement the

OSCTUNE register.

3.6.4.3 Compensating with the CCP Module

in Capture Mode

A CCP module can use free-running Timer1 (or

Timer3), clocked by the internal oscillator block and an

external event with a known period (such as the AC

power frequency). The time of the first event is cap-

tured in the CCPRxH:CCPRxL registers and recorded

for later use. When the second event causes a capture,

the time of the first event is subtracted from the time of

the second event. Since the period of the external

event is known, the time difference between events can

be calculated.

If the measured time is much greater than the calcu-

lated time, the internal oscillator block is running too

fast. To compensate for this, decrement the OSCTUNE

calculated time, the internal oscillator block is running

too slow and the OSCTUNE register should be

incremented.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 TUN<5:0>: Frequency Tuning bits

011111 = Maximum frequency

• •

000001

000000 = Center frequency. Oscillator module is running at the calibrated frequency.

111111

• •

100000 = Minimum frequency

PIC18F2331/2431/4331/4431

DS39616D-page 34  2010 Microchip Technology Inc.

3.7 Clock Sources and Oscillator

Switching

Like previous PIC18 devices, the PIC18F2331/2431/

4331/4431 devices include a feature that allows the sys-

tem clock source to be switched from the main oscillator

to an alternate low-frequency clock source. PIC18F2331/

2431/4331/4431 devices offer two alternate clock

sources. When enabled, these give additional options for

switching to the various power-managed operating

modes.

Essentially, there are three clock sources for these

devices:

• Primary oscillators

• Secondary oscillators

• Internal oscillator block

The primary oscillators include the External Crystal

and Resonator modes, the External RC modes, the

External Clock modes and the internal oscillator block.

The particular mode is defined on POR by the contents

of Configuration Register 1H. The details of these

modes are covered earlier in this chapter.

The secondary oscillat ors are those external sources

not connected to the OSC1 or OSC2 pins. These

sources may continue to operate even after the

controller is placed in a power-managed mode.

PIC18F2331/2431/4331/4431 devices offer only the

Timer1 oscillator as a secondary oscillator. This

oscillator, in all power-managed modes, is often the

time base for functions such as a Real-Time Clock

(RTC).

Most often, a 32.768 kHz watch crystal is connected

between the RC0/T1OSO/T1CKI and RC1/T1OSI/

CCP2/FLTA pins. Like the LP Oscillator mode circuit,

loading capacitors are also connected from each pin to

ground.

The Timer1 oscillator is discussed in greater detail in

Section 13.2 “Timer1 Oscillator”.

In addition to being a primary clock source, the internal

oscillator block is available as a power-managed

mode clock source. The INTRC source is also used as

the clock source for several special features, such as

the WDT and Fail-Safe Clock Monitor.

The clock sources for the PIC18F2331/2431/4331/4431

devices are shown in Figure 3-8. See Section 13.0

“Timer1 Module” for further details of the Timer1

oscillator. See Section 23.1 “Configuration Bits” for

Configuration register details.

3.7.1 OSCILLATOR CONTROL REGISTER

The OSCCON register (Register 3-2) controls sev-

eral aspects of the system clock’s operation, both in

full-power operation and in power-managed modes.

The System Clock Select bits, SCS<1:0>, select the

clock source that is used when the device is operating

in power-managed modes. The available clock sources

are the primary clock (defined in Configuration Register

1H), the secondary clock (Timer1 oscillator) and the

internal oscillator block. The clock selection has no

effect until a SLEEP instruction is executed and the

device enters a power-managed mode of operation.

The SCS bits are cleared on all forms of Reset.

The Internal Oscillator Select bits, IRCF<2:0>, select

the frequency output of the internal oscillator block that

is used to drive the system clock. The choices are the

INTRC source, the INTOSC source (8 MHz) or one of

the six frequencies derived from the INTOSC post-

scaler (125 kHz to 4 MHz). If the internal oscillator

block is supplying the system clock, changing the

states of these bits will have an immediate change on

the internal oscillator’s output. On device Resets, the

default output frequency of the internal oscillator block

is set at 32 kHz.

The OSTS, IOFS and T1RUN bits indicate which clock

source is currently providing the system clock. The OSTS

indicates that the Oscillator Start-up Timer has timed out,

and the primary clock is providing the system clock in

Primary Clock modes. The IOFS bit indicates when the

internal oscillator block has stabilized, and is providing

the system clock in RC Clock modes. The T1RUN bit

(T1CON<6>) indicates when the Timer1 oscillator is

providing the system clock in Secondary Clock modes. In

power-managed modes, only one of these three bits will

be set at any time. If none of these bits are set, the INTRC

is providing the system clock, or the internal oscillator

block has just started and is not yet stable.

The IDLEN bit controls the selective shutdown of the

controller’s CPU in power-managed modes. The use of

these bits is discussed in more detail in Section 4.0

“Power-M ana ged Modes”

Note 1: The Timer1 oscillator must be enabled to

select the secondary clock source. The

Timer1 oscillator is enabled by setting the

T1OSCEN bit in the Timer1 Control

oscillator is not enabled, then any

attempt to select a secondary clock

source, when executing a SLEEP

instruction, will be ignored.

2: It is recommended that the Timer1

oscillator be operating and stable before

executing the SLEEP instruction, or a

very long delay may occur while the

Timer1 oscillator starts.

 2010 Microchip Technology Inc. DS39616D-page 35

PIC18F2331/2431/4331/4431

FIGURE 3- 8 : PIC18F 23 31/ 243 1/433 1/ 443 1 CL OCK D IA GRA M

4 x PLL

CONFIG1H <3:0>

T1OSCEN

Enable

Oscillator

T1OSO

T1OSI

Clock Source Option

for other Modules

OSC1

OSC2

Sleep

HSPLL

LP, XT, HS, RC, EC

T1OSC

CPU

Peripherals

IDLEN

Postscaler

MUX

8 MHz

4 MHz

2 MHz

1 MHz

500 kHz

125 kHz

250 kHz

OSCCON<6:4>

111

110

101

100

011

010

001

000

31 kHz

INTRC

Source

Internal

Oscillator

Block

WDT, FSCM

8 MHz

Internal Oscillator

(INTOSC)

OSCCON<6:4>

Clock

Control OSCCON<1:0>

Primary Oscillator

Secondary Oscillator

PIC18F2331/2431/4331/4431

DS39616D-page 36  2010 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0

IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 IDLEN: Idle Enable bit

1 = Idle mode enabled; CPU core is not clocked in power-managed modes

0 = Run mode enabled; CPU core is clocked in power-managed modes

bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits

111 = 8 MHz (8 MHz source drives clock directly)

110 = 4 MHz (default)

101 = 2 MHz

100 = 1 MHz

011 = 500 kHz

010 = 250 kHz

001 = 125 kHz

000 = 31 kHz (INTRC source drives clock directly)(2)

bit 3 OSTS: Oscillator Start-up Timer Time-out Status bit(1)

1 = Oscillator Start-up Timer time-out has expired; primary oscillator is running

0 = Oscillator Start-up Timer time-out is running; primary oscillator is not ready

bit 2 IOFS: INTOSC Frequency Stable bit

1 = INTOSC frequency is stable

0 = INTOSC frequency is not stable

bit 1-0 SCS<1:0>: System Clock Select bits

1x = Internal oscillator block

01 = Secondary (Timer1) oscillator

00 = Primary oscillator

Note 1: Depends on the state of the IESO bit in Configuration Register 1H.

2: Default output frequency of INTOSC on Reset.

 2010 Microchip Technology Inc. DS39616D-page 37

PIC18F2331/2431/4331/4431

3.7.2 OSCILLATOR TRANSITIONS

The PIC18F2331/2431/4331/4431 devices contain

circuitry to prevent clocking “glitches” when switching

between clock sources. A short pause in the system

clock occurs during the clock switch. The length of this

pause is between 8 and 9 clock periods of the new

clock source. This ensures that the new clock source is

stable and that its pulse width will not be less than the

shortest pulse width of the two clock sources.

Clock transitions are discussed in greater detail in

Section 4.1.2 “Entering Power-Managed Modes”.

3.8 Effects of Power-Managed Modes

on the Various Clock Sources

When PRI_IDLE mode is selected, the designated

primary oscillator continues to run without interruption.

For all other power-managed modes, the oscillator using

the OSC1 pin is disabled. The OSC1 pin (and OSC2 pin,

if used by the oscillator) will stop oscillating.

When the device executes a SLEEP instruction, the

system is switched to one of the power-managed

modes, depending on the state of the IDLEN and

SCS<1:0> bits of the OSCCON register. See

Section 4.0 “Power-Managed Modes” for details.

In secondary clock modes (SEC_RUN and

SEC_IDLE), the Timer1 oscillator is operating and

providing the system clock. The Timer1 oscillator may

also run in all power-managed modes if required to

clock Timer1.

In internal oscillator modes (RC_RUN and RC_IDLE),

the internal oscillator block provides the system clock

source. The INTRC output can be used directly to

provide the system clock and may be enabled to

support various special features, regardless of the

power-managed mode (see Sect io n 23. 2 “Watch dog

Time r (WDT)” through Section 23.4 “Fail-Safe Clock

Monitor”). The INTOSC output at 8 MHz may be used

directly to clock the system, or may be divided down

first. The INTOSC output is disabled if the system clock

is provided directly from the INTRC output.

If the Sleep mode is selected, all clock sources are

stopped. Since all the transistor switching currents

have been stopped, Sleep mode achieves the lowest

current consumption of the device (only leakage

currents).

Enabling any on-chip feature that will operate during

Sleep will increase the current consumed during Sleep.

The INTRC is required to support WDT operation. The

Timer1 oscillator may be operating to support a Real-

Time Clock. Other features may be operating that do

not require a system clock source (i.e., SSP slave,

INTx pins, A/D conversions and others).

3.9 Power-up Delays

Power-up delays are controlled by two timers, so that no

external Reset circuitry is required for most applications.

The delays ensure that the device is kept in Reset until

the device power supply is stable under normal

circumstances, and the primary clock is operating and

stable. For additional information on power-up delays,

see Section 5.3 “Power-on Reset (POR)” through

Section 5.4 “Brown-out Reset (BOR)”.

The first timer is the Power-up Timer (PWRT), which

provides a fixed delay on power-up (parameter 33,

Table 26-8), if enabled, in Configuration Register 2L.

The second timer is the Oscillator Start-up Timer

(OST), intended to keep the chip in Reset until the crys-

tal oscillator is stable (LP, XT and HS modes). The OST

does this by counting 1024 oscillator cycles before

allowing the oscillator to clock the device.

When the HSPLL Oscillator mode is selected, the

device is kept in Reset for an additional 2 ms, following

the HS mode OST delay, so the PLL can lock to the

incoming clock frequency.

TABLE 3-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE

OSC Mode OSC1 Pin OSC2 Pin

RC, INTIO1 Floating, external resistor

should pull high

At logic low (clock/4 output)

RCIO, INTIO2 Floating, external resistor

should pull high

Configured as PORTA, bit 6

ECIO Floating, pulled by external clock Configured as PORTA, bit 6

EC Floating, pulled by external clock At logic low (clock/4 output)

LP, XT and HS Feedback inverter disabled at

quiescent voltage level

Feedback inverter disabled at

quiescent voltage level

Note: See Table 5-1 in Section 5.0 “Reset” for time-outs due to Sleep and MCLR Reset.

PIC18F2331/2431/4331/4431

DS39616D-page 38  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 39

PIC18F2331/2431/4331/4431

4.0 POWER-MANAGED MODES

PIC18F2331/2431/4331/4431 devices offer a total of

seven operating modes for more efficient power

management. These modes provide a variety of

options for selective power conservation in applications

where resources may be limited (i.e., battery-powered

devices).

There are three categories of power-managed modes:

• Run modes

• Idle modes

• Sleep mode

These categories define which portions of the device

are clocked, and sometimes, what speed. The Run and

Idle modes may use any of the three available clock

sources (primary, secondary or internal oscillator

block); the Sleep mode does not use a clock source.

The power-managed modes include several power-

saving features offered on previous PIC® devices. One

is the clock switching feature, offered in other PIC18

devices, allowing the controller to use the Timer1 oscil-

lator in place of the primary oscillator. Also included is

the Sleep mode, offered by all PIC devices, where all

device clocks are stopped.

4.1 Selecting Power-Managed Modes

Selecting a power-managed mode requires two

decisions: if the CPU is to be clocked or not and the

selection of a clock source. The IDLEN bit

(OSCCON<7>) controls CPU clocking, while the

SCS<1:0> bits (OSCCON<1:0>) select the clock

source. The individual modes, bit settings, clock sources

and affected modules are summarized in Table 4-1.

4.1.1 CLOCK SOURCES

The SCS<1:0> bits allow the selection of one of three

clock sources for power-managed modes. They are:

• the primary clock, as defined by the FOSC<3:0>

Configuration bits

• the secondary clock (the Timer1 oscillator)

• the internal oscillator block (for RC modes)

4.1.2 ENTERING POWER-MANAGED

MODES

Switching from one power-managed mode to another

begins by loading the OSCCON register. The

SCS<1:0> bits select the clock source and determine

which Run or Idle mode is to be used. Changing these

bits causes an immediate switch to the new clock

source, assuming that it is running. The switch may

also be subject to clock transition delays. These are

discussed in Section 4.1.3 “Clock Transitions and

Status Indicators” and subsequent sections.

Entry to the power-managed Idle or Sleep modes is

triggered by the execution of a SLEEP instruction. The

actual mode that results depends on the status of the

IDLEN bit.

Depending on the current mode and the mode being

switched to, a change to a power-managed mode does

not always require setting all of these bits. Many

transitions may be done by changing the oscillator select

bits, or changing the IDLEN bit, prior to issuing a SLEEP

instruction. If the IDLEN bit is already configured

correctly, it may only be necessary to perform a SLEEP

instruction to switch to the desired mode.

TABLE 4-1: POWER-MANAGED MODES

Mode OSCCON Bits<7,1:0> Module Clocking Availab le Clock and Os cillator Source

IDLEN(1) SCS<1:0> CPU Peripherals

Sleep 0N/A Off Off None – All clocks are disabled

PRI_RUN N/A 00 Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC and

Internal Oscillator Block.(2)

This is the normal, full-power execution mode.

SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator

RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2)

PRI_IDLE 100Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC

SEC_IDLE 101Off Clocked Secondary – Timer1 Oscillator

RC_IDLE 11xOff Clocked Internal Oscillator Block(2)

Note 1: IDLEN reflects its value when the SLEEP instruction is executed.

2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.

PIC18F2331/2431/4331/4431

DS39616D-page 40  2010 Microchip Technology Inc.

4.1.3 CLOCK TRANSITIONS AND STATUS

INDICATORS

The length of the transition between clock sources is

the sum of two cycles of the old clock source and three

to four cycles of the new clock source. This formula

assumes that the new clock source is stable.

Three bits indicate the current clock source and its

status. They are:

• OSTS (OSCCON<3>)

• IOFS (OSCCON<2>)

• T1RUN (T1CON<6>)

In general, only one of these bits will be set while in a

given power-managed mode. When the OSTS bit is

set, the primary clock is providing the device clock.

When the IOFS bit is set, the INTOSC output is

providing a stable, 8 MHz clock source to a divider that

actually drives the device clock. When the T1RUN bit is

set, the Timer1 oscillator is providing the clock. If none

of these bits are set, then either the INTRC clock

source is clocking the device, or the INTOSC source is

not yet stable.

If the internal oscillator block is configured as the primary

clock source by the FOSC<3:0> Configuration bits, then

both the OSTS and IOFS bits may be set when in

PRI_RUN or PRI_IDLE modes. This indicates that the

primary clock (INTOSC output) is generating a stable,

8 MHz output. Entering another power-managed RC

mode at the same frequency would clear the OSTS bit.

4.1.4 MULTIPLE SLEEP COMMANDS

The power-managed mode that is invoked with the

SLEEP instruction is determined by the setting of the

IDLEN bit at the time the instruction is executed. If

another SLEEP instruction is executed, the device will

enter the power-managed mode specified by IDLEN at

that time. If IDLEN has changed, the device will enter

the new power-managed mode specified by the new

setting.

4.2 Run Modes

In the Run modes, clocks to both the core and

peripherals are active. The difference between these

modes is the clock source.

4.2.1 PRI_RUN MODE

The PRI_RUN mode is the normal, full-power execu-

tion mode of the microcontroller. This is also the default

mode upon a device Reset unless Two-Speed Start-up

is enabled (see Section 23.3 “Two-Speed Start-up”

for details). In this mode, the OSTS bit is set. The IOFS

bit may be set if the internal oscillator block is the

primary clock source (see Section 3.7.1 “Oscillator

Control Register”).

4.2.2 SEC_RUN MODE

The SEC_RUN mode is the compatible mode to the

“clock switching” feature offered in other PIC18

devices. In this mode, the CPU and peripherals are

clocked from the Timer1 oscillator. This gives users the

option of lower power consumption while still using a

high-accuracy clock source.

SEC_RUN mode is entered by setting the SCS<1:0>

bits to ‘01’. The device clock source is switched to the

Timer1 oscillator (see Figure 4-1), the primary oscillator

is shut down, the T1RUN bit (T1CON<6>) is set and the

OSTS bit is cleared.

On transitions from SEC_RUN mode to PRI_RUN, the

peripherals and CPU continue to be clocked from the

Timer1 oscillator while the primary clock is started.

When the primary clock becomes ready, a clock switch

back to the primary clock occurs (see Figure 4-2).

When the clock switch is complete, the T1RUN bit is

cleared, the OSTS bit is set and the primary clock is

providing the clock. The IDLEN and SCS bits are not

affected by the wake-up; the Timer1 oscillator

continues to run.

Note 1: Caution should be used when modifying

a single IRCF bit. If VDD is less than 3V, it

is possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

2: Executing a SLEEP instruction does not

necessarily place the device into Sleep

mode. It acts as the trigger to place the

controller into either the Sleep mode or

one of the Idle modes, depending on the

setting of the IDLEN bit.

Note: The Timer1 oscillator should already be

running prior to entering SEC_RUN

mode. If the T1OSCEN bit is not set when

the SCS<1:0> bits are set to ‘01’, entry to

SEC_RUN mode will not occur. If the

Timer1 oscillator is enabled, but not yet

running, device clocks will be delayed until

the oscillator has started. In such situa-

tions, initial oscillator operation is far from

stable and unpredictable operation may

result.

 2010 Microchip Technology Inc. DS39616D-page 41

PIC18F2331/2431/4331/4431

FIGURE 4-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE

FIGURE 4-2: TRAN SITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)

4.2.3 RC_RUN MODE

In RC_RUN mode, the CPU and peripherals are

clocked from the internal oscillator block using the

INTOSC multiplexer. In this mode, the primary clock is

shut down. When using the INTRC source, this mode

provides the best power conservation of all the Run

modes, while still executing code. It works well for user

applications which are not highly timing-sensitive or do

not require high-speed clocks at all times.

If the primary clock source is the internal oscillator block

(either INTRC or INTOSC), there are no distinguishable

differences between PRI_RUN and RC_RUN modes

during execution. However, a clock switch delay will

occur during entry to and exit from RC_RUN mode.

Therefore, if the primary clock source is the internal

oscillator block, the use of RC_RUN mode is not

recommended.

This mode is entered by setting the SCS1 bit to ‘1’.

Although it is ignored, it is recommended that the SCS0

bit also be cleared; this is to maintain software compat-

ibility with future devices. When the clock source is

switched to the INTOSC multiplexer (see Figure 4-3),

the primary oscillator is shut down and the OSTS bit is

cleared. The IRCF bits may be modified at any time to

immediately change the clock speed.

Q4Q3Q2

OSC1

Peripheral

Program

T1OSI

Counter

Clock

CPU

Clock

PC + 2PC

123 n-1n

Clock Transition(1)

Q4Q3Q2 Q1 Q3Q2

PC + 4

Note 1: Clock transition typically occurs within 2-4 TOSC.

Q1 Q3 Q4

OSC1

Peripheral

Program PC

T1OSI

PLL Clock

PC + 4

Output

Q3 Q4 Q1

CPU Clock

PC + 2

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

2: Clock transition typically occurs within 2-4 TOSC.

SCS<1:0> bits Changed

TPLL(1)

12 n-1n

Clock

OSTS bit Set

Transition(2)

TOST(1)

Note: Caution should be used when modifying a

single IRCF bit. If VDD is less than 3V, it is

possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

PIC18F2331/2431/4331/4431

DS39616D-page 42  2010 Microchip Technology Inc.

If the IRCF bits and the INTSRC bit are all clear, the

INTOSC output is not enabled and the IOFS bit will

remain clear; there will be no indication of the current

clock source. The INTRC source is providing the

device clocks.

If the IRCF bits are changed from all clear (thus,

enabling the INTOSC output), or if INTSRC is set, the

IOFS bit becomes set after the INTOSC output

becomes stable. Clocks to the device continue while

the INTOSC source stabilizes, after an interval of

TIOBST.

If the IRCF bits were previously at a non-zero value, or

if INTSRC was set before setting SCS1 and the

INTOSC source was already stable, the IOFS bit will

remain set.

On transitions from RC_RUN mode to PRI_RUN mode,

the device continues to be clocked from the INTOSC

multiplexer while the primary clock is started. When the

primary clock becomes ready, a clock switch to the

primary clock occurs (see Figure 4-4). When the clock

switch is complete, the IOFS bit is cleared, the OSTS

bit is set and the primary clock is providing the device

clock. The IDLEN and SCS bits are not affected by the

switch. The INTRC source will continue to run if either

the WDT or the Fail-Safe Clock Monitor is enabled.

FIGURE 4-3: TRAN SITION TIMING TO RC_RUN MODE

FIGURE 4-4: TRAN SITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE

Q4Q3Q2

OSC1

Peripheral

Program

INTRC

Counter

Clock

CPU

Clock

PC + 2PC

123

n-1

Clock Transition(1)

Q4Q3Q2 Q1 Q3Q2

PC + 4

Note 1: Clock transition typically occurs within 2-4 TOSC.

Q1 Q3 Q4

OSC1

Peripheral

Program PC

INTOSC

PLL Clock

PC + 4

Output

Q3 Q4 Q1

CPU Clock

PC + 2

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

2: Clock transition typically occurs within 2-4 TOSC.

SCS<1:0> bits Changed

TPLL(1)

12 n-1n

Clock

OSTS bit Set

Transition(2)

Multiplexer

TOST(1)

 2010 Microchip Technology Inc. DS39616D-page 43

PIC18F2331/2431/4331/4431

4.3 Sleep Mode

The power-managed Sleep mode in the PIC18F2331/

2431/4331/4431 devices is identical to the legacy

Sleep mode offered in all other PIC devices. It is

entered by clearing the IDLEN bit (the default state on

device Reset) and executing the SLEEP instruction.

This shuts down the selected oscillator (Figure 4-5). All

clock source status bits are cleared.

Entering the Sleep mode from any other mode does not

require a clock switch. This is because no clocks are

needed once the controller has entered Sleep. If the

WDT is selected, the INTRC source will continue to

operate. If the Timer1 oscillator is enabled, it will also

continue to run.

When a wake event occurs in Sleep mode (by interrupt,

Reset or WDT time-out), the device will not be clocked

until the clock source, selected by the SCS<1:0> bits,

becomes ready (see Figure 4-6), or it will be clocked

from the internal oscillator block if either the Two-Speed

Start-up or the Fail-Safe Clock Monitor is enabled (see

Section 23.0 “Special Features of the CPU”). In

either case, the OSTS bit is set when the primary clock

is providing the device clocks. The IDLEN and SCS bits

are not affected by the wake-up.

4.4 Idle Modes

The Idle modes allow the controller’s CPU to be

selectively shut down while the peripherals continue to

operate. Selecting a particular Idle mode allows users

to further manage power consumption.

If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is

executed, the peripherals will be clocked from the clock

source selected using the SCS<1:0> bits; however, the

CPU will not be clocked. The clock source status bits are

not affected. Setting IDLEN and executing a SLEEP

instruction provides a quick method of switching from a

given Run mode to its corresponding Idle mode.

If the WDT is selected, the INTRC source will continue

to operate. If the Timer1 oscillator is enabled, it will also

continue to run.

Since the CPU is not executing instructions, the only

exits from any of the Idle modes are by interrupt, WDT

time-out or a Reset. When a wake event occurs, CPU

execution is delayed by an interval of TCSD

(Parameter 38, Ta b l e 2 6 - 8 ) while it becomes ready to

execute code. When the CPU begins executing code,

it resumes with the same clock source for the current

Idle mode. For example, when waking from RC_IDLE

mode, the internal oscillator block will clock the CPU

and peripherals (in other words, RC_RUN mode). The

IDLEN and SCS bits are not affected by the wake-up.

While in any Idle mode or Sleep mode, a WDT time-

out will result in a WDT wake-up to the Run mode

currently specified by the SCS<1:0> bits.

FIGURE 4-5: TRAN SITION TIMING FOR ENTRY TO SLEEP MODE

FIGURE 4-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)

Q4Q3Q2

OSC1

Peripheral

Sleep

Program

Q1Q1

Counter

Clock

CPU

Clock

PC + 2PC

Q3 Q4 Q1 Q2

OSC1

Peripheral

Program PC

PLL Clock

Q3 Q4

Output

CPU Clock

Q1 Q2 Q3 Q4 Q1 Q2

Clock

Counter PC + 6

PC + 4

Q1 Q2 Q3 Q4

Wake Event

Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

TOST(1) TPLL(1)

OSTS bit Set

PC + 2

PIC18F2331/2431/4331/4431

DS39616D-page 44  2010 Microchip Technology Inc.

4.4.1 PRI_IDLE MODE

This mode is unique among the three low-power Idle

modes, in that it does not disable the primary device

clock. For timing-sensitive applications, this allows for

the fastest resumption of device operation with its more

accurate primary clock source, since the clock source

does not have to “warm-up” or transition from another

oscillator.

PRI_IDLE mode is entered from PRI_RUN mode by

setting the IDLEN bit and executing a SLEEP instruc-

tion. If the device is in another Run mode, set IDLEN

first, then clear the SCS bits and execute SLEEP.

Although the CPU is disabled, the peripherals continue

to be clocked from the primary clock source specified

by the FOSC<3:0> Configuration bits. The OSTS bit

remains set (see Figure 4-7).

When a wake event occurs, the CPU is clocked from the

primary clock source. A delay of interval, TCSD, is

required between the wake event and when code

execution starts. This is required to allow the CPU to

become ready to execute instructions. After the wake-

up, the OSTS bit remains set. The IDLEN and SCS bits

are not affected by the wake-up (see Figure 4-8).

4.4.2 SEC_IDLE MODE

In SEC_IDLE mode, the CPU is disabled but the

peripherals continue to be clocked from the Timer1

oscillator. This mode is entered from SEC_RUN by

setting the IDLEN bit and executing a SLEEP

instruction. If the device is in another Run mode, set the

IDLEN bit first, then set the SCS<1:0> bits to ‘01’ and

execute SLEEP. When the clock source is switched to

the Timer1 oscillator, the primary oscillator is shut down,

the OSTS bit is cleared and the T1RUN bit is set.

When a wake event occurs, the peripherals continue to

be clocked from the Timer1 oscillator. After an interval

of TCSD, following the wake event, the CPU begins exe-

cuting code being clocked by the Timer1 oscillator. The

IDLEN and SCS bits are not affected by the wake-up;

the Timer1 oscillator continues to run (see Figure 4-8).

FIGURE 4-7: TRANSITION TI MING FOR ENTRY TO IDLE MODE

FIGURE 4-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE

Note: The Timer1 oscillator should already be

running prior to entering SEC_IDLE

mode. If the T1OSCEN bit is not set when

the SLEEP instruction is executed, the

SLEEP instruction will be ignored and

entry to SEC_IDLE mode will not occur. If

the Timer1 oscillator is enabled but not yet

running, peripheral clocks will be delayed

until the oscillator has started. In such

situations, initial oscillator operation is far

from stable and unpredictable operation

may result.

Peripheral

Program PC PC + 2

OSC1

Q3 Q4 Q1

CPU Clock

Clock

Counter

OSC1

Peripheral

Program PC

CPU Clock

Q1 Q3 Q4

Clock

Counter

Wake Event

TCSD

 2010 Microchip Technology Inc. DS39616D-page 45

PIC18F2331/2431/4331/4431

4.4.3 RC_IDLE MODE

In RC_IDLE mode, the CPU is disabled but the periph-

erals continue to be clocked from the internal oscillator

block using the INTOSC multiplexer. This mode allows

for controllable power conservation during Idle periods.

From RC_RUN, this mode is entered by setting the

IDLEN bit and executing a SLEEP instruction. If the

device is in another Run mode, first set IDLEN, then set

the SCS1 bit and execute SLEEP. Although its value is

ignored, it is recommended that SCS0 also be cleared;

this is to maintain software compatibility with future

devices. The INTOSC multiplexer may be used to

select a higher clock frequency by modifying the IRCF

bits before executing the SLEEP instruction. When the

clock source is switched to the INTOSC multiplexer, the

primary oscillator is shut down and the OSTS bit is

cleared.

If the IRCF bits are set to any non-zero value, or the

INTSRC bit is set, the INTOSC output is enabled. The

IOFS bit becomes set, after the INTOSC output

becomes stable, after an interval of TIOBST

(Parameter 39, Table 26-8). Clocks to the peripherals

continue while the INTOSC source stabilizes. If the

IRCF bits were previously at a non-zero value, or

INTSRC was set before the SLEEP instruction was

executed, and the INTOSC source was already stable,

the IOFS bit will remain set. If the IRCF bits and

INTSRC are all clear, the INTOSC output will not be

enabled, the IOFS bit will remain clear and there will be

no indication of the current clock source.

When a wake event occurs, the peripherals continue to

be clocked from the INTOSC multiplexer. After a delay of

CSD, following the wake event, the CPU begins execut-

ing code being clocked by the INTOSC multiplexer. The

IDLEN and SCS bits are not affected by the wake-up.

The INTRC source will continue to run if either the WDT

or the Fail-Safe Clock Monitor is enabled.

4.5 Exiting Idle and Sleep Modes

An exit from Sleep mode or any of the Idle modes, is

triggered by an interrupt, a Reset or a WDT time-out.

This section discusses the triggers that cause exits

from power-managed modes. The clocking subsystem

actions are discussed in more detail in each of the

sections that relate to the power-managed modes (see

Section 4.2 “Run Modes”, Section 4.3 “Sleep

Mode” and Section 4.4 “Idle Modes”).

4.5.1 EXIT BY INTERRUPT

Any of the available interrupt sources can cause the

device to exit from an Idle mode or Sleep mode to a

Run mode. To enable this functionality, an interrupt

source must be enabled by setting its enable bit in one

of the INTCON or PIE registers. The exit sequence is

initiated when the corresponding interrupt flag bit is set.

On all exits from Idle or Sleep modes by interrupt, code

execution branches to the interrupt vector if the GIE/

GIEH bit (INTCON<7>) is set. Otherwise, code execution

continues or resumes without branching (see

Section 10.0 “Interrupts”).

A fixed delay of interval, TCSD, following the wake

event, is required when leaving Sleep and Idle modes.

This delay is required for the CPU to prepare for execu-

tion. Instruction execution resumes on the first clock

cycle following this delay.

4.5.2 EXIT BY WDT TIME-OUT

A WDT time-out will cause different actions depending

on which power-managed mode the device is in when

the time-out occurs.

If the device is not executing code (all Idle modes and

Sleep mode), the time-out will result in an exit from the

power-managed mode (see Section 4.2 “Run

Modes” and Section 4.3 “Sleep Mode”). If the device

is executing code (all Run modes), the time-out will

result in a WDT Reset (see Section 23.2 “Watchdog

Timer (WDT)”).

The WDT timer and postscaler are cleared by

executing a SLEEP or CLRWDT instruction, the loss of a

currently selected clock source (if the Fail-Safe Clock

Monitor is enabled) and modifying the IRCF bits in the

OSCCON register if the internal oscillator block is the

device clock source.

4.5.3 EXIT BY RESET

Normally, the device is held in Reset by the Oscillator

Start-up Timer (OST) until the primary clock becomes

ready. At that time, the OSTS bit is set and the device

begins executing code. If the internal oscillator block is

the new clock source, the IOFS bit is set instead.

The exit delay time from Reset to the start of code

execution depends on both the clock sources before

and after the wake-up, and the type of oscillator if the

new clock source is the primary clock. Exit delays are

summarized in Ta bl e 4 - 2 .

Code execution can begin before the primary clock

becomes ready. If either the Two-Speed Start-up (see

Section 23.3 “Two-Speed Start-up”) or Fail-Safe

Clock Monitor (see Section 23.4 “Fail-Safe Clock

Monitor”) is enabled, the device may begin execution

as soon as the Reset source has cleared. Execution is

clocked by the INTOSC multiplexer driven by the

internal oscillator block. Execution is clocked by the

internal oscillator block until either the primary clock

becomes ready or a power-managed mode is entered

before the primary clock becomes ready; the primary

clock is then shut down.

PIC18F2331/2431/4331/4431

DS39616D-page 46  2010 Microchip Technology Inc.

4.5.4 EXIT WITHOUT AN OSCILLATOR

START-UP DELAY

Certain exits from power-managed modes do not

invoke the OST at all. There are two cases:

• PRI_IDLE mode, where the primary clock source

is not stopped; and

• the primary clock source is not any of the LP, XT,

HS or HSPLL modes.

In these instances, the primary clock source either

does not require an oscillator start-up delay since it is

already running (PRI_IDLE), or normally does not

require an oscillator start-up delay (RC, EC and INTIO

Oscillator modes). However, a fixed delay of interval,

CSD, following the wake event, is still required when

leaving Sleep and Idle modes to allow the CPU to

prepare for execution. Instruction execution resumes

on the first clock cycle following this delay.

TABLE 4-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE

(BY CLOCK SOURCES)

Clock Source

Before Wake-up Clock Source

After Wake-up Exit Delay Clock Ready Status

Bit (OSCCON)

Primary Device Clock

(PRI_IDLE mode)

LP, XT, HS

CSD(1) OSTSHSPLL

EC, RC

INTOSC(2) IOFS

T1OSC

LP, XT, HS TOST(3)

OSTSHSPLL TOST + trc(3)

EC, RC TCSD(1)

INTOSC(2) TIOBST(4) IOFS

INTOSC(3)

LP, XT, HS TOST(3)

OSTSHSPLL TOST + trc(3)

EC, RC TCSD(1)

INTOSC(2) None IOFS

None

(Sleep mode)

LP, XT, HS TOST(3)

OSTSHSPLL TOST + trc(3)

EC, RC TCSD(1)

INTOSC(2) TIOBST(4) IOFS

Note 1: TCSD (Parameter 38) is a required delay when waking from Sleep and all Idle modes, and runs concur-

rently with any other required delays (see Sect ion 4.4 “Idle Modes”).

2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.

3: T

OST is the Oscillator Start-up Timer (Parameter 32). trc is the PLL Lock-out Timer (Parameter F12); it is

also designated as TPLL.

4: Execution continues during TIOBST (Parameter 39), the INTOSC stabilization period.

 2010 Microchip Technology Inc. DS39616D-page 47

PIC18F2331/2431/4331/4431

5.0 RESET

The PIC18F2331/2431/4331/4431 devices differentiate

between various kinds of Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during

execution)

e) Programmable Brown-out Reset (BOR)

f) RESET Instruction

g) Stack Full Reset

h) Stack Underflow Reset

This section discusses Resets generated by MCLR,

POR and BOR, and the operation of the various start-

up timers. Stack Reset events are covered in

Section 6.1.2.4 “Stack Full/Underflow Resets”.

WDT Resets are covered in Section 23.2 “Watchdog

Timer (WDT)”.

A simplified block diagram of the On-Chip Reset Circuit

is shown in Figure 5-1.

FIGURE 5-1: SIMPLIFIE D BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

External Reset

MCLR

VDD

OSC1

WDT

Time-out

VDD Rise

Detect

OST/PWRT

INTRC

POR Pulse

OST

10-Bit Ripple Counter

PWRT

Chip_Reset

11-Bit Ripple Counter

Enable OST(1)

Enable PWRT

Note 1: See Table 5-1 for time-out situations.

Brown-out

Reset

BOREN

RESET

Instruction

Stack

Pointer

Stack Full/Underflow Reset

Sleep

( )_IDLE

1024 Cycles

65.5 ms

32 s

MCLRE

PIC18F2331/2431/4331/4431

DS39616D-page 48  2010 Microchip Technology Inc.

5.1 RCON Register

Device Reset events are tracked through the RCON

indicate that a specific Reset event has occurred. In most

cases, these bits can only be cleared by the event and

must be set by the application after the event. The state

of these flag bits, taken together, can be read to indicate

the type of Reset that just occurred. This is described in

more detail in Section 5.6 “R es et Sta t e of Registers” .

The RCON register also has control bits for setting

interrupt priority (IPEN) and software control of the

BOR (SBOREN). Interrupt priority is discussed in

Section 10.0 “Interrupts”. BOR is covered in

Section 5.4 “Brown-out Reset (BOR)”.

Note 1: If the BOREN Configuration bit is set

(Brown-out Reset enabled), the BOR bit

is ‘1’ on a Power-on Reset. After a

Brown-out Reset has occurred, the BOR

bit will be cleared and must be set by

firmware to indicate the occurrence of the

next Brown-out Reset.

2: It is recommended that the POR bit be

set after a Power-on Reset has been

detected, so that subsequent Power-on

Resets may be detected.

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0

IPEN ——RITO PD POR(2) BOR(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts

0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)

bit 6-5 Unimplemented: Read as ‘0’

bit 4 RI: RESET Instruction Flag bit

1 = The RESET instruction was not executed (set by firmware only)

0 = The RESET instruction was executed causing a device Reset (must be set in software after a

Brown-out Reset occurs)

bit 3 TO: Watchdog Time-out Flag bit

1 = Set by power-up, CLRWDT instruction or SLEEP instruction

0 = A WDT time-out occurred

bit 2 PD: Power-Down Detection Flag bit

1 = Set by power-up or by the CLRWDT instruction

0 = Set by execution of the SLEEP instruction

bit 1 POR: Power-on Reset Status bit(2)

1 = A Power-on Reset has not occurred (set by firmware only)

0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)

bit 0 BOR: Brown-out Reset Status bit(1)

1 = A Brown-out Reset has not occurred (set by firmware only)

0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)

Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.

2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this

Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent

Power-on Resets may be detected.

2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to

‘1’ by software immediately after a Power-on Reset).

 2010 Microchip Technology Inc. DS39616D-page 49

PIC18F2331/2431/4331/4431

5.2 Master Clear (MCLR)

The MCLR pin can trigger an external Reset of the

device by holding the pin low. These devices have a

noise filter in the MCLR Reset path that detects and

ignores small pulses.

The MCLR pin is not driven low by any internal Resets,

including the Watchdog Timer.

In PIC18F2331/2431/4331/4431 devices, the MCLR

input can be disabled with the MCLRE Configuration

bit. When MCLR is disabled, the pin becomes a digital

input. For more information, see Section 11.5

“PORTE, TRISE and LATE Registers”.

5.3 Power-on Reset (POR)

A Power-on Reset pulse is generated on-chip when-

ever VDD rises above a certain threshold. This allows

the device to start in the initialized state when VDD is

adequate for operation.

To take advantage of the POR circuitry, tie the MCLR

pin through a resistor (1 k to 10 k) to VDD. This will

eliminate external RC components usually needed to

create a Power-on Reset delay. The minimum rise rate

for VDD is specified (Parameter D004). For a slow rise

time, see Figure 5-2.

When the device starts normal operation (i.e., exits the

Reset condition), device operating parameters (such

as voltage, frequency and temperature) must be met to

ensure operation. If these conditions are not met, the

device must be held in Reset until the operating

conditions are met.

Power-on Reset events are captured by the POR bit

(RCON<1>). The state of the bit is set to ‘0’ whenever

a POR occurs and does not change for any other Reset

event. POR is not reset to ‘1’ by any hardware event.

To capture multiple events, the user manually resets

the bit to ‘1’ in software following any Power-on Reset.

FIGURE 5-2: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

5.4 Brown-out Reset (BOR)

A Configuration bit, BOREN, can disable (if clear/

programmed) or enable (if set) the Brown-out Reset

circuitry. If VDD falls below VBOR (Parameter D005A

through D005F) for greater than TBOR (Parameter 35),

the brown-out situation will reset the chip. A Reset may

not occur if VDD falls below VBOR for less than TBOR.

The chip will remain in Brown-out Reset until VDD rises

above VBOR. If the Power-up Timer is enabled, it will be

invoked after VDD rises above VBOR; it then will keep

the chip in Reset for an additional time delay TPWRT

(Parameter 33). If VDD drops below VBOR while the

Power-up Timer is running, the chip will go back into a

Brown-out Reset and the Power-up Timer will be

initialized. Once VDD rises above VBOR, the Power-up

Timer will execute the additional time delay. Enabling

the Brown-out Reset does not automatically enable the

PWRT.

Note: The following decoupling method is

recommended:

1. A 1 F capacitor should be connected

across AVDD and AVSS.

2. A similar capacitor should be

connected across VDD and VSS.

Note 1: External Power-on Reset circuit is

required only if the VDD power-up slope is

too slow. The diode, D, helps discharge

the capacitor quickly when VDD powers

down.

2: R < 40 k is recommended to make

sure that the voltage drop across R does

not violate the device’s electrical

specification.

3: R1  1 k will limit any current flowing

into MCLR from external capacitor, C, in

the event of MCLR/VPP pin breakdown,

due to Electrostatic Discharge (ESD) or

Electrical Overstress (EOS).

VDD

MCLR

PIC18FXXXX

VDD

PIC18F2331/2431/4331/4431

DS39616D-page 50  2010 Microchip Technology Inc.

5.5 Device Reset Timers

PIC18F2331/2431/4331/4431 devices incorporate

three separate on-chip timers that help regulate the

Power-on Reset process. Their main function is to

ensure that the device clock is stable before code is

executed. These timers are:

• Power-up Timer (PWRT)

• Oscillator Start-up Timer (OST)

• PLL Lock Time-out

5.5.1 POWER-UP TIMER (PWRT)

The Power-up Timer (PWRT) of PIC18F2331/2431/

4331/4431 devices is an 11-bit counter that uses the

INTRC source as the clock input. This yields an

approximate time interval of 2,048 x 32 s = 65.6 ms.

While the PWRT is counting, the device is held in

Reset. The power-up time delay depends on the

INTRC clock and will vary from chip to chip due to tem-

perature and process variation. See DC Parameter 33

for details.

The PWRT is enabled by clearing the PWRTEN

Configuration bit.

5.5.2 OSCILLATOR START-UP TIMER

(OST)

The Oscillator Start-up Timer (OST) provides a

1,024 oscillator cycle (from OSC1 input) delay after the

PWRT delay is over (Parameter 33). This ensures that

the crystal oscillator or resonator has started and

stabilized.

The OST time-out is invoked only for XT, LP, HS and

HSPLL modes, and on Power-on Reset or on exit from

most power-managed modes.

5.5.3 PLL LOCK TIME-OUT

With the PLL enabled in its PLL mode, the time-out

sequence following a Power-on Reset is slightly differ-

ent from other oscillator modes. A separate timer is

used to provide a fixed time-out that is sufficient for the

PLL to lock to the main oscillator frequency. This PLL

Lock Time-out (TPLL) is typically 2 ms and follows the

oscillator start-up time-out.

5.5.4 TIME-OUT SEQUENCE

On power-up, the time-out sequence is as follows:

1. After the POR pulse has cleared, the PWRT time-out

is invoked (if enabled).

2. Then, the OST is activated.

The total time-out will vary based on oscillator configu-

ration and the status of the PWRT. Figure 5-3 through

Figure 5-7 depict time-out sequences on power-up,

with the Power-up Timer enabled and the device oper-

ating in HS Oscillator mode. Figure 5-3 through

Figure 5-6 also apply to devices operating in XT or LP

modes.

For devices in RC mode, and with the PWRT disabled,

there will be no time-out at all. Since the time-outs

occur from the POR pulse, if MCLR is kept low long

enough, all time-outs will expire. Bringing MCLR high

will begin execution immediately (Figure 5-5). This is

useful for testing purposes or synchronization of more

than one PIC18FXXXX device operating in parallel.

TABLE 5-1: TIME-OUT IN VARIOUS SITUATIONS

Oscillator

Configuration

Power-up(2) and Brown-out Exit From

Power-Managed Mode

PWRTEN = 0PWRTEN = 1

HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2)

HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC

EC, ECIO 66 ms(1) ——

RC, RCIO 66 ms(1) ——

INTIO1, INTIO2 66 ms(1) ——

Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.

2: 2 ms is the nominal time required for the 4x PLL to lock.

 2010 Microchip Technology Inc. DS39616D-page 51

PIC18F2331/2431/4331/4431

5.6 Reset State of Registers

Most registers are unaffected by a Reset. Their status

is unknown on POR and unchanged by all other

Resets. The other registers are forced to a “Reset

state” depending on the type of Reset that occurred.

Most registers are not affected by a WDT wake-up,

since this is viewed as the resumption of normal

operation.

Status bits from the RCON register (RI, TO, PD, POR

and BOR) are set or cleared differently in different

Reset situations, as indicated in Ta b l e 5 - 2 . These bits

are used in software to determine the nature of the

Reset.

Table 5-3 describes the Reset states for all of the

Special Function Registers. These are categorized by

Power-on and Brown-out Resets, Master Clear and

WDT Resets, and WDT wake-ups.

FIGU RE 5-3 : TIME-O UT SEQ UENCE ON POWER -UP (MCL R T IED TO VDD, VDD RISE < TPWRT)

FIGURE 5-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

PIC18F2331/2431/4331/4431

DS39616D-page 52  2010 Microchip Technology Inc.

FIGURE 5-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT T IED TO VDD): CASE 2

FIGURE 5-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

0V 1V

TPWRT

TOST

 2010 Microchip Technology Inc. DS39616D-page 53

PIC18F2331/2431/4331/4431

FIGURE 5-7: TIME-OUT SEQU ENCE ON POR w/PLL ENABLED (MCLR TIED TO VDD)

TABLE 5-2: ST ATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR

RCON REGISTER

Condition Program

Counter RCON

Power-on Reset 0000h 0--1 1100 1 1 1 0 0 0 0

RESET Instruction 0000h 0--0 uuuu 0 u u u u u u

Brown-out 0000h 0--1 11u- 1 1 1 u 0 u u

MCLR Reset during power-managed

Run modes

0000h 0--u 1uuu u 1 u u u u u

MCLR Reset during power-managed Idle

and Sleep modes

0000h 0--u 10uu u 1 0 u u u u

WDT Time-out during full power or

power-managed Run modes

0000h 0--u 0uuu u 0 u u u u u

MCLR Reset during full-power execution

0000h 0--u uuuu u u u u u

Stack Full Reset (STVREN = 1)1u

Stack Underflow Reset (STVREN = 1)u1

Stack Underflow Error (not an actual

Reset, STVREN = 0)

0000h u--u uuuu u u u u u u 1

WDT time-out during power-managed Idle

or Sleep modes

PC + 2 u--u 00uu u 0 0 u u u u

Interrupt exit from power-managed modes PC + 2(1) u--u u0uu u u 0 u u u u

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’.

Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the

interrupt vector (0x000008h or 0x000018h).

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

PLL TIME-OUT

TPLL

Note: TOST = 1024 clock cycles.

TPLL  2 ms max. First three stages of the PWRT timer.

PIC18F2331/2431/4331/4431

DS39616D-page 54  2010 Microchip Technology Inc.

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS

Regist er App lica ble D evic es Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

TOSU 2331 2431 4331 4431 ---0 0000 ---0 0000 ---0 uuuu(3)

TOSH 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu(3)

TOSL 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu(3)

STKPTR 2331 2431 4331 4431 00-0 0000 uu-0 0000 uu-u uuuu(3)

PCLATU 2331 2431 4331 4431 ---0 0000 ---0 0000 ---u uuuu

PCLATH 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PCL 2331 2431 4331 4431 0000 0000 0000 0000 PC + 2(2)

TBLPTRU 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

TBLPTRH 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TBLPTRL 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TABLAT 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PRODH 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

PRODL 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

INTCON 2331 2431 4331 4431 0000 000x 0000 000u uuuu uuuu(1)

INTCON2 2331 2431 4331 4431 1111 -1-1 1111 -1-1 uuuu -u-u(1)

INTCON3 2331 2431 4331 4431 11-0 0-00 11-0 0-00 uu-u u-uu(1)

INDF0 2331 2431 4331 4431 N/A N/A N/A

POSTINC0 2331 2431 4331 4431 N/A N/A N/A

POSTDEC0 2331 2431 4331 4431 N/A N/A N/A

PREINC0 2331 2431 4331 4431 N/A N/A N/A

PLUSW0 2331 2431 4331 4431 N/A N/A N/A

FSR0H 2331 2431 4331 4431 ---- xxxx ---- uuuu ---- uuuu

FSR0L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

WREG 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

INDF1 2331 2431 4331 4431 N/A N/A N/A

POSTINC1 2331 2431 4331 4431 N/A N/A N/A

POSTDEC1 2331 2431 4331 4431 N/A N/A N/A

PREINC1 2331 2431 4331 4431 N/A N/A N/A

PLUSW1 2331 2431 4331 4431 N/A N/A N/A

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

 2010 Microchip Technology Inc. DS39616D-page 55

PIC18F2331/2431/4331/4431

FSR1H 2331 2431 4331 4431 ---- 0000 ---- uuuu ---- uuuu

FSR1L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

BSR 2331 2431 4331 4431 ---- 0000 ---- 0000 ---- uuuu

INDF2 2331 2431 4331 4431 N/A N/A N/A

POSTINC2 2331 2431 4331 4431 N/A N/A N/A

POSTDEC2 2331 2431 4331 4431 N/A N/A N/A

PREINC2 2331 2431 4331 4431 N/A N/A N/A

PLUSW2 2331 2431 4331 4431 N/A N/A N/A

FSR2H 2331 2431 4331 4431 ---- 0000 ---- uuuu ---- uuuu

FSR2L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

STATUS 2331 2431 4331 4431 ---x xxxx ---u uuuu ---u uuuu

TMR0H 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TMR0L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

T0CON 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

OSCCON 2331 2431 4331 4431 0000 q000 0000 q000 uuuu uuuu

LVDCON 2331 2431 4331 4431 --00 0101 --00 0101 --uu uuuu

WDTCON 2331 2431 4331 4431 0--- ---0 0--- ---0 u--- ---u

RCON(4) 2331 2431 4331 4431 0--1 11q0 0--q qquu u--u qquu

TMR1H 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

TMR1L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

T1CON 2331 2431 4331 4431 0000 0000 u0uu uuuu uuuu uuuu

TMR2 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PR2 2331 2431 4331 4431 1111 1111 1111 1111 1111 1111

T2CON 2331 2431 4331 4431 -000 0000 -000 0000 -uuu uuuu

SSPBUF 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

SSPADD 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

SSPSTAT 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

SSPCON 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Regist er Applicable Devices Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

PIC18F2331/2431/4331/4431

DS39616D-page 56  2010 Microchip Technology Inc.

ADRESH 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

ADRESL 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

ADCON0 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

ADCON1 2331 2431 4331 4431 00-0 0000 00-0 0000 uu-u uuuu

ADCON2 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

ADCON3 2331 2431 4331 4431 00-0 0000 00-0 0000 uu-u uuuu

ADCHS 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

CCPR1H 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR1L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CCP1CON 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

CCPR2H 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR2L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CCP2CON 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

ANSEL1 2331 2431 4331 4431 ---- ---1 ---- ---1 ---- ---u

ANSEL0 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

T5CON 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

QEICON 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

SPBRGH 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

SPBRG 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

RCREG 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TXREG 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

TXSTA 2331 2431 4331 4431 0000 -010 0000 -010 uuuu -uuu

RCSTA 2331 2431 4331 4431 0000 000x 0000 000x uuuu uuuu

BAUDCON 2331 2431 4331 4431 -1-1 0-00 -1-1 0-00 -u-u u-uu

EEADR 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

EEDATA 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

EECON2 2331 2431 4331 4431 0000 0000 0000 0000 0000 0000

EECON1 2331 2431 4331 4431 xx-0 x000 uu-0 u000 uu-0 u000

IPR3 2331 2431 4331 4431 ---1 1111 ---1 1111 ---u uuuu

PIE3 2331 2431 4331 4431 ---0 0000 ---0 0000 ---u uuuu

PIR3 2331 2431 4331 4431 ---0 0000 ---0 0000 ---u uuuu

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Regist er Applicable Devices Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

 2010 Microchip Technology Inc. DS39616D-page 57

PIC18F2331/2431/4331/4431

IPR2 2331 2431 4331 4431 1--1 -1-1 1--1 -1-1 u--u -u-u

PIR2 2331 2431 4331 4431 0--0 -0-0 0--0 -0-0 u--u -u-u

PIE2 2331 2431 4331 4431 0--0 -0-0 0--0 -0-0 u--u -u-u

IPR1 2331 2431 4331 4431 -111 1111 -111 1111 -uuu uuuu

PIR1 2331 2431 4331 4431 -000 0000 -000 0000 -uuu uuuu(1)

2331 2431 4331 4431 -000 0000 -000 0000 -uuu uuuu(1)

PIE1 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

2331 2431 4331 4431 -000 0000 -000 0000 -uuu uuuu

OSCTUNE 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

TRISE(6) 2331 2431 4331 4431 ---- -111 ---- -111 ---- -uuu

TRISD 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

TRISC 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

TRISB 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

TRISA(5) 2331 2431 4331 4431 1111 1111(5) 1111 1111(5) uuuu uuuu(5)

PR5H 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

PR5L 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

LATE(6) 2331 2431 4331 4431 ---- -xxx ---- -uuu ---- -uuu

LATD 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

LATC 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

LATB 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

LATA(5) 2331 2431 4331 4431 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5)

TMR5H 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

TMR5L 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

PORTE(6) 2331 2431 4331 4431 ---- xxxx ---- xxxx ---- uuuu

PORTD 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

PORTC 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

PORTB 2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

PORTA(5) 2331 2431 4331 4431 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5)

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Regist er Applicable Devices Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

PIC18F2331/2431/4331/4431

DS39616D-page 58  2010 Microchip Technology Inc.

PTCON0 2331 2431 4331 4431 0000 0000 uuuu uuuu uuuu uuuu

PTCON1 2331 2431 4331 4431 00-- ---- 00-- ---- uu-- ----

PTMRL 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PTMRH 2331 2431 4331 4431 ---- 0000 ---- 0000 ---- uuuu

PTPERL 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

PTPERH 2331 2431 4331 4431 ---- 1111 ---- 1111 ---- uuuu

PDC0L 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PDC0H 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

PDC1L 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PDC1H 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

PDC2L 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PDC2H 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

PDC3L 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

PDC3H 2331 2431 4331 4431 --00 0000 --00 0000 --uu uuuu

SEVTCMPL 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

SEVTCMPH 2331 2431 4331 4431 ---- 0000 ---- 0000 ---- uuuu

PWMCON0 2331 2431 4331 4431 -111 0000 -111 0000 -uuu uuuu

PWMCON1 2331 2431 4331 4431 0000 0-00 0000 0-00 uuuu u-uu

DTCON 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

FLTCONFIG 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

OVDCOND 2331 2431 4331 4431 1111 1111 1111 1111 uuuu uuuu

OVDCONS 2331 2431 4331 4431 0000 0000 0000 0000 uuuu uuuu

CAP1BUFH/

VELRH

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CAP1BUFL/

VELRL

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CAP2BUFH/

POSCNTH

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CAP2BUFL/

POSCNTL

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CAP3BUFH/

MAXCNTH

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Regist er Applicable Devices Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

 2010 Microchip Technology Inc. DS39616D-page 59

PIC18F2331/2431/4331/4431

CAP3BUFL/

MAXCNTL

2331 2431 4331 4431 xxxx xxxx uuuu uuuu uuuu uuuu

CAP1CON 2331 2431 4331 4431 -0-- 0000 -0-- 0000 -u-- uuuu

CAP2CON 2331 2431 4331 4431 -0-- 0000 -0-- 0000 -u-- uuuu

CAP3CON 2331 2431 4331 4431 -0-- 0000 -0-- 0000 -u-- uuuu

DFLTCON 2331 2431 4331 4431 -000 0000 -000 0000 -uuu uuuu

TABLE 5-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Regist er Applicable Devices Power-on Reset,

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Resets

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 5-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

6: Bit 3 of PORTE and LATE are enabled if MCLR functionality is disabled. When not enabled as the PORTE

pin, they are disabled and read as ‘0’. The 28-pin devices do not have only RE3 implemented.

PIC18F2331/2431/4331/4431

DS39616D-page 60  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 61

PIC18F2331/2431/4331/4431

6.0 MEMORY ORGANIZATION

There are three memory types in enhanced MCU

devices. These memory types are:

• Program Memory

• Data RAM

• Data EEPROM

As Harvard architecture devices, the data and program

memories use separate buses, enabling concurrent

access of the two memory spaces. The data EEPROM,

for practical purposes, can be regarded as a peripheral

device, since it is addressed and accessed through a

set of control registers.

Additional detailed information on the operation of the

Flash program memory is provided in Section 8.0

“Flash Program Memory”. Data EEPROM is

discussed separately in Section 7.0 “Data EEPROM

Memory”.

FIGU RE 6- 1 : PRO GRA M M EMO RY MA P

AND ST ACK FOR

PIC18F2331/4331

6.1 Program Memory Organization

PIC18 microcontrollers implement a 21-bit program

counter that can address a 2-Mbyte program memory

space. Accessing a location between the upper bound-

ary of the physically implemented memory and the

2-Mbyte address will return all ‘0’s (a NOP instruction).

The PIC18F2331/4331 devices each have 8 Kbytes of

Flash memory and can store up to 4,096 single-word

instructions.

The PIC18F2431/4431 devices each have 16 Kbytes

of Flash memory and can store up to 8,192 single-word

instructions.

PIC18 devices have two interrupt vectors. The Reset

vector address is at 000000h and the interrupt vector

addresses are at 000008h and 000018h.

The program memory maps for PIC18F2331/4331 and

PIC18F2431/4431 devices are shown in Figure 6-1

and Figure 6-2, respectively.

FIGURE 6-2: PROGRAM MEMORY MAP

AND STACK F O R

PIC18F 2431/ 4431

PC<20:0>

Stack Level 1



Stack Level 31

Reset Vector LSb

High-Priority Interrupt Vector LSb



User Memory

Space

CALL,RCALL,RETURN

RETFIE,RETLW

000000h

000008h

000018h

1FFFFFh

Low-Priority Interrupt Vector LSb

On-Chip Flash

Program Memory

002000h

001FFFh

Unused

Read ‘0’s

PC<20:0>

Stack Level 1



Stack Level 31

Reset Vector LSb

High-Priority Interrupt Vector LSb



User Memory

Space

CALL,RCALL,RETURN

RETFIE,RETLW

000000h

000008h

000018h

1FFFFFh

Low-Priority Interrupt Vector LSb

On-Chip Flash

Program Memory

004000h

003FFFh

Unused

Read ‘0’s

PIC18F2331/2431/4331/4431

DS39616D-page 62  2010 Microchip Technology Inc.

6.1.1 PROGRAM COUNTER

The Program Counter (PC) specifies the address of the

instruction to fetch for execution. The PC is 21 bits wide

and contained in three 8-bit registers. The low byte,

known as the PCL register, is both readable and writ-

able. The high byte (PCH register) contains the

PC<15:8> bits and is not directly readable or writable.

Updates to the PCH register are performed through the

PCLATH register. The upper byte is the PCU register

and contains the bits, PC<20:16>. This register is also

not directly readable or writable. Updates to the PCU

The contents of PCLATH and PCLATU are transferred

to the program counter by any operation that writes to

the PCL. Similarly, the upper two bytes of the program

counter are transferred to PCLATH and PCLATU by an

operation that reads PCL. This is useful for computed

offsets to the PC (see Section 6.1.4.1 “Computed

GOTO”).

The PC addresses bytes in the program memory. To

prevent the PC from becoming misaligned with word

instructions, the Least Significant bit of the PCL is fixed

to a value of ‘0‘. The PC increments by two to address

sequential instructions in the program memory.

The CALL, RCALL, GOTO and program branch instruc-

tions write to the program counter directly. For these

instructions, the contents of PCLATH and PCLATU are

not transferred to the program counter.

6.1.2 RETURN ADDRESS STACK

The return address stack allows any combination of up

to 31 program calls and interrupts to occur. The PC

(Program Counter) is pushed onto the stack when a

CALL or RCALL instruction is executed, or an interrupt

is Acknowledged. The PC value is pulled off the stack

on a RETURN, RETLW or a RETFIE instruction.

PCLATU and PCLATH are not affected by any of the

RETURN or CALL instructions.

The stack operates as a 31-word by 21-bit RAM and a

5-bit Stack Pointer, with the Stack Pointer initialized to

00000b after all Resets. There is no RAM associated

with Stack Pointer, 00000b. This is only a Reset value.

During a CALL type instruction, causing a push onto the

stack, the Stack Pointer is first incremented and the

RAM location pointed to by the Stack Pointer is written

with the contents of the PC (already pointing to the

instruction following the CALL). During a RETURN type

instruction, causing a pop from the stack, the contents

of the RAM location pointed to by the STKPTR are

transferred to the PC and then the Stack Pointer is

decremented.

The stack space is not part of either program or data

space. The Stack Pointer is readable and writable, and

the address on the top of the stack is readable and

writable through the Top-of-Stack (TOS) Special Function

Registers. Data can also be pushed to, or popped from,

the stack using the Top-of-Stack SFRs. Status bits

indicate if the stack is full, has overflowed or underflowed.

6.1.2.1 Top-of-Stack Access

The top of the stack is readable and writable. Three

contents of the stack location pointed to by the

STKPTR register (Figure 6-3). This allows users to

implement a software stack if necessary. After a CALL,

RCALL or interrupt, the software can read the pushed

value by reading the TOSU, TOSH and TOSL registers.

These values can be placed on a user-defined software

stack. At return time, the software can replace the

TOSU, TOSH and TOSL and do a return.

The user must disable the global interrupt enable bits

while accessing the stack to prevent inadvertent stack

corruption.

6.1.2.2 Return Stack Pointer (STKPTR)

The STKPTR register (Register 6-1) contains the Stack

Pointer value, the STKFUL (Stack Full) status bit and

the STKUNF (Stack Underflow) status bits. The value

of the Stack Pointer can be 0 through 31. The Stack

Pointer increments before values are pushed onto the

stack and decrements after values are popped off the

stack. At Reset, the Stack Pointer value will be zero.

The user may read and write the Stack Pointer value.

This feature can be used by a Real-Time Operating

System (RTOS) for return stack maintenance.

After the PC is pushed onto the stack 31 times (without

popping any values off the stack), the STKFUL bit is

set. The STKFUL bit is cleared by software or by a

POR.

The action that takes place when the stack becomes

full depends on the state of the STVREN (Stack Over-

flow Reset Enable) Configuration bit. (Refer to

Section 23.1 “Configuration Bit s” for a description of

the device Configuration bits.) If STVREN is set

(default), the 31st push will push the (PC + 2) value

onto the stack, set the STKFUL bit and reset the

device. The STKFUL bit will remain set and the Stack

Pointer will be set to zero.

If STVREN is cleared, the STKFUL bit will be set on the

31st push and the Stack Pointer will increment to 31.

Any additional pushes will not overwrite the 31st push

and STKPTR will remain at 31.

 2010 Microchip Technology Inc. DS39616D-page 63

PIC18F2331/2431/4331/4431

When the stack has been popped enough times to

unload the stack, the next pop will return a value of zero

to the PC and set the STKUNF bit, while the Stack

Pointer remains at zero. The STKUNF bit will remain

set until cleared by software or a POR occurs.

FIGURE 6-3: RETURN ADDRESS ST ACK AND ASSOCIA TED REGISTERS

Note: Returning a value of zero to the PC on an

underflow has the effect of vectoring the

program to the Reset vector, where the

stack conditions can be verified and

appropriate actions can be taken. This is

not the same as a Reset as the contents

of the SFRs are not affected.

R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0

bit 7 bit 0

Legend: C = Clearable bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 STKFUL: Stack Full Flag bit(1)

1 = Stack became full or overflowed

0 = Stack has not become full or overflowed

bit 6 STKUNF: Stack Underflow Flag bit(1)

1 = Stack underflow occurred

0 = Stack underflow did not occur

bit 5 Unimplemented: Read as ‘0’

bit 4-0 SP<4:0>: Stack Pointer Location bits

Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.

00011

001A34h

11111

11110

11101

00010

00001

00000

00010

Return Address Stack

To p - o f - St a c k 000D58h

TOSLTOSHTOSU

34h1Ah00h

STKPTR<4:0>

PIC18F2331/2431/4331/4431

DS39616D-page 64  2010 Microchip Technology Inc.

6.1.2.3 PUSH and POP Instructions

Since the Top-of-Stack (TOS) is readable and writable,

the ability to push values onto the stack and pull values

off the stack without disturbing normal program execu-

tion is a desirable option. To push the current PC value

onto the stack, a PUSH instruction can be executed.

This will increment the Stack Pointer and load the

current PC value onto the stack. TOSU, TOSH and

TOSL can then be modified to place data or a return

address on the stack.

The PUSH instruction places the current PC value onto

the stack. This increments the Stack Pointer and loads

the current PC value onto the stack. The POP instruc-

tion discards the current TOS by decrementing the

Stack Pointer. The previous value pushed onto the

stack then becomes the TOS value.

6.1.2.4 Stack Full/Underflow Resets

These Resets are enabled by programming the

STVREN bit in Configuration Register 4L. When the

STVREN bit is cleared, a full or underflow condition will

set the appropriate STKFUL or STKUNF bit, but not

cause a device Reset. When the STVREN bit is set, a

full or underflow condition will set the appropriate

STKFUL or STKUNF bit and then cause a device

Reset. The STKFUL or STKUNF bits are cleared by the

user software or a Power-on Reset.

6.1.3 FAST REGISTER STACK

A Fast Register Stack is provided for the STATUS,

WREG and BSR registers, to provide a “fast return”

option for interrupts. The stack for each register is only

one level deep and is neither readable nor writable. It is

loaded with the current value of the corresponding

interrupt sources will push values into the stack

registers.

The values in the registers are then loaded back into

their associated registers if the RETFIE, FAST instruc-

tion is used to return from the interrupt. If both low and

high-priority interrupts are enabled, the stack registers

cannot be used reliably to return from low-priority inter-

rupts. If a high-priority interrupt occurs while servicing a

low-priority interrupt, the stack register values stored by

the low-priority interrupt will be overwritten. In these

cases, users must save the key registers in software

during a low-priority interrupt.

If interrupt priority is not used, all interrupts may use the

Fast Register Stack for returns from interrupt. If no

interrupts are used, the Fast Register Stack can be

used to restore the STATUS, WREG and BSR registers

at the end of a subroutine call. To use the Fast Register

Stack for a subroutine call, a CALL label, FAST

instruction must be executed to save the STATUS,

WREG and BSR registers to the Fast Register Stack. A

RETURN, FAST instruction is then executed to restore

these registers from the Fast Register Stack.

Example 6-1 shows a source code example that uses

the Fast Register Stack during a subroutine call and

return.

EXAMPLE 6-1: FAST REGISTER ST ACK

CODE EXAMPLE

6.1.4 LOOK-UP TABLES IN PROGRAM

MEMORY

There may be programming situations that require the

creation of data structures, or look-up tables, in

program memory. For PIC18 devices, look-up tables

can be implemented two ways:

• Computed GOTO

• Table Reads

6.1.4.1 Computed GOTO

A computed GOTO is accomplished by adding an offset

to the program counter. An example is shown in

Example 6-2.

A look-up table can be formed with an ADDWF PCL

instruction and a group of RETLW nn instructions. The

W register is loaded with an offset into the table before

executing a call to that table. The first instruction of the

called routine is the ADDWF PCL instruction. The next

instruction executed will be one of the RETLW nn

instructions that returns the value “nn” to the calling

function.

The offset value (in WREG) specifies the number of

bytes that the program counter should advance and

should be multiples of 2 (LSb = 0).

In this method, only one data byte can be stored in

each instruction location and room on the return

address stack is required.

EXAMPLE 6-2: COMPUTED GOTO USING

AN OFFSET VALUE

CALL SUB1, FAST ;STATUS, WREG, BSR

;SAVED IN FAST REGISTER

;STACK



SUB1



RETURN FAST ;RESTORE VALUES SAVED

;IN FAST REGISTER STACK

MOVFW OFFSET

CALL TABLE

ORG 0xnn00

TABLE ADDWF PCL

RETLW 0xnn

 2010 Microchip Technology Inc. DS39616D-page 65

PIC18F2331/2431/4331/4431

6.1.4.2 Table Reads and Table Writes

A better method of storing data in program memory

allows two bytes of data to be stored in each instruction

location. Look-up table data may be stored, two bytes

per program word, by using table reads and writes.

The Table Pointer register (TBLPTR) specifies the byte

address and the Table Latch register (TABLAT) con-

tains the data that is read from or written to program

memory. Data is transferred to or from program

memory, one byte at a time.

Table read and table write operations are discussed

further in Section 8.1 “Table Reads and Table

Writes”.

6.2 Clocking Scheme/Inst ruction

Cycle

The clock input (from OSC1) is internally divided by

four to generate four non-overlapping quadrature

clocks, namely Q1, Q2, Q3 and Q4. Internally, the

Program Counter (PC) is incremented every Q1, the

instruction is fetched from the program memory and

latched into the Instruction Register (IR) in Q4. The

instruction is decoded and executed during the

following Q1 through Q4. The clocks and instruction

execution flow are shown in Figure 6-4.

FIGU RE 6-4: CLOC K/INST RU CTIO N C YC LE

6.3 Instruction Flow/Pipelining

An “Instruction Cycle” consists of four Q cycles (Q1,

Q2, Q3 and Q4). The instruction fetch and execute are

pipelined such that fetch takes one instruction cycle,

while decode and execute take another instruction

cycle. However, due to the pipelining, each instruction

effectively executes in one cycle. If an instruction

causes the program counter to change (e.g., GOTO),

then two cycles are required to complete the instruction

(Example 6-3).

A fetch cycle begins with the Program Counter (PC)

incrementing in Q1.

In the execution cycle, the fetched instruction is latched

into the “Instruction Register” (IR) in cycle, Q1. This

instruction is then decoded and executed during the

Q2, Q3 and Q4 cycles. Data memory is read during Q2

(operand read) and written during Q4 (destination

write).

EXAMPLE 6-3: INSTRUCTION PIPELINE FLOW

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

OSC2/CLKO

(RC mode)

PC PC + 2 PC + 4

Fetch INST (PC)

Execute INST (PC – 2)

Fetch INST (PC + 2)

Execute INST (PC)

Fetch INST (PC + 4)

Execute INST (PC + 2)

Internal

Phase

Clock

All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction

is “flushed” from the pipeline, while the new instruction is being fetched and then executed.

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOVLW 55h Fetch 1 Execute 1

2. MOVWF PORTB Fetch 2 Execute 2

3. BRA SUB_1 Fetch 3 Execute 3

4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)

5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1

PIC18F2331/2431/4331/4431

DS39616D-page 66  2010 Microchip Technology Inc.

6.4 Instructions in Program Memory

The program memory is addressed in bytes. Instructions

are stored as two bytes or four bytes in program memory.

The Least Significant Byte of an instruction word is

always stored in a program memory location with an

even address (LSB = 0). Figure 6-5 shows an example of

how instruction words are stored in the program memory.

To maintain alignment with instruction boundaries, the

PC increments in steps of 2 and the LSB will always read

‘0’.

The CALL and GOTO instructions have the absolute

program memory address embedded into the instruction.

Since instructions are always stored on word boundaries,

the data contained in the instruction is a word address.

The word address is written to PC<20:1>, which

accesses the desired byte address in program memory.

Instruction 2 in Figure 6-5 shows how the instruction,

‘GOTO 000006h’, is encoded in the program memory.

Program branch instructions, which encode a relative

address offset, operate in the same manner. The offset

value stored in a branch instruction represents the num-

ber of single-word instructions that the PC will be offset

by. Section 24.0 “Instruction Set Summary” provides

further details of the instruction set.

6.4.1 TWO-WORD INSTRUCTIONS

The standard PIC18 instruction set has four two-word

instructions: CALL, MOVFF, GOTO and LSFR. In all

cases, the second word of the instructions always has

‘1111’ as its four Most Significant bits; the other 12 bits

are literal data, usually a data memory address.

The use of ‘1111’ in the four MSbs of an instruction

specifies a special form of NOP. If the instruction is exe-

cuted in proper sequence, immediately after the first

word, the data in the second word is accessed and

used by the instruction sequence. If the first word is

skipped for some reason and the second word is

executed by itself, a NOP is executed instead. This is

necessary for cases when the two-word instruction is

preceded by a conditional instruction that changes the

PC. Example 6-4 shows how this works.

FIGURE 6-5: INSTRUCTIONS IN PROGRAM MEMORY

EXAMPLE 6-4: TWO-WORD INSTRUCTI ONS

Note: For information on two-word instructions

in the extended instruction set, see

Section 24.2 “Instruction Set”.

CASE 1:

Object Code Source Code

0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?

1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word

1111 0100 0101 0110 ; Execute this word as a NOP

0010 0100 0000 0000 ADDWF REG3 ; continue code

CASE 2:

Object Code Source Code

0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?

1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word

1111 0100 0101 0110 ; 2nd word of instruction

0010 0100 0000 0000 ADDWF REG3 ; continue code

Word Address

LSB = 1LSB = 0

Program Memory

Byte Locations 

000000h

000002h

000004h

000006h

Instruction 1: MOVLW 055h 0Fh 55h 000008h

Instruction 2: GOTO 000006h EFh 03h 00000Ah

F0h 00h 00000Ch

Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh

F4h 56h 000010h

000012h

000014h

 2010 Microchip Technology Inc. DS39616D-page 67

PIC18F2331/2431/4331/4431

6.5 Data Memory Organization

The data memory in PIC18 devices is implemented as

static RAM. Each register in the data memory has a 12-bit

address, allowing up to 4,096 bytes of data memory. The

memory space is divided into as many as 16 banks that

contain 256 bytes each. PIC18F2331/2431/4331/4431

devices implement all 16 banks.

Figure 6-6 shows the data memory organization for the

PIC18F2331/2431/4331/4431 devices. The data mem-

ory contains Special Function Registers (SFRs) and

General Purpose Registers (GPRs). The SFRs are used

for control and status of the controller and peripheral

functions, while GPRs are used for data storage and

scratchpad operations in the user’s application. Any

read of an unimplemented location will read as ‘0’s.

The instruction set and architecture allow operations

across all banks. The entire data memory may be

accessed by Direct, Indirect or Indexed Addressing

modes. Addressing modes are discussed later in this

subsection.

To ensure that commonly used registers (SFRs and

select GPRs) can be accessed in a single cycle, PIC18

devices implement an Access Bank. This is a 256-byte

memory space that provides fast access to SFRs and

the lower portion of GPR Bank 0 without using the

BSR. Section 6.5.2 “Access Bank” provides a

detailed description of the Access RAM.

FIGURE 6- 6 : DATA MEM ORY MA P FO R PI C18 F 233 1/2 43 1/4 331 /4431 D EVI CES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory Map

BSR<3:0>

= 0000

= 0001

= 1111

060h

05Fh

F60h

FFFh

00h

5Fh

60h

FFh

Access Bank

When a = 0:

The BSR is ignored and the

Access Bank is used.

The first 96 bytes are

General Purpose RAM

(from Bank 0).

The second 160 bytes are

Special Function Registers

(from Bank 15).

When a = 1:

The BSR specifies the bank

used by the instruction.

F5Fh

F00h

EFFh

1FFh

100h

0FFh

000h

Access RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

Unused

Access RAM High

Access RAM Low

Bank 3

200h

Unused

Read ‘00h’

= 1110

= 0011

(SFRs)

= 0010 GPR

FFh

00h

Bank 2

300h

2FFh

PIC18F2331/2431/4331/4431

DS39616D-page 68  2010 Microchip Technology Inc.

6.5.1 BANK SELECT REGISTER (BSR)

Large areas of data memory require an efficient

addressing scheme to make rapid access to any

address possible. Ideally, this means that an entire

address does not need to be provided for each read or

write operation. For PIC18 devices, this is accom-

plished with a RAM banking scheme. This divides the

memory space into 16 contiguous banks of 256 bytes.

Depending on the instruction, each location can be

addressed directly by its full 12-bit address, or an 8-bit

low-order address and a four-bit Bank Pointer. Most

instructions in the PIC18 instruction set make use of

the Bank Pointer, known as the Bank Select Register

(BSR). This SFR holds the four Most Significant bits of

a location’s address; the instruction itself includes the

eight Least Significant bits. Only the four lower bits of

the BSR are implemented (BSR<3:0>). The upper four

bits are unused; they will always read ‘0’ and cannot be

written to. The BSR can be loaded directly by using the

MOVLB instruction.

The value of the BSR indicates the bank in data mem-

ory. The eight bits in the instruction show the location in

the bank and can be thought of as an offset from the

bank’s lower boundary. The relationship between the

BSR’s value and the bank division in data memory is

shown in Figure 6-6.

Since up to 16 registers may share the same low-order

address, the user must always be careful to ensure that

the proper bank is selected before performing a data

read or write. For example, writing what should be pro-

gram data to the eight-bit address of F9h, while the

BSR is 0Fh, will end up resetting the program counter.

While any bank can be selected, only those banks that

are actually implemented can be read or written to.

Writes to unimplemented banks are ignored, while

reads from unimplemented banks will return ‘0’s. Even

so, the STATUS register will still be affected as if the

operation was successful. The data memory map in

Figure 6-5 indicates which banks are implemented.

In the core PIC18 instruction set, only the MOVFF

instruction fully specifies the 12-bit address of the

source and target registers. This instruction ignores the

BSR completely when it executes. All other instructions

include only the low-order address as an operand and

must use either the BSR or the Access Bank to locate

their target registers.

6.5.2 ACCESS BANK

While the use of the BSR with an embedded 8-bit

address allows users to address the entire range of

data memory, it also means that the user must always

ensure that the correct bank is selected; otherwise,

data may be read from or written to the wrong location.

This can be disastrous if a GPR is the intended target

of an operation, but an SFR is written to instead.

Verifying and/or changing the BSR for each read or

write to data memory can become very inefficient.

To streamline access for the most commonly used data

memory locations, the data memory is configured with

an Access Bank, which allows users to access a

mapped block of memory without specifying a BSR.

The Access Bank consists of the first 128 bytes of

memory (00h-7Fh) in Bank 0 and the last 128 bytes of

memory (80h-FFh) in Block 15. The lower half is known

as the “Access RAM” and is composed of GPRs. This

upper half is also where the device’s SFRs are

mapped. These two areas are mapped contiguously in

the Access Bank and can be addressed in a linear

fashion by an 8-bit address (Figure 6-6).

The Access Bank is used by core PIC18 instructions

that include the Access RAM bit (the ‘a’ parameter in

the instruction). When ‘a’ is equal to ‘1’, the instruction

uses the BSR and the 8-bit address included in the

opcode for the data memory address. When ‘a’ is ‘0’,

however, the instruction is forced to use the Access

Bank address map; the current value of the BSR is

ignored entirely.

Using this “forced” addressing allows the instruction to

operate on a data address in a single cycle, without

updating the BSR first. For 8-bit addresses of 80h and

above, this means that users can evaluate and operate

on SFRs more efficiently. The Access RAM below 80h

is a good place for data values that the user might need

to access rapidly, such as immediate computational

results or common program variables. Access RAM

also allows for faster and more code efficient context

saving and switching of variables.

6.5.3 GENERAL PURPOSE REGISTER

(GPR) FILE

PIC18 devices may have banked memory in the GPR

area. This is data RAM, which is available for use by all

instructions. GPRs start at the bottom of Bank 0

(address 000h) and grow upwards towards the bottom of

the SFR area. GPRs are not initialized by a Power-on

Reset and are unchanged on all other Resets.

 2010 Microchip Technology Inc. DS39616D-page 69

PIC18F2331/2431/4331/4431

6.5.4 SPECIAL FUNCTION REGISTERS

The Special Function Registers (SFRs) are registers

used by the CPU and peripheral modules for controlling

the desired operation of the device. These registers are

implemented as static RAM. A list of these registers is

given in Ta b l e 6 - 1 and Table 6- 2 .

The SFRs can be classified into two sets: those asso-

ciated with the “core” function and those related to the

peripheral functions. Those registers related to the

“core” are described in this section, while those related

to the operation of the peripheral features are

described in the section of that peripheral feature.

The SFRs are typically distributed among the

peripherals whose functions they control.

The unused SFR locations will be unimplemented and

read as ‘0’s.

TABLE 6-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2331/2431/4331/4431 DEVICES

Address Name Address Name Address Name Address Name Address Name

FFFh TOSU FDFh INDF2

(1)

FBFh CCPR1H F9Fh IPR1 F7Fh PTCON0

FFEh TOSH FDEh POSTINC2

(1)

FBEh CCPR1L F9Eh PIR1 F7Eh PTCON1

FFDh TOSL FDDh POSTDEC2

(1)

FBDh CCP1CON F9Dh PIE1 F7Dh PTMRL

FFCh STKPTR FDCh PREINC2

(1)

FBCh CCPR2H F9Ch —

(2)

F7Ch PTMRH

FFBh PCLATU FDBh PLUSW2

(1)

FBBh CCPR2L F9Bh OSCTUNE F7Bh PTPERL

FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah ADCON3 F7Ah PTPERH

FF9h PCL FD9h FSR2L FB9h ANSEL1 F99h ADCHS F79h PDC0L

FF8h TBLPTRU FD8h STATUS FB8h ANSEL0 F98h —

(2)

F78h PDC0H

FF7h TBLPTRH FD7h TMR0H FB7h T5CON F97h —

(2)

F77h PDC1L

FF6h TBLPTRL FD6h TMR0L FB6h QEICON F96h TRISE

(3)

F76h PDC1H

FF5h TABLAT FD5h T0CON FB5h —

(2)

F95h TRISD

(3)

F75h PDC2L

FF4h PRODH FD4h —

(2)

FB4h —

(2)

F94h TRISC F74h PDC2H

FF3h PRODL FD3h OSCCON FB3h —

(2)

F93h TRISB F73h PDC3L

(3)

FF2h INTCON FD2h LVDCON FB2h —

(2)

F92h TRISA F72h PDC3H

(3)

FF1h INTCON2 FD1h WDTCON FB1h —

(2)

F91h PR5H F71h SEVTCMPL

FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h PR5L F70h SEVTCMPH

FEFh INDF0

(1)

FCFh TMR1H FAFh SPBRG F8Fh —

(2)

F6Fh PWMCON0

FEEh POSTINC0

(1)

FCEh TMR1L FAEh RCREG F8Eh —

(2)

F6Eh PWMCON1

FEDh POSTDEC0

(1)

FCDh T1CON FADh TXREG F8Dh LATE

(3)

F6Dh DTCON

FECh PREINC0

(1)

FCCh TMR2 FACh TXSTA F8Ch LATD

(3)

F6Ch FLTCONFIG

FEBh PLUSW0

(1)

FCBh PR2 FABh RCSTA F8Bh LATC F6Bh OVDCOND

FEAh FSR0H FCAh T2CON FAAh BAUDCON F8Ah LATB F6Ah OVDCONS

FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA F69h CAP1BUFH

FE8h WREG FC8h SSPADD FA8h EEDATA F88h TMR5H F68h CAP1BUFL

FE7h INDF1

(1)

FC7h SSPSTAT FA7h EECON2 F87h TMR5L F67h CAP2BUFH

FE6h POSTINC1

(1)

FC6h SSPCON FA6h EECON1 F86h —

(2)

F66h CAP2BUFL

FE5h POSTDEC1

(1)

FC5h —

(2)

FA5h IPR3 F85h —

(2)

F65h CAP3BUFH

FE4h PREINC1

(1)

FC4h ADRESH FA4h PIR3 F84h PORTE F64h CAP3BUFL

FE3h PLUSW1

(1)

FC3h ADRESL FA3h PIE3 F83h PORTD

(3)

F63h CAP1CON

FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC F62h CAP2CON

FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB F61h CAP3CON

FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA F60h DFLTCON

Note 1: This is not a physical register.

2: Unimplemented registers are read as ‘0’.

3: This register is not available on 28-pin devices.

PIC18F2331/2431/4331/4431

DS39616D-page 70  2010 Microchip Technology Inc.

TABLE 6-2: REGISTER FILE SUMMARY (PIC18F2331/2431/4331/4431)

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000

TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000

TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000

STKPTR STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0 00-0 0000

PCLATU ——bit 21

(3) Holding Register for PC<20:16> ---0 0000

PCLATH Holding Register for PC<15:8> 0000 0000

PCL PC Low Byte (PC<7:0>) 0000 0000

TBLPTRU ——bit 21

(3) Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000

TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000

TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000

TABLAT Program Memory Table Latch 0000 0000

PRODH Product Register High Byte xxxx xxxx

PRODL Product Register Low Byte xxxx xxxx

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x

INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP1111 -1-1

INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00

INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A

POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A

POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A

PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A

PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 offset by W (not a physical register) N/A

FSR0H — — — — Indirect Data Memory Address Pointer 0 High ---- xxxx

FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx

WREG Working Register xxxx xxxx

INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A

POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A

POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A

PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A

PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 offset by W (not a physical register) N/A

FSR1H — — — — Indirect Data Memory Address Pointer 1 High Byte ---- 0000

FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx

BSR — — — — Bank Select Register ---- 0000

INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A

POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A

POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A

PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A

PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 offset by W (not a physical register) N/A

FSR2H — — — — Indirect Data Memory Address Pointer 2 High Byte ---- 0000

FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx

STATUS — — —NOVZDCC---x xxxx

TMR0H Timer0 Register High Byte 0000 0000

TMR0L Timer0 Register Low Byte xxxx xxxx

T0CON TMR0ON T016BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111

Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented.

Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator modes only and read

‘0’ in all other oscillator modes.

2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.

3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.

4: These registers and/or bits are not implemented on the PIC18F2331/2431 devices and read as ‘0’.

5: The RE3 port bit is only available for PIC18F4331/4431 devices when the MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’; otherwise, RE3

reads ‘0’. This bit is read-only.

 2010 Microchip Technology Inc. DS39616D-page 71

PIC18F2331/2431/4331/4431

OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 q000

LVDCON —— IRVST LVDEN LVDL3 LVDL2 LVDL1 LVDL0 --00 0101

WDTCON WDTW ——————SWDTEN0--- ---0

RCON IPEN ——RITO PD POR BOR 0--1 11q0

TMR1H Timer1 Register High Byte xxxx xxxx

TMR1L Timer1 Register Low Byte xxxx xxxx

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000

TMR2 Timer2 Register 0000 0000

PR2 Timer2 Period Register 1111 1111

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000

SSPBUF SSP Receive Buffer/Transmit Register xxxx xxxx

SSPADD SSP Address Register in I2C™ Slave mode. SSP Baud Rate Reload Register in I2C Master mode. 0000 0000

SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000

SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000

ADRESH A/D Result Register High Byte xxxx xxxx

ADRESL A/D Result Register Low Byte xxxx xxxx

ADCON0 —— ACONV ACSCH ACMOD1 ACMOD0 GO/DONE ADON --00 0000

ADCON1 VCFG1 VCFG0 — FIFOEN BFEMT BFOVFL ADPNT1 ADPNT0 00-0 0000

ADCON2 ADFM ACQT3 ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0000 0000

ADCON3 ADRS1 ADRS0 — SSRC4 SSRC3 SSRC2 SSRC1 SSRC0 00-0 0000

ADCHS GDSEL1 GDSEL0 GBSEL1 GBSEL0 GCSEL1 GCSEL0 GASEL1 GASEL0 0000 0000

CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx

CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx

CCP1CON —— DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000

CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx

CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx

CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000

ANSEL1 ———————ANS8

(4) ---- ---1

ANSEL0 ANS7(4) ANS6(4) ANS5(4) ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111

T5CON T5SEN RESEN(4) T5MOD T5PS1 T5PS0 T5SYNC TMR5CS TMR5ON 0000 0000

QEICON VELM QERR UP/DOWN QEIM2 QEIM1 QEIM0 PDEC1 PDEC0 0000 0000

SPBRGH EUSART Baud Rate Generator Register High Byte 0000 0000

SPBRG EUSART Baud Rate Generator Register Low Byte 0000 0000

RCREG EUSART Receive Register 0000 0000

TXREG EUSART Transmit Register 0000 0000

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000X

BAUDCON — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00

TABLE 6-2: REGISTER FILE SUMMARY (PIC18F2331/2431/4331/4431) (CONTINUED)

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented.

Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator modes only and read

‘0’ in all other oscillator modes.

2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.

3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.

4: These registers and/or bits are not implemented on the PIC18F2331/2431 devices and read as ‘0’.

5: The RE3 port bit is only available for PIC18F4331/4431 devices when the MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’; otherwise, RE3

reads ‘0’. This bit is read-only.

PIC18F2331/2431/4331/4431

DS39616D-page 72  2010 Microchip Technology Inc.

EEADR EEPROM Address Register 0000 0000

EEDATA EEPROM Data Register 0000 0000

EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000

EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000

IPR3 — — — PTIP IC3DRIP IC2QEIP IC1IP TMR5IP ---1 1111

PIR3 — — — PTIF IC3DRIF IC2QEIF IC1IF TMR5IF ---0 0000

PIE3 — — — PTIE IC3DRIE IC2QEIE IC1IE TMR5IE ---0 0000

IPR2 OSCFIP ——EEIP—LVDIP— CCP2IP 1--1 -1-1

PIR2 OSCFIF —— EEIF —LVDIF— CCP2IF 0--0 -0-0

PIE2 OSCFIE ——EEIE—LVDIE— CCP2IE 0--0 -0-0

IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP -111 1111

PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000

PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000

OSCTUNE —— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000

ADCON3 ADRS1 ADRS0 — SSRC4 SSRC3 SSRC2 SSRC1 SSRC0 00-0 0000

ADCHS GDSEL1 GDSEL0 GBSEL1 GBSEL0 GCSEL1 GCSEL0 GASEL1 GASEL0 0000 0000

TRISE(4) — — — — — PORTE Data Direction Register(4) ---- -111

TRISD(4) PORTD Data Direction Register 1111 1111

TRISC PORTC Data Direction Register 1111 1111

TRISB PORTB Data Direction Register 1111 1111

TRISA TRISA7(2) TRISA6(1) PORTA Data Direction Register 1111 1111

PR5H Timer5 Period Register High Byte 1111 1111

PR5L Timer5 Period Register Low Byte 1111 1111

LATE(4) — — — — — LATE Data Output Register ---- -xxx

LATD(4) LATD Data Output Register xxxx xxxx

LATC LATC Data Output Register xxxx xxxx

LATB LATB Data Output Register xxxx xxxx

LATA LATA7(2) LATA6(1) LATA Data Output Register xxxx xxxx

TMR5H Timer5 Register High Byte xxxx xxxx

TMR5L Timer5 Register Low Byte xxxx xxxx

PORTE — — — —RE3

(4,5) RE2(4) RE1(4) RE0(4) ---- xxxx

PORTD(4) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx

PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx

PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx

PORTA RA7(2) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000

PTCON0 PTOPS3 PTOPS2 PTOPS1 PTOPS0 PTCKPS1 PTCKPS0 PTMOD1 PTMOD0 0000 0000

PTCON1 PTEN PTDIR ——————00-- ----

PTMRL PWM Time Base Register (lower 8 bits) 0000 0000

PTMRH UNUSED PWM Time Base Register (upper 4 bits) ---- 0000

PTPERL PWM Time Base Period Register (lower 8 bits) 1111 1111

PTPERH UNUSED PWM Time Base Period Register (upper 4 bits) ---- 1111

TABLE 6-2: REGISTER FILE SUMMARY (PIC18F2331/2431/4331/4431) (CONTINUED)

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented.

Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator modes only and read

‘0’ in all other oscillator modes.

2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.

3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.

4: These registers and/or bits are not implemented on the PIC18F2331/2431 devices and read as ‘0’.

5: The RE3 port bit is only available for PIC18F4331/4431 devices when the MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’; otherwise, RE3

reads ‘0’. This bit is read-only.

 2010 Microchip Technology Inc. DS39616D-page 73

PIC18F2331/2431/4331/4431

PDC0L PWM Duty Cycle #0L Register (lower 8 bits) 0000 0000

PDC0H UNUSED PWM Duty Cycle #0H Register (upper 6 bits) --00 0000

PDC1L PWM Duty Cycle #1L Register (lower 8 bits) 0000 0000

PDC1H UNUSED PWM Duty Cycle #1H Register (upper 6 bits) --00 0000

PDC2L PWM Duty Cycle #2L Register (lower 8 bits) 0000 0000

PDC2H UNUSED PWM Duty Cycle #2H Register (upper 6 bits) --00 0000

PDC3L(4) PWM Duty Cycle #3L Register (lower 8 bits) 0000 0000

PDC3H(4) UNUSED PWM Duty Cycle #3H Register (upper 6 bits) --00 0000

SEVTCMPL PWM Special Event Compare Register (lower 8 bits) 0000 0000

SEVTCMPH UNUSED PWM Special Event Compare Register (upper 4 bits) ---- 0000

PWMCON0 —PWMEN2 PWMEN1 PWMEN0 PMOD3 PMOD2 PMOD1 PMOD0 -111 0000

PWMCON1 SEVOPS3 SEVOPS2 SEVOPS1 SEVOPS0 SEVTDIR — UDIS OSYNC 0000 0-00

DTCON DTPS1 DTPS0 DT5 DT4 DT3 DT2 DT1 DT0 0000 0000

FLTCONFIG BRFEN FLTBS(4) FLTBMOD(4) FLTBEN(4) FLTCON FLTAS FLTAMOD FLTAEN 0000 0000

OVDCOND POVD7(4) POVD6(4) POVD5 POVD4 POVD3 POVD2 POVD1 POVD0 1111 1111

OVDCONS POUT7(4) POUT6(4) POUT5 POUT4 POUT3 POUT2 POUT1 POUT0 0000 0000

CAP1BUFH/

VELRH

Capture 1 Register High Byte/Velocity Register High Byte xxxx xxxx

CAP1BUFL/

VELRL

Capture 1 Register Low Byte/Velocity Register Low Byte xxxx xxxx

CAP2BUFH/

POSCNTH

Capture 2 Register High Byte/QEI Position Counter Register High Byte xxxx xxxx

CAP2BUFL/

POSCNTL

Capture 2 Register Low Byte/QEI Position Counter Register Low Byte xxxx xxxx

CAP3BUFH/

MAXCNTH

Capture 3 Register High Byte/QEI Max. Count Limit Register High Byte xxxx xxxx

CAP3BUFL/

MAXCNTL

Capture 3 Register Low Byte/QEI Max. Count Limit Register Low Byte xxxx xxxx

CAP1CON — CAP1REN —— CAP1M3 CAP1M2 CAP1M1 CAP1M0 -0-- 0000

CAP2CON — CAP2REN —— CAP2M3 CAP2M2 CAP2M1 CAP2M0 -0-- 0000

CAP3CON — CAP3REN —— CAP3M3 CAP3M2 CAP3M1 CAP3M0 -0-- 0000

DFLTCON — FLT4EN FLT3EN FLT2EN FLT1EN FLTCK2 FLTCK1 FLTCK0 -000 0000

TABLE 6-2: REGISTER FILE SUMMARY (PIC18F2331/2431/4331/4431) (CONTINUED)

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented.

Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator modes only and read

‘0’ in all other oscillator modes.

2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.

3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.

4: These registers and/or bits are not implemented on the PIC18F2331/2431 devices and read as ‘0’.

5: The RE3 port bit is only available for PIC18F4331/4431 devices when the MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’; otherwise, RE3

reads ‘0’. This bit is read-only.

PIC18F2331/2431/4331/4431

DS39616D-page 74  2010 Microchip Technology Inc.

6.6 STATUS Register

The STATUS register, shown in Register 6-2, contains

the arithmetic status of the ALU. The STATUS register

can be the operand for any instruction, as with any

other register. If the STATUS register is the destination

for an instruction that affects the Z, DC, C, OV or N bits,

then the write to these five bits is disabled. These bits

are set or cleared according to the device logic. There-

fore, the result of an instruction with the STATUS

For example, CLRF STATUS will clear the upper three

bits and set the Z bit. This leaves the STATUS register

as 000u u1uu (where u = unchanged).

It is recommended, therefore, that only BCF, BSF,

SWAPF, MOVFF and MOVWF instructions are used to

alter the STATUS register, because these instructions

do not affect the Z, C, DC, OV or N bits in the STATUS

bits, see Table 24-2.

Note: The C and DC bits operate as a Borrow

and Digit Borrow bit respectively, in

subtraction.

U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x

— — —NOVZDC

(1) C(2)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 Unimplemented: Read as ‘0’

bit 4 N: Negative bit

This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative

(ALU MSB = 1).

1 = Result was negative

0 = Result was positive

bit 3 OV: Overflow bit

This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude

which causes the sign bit (bit 7) to change state.

1 = Overflow occurred for signed arithmetic (in this arithmetic operation)

0 = No overflow occurred

bit 2 Z: Zero bit

1 = The result of an arithmetic or logic operation is zero

0 = The result of an arithmetic or logic operation is not zero

bit 1 DC: Digit Carry/Borrow bit(1)

For ADDWF, ADDLW, SUBLW and SUBWF instructions:

1 = A carry-out from the 4th low-order bit of the result occurred

0 = No carry-out from the 4th low-order bit of the result

bit 0 C: Carry/Borrow bit(2)

For ADDWF, ADDLW, SUBLW and SUBWF instructions:

1 = A carry-out from the Most Significant bit of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second

operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register.

2: For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the

second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit

of the source register.

 2010 Microchip Technology Inc. DS39616D-page 75

PIC18F2331/2431/4331/4431

6.7 Data Addressing Modes

The data memory space can be addressed in several

ways. For most instructions, the addressing mode is

fixed. Other instructions may use up to three modes,

depending on which operands are used and whether or

not the extended instruction set is enabled.

The addressing modes are:

• Inherent

• Literal

•Direct

•Indirect

6.7.1 INHERENT AND LITERAL

ADDRESSING

Many PIC18 control instructions do not need any

argument at all. They either perform an operation that

globally affects the device or they operate implicitly on

one register. This addressing mode is known as Inherent

Addressing. Examples include SLEEP, RESET and DAW.

Other instructions work in a similar way but require an

additional explicit argument in the opcode. This is

known as Literal Addressing mode because they

require some literal value as an argument. Examples

include ADDLW and MOVLW, which respectively, add or

move a literal value to the W register. Other examples

include CALL and GOTO, which include a 20-bit

program memory address.

6.7.2 DIRECT ADDRESSING

Direct Addressing specifies all or part of the source

and/or destination address of the operation within the

opcode itself. The options are specified by the

arguments accompanying the instruction.

In the core PIC18 instruction set, bit-oriented and byte-

oriented instructions use some version of Direct

Addressing by default. All of these instructions include

some 8-bit literal address as their Least Significant

Byte. This address specifies either a register address in

one of the banks of data RAM (Section 6.5.4 “Sp ecial

Function Regis ters”) or a location in the Access Bank

(Section 6.5.2 “Access Bank”) as the data source for

the instruction.

The Access RAM bit, ‘a’, determines how the address

is interpreted. When ‘a’ is ‘1’, the contents of the BSR

(Section 6.5.1 “Bank Select Register (BSR)”) are

used with the address to determine the complete 12-bit

address of the register. When ‘a’ is ‘0’, the address is

interpreted as being a register in the Access Bank.

Addressing that uses the Access RAM is sometimes

also known as Direct Forced Addressing mode.

A few instructions, such as MOVFF, include the entire

12-bit address (either source or destination) in their op

codes. In these cases, the BSR is ignored entirely.

The destination of the operation’s results is determined

by the destination bit, ‘d’. When ‘d’ is ‘1’, the results are

stored back in the source register, overwriting its origi-

nal contents. When ‘d’ is ‘0’, the results are stored in

the W register. Instructions without the ‘d’ argument

have a destination that is implicit in the instruction; their

destination is either the target register being operated

on or the W register.

6.7.3 INDIRECT ADDRESSING

Indirect Addressing allows the user to access a location

in data memory without giving a fixed address in the

instruction. This is done by using File Select Registers

(FSRs) as pointers to the locations to be read or written

to. Since the FSRs are themselves located in RAM as

Special Function Registers, they can also be directly

manipulated under program control. This makes FSRs

very useful in implementing data structures, such as

tables and arrays in data memory.

The registers for Indirect Addressing are also

implemented with Indirect File Operands (INDFs) that

permit automatic manipulation of the pointer value with

auto-incrementing, auto-decrementing or offsetting

with another value. This allows for efficient code, using

loops, such as the example of clearing an entire RAM

bank in Example 6-5.

EXAMPLE 6-5: HOW TO CLEAR RAM

(BANK 1) USING

INDIRECT ADDRESSING

LFSR FSR0, 100h ;

NEXT CLRF POSTINC0 ; Clear INDF

; register then

; inc pointer

BTFSS FSR0H, 1 ; All done with

; Bank1?

BRA NEXT ; NO, clear next

CONTINUE ; YES, continue

PIC18F2331/2431/4331/4431

DS39616D-page 76  2010 Microchip Technology Inc.

6.7.3.1 FSR Registers and the

INDF Operand

At the core of Indirect Addressing are three sets of

registers: FSR0, FSR1 and FSR2. Each represents a

pair of 8-bit registers, FSRnH and FSRnL. The four

upper bits of the FSRnH register are not used so each

FSR pair holds a 12-bit value. This represents a value

that can address the entire range of the data memory

in a linear fashion. The FSR register pairs, then, serve

as pointers to data memory locations.

Indirect Addressing is accomplished with a set of

Indirect File Operands: INDF0 through INDF2. These

can be thought of as “virtual” registers; they are

mapped in the SFR space but are not physically imple-

mented. Reading or writing to a particular INDF register

actually accesses its corresponding FSR register pair.

A read from INDF1, for example, reads the data at the

address indicated by FSR1H:FSR1L. Instructions that

use the INDF registers as operands actually use the

contents of their corresponding FSR as a pointer to the

instruction’s target. The INDF operand is just a

convenient way of using the pointer.

Because Indirect Addressing uses a full 12-bit address,

data RAM banking is not necessary. Thus, the current

contents of the BSR and the Access RAM bit have no

effect on determining the target address.

6.7.3.2 FSR Registers and POSTINC,

POSTDEC, PREINC and PLUSW

In addition to the INDF operand, each FSR register pair

also has four additional indirect operands. Like INDF,

these are “virtual” registers that cannot be indirectly

read or written to. Accessing these registers actually

accesses the associated FSR register pair, but also

performs a specific action on its stored value. They are:

• POSTDEC: accesses the FSR value, then

automatically decrements it by 1 afterwards

• POSTINC: accesses the FSR value, then

automatically increments it by 1 afterwards

• PREINC: increments the FSR value by 1, then

uses it in the operation

• PLUSW: adds the signed value of the W register

(range of -127 to 128) to that of the FSR and uses

the new value in the operation.

In this context, accessing an INDF register uses the

value in the FSR registers without changing them. Sim-

ilarly, accessing a PLUSW register gives the FSR value

offset by that in the W register; neither value is actually

changed in the operation. Accessing the other virtual

registers changes the value of the FSR registers.

Operations on the FSRs with POSTDEC, POSTINC

and PREINC affect the entire register pair; that is, roll-

overs of the FSRnL register from FFh to 00h carry over

to the FSRnH register. On the other hand, results of

these operations do not change the value of any flags

in the STATUS register (e.g., Z, N, OV, etc.).

FIGURE 6-7: INDIRECT ADDRESSING

FSR1H:FSR1L

Data Memory

000h

100h

200h

300h

F00h

E00h

FFFh

Bank 0

Bank 1

Bank 2

Bank 14

Bank 15

Bank 3

through

Bank 13

ADDWF, INDF1, 1

Using an instruction with one of the

indirect addressing registers as the

operand....

...uses the 12-bit address stored in

the FSR pair associated with that

...to determine the data memory

location to be used in that operation.

In this case, the FSR1 pair contains

ECCh. This means the contents of

location ECCh will be added to that

of the W register and stored back in

ECCh.

xxxx1110 11001100

 2010 Microchip Technology Inc. DS39616D-page 77

PIC18F2331/2431/4331/4431

The PLUSW register can be used to implement a form

of Indexed Addressing in the data memory space. By

manipulating the value in the W register, users can

reach addresses that are fixed offsets from pointer

addresses. In some applications, this can be used to

implement some powerful program control structure,

such as software stacks, inside of data memory.

6.7.3.3 Operations by FSRs on FSRs

Indirect Addressing operations that target other FSRs or

virtual registers represent special cases. For example,

using an FSR to point to one of the virtual registers will

not result in successful operations. As a specific case,

assume that FSR0H:FSR0L contain FE7h, the address

of INDF1. Attempts to read the value of the INDF1 using

INDF0 as an operand will return 00h. Attempts to write

to INDF1 using INDF0 as the operand will result in a NOP.

On the other hand, using the virtual registers to write to

an FSR pair may not occur as planned. In these cases,

the value will be written to the FSR pair but without any

incrementing or decrementing. Thus, writing to INDF2

or POSTDEC2 will write the same value to the

FSR2H:FSR2L.

Since the FSRs are physical registers mapped in the

SFR space, they can be manipulated through all direct

operations. Users should proceed cautiously when

working on these registers, particularly if their code

uses Indirect Addressing.

Similarly, operations by Indirect Addressing are gener-

ally permitted on all other SFRs. Users should exercise

the appropriate caution that they do not inadvertently

change settings that might affect the operation of the

device.

PIC18F2331/2431/4331/4431

DS39616D-page 78  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 79

PIC18F2331/2431/4331/4431

7.0 DATA EEPROM MEMORY

The data EEPROM is readable and writable during

normal operation over the entire VDD range. The data

memory is not directly mapped in the register file

space. Instead, it is indirectly addressed through the

Special Function Registers (SFR).

There are four SFRs used to read and write the

program and data EEPROM memory. These registers

are:

• EECON1

• EECON2

• EEDATA

• EEADR

The EEPROM data memory allows byte read and write.

When interfacing to the data memory block, EEDATA

holds the 8-bit data for read/write and EEADR holds the

address of the EEPROM location being accessed.

These devices have 256 bytes of data EEPROM with

an address range from 00h to FFh.

The EEPROM data memory is rated for high erase/

write cycle endurance. A byte write automatically

erases the location and writes the new data (erase-

before-write). The write time is controlled by an on-chip

timer. The write time will vary with voltage and

temperature, as well as from chip-to-chip. Please

refer to Parameter D122 (Table 26-1 in Section 26.0

“Electrical Characte ristics”) for exact limits.

7.1 EEADR

The Address register can address 256 bytes of data

EEPROM.

7.2 EECON1 and EECON2 Registers

Access to the data EEPROM is controlled by two

registers: EECON1 and EECON2. These are the same

registers which control access to the program memory

and are used in a similar manner for the data

EEPROM.

The EECON1 register (Register 7-1) is the control

bit, EEPGD, determines if the access will be to program

or data EEPROM memory. When clear, operations will

access the data EEPROM memory. When set, program

memory is accessed.

Control bit, CFGS, determines if the access will be to

the Configuration registers or to program memory/data

EEPROM memory. When set, subsequent operations

access Configuration registers. When CFGS is clear,

the EEPGD bit selects either Flash program or data

EEPROM memory.

The WREN bit, when set, will allow a write operation.

On power-up, the WREN bit is clear. The WRERR bit is

set in hardware when the WREN bit is set and cleared

when the internal programming timer expires and the

write operation is complete.

The WR control bit initiates write operations. The bit

cannot be cleared, only set, in software; it is cleared in

hardware at the completion of the write operation.

Control bits, RD and WR, start read and erase/write

operations, respectively. These bits are set by firmware

and cleared by hardware at the completion of the

operation.

The RD bit cannot be set when accessing program

memory (EEPGD = 1). Program memory is read using

table read instructions. See Section 7.3 “Reading the

Data EEPROM Memory” regarding table reads.

The EECON2 register is not a physical register. It is

used exclusively in the memory write and erase

sequences. Reading EECON2 will read all ‘0’s.

Note: During normal operation, the WRERR bit

is read as ‘1’. This can indicate that a write

operation was prematurely terminated by

a Reset or a write operation was

attempted improperly.

Note: The EEIF interrupt flag bit (PIR2<4>) is

set when the write is complete. It must be

cleared in software.

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R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0

EEPGD CFGS — FREE WRERR(1) WREN WR RD

bit 7 bit 0

Legend: S = Settable bit (cannot be cleared in software)

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access Flash program memory

0 = Access data EEPROM memory

bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit

1 = Access Configuration registers

0 = Access Flash program or data EEPROM memory

bit 5 Unimplemented: Read as ‘0’

bit 4 FREE: Flash Row Erase Enable bit

1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by

completion of erase operation)

0 = Perform write only

bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1)

1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal

operation, or an improper write attempt)

0 = The write operation completed

bit 2 WREN: Flash Program/Data EEPROM Write Enable bit

1 = Allows write cycles to Flash program/data EEPROM

0 = Inhibits write cycles to Flash program/data EEPROM

bit 1 WR: Write Control bit

1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle

(The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit

can only be set (not cleared) in software.)

0 = Write cycle to the EEPROM is complete

bit 0 RD: Read Control bit

1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only

be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)

0 = Does not initiate an EEPROM read

Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error

condition.

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7.3 Reading the Data EEPROM

Memory

To read a data memory location, the user must write the

address to the EEADR register, clear the EEPGD con-

trol bit (EECON1<7>) and then set control bit, RD

(EECON1<0>). The data is available for the very next

instruction cycle; therefore, the EEDATA register can

be read by the next instruction. EEDATA will hold this

value until another read operation, or until it is written to

by the user (during a write operation).The basic

process is shown in Example 7-1.

7.4 Writing to the Data EEPROM

Memory

To write an EEPROM data location, the address must

first be written to the EEADR register and the data writ-

ten to the EEDATA register. The sequence in

Example 7-2 must be followed to initiate the write cycle.

The write will not begin if this sequence is not exactly

followed (write 55h to EECON2, write 0AAh to

EECON2, then set WR bit) for each byte. It is strongly

recommended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in EECON1 must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution (i.e., runaway programs). The WREN bit should

be kept clear at all times, except when updating the

EEPROM. The WREN bit is not cleared by hardware.

After a write sequence has been initiated, EECON1,

EEADR and EEDATA cannot be modified. The WR bit

will be inhibited from being set unless the WREN bit is

set. The WREN bit must be set on a previous instruc-

tion. Both WR and WREN cannot be set with the same

instruction.

At the completion of the write cycle, the WR bit is

cleared in hardware and the EEPROM Interrupt Flag bit

(EEIF) is set. The user may either enable this interrupt

or poll this bit. EEIF must be cleared by software.

7.5 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

7.6 Protect ion Against Spurious Write

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared.

Also, the Power-up Timer (72 ms duration) prevents

EEPROM write.

The write initiate sequence and the WREN bit together

help prevent an accidental write during brown-out,

power glitch, or software malfunction.

EXAMPLE 7-1: DAT A EEPROM READ

EXAMPLE 7-2: DAT A EEPROM WR ITE

MOVLW DATA_EE_ADDR ;

MOVWF EEADR ; Data Memory Address to read

BCF EECON1, EEPGD ; Point to DATA memory

BSF EECON1, RD ; EEPROM Read

MOVF EEDATA, W ; W = EEDATA

MOVLW DATA_EE_ADDR ;

MOVWF EEADR ; Data Memory Address to write

MOVLW DATA_EE_DATA ;

MOVWF EEDATA ; Data Memory Value to write

BCF EECON1, EEPGD ; Point to DATA memory

BCF EECON1, CFGS ; Access EEPROM

BSF EECON1, WREN ; Enable writes

BCF INTCON, GIE ; Disable Interrupts

MOVLW 55h ;

Required MOVWF EECON2 ; Write 55h

Sequence MOVLW 0AAh ;

MOVWF EECON2 ; Write 0AAh

BSF EECON1, WR ; Set WR bit to begin write

BTFSC EECON1, WR ; Wait for write to complete

GOTO $-2 ;

BSF INTCON, GIE ; Enable interrupts

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7.7 Operation During Code-Protect

Data EEPROM memory has its own code-protect bits in

Configuration Words. External read and write opera-

tions are disabled if either of these mechanisms are

enabled.

The microcontroller itself can both read and write to the

internal data EEPROM, regardless of the state of the

code-protect Configuration bit. Refer to Section 23.0

“Special Features of the CPU” for additional

information.

7.8 Protection Against Spurious Write

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been implemented. On power-up, the WREN bit is

cleared. In addition, writes to the EEPROM memory

are blocked during the Power-up Timer period (TPWRT,

Parameter 33).

The write/initiate sequence, and the WREN bit

together, help prevent an accidental write during

Brown-out Reset, power glitch or software malfunction.

7.9 Using the Data EEPROM

The data EEPROM is a high-endurance, byte-

addressable array that has been optimized for the

storage of frequently changing information (e.g.,

program variables or other data that are updated

often). Frequently changing values will typically be

updated more often than Specification D124. If this is

not the case, an array refresh must be performed. For

this reason, variables that change infrequently (such as

constants, IDs, calibration, etc.) should be stored in

Flash program memory.

A simple data EEPROM refresh routine is shown in

Example 7-3.

EXAMPLE 7-3: DAT A EEPROM REFRESH ROUTINE

Note: If data EEPROM is only used to store con-

stants and/or data that changes rarely, an

array refresh is likely not required. See

Specification D124.

CLRF EEADR ; Start at address 0

BCF EECON1, CFGS ; Set for memory

BCF EECON1, EEPGD ; Set for Data EEPROM

BCF INTCON, GIE ; Disable interrupts

BSF EECON1, WREN ; Enable writes

LOOP ; Loop to refresh array

BSF EECON1, RD ; Read current address

MOVLW 55h ;

MOVWF EECON2 ; Write 55h

Required MOVLW 0AAh ;

Sequence MOVWF EECON2 ; Write 0AAh

BSF EECON1, WR ; Set WR bit to begin write

BTFSC EECON1, WR ; Wait for write to complete

BRA $-2

INCFSZ EEADR, F ; Increment address

BRA LOOP ; Not zero, do it again

BCF EECON1, WREN ; Disable writes

BSF INTCON, GIE ; Enable interrupts

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TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset

Values on

page

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

EEADR EEPROM Address Register 56

EEDATA EEPROM Data Register 56

EECON2 EEPROM Control Register 2 (not a physical register) 56

EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 56

IPR2 OSCFIP —— EEIP —LVDIP—CCP2IP 57

PIR2 OSCFIF —— EEIF —LVDIF—CCP2IF 57

PIE2 OSCFIE —— EEIE —LVDIE—CCP2IE 57

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.

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NOTES:

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8.0 FLASH PROGRAM MEMORY

The Flash program memory is readable, writable and

erasable during normal operation over the entire VDD

range.

A read from program memory is executed on one byte

at a time. A write to program memory is executed on

blocks of 8 bytes at a time. Program memory is erased

in blocks of 64 bytes at a time. A bulk erase operation

may not be issued from user code.

While writing or erasing program memory, instruction

fetches cease until the operation is complete. The

program memory cannot be accessed during the write

or erase, therefore, code cannot execute. An internal

programming timer terminates program memory writes

and erases.

A value written to program memory does not need to be

a valid instruction. Executing a program memory

location that forms an invalid instruction results in a

NOP.

8.1 Table Reads and Table Writes

In order to read and write program memory, there are

two operations that allow the processor to move bytes

between the program memory space and the data

RAM:

• Table Read (TBLRD)

• Table Write (TBLWT)

The program memory space is 16 bits wide, while the

data RAM space is 8 bits wide. Table reads and table

writes move data between these two memory spaces

through an 8-bit register (TABLAT).

Table read operations retrieve data from program

memory and place it into TABLAT in the data RAM

space. Figure 8-1 shows the operation of a table read

with program memory and data RAM.

Table write operations store data from TABLAT in the

data memory space into holding registers in program

memory. The procedure to write the contents of the

holding registers into program memory is detailed in

Section 8.5 “Writing to Flash Program Memory”.

Figure 8-2 shows the operation of a table write with

program memory and data RAM.

Table operations work with byte entities. A table block

containing data, rather than program instructions, is not

required to be word-aligned. Therefore, a table block can

start and end at any byte address. If a table write is being

used to write executable code into program memory,

program instructions will need to be word-aligned,

(TBLPTRL<0> = 0).

FIGU RE 8-1: TABLE RE AD OPE RAT ION

Table Pointer(1)

Table Latch (8-bit)

Program Memory

TBLPTRH TBLPTRL

TABLAT

TBLPTRU

Instruction: TBLRD*

Note 1: The Table Pointer points to a byte in program memory.

Program Memory

(TBLPTR)

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FIGURE 8-2: TABLE WRITE OPERATION

8.2 Control Registers

Several control registers are used in conjunction with

the TBLRD and TBLWT instructions. These include the:

• EECON1 register

• EECON2 register

• TABLAT register

• TBLPTR registers

8.2.1 EECON1 AND EECON2 REGISTERS

EECON1 is the control register for memory accesses.

EECON2 is not a physical register. Reading EECON2

will read all ‘0’s. The EECON2 register is used

exclusively in the memory write and erase sequences.

Control bit, EEPGD, determines if the access will be to

program or data EEPROM memory. When clear,

operations will access the data EEPROM memory.

When set, program memory is accessed.

Control bit, CFGS, determines if the access will be to

the Configuration registers or to program memory/data

EEPROM memory. When set, subsequent operations

access Configuration registers, regardless of EEPGD.

(See Section 23.0 “Special Features of the CPU”.)

When CFGS is clear, the EEPGD bit selects either

program Flash or data EEPROM memory.

The FREE bit controls program memory erase opera-

tions. When the FREE bit is set, the erase operation is

initiated on the next WR command. When FREE is

clear, only writes are enabled.

A write operation is allowed when the WREN bit

(EECON1<2>) is set. On power-up, the WREN bit is

clear. The WRERR bit (EECON1<3>) is set in hard-

ware when the WR bit (EECON1<1>) is set and

cleared when the internal programming timer expires

and the write operation is complete.

The WR control bit initiates write operations. The bit

cannot be cleared, only set, in software. The bit is

cleared in hardware at the completion of the write

operation.

Table Pointer(1) Table Latch (8-bit)

TBLPTRH TBLPTRL TABLAT

Program Memory

(TBLPTR)

TBLPTRU

Instruction: TBLWT*

Note 1: The Table Pointer actually points to one of eight holding registers, the address of which is determined

by TBLPTRL<2:0>. The process for physically writing data to the program memory array is discussed

in Section 8.5 “Writing to Flash Program Memory”.

Holding Registers

Program Memory

Note: During normal operation, the WRERR

may read as ‘1’. This can indicate that a

write operation was prematurely termi-

nated by a Reset or a write operation was

attempted improperly.

Note: The EEIF interrupt flag bit (PIR2<4>) is

set when the write is complete. It must be

cleared in software.

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R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0

EEPGD CFGS — FREE WRERR(1) WREN WR RD

bit 7 bit 0

Legend: S = Settable bit (cannot be cleared in software)

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access Flash program memory

0 = Access data EEPROM memory

bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit

1 = Access Configuration registers

0 = Access Flash program or data EEPROM memory

bit 5 Unimplemented: Read as ‘0’

bit 4 FREE: Flash Row Erase Enable bit

1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by

completion of erase operation)

0 = Perform write only

bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1)

1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal

operation, or an improper write attempt)

0 = The write operation completed

bit 2 WREN: Flash Program/Data EEPROM Write Enable bit

1 = Allows write cycles to Flash program/data EEPROM

0 = Inhibits write cycles to Flash program/data EEPROM

bit 1 WR: Write Control bit

1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle

(The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit

can only be set (not cleared) in software.)

0 = Write cycle to the EEPROM is complete

bit 0 RD: Read Control bit

1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only

be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)

0 = Does not initiate an EEPROM read

Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error

condition.

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8.2.2 TABLAT – TABLE LATCH REGISTER

The Table Latch (TABLAT) is an 8-bit register mapped

into the SFR space. The Table Latch is used to hold

8-bit data during data transfers between program

memory and data RAM.

8.2.3 TBLPTR – TABLE POINTER

The Table Pointer (TBLPTR) addresses a byte within

the program memory. The TBLPTR is comprised of

three SFR registers: Table Pointer Upper Byte, Table

Pointer High Byte and Table Pointer Low Byte

(TBLPTRU:TBLPTRH:TBLPTRL). These three regis-

ters join to form a 22-bit wide pointer. The low-order

21 bits allow the device to address up to 2 Mbytes of

program memory space. Setting the 22nd bit allows

access to the Device ID, the User ID and the

Configuration bits.

The TBLPTR is used by the TBLRD and TBLWT instruc-

tions. These instructions can update the TBLPTR in

one of four ways based on the table operation. These

operations are shown in Table 8-1. These operations

on the TBLPTR only affect the low-order 21 bits.

8.2.4 TABLE POINTER BOUNDARIES

TBLPTR is used in reads, writes and erases of the

Flash program memory.

When a TBLRD is executed, all 22 bits of the Table

Pointer determine which byte is read from program or

configuration memory into TABLAT.

When a TBLWT is executed, the three LSbs of the Table

Pointer (TBLPTR<2:0>) determine which of the eight

program memory holding registers is written to. When

the timed write to program memory (long write) begins,

the 19 MSbs of the Table Pointer, TBLPTR

(TBLPTR<21:3>), will determine which program

memory block of 8 bytes is written to (TBLPTR<2:0>

are ignored). For more detail, see Section 8.5

“Writing to Flash Program Memory”.

When an erase of program memory is executed, the

16 MSbs of the Table Pointer (TBLPTR<21:6>) point to

the 64-byte block that will be erased. The Least

Significant bits (TBLPTR<5:0>) are ignored.

Figure 8-3 describes the relevant boundaries of

TBLPTR based on Flash program memory operations.

TABLE 8-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS

FIGURE 8-3: TABLE POINTER BOUNDARIES BASED ON OPERATION

Example Operation on Table Pointer

TBLRD*

TBLWT* TBLPTR is not modified

TBLRD*+

TBLWT*+ TBLPTR is incremented after the read/write

TBLRD*-

TBLWT*- TBLPTR is decremented after the read/write

TBLRD+*

TBLWT+* TBLPTR is incremented before the read/write

21 16 15 87 0

TABLE ERASE/WRITE TABLE WRITE

TABLE READ – TBLPTR<21:0>

TBLPTRL

TBLPTRH

TBLPTRU

TBLPTR<5:0>TBLPTR<21:6>

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8.3 Reading the Flash Program

Memory

The TBLRD instruction is used to retrieve data from

program memory and place it into data RAM. Table

reads from program memory are performed one byte at

a time.

TBLPTR points to a byte address in program space.

Executing a TBLRD instruction places the byte pointed

to into TABLAT. In addition, TBLPTR can be modified

automatically for the next table read operation.

The internal program memory is typically organized by

words. The Least Significant bit of the address selects

between the high and low bytes of the word. Figure 8-4

shows the interface between the internal program

memory and the TABLAT.

FIGURE 8-4: READS FROM FLASH PROGRAM MEMORY

EXAMPLE 8-1: READING A FLASH PROGRAM MEMORY WORD

(Even Byte Address)

Program Memory

(Odd Byte Address)

TBLRD TABLAT

TBLPTR = xxx xx1

FETCH

Instruction Register

(IR) Read Register

TBLPTR = xxxxx0

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base

MOVWF TBLPTRU ; address of the word

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW

MOVWF TBLPTRL

READ_WORD TBLRD*+ ; read into TABLAT and increment TBLPTR

MOVF TABLAT,W ; get data

MOVWF WORD_EVEN

TBLRD*+ ; read into TABLAT and increment TBLPTR

MOVF TABLAT,W ; get data

MOVWF WORD_ODD

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8.4 Erasing Flash Program Memory

The minimum erase block is 32 words or 64 bytes.

Larger blocks of program memory can be bulk erased

only through the use of an external programmer or

ICSP control. Word erase in the Flash array is not

supported.

When initiating an erase sequence from the micro-

controller itself, a block of 64 bytes of program memory

is erased. The Most Significant 16 bits of the

TBLPTR<21:6> point to the block being erased;

TBLPTR<5:0> are ignored.

The EECON1 register commands the erase operation.

The EEPGD bit (EECON1<7>) must be set to point to

the Flash program memory. The WREN bit

(EECON1<2>) must be set to enable write operations.

The FREE bit (EECON1<4>) is set to select an erase

operation.

For protection, the write initiate sequence using

EECON2 must be used.

A long write is necessary for erasing the internal Flash.

Instruction execution is halted while in a long write

cycle. The long write will be terminated by the internal

programming timer.

8.4.1 FLASH PROGRAM MEMORY

ERASE SEQUENCE

The sequence of events for erasing a block of internal

program memory location is:

1. Load the Table Pointer with the address of the

row being erased.

2. Set the EECON1 register for the erase

operation:

- set the EEPGD bit to point to program memory;

- clear the CFGS bit to access program memory;

- set the WREN bit to enable writes;

- set the FREE bit to enable the erase.

3. Disable interrupts.

4. Write 55h to EECON2.

5. Write 0AAh to EECON2.

6. Set the WR bit. This will begin the row erase

cycle.

7. The CPU will stall for the duration of the erase

(about 2 ms using internal timer).

8. Execute a NOP.

9. Re-enable interrupts.

EXAMPLE 8-2: ERASING A FLASH PROGRAM MEMORY ROW

MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW

MOVWF TBLPTRL

ERASE_ROW BSF EECON1, EEPGD ; point to Flash program memory

BCF EECON1, CFGS ; access Flash program memory

BSF EECON1, WREN ; enable write to memory

BSF EECON1, FREE ; enable Row Erase operation

BCF INTCON, GIE ; disable interrupts

MOVLW 55h

MOVWF EECON2 ; write 55H

Required MOVLW 0AAh

Sequence MOVWF EECON2 ; write 0AAH

BSF EECON2, WR ; start erase (CPU stall)

NOP

BSF INTCON, GIE ; re-enable interrupts

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8.5 Writing to Flash Program Memory

The programming block size is 4 words or 8 bytes.

Word or byte programming is not supported.

Table writes are used internally to load the holding

registers needed to program the Flash memory. There

are 8 holding registers used by the table writes for

programming.

Since the Table Latch (TABLAT) is only a single byte,

the TBLWT instruction has to be executed 8 times for

each programming operation. All of the table write

operations will essentially be short writes, because only

the holding registers are written. At the end of updating

8 registers, the EECON1 register must be written to, to

start the programming operation with a long write.

The long write is necessary for programming the

internal Flash. Instruction execution is halted while in a

long write cycle. The long write will be terminated by

the internal programming timer.

The EEPROM on-chip timer controls the write time.

The write/erase voltages are generated by an on-chip

charge pump, rated to operate over the voltage range

of the device.

FIGURE 8-5: TA BLE WRITES TO FLASH PROGRAM MEMORY

Note: The default value of the holding registers

on device Resets and after write operations

is FFh. A write of FFh to a holding register

does not modify that byte. This means that

individual bytes of program memory may

be modified, provided that the modification

does not attempt to change any bit from a

‘0’ to a ‘1’. When modifying individual

bytes, it is not necessary to load all 64 hold-

ing registers before executing a write

operation.

Holding Register

TABLAT

Holding Register

TBLPTR = xxxxx7

Holding Register

TBLPTR = xxxxx1

Holding Register

TBLPTR = xxxxx0

88 8 8

Write Register

TBLPTR = xxxxx2

Program Memory

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8.5.1 FLASH PROGRAM MEMORY WRITE

SEQUENCE

The sequence of events for programming an internal

program memory location should be:

1. Read 64 bytes into RAM.

2. Update data values in RAM as necessary.

3. Load Table Pointer with address being erased.

4. Do the row erase procedure (see Section 8.4.1

“Flash Program Memory Erase Sequenc e”).

5. Load Table Pointer with the address of the first

byte being written.

6. Write the first 8 bytes into the holding registers

with auto-increment.

7. Set the EECON1 register for the write operation

by doing the following:

• Set the EEPGD bit to point to program

memory

• Clear the CFGS bit to access program

memory

• Set the WREN bit to enable byte writes

8. Disable interrupts.

9. Write 55h to EECON2.

10. Write 0AAh to EECON2.

11. Set the WR bit. This will begin the write cycle.

12. The CPU will stall for the duration of the write

(about 2 ms using internal timer).

13. Execute a NOP.

14. Re-enable interrupts.

15. Repeat Steps 6-14 seven times to write

64 bytes.

16. Verify the memory (table read).

This procedure will require about 18 ms to update one

row of 64 bytes of memory. An example of the required

code is given in Example 8-3.

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EXAMPLE 8-3: WRITING TO FLASH PROGRAM MEMORY

MOVLW D'64' ; number of bytes in erase block

MOVWF COUNTER

MOVLW BUFFER_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW BUFFER_ADDR_LOW

MOVWF FSR0L

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW ; 6 LSB = 0

MOVWF TBLPTRL

READ_BLOCK TBLRD*+ ; read into TABLAT, and inc

MOVF TABLAT,W ; get data

MOVWF POSTINC0 ; store data and increment FSR0

DECFSZ COUNTER ; done?

BRA READ_BLOCK ; repeat

MODIFY_WORDMOVLW DATA_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW DATA_ADDR_LOW

MOVWF FSR0L

MOVLW NEW_DATA_LOW ; update buffer word and increment FSR0

MOVWF POSTINC0

MOVLW NEW_DATA_HIGH ; update buffer word

MOVWF INDF0

ERASE_BLOCKMOVLW CODE_ADDR_UPPER ; load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW ; 6 LSB = 0

MOVWF TBLPTRL

BCF EECON1, CFGS ; point to PROG/EEPROM memory

BSF EECON1, EEPGD ; point to Flash program memory

BSF EECON1, WREN ; enable write to memory

BSF EECON1, FREE ; enable Row Erase operation

BCF INTCON, GIE ; disable interrupts

MOVLW 55h ; Required sequence

MOVWF EECON2 ; write 55h

MOVLW 0AAh

MOVWF EECON2 ; write 0AAh

BSF EECON1, WR ; start erase (CPU stall)

NOP

BSF INTCON, GIE ; re-enable interrupts

WRITE_BUFFER_BACK

MOVLW 8 ; number of write buffer groups of 8 bytes

MOVWF COUNTER_HI

MOVLW BUFFER_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW BUFFER_ADDR_LOW

MOVWF FSR0L

PROGRAM_LOOP

MOVLW 8 ; number of bytes in holding register

MOVWF COUNTER

WRITE_WORD_TO_HREGS

MOVF POSTINC0,F ; get low byte of buffer data and increment FSR0

MOVWF TABLAT ; present data to table latch

TBLWT+* ; short write

; to internal TBLWT holding register, increment

; TBLPTR

DECFSZ COUNTER ; loop until buffers are full

GOTO WRITE_WORD_TO_HREGS

PIC18F2331/2431/4331/4431

DS39616D-page 94  2010 Microchip Technology Inc.

EXAMPLE 8-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED)

8.5.2 WRITE VERIFY

Depending on the application, good programming

practice may dictate that the value written to the

memory should be verified against the original value.

This should be used in applications where excessive

writes can stress bits near the specification limit.

8.5.3 UNEXPECTED TERMINATION OF

WRITE OPERATION

If a write is terminated by an unplanned event, such as

loss of power or an unexpected Reset, the memory

location just programmed should be verified and

reprogrammed if needed. The WRERR bit is set when

a write operation is interrupted by a MCLR Reset, or a

WDT Time-out Reset during normal operation. In these

situations, users can check the WRERR bit and rewrite

the location.

8.6 Flash Program Operation Duri ng

Code Protection

See Section 23.5 “Program Verification and Code

Protection” for details on code protection of Flash

program memory.

TABLE 8-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY

PROGRAM_MEMORY

BCF INTCON, GIE ; disable interrupts

MOVLW 55h ; required sequence

MOVWF EECON2 ; write 55h

MOVLW 0AAh

MOVWF EECON2 ; write 0AAh

BSF EECON1, WR ; start program (CPU stall)

NOP

BSF INTCON, GIE ; re-enable interrupts

DECFSZ COUNTER_HI ; loop until done

GOTO PROGRAM_LOOP

BCF EECON1, WREN ; disable write to memory

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset

Values

on Page:

TBLPTRU ——bit 21

(1) Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) 54

TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 54

TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 54

TABLAT Program Memory Table Latch 54

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

EECON2 EEPROM Control Register 2 (not a physical register) 56

EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 56

IPR2 OSCFIP —— EEIP —LVDIP — CCP2IP 57

PIR2 OSCFIF —— EEIF —LVDIF—CCP2IF 57

PIE2 OSCFIE —— EEIE —LVDIE — CCP2IE 57

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.

Note 1: Bit 21 of the PC is only available in Test mode and Serial Programming modes.

 2010 Microchip Technology Inc. DS39616D-page 95

PIC18F2331/2431/4331/4431

9.0 8 x 8 HARDWARE MULTIPLIER

9.1 Introduction

All PIC18 devices include an 8 x 8 hardware multiplier

as part of the ALU. The multiplier performs an unsigned

operation and yields a 16-bit result that is stored in the

product register pair, PRODH:PRODL. The multiplier’s

operation does not affect any flags in the STATUS

Making multiplication a hardware operation allows it to be

completed in a single instruction cycle. This has the

advantages of higher computational throughput and

reduced code size for multiplication algorithms, and

allows the PIC18 devices to be used in many applications

previously reserved for digital signal processors.

A comparison of various hardware and software multi-

ply operations, along with the savings in memory and

execution time, is shown in Ta b l e 9 - 1 .

9.2 Operation

Example 9-1 shows the sequence to do an 8 x 8

unsigned multiply. Only one instruction is required

when one argument of the multiply is already loaded in

the WREG register.

Example 9-2 shows the sequence to do an 8 x 8 signed

multiply. To account for the sign bits of the arguments,

each argument’s Most Significant bit (MSb) is tested

and the appropriate subtractions are done.

EXAMPLE 9-1: 8 x 8 UNSIGNED MULTIPLY

ROUTIN E

EXAMPLE 9-2: 8 x 8 SIGNED MULTIPLY

ROUTIN E

TABLE 9-1: PERFORMANCE COMPARISON

MOVF ARG1, W ;

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

MOVF ARG1, W

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

BTFSC ARG2, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG1

MOVF ARG2, W

BTFSC ARG1, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG2

Routine Multiply Method Program

Memory

(Words)

Cycles

(Max)

Time

@ 40 MHz @ 10 MHz @ 4 MHz

8 x 8 Unsigned Without Hardware Multiply 13 69 6.9 s 27.6 s 69 s

Hardware Multiply 1 1 100 ns 400 ns 1 s

8 x 8 Signed Without Hardware Multiply 33 91 9.1 s 36.4 s 91 s

Hardware Multiply 6 6 600 ns 2.4 s6 s

16 x 16 Unsigned Without Hardware Multiply 21 242 24.2 s 96.8 s242 s

Hardware Multiply 24 24 2.4 s9.6 s 24 s

16 x 16 Signed Without Hardware Multiply 52 254 25.4 s102.6 s254 s

Hardware Multiply 36 36 3.6 s 14.4 s 36 s

PIC18F2331/2431/4331/4431

DS39616D-page 96  2010 Microchip Technology Inc.

Example 9-3 shows the sequence to do a 16 x 16

unsigned multiply. Equation 9-1 shows the algorithm

that is used. The 32-bit result is stored in four registers,

RES<3:0>.

EQUATION 9-1: 16 x 16 UNSIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 9-3: 16 x 16 UNSIGN ED

MULTIPLY ROUTINE

Example 9-4 shows the sequence to do a 16 x 16

signed multiply. Equation 9-2 shows the algorithm

used. The 32-bit result is stored in four registers,

RES<3:0>. To account for the sign bits of the argu-

ments, each argument pair’s Most Significant bit (MSb)

is tested and the appropriate subtractions are done.

EQUATION 9-2: 16 x 16 SIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 9-4: 16 x 16 S IGNE D MULT IP LY

ROUTINE

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L ->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

; MOVF ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H ->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

; MOVF ARG1L, W

MULWF ARG2H ; ARG1L * ARG2H ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

; MOVF ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

RES<3:0> = ARG1H:ARG1L  ARG2H:ARG2L

= (ARG1H  ARG2H  216) +

(ARG1H  ARG2L  28) +

(ARG1L  ARG2H  28) +

(ARG1L  ARG2L)

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L ->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

; MOV F ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H ->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

; MOV F ARG1L,W

MULWF ARG2H ; ARG1L * ARG2H ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

; MOV F ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

; BTF SS ARG2H, 7 ; ARG2H:ARG2L neg?

BRA SIGN_A RG1 ; no, check ARG1

MOVF ARG1L, W ;

SUBWF RES2 ;

MOVF ARG1H, W ;

SUBWFB RES3

;

SIGN_ARG1

BTFSS ARG1H, 7 ; ARG1H:ARG 1L neg?

BRA CONT_C ODE ; no, done

MOVF ARG2L, W ;

SUBWF RES2 ;

MOVF ARG2H, W ;

SUBWFB RES3

;

CONT_CODE

RES<3:0>

= ARG1H:ARG1L  ARG2H:ARG2L

= (ARG1H  ARG2H  216) +

(ARG1H  ARG2L  28) +

(ARG1L  ARG2H ² 28) +

(ARG1L  ARG2L)+

(-1  ARG2H<7>  ARG1H:ARG1L  216) +

(-1  ARG1H<7>  ARG2H:ARG2L  216)

 2010 Microchip Technology Inc. DS39616D-page 97

PIC18F2331/2431/4331/4431

10.0 INTERRUPTS

The PIC18F2331/2431/4331/4431 devices have

multiple interrupt sources and an interrupt priority

feature that allows each interrupt source to be assigned

a high-priority level or a low-priority level. The high-

priority interrupt vector is at 000008h and the low-priority

interrupt vector is at 000018h. High-priority interrupt

events will interrupt any low-priority interrupts that may

be in progress.

There are thirteen registers which are used to control

interrupt operation. These registers are:

• RCON

•INTCON

• INTCON2

• INTCON3

• PIR1, PIR2, PIR3

• PIE1, PIE2, PIE3

• IPR1, IPR2, IPR3

It is recommended that the Microchip header files sup-

plied with MPLAB® IDE be used for the symbolic bit

names in these registers. This allows the assembler/

compiler to automatically take care of the placement of

these bits within the specified register.

In general, each interrupt source has three bits to

control its operation. The functions of these bits are:

• Flag bit to indicate that an interrupt event

occurred

• Enable bit that allows program execution to

branch to the interrupt vector address when the

flag bit is set

• Priority bit to select high priority or low priority

(most interrupt sources have priority bits)

The interrupt priority feature is enabled by setting the

IPEN bit (RCON<7>). When interrupt priority is

enabled, there are two bits which enable interrupts

globally. Setting the GIEH bit (INTCON<7>) enables all

interrupts that have the priority bit set (high priority).

Setting the GIEL bit (INTCON<6>) enables all

interrupts that have the priority bit cleared (low priority).

When the interrupt flag, enable bit and appropriate

global interrupt enable bit are set, the interrupt will

vector immediately to address 000008h or 000018h

depending on the priority bit setting. Individual

interrupts can be disabled through their corresponding

enable bits.

When the IPEN bit is cleared (default state), the

interrupt priority feature is disabled and interrupts are

compatible with PIC® mid-range devices. In Compati-

bility mode, the interrupt priority bits for each source

have no effect. INTCON<6> is the PEIE bit, which

enables/disables all peripheral interrupt sources.

INTCON<7> is the GIE bit, which enables/disables all

interrupt sources. All interrupts branch to address

000008h in Compatibility mode.

When an interrupt is responded to, the global interrupt

enable bit is cleared to disable further interrupts. If the

IPEN bit is cleared, this is the GIE bit. If interrupt priority

levels are used, this will be either the GIEH or GIEL bit.

High-priority interrupt sources can interrupt a low-

priority interrupt. Low-priority interrupts are not

processed while high-priority interrupts are in progress.

The return address is pushed onto the stack and the

PC is loaded with the interrupt vector address

(000008h or 000018h). Once in the Interrupt Service

Routine, the source(s) of the interrupt can be deter-

mined by polling the interrupt flag bits. The interrupt

flag bits must be cleared in software before re-enabling

interrupts to avoid recursive interrupts.

The “return from interrupt” instruction, RETFIE, exits

the interrupt routine and sets the GIE bit (GIEH or

GIEL if priority levels are used), which re-enables

interrupts.

For external interrupt events, such as the INTx pins or

the PORTB input change interrupt, the interrupt latency

will be three to four instruction cycles. The exact

latency is the same for one or two-cycle instructions.

Individual interrupt flag bits are set, regardless of the

status of their corresponding enable bit or the GIE bit.

Note: Do not use the MOVFF instruction to modify

any of the Interrupt Control registers while

any interrupt is enabled. Doing so may

cause erratic microcontroller behavior.

PIC18F2331/2431/4331/4431

DS39616D-page 98  2010 Microchip Technology Inc.

FIGU RE 10-1 : INTERRU PT L OG IC

TMR0IE

GIE/GIEH

PEIE/GIEL

Wake-up if in

Interrupt to CPU

Vector to Location

0008h

INT2IF

INT2IE

INT2IP

INT1IF

INT1IE

INT1IP

TMR0IF

TMR0IE

TMR0IP

INT0IF

INT0IE

RBIF

RBIE

RBIP

IPEN

TMR0IF

TMR0IP

INT1IF

INT1IE

INT1IP

INT2IF

INT2IE

INT2IP

RBIF

RBIE

RBIP

INT0IF

INT0IE

PEIE/GIEL

Interrupt to CPU

Vector to Location

IPEN

0018h

TXIF

TXIE

TXIP

TXIF

TXIE

TXIP

ADIF

ADIE

ADIP

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

ADIF

ADIE

ADIP

High-Priority Interrupt Generation

Low-Priority Interrupt Generation

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

Power-Managed Mode

 2010 Microchip Technology Inc. DS39616D-page 99

PIC18F2331/2431/4331/4431

10.1 INTCON Registers

The INTCON registers are readable and writable

registers which contain various enable, priority and flag

bits.

Note: Interrupt flag bits are set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit or the global

enable bit. User software should ensure

the appropriate interrupt flag bits are clear

prior to enabling an interrupt. This feature

allows for software polling.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x

GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 GIE/GIEH: Global Interrupt Enable bit

When IPEN = 0:

1 = Enables all unmasked interrupts

0 = Disables all interrupts

When IPEN = 1:

1 = Enables all high-priority interrupts

0 = Disables all high-priority interrupts

bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit

When IPEN = 0:

1 = Enables all unmasked peripheral interrupts

0 = Disables all peripheral interrupts

When IPEN = 1:

1 = Enables all low-priority peripheral interrupts

0 = Disables all low-priority peripheral interrupts

bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit

1 = Enables the TMR0 overflow interrupt

0 = Disables the TMR0 overflow interrupt

bit 4 INT0IE: INT0 External Interrupt Enable bit

1 = Enables the INT0 external interrupt

0 = Disables the INT0 external interrupt

bit 3 RBIE: RB Port Change Interrupt Enable bit

1 = Enables the RB port change interrupt for RB<7:4> pins

0 = Disables the RB port change interrupt for RB<7:4> pins

bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit

1 = TMR0 register has overflowed (must be cleared in software)

0 = TMR0 register did not overflow

bit 1 INT0IF: INT0 External Interrupt Flag bit

1 = The INT0 external interrupt occurred (must be cleared in software)

0 = The INT0 external interrupt did not occur

bit 0 RBIF: RB Port Change Interrupt Flag bit

1 = At least one of the RB<7:4> pins changed state (must be cleared in software)

0 = None of the RB<7:4> pins have changed state

PIC18F2331/2431/4331/4431

DS39616D-page 100  2010 Microchip Technology Inc.

R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1

RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 RBPU: PORTB Pull-up Enable bit

1 = All PORTB pull-ups are disabled

0 = PORTB pull-ups are enabled by individual port latch values

bit 6 INTEDG0: External Interrupt 0 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 5 INTEDG1: External Interrupt 1 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 4 INTEDG2: External Interrupt 2 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 3 Unimplemented: Read as ‘0’

bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 Unimplemented: Read as ‘0’

bit 0 RBIP: RB Port Change Interrupt Priority bit

1 =High priority

0 = Low priority

Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding

enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear

prior to enabling an interrupt. This feature allows for software polling.

 2010 Microchip Technology Inc. DS39616D-page 101

PIC18F2331/2431/4331/4431

R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

INT2IP INT1IP —INT2IE INT1IE —INT2IF INT1IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 INT2IP: INT2 External Interrupt Priority bit

1 =High priority

0 = Low priority

bit 6 INT1IP: INT1 External Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5 Unimplemented: Read as ‘0’

bit 4 INT2IE: INT2 External Interrupt Enable bit

1 = Enables the INT2 external interrupt

0 = Disables the INT2 external interrupt

bit 3 INT1IE: INT1 External Interrupt Enable bit

1 = Enables the INT1 external interrupt

0 = Disables the INT1 external interrupt

bit 2 Unimplemented: Read as ‘0’

bit 1 INT2IF: INT2 External Interrupt Flag bit

1 = The INT2 external interrupt occurred (must be cleared in software)

0 = The INT2 external interrupt did not occur

bit 0 INT1IF: INT1 External Interrupt Flag bit

1 = The INT1 external interrupt occurred (must be cleared in software)

0 = The INT1 external interrupt did not occur

Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding

enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear

prior to enabling an interrupt. This feature allows for software polling.

PIC18F2331/2431/4331/4431

DS39616D-page 102  2010 Microchip Technology Inc.

10.2 PIR Registers

The PIR registers contain the individual flag bits for the

peripheral interrupts. Due to the number of peripheral

interrupt sources, there are three Peripheral Interrupt

Request (Flag) Registers (PIR1, PIR2 and PIR3).

Note 1: Interrupt flag bits are set when an inter-

rupt condition occurs, regardless of the

state of its corresponding enable bit or the

Global Interrupt Enable bit, GIE

(INTCON<7>).

2: User software should ensure the appro-

priate interrupt flag bits are cleared prior

to enabling an interrupt and after servicing

that interrupt.

U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0

—ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIF: A/D Converter Interrupt Flag bit

1 = An A/D conversion completed (must be cleared in software)

0 = The A/D conversion is not complete

bit 5 RCIF: EUSART Receive Interrupt Flag bit

1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read)

0 = The EUSART receive buffer is empty

bit 4 TXIF: EUSART Transmit Interrupt Flag bit

1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written)

0 = The EUSART transmit buffer is full

bit 3 SSPIF: Synchronous Serial Port Interrupt Flag bit

1 = The transmission/reception is complete (must be cleared in software)

0 = Waiting to transmit/receive

bit 2 CCP1IF: CCP1 Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurred (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Unused in this mode.

bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit

1 = TMR2 to PR2 match occurred (must be cleared in software)

0 = No TMR2 to PR2 match occurred

bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit

1 = TMR1 register overflowed (must be cleared in software)

0 = TMR1 register did not overflow

 2010 Microchip Technology Inc. DS39616D-page 103

PIC18F2331/2431/4331/4431

R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 U-0 R/W-0

OSCFIF —— EEIF —LVDIF— CCP2IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit

1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software)

0 = Device clock operating

bit 6-5 Unimplemented: Read as ‘0’

bit 4 EEIF: EEPROM or Flash Write Operation Interrupt Flag bit

1 = The write operation is complete (must be cleared in software)

0 = The write operation is not complete or has not been started

bit 3 Unimplemented: Read as ‘0’

bit 2 LVDIF: Low-Voltage Detect Interrupt Flag bit

1 = The supply voltage has fallen below the specified LVD voltage (must be cleared in software)

0 = The supply voltage is greater than the specified LVD voltage

bit 1 Unimplemented: Read as ‘0’

bit 0 CCP2IF: CCP2 Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurred (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Not used in this mode.

PIC18F2331/2431/4331/4431

DS39616D-page 104  2010 Microchip Technology Inc.

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — PTIF IC3DRIF IC2QEIF IC1IF TMR5IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 Unimplemented: Read as ‘0’

bit 4 PTIF: PWM Time Base Interrupt bit

1 = PWM time base matched the value in the PTPER registers. Interrupt is issued according to the

postscaler settings. PTIF must be cleared in software.

0 = PWM time base has not matched the value in the PTPER registers

bit 3 IC3DRIF: IC3 Interrupt Flag/Direction Change Interrupt Flag bit

IC3 Enabled (CAP3CON<3:0>):

1 = TMR5 value was captured by the active edge on CAP3 input (must be cleared in software)

0 = TMR5 capture has not occurred

QEI Enabled (QEIM<2:0>):

1 = Direction of rotation has changed (must be cleared in software)

0 = Direction of rotation has not changed

bit 2 IC2QEIF: IC2 Interrupt Flag/QEI Interrupt Flag bit

IC2 Enabled (CAP2CON<3:0>):

1 = TMR5 value was captured by the active edge on CAP2 input (must be cleared in software)

0 = TMR5 capture has not occurred

QEI Enabled (QEIM<2:0>):

1 = The QEI position counter has reached the MAXCNT value, or the index pulse, INDX, has been

detected. Depends on the QEI operating mode enabled. Must be cleared in software.

0 = The QEI position counter has not reached the MAXCNT value or the index pulse has not been

detected

bit 1 IC1 Enabled (CAP1CON<3:0>):

1 = TMR5 value was captured by the active edge on CAP1 input (must be cleared in software)

0 = TMR5 capture has not occurred

QEI Enabled (QEIM<2:0>), Velocity Measurement Mode Enabled (VELM = 0 in QEICON register):

1 = Timer5 value was captured by the active velocity edge (based on PHA or PHB input). CAP1REN

bit must be set in CAP1CON register. IC1IF must be cleared in software.

0 = Timer5 value was not captured by the active velocity edge

bit 0 TMR5IF: Timer5 Interrupt Flag bit

1 = Timer5 time base matched the PR5 value (must be cleared in software)

0 = Timer5 time base did not match the PR5 value

 2010 Microchip Technology Inc. DS39616D-page 105

PIC18F2331/2431/4331/4431

10.3 PIE Registers

The PIE registers contain the individual enable bits for

the peripheral interrupts. Due to the number of peripheral

interrupt sources, there are three Peripheral Interrupt

Enable Registers (PIE1, PIE2 and PIE3). When

IPEN = 0, the PEIE bit must be set to enable any of these

peripheral interrupts.

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIE: A/D Converter Interrupt Enable bit

1 = Enables the A/D interrupt

0 = Disables the A/D interrupt

bit 5 RCIE: EUSART Receive Interrupt Enable bit

1 = Enables the EUSART receive interrupt

0 = Disables the EUSART receive interrupt

bit 4 TXIE: EUSART Transmit Interrupt Enable bit

1 = Enables the EUSART transmit interrupt

0 = Disables the EUSART transmit interrupt

bit 3 SSPIE: Synchronous Serial Port Interrupt Enable bit

1 = Enables the SSP interrupt

0 = Disables the SSP interrupt

bit 2 CCP1IE: CCP1 Interrupt Enable bit

1 = Enables the CCP1 interrupt

0 = Disables the CCP1 interrupt

bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit

1 = Enables the TMR2 to PR2 match interrupt

0 = Disables the TMR2 to PR2 match interrupt

bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit

1 = Enables the TMR1 overflow interrupt

0 = Disables the TMR1 overflow interrupt

PIC18F2331/2431/4331/4431

DS39616D-page 106  2010 Microchip Technology Inc.

R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 U-0 R/W-0

OSCFIE —— EEIE —LVDIE— CCP2IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit

1 = Enabled

0 = Disabled

bit 6-5 Unimplemented: Read as ‘0’

bit 4 EEIE: Interrupt Enable bit

1 = Enabled

0 = Disabled

bit 3 Unimplemented: Read as ‘0’

bit 2 LVDIE: Low-Voltage Detect Interrupt Enable bit

1 = Enabled

0 = Disabled

bit 1 Unimplemented: Read as ‘0’

bit 0 CCP2IE: CCP2 Interrupt Enable bit

1 = Enabled

0 = Disabled

 2010 Microchip Technology Inc. DS39616D-page 107

PIC18F2331/2431/4331/4431

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — PTIE IC3DRIE IC2QEIE IC1IE TMR5IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 Unimplemented: Read as ‘0’

bit 4 PTIE: PWM Time Base Interrupt Enable bit

1 = PTIF enabled

0 = PTIF disabled

bit 3 IC3DRIE: IC3 Interrupt Enable/Direction Change Interrupt Enable bit

IC3 Enabled (CAP3CON<3:0>):

1 = IC3 interrupt enabled

0 = IC3 interrupt disabled

QEI Enabled (QEIM<2:0>):

1 = Change of direction interrupt enabled

0 = Change of direction interrupt disabled

bit 2 IC2QEIE: IC2 Interrupt Flag/QEI Interrupt Flag Enable bit

IC2 Enabled (CAP2CON<3:0>):

1 = IC2 interrupt enabled)

0 = IC2 interrupt disabled

QEI Enabled (QEIM<2:0>):

1 = QEI interrupt enabled

0 = QEI interrupt disabled

bit 1 IC1IE: IC1 Interrupt Enable bit

1 = IC1 interrupt enabled

0 = IC1 interrupt disabled

bit 0 TMR5IE: Timer5 Interrupt Enable bit

1 = Timer5 interrupt enabled

0 = Timer5 interrupt disabled

PIC18F2331/2431/4331/4431

DS39616D-page 108  2010 Microchip Technology Inc.

10.4 IPR Registers

The IPR registers contain the individual priority bits for

the peripheral interrupts. Due to the number of

peripheral interrupt sources, there are three peripheral

interrupt priority registers (IPR1, IPR2 and IPR3).

Using the priority bits requires that the Interrupt Priority

Enable (IPEN) bit be set.

U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— ADIP RCIP TXIP SSPIP CCPIP TMR2IP TMR1IP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIP: A/D Converter Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5 RC1IP: EUSART Receive Interrupt Priority bit

1 =High priority

0 = Low priority

bit 4 TX1IP: EUSART Transmit Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 SSP1IP: Synchronous Serial Port Interrupt Priority bit

1 =High priority

0 = Low priority

bit 2 CCP1IP: CCP1 Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

 2010 Microchip Technology Inc. DS39616D-page 109

PIC18F2331/2431/4331/4431

R/W-1 U-0 U-0 R/W-1 U-0 R/W-1 U-0 R/W-1

OSCFIP —— EEIP —LVDIP— CCP2IP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit

1 =High priority

0 = Low priority

bit 6-5 Unimplemented: Read as ‘0’

bit 4 EEIP: Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 Unimplemented: Read as ‘0’

bit 2 LVDIP: Low-Voltage Detect Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 Unimplemented: Read as ‘0’

bit 0 CCP2IP: CCP2 Interrupt Priority bit

1 =High priority

0 = Low priority

PIC18F2331/2431/4331/4431

DS39616D-page 110  2010 Microchip Technology Inc.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — PTIP IC3DRIP IC2QEIP IC1IP TMR5IP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 Unimplemented: Read as ‘0’

bit 4 PTIP: PWM Time Base Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 IC3DRIP: IC3 Interrupt Priority/Direction Change Interrupt Priority bit

IC3 Enabled (CAP3CON<3:0>):

1 = IC3 interrupt high priority

0 = IC3 interrupt low priority

QEI Enabled (QEIM<2:0>):

1 = Change of direction interrupt high priority

0 = Change of direction interrupt low priority

bit 2 IC2QEIP: IC2 Interrupt Priority/QEI Interrupt Priority bit

IC2 Enabled (CAP2CON<3:0>):

1 = IC2 interrupt high priority

0 = IC2 interrupt low priority

QEI Enabled (QEIM<2:0>):

1 =High priority

0 = Low priority

bit 1 IC1IP: IC1 Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 TMR5IP: Timer5 Interrupt Priority bit

1 =High priority

0 = Low priority

 2010 Microchip Technology Inc. DS39616D-page 111

PIC18F2331/2431/4331/4431

10.5 RCON Register

The RCON register contains bits used to determine the

cause of the last Reset or wake-up from a power-

managed mode. RCON also contains the bit that

enables interrupt priorities (IPEN).

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0

IPEN ——RITO PD POR BOR

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts

0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)

bit 6-5 Unimplemented: Read as ‘0’

bit 4 RI: RESET Instruction Flag bit

For details of bit operation, see Register 5-1.

bit 3 TO: Watchdog Timer Time-out Flag bit

For details of bit operation, see Register 5-1.

bit 2 PD: Power-Down Detection Flag bit

For details of bit operation, see Register 5-1.

bit 1 POR: Power-on Reset Status bit

For details of bit operation, see Register 5-1.

bit 0 BOR: Brown-out Reset Status bit

For details of bit operation, see Register 5-1.

PIC18F2331/2431/4331/4431

DS39616D-page 112  2010 Microchip Technology Inc.

10.6 INTx Pin Interrupts

External interrupts on the INT0, INT1 and INT2 pins are

edge-triggered. If the corresponding INTEDGx bit in the

INTCON2 register is set (= 1), the interrupt is triggered

by a rising edge. If the bit is clear, the trigger is on the

falling edge.

When a valid edge appears on the INTx pin, the corre-

sponding flag bit, INTxIF, is set. This interrupt can be

disabled by clearing the corresponding enable bit,

INTxIE. Before re-enabling the interrupt, the flag bit,

INTxIF, must be cleared in software in the Interrupt

Service Routine.

All external interrupts (INT0, INT1 and INT2) can wake-

up the processor from the Idle or Sleep modes if bit,

INTxIE, was set prior to going into those modes. If the

Global Interrupt Enable bit, GIE, is set, the processor

will branch to the interrupt vector following wake-up.

Interrupt priority for INT1 and INT2 is determined by

the value contained in the Interrupt Priority bits,

INT1IP (INTCON3<6>) and INT2IP (INTCON3<7>).

There is no priority bit associated with INT0. It is

always a high-priority interrupt source.

10.7 TMR0 Interrupt

In 8-bit mode (which is the default), an overflow

(FFh 00h) in the TMR0 register will set flag bit,

TMR0IF. In 16-bit mode, an overflow (FFFFh 0000h)

in the TMR0H:TMR0L registers will set flag bit,

TMR0IF. The interrupt can be enabled/disabled by

setting/clearing enable bit, TMR0IE (INTCON<5>).

Interrupt priority for Timer0 is determined by the value

contained in the interrupt priority bit, TMR0IP

(INTCON2<2>). See Section 12.0 “Timer0 Module”

for further details.

10.8 PORTB Interrupt-on-Change

An input change on PORTB<7:4> sets flag bit, RBIF

(INTCON<0>). The interrupt can be enabled/disabled

by setting/clearing enable bit, RBIE (INTCON<3>).

Interrupt priority for PORTB interrupt-on-change is

determined by the value contained in the interrupt

priority bit, RBIP (INTCON2<0>).

10.9 Context Saving During Interrupts

During interrupts, the return PC address is saved on

the stack. Additionally, the WREG, STATUS and BSR

registers are saved on the fast return stack. If a fast

return from interrupt is not used (see Section 6.1.3

“Fast R egister S tac k”), the user may need to save the

WREG, STATUS and BSR registers on entry to the

Interrupt Service Routine. Depending on the user’s

application, other registers may also need to be saved.

Example 10-1 saves and restores the WREG, STATUS

and BSR registers during an Interrupt Service Routine.

EXAMPLE 10-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM

MOVWF W_TEMP ; W_TEMP is in virtual bank

MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere

MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere

;

; USER ISR CODE

;

MOVFF BSR_TEMP, BSR ; Restore BSR

MOVF W_TEMP, W ; Restore WREG

MOVFF STATUS_TEMP, STATUS ; Restore STATUS

 2010 Microchip Technology Inc. DS39616D-page 113

PIC18F2331/2431/4331/4431

11.0 I/O PORTS

Depending on the device selected and features

enabled, there are up to five ports available. Some pins

of the I/O ports are multiplexed with an alternate

function from the peripheral features on the device. In

general, when a peripheral is enabled, that pin may not

be used as a general purpose I/O pin.

Each port has three registers for its operation. These

registers are:

• TRIS register (Data Direction register)

• PORT register (reads the levels on the pins of the

device)

• LAT register (Data Latch)

The Data Latch (LAT register) is useful for read-modify-

write operations on the value that the I/O pins are

driving.

A simplified model of a generic I/O port without the

interfaces to other peripherals is shown in Figure 11-1.

FIGURE 11-1: GENERIC I/O PORT

OPERATION

11.1 PORTA , TRISA and LATA

Registers

PORTA is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISA. Setting a

TRISA bit (= 1) will make the corresponding PORTA pin

an input (i.e., put the corresponding output driver in a

high-impedance mode). Clearing a TRISA bit (= 0) will

make the corresponding PORTA pin an output (i.e., put

the contents of the output latch on the selected pin).

Reading the PORTA register reads the status of the

pins, whereas writing to it, will write to the port latch.

The Data Latch register (LATA) is also memory mapped.

Read-modify-write operations on the LATA register read

and write the latched output value for PORTA.

The RA<4:2> pins are multiplexed with three input

capture pins and Quadrature Encoder Interface pins.

Pins, RA6 and RA7, are multiplexed with the main

oscillator pins. They are enabled as oscillator or I/O

pins by the selection of the main oscillator in

Configuration Register 1H (see Section 23.1

“Configuration Bits” for details). When they are not

used as port pins, RA6 and RA7 and their associated

TRIS and LAT bits are read as ‘0’.

The other PORTA pins are multiplexed with analog

inputs, the analog VREF+ and VREF- inputs and the com-

parator voltage reference output. The operation of pins

RA<3:0> and RA5 as A/D Converter inputs is selected

by clearing/setting the control bits in the ANSEL0 and

ANSEL1 registers.

The TRISA register controls the direction of the RA

pins, even when they are being used as analog inputs.

The user must ensure the bits in the TRISA register are

maintained set when using them as analog inputs.

EXAMP LE 11-1: I NITI ALI ZIN G PORTA

Data

Bus

WR LAT

WR TRIS

RD PORT

Data Latch

TRIS Latch

RD TRIS

Input

Buffer

I/O Pin(1)

RD LAT

or PORT

Note 1: I/O pins have diode protection to VDD and VSS.

Note 1: On a Power-on Reset, RA<5:0> are

configured as analog inputs and read as ‘0’.

2: RA5 I/F is available only on 40-pin

devices (PIC18F4331/4431).

CLRF PORTA ; Initialize PORTA by

; clearing output

; data latches

CLRF LATA ; Alternate method

; to clear output

; data latches

MOVLW 0x3F ; Configure A/D

MOVWF ANSEL0 ; for digital inputs

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISA ; Set RA<3:0> as inputs

; RA<5:4> as outputs

PIC18F2331/2431/4331/4431

DS39616D-page 114  2010 Microchip Technology Inc.

TABLE 11-1: PORTA I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RA0/AN0 RA0 0O DIG LATA<0> data output; not affected by analog input.

1I TTL PORTA<0> data input; disabled when analog input is enabled.

AN0 1I ANA A/D Input Channel 0. Default input configuration on POR; does not

affect digital output.

RA1/AN1 RA1 0O DIG LATA<1> data output; not affected by analog input.

1I TTL PORTA<1> data input; disabled when analog input is enabled.

AN1 1I ANA A/D Input Channel 1. Default input configuration on POR; does not

affect digital output.

RA2/AN2/VREF-/

CAP1/INDX

RA2 0O DIG LATA<2> data output; not affected by analog input.

1I TTL PORTA<2> data input. Disabled when analog input is enabled.

AN2 1I ANA A/D Input Channel 2. Default input configuration on POR.

VREF-1I ANA A/D voltage reference low input.

CAP1 1I ST Input Capture Pin 1. Disabled when analog input is enabled.

INDX 1I ST Quadrature Encoder Interface index input pin. Disabled when analog

input is enabled.

RA3/AN3/VREF+/

CAP2/QEA

RA3 0O DIG LATA<3> data output; not affected by analog input.

1I TTL PORTA<3> data input; disabled when analog input is enabled.

AN3 1I ANA A/D Input Channel 3. Default input configuration on POR.

VREF+1I ANA A/D voltage reference high input.

CAP2 1I ST Input Capture Pin 2. Disabled when analog input is enabled.

QEA 1I ST Quadrature Encoder Interface Channel A input pin. Disabled when

analog input is enabled.

RA4/AN4/CAP3/

QEB

RA4 0O DIG LATA<4> data output; not affected by analog input.

1I ST PORTA<4> data input; disabled when analog input is enabled.

AN4 1I ANA A/D Input Channel 4. Default input configuration on POR.

CAP3 1I ST Input Capture Pin 3. Disabled when analog input is enabled.

QEB 1I ST Quadrature Encoder Interface Channel B input pin. Disabled when

analog input is enabled.

RA5/AN5/LVDIN RA5 0O DIG LATA<5> data output; not affected by analog input.

1I TTL PORTA<5> data input; disabled when analog input is enabled.

AN5 1I ANA A/D Input Channel 5. Default configuration on POR.

LVDIN 1I ANA Low-Voltage Detect external trip point input.

OSC2/CLKO/RA6 OSC2 xO ANA Main oscillator feedback output connection (XT, HS and LP modes).

CLKO xO DIG System cycle clock output (FOSC/4) in RC, INTIO1 and EC Oscillator

modes.

RA6 0O DIG LATA<6> data output. Enabled in RCIO, INTIO2 and ECIO modes only.

1I TTL PORTA<6> data input. Enabled in RCIO, INTIO2 and ECIO modes only.

OSC1/CLKI/RA7 OSC1 xI ANA Main oscillator input connection.

CLKI xI ANA Main clock input connection.

RA7 0O DIG LATA<7> data output. Disabled in external oscillator modes.

1I TTL PORTA<7> data input. Disabled in external oscillator modes.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

 2010 Microchip Technology Inc. DS39616D-page 115

PIC18F2331/2431/4331/4431

TABLE 11-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page:

PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 57

LATA LATA7(1) LATA6(1) LATA Data Output Register 57

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 57

ADCON1 VCFG1 VCFG0 — FIFOEN BFEMT BFOVFL ADPNT1 ADPNT0 56

ANSEL0 ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0 56

ANSEL1 — — — — — — —ANS8

(2) 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA.

Note 1: RA<7:6> and their associated latch and data direction bits are enabled as I/O pins based on oscillator

configuration; otherwise, they are read as ‘0’.

2: ANS5 through ANS8 are available only on the PIC18F4331/4431 devices.

PIC18F2331/2431/4331/4431

DS39616D-page 116  2010 Microchip Technology Inc.

11.2 PORTB, TRISB and LATB

Registers

PORTB is an 8-bit wide, bidirectional port. The corre-

sponding Data Direction register is TRISB. Setting a

TRISB bit (= 1) will make the corresponding PORTB

pin an input (i.e., put the corresponding output driver in

a high-impedance mode). Clearing a TRISB bit (= 0)

will make the corresponding PORTB pin an output (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATB) is also memory

mapped. Read-modify-write operations on the LATB

PORTB.

EXAMPLE 11-2: INITIALIZING PORTB

Each of the PORTB pins has a weak internal pull-up. A

single control bit can turn on all the pull-ups. This is

performed by clearing bit RBPU (INTCON2<7>). The

weak pull-up is automatically turned off when the port

pin is configured as an output. The pull-ups are

disabled on a Power-on Reset.

Four of the PORTB pins (RB<7:4>) have an interrupt-

on-change feature. Only pins configured as inputs can

cause this interrupt to occur (i.e., any RB<7:4> pin

configured as an output is excluded from the interrupt-

on-change comparison). The input pins (of RB<7:4>)

are compared with the old value latched on the last

read of PORTB. The “mismatch” outputs of RB<7:4>

are ORed together to generate the RB port change

interrupt with flag bit, RBIF (INTCON<0>).

This interrupt can wake the device from Sleep. The

user, in the Interrupt Service Routine, can clear the

interrupt in the following manner:

a) Any read or write of PORTB (except with the

MOVFF (ANY), PORTB instruction).

b) NOP (or any 1 T

CY delay).

c) Clear flag bit, RBIF.

A mismatch condition will continue to set flag bit, RBIF.

Reading PORTB and waiting 1 TCY will end the

mismatch condition and allow flag bit, RBIF, to be

cleared. Also, if the port pin returns to its original state,

the mismatch condition will be cleared.

The interrupt-on-change feature is recommended for

wake-up on key depression operation and operations

where PORTB is only used for the interrupt-on-change

feature. Polling of PORTB is not recommended while

using the interrupt-on-change feature.

RB<3:0> and RB4 pins are multiplexed with the 14-bit

PWM module for PWM<3:0> and PWM5 output. The

RB5 pin can be configured by the Configuration bit,

PWM4MX, as the alternate pin for PWM4 output.

CLRF PORTB ; Initialize PORTB by

; clearing output

; data latches

CLRF LATB ; Alternate method

; to clear output

; data latches

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISB ; Set RB<3:0> as inputs

; RB<5:4> as outputs

; RB<7:6> as inputs

 2010 Microchip Technology Inc. DS39616D-page 117

PIC18F2331/2431/4331/4431

TABLE 11-3: PORTB I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RB0/PWM0 RB0 0O DIG LATB<0> data output; not affected by analog input.

1I TTL PORTB<0> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input is enabled.

PWM0 0O DIG PWM Output 0.

RB1/PWM1 RB1 0O DIG LATB<1> data output; not affected by analog input.

1I TTL PORTB<1> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input is enabled.

PWM1 0O DIG PWM Output 1.

RB2/PWM2 RB2 0O DIG LATB<2> data output; not affected by analog input.

1I TTL PORTB<2> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input is enabled.

PWM2 0O DIG PWM Output 2.

RB3/PWM3 RB3 0O DIG LATB<3> data output; not affected by analog input.

1I TTL PORTB<3> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input is enabled.

PWM3 0O DIG PWM Output 3.

RB4/KBI0/PWM5 RB4 0O DIG LATB<4> data output; not affected by analog input.

1I TTL PORTB<4> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input is enabled.

KBI0 1I TTL Interrupt-on-change pin.

PWM5 0O DIG PWM Output 5.

RB5/KBI1/

PWM4/PGM

RB5 0O DIG LATB<5> data output.

1I TTL PORTB<5> data input; weak pull-up when RBPU bit is cleared.

KBI1 1I TTL Interrupt-on-change pin.

PWM4(3) 0O DIG PWM Output 4; takes priority over port data.

PGM(2) xI ST Single-Supply Programming mode entry (ICSP™). Enabled by LVP

Configuration bit; all other pin functions are disabled.

RB6/KBI2/PGC RB6 0O DIG LATB<6> data output.

1I TTL PORTB<6> data input; weak pull-up when RBPU bit is cleared.

KBI2 1I TTL Interrupt-on-change pin.

PGC xI ST Serial execution (ICSP™) clock input for ICSP and ICD operation.(1)

RB7/KBI3/PGD RB7 0O DIG LATB<7> data output.

1I TTL PORTB<7> data input; weak pull-up when RBPU bit is cleared.

KBI3 1I TTL Interrupt-on-change pin.

PGD xO DIG Serial execution data output for ICSP and ICD operation.(1)

xI ST Serial execution data input for ICSP and ICD operation.(1)

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: All other pin functions are disabled when ICSP or ICD is enabled.

2: Single-Supply Programming must be enabled.

3: RD5 is the alternate pin for PWM4.

PIC18F2331/2431/4331/4431

DS39616D-page 118  2010 Microchip Technology Inc.

TABLE 11-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 57

LATB LATB Data Output Register 57

TRISB PORTB Data Direction Register 57

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP —RBIP 54

INTCON3 INT2IP INT1IP —INT2IE INT1IE —INT2IF INT1IF 54

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTB.

 2010 Microchip Technology Inc. DS39616D-page 119

PIC18F2331/2431/4331/4431

11.3 PORTC, TRISC and LATC

Registers

PORTC is an 8-bit wide, bidirectional port. The corre-

sponding Data Direction register is TRISC. Setting a

TRISC bit (= 1) will make the corresponding PORTC

pin an input (i.e., put the corresponding output driver in

a high-impedance mode). Clearing a TRISC bit (= 0)

will make the corresponding PORTC pin an output (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATC) is also memory

mapped. Read-modify-write operations on the LATC

PORTC.

PORTC is multiplexed with several peripheral functions

(Table 11-5). The pins have Schmitt Trigger input

buffers.

When enabling peripheral functions, care should be

taken in defining TRIS bits for each PORTC pin. Some

peripherals override the TRIS bit to make a pin an output,

while other peripherals override the TRIS bit to make a

pin an input. The user should refer to the corresponding

peripheral section for the correct TRIS bit settings.

The contents of the TRISC register are affected by

peripheral overrides. Reading TRISC always returns

the current contents, even though a peripheral device

may be overriding one or more of the pins.

External interrupts, IN0, INT1 and INT2, are placed on

RC3, RC4 and RC5 pins, respectively.

SSP alternate interface pins, SDI/SDA, SCK/SCL and

SDO are placed on RC4, RC5 and RC7 pins,

respectively.

These pins are multiplexed on PORTC and PORTD by

using the SSPMX bit in the CONFIG3L register.

EUSART pins RX/DT and TX/CK are placed on RC7

and RC6 pins, respectively.

The alternate Timer5 external clock input, T5CKI, and

the alternate TMR0 external clock input, T0CKI, are

placed on RC3 and are multiplexed with the PORTD

(RD0) pin using the EXCLKMX Configuration bit in

CONFIG3H. Fault inputs to the 14-bit PWM module,

FLTA and FLTB, are located on RC1 and RC2. FLTA

input on RC1 is multiplexed with RD4 using the

FLTAMX bit.

The contents of the TRISC register are affected by

peripheral overrides. Reading TRISC always returns

the current contents, even though a peripheral device

may be overriding one or more of the pins.

EXAMP LE 11-3: I NITI ALI ZING P ORTC

Note: On a Power-on Reset, these pins are

configured as digital inputs.

CLRF PORTC ; Initialize PORTC by

; clearing output

; data latches

CLRF LATC ; Alternate method

; to clear output

; data latches

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISC ; Set RC<3:0> as inputs

; RC<5:4> as outputs

; RC<7:6> as inputs

PIC18F2331/2431/4331/4431

DS39616D-page 120  2010 Microchip Technology Inc.

TABLE 11-5: PORTC I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RC0/T1OSO/

T1CKI

RC0 0O DIG LATC<0> data output.

1I ST PORTC<0> data input.

T1OSO xO ANA Timer1 oscillator output; enabled when Timer1 oscillator is enabled.

Disables digital I/O.

T1CKI 1I ST Timer1/Timer3 counter input.

RC1/T1OSI/

CCP2/FLTA

RC1 0O DIG LATC<1> data output.

1I ST PORTC<1> data input.

T1OSI xI ANA Timer1 oscillator input; enabled when Timer1 oscillator is enabled.

Disables digital I/O.

CCP2 0O DIG CCP2 compare and PWM output; takes priority over port data.

1I ST CCP2 capture input.

FLTA 1I ST Fault Interrupt Input Pin A.

RC2/CCP1/FLTB RC2 0O DIG LATC<2> data output.

1I ST PORTC<2> data input.

CCP1 0O DIG CCP1 compare or PWM output; takes priority over port data.

1I ST CCP1 capture input.

FLTB 1I ST Fault Interrupt Input Pin B.

RC3/T0CKI/

T5CKI/INT0

RC3 0O DIG LATC<3> data output.

1I ST PORTC<3> data input.

T0CKI(1) 1I ST Timer0 alternate clock input.

T5CKI(1) 1I ST Timer5 alternate clock input.

INT0 1I ST External Interrupt 0.

RC4/INT1/SDI/

SDA

RC4 0O DIG LATC<4> data output.

1I ST PORTC<4> data input.

INT1 1I ST External Interrupt 1.

SDI(1) 1I ST SPI data input (SSP module).

SDA(1) 0ODIGI

2C™ data output (SSP module); takes priority over port data.

1II

2CI

2C data input (SSP module).

RC5/INT2/SCK/

SCL

RC5 0O DIG LATC<5> data output.

1I ST PORTC<5> data input.

INT2 1I ST External Interrupt 2.

SCK(1) 0O DIG SPI clock output (SSP module); takes priority over port data.

1I ST SPI clock input (SSP module).

SCL(1) 0ODIGI

2C clock output (SSP module); takes priority over port data.

1II

2CI

2C clock input (SSP module); input type depends on module setting.

RC6/TX/CK/SS RC6 0O DIG LATC<6> data output.

1I ST PORTC<6> data input.

TX 0O DIG Asynchronous serial transmit data output (EUSART module);

takes priority over port data. User must configure as an output.

CK 0O DIG Synchronous serial clock output (EUSART module); takes priority

over port data.

1I ST Synchronous serial clock input (EUSART module).

SS 1I ST SPI slave select input.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: RD0 is the alternate pin for T0CKI/T5CKI; RD2 is the alternate pin for SDI/SDA; RD3 is the alternate pin for SCK/SCL;

RD1 is the alternate pin for SDO.

 2010 Microchip Technology Inc. DS39616D-page 121

PIC18F2331/2431/4331/4431

TABLE 11-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC

RC7/RX/DT/SDO RC7 0O DIG LATC<7> data output.

1I ST PORTC<7> data input.

RX 1I ST Asynchronous serial receive data input (EUSART module).

DT 0O DIG Synchronous serial data output (EUSART module); takes priority over

port data.

1I ST Synchronous serial data input (EUSART module). User must

configure as an input.

SDO(1) 0O DIG SPI data out; takes priority over port data.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 57

LATC LATC Data Output Register 57

TRISC PORTC Data Direction Register 57

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP —RBIP 54

INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 54

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTC.

TABLE 11-5: PORTC I/O SUMMARY (CONTINUED)

Pin Function TRIS

Setting I/O I/O

Type Description

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: RD0 is the alternate pin for T0CKI/T5CKI; RD2 is the alternate pin for SDI/SDA; RD3 is the alternate pin for SCK/SCL;

RD1 is the alternate pin for SDO.

PIC18F2331/2431/4331/4431

DS39616D-page 122  2010 Microchip Technology Inc.

11.4 PORTD, TRISD and LATD

Registers

PORTD is an 8-bit wide, bidirectional port. The

corresponding Data Direction register is TRISD.

Setting a TRISD bit (= 1) will make the corresponding

PORTD pin an input (i.e., put the corresponding output

driver in a high-impedance mode). Clearing a TRISD

bit (= 0) will make the corresponding PORTD pin an

output (i.e., put the contents of the output latch on the

selected pin).

The Data Latch register (LATD) is also memory

mapped. Read-modify-write operations on the LATD

PORTD.

All pins on PORTD are implemented with Schmitt

Trigger input buffers. Each pin is individually

configurable as an input or output.

PORTD includes PWM<7:6> complementary fourth

channel PWM outputs. PWM4 is the complementary

output of PWM5 (the third channel), which is multi-

plexed with the RB5 pin. This output can be used as the

alternate output using the PWM4MX Configuration bit

in CONFIG3H when the Single-Supply Programming

pin (PGM) is used on RB5.

RD1, RD2 and RD3 can be used as the alternate out-

put for SDO, SDI/SDA and SCK/SCL using the SSPMX

Configuration bit in CONFIG3H.

RD4 an be used as the alternate output for FLTA using

the FLTAMX Configuration bit in CONFIG3H.

EXAMP LE 11-4: I NITI ALI ZING P ORTD

Note: PORTD is only available on PIC18F4331/

4431 devices.

Note: On a Power-on Reset, these pins are

configured as digital inputs.

CLRF PORTD ; Initialize PORTD by

; clearing output

; data latches

CLRF LATD ; Alternate method

; to clear output

; data latches

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISD ; Set RD<3:0> as inputs

; RD<5:4> as outputs

; RD<7:6> as inputs

 2010 Microchip Technology Inc. DS39616D-page 123

PIC18F2331/2431/4331/4431

TABLE 11-7: PORTD I/O SUMMARY

TABLE 11-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD

Pin Function TRIS

Setting I/O I/O

Type Description

RD0/T0CKI/

T5CKI

RD0 0O DIG LATD<0> data output.

1I ST PORTD<0> data input.

T0CKI(1) 1I ST Timer0 alternate clock input.

T5CKI(1) 1I ST Timer5 alternate clock input.

RD1/SDO RD1 0O DIG LATD<1> data output.

1I ST PORTD<1> data input.

SDO(1) 0O DIG SPI data out; takes priority over port data.

RD2/SDI/SDA RD2 0O DIG LATD<2> data output.

1I ST PORTD<2> data input.

SDI(1) 1I ST SPI data input (SSP module).

SDA(1) 0ODIGI

2C™ data output (SSP module); takes priority over port data.

1II

2CI

2C data input (SSP module).

RD3/SCK/SCL RD3 0O DIG LATD<3> data output.

1I ST PORTD<3> data input.

SCK(1) 0O DIG SPI clock output (SSP module); takes priority over port data.

1I ST SPI clock input (SSP module).

SCL(1) 0ODIGI

2C clock output (SSP module); takes priority over port data.

1II

2CI

2C clock input (SSP module); input type depends on module setting.

RD4/FLTA RD4 0O DIG LATD<4> data output.

1I ST PORTD<4> data input.

FLTA(2) 1I ST Fault Interrupt Input Pin A.

RD5/PWM4 RD5 0O DIG LATD<5> data output.

1I ST PORTD<5> data input.

PWM4(3) 0O DIG PWM Output 4; takes priority over port data.

RD6/PWM6 RD6 0O DIG LATD<6> data output.

1I ST PORTD<6> data input.

PWM6 0O DIG PWM Output 6; takes priority over port data.

RD7/PWM7 RD7 0O DIG LATD<7> data output.

1I ST PORTD<7> data input.

PWM7 0O DIG PWM Output 7; takes priority over port data.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: RC3 is the alternate pin for T0CKI/T5CKI; RC4 is the alternate pin for SDI/SDA; RC5 is the alternate pin for SCK/SCL;

RC7 is the alternate pin for SDO.

2: RC1 is the alternate pin for FLTA.

3: RB5 is the alternate pin for PWM4.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page :

PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 57

LATD LATD Data Output Register 57

TRISD PORTD Data Direction Register 57

PIC18F2331/2431/4331/4431

DS39616D-page 124  2010 Microchip Technology Inc.

11.5 PORTE, TRISE and LATE

Registers

PORTE is a 4-bit wide, bidirectional port. Three pins

(RE0/AN6, RE1/AN7 and RE2/AN8) are individually

configurable as inputs or outputs. These pins have

Schmitt Trigger input buffers. When selected as an

analog input, these pins will read as ‘0’s.

The corresponding Data Direction register is TRISE.

Setting a TRISE bit (= 1) will make the corresponding

PORTE pin an input (i.e., put the corresponding output

driver in a high-impedance mode). Clearing a TRISE bit

(= 0) will make the corresponding PORTE pin an output

(i.e., put the contents of the output latch on the selected

pin).

TRISE controls the direction of the RE pins, even when

they are being used as analog inputs. The user must

make sure to keep the pins configured as inputs when

using them as analog inputs.

The Data Latch register (LATE) is also memory

mapped. Read-modify-write operations on the LATE

PORTE.

The fourth pin of PORTE (MCLR/VPP/RE3) is an input

only pin available for PIC18F4331/4431 devices. Its

operation is controlled by the MCLRE Configuration bit

in Configuration Register 3H (CONFIG3H<7>). When

selected as a port pin (MCLRE = 0), it functions as a

digital input-only pin. As such, it does not have TRIS or

LAT bits associated with its operation. Otherwise, it

functions as the device’s master clear input. In either

configuration, RE3 also functions as the programming

voltage input during programming.

EXAMPLE 11-5: I NITIALIZIN G PORTE

11.5.1 PORTE IN 28-PIN DEVICES

For PIC18F2331/2431 devices, PORTE is not available.

It is only available for PIC18F4331/4431 devices.

Note: PORTE is only available on PIC18F4331/

4431 devices.

Note: On a Power-on Reset, RE<2:0> are

configured as analog inputs.

Note: On a Power-on Reset, RE3 is enabled as a

digital input only if Master Clear functionality

is disabled.

CLRF PORTE ; Initialize PORTE by

; clearing output

; data latches

CLRF LATE ; Alternate method

; to clear output

; data latches

MOVLW 0x3F ; Configure A/D

MOVWF ANSEL0 ; for digital inputs

BCF ANSEL1, 0 ;

MOVLW 0x03 ; Value used to

; initialize data

; direction

MOVWF TRISE ; Set RE<0> as input

; RE<1> as output

; RE<2> as input

U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-1 R/W-1

— — — — — TRISE2 TRISE1 TRISE0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-3 Unimplemented: Read as ‘0’

bit 2 TRISE2: RE2 Direction Control bit

1 = Input

0 = Output

bit 1 TRISE1: RE1 Direction Control bit

1 = Input

0 = Output

bit 0 TRISE0: RE0 Direction Control bit

1 = Input

0 = Output

 2010 Microchip Technology Inc. DS39616D-page 125

PIC18F2331/2431/4331/4431

TABLE 11-9: PORTE I/O SUMMARY

TABLE 1 1-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE

Pin Function TRIS

Setting I/O I/O

Type Description

RE0/AN6 RE0 0O DIG LATE<0> data output; not affected by analog input.

1I ST PORTE<0> data input; disabled when analog input is enabled.

AN6 1I ANA A/D Input Channel 6. Default input configuration on POR.

RE1/AN7 RE1 0O DIG LATE<1> data output; not affected by analog input.

1I ST PORTE<1> data input; disabled when analog input is enabled.

AN7 1I ANA A/D Input Channel 7. Default input configuration on POR.

RE2/AN8 RE2 0O DIG LATE<2> data output; not affected by analog input.

1I ST PORTE<2> data input; disabled when analog input is enabled.

AN8 1I ANA A/D Input Channel 8. Default input configuration on POR.

MCLR/VPP/RE3(1) MCLR — I ST External Master Clear input; enabled when MCLRE Configuration bit

is set.

VPP — I ANA High-Voltage Detection; used for ICSP™ mode entry detection. Always

available, regardless of pin mode.

RE3 —(2) I ST PORTE<3> data input; enabled when MCLRE Configuration bit is

clear.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: All PORTE pins are only implemented on 40/44-pin devices.

2: RE3 does not have a corresponding TRIS bit to control data direction.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Re se t Values

on Page:

PORTE — — — —RE3

(1) RE2 RE1 RE0 57

LATE — — — — — LATE Data Output Register 57

TRISE — — — — — PORTE Data Direction Register 57

ANSEL0 ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0 56

ANSEL1 — — — — — — —ANS8

(2) 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTE.

Note 1: Implemented only when Master Clear functionality is disabled (CONFIG3H<7> = 0). It is available for

PIC18F4331/4431 devices only.

2: ANS5 through ANS8 are available only on PIC18F4331/4431 devices.

PIC18F2331/2431/4331/4431

DS39616D-page 126  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 127

PIC18F2331/2431/4331/4431

12.0 TIMER0 MODULE

The Timer0 module has the following features:

• Software selectable as an 8-bit or

16-bit timer/counter

• Readable and writable

• Dedicated 8-bit software programmable prescaler

• Clock source selectable to be external or internal

• Interrupt-on-overflow from FFh to 00h in 8-bit

mode and FFFFh to 0000h in 16-bit mode

• Edge select for external clock

Figure 12-1 shows a simplified block diagram of the

Timer0 module in 8-bit mode and Figure 12-2 shows a

simplified block diagram of the Timer0 module in 16-bit

mode.

The T0CON register (Register 12-1) is a readable and

writable register that controls all the aspects of Timer0,

including the prescale selection.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

TMR0ON T016BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 TMR0ON: Timer0 On/Off Control bit

1 = Enables Timer0

0 = Stops Timer0

bit 6 T016BIT: Timer0 16-Bit Control bit

1 = Timer0 is configured as an 8-bit timer/counter

0 = Timer0 is configured as a 16-bit timer/counter

bit 5 T0CS: Timer0 Clock Source Select bit

1 = Transition on T0CKI pin input edge

0 = Internal clock (FOSC/4)

bit 4 T0SE: Timer0 Source Edge Select bit

1 = Increment on high-to-low transition on T0CKI pin

0 = Increment on low-to-high transition on T0CKI pin

bit 3 PSA: Timer0 Prescaler Assignment bit

1 = TImer0 prescaler is not assigned. Timer0 clock input bypasses prescaler.

0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.

bit 2-0 T0PS<2:0>: Timer0 Prescaler Select bits

111 = 1:256 Prescale value

110 = 1:128 Prescale value

101 = 1:64 Prescale value

100 = 1:32 Prescale value

011 = 1:16 Prescale value

010 = 1:8 Prescale value

001 = 1:4 Prescale value

000 = 1:2 Prescale value

PIC18F2331/2431/4331/4431

DS39616D-page 128  2010 Microchip Technology Inc.

FIGURE 12-1: TIMER0 BLOCK DIAGRAM (8-BIT MODE)

FIGURE 12-2: TIMER0 BLOCK DIAGRA M (16-BIT MODE)

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.

T0CKI pin

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks

TMR0L

(2 TCY Delay)

Internal Data Bus

PSA

T0PS<2:0>

Set

TMR0IF

on Overflow

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.

T0CKI pin

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks TMR0L

(2 TCY Delay)

Internal Data Bus

PSA

T0PS<2:0>

Set

TMR0IF

on Overflow

TMR0

TMR0H

High Byte

Read TMR0L

Write TMR0L

 2010 Microchip Technology Inc. DS39616D-page 129

PIC18F2331/2431/4331/4431

12.1 Timer0 Operation

Timer0 can operate as a timer or as a counter.

Timer mode is selected by clearing the T0CS bit. In

Timer mode, the Timer0 module will increment every

instruction cycle (without prescaler). If the TMR0 regis-

ter is written, the increment is inhibited for the following

two instruction cycles. The user can work around this

by writing an adjusted value to the TMR0 register.

Counter mode is selected by setting the T0CS bit. In

Counter mode, Timer0 will increment, either on every

rising or falling edge of pin, RC3/T0CKI/T5CKI/INT0.

The incrementing edge is determined by the Timer0

Source Edge Select bit (T0SE). Clearing the T0SE bit

selects the rising edge.

When an external clock input is used for Timer0, it must

meet certain requirements. The requirements ensure

the external clock can be synchronized with the internal

phase clock (TOSC). Also, there is a delay in the actual

incrementing of Timer0 after synchronization.

12.2 Prescaler

An 8-bit counter is available as a prescaler for the Timer0

module. The prescaler is not readable or writable.

The PSA and T0PS<2:0> bits determine the prescaler

assignment and prescale ratio.

Clearing bit, PSA, will assign the prescaler to the

Timer0 module. When the prescaler is assigned to the

Timer0 module, prescale values of 1:2, 1:4, ..., 1:256

are selectable.

When assigned to the Timer0 module, all instructions

writing to the TMR0 register (e.g., CLRF TMR0, MOVWF

TMR0, BSF TMR0, x..., etc.) will clear the prescaler

count.

12.2.1 SWITCHING PRESCALER

ASSIGNMENT

The prescaler assignment is fully under software con-

trol (i.e., it can be changed “on-the-fly” during program

execution).

12.3 Timer0 Interrupt

The TMR0 interrupt is generated when the TMR0

FFFFh to 0000h in 16-bit mode. This overflow sets the

TMR0IF bit. The interrupt can be masked by clearing

the TMR0IE bit. The TMR0IF bit must be cleared in

software by the Timer0 module Interrupt Service

Routine before re-enabling this interrupt. The TMR0

interrupt cannot awaken the processor from Sleep

mode, since the timer requires clock cycles, even when

T0CS is set.

12.4 16-Bit Mode Timer Reads and

Writes

TMR0H is not the high byte of the timer/counter in

16-bit mode, but is actually a buffered version of the

high byte of Timer0 (refer to Figure 12-2). The high byte

of the Timer0 counter/timer is not directly readable nor

writable. TMR0H is updated with the contents of the

high byte of Timer0 during a read of TMR0L. This pro-

vides the ability to read all 16 bits of Timer0 without

having to verify that the read of the high and low byte

were valid due to a rollover between successive reads

of the high and low byte.

A write to the high byte of Timer0 must also take place

through the TMR0H Buffer register. Timer0 high byte is

updated with the contents of TMR0H when a write

occurs to TMR0L. This allows all 16 bits of Timer0 to be

updated at once.

TABLE 12-1: REGISTERS ASSOCIATED WITH TIMER0

Note: Writing to TMR0 when the prescaler is

assigned to Timer0 will clear the prescaler

count, but will not change the prescaler

assignment.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

TMR0L Timer0 Register Low Byte 55

TMR0H Timer0 Register High Byte 55

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

T0CON TMR0ON T016BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 55

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 57

Legend: Shaded cells are not used by Timer0.

Note 1: RA6 and RA7 are enabled as I/O pins depending on the oscillator mode selected in Configuration Word 1H.

PIC18F2331/2431/4331/4431

DS39616D-page 130  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 131

PIC18F2331/2431/4331/4431

13.0 TIMER1 MODULE

The Timer1 timer/counter module has the following

features:

• 16-bit timer/counter

(two 8-bit registers; TMR1H and TMR1L)

• Readable and writable (both registers)

• Internal or external clock select

• Interrupt-on-overflow from FFFFh to 0000h

• Reset from CCP module Special Event Trigger

• Status of system clock operation

Figure 13-1 is a simplified block diagram of the Timer1

module.

module and contains the Timer1 Oscillator Enable bit

(T1OSCEN). Timer1 can be enabled or disabled by

setting or clearing control bit, TMR1ON (T1CON<0>).

The Timer1 oscillator can be used as a secondary clock

source in power-managed modes. When the T1RUN

bit is set, the Timer1 oscillator provides the system

clock. If the Fail-Safe Clock Monitor is enabled and the

Timer1 oscillator fails while providing the system clock,

polling the T1RUN bit will indicate whether the clock is

being provided by the Timer1 oscillator or another

source.

Timer1 can also be used to provide Real-Time Clock

(RTC) functionality to applications with only a minimal

addition of external components and code overhead.

R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

RD16 T1RUN T1CKPS1 T1CKPS0

T1OSCEN

T1SYNC TMR1CS TMR1ON

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 RD16: 16-Bit Read/Write Mode Enable bit

1 = Enables register read/write of TImer1 in one 16-bit operation

0 = Enables register read/write of Timer1 in two 8-bit operations

bit 6 T1RUN: Timer1 System Clock Status bit

1 = Device clock is derived from Timer1 oscillator

0 = Device clock is derived from another source

bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits

11 = 1:8 Prescale value

10 = 1:4 Prescale value

01 = 1:2 Prescale value

00 = 1:1 Prescale value

bit 3 T1OSCEN: Timer1 Oscillator Enable bit

1 = Timer1 oscillator is enabled

0 = Timer1 oscillator is shut off

The oscillator inverter and feedback resistor are turned off to eliminate power drain.

bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit

When TMR1CS = 1 (External Clock):

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR1CS = 0 (Internal Clock):

This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.

bit 1 TMR1CS: Timer1 Clock Source Select bit

1 = External clock from pin RC0/T1OSO/T1CKI (on the rising edge)

0 = Internal clock (FOSC/4)

bit 0 TMR1ON: Timer1 On bit

1 = Enables Timer1

0 =Stops Timer1

PIC18F2331/2431/4331/4431

DS39616D-page 132  2010 Microchip Technology Inc.

13.1 Timer1 Operation

Timer1 can operate in one of these modes:

•As a timer

• As a synchronous counter

• As an asynchronous counter

The operating mode is determined by the Timer1 Clock

Select bit, TMR1CS (T1CON<1>).

When TMR1CS = 0, Timer1 increments every instruc-

tion cycle. When TMR1CS = 1, Timer1 increments on

every rising edge of the external clock input or the

Timer1 oscillator, if enabled.

When the Timer1 oscillator is enabled (T1OSCEN is

set), the RC1/T1OSI/CCP2/FLTA and RC0/T1OSO/

T1CKI pins become inputs. That is, the TRISC<1:0>

value is ignored and the pins are read as ‘0’.

Timer1 also has an internal “Reset input”. This Reset

can be generated by the CCP module (see

Section 16.4.4 “Special Event Trigger”).

FIGURE 13-1: TIMER1 BLOCK DIAGRAM

FIGURE 13-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)

T1SYNC

TMR1CS

T1CKPS<1:0>

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

On/Off

Prescaler

1, 2, 4, 8

Synchronize

Detect

T1OSO/T1CKI

T1OSI

TMR1ON

TMR1L Set

TMR1IF

on Overflow

TMR1

High Byte

Clear TMR1

(CCP Special Event Trigger)

Timer1 Oscillator

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

On/Off

Timer1

Timer1 Clock Input

T1SYNC

TMR1CS

T1CKPS<1:0>

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

Prescaler

1, 2, 4, 8

Synchronize

Detect

T1OSO/T1CKI

T1OSI

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

TMR1L

Internal Data Bus

Set

TMR1IF

on Overflow

TMR1

TMR1H

High Byte

Read TMR1L

Write TMR1L

TMR1ON

Clear TMR1

(CCP Special Event Trigger)

Timer1 Oscillator

On/Off

Timer1

Timer1 Clock Input

 2010 Microchip Technology Inc. DS39616D-page 133

PIC18F2331/2431/4331/4431

13.2 Timer1 Oscillator

A crystal oscillator circuit is built in-between pins, T1OSI

(input) and T1OSO (amplifier output). It is enabled by

setting control bit, T1OSCEN (T1CON<3>). The oscilla-

tor is a low-power oscillator rated for 32 kHz crystals. It

will continue to run during all power-managed modes.

The circuit for a typical LP oscillator is shown in

Figure 13-3. Table 13-1 shows the capacitor selection

for the Timer1 oscillator.

The user must provide a software time delay to ensure

proper start-up of the Timer1 oscillator.

FIGURE 13-3: EXTERNAL COMPONENTS

FOR THE TIMER1 LP

OSCILLATOR

TABLE 13-1: CAPACITOR SELECTION FOR

THE TIMER OSCILLATOR

13.3 Timer1 Oscillator Layout

Considerations

The Timer1 oscillator for PIC18F2331/2431/4331/4431

devices incorporates an additional low-power feature.

When this option is selected, it allows the oscillator to

automatically reduce its power consumption when the

microcontroller is in Sleep mode. During normal device

operation, the oscillator draws full current. As high

noise environments may cause excessive oscillator

instability in Sleep mode, this option is best suited for

low noise applications, where power conservation is an

important design consideration.

The low-power option is enabled by clearing the

T1OSCMX bit (CONFIG3L<5>). By default, the option

is disabled, which results in a more or less constant

current draw for the Timer1 oscillator.

Due to the low-power nature of the oscillator, it may

also be sensitive to rapidly changing signals in close

proximity.

The oscillator circuit, shown in Figure 13-3, should be

located as close as possible to the microcontroller.

There should be no circuits passing within the oscillator

circuit boundaries other than VSS or VDD. Refer to

Section 2.0 “Guidelines for Getting Started with

PIC18F Microcontrollers” for additional information

Osc Type Freq C1 C2

LP 32 kHz 27 pF(1) 27 pF(1)

Note 1: Microchip suggests this value as a starting

point in validating the oscillator circuit.

2: Higher capacitance increases the stabil-

ity of the oscillator, but also increases the

start-up time.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: Capacitor values are for design guidance

only.

Note: See the notes with Table 13-1 for additional

information about capacitor selection.

XTAL

PIC18FXXXX

T1OSI

T1OSO

32.768 kHz

27 pF

PIC18F2331/2431/4331/4431

DS39616D-page 134  2010 Microchip Technology Inc.

13.4 Timer1 Interrupt

The TMR1 register pair (TMR1H:TMR1L) increments

from 0000h to FFFFh and rolls over to 0000h. The

Timer1 interrupt, if enabled, is generated on overflow,

which is latched in Timer1 Interrupt Flag bit, TMR1IF

(PIR1<0>). This interrupt can be enabled/disabled by

setting/clearing Timer1 Interrupt Enable bit, TMR1IE

(PIE1<0>).

13.5 Resetting T imer1 Using a CCP

Trigger Output

If the CCP1 module is configured in Compare mode

to generate a “Special Event Trigger”

(CCP1M<3:0> = 1011), this signal will reset Timer1 and

start an A/D conversion if the A/D module is enabled

(see Section 16.4.4 “Special Event Trigger” for more

information).

Timer1 must be configured for either Timer or Synchro-

nized Counter mode to take advantage of this feature.

If Timer1 is running in Asynchronous Counter mode,

this Reset operation may not work.

In the event that a write to Timer1 coincides with a

Special Event Trigger from CCP1, the write will take

precedence.

In this mode of operation, the CCPR1H:CCPR1L regis-

ter pair effectively becomes the Period register for

Timer1.

13.6 Timer1 16-Bit Read/Write Mode

Timer1 can be configured for 16-bit reads and writes

(see Figure 13-2). When the RD16 control bit

(T1CON<7>) is set, the address for TMR1H is mapped

to a buffer register for the high byte of Timer1. A read

from TMR1L will load the contents of the high byte of

Timer1 into the Timer1 High Byte Buffer register. This

provides the user with the ability to accurately read all

16 bits of Timer1 without having to determine whether

a read of the high byte, followed by a read of the low

byte, is valid due to a rollover between reads.

A write to the high byte of Timer1 must also take place

through the TMR1H Buffer register. Timer1 high byte is

updated with the contents of TMR1H when a write

occurs to TMR1L. This allows a user to write all 16 bits

to both the high and low bytes of Timer1 at once.

The high byte of Timer1 is not directly readable or writ-

able in this mode. All reads and writes must take place

through the Timer1 High Byte Buffer register. Writes to

TMR1H do not clear the Timer1 prescaler. The

prescaler is only cleared on writes to TMR1L.

13.7 Using Timer1 as a Real-Time

Clock (RTC)

Adding an external LP oscillator to Timer1 (such as the

one described in Section 13.2 “Timer1 Oscillator”)

gives users the option to include RTC functionality to

their applications. This is accomplished with an

inexpensive watch crystal to provide an accurate time

base, and several lines of application code to calculate

the time. When operating in Sleep mode and using a

battery or supercapacitor as a power source, it can

completely eliminate the need for a separate RTC

device and battery backup.

The application code routine, RTCisr, shown in

Example 13-1, demonstrates a simple method to

increment a counter at one-second intervals using an

Interrupt Service Routine. Incrementing the TMR1

the routine, which increments the seconds counter by

one. Additional counters for minutes and hours are

incremented as the previous counter overflow.

Since the register pair is 16 bits wide, counting up to

overflow the register directly from a 32.768 kHz clock

would take 2 seconds. To force the overflow at the

required one-second intervals, it is necessary to pre-

load it. The simplest method is to set the MSb of

TMR1H with a BSF instruction. Note that the TMR1L

introduce cumulative error over many cycles.

For this method to be accurate, Timer1 must operate in

Asynchronous mode and the Timer1 overflow interrupt

must be enabled (PIE1<0> = 1) as shown in the

routine, RTCinit. The Timer1 oscillator must also be

enabled and running at all times.

Note: The Special Event Triggers from the

CCP1 module will not set interrupt flag bit,

TMR1IF (PIR1<0>).

 2010 Microchip Technology Inc. DS39616D-page 135

PIC18F2331/2431/4331/4431

EXAMPLE 13-1 : IMPLEMENTING A REAL-T IME CLOCK USI NG A T IMER1 INTERRUPT SER VICE

TABLE 13-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page :

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

TMR1L Timer1 Register Low Byte 55

TMR1H Timer1 Register High Byte 55

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 55

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.

RTCinit MOVLW 0x80 ; Preload TMR1 register pair

MOVWF TMR1H ; for 1 second overflow

CLRF TMR1L

MOVLW b'00001111' ; Configure for external clock,

MOVWF T1CON ; Asynchronous operation, external oscillator

CLRF secs ; Initialize timekeeping registers

CLRF mins ;

MOVLW .12

MOVWF hours

BSF PIE1, TMR1IE ; Enable Timer1 interrupt

RETURN

RTCisr BSF TMR1H, 7 ; Preload for 1 sec overflow

BCF PIR1, TMR1IF ; Clear interrupt flag

INCF secs, F ; Increment seconds

MOVLW .59 ; 60 seconds elapsed?

CPFSGT secs

RETURN ; No, done

CLRF secs ; Clear seconds

INCF mins, F ; Increment minutes

MOVLW .59 ; 60 minutes elapsed?

CPFSGT mins

RETURN ; No, done

CLRF mins ; clear minutes

INCF hours, F ; Increment hours

MOVLW .23 ; 24 hours elapsed?

CPFSGT hours

RETURN ; No, done

MOVLW .01 ; Reset hours to 1

MOVWF hours

RETURN ; Done

PIC18F2331/2431/4331/4431

DS39616D-page 136  2010 Microchip Technology Inc.

14.0 TIMER2 MODULE

The Timer2 module has the following features:

• 8-bit Timer register (TMR2)

• 8-bit Period register (PR2)

• Readable and writable (both registers)

• Software programmable prescaler (1:1, 1:4, 1:16)

• Software programmable postscaler (1:1 to 1:16)

• Interrupt on TMR2 match with PR2

• SSP module optional use of TMR2 output to

generate clock shift

Timer2 has a control register, shown in Register 14-1.

TMR2 can be shut off by clearing control bit, TMR2ON

(T2CON<2>), to minimize power consumption.

Figure 14-1 is a simplified block diagram of the Timer2

module. Register 14-1 shows the Timer2 Control

Timer2 are controlled by this register.

14.1 Timer2 Operation

Timer2 can be used as the PWM time base for the

PWM mode of the CCP module. The TMR2 register is

readable and writable, and is cleared on any device

Reset. The input clock (FOSC/4) has a prescale option

of 1:1, 1:4 or 1:16, selected by control bits,

T2CKPS<1:0> (T2CON<1:0>). The match output of

TMR2 goes through a 4-bit postscaler (which gives a

1:1 to 1:16 scaling inclusive) to generate a TMR2

interrupt, latched in flag bit, TMR2IF (PIR1<1>).

The TMR2 and PR2 registers are both directly readable

and writable. The TMR2 register is cleared on any

device Reset, while the PR2 register initializes at FFh.

The prescaler and postscaler counters are cleared

when any of the following occurs:

• A write to the TMR2 register

• A write to the T2CON register

• Any device Reset (Power-on Reset, MCLR Reset,

Watchdog Timer Reset or Brown-out Reset)

TMR2 is not cleared when T2CON is written.

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6-3 TOUTPS<3:0>: Timer2 Output Postscale Select bits

0000 = 1:1 Postscale

0001 = 1:2 Postscale

•

1111 = 1:16 Postscale

bit 2 TMR2ON: Timer2 On bit

1 = Timer2 is on

0 = Timer2 is off

bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits

00 = Prescaler is 1

01 = Prescaler is 4

1x = Prescaler is 16

 2010 Microchip Technology Inc. DS39616D-page 137

PIC18F2331/2431/4331/4431

14.2 Timer2 Interrupt

Timer2 can also generate an optional device interrupt.

The Timer2 output signal (TMR2 to PR2 match) pro-

vides the input for the 4-bit output counter/postscaler.

This counter generates the TMR2 match interrupt flag

which is latched in TMR2IF (PIR1<1>).

The interrupt is enabled by setting the TMR2 Match

Interrupt Enable bit, TMR2IE (PIE1<1>). A range of

16 postscale options (from 1:1 through 1:16 inclusive)

can be selected with the postscaler control bits,

T2OUTPS<3:0> (T2CON<6:3>).

14.3 Output of TMR2

The unscaled output of TMR2 is available primarily to

the CCP modules, where it is used as a time base for

operations in PWM mode. Timer2 can be optionally

used as the shift clock source for the SSP module

operating in SPI mode.

For additional information, see Section 19.0

“Synchronous Serial Port (SSP) Module”.

FIGU RE 14 -1: T IMER 2 BLOCK DIAG RAM

TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Va lu es

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

TMR2 Timer2 Register 55

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 55

PR2 Timer2 Period Register 55

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.

Comparator

TMR2 Output

TMR2

Postscaler

Prescaler PR2

FOSC/4

1:1 to 1:16

1:1, 1:4, 1:16

T2OUTPS<3:0>

T2CKPS<1:0>

Set TMR2IF

Internal Data Bus

Reset

TMR2/PR2

(to PWM or SSP)

Match

PIC18F2331/2431/4331/4431

DS39616D-page 138  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 139

PIC18F2331/2431/4331/4431

15.0 TIMER5 MODULE

The Timer5 module implements these features:

• 16-bit timer/counter operation

• Synchronous and Asynchronous Counter modes

• Continuous Count and Single-Shot Operating modes

• Four programmable prescaler values (1:1 to 1:8)

• Interrupt generated on period match

• Special Event Trigger Reset function

• Double-buffered registers

• Operation during Sleep

• CPU wake-up from Sleep

• Selectable hardware Reset input with a wake-up

feature

Timer5 is a general purpose timer/counter that incor-

porates additional features for use with the Motion

Feedback Module (see Section 17.0 “Motion Feed-

back Module”). It may also be used as a general

purpose timer or a Special Event Trigger delay timer.

When used as a general purpose timer, it can be

configured to generate a delayed Special Event Trigger

(e.g., an ADC Special Event Trigger) using a

preprogrammed period delay.

Timer5 is controlled through the Timer5 Control register

(T5CON), shown in Register 15-1. The timer can be

enabled or disabled by setting or clearing the control bit

TMR5ON (T5CON<0>).

A block diagram of Timer5 is shown in Figure 15-1.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

T5SEN RESEN(1) T5MOD T5PS1 T5PS0 T5SYNC(2) TMR5CS TMR5ON

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 T5SEN: Timer5 Sleep Enable bit

1 = Timer5 is enabled during Sleep

0 = Timer5 is disabled during Sleep

bit 6 RESEN: Special Event Trigger Reset Enable bit(1)

1 = Special Event Trigger Reset is disabled

0 = Special Event Trigger Reset is enabled

bit 5 T5MOD: Timer5 Mode bit

1 = Single-Shot mode is enabled

0 = Continuous Count mode is enabled

bit 4-3 T5PS<1:0>: Timer5 Input Clock Prescale Select bits

11 = 1:8

10 = 1:4

01 = 1:2

00 = 1:1

bit 2 T5SYNC: Timer5 External Clock Input Synchronization Select bit(2)

When TMR5CS = 1:

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR5CS = 0:

This bit is ignored. Timer5 uses the internal clock when TMR5CS = 0.

bit 1 TMR5CS: Timer5 Clock Source Select bit

1 = External clock from the T5CKI pin

0 = Internal clock (TCY)

bit 0 TMR5ON: Timer5 On bit

1 = Timer5 is enabled

0 = Timer5 is disabled

Note 1: These bits are not implemented on PIC18F2331/2431 devices and read as ‘0’.

2: For Timer5 to operate during Sleep mode, T5SYNC must be set.

PIC18F2331/2431/4331/4431

DS39616D-page 140  2010 Microchip Technology Inc.

FIGU RE 15 -1: TI MER 5 BLOCK DIAGRA M (16-B IT REA D/W R ITE MOD E SHOW N)

15.1 Timer5 Operation

Timer5 combines two 8-bit registers to function as a

16-bit timer. The TMR5L register is the actual low byte

of the timer; it can be read and written to directly. The

high byte is contained in an unmapped register; it is

read and written to through TMR5H, which serves as

a buffer. Each register increments from 00h to FFh.

A second register pair, PR5H and PR5L, serves as the

Period register; it sets the maximum count for the

TMR5 register pair. When TMR5 reaches the value of

PR5, the timer rolls over to 00h and sets the TMR5IF

interrupt flag. A simplified block diagram of the Timer5

module is shown in Figure 2-1.

Timer5 supports three configurations:

• 16-Bit Synchronous Timer

• 16-Bit Synchronous Counter

• 16-Bit Asynchronous Counter

In Synchronous Timer configuration, the timer is

clocked by the internal device clock. The optional

Timer5 prescaler divides the input by 2, 4, 8 or not at all

(1:1). The TMR5 register pair increments on Q1.

Clearing TMR5CS (= 0) selects the internal device

clock as the timer sampling clock.

T5SYNC

TMR5CS

T5PS<1:0>

Sleep Input

FOSC/4

Internal

Clock

T5CKI

TMR5L

Internal Data Bus

TMR5

TMR5H

High Byte

Write TMR5L

Read TMR5L

TMR5ON

On/Off

Timer5

PR5L

PR5H

Comparator

TMR5

PR5

Reset

Logic

Special

Event

Logic

Timer5 Reset

Set TMR5IF

Timer5 Reset

(external)

Special Event

Trigger Output

Special Event

Trigger Input

from IC1

Noise

Filter Prescaler

1, 2, 4, 8

Synchronize

Detect

Note: The Timer5 may be used as a general pur-

pose timer and as the time base resource to

the Motion Feedback Module (Input

Capture or Quadrature Encoder Interface).

 2010 Microchip Technology Inc. DS39616D-page 141

PIC18F2331/2431/4331/4431

In Synchronous Counter mode configuration, the timer

is clocked by the external clock (T5CKI) with the

optional prescaler. The external T5CKI is selected by

setting the TMR5CS bit (TMR5CS = 1); the internal

clock is selected by clearing TMR5CS. The external

clock is synchronized to the internal clock by clearing

the T5SYNC bit. The input on T5CKI is sampled on

every Q2 and Q4 of the internal clock. The low to rise

transition is decoded on three adjacent samples and

the Timer5 is incremented on the next Q1. The T5CKI

minimum pulse-width high and low time must be

greater than T

CY/2.

In Asynchronous Counter mode configuration, Timer5

is clocked by the external clock (T5CKI) with the

optional prescaler. In this mode, T5CKI is not synchro-

nized to the internal clock. By setting TMR5CS, the

external input clock (T5CKI) can be used as the coun-

ter sampling clock. When T5SYNC is set, the external

clock is not synchronized to the internal device clock.

The timer count is not reset automatically when the

module is disabled. The user may write the Counter

15.1.1 CONTINUOUS COUNT AND

SINGLE-SHOT OPERATION

Timer5 has two operating modes: Continuous Count

and Single-Shot.

Continuous Count mode is selected by clearing the

T5MOD control bit (= 0). In this mode, the Timer5 time

base will start incrementing according to the prescaler

settings until a TMR5/PR5 match occurs, or until TMR5

rolls over (FFFFh to 0000h). The TMR5IF interrupt flag

is set, the TMR5 register is reset on the following input

clock edge and the timer continues to count for as long

as the TMR5ON bit remains set.

Single-Shot mode is selected by setting T5MOD (= 1).

In this mode, the Timer5 time base begins to increment

according to the prescaler settings until a TMR5/PR5

match occurs. This causes the TMR5IF interrupt flag to

be set, the TMR5 register pair to be cleared on the

following input clock edge and the TMR5ON bit to be

cleared by the hardware to halt the timer.

The Timer5 time base can only start incrementing in

Single-Shot mode under two conditions:

1. Timer5 is enabled (TMR5ON is set), or

2. Timer5 is disabled and a Special Event Trigger

Reset is present on the Timer5 Reset input. (See

Section 15.7 “Timer5 Special Event Trigger

Reset Input” for additional information.)

15.2 16-Bit Read/Wri te and Wr ite Modes

As noted, the actual high byte of the Timer5 register

pair is mapped to TMR5H, which serves as a buffer.

Reading TMR5L will load the contents of the high byte

of the register pair into the TMR5H register. This allows

the user to accurately read all 16 bits of the register pair

without having to determine whether a read of the high

byte, followed by the low byte, is valid due to a rollover

between reads.

Since the actual high byte of the Timer5 register pair is

not directly readable or writable, it must be read and

written to through the Timer5 High Byte Buffer register

(TMR5H). The T5 high byte is updated with the con-

tents of TMR5H when a write occurs to TMR5L. This

allows a user to write all 16 bits to both the high and low

bytes of Timer5 at once. Writes to TMR5H do not clear

the Timer5 prescaler. The prescaler is only cleared on

writes to TMR5L.

15.2.1 16-BIT READ-MODIFY-WRITE

Read-modify-write instructions, like BSF and BCF, will

read the contents of a register, make the appropriate

changes and place the result back into the register. The

write portion of a read-modify-write instruction of

TMR5H will not update the contents of the high byte of

TMR5 until a write of TMR5L takes place. Only then will

the contents of TMR5H be placed into the high byte of

TMR5.

15.3 Timer5 Prescaler

The Timer5 clock input (either TCY or the external clock)

may be divided by using the Timer5 programmable

prescaler. The prescaler control bits, T5PS<1:0>

(T5CON<4:3>), select a prescale factor of 2, 4, 8 or no

prescale.

The Timer5 prescaler is cleared by any of the following:

• A write to the Timer5 register

• Disabling Timer5 (TMR5ON = 0)

• A device Reset such as Master Clear, POR or

BOR

Note: The Timer5 module does NOT prevent

writes to the PR5 registers (PR5H:PR5L)

while the timer is enabled. Writing to PR5

while the timer is enabled may result in

unexpected period match events.

Note: Writing to the T5CON register does not

clear the Timer5.

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15.4 Noise Filter

The Timer5 module includes an optional input noise

filter, designed to reduce spurious signals in noisy

operating environments. The filter ensures that the input

is not permitted to change until a stable value has been

registered for three consecutive sampling clock cycles.

The noise filter is part of the input filter network associ-

ated with the Motion Feedback Module (see

Section 17.0 “Motion Feedback Module”). All of the

filters are controlled using the Digital Filter Control

(DFLTCON) register (Register 17-3). The Timer5 filter

can be individually enabled or disabled by setting or

clearing the FLT4EN bit (DFLTCON<6>). It is disabled

on all Brown-out Resets.

For additional information, refer to Section 17.3

“Noise Filters” in the Motion Feedback Module.

15.5 Timer5 Interrupt

Timer5 has the ability to generate an interrupt on a

period match. When the PR5 register is loaded with a

new period value (00FFh), the Timer5 time base incre-

ments until its value is equal to the value of PR5. When

a match occurs, the Timer5 interrupt is generated on

the rising edge of Q4; TMR5IF is set on the next TCY.

The interrupt latency (i.e., the time elapsed from the

moment Timer5 rolls over until TMR5IF is set) will not

exceed 1 TCY. When the Timer5 clock input is prescaled

and a TMR5/PR5 match occurs, the interrupt will be

generated on the first Q4 rising edge after TMR5 resets.

15.6 Timer5 Special Event Trigger

Output

A Timer5 Special Event Trigger is generated on a

TMR5/PR5 match. The Special Event Trigger is

generated on the falling edge of Q3.

Timer5 must be configured for either Synchronous

mode (Counter or Timer) to take advantage of the

Special Event Trigger feature. If Timer5 is running in

Asynchronous Counter mode, the Special Event

Trigger may not work and should not be used.

15.7 Timer5 Special Event Trigger

Reset Input

In addition to the Special Event Trigger output, Timer5

has a Special Event Trigger Reset input that may be

used with Input Capture Channel 1 (IC1) of the Motion

Feedback Module. To use the Special Event Trigger

Reset, the Capture 1 Control register, CAP1CON, must

be configured for one of the Special Event Trigger

modes (CAP1M<3:0> = 1110 or 1111). The Special

Event Trigger Reset can be disabled by setting the

RESEN control bit (T5CON<6>).

The Special Event Trigger Reset resets the Timer5 time

base. This Reset occurs in either Continuous Count or

Single-Shot modes.

15.7.1 WAKE-UP ON IC1 EDGE

The Timer5 Special Event Trigger Reset input can act

as a Timer5 wake-up and a start-up pulse. Timer5 must

be in Single-Shot mode and disabled (TMR5ON = 0).

An active edge on the CAP1 input pin will set TMR5ON.

The timer is subsequently incremented on the next fol-

lowing clock according to the prescaler and the Timer5

clock settings. A subsequent hardware time-out (such

as TMR5/PR5 match) will clear the TMR5ON bit and

stop the timer.

15.7.2 DELAYED ACTION EVENT TRIGGER

An active edge on CAP1 can also be used to initiate

some later action delayed by the Timer5 time base. In

this case, Timer5 increments as before after being

triggered. When the hardware time-out occurs, the

Special Event Trigger output is generated and used to

trigger another action, such as an A/D conversion. This

allows a given hardware action to be referenced from a

capture edge on CAP1 and delayed by the timer.

The event timing for the delayed action event trigger is

discussed further in Section 17.1 “Input Capture”.

15.7.3 SPECIAL EVENT TRIGGER RESET

WHILE TIMER5 IS INCREMENTING

In the event that a bus write to Timer5 coincides with a

Special Event Trigger Reset, the bus write will always

take precedence over the Special Event Trigger Reset.

15.8 Operation in Sleep Mode

When Timer5 is configured for asynchronous operation,

it will continue to increment each timer clock (or prescale

multiple of clocks). Executing the SLEEP instruction will

either stop the timer or let the timer continue, depending

on the setting of the Timer5 Sleep Enable bit, T5SEN. If

T5SEN is set (= 1), the timer continues to run when the

SLEEP instruction is executed and the external clock is

selected (TMR5CS = 1). If T5SEN is cleared, the timer

stops when a SLEEP instruction is executed, regardless

of the state of the TMR5CS bit.

To summarize, Timer5 will continue to increment when

a SLEEP instruction is executed only if all of these bits

are set:

•TMR5ON

• T5SEN

•TMR5CS

•T5SYNC

15.8.1 INTERRUPT DETECT IN SLEEP MODE

When configured as described above, Timer5 will

continue to increment on each rising edge on T5CKI

while in Sleep mode. When a TMR5/PR5 match occurs,

an interrupt is generated which can wake the part.

 2010 Microchip Technology Inc. DS39616D-page 143

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TABLE 15-1: REGISTERS ASSOCIATED WITH TIMER5

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Va lues

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

IPR3 — — — PTIP IC3DRIP IC2QEIP IC1IP TMR5IP 56

PIE3 — — — PTIE IC3DRIE IC2QEIE IC1IE TMR5IE 56

PIR3 — — — PTIF IC3DRIF IC2QEIF IC1IF TMR5IF 56

TMR5H Timer5 Register High Byte 57

TMR5L TImer5 Register Low Byte 57

PR5H Timer5 Period Register High Byte 57

PR5L Timer5 Period Register Low Byte 57

T5CON T5SEN RESEN T5MOD T5PS1 T5PS0 T5SYNC TMR5CS TMR5ON 56

CAP1CON —CAP1REN —— CAP1M3 CAP1M2 CAP1M1 CAP1M0 59

DFLTCON —FLT4ENFLT3EN FLT2EN FLT1EN FLTCK2 FLTCK1 FLTCK0 59

Legend: — = unimplemented. Shaded cells are not used by the Timer5 module.

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NOTES:

 2010 Microchip Technology Inc. DS39616D-page 145

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16.0 CAPTURE/COMPARE/PWM

(CCP) MODULES

The CCP (Capture/Compare/PWM) module contains a

16-bit register that can operate as a 16-bit Capture reg-

ister, a 16-bit Compare register or a PWM Master/Slave

Duty Cycle register. Table 16-1 shows the timer

resources required for each of the CCP module modes.

The operation of CCP1 is identical to that of CCP2, with

the exception of the Special Event Trigger. Therefore,

operation of a CCP module is described with respect to

CCP1, except where noted.

16.1 CCP1 Module

Capture/Compare/PWM Register 1 (CCPR1) is

comprised of two 8-bit registers: CCPR1L (low byte)

and CCPR1H (high byte). The CCP1CON register

controls the operation of CCP1. All are readable and

writable.

TABLE 16-1: CCP MODE – TIMER

RESOURCES

16.2 CCP2 Module

Capture/Compare/PWM Register 2 (CCPR2) is com-

prised of two 8-bit registers: CCPR2L (low byte) and

CCPR2H (high byte). The CCP2CON register controls

the operation of CCP2. All are readable and writable.

CCP Mode Timer Resources

Capture

Compare

PWM

Timer1

Timer2

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’

bit 5-4 DCxB<1:0>: PWM Duty Cycle bit 1 and bit 0

Capture mode:

Unused.

Compare mode:

Unused.

PWM mode:

These bits are the two LSBs (bit 1 and bit 0) of the 10-bit PWM duty cycle. The upper eight bits

(DCxB<9:2>) of the duty cycle are found in CCPRxL.

bit 3-0 CCPxM<3:0>: CCPx Mode Select bits

0000 = Capture/Compare/PWM disabled (resets CCPx module)

0001 = Reserved

0010 = Compare mode; toggle output on match (CCPxIF bit is set)

0011 = Reserved

0100 = Capture mode; every falling edge

0101 = Capture mode; every rising edge

0110 = Capture mode; every 4th rising edge

0111 = Capture mode; every 16th rising edge

1000 = Compare mode; initialize CCPx pin low; on compare match, force CCPx pin high (CCPxIF bit is set)

1001 = Compare mode; initialize CCPx pin high; on compare match, force CCPx pin low (CCPxIF bit is set)

1010 = Compare mode; generate software interrupt on compare match (CCPxIF bit is set, CCPx pin is

unaffected)

1011 = Compare mode; Special Event Trigger (CCPxIF bit is set)

11xx =PWM mode

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DS39616D-page 146  2010 Microchip Technology Inc.

16.3 Capture Mode

In Capture mode, CCPR1H:CCPR1L captures the

16-bit value of the TMR1 register when an event

occurs on pin RC2/CCP1. An event is defined as

one of the following:

• every falling edge

• every rising edge

• every 4th rising edge

• every 16th rising edge

The event is selected by control bits, CCP1M<3:0>

(CCP1CON<3:0>). When a capture is made, the

interrupt request flag bit, CCP1IF (PIR1<2>), is set; it

must be cleared in software. If another capture occurs

before the value in register CCPR1 is read, the old

captured value is overwritten by the new captured value.

16.3.1 CCP PIN CONFIGURATION

In Capture mode, the RC2/CCP1 pin should be

configured as an input by setting the TRISC<2> bit.

16.3.2 TIMER1 MODE SELECTION

Timer1 must be running in Timer mode or Synchro-

nized Counter mode to be used with the capture

feature. In Asynchronous Counter mode, the capture

operation may not work.

16.3.3 SOFTWARE INTERRUPT

When the Capture mode is changed, a false capture

interrupt may be generated. The user should keep bit,

CCP1IE (PIE1<2>), clear to avoid false interrupts and

should clear the flag bit, CCP1IF, following any such

change in operating mode.

16.3.4 CCP PRESCALER

There are four prescaler settings specified by bits

CCP1M<3:0>. Whenever the CCP module is turned off,

or the CCP module is not in Capture mode, the

prescaler counter is cleared. This means that any

Reset will clear the prescaler counter.

Switching from one capture prescaler to another may

generate an interrupt. Also, the prescaler counter will

not be cleared, therefore, the first capture may be from

a non-zero prescaler. Example 16-1 shows the recom-

mended method for switching between capture

prescalers. This example also clears the prescaler

counter and will not generate the “false” interrupt.

EXAMPLE 16-1: CHANGING BETWEEN

CAPTURE PRESCALERS

FIGURE 16-1: CAPTURE MODE OPERATION BLOCK DIAGRAM

Note: If the RC2/CCP1 pin is configured as an

output, a write to the port can cause a

capture condition.

CLRF CCP1CON ; Turn CCP module off

MOVLW NEW_CAPT_PS ; Load WREG with the

; new prescaler mode

; value and CCP ON

MOVWF CCP1CON ; Load CCP1CON with

; this value

CCPR1H CCPR1L

TMR1H TMR1L

Set CCP1IF Flag bit

CCP1CON<3:0>

CCP1 Pin

Prescaler

 1, 4, 16

and

Edge Detect

TMR1

Enable

CCPR2H CCPR2L

TMR1H TMR1L

Set CCP2IF Flag bit

Qs CCP2CON<3:0>

CCP2 Pin

Prescaler

 1, 4, 16

TMR1

Enable

and

Edge Detect

 2010 Microchip Technology Inc. DS39616D-page 147

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16.4 Compare Mode

In Compare mode, the 16-bit CCPR1 (CCPR2) register

value is constantly compared against the TMR1

CCP1 (RC1/CCP2) pin:

• is driven high

• is driven low

• toggles output (high-to-low or low-to-high)

• remains unchanged (interrupt only)

The action on the pin is based on the value of control

bits, CCP1M<3:0> (CCP2M<3:0>). At the same time,

interrupt flag bit CCP1IF (CCP2IF) is set.

16.4.1 CCP PIN CONFIGURATION

The user must configure the CCP1 pin as an output by

clearing the appropriate TRISC bit.

16.4.2 TIMER1 MODE SELECTION

Timer1 must be running in Timer mode or Synchro-

nized Counter mode if the CCP module is using the

compare feature. In Asynchronous Counter mode, the

compare operation may not work.

16.4.3 SOFTWARE INTERRUPT MODE

When generate software interrupt is chosen, the CCP1

pin is not affected. Only a CCP interrupt is generated (if

enabled).

16.4.4 SPECIAL EVENT TRIGGER

In this mode, an internal hardware trigger is generated

which may be used to initiate an action.

The Special Event Trigger output of CCP1 resets the

TMR1 register pair. This allows the CCPR1 register to

effectively be a 16-bit programmable period register for

Timer1.

The Special Event Trigger output of CCP2 resets the

TMR1 register pair. Additionally, the CCP2 Special

Event Trigger will start an A/D conversion if the A/D

module is enabled.

FIGU RE 16-2: COMPARE MOD E OPE R ATI O N BL OCK D IA GRA M

Note: Clearing the CCPxCON register will force

the RC1 or RC2 compare output latch to

the default low level. This is not the

PORTC I/O data latch.

Note: The Special Event Trigger from the CCP2

module will not set the Timer1 interrupt

flag bit.

CCPR1H CCPR1L

TMR1H TMR1L

Comparator

Output

Logic

Special Event Trigger

Set Flag CCP1IF bit

Match

RC2/CCP1 Pin

TRISC<2>

CCP1CON<3:0>

Mode Select

Output Enable

Special Event Trigger will:

Reset Timer1, but not set Timer1 interrupt flag bit

and set bit, GO/DONE (ADCON0<1>), which starts an A/D conversion (CCP2 only)

CCPR2H CCPR2L

Comparator

Output

Logic

Special Event Trigger

Set Flag CCP2IF bit

Match

RC1/CCP2 Pin

TRISC<1>

CCP2CON<3:0>

Mode Select

Output Enable

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DS39616D-page 148  2010 Microchip Technology Inc.

TABLE 16-2: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

TRISC PORTC Data Direction Register 57

TMR1L Timer1 Register Low Byte 55

TMR1H Timer1 Register High Byte 55

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 55

CCPR1L Capture/Compare/PWM Register 1 Low Byte 56

CCPR1H Capture/Compare/PWM Register 1 High Byte 56

CCP1CON —— DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 56

CCPR2L Capture/Compare/PWM Register 2 Low Byte 56

CCPR2H Capture/Compare/PWM Register 2 High Byte 56

CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 56

PIR2 OSCFIF — — EEIF —LVDIF — CCP2IF 57

PIE2 OSCFIE — — EEIE —LVDIE — CCP2IE 57

IPR2 OSCFIP — — EEIP —LVDIP — CCP2IP 57

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture, Compare and Timer1.

 2010 Microchip Technology Inc. DS39616D-page 149

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16.5 PWM Mode

In Pulse-Width Modulation (PWM) mode, the CCP1 pin

produces up to a 10-bit resolution PWM output. Since

the CCP1 pin is multiplexed with the PORTC data latch,

the TRISC<2> bit must be cleared to make the CCP1

pin an output.

Figure 16-3 shows a simplified block diagram of the

CCP1 module in PWM mode.

For a step-by-step procedure on how to set up the

CCP1 module for PWM operation, see Section 16.5.3

“Setup for PWM Operation”.

FIGU RE 16-3: SIM PLIFI ED PW M BLOC K

DIAGRAM

A PWM output (Figure 16-4) has a time base

(period) and a time that the output is high (duty

cycle). The frequency of the PWM is the inverse of

the period (1/period).

FIGURE 16 - 4: PWM OUTPUT

16.5.1 PWM PERIOD

The PWM period is specified by writing to the PR2

following equation:

EQUATION 16-1:

PWM frequency is defined as 1/[PWM period]. When

TMR2 is equal to PR2, the following three events occur

on the next increment cycle:

•TMR2 is cleared

• The CCP1 pin is set (if PWM duty cycle = 0%, the

CCP1 pin will not be set)

• The PWM duty cycle is copied from CCPR1L into

CCPR1H

16.5.2 PWM DUTY CYCLE

The PWM duty cycle is specified by writing to the

CCPR1L register and to the CCP1CON<5:4> bits. Up

to 10-bit resolution is available. The CCPR1L contains

the eight MSbs and the CCP1CON<5:4> contains the

two LSbs. This 10-bit value is represented by

CCPR1L:CCP1CON<5:4>. The PWM duty cycle is

calculated by the following equation:

EQUATION 16-2:

CCPR1L and CCP1CON<5:4> can be written to at any

time, but the duty cycle value is not copied into

CCPR1H until a match between PR2 and TMR2 occurs

(i.e., the period is complete). In PWM mode, CCPR1H

is a read-only register.

Note: Clearing the CCP1CON register will force

the CCP1 PWM output latch to the default

low level. This is not the PORTC I/O data

latch.

CCPR1L

CCPR1H (Slave)

Comparator

TMR2

Comparator

PR2

(Note 1)

Duty Cycle Registers CCP1CON<5:4>

Clear Timer,

CCP1 pin and

latch D.C.

TRISC<2>

RC2/CCP1

Note 1: 8-bit timer is concatenated with 2-bit internal

Q clock or 2 bits of the prescaler to create

10-bit time base.

Period

Duty Cycle

TMR2 = PR2

TMR2 = Duty Cycle

TMR2 = PR2

Note: The Timer2 postscaler (see Section 14.0

“Timer2 Module”) is not used in the

determination of the PWM frequency. The

postscaler could be used to have a servo

update rate at a different frequency than

the PWM output.

PWM Period = [(PR2) + 1] • 4 • TOSC •

(TMR2 Pres cale Value)

PWM Duty Cycle = ( CCPR1L:CCP1CON<5:4>) •

TOSC • (TMR2 Prescale Value)

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The CCPR1H register and a 2-bit internal latch are

used to double buffer the PWM duty cycle. This double

buffering is essential for glitchless PWM operation.

When the CCPR1H and 2-bit latch match TMR2,

concatenated with an internal 2-bit Q clock or two bits

of the TMR2 prescaler, the CCP1 pin is cleared. The

maximum PWM resolution (bits) for a given PWM

frequency is given by the following equation:

EQUATION 16-3:

16.5.3 SETUP FOR PWM OPERATION

The following steps should be taken when configuring

the CCP1 module for PWM operation:

1. Set the PWM period by writing to the PR2 register.

2. Set the PWM duty cycle by writing to the CCPR1L

3. Make the CCP1 pin an output by clearing the

TRISC<2> bit.

4. Set the TMR2 prescale value and enable Timer2

by writing to T2CON.

5. Configure the CCP1 module for PWM operation.

TABLE 16-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz

TABLE 16-4: REGISTERS ASSOCIATED WITH PWM AND TIMER2

Note: If the PWM duty cycle value is longer than

the PWM period, the CCP1 pin will not be

cleared.

PWM Resolution (max) =

FOSC

FPWM

log

log(2) bits







PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz

Timer Prescaler (1, 4, 16)1641111

PR2 Value FFh FFh FFh 3Fh 1Fh 17h

Maximum Resolution (bits) 10 10 10 8 7 6.58

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

TRISC PORTC Data Direction Register 57

TMR2 Timer2 Register 55

PR2 Timer2 Period Register 55

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 55

CCPR1L Capture/Compare/PWM Register 1 Low Byte 56

CCPR1H Capture/Compare/PWM Register 1 High Byte 56

CCP1CON —— DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 56

CCPR2L Capture/Compare/PWM Register 2 Low Byte 56

CCPR2H Capture/Compare/PWM Register 2 High Byte 56

CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 56

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PWM and

Timer2.

 2010 Microchip Technology Inc. DS39616D-page 151

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17.0 MOTION FEEDBACK MODULE

The Motion Feedback Module (MFM) is a special

purpose peripheral designed for motion feedback

applications. Together with the Power Control PWM

(PCPWM) module (see Section 18.0 “Power Control

PWM Module”), it provides a variety of control

solutions for a wide range of electric motors.

The module actually consists of two hardware

submodules:

• Input Capture (IC)

• Quadrature Encoder Interface (QEI)

Together with Timer5 (see Section 15.0 “Timer5

Module”), these modules provide a number of

options for motion and control applications.

Many of the features for the IC and QEI submodules

are fully programmable, creating a flexible peripheral

structure that can accommodate a wide range of

in-system uses. An overview of the available features

is presented in Table 17-1. A simplified block diagram

of the entire Motion Feedback Module is shown in

Figure 17-1.

TABLE 17-1: SUMMARY OF MOTION FEEDBACK MODULE FEATURES

Note: Because the same input pins are common

to the IC and QEI submodules, only one of

these two submodules may be used at

any given time. If both modules are on, the

QEI submodule will take precedence.

Submodule Mode(s) Features Timer Function

IC (3x) • Synchronous

• Input Capture

• Flexible Input Capture modes

• Available Prescaler

• Selectable Time Base Reset

• Special Event Trigger for ADC

Sampling/Conversion or Optional

TMR5 Reset Feature (CAP1 only)

• Wake-up from Sleep function

• Selectable Interrupt Frequency

• Optional Noise Filter

TMR5 • 3x Input Capture (edge

capture, pulse width, period

measurement, capture on

change)

• Special Event Triggers the

A/D Conversion on the CAP1

Input

QEI QEI • Detect Position

• Detect Direction of Rotation

• Large Bandwidth (FCY/16)

• Optional Noise Filter

16-Bit

Position

Counter

• Position Measurement

• Direction of Rotation Status

Velocity

Measurement

• 2x and 4x Update modes

• Velocity Event Postscaler

• Counter Overflow Flag for Low

Rotation Speed

• Utilizes Input Capture 1 Logic

(IC1)

• High and Low Velocity Support

TMR5 • Precise Velocity Measurement

• Direction of Rotation Status

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DS39616D-page 152  2010 Microchip Technology Inc.

FIGURE 17-1: MOTION FEEDBACK MODULE BLOCK DIAGRAM

TCY

Timer5

T5CKI

Data Bus<7:0>

TMR5<15:0>

CAP1/INDX

CAP2/QEA

CAP3/QEB

TMR5<15:0>

TCY

Clock QEIF

Special Event Trigger Reset

IC3IF

TMR5IF

IC2IF

IC1IF

Position Counter

QEI

Control

Logic

IC1

IC2

Special Event Trigger Output

Direction

Prescaler

Velocity Event

Postscaler

IC3

Filter

Special Event Trigger Reset

QEB

QEA

INDX

3x Input Capture Logic

QEI Logic

TMR5

Reset

Control

Timer Reset

CHGIF

IC3IF

IC2IF

QEIF

QEI

Mode

Decoder

IC3DRIF

IC2QEIF

Filter

Clock

Divider

 2010 Microchip Technology Inc. DS39616D-page 153

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17.1 Input Capture

The Input Capture (IC) submodule implements the

following features:

• Three channels of independent input capture

(16-bits/channel) on the CAP1, CAP2 and CAP3

pins

• Edge-Trigger, Period or Pulse-Width

Measurement Operating modes for each channel

• Programmable prescaler on every input capture

channel

• Special Event Trigger output (IC1 only)

• Selectable noise filters on each capture input

Input Channel 1 (IC1) includes a Special Event

Trigger that can be configured for use in Velocity

Measurement mode. Its block diagram is shown in

Figure 17-2. IC2 and IC3 are similar, but lack the

Special Event Trigger features or additional velocity

measurement logic. A representative block diagram is

shown in Figure 17-3. Please note that the time base

is Timer5.

FIGU RE 17-2: INPU T CAPT URE BL OCK DIAGRA M FOR IC 1

CAP1BUF/VELR(1)

CAPxREN

CAP1 Pin

CAP1M<3:0> Q Clocks

FLTCK<2:0>

VELM

TMR5

Timer5 Reset

Timer

Reset

Control

Clock

Q Clocks CAP1M<3:0>

MUX

First Event

CAP1BUF_clk

Reset

IC1_TR

Tim er5 Logic

Reset

Control

Reset

velcap(2)

Clock/

Reset/

Interrupt

Decode

Logic

Special

Event Trigger

Reset

IC1IF

Note 1: CAP1BUF register is reconfigured as VELR register when QEI mode is active.

2: QEI generated velocity pulses, vel_out, are downsampled to produce this velocity capture signal.

Prescaler

1, 4, 16

Noise

Filter

and

Mode

Select

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FIGURE 17-3: INPUT CAPTURE BLOCK DIAGRAM FOR IC2 AND IC3

CAPxBUF(1,2,3)

CAPxREN(2)

TMR5

Enable

TMR5

TMR5 Reset

Timer

Reset

Control

Capture

Clock

ICxIF(1)

Capture Clock/

Q Clocks CAPxM<3:0>(1)

CAPxBUF_clk(1)

Reset

Reset/

Interrupt

Decode

Logic

Note 1: IC2 and IC3 are denoted as x = 2 and 3.

2: CAP2BUF is enabled as POSCNT when QEI mode is active.

3: CAP3BUF is enabled as MAXCNT when QEI mode is active.

CAP2/3 Pin

CAP1M<3:0>(1) Q Clocks

FLTCK<2:0>

Prescaler

1, 4, 16

Noise

Filter

and

Mode

Select

 2010 Microchip Technology Inc. DS39616D-page 155

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The three input capture channels are controlled

through the Input Capture Control registers,

CAP1CON, CAP2CON and CAP3CON. Each channel

is configured independently with its dedicated register.

The implementation of the registers is identical except

for the Special Event Trigger (see Section 17.1.8

“Special Event Trigger (CAP1 Only)”). The typical

Capture Control register is shown in Register 17-1.

Note: Throughout this section, references to

registers and bit names that may be asso-

ciated with a specific capture channel will

be referred to generically by the use of the

term ‘x’ in place of the channel number.

For example, ‘CAPxREN’ may refer to the

Capture Reset Enable bit in CAP1CON,

CAP2CON or CAP3CON.

U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

— CAPxREN —— CAPxM3 CAPxM2 CAPxM1 CAPxM0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 CAPxREN: Time Base Reset Enable bit

1 = Enabled

0 = Disable selected time base Reset on capture

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 CAPxM<3:0>: Input Capture x (ICx) Mode Select bits

1111 = Special Event Trigger mode; the trigger occurs on every rising edge on CAP1 input(1)

1110 = Special Event Trigger mode; the trigger occurs on every falling edge on CAP1 input(1)

1101 = Unused

1100 = Unused

1011 = Unused

1010 = Unused

1001 = Unused

1000 = Capture on every CAPx input state change

0111 = Pulse-Width Measurement mode, every rising to falling edge

0110 = Pulse-Width Measurement mode, every falling to rising edge

0101 = Frequency Measurement mode, every rising edge

0100 = Capture mode, every 16th rising edge

0011 = Capture mode, every 4th rising edge

0010 = Capture mode, every rising edge

0001 = Capture mode, every falling edge

0000 = Input Capture x (ICx) off

Note 1: Special Event Trigger is only available on CAP1. For CAP2 and CAP3, this configuration is unused.

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When in Counter mode, the counter must be

configured as the synchronous counter only

(T5SYNC =0). When configured in Asynchronous

mode, the IC module will not work properly.

17.1.1 EDGE CAPTURE MODE

In this mode, the value of the time base is captured

either on every rising edge, every falling edge, every

4th rising edge, or every 16th rising edge. The edge

present on the input capture pin (CAP1, CAP2 or

CAP3) is sampled by the synchronizing latch. The

signal is used to load the Input Capture Buffer (ICxBUF

Consequently, Timer5 is either reset to ‘0’ (Q1

immediately following the capture event) or left free

running, depending on the setting of the Capture Reset

Enable bit, CAPxREN, in the CAPxCON register.

FIGURE 17-4: EDGE CAPTURE MODE TIMING

Note 1: Input capture prescalers are reset

(cleared) when the input capture module

is disabled (CAPxM = 0000).

2: When the Input Capture mode is

changed, without first disabling the

module and entering the new Input Cap-

ture mode, a false interrupt (or Special

Event Trigger on IC1) may be generated.

The user should either: (1) disable the

input capture before entering another

mode, or (2) disable IC interrupts to avoid

false interrupts during IC mode changes.

3: During IC mode changes, the prescaler

count will not be cleared, therefore, the

first capture in the new IC mode may be

from the non-zero prescaler.

Note: On the first capture edge following the

setting of the Input Capture mode (i.e.,

MOVWF CAP1CON), Timer5 contents are

always captured into the corresponding

Input Capture Buffer (i.e., CAPxBUF).

Timer5 can optionally be reset; however,

this is dependent on the setting of the

Capture Reset Enable bit, CAPxREN (see

Figure 17-4).

CAP1 Pin(2)

0000 0002 0000 0001 0002

TMR5(1)

CAP1BUF(3) 0002

001400130012 0015

ABCD

0001

0003

TMR5 Reset(4)

MOVWF CAP1CON BCF CAP1CON, CAP1REN

Note 5

0016

Instruction

Note 1: TMR5 is a synchronous time base input to the input capture; prescaler = 1:1. It increments on the Q1 rising edge.

2: IC1 is configured in Edge Capture mode (CAP1M<3:0> = 0010) with the time base reset upon edge capture

(CAP1REN = 1) and no noise filter.

3: TMR5 value is latched by CAP1BUF on TCY. In the event that a write to TMR5 coincides with an input capture event,

the write will always take precedence. All Input Capture Buffers, CAP1BUF, CAP2BUF and CAP3BUF, are updated

with the incremented value of the time base on the next T

CY clock edge when the capture event takes place (see

Note 4 when Reset occurs).

4: TMR5 Reset is normally an asynchronous Reset signal to TMR5. When used with the input capture, it is active

immediately after the time base value is captured.

5: TMR5 Reset pulse is disabled by clearing the CAP1REN bit (e.g., BCF CAP1CON, CAP1REN).

OSC

Execution

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

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17.1.2 PERIOD MEASUREMENT MODE

The Period Measurement mode is selected by setting

CAPxM<3:0> = 0101. In this mode, the value of Timer5

is latched into the CAPxBUF register on the rising edge

of the input capture trigger and Timer5 is subsequently

reset to 0000h (optional by setting CAPxREN = 1) on

the next T

CY (see capture and Reset relationship in

Figure 17-4).

17.1.3 PULSE-WIDTH MEASUREMENT

MODE

The Pulse-Width Measurement mode can be configured

for two different edge sequences, such that the pulse

width is based on either the falling to rising edge of the

CAPx input pin (CAPxM<3:0> = 0110), or on the rising

to falling edge (CAPxM<3:0> = 0111).

Timer5 is always reset on the edge when the

measurement is first initiated. For example, when the

measurement is based on the falling to rising edge,

Timer5 is first reset on the falling edge, and thereafter,

the timer value is captured on the rising edge. Upon

entry into the Pulse-Width Measurement mode, the

very first edge detected on the CAPx pin is always

captured. The TMR5 value is reset on the first active

edge (see Figure 17-5).

FIGURE 17-5: PULSE-WIDTH MEASUREMENT MODE TIMING

CAP1 Pin(2)

0000 0002 0000 0001 0002

TMR5(1)

CAP1BUF(3) 0002

001400130012 0015

0015

0001

TMR5 Reset(4,5)

MOVWF CAP1CON

Instruction

0001

Note 1: TMR5 is a synchronous time base input to the input capture; prescaler = 1:1. It increments on every Q1 rising edge.

2: IC1 is configured in Pulse-Width Measurement mode (CAP1M<3:0> = 0111, rising to falling pulse-width

measurement). No noise filter on CAP1 input is used. The MOVWF instruction loads CAP1CON when W = 0111.

3: TMR5 value is latched by CAP1BUF on T

CY rising edge. In the event that a write to TMR5 coincides with an input cap-

ture event, the write will always take precedence. All Input Capture Buffers, CAP1BUF, CAP2BUF and CAP3BUF, are

updated with the incremented value of the time base on the next TCY clock edge when the capture event takes place

(see Note 4 when Reset occurs).

4: TMR5 Reset is normally an asynchronous Reset signal to TMR5. When used in Pulse-Width Measurement mode, it

is always present on the edge that first initiates the pulse-width measurement (i.e., when configured in the rising to

falling Pulse-Width Measurement mode); it is active on each rising edge detected. In the falling to rising Pulse-Width

Measurement mode, it is active on each falling edge detected.

5: TMR5 Reset pulse is activated on the capture edge. The CAP1REN bit has no bearing in this mode.

Execution(2)

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

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17.1.3.1 Pulse-Width Measurement Timing

Pulse-width measurement accuracy can only be

ensured when the pulse-width high and low present on

the CAPx input exceeds one T

CY clock cycle. The

limitations depend on the mode selected:

• When CAPxM<3:0> = 0110 (rising to falling edge

delay), the CAPx input high pulse width (TCCH)

must exceed TCY + 10 ns.

• When CAPxM<3:0> = 0111 (falling to rising edge

delay), the CAPx input low pulse width (TCCL)

must exceed TCY + 10 ns.

17.1.4 INPUT CAPTURE ON STATE

CHANGE

When CAPxM<3:0> = 1000, the value is captured on

every signal change on the CAPx input. If all three

capture channels are configured in this mode, the three

input captures can be used as the Hall effect sensor

state transition detector. The value of Timer5 can be

captured, Timer5 reset and the interrupt generated.

Any change on CAP1, CAP2 or CAP3 is detected and

the associated time base count is captured.

For position and velocity measurement in this mode,

the timer can be optionally reset (see Section 17.1.6

“Tim er 5 Rese t” for Reset options).

FIGURE 17-6: INPUT CAPTURE ON STATE CHANGE (HALL EFFECT SENSOR MODE)

Note 1: The Period Measurement mode will

produce valid results upon sampling of the

second rising edge of the input capture.

CAPxBUF values latched during the first

active edge after initialization are invalid.

2: The Pulse-Width Measurement mode will

latch the value of the timer upon sampling

of the first input signal edge by the input

capture.

CAP2

CAP1

CAP3

Time Base(1)

CAP1BUF(2)

CAP2BUF(2)

CAP3BUF(2)

0FFFh

0000h

Time Base Reset(1)

State 1

State 2

State 3

State 4

State 5

State 6

Note 1: TMR5 can be selected as the time base for input capture. The time base can be optionally reset when the Capture

Reset Enable bit is set (CAPxREN = 1).

2: Detailed CAPxBUF event timing (all modes reflect the same capture and Reset timing) is shown in Figure 17-4. There

are six commutation BLDC Hall effect sensor states shown. The other two remaining states (i.e., 000h and 111h) are

invalid in the normal operation. They remain to be decoded by the CPU firmware in BLDC motor application.

 2010 Microchip Technology Inc. DS39616D-page 159

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17.1.5 ENTERING INPUT CAPTURE MODE

AND CAPTURE TIMING

The following is a summary of functional operation

upon entering any of the Input Capture modes:

1. After the module is configured for one of the

Capture modes by setting the Capture Mode

Select bits (CAPxM<3:0>), the first detected

edge captures the Timer5 value and stores it in

the CAPxBUF register. The timer is then reset

(depending on the setting of CAPxREN bit) and

starts to increment according to its settings (see

Figure 17-4, Figure 17-5 and Figure 17-6).

2. On all edges, the capture logic performs the

following:

a) Input Capture mode is decoded and the

active edge is identified.

b) The CAPxREN bit is checked to determine

whether Timer5 is reset or not.

c) On every active edge, the Timer5 value is

recorded in the Input Capture Buffer

(CAPxBUF).

d) Reset Timer5 after capturing the value of

the timer when the CAPxREN bit is

enabled. Timer5 is reset on every active

capture edge in this case.

e) On all continuing capture edge events,

repeat steps (a) through (d) until the opera-

tional mode is terminated, either by user

firmware, POR or BOR.

f) The timer value is not affected when switch-

ing into and out of various Input Capture

modes.

17.1.6 TIMER5 RESET

Every input capture trigger can optionally reset

(TMR5). The Capture Reset Enable bit, CAPxREN,

gates the automatic Reset of the time base of the cap-

ture event with this enable Reset signal. All capture

events reset the selected timer when CAPxREN is set.

Resets are disabled when CAPxREN is cleared (see

Figure 17-4, Figure 17-5 and Figure 17-6).

17.1.7 IC INTERRUPTS

There are four operating modes for which the IC

module can generate an interrupt and set one of the

Interrupt Capture Flag bits (IC1IF, IC2QEIF or

IC3DRIF). The interrupt flag that is set depends on the

channel in which the event occurs. The modes are:

• Edge Capture

(CAPxM<3:0> = 0001, 0010, 0011 or 0100)

• Period Measurement Event (CAPxM<3:0> = 0101)

• Pulse-Width Measurement Event

(CAPxM<3:0> = 0110 or 0111)

• State Change Event (CAPxM<3:0> = 1000)

The timing of interrupt and Special Event Trigger

events is shown in Figure 17-7. Any active edge is

detected on the rising edge of Q2 and propagated on

the rising edge of Q4 rising edge. If an active edge

happens to occur any later than this (on the falling edge

of Q2, for example), then it will be recognized on the

next Q2 rising edge.

FIGU RE 17-7 : CAPx I NT E R RUP TS AN D IC 1 S PE C IAL E VE NT TRIGGER

Note: The CAPxREN bit has no effect in

Pulse-Width Measurement mode.

Note: The Special Event Trigger is generated

only in the Special Event Trigger mode on

the CAP1 input (CAP1M<3:0> = 1110

and 1111). IC1IF interrupt is not set in this

mode.

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

OSC

CAP1 Pin

IC1IF

TMR5

TMR5 Reset

XXXX 0000 0001

TMR5ON(1)

Note 1: Timer5 is only reset and enabled (assuming TMR5ON = 0 and T5MOD = 1) when the Special Event Trigger Reset is

enabled for the Timer5 Reset input. The TMR5ON bit is asserted and Timer5 is reset on the Q1 rising edge following

the event capture. With the Special Event Trigger Reset disabled, Timer5 cannot be reset by the Special Event Trigger

Reset on the CAP1 input. In order for the Special Event Trigger Reset to work as the Reset trigger to Timer5, IC1 must

be configured in the Special Event Trigger mode (CAP1M<3:0> = 1110 or 1111).

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17.1.8 SPECIAL EVENT TRIGGER

(CAP1 ONLY)

The Special Event Trigger mode of IC1

(CAP1M<3:0> = 1110 or 1111) enables the Special

Event Trigger signal. The trigger signal can be used as

the Special Event Trigger Reset input to TMR5,

resetting the timer when the specific event happens on

IC1. The events are summarized in Table 17-2.

TABLE 17-2: SPECIAL EVENT TRIGGER

17.1.9 OPERATING MODES SUMMARY

Table 17-3 shows a summary of the input capture

configuration when used in conjunction with the TMR5

timer resource.

17.1.10 OTHER OPERATING MODES

Although the IC and QEI submodules are mutually

exclusive, the IC can be reconfigured to work with the

QEI module to perform specific functions. In effect, the

QEI “borrows” hardware from the IC to perform these

operations.

For velocity measurement, the QEI uses dedicated

hardware in channel IC1. The CAP1BUF registers are

remapped, becoming the VELR registers. Its operation

and use are described in Section 17.2.6 “Velocity

Measurement”.

While in QEI mode, the CAP2BUF and CAP3BUF reg-

isters of channel IC2 and IC3 are used for position

determination. They are remapped as the POSCNT

and MAXCNT Buffer registers, respectively.

TABLE 17-3: INPUT CAPTURE TIME BASE RESET SUMMARY

CAP1M<3:0> Description

1110 The trigger occurs on every falling

edge on the CAP1 input.

1111 The trigger occurs on every rising

edge on the CAP1 input.

Pin CAPxM Mode Timer Reset Timer

on Capture Description

CAP1 0001-0100 Edge Capture TMR5 optional(1) Simple Edge Capture mode (includes a

selectable prescaler).

0101 Period Measurement TMR5 optional(1) Captures Timer5 on period boundaries.

0110-0111 Pulse-Width

Measurement

TMR5 always Captures Timer5 on pulse boundaries.

1000 Input Capture on State

Change

TMR5 optional(1) Captures Timer5 on state change.

1110-1111 Special Event Trigger

(rising or falling edge)

TMR5 optional(2) Used as a Special Event Trigger to be

used with the Timer5 or other peripheral

modules.

CAP2 0001-0100 Edge Capture TMR5 optional(1) Simple Edge Capture mode (includes a

selectable prescaler).

0101 Period Measurement TMR5 optional(1) Captures Timer5 on period boundaries.

0110-0111 Pulse-Width

Measurement

TMR5 always Captures Timer5 on pulse boundaries.

1000 Input Capture on State

Change

TMR5 optional(1) Captures Timer5 on state change.

CAP3 0001-0100 Edge Capture TMR5 optional(1) Simple Edge Capture mode (includes a

selectable prescaler).

0101 Period Measurement TMR5 optional(1) Captures Timer5 on period boundaries.

0110-0111 Pulse-Width

Measurement

TMR5 always Captures Timer5 on pulse boundaries.

1000 Input Capture on State

Change

TMR5 optional(1) Captures Timer5 on state change.

Note 1: Timer5 may be reset on capture events only when CAPxREN = 1.

2: Trigger mode will not reset Timer5 unless RESEN = 0 in the T5CON register.

 2010 Microchip Technology Inc. DS39616D-page 161

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17.2 Quadrature Encoder Interface

The Quadrature Encoder Interface (QEI) decodes

speed and motion sensor information. It can be used in

any application that uses a quadrature encoder for

feedback. The interface implements these features:

• Three QEI inputs: two phase signals (QEA and

QEB) and one index signal (INDX)

• Direction of movement detection with a direction

change interrupt (IC3DRIF)

• 16-bit up/down position counter

• Standard and High-Precision Position Tracking

modes

• Two Position Update modes (x2 and x4)

• Velocity measurement with a programmable

postscaler for high-speed velocity measurement

• Position counter interrupt (IC2QEIF in the PIR3

• Velocity control interrupt (IC1IF in the PIR3

The QEI submodule has three main components: the

QEI control logic block, the position counter and

velocity postscaler.

The QEI control logic detects the leading edge on the

QEA or QEB phase input pins and generates the count

pulse, which is sent to the position counter logic. It also

samples the index input signal (INDX) and generates

the direction of the rotation signal (up/down) and the

velocity event signals.

The position counter acts as an integrator for tracking

distance traveled. The QEA and QEB input edges

serve as the stimulus to create the input clock which

advances the Position Counter register (POSCNT).

The register is incremented on either the QEA input

edge, or the QEA and QEB input edges, depending on

the operating mode. It is reset either by a rollover on

match to the Period register, MAXCNT, or on the

external index pulse input signal (INDX). An interrupt is

generated on a Reset of POSCNT if the position

counter interrupt is enabled.

The velocity postscaler down samples the velocity

pulses used to increment the velocity counter by a

specified ratio. It essentially divides down the number

of velocity pulses to one output per so many inputs,

preserving the pulse width in the process.

A simplified block-diagram of the QEI module is shown

in Figure 17-8.

FIGU RE 17-8 : QEI BLOC K DI A GRAM

Comparator

CAP2/QEA

CAP1/INDX

CAP3/QEB

CAP2BUF/POSCNT

QEI Module

QEI

Control

Logic

Filter

QEB

QEA

INDX

Timer Reset

Velocity Event Postscaler 8

CAP3BUF/MAXCNT

Clock

Direction 8

Data Bus

Position Counter

Direction Change Set CHGIF Reset Timer5

Velocity Capture

Set UP/DOWN

Reset on Match

Set IC2QEIF

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17.2.1 QEI CONFIGURATION

The QEI module shares its input pins with the Input

Capture (IC) module. The inputs are mutually

exclusive; only the IC module or the QEI module (but

not both) can be enabled at one time. Also, because

the IC and QEI are multiplexed to the same input pins,

the programmable noise filters can be dedicated to one

module only.

The operation of the QEI is controlled by the QEICON

Configuration register (see Register 17-2).

Note: In the event that both QEI and IC are

enabled, QEI will take precedence and IC

will remain disabled.

R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

VELM QERR(1) UP/DOWN QEIM2(2,3) QEIM1(2,3) QEIM0(2,3) PDEC1 PDEC0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 VELM: Velocity Mode bit

1 = Velocity mode disabled

0 = Velocity mode enabled

bit 6 QERR: QEI Error bit(1)

1 = Position counter overflow or underflow(4)

0 = No overflow or underflow

bit 5 UP/DOWN: Direction of Rotation Status bit

1 =Forward

0 = Reverse

bit 4-2 QEIM<2:0>: QEI Mode bits(2,3)

111 = Unused

110 = QEI enabled in 4x Update mode; position counter is reset on period match (POSCNT = MAXCNT)

101 = QEI enabled in 4x Update mode; INDX resets the position counter

100 = Unused

010 = QEI enabled in 2x Update mode; position counter is reset on period match (POSCNT = MAXCNT)

001 = QEI enabled in 2x Update mode; INDX resets the position counter

000 = QEI off

bit 1-0 PDEC<1:0>: Velocity Pulse Reduction Ratio bits

11 = 1:64

10 = 1:16

01 = 1:4

00 = 1:1

Note 1: QEI must be enabled and in Index mode.

2: QEI mode select must be cleared (= 000) to enable CAP1, CAP2 or CAP3 inputs. If QEI and IC modules

are both enabled, QEI will take precedence.

3: Enabling one of the QEI operating modes remaps the IC Buffer registers, CAP1BUFH, CAP1BUFL,

CAP2BUFH, CAP2BUFL, CAP3BUFH and CAP3BUFL, as the VELRH, VELRL, POSCNTH, POSCNTL,

MAXCNTH and MAXCNTL registers (respectively) for the QEI.

4: The QERR bit must be cleared in software.

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17.2.2 QEI MODES

Position measurement resolution depends on how

often the Position Counter register, POSCNT, is

incremented. There are two QEI Update modes to

measure the rotor’s position: QEI x2 and QEI x4.

TABLE 17-4: QEI MODES

17.2.2.1 QEI x2 Update Mode

QEI x2 Update mode is selected by setting the QEI

Mode Select bits (QEIM<2:0>) to ‘001’ or ‘010’. In this

mode, the QEI logic detects every edge on the QEA

input only. Every rising and falling edge on the QEA

signal clocks the position counter.

The position counter can be reset by either an input on

the INDX pin (QEIM<2:0> = 001), or by a period match,

even when the POSCNT register pair equals MAXCNT

(QEIM<2:0> = 010).

17.2.2.2 QEI x4 Update Mode

QEI x4 Update mode provides for a finer resolution of

the rotor position, since the counter increments or

decrements more frequently for each QEA/QEB input

pulse pair than in QEI x2 mode. This mode is selected

by setting the QEI mode select bits to ‘101’ or ‘110’. In

QEI x4, the phase measurement is made on the rising

and the falling edges of both QEA and QEB inputs. The

position counter is clocked on every QEA and QEB

edge.

Like QEI x2 mode, the position counter can be reset by

an input on the pin (QEIM<2:0> = 101), or by the period

match event (QEIM<2:0> = 010).

17.2.3 QEI OPERATION

The Position Counter register pair (POSCNTH:

POSCNTL) acts as an integrator, whose value is propor-

tional to the position of the sensor rotor that corresponds

to the number of active edges detected. POSCNT can

either increment or decrement, depending on a number

of selectable factors which are decoded by the QEI logic

block. These include the Count mode selected, the

phase relationship of QEA to QEB (“lead/lag”), the

direction of rotation and if a Reset event occurs. The

logic is detailed in the sections that follow.

17.2.3.1 Edge and Phase Detect

In the first step, the active edges of QEA and QEB are

detected, and the phase relationship between them is

determined. The position counter is changed based on

the selected QEI mode.

In QEI x2 Update mode, the position counter

increments or decrements on every QEA edge based

on the phase relationship of the QEA and QEB signals.

In QEI x4 Update mode, the position counter

increments or decrements on every QEA and QEB

edge based on the phase relationship of the QEA and

QEB signals. For example, if QEA leads QEB, the

position counter is incremented by ‘1’. If QEB lags

QEA, the position counter is decremented by ‘1’.

17.2.3.2 Direction of Count

The QEI control logic generates a signal that sets the

UP/DOWN bit (QEICON<5>); this, in turn, determines

the direction of the count. When QEA leads QEB,

UP/DOWN is set (= 1) and the position counter

increments on every active edge. When QEA lags

QEB, UP/DOWN is cleared and the position counter

decrements on every active edge.

TABLE 17-5: DIRECTION OF ROTATION

QEIM<2:0> Mode/

Reset Description

000 — QEI disabled.(1)

001 x2 update/

index pulse

Two clocks per QEA

pulse. INDX resets

POSCNT.

010 x2 update/

period

match

Two clocks per QEA pulse.

POSCNT is reset by the

period match (MAXCNT).

011 — Unused.

100 — Unused.

101 x4 update/

index pulse

Four clocks per QEA and

QEB pulse pair.

INDX resets POSCNT.

110 x4 update/

period

match

Four clocks per QEA and

QEB pulse pair.

POSCNT is reset by the

period match (MAXCNT).

111 — Unused.

Note 1: QEI module is disabled. The position

counter and the velocity measurement

functions are fully disabled in this mode.

Current

Signal

Detected

Previous Signal

Detected Pos.

Cntrl.(1)

Rising Falling

QEA QEB QEA QEB

QEA Rising x INC

xDEC

QEA Falling x DEC

xINC

QEB Rising x INC

xDEC

QEB Falling x INC

xDEC

Note 1: When UP/DOWN = 1, the position counter

is incremented. When UP/DOWN = 0, the

position counter is decremented.

PIC18F2331/2431/4331/4431

DS39616D-page 164  2010 Microchip Technology Inc.

17.2.3.3 Reset and Update Events

The position counter will continue to increment or dec-

rement until one of the following events takes place.

The type of event and the direction of rotation when it

happens determines if a register Reset or update

occurs.

1. An index pulse is detected on the INDX input

(QEIM<2:0> = 001).

If the encoder is traveling in the forward direc-

tion, POSCNT is reset (00h) on the next clock

edge after the index marker, INDX, has been

detected. The position counter resets on the

QEA or QEB edge once the INDX rising edge

has been detected.

If the encoder is traveling in the reverse direc-

tion, the value in the MAXCNT register is loaded

into POSCNT on the next quadrature pulse

edge (QEA or QEB) after the falling edge on

INDX has been detected.

2. A POSTCNT/MAXCNT period match occurs

(QEIM<2:0> = 010).

If the encoder is traveling in the forward direc-

tion, POSCNT is reset (00h) on the next clock

edge when POSCNT = MAXCNT. An interrupt

event is triggered on the next T

CY after the Reset

(see Figure 17-10)

If the encoder is traveling in the reverse

direction and the value of POSCNT reaches

00h, POSCNT is loaded with the contents of the

MAXCNT register on the next clock edge. An

interrupt event is triggered on the next TCY after

the load operation (see Figure 17-10).

The value of the position counter is not affected during

QEI mode changes, nor when the QEI is disabled

altogether.

17.2.4 QEI INTERRUPTS

The position counter interrupt occurs and the interrupt

flag (IC2QEIF) is set, based on the following events:

• A POSCNT/MAXCNT period match event

(QEIM<2:0> = 010 or 110)

• A POSCNT rollover (FFFFh to 0000h) in Period

mode only (QEIM<2:0> = 010 or 110)

• An index pulse detected on INDX

The interrupt timing diagrams for IC2QEIF are shown in

Figure 17-10 and Figure 17-11.

When the direction has changed, the direction change

interrupt flag (IC3DRIF) is set on the following TCY

clock (see Figure 17-10).

If the position counter rolls over in Index mode, the

QERR bit will be set.

17.2.5 QEI SAMPLE TIMING

The quadrature input signals, QEA and QEB, may vary

in quadrature frequency. The minimum quadrature

input period, TQEI, is 16 TCY.

The position count rate, FPOS, is directly proportional to

the rotor’s RPM, line count D and QEI Update mode (x2

versus x4); that is,

EQUATION 17-1:

The maximum position count rate (i.e., x4 QEI

Update mode, D = 1024) with FCY = 10 MIPS is equal

to 2.5 MHz, which corresponds to FQEI of 625 kHz.

Figure 17-9 shows QEA and QEB quadrature input

timing when sampled by the noise filter.

Note: The number of incremental lines in the

position encoder is typically set at D = 1024

and the QEI Update mode = x4.

FPOS = 4D • RPM

 2010 Microchip Technology Inc. DS39616D-page 165

PIC18F2331/2431/4331/4431

FIGURE 17-9: QEI INPUTS WHEN SA MPLED B Y THE FI LTER (D IVIDE RATIO = 1 :1)

FIGU RE 17-10: QEI MODUL E RE S ET TIMI NG ON PERIOD MATC H

TCY

QEA Pin

TGD = 3 TCY

QEB Pin

QEA Input

QEB Input

Note 1: The module design allows a quadrature frequency of up to FQEI = FCY/16.

TQEI = 16 TCY(1)

QEB

QEA

UP/DOWN

IC2QEIF

POSCNT(1)

1520

1521

1522

1523

1524

1525

1526

1527

Count (+/-) +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1

MAXCNT

0000

0001

0002

0003

0004

0003

0002

0001

0000

1527

1526

1525

1524

1523

1522

1521

1520

1519

1518

1517

1516

1515

1514

Q4(3)

Q1(4) Q1(5)

Position

Counter Load

Forward Reverse

Q1(5)

IC3DRIF

Note 2 Note 2

Note 1: The POSCNT register is shown in QEI x4 Update mode (POSCNT increments on every rising and every falling edge

of QEA and QEB input signals). Asynchronous external QEA and QEB inputs are synchronized to the TCY clock by

the input sampling FF in the noise filter (see Figure 17-14).

2: When POSCNT = MAXCNT, POSCNT is reset to ‘0’ on the next QEA rising edge. POSCNT is set to MAXCNT when

POSCNT = 0 (when decrementing), which occurs on the next QEA falling edge.

3: IC2QEIF is generated on the Q4 rising edge.

4: Position counter is loaded with ‘0’ (which is a rollover event in this case) on POSCNT = MAXCNT.

5: Position counter is loaded with MAXCNT value (1527h) on underflow.

6: IC2QEIF must be cleared in software.

Note 6

Q4(3)

MAXCNT=1527

PIC18F2331/2431/4331/4431

DS39616D-page 166  2010 Microchip Technology Inc.

FIGURE 17-11: QEI MODULE RESET TIMING WITH THE INDEX INPUT

QEB

QEA

UP/DOWN

IC2QEIF

POSCNT(1)

1520

1521

1522

1523

1524

1525

1526

1527

Count (+/-) +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1

MAXCNT MAXCNT = 1527

0000

0001

0002

0003

0004

0003

0002

0001

0000

1527

1526

1525

1524

1523

1522

1521

1520

1519

1518

1517

1516

1515

1514

Q4(3)

INDX

Q1(4) Q1(5)

Position

Counter Load

Forward Reverse

Note 2 Note 2

Note 1: POSCNT register is shown in QEI x4 Update mode (POSCNT increments on every rising and every falling edge of

QEA and QEB input signals).

2: When an INDX Reset pulse is detected, POSCNT is reset to ‘0’ on the next QEA or QEB edge. POSCNT is set to

MAXCNT when POSCNT = 0 (when decrementing), which occurs on the next QEA or QEB edge. a similar Reset

sequence occurs for the reverse direction, except that the INDX signal is recognized on its falling edge. The Reset

is generated on the next QEA or QEB edge.

3: IC2QEIF is enabled for one TCY clock cycle.

4: The position counter is loaded with 0000h (i.e., Reset) on the next QEA or QEB edge when the INDX is high.

5: The position counter is loaded with a MAXCNT value (e.g., 1527h) on the next QEA or QEB edge following the

INDX falling edge input signal detect).

6: IC2QEIF must be cleared in software.

Note 6

Q4(3)

 2010 Microchip Technology Inc. DS39616D-page 167

PIC18F2331/2431/4331/4431

17.2.6 VELOCITY MEASUREMENT

The velocity pulse generator, in conjunction with the

IC1 and the synchronous TMR5 (in synchronous

operation), provides a method for high accuracy speed

measurements at both low and high mechanical motor

speeds. The Velocity mode is enabled when the VELM

bit is cleared (= 0) and QEI is set to one of its operating

modes (see Table 17-6).

To optimize register space, the Input Capture

Channel 1 (IC1) is used to capture TMR5 counter

values. Input Capture Buffer register, CAP1BUF, is

redefined in Velocity Measurement mode, VELM = 0,

as the Velocity Register Buffer (VELRH, VELRL).

TABLE 17-6: VELOCITY PULSES

17.2.6.1 Velocity Event Timing

The event pulses are reduced by a fixed ratio by the

velocity pulse divider. The divider is useful for

high-speed measurements where the velocity events

happen frequently. By producing a single output pulse

for a given number of input event pulses, the counter

can track larger pulse counts (i.e., distance travelled)

for a given time interval. Time is measured by utilizing

the TMR5 time base.

Each velocity pulse serves as a capture pulse. With the

TMR5 in Synchronous Timer mode, the value of TMR5

is captured on every output pulse of the postscaler. The

counter is subsequently reset to ‘0’. TMR5 is reset

upon a capture event.

Figure 17-13 shows the velocity measurement timing

diagram.

FIGURE 17-12: VELOCITY MEASUREMENT BLOCK DIAGRAM

QEIM<2:0> Velocity Event Mode

001

010 x2 Velocity Event mode. The velocity

pulse is generated on every QEA edge.

101

110 x4 Velocity Event mode. The velocity

pulse is generated on every QEA and

QEB active edge.

CAP2/QEA

CAP1/INDX

CAP3/QEB

QEI

Control

Logic

QEB

QEA

INDX

Postscaler

Clock

Direction Position

Counter

TMR5

IC1

Noise Filters

Reset

Logic

Velocity Mode

(VELR Register)

TCY

Clock

TMR5 Reset

Velocity Capture

Velocity Event

PIC18F2331/2431/4331/4431

DS39616D-page 168  2010 Microchip Technology Inc.

FIGURE 17-13: VELOCITY MEASUREMENT TIMING(1)

17.2.6.2 Velocity Postscaler

The velocity event pulse (velcap, see Figure 17-12)

serves as the TMR5 capture trigger to IC1 while in the

Velocity mode. The number of velocity events are

reduced by the velocity postscaler before they are used

as the input capture clock. The velocity event reduction

ratio can be set with the PDEC<1:0> control bits

(QEICON<1:0>) to 1:4, 1:16, 1:64 or no reduction (1:1).

The velocity postscaler settings are automatically

reloaded from their previous values as the Velocity

mode is re-enabled.

17.2.6.3 CAP1REN in Velocity Mode

The TMR5 value can be reset (TMR5 register

pair = 0000h) on a velocity event capture by setting

the CAP1REN bit (CAP1CON<6>). When CAP1REN

is cleared, the TMR5 time base will not be reset on

any velocity event capture pulse. The VELR register

pair, however, will continue to be updated with the

current TMR5 value.

QEB

QEA

cnt_reset(3)

TMR5(2)

velcap

BCF T5CON,

VELM

VELR(2)

1520

1521

1522

1523

1525

1526

1527

1528

1529

1530

1531

1532

1534

1535

1536

0000

0001

0002

0003

0004

0005

0006

0007

0008

0009

0000

0001

0002

0003

0004

1529

1524

1533

1537

vel_out

Old Value

Forward

Q1Q1

IC1IF(4)

Instr.

Execution

MOVWF QEICON

(5)

BCF

PIE2,

IC1IE BSF

PIE2,

IC1IE

CAP1REN

Note 1: Timing shown is for QEIM<2:0> = 101, 110 or 111 (x4 Update mode enabled) and the velocity postscaler divide ratio

is set to divide-by-4 (PDEC<1:0> = 01).

2: The VELR register latches the TMR5 count on the “velcap” capture pulse. Timer5 must be set to the Synchronous Timer

or Counter mode. In this example, it is set to the Synchronous Timer mode, where the TMR5 prescaler divide ratio = 1

(i.e., Timer5 Clock = T

CY).

3: The TMR5 counter is reset on the next Q1 clock cycle following the “velcap” pulse. The TMR5 value is unaffected

when the Velocity Measurement mode is first enabled (VELM = 0). The velocity postscaler values must be

reconfigured to their previous settings when re-entering Velocity Measurement mode. While making speed

measurements of very slow rotational speeds (e.g., servo-controller applications), the Velocity Measurement mode

may not provide sufficient precision. The Pulse-Width Measurement mode may have to be used to provide the

additional precision. In this case, the input pulse is measured on the CAP1 input pin.

4: IC1IF interrupt is enabled by setting IC1IE as follows: BSF PIE2, IC1IE. Assume IC1E bit is placed in the PIE2

(Peripheral Interrupt Enable 2) register in the target device. The actual IC1IF bit is written on the Q2 rising edge.

5: The post decimation value is changed from PDEC = 01 (decimate by 4) to PDEC = 00 (decimate by 1).

Reverse

 2010 Microchip Technology Inc. DS39616D-page 169

PIC18F2331/2431/4331/4431

17.3 Noise Filters

The Motion Feedback Module includes three noise

rejection filters on RA2/AN2/VREF-/CAP1/INDX,

RA3/AN3/VREF+/CAP2/QEA and RA4/AN4/CAP3/QEB.

The filter block also includes a fourth filter for the T5CKI

pin. They are intended to help reduce spurious noise

spikes which may cause the input signals to become

corrupted at the inputs. The filter ensures that the input

signals are not permitted to change until a stable value

has been registered for three consecutive sampling

clock cycles.

The filters are controlled using the Digital Filter Control

(DFLTCON) register (see Register 17-3). The filters

can be individually enabled or disabled by setting or

clearing the corresponding FLTxEN bit in the

DFLTCON register. The sampling frequency, which

must be the same for all three noise filters, can be

programmed by the FLTCK<2:0> Configuration bits.

CY is used as the clock reference to the clock divider

block.

The noise filters can either be added or removed from

the input capture, or QEI signal path, by setting or

clearing the appropriate FLTxEN bit, respectively. Each

capture channel provides for individual enable control

of the filter output. The FLT4EN bit enables or disables

the noise filter available on the T5CKI input in the

Timer5 module.

The filter network for all channels is disabled on

Power-on and Brown-out Resets, as the DFLTCON

is shown in the timing diagram in Figure 17-14.

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— FLT4EN FLT3EN(1) FLT2EN(1) FLT1EN(1) FLTCK2 FLTCK1 FLTCK0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 FLT4EN: Noise Filter Output Enable bit (T5CKI input)

1 = Enabled

0 = Disabled

bit 5 FLT3EN: Noise Filter Output Enable bit (CAP3/QEB input)(1)

1 = Enabled

0 = Disabled

bit 4 FLT2EN: Noise Filter Output Enable bit (CAP2/QEA input)(1)

1 = Enabled

0 = Disabled

bit 3 FLT1EN: Noise Filter Output Enable bit (CAP1/INDX Input)(1)

1 = Enabled

0 = Disabled

bit 2-0 FLTCK<2:0>: Noise Filter Clock Divider Ratio bits

111 = Unused

110 = 1:128

101 = 1:64

100 = 1:32

011 = 1:16

010 = 1:4

001 = 1:2

000 = 1:1

Note 1: The noise filter output enables are functional in both QEI and IC Operating modes.

Note: The noise filter is intended for random high-frequency filtering and not continuous high-frequency filtering.

PIC18F2331/2431/4331/4431

DS39616D-page 170  2010 Microchip Technology Inc.

FIGU RE 17 -14: NOISE FI LTER T I MING DIA GRA M (CLO CK DIVI DER = 1:1)

17.4 IC and QEI Shared Interrupts

The IC and QEI submodules can each generate three

distinct interrupt signals; however, they share the use

of the same three interrupt flags in register, PIR3. The

meaning of a particular interrupt flag at any given time

depends on which module is active at the time the

interrupt is set. The meaning of the flags in context are

summarized in Table 17-7.

When the IC submodule is active, the three flags (IC1IF,

IC2QEIF and IC3DRIF) function as interrupt-on-capture

event flags for their respective input capture channels.

The channel must be configured for one of the events

that will generate an interrupt (see Section 17.1.7 “IC

Interrupts” for more information).

When the QEI is enabled, the IC1IF interrupt flag

indicates an interrupt caused by a velocity

measurement event, usually an update of the VELR

measurement event has occurred. IC3DRIF indicates

that a direction change has been detected.

TABLE 17-7: MEANING OF IC AND QEI

INTERRUPT FLAGS

17.5 Operation in Sleep Mode

17.5.1 3x INPUT CAPTURE IN SLEEP

MODE

Since the input capture can operate only when its time

base is configured in a Synchronous mode, the input

capture will not capture any events. This is because the

device’s internal clock has been stopped and any inter-

nal timers in Synchronous modes will not increment.

The prescaler will continue to count the events (not

synchronized).

When the specified capture event occurs, the CAPx

interrupt will be set. The Capture Buffer register will be

updated upon wake-up from sleep to the current TMR5

value. If the CAPx interrupt is enabled, the device will

wake-up from Sleep. This effectively enables all input

capture channels to be used as the external interrupts.

17.5.2 QEI IN SLEEP MODE

All QEI functions are halted in Sleep mode.

CAP1/INDX Pin(1)

TCY

Noise Glitch(3)

CAP1/INDX Input(2)

TQEI = 16 TCY

Note 1: Only the CAP1/INDX pin input is shown for simplicity. Similar event timing occurs on the CAP2/QEA and

CAP3/QEB pins.

2: Noise filtering occurs in the shaded portions of the CAP1 input.

3: Filter’s group delay: TGD = 3 TCY.

(input to filter)

(output from filter) TGD = 3 TCY

Noise Glitch(3)

Interr upt

Flag

Meaning

IC Mode QEI Mode

IC1IF IC1 Capture Event Velocity Register Update

IC2QEIF IC2 Capture Event Position Measurement

Update

IC3DRIF IC3 Capture Event Direction Change

 2010 Microchip Technology Inc. DS39616D-page 171

PIC18F2331/2431/4331/4431

TABLE 17-8: REGISTERS ASSOCIATED WITH THE MOTION FEEDBACK MODULE

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

IPR3 — — — PTIP IC3DRIP IC2QEIP IC1IP TMR5IP 56

PIE3 — — — PTIE IC3DRIE IC2QEIE IC1IE TMR5IE 56

PIR3 — — — PTIF IC3DRIF IC2QEIF IC1IF TMR5IF 56

TMR5H Timer5 Register High Byte 57

TMR5L Timer5 Register Low Byte 57

PR5H Timer5 Period Register High Byte 57

PR5L Timer5 Period Register Low Byte 57

T5CON T5SEN RESEN T5MOD T5PS1 T5PS0 T5SYNC TMR5CS TMR5ON 57

CAP1BUFH/

VELRH

Capture 1 Register High Byte/Velocity Register High Byte(1) 58

CAP1BUFL/

VELRL

Capture 1 Register Low Byte/Velocity Register Low Byte(1) 58

CAP2BUFH/

POSCNTH

Capture 2 Register High Byte/QEI Position Counter Register High Byte(1) 58

CAP2BUFL/

POSCNTL

Capture 2 Register Low Byte/QEI Position Counter Register Low Byte(1) 58

CAP3BUFH/

MAXCNTH

Capture 3 Register High Byte/QEI Max. Count Limit Register High Byte(1) 58

CAP3BUFL/

MAXCNTL

Capture 3 Register Low Byte/QEI Max. Count Limit Register Low Byte(1) 58

CAP1CON —CAP1REN—— CAP1M3 CAP1M2 CAP1M1 CAP1M0 59

CAP2CON —CAP2REN—— CAP2M3 CAP2M2 CAP2M1 CAP2M0 59

CAP3CON —CAP3REN—— CAP3M3 CAP3M2 CAP3M1 CAP3M0 59

DFLTCON — FLT4EN FLT3EN FLT2EN FLT1EN FLTCK2 FLTCK1 FLTCK0 59

QEICON VELM QERR UP/DOWN QEIM2 QEIM1 QEIM0 PDEC1 PDEC0 56

Legend: — = unimplemented. Shaded cells are not used by the Motion Feedback Module.

Note 1: Register name and function determined by which submodule is selected (IC/QEI, respectively). See

Section 17.1.10 “Other Operating Modes” for more information.

PIC18F2331/2431/4331/4431

DS39616D-page 172  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 173

PIC18F2331/2431/4331/4431

18.0 POW ER CONTROL PWM

MODULE

The Power Control PWM module simplifies the task of

generating multiple, synchronized Pulse-Width

Modulated (PWM) outputs for use in the control of

motor controllers and power conversion applications.

In particular, the following power and motion control

applications are supported by the PWM module:

• Three-Phase and Single-Phase AC Induction

Motors

• Switched Reluctance Motors

• Brushless DC (BLDC) Motors

• Uninterruptible Power Supplies (UPS)

• Multiple DC Brush Motors

The PWM module has the following features:

• Up to eight PWM I/O pins with four duty cycle

generators. Pins can be paired to get a complete

half-bridge control.

• Up to 14-bit resolution, depending upon the PWM

period.

• “On-the-fly” PWM frequency changes.

• Edge and Center-Aligned Output modes.

• Single-Pulse Generation mode.

• Programmable dead-time control between paired

PWMs.

• Interrupt support for asymmetrical updates in

Center-Aligned mode.

• Output override for Electrically Commutated

Motor (ECM) operation; for example, BLDC.

• Special Event Trigger comparator for scheduling

other peripheral events.

• PWM outputs disable feature sets PWM outputs

to their inactive state when in Debug mode.

The Power Control PWM module supports three PWM

generators and six output channels on

PIC18F2331/2431 devices, and four generators and

eight channels on PIC18F4331/4431 devices. A simpli-

fied block diagram of the module is shown in

Figure 18-1. Figure 18-2 and Figure 18-3 show how

the module hardware is configured for each PWM

output pair for the Complementary and Independent

Output modes.

Each functional unit of the PWM module will be

discussed in subsequent sections.

PIC18F2331/2431/4331/4431

DS39616D-page 174  2010 Microchip Technology Inc.

FIGURE 18-1: POWER CONTROL PWM MODULE BLOCK DIAGRAM

PDC3

PDC3 Buffer

Output

Driver

Block

PWMCON0

PTPER Buffer

PWMCON1

PTPER

PTMR

Comparator

Channel 3

PTCON

SEVTCMP

Comparator Special Event Trigger

OVDCON<D/S>

PWM Enable and Mode

PWM Manual Control

PWM

PWM Generator #3(1)

SEVTDIR

PTDIR

DTCON Dead-Time Control

Special Event

Postscaler

FLTA

PWM0

PWM1

PWM2

PWM3

PWM4

PWM5

PWM

FLTB(2)

Note 1: Only PWM Generator 3 is shown in detail. The other generators are identical; their details are omitted for clarity.

2: PWM Generator 3 and its logic, PWM Channels 6 and 7, and FLTB and its associated logic are not implemented on

PIC18F2331/2431 devices.

PWM6(2)

PWM7(2)

FLTCONFIG Fault Pin Control

Dead-Time Generator

and Override Logic(2)

Channel 2

Dead-Time Generator

and Override Logic

Channel 1

Dead-Time Generator

and Override Logic

Channel 0

Dead-Time Generator

and Override Logic

Internal Data Bus

Generator 1

Generator 0

Generator 2

 2010 Microchip Technology Inc. DS39616D-page 175

PIC18F2331/2431/4331/4431

FIGU RE 18-2: PWM MODULE BLOCK D IAGRAM, O NE OUT PUT PAIR, COMPLEMENT AR Y MODE

FIGU RE 18 - 3: PWM MODUL E BLO CK D I AGRA M, O N E OU TPUT P AI R, INDEPE ND E NT MO DE

This module contains four duty cycle generators,

numbered 0 through 3. The module has eight PWM

output pins, numbered 0 through 7. The eight PWM

outputs are grouped into output pairs of even and odd

numbered outputs. In Complementary modes, the even

PWM pins must always be the complement of the

corresponding odd PWM pin. For example, PWM0 will

be the complement of PWM1, PWM2 will be the

complement of PWM3 and so on. The dead-time

generator inserts an OFF period called “dead time”

between the going OFF of one pin to the going ON of

the complementary pin of the paired pins. This is to

prevent damage to the power switching devices that

will be connected to the PWM output pins.

The time base for the PWM module is provided by its

own 12-bit timer, which also incorporates selectable

prescaler and postscaler options.

PWM Duty Cycle Register

Duty Cycle Comparator

Dead-Band

Generator

Fault Override Values

Channel Override Values

Fault A Pin

Fault B Pin

HPOL

LPOL

PWM1

PWM0

VDD

Note: In Complementary mode, the even channel cannot be forced active by a Fault or override event when the odd channel is active.

The even channel is always the complement of the odd channel and is inactive, with dead time inserted, before the odd channel

is driven to its active state.

Fault Pin Assignment

Logic

Duty Cycle Comparator

PWM Duty Cycle Register

Fault A Pin

Fault B Pin

HPOL

LPOL

PWM1

PWM0

VDD

Fault Override Values

Channel Override Values

Fault Pin Assignment

Logic

PIC18F2331/2431/4331/4431

DS39616D-page 176  2010 Microchip Technology Inc.

18.1 Control Registers

The operation of the PWM module is controlled by a

total of 22 registers. Eight of these are used to

configure the features of the module:

• PWM Timer Control Register 0 (PTCON0)

• PWM Timer Control Register 1 (PTCON1)

• PWM Control Register 0 (PWMCON0)

• PWM Control Register 1 (PWMCON1)

• Dead-Time Control Register (DTCON)

• Output Override Control Register (OVDCOND)

• Output State Register (OVDCONS)

• Fault Configuration Register (FLTCONFIG)

There are also 14 registers that are configured as

seven register pairs of 16 bits. These are used for the

configuration values of specific features. They are:

• PWM Time Base Registers (PTMRH and PTMRL)

• PWM Time Base Period Registers (PTPERH and

PTPERL)

• PWM Special Event Trigger Compare Registers

(SEVTCMPH and SEVTCMPL)

• PWM Duty Cycle #0 Registers

(PDC0H and PDC0L)

• PWM Duty Cycle #1 Registers

(PDC1H and PDC1L)

• PWM Duty Cycle #2 Registers

(PDC2H and PDC2L)

• PWM Duty Cycle #3 Registers

(PDC3H and PDC3L)

All of these register pairs are double-buffered.

18.2 Module Functionality

The PWM module supports several modes of operation

that are beneficial for specific power and motor control

applications. Each mode of operation is described in

subsequent sections.

The PWM module is composed of several functional

blocks. The operation of each is explained separately

in relation to the several modes of operation:

•PWM Time Base

• PWM Time Base Interrupts

•PWM Period

• PWM Duty Cycle

• Dead-Time Generators

• PWM Output Overrides

• PWM Fault Inputs

• PWM Special Event Trigger

18.3 PWM Time Base

The PWM time base is provided by a 12-bit timer with

prescaler and postscaler functions. A simplified block

diagram of the PWM time base is shown in Figure 18-4.

The PWM time base is configured through the

PTCON0 and PTCON1 registers. The time base is

enabled or disabled by respectively setting or clearing

the PTEN bit in the PTCON1 register.

Note: The PTMR register pair (PTMRL:PTMRH)

is not cleared when the PTEN bit is

cleared in software.

 2010 Microchip Technology Inc. DS39616D-page 177

PIC18F2331/2431/4331/4431

FIGU RE 18 - 4: PWM TI ME BA SE BLO CK D IA GRA M

The PWM time base can be configured for four different

modes of operation:

• Free-Running mode

• Single-Shot mode

• Continuous Up/Down Count mode

• Continuous Up/Down Count mode with interrupts

for double updates

These four modes are selected by the PTMOD<1:0>

bits in the PTCON0 register. The Free-Running mode

produces edge-aligned PWM generation. The

Continuous Up/Down Count modes produce

center-aligned PWM generation. The Single-Shot

mode allows the PWM module to support pulse control

of certain Electronically Commutated Motors (ECMs)

and produces edge-aligned operation.

PTMR Register

PTPER

Comparator

PTPER Buffer

Comparator Zero Match

Period Match

PTMOD1

Up/Down

Timer Reset

FOSC/4

Clock

Control

Period Load

Duty Cycle Load

PTMOD1

Period Match

Zero Match

PTMR Clock

Interrupt

Control

PTMOD1

Period Match

Zero Match

PTMOD0

PTEN

PTIF

PTDIR

PTMR Clock

Update Disable (UDIS)

Timer

Direction

Control

Postscaler

1:1-1:16

Prescaler

1:1, 1:4, 1:16, 1:64

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DS39616D-page 178  2010 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PTOPS3 PTOPS2 PTOPS1 PTOPS0 PTCKPS1 PTCKPS0 PTMOD1 PTMOD0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-4 PTOPS<3:0>: PWM Time Base Output Postscale Select bits

0000 = 1:1 Postscale

0001 = 1:2 Postscale

1111 = 1:16 Postscale

bit 3-2 PTCKPS<1:0>: PWM Time Base Input Clock Prescale Select bits

00 = PWM time base input clock is FOSC/4 (1:1 prescale)

01 = PWM time base input clock is FOSC/16 (1:4 prescale)

10 = PWM time base input clock is FOSC/64 (1:16 prescale)

11 = PWM time base input clock is FOSC/256 (1:64 prescale)

bit 1-0 PTMOD<1:0>: PWM Time Base Mode Select bits

11 = PWM time base operates in a Continuous Up/Down Count mode with interrupts for double PWM

updates

10 = PWM time base operates in a Continuous Up/Down Count mode

01 = PWM time base configured for Single-Shot mode

00 = PWM time base operates in a Free-Running mode

R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0

PTEN PTDIR — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 PTEN: PWM Time Base Timer Enable bit

1 = PWM time base is on

0 = PWM time base is off

bit 6 PTDIR: PWM Time Base Count Direction Status bit

1 = PWM time base counts down

0 = PWM time base counts up

bit 5-0 Unimplemented: Read as ‘0’

 2010 Microchip Technology Inc. DS39616D-page 179

PIC18F2331/2431/4331/4431

U-0 R/W-1(1) R/W-1(1) R/W-1(1) R/W-0 R/W-0 R/W-0 R/W-0

— PWMEN2 PWMEN1 PWMEN0 PMOD3(3) PMOD2 PMOD1 PMOD0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6-4 PWMEN<2:0>: PWM Module Enable bits(1)

111 = All odd PWM I/O pins are enabled for PWM output(2)

110 = PWM1, PWM3 pins are enabled for PWM output

101 = All PWM I/O pins are enabled for PWM output(2)

100 = PWM0, PWM1, PWM2, PWM3, PWM4 and PWM5 pins are enabled for PWM output

011 = PWM0, PWM1, PWM2 and PWM3 I/O pins are enabled for PWM output

010 = PWM0 and PWM1 pins are enabled for PWM output

001 = PWM1 pin is enabled for PWM output

000 = PWM module is disabled; all PWM I/O pins are general purpose I/O

bit 3-0 PMOD<3:0>: PWM Output Pair Mode bits

For PMOD0:

1 = PWM I/O pin pair (PWM0, PWM1) is in the Independent mode

0 = PWM I/O pin pair (PWM0, PWM1) is in the Complementary mode

For PMOD1:

1 = PWM I/O pin pair (PWM2, PWM3) is in the Independent mode

0 = PWM I/O pin pair (PWM2, PWM3) is in the Complementary mode

For PMOD2:

1 = PWM I/O pin pair (PWM4, PWM5) is in the Independent mode

0 = PWM I/O pin pair (PWM4, PWM5) is in the Complementary mode

For PMOD3:(3)

1 = PWM I/O pin pair (PWM6, PWM7) is in the Independent mode

0 = PWM I/O pin pair (PWM6, PWM7) is in the Complementary mode

Note 1: Reset condition of the PWMEN bits depends on the PWMPIN Configuration bit.

2: When PWMEN<2:0> = 101, PWM<5:0> outputs are enabled for PIC18F2331/2431 devices; PWM<7:0>

outputs are enabled for PIC18F4331/4431 devices.

When PWMEN<2:0> = 111, PWM Outputs 1, 3 and 5 are enabled in PIC18F2331/2431 devices; PWM

Outputs 1, 3, 5 and 7 are enabled in PIC18F4331/4431 devices.

3: Unimplemented in PIC18F2331/2431 devices; maintain these bits clear.

PIC18F2331/2431/4331/4431

DS39616D-page 180  2010 Microchip Technology Inc.

18.3.1 FREE-RUNNING MODE

In the Free-Running mode, the PWM Time Base regis-

ters (PTMRL and PTMRH) will begin counting upwards

until the value in the PWM Time Base Period register,

PTPER (PTPERL and PTPERH), is matched. The

PTMR registers will be reset on the following input

clock edge and the time base will continue counting

upwards as long as the PTEN bit remains set.

18.3.2 SINGLE-SHOT MODE

In the Single-Shot mode, the PWM time base will begin

counting upwards when the PTEN bit is set. When the

value in the PTMR register matches the PTPER regis-

ter, the PTMR register will be reset on the following

input clock edge and the PTEN bit will be cleared by the

hardware to halt the time base.

18.3.3 CONTINUOUS UP/DOWN COUNT

MODES

In Continuous Up/Down Count modes, the PWM time

base counts upwards until the value in the PTPER

following input clock edge, the timer counts

downwards. The PTDIR bit in the PTCON1 register is

read-only and indicates the counting direction. The

PTDIR bit is set when the timer counts downwards.

18.3.4 PWM TIME BASE PRESCALER

The input clock to PTMR (FOSC/4) has prescaler

options of 1:1, 1:4, 1:16 or 1:64. These are selected by

control bits, PTCKPS<1:0>, in the PTCON0 register.

The prescaler counter is cleared when any of the

following occurs:

• Write to the PTMR register

• Write to the PTCON (PTCON0 or PTCON1)

• Any device Reset

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

SEVOPS3 SEVOPS2 SEVOPS1 SEVOPS0 SEVTDIR — UDIS OSYNC

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-4 SEVOPS<3:0>: PWM Special Event Trigger Output Postscale Select bits

0000 = 1:1 Postscale

0001 = 1:2 Postscale

1111 = 1:16 Postscale

bit 3 SEVTDIR: Special Event Trigger Time Base Direction bit

1 = A Special Event Trigger will occur when the PWM time base is counting downwards

0 = A Special Event Trigger will occur when the PWM time base is counting upwards

bit 2 Unimplemented: Read as ‘0’

bit 1 UDIS: PWM Update Disable bit

1 = Updates from Duty Cycle and Period Buffer registers are disabled

0 = Updates from Duty Cycle and Period Buffer registers are enabled

bit 0 OSYNC: PWM Output Override Synchronization bit

1 = Output overrides via the OVDCON register are synchronized to the PWM time base

0 = Output overrides via the OVDCON register are asynchronous

Note: Since the PWM compare outputs are

driven to the active state when the PWM

time base is counting downwards and

matches the duty cycle value, the PWM

outputs are held inactive during the first

half of the first period of the Continuous

Up/Down Count mode until PTMR begins

to count down from the PTPER value.

Note: The PTMR register is not cleared when

PTCONx is written.

 2010 Microchip Technology Inc. DS39616D-page 181

PIC18F2331/2431/4331/4431

Table 18-1 shows the minimum PWM frequencies that

can be generated with the PWM time base and the

prescaler. An operating frequency of 40 MHz

(FCYC = 10 MHz) and PTPER = 0xFFF is assumed in

the table. The PWM module must be capable of gener-

ating PWM signals at the line frequency (50 Hz or

60 Hz) for certain power control applications.

TABLE 18-1: MINIMUM PWM FREQUENCY

18.3.5 PWM TIME BASE POSTSCALER

The match output of PTMR can optionally be

postscaled through a 4-bit postscaler (which gives a

1:1 to 1:16 scaling inclusive) to generate an interrupt.

The postscaler counter is cleared when any of the

following occurs:

• Write to the PTMR register

• Write to the PTCON register

• Any device Reset

The PTMR register is not cleared when PTCON is

written.

18.4 PWM Time Base Interrupts

The PWM timer can generate interrupts based on the

modes of operation selected by the PTMOD<1:0> bits

and the postscaler bits (PTOPS<3:0>).

18.4.1 INTERRUPTS IN FREE-RUNNING

MODE

When the PWM time base is in the Free-Running mode

(PTMOD<1:0> = 00), an interrupt event is generated

each time a match with the PTPER register occurs. The

PTMR register is reset to zero in the following clock edge.

Using a postscaler selection other than 1:1 will reduce

the frequency of interrupt events.

FIGU RE 18-5: PWM T IME BASE IN TE RRUPT TIM IN G, FREE -RUN NING MODE

Minimum PWM Frequencies vs. Prescaler Value

for FCYC = 10 MIPS (PTPER = 0FFFh)

Prescale PWM Frequency

Edge-Aligned PWM Frequency

Center-Aligned

1:1 2441 Hz 1221 Hz

1:4 610 Hz 305 Hz

1:16 153 Hz 76 Hz

1:64 38 Hz 19 Hz

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

FOSC/4

PTMR_INT_REQ

FFEh FFFh 000h 001h 002h

PTIF bit

Note 1: PWM Time Base Period register, PTPER, is loaded with the value, FFFh, for this example.

QcQc Qc QcQcQc Qc Qc QcQc Qc Qc QcQc Qc Qc QcQc Qc Qc

PTIF bit

PTMR FFEh FFFh 001h 002h

A: PRESCALER = 1:1

B: PRESCALER = 1:4

PTMR

PTMR_INT_REQ

000h

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DS39616D-page 182  2010 Microchip Technology Inc.

18.4.2 INTERRUPTS IN SINGLE-SHOT

MODE

When the PWM time base is in the Single-Shot mode

(PTMOD<1:0> = 01), an interrupt event is generated

when a match with the PTPER register occurs. The

PWM Time Base register (PTMR) is reset to zero on

the following input clock edge and the PTEN bit is

cleared. The postscaler selection bits have no effect in

this Timer mode.

18.4.3 INTERRUPTS IN CONTINUOUS

UP/DOWN COUNT MODE

In the Continuous Up/Down Count mode

(PTMOD<1:0> = 10), an interrupt event is generated

each time the value of the PTMR register becomes

zero and the PWM time base begins to count upwards.

The postscaler selection bits may be used in this mode

of the timer to reduce the frequency of the interrupt

events. Figure 18-7 shows the interrupts in Continuous

Up/Down Count mode.

FIGU RE 18 -6: PWM T IME BA SE IN TERR UPT T IM ING , SING LE-SH OT MOD E

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

FOSC/4

PTMR FFEh FFFh 000h 000h 000h

PTIF bit

Note 1: Interrupt flag bit, PTIF, is sampled here (every Q1).

2: PWM Time Base Period register, PTPER, is loaded with the value, FFFh, for this example.

QcQc Qc QcQcQc Qc Qc QcQc Qc Qc QcQc Qc Qc QcQc Qc Qc

PTMR FFEh FFFh 000h 000h

A: PRESCALER = 1:1

B: PRESCALER = 1:4

PTMR_INT_REQ

Q4Q4

PTIF bit

PTMR_INT_REQ

000h

 2010 Microchip Technology Inc. DS39616D-page 183

PIC18F2331/2431/4331/4431

FIGU RE 18-7: PWM TIME BA SE INTERRUPT , C ONT IN UOU S U P /D OWN CO U NT MO DE

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

FOSC/4

PTMR 002h 001h 000h 001h 002h

Note 1: Interrupt flag bit, PTIF, is sampled here (every Q1).

QcQc Qc QcQcQc Qc Qc QcQc Qc Qc QcQc Qc Qc QcQc Qc Qc

PTMR 002h 001h 001h 002h

PTDIR bit

A: PRESCALER = 1:1

B: PRESCALER = 1:4

PTIF bit

PTMR_INT_REQ

PTDIR bit

Q4Q4

PTIF bit

PTMR_INT_REQ

1111

000h

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DS39616D-page 184  2010 Microchip Technology Inc.

18.4.4 INTERRUPTS IN DOUBLE UPDATE

MODE

This mode is available in Continuous Up/Down Count

mode. In the Double Update mode (PTMOD<1:0> = 11),

an interrupt event is generated each time the PTMR

matches with PTPER register. Figure 18-8 shows the

interrupts in Continuous Up/Down Count mode with

double updates.

The Double Update mode provides two additional

functions to the user in Center-Aligned mode.

1. The control loop bandwidth is doubled because

the PWM duty cycles can be updated twice per

period.

2. Asymmetrical center-aligned PWM waveforms

can be generated, which are useful for

minimizing output waveform distortion in certain

motor control applications.

FIGU RE 18 -8: PWM T IME BA SE IN TERR UPT, CONTIN UOU S UP/DO WN COU NT MODE WI TH

DOUBLE UPDATES

Note: Do not change the PTMOD bits while

PTEN is active; it will yield unexpected

results. To change the PWM Timer mode

of operation, first clear the PTEN bit, load

the PTMOD bits with the required data

and then set PTEN.

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

OSC1

PTMR 3FDh 3FEh 3FFh 3FEh 3FDh

Case 1: PTMR Counting Upwards

Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

OSC1

PTMR 002h 001h 000h 001h 002h

Case 2: PTMR Counting Downwards

Note 1: Interrupt flag bit, PTIF, is sampled here (every Q1).

2: PWM Time Base Period register, PTPER, is loaded with the value, 3FFh, for this example.

PTIF bit

PTMR_INT_REQ

PTIF bit

PTMR_INT_REQ

A: PRESCALER = 1:1

PTDIR bit

 2010 Microchip Technology Inc. DS39616D-page 185

PIC18F2331/2431/4331/4431

18.5 PWM Period

The PWM period is defined by the PTPER register pair

(PTPERL and PTPERH). The PWM period has 12-bit

resolution by combining 4 LSBs of PTPERH and 8 bits

of PTPERL. PTPER is a double-buffered register used

to set the counting period for the PWM time base.

The PTPER register contents are loaded into the

PTPER register at the following times:

• Free-Running and Single-Shot modes: When the

PTMR register is reset to zero after a match with

the PTPER register.

• Continuous Up/Down Count modes: When the

PTMR register is zero. The value held in the

PTPER register is automatically loaded into the

PTPER register when the PWM time base is

disabled (PTEN = 0). Figure 18-9 and

Figure 18-10 indicate the times when the contents

of the PTPER register are loaded into the actual

PTPER register.

The PWM period can be calculated from the following

formulas:

EQUATION 18-1: PWM PERIOD FOR

FREE-RUNNING MODE

EQUATION 18-2: PWM PERIOD FOR

UP/DOWN COUNT MODE

The PWM frequency is the inverse of period; or:

EQUATION 18-3: PWM FREQUENCY

The maximum resolution (in bits) for a given device

oscillator and PWM frequency can be determined from

the following formula:

EQUATION 18-4: PWM RESOLUTION

The PWM resolutions and frequencies are shown for a

selection of execution speeds and PTPER values in

Table 18-2. The PWM frequencies in Tabl e 1 8-2 are

calculated for Edge-Aligned PWM mode. For

Center-Aligned mode, the PWM frequencies will be

approximately one-half the values indicated in this

table.

TABLE 18-2: EXAMPLE PWM FREQUENCIES

AND RESOLUTIONS

TPWM = (PTPER + 1) x PTMRPS

FOSC/4

TPWM = (2 x PTPER) x PTMRPS

FOSC

PWM Frequency = 1

PWM Period

PWM Frequenc y = 1/TPWM

FOSC MIPS PTPER

Value PWM

Resolution PWM

Frequency

40 MHz 10 0FFFh 14 bits 2.4 kHz

40 MHz 10 07FFh 13 bits 4.9 kHz

40 MHz 10 03FFh 12 bits 9.8 kHz

40 MHz 10 01FFh 11 bits 19.5 kHz

40 MHz 10 FFh 10 bits 39.0 kHz

40 MHz 10 7Fh 9 bits 78.1 kHz

40 MHz 10 3Fh 8 bits 156.2 kHz

40 MHz 10 1Fh 7 bits 312.5 kHz

40 MHz 10 0Fh 6 bits 625 kHz

25 MHz 6.25 0FFFh 14 bits 1.5 kHz

25 MHz 6.25 03FFh 12 bits 6.1 kHz

25 MHz 6.25 FFh 10 bits 24.4 kHz

10 MHz 2.5 0FFFh 14 bits 610 Hz

10 MHz 2.5 03FFh 12 bits 2.4 kHz

10 MHz 2.5 FFh 10 bits 9.8 kHz

5 MHz 1.25 0FFFh 14 bits 305 Hz

5 MHz 1.25 03FFh 12 bits 1.2 kHz

5 MHz 1.25 FFh 10 bits 4.9 kHz

4 MHz 1 0FFFh 14 bits 244 Hz

4 MHz 1 03FFh 12 bits 976 Hz

4 MHz 1 FFh 10 bits 3.9 kHz

Note: For center-aligned operation, PWM frequencies

will be approximately 1/2 the value indicated in

the table.

Resolution = log(2)

log FOSC

FPWM

PIC18F2331/2431/4331/4431

DS39616D-page 186  2010 Microchip Technology Inc.

FIGURE 18-9: PWM PERIOD BUFFER UPDATES IN FREE-RUNNING MODE

FIGURE 18-10: PWM PERIOD BUFFER UPDATES IN CONTINUOUS UP/DOWN COUNT MODE

Old PTPER Value = 004

New PTPER Value = 007

Period Value Loaded from PTPER Register

New Value Written to PTPER Register

Old PTPER Value = 004

New PTPER Value = 007

Period Value Loaded from PTPER Register

New Value Written to PTPER Register

 2010 Microchip Technology Inc. DS39616D-page 187

PIC18F2331/2431/4331/4431

18.6 PWM Duty Cycle

PWM duty cycle is defined by the PDCx (PDCxL and

PDCxH) registers. There are a total of four PWM Duty

Cycle registers for four pairs of PWM channels. The

Duty Cycle registers have 14-bit resolution by combin-

ing six LSbs of PDCxH with the 8 bits of PDCxL. PDCx

is a double-buffered register used to set the counting

period for the PWM time base.

18.6.1 PWM DUTY CYCLE REGISTERS

There are four 14-bit Special Function Registers used

to specify duty cycle values for the PWM module:

• PDC0 (PDC0L and PDC0H)

• PDC1 (PDC1L and PDC1H)

• PDC2 (PDC2L and PDC2H)

• PDC3 (PDC3L and PDC3H)

The value in each Duty Cycle register determines the

amount of time that the PWM output is in the active

state. The upper 12 bits of PDCx holds the actual duty

cycle value from PTMRH/L<11:0>, while the lower

2 bits control which internal Q clock the duty cycle

match will occur. This 2-bit value is decoded from the Q

clocks as shown in Figure 18-11 (when the prescaler is

1:1 or PTCKPS<1:0> = 00).

In Edge-Aligned mode, the PWM period starts at Q1

and ends when the Duty Cycle register matches the

PTMR register as follows. The duty cycle match is con-

sidered when the upper 12 bits of the PDCx are equal

to the PTMR and the lower 2 bits are equal to Q1, Q2,

Q3 or Q4, depending on the lower two bits of the PDCx

(when the prescaler is 1:1 or PTCKPS<1:0> = 00).

Each compare unit has logic that allows override of the

PWM signals. This logic also ensures that the PWM

signals will complement each other (with dead-time

insertion) in Complementary mode (see Section 18.7

“Dead-Time Generators”).

FIGURE 18-11: DUTY CYCLE COMPARISON

Note: When the prescaler is not 1:1

(PTCKPS<1:0>  ~00), the duty cycle

match occurs at the Q1 clock of the

instruction cycle when the PTMR and

PDCx match occurs.

PTMR<11:0>

PDCx<13:0>

Comparator

Unused

PTMRH<7:0> PTMRL<7:0>

PTMRH<3:0> PTMRL<7:0> Q Clocks(1)

PDCxH<7:0> PDCxL<7:0>

PDCxH<5:0> PDCxL<7:0>

<1:0>

Note 1: This value is decoded from the Q clocks:

00 = duty cycle match occurs on Q1

01 = duty cycle match occurs on Q2

10 = duty cycle match occurs on Q3

11 = duty cycle match occurs on Q4

PIC18F2331/2431/4331/4431

DS39616D-page 188  2010 Microchip Technology Inc.

18.6.2 DUTY CYCLE REGISTER BUFFERS

The four PWM Duty Cycle registers are

double-buffered to allow glitchless updates of the PWM

outputs. For each duty cycle block, there is a Duty

Cycle Buffer register that is accessible by the user and

a second Duty Cycle register that holds the actual

compare value used in the present PWM period.

In Edge-Aligned PWM Output mode, a new duty cycle

value will be updated whenever a PTMR match with the

PTPER register occurs and PTMR is reset as shown in

Figure 18-12. Also, the contents of the duty cycle buffers

are automatically loaded into the Duty Cycle registers

when the PWM time base is disabled (PTEN = 0).

When the PWM time base is in the Continuous

Up/Down Count mode, new duty cycle values will be

updated when the value of the PTMR register is zero

and the PWM time base begins to count upwards. The

contents of the duty cycle buffers are automatically

loaded into the Duty Cycle registers when the PWM

time base is disabled (PTEN = 0). Figure 18-13 shows

the timings when the duty cycle update occurs for the

Continuous Up/Down Count mode. In this mode, up to

one entire PWM period is available for calculating and

loading the new PWM duty cycle before changes take

effect.

When the PWM time base is in the Continuous

Up/Down Count mode with double updates, new duty

cycle values will be updated when the value of the

PTMR register is zero and when the value of the PTMR

contents of the duty cycle buffers are automatically

loaded into the Duty Cycle registers during both of the

previously described conditions. Figure 18-14 shows

the duty cycle updates for Continuous Up/Down Count

mode with double updates. In this mode, only up to half

of a PWM period is available for calculating and loading

the new PWM duty cycle before changes take effect.

18.6.3 EDGE-ALIGNED PWM

Edge-aligned PWM signals are produced by the

module when the PWM time base is in the

Free-Running mode or the Single-Shot mode. For

edge-aligned PWM outputs, the output for a given

PWM channel has a period specified by the value

loaded in PTPER and a duty cycle specified by the

appropriate Duty Cycle register (see Figure 18-12).

The PWM output is driven active at the beginning of the

period (PTMR = 0) and is driven inactive when the

value in the Duty Cycle register matches PTMR. A new

cycle is started when PTMR matches the PTPER as

explained in the PWM period section.

If the value in a particular Duty Cycle register is zero,

then the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the Duty Cycle register is greater

than the value held in the PTPER register.

FIGURE 18- 12: EDGE-ALIGNED PWM

FIGURE 18-13: DUTY CYCLE UPDATE TIMES IN CONTINUOUS UP/DOWN COUNT MODE

Period

Duty Cycle

PTPER

PTMR

Value

New Duty Cycle Latched

Active at

of Period

Beginning

PDCx

(new)

(old)

PTMR Value

PWM Output

Duty Cycle Value Loaded from Buffer Register

New Value Written to Duty Cycle Buffer

 2010 Microchip Technology Inc. DS39616D-page 189

PIC18F2331/2431/4331/4431

FIGURE 18-14: DUTY CYCLE UPDATE TIMES IN CONTINUOUS UP/DOWN COUNT MODE WITH

DOUBLE UPDATES

18.6.4 CENTER-ALIGNED PWM

Center-aligned PWM signals are produced by the

module when the PWM time base is configured in a

Continuous Up/Down Count mode (see Figure 18-15).

The PWM compare output is driven to the active state

when the value of the Duty Cycle register matches the

value of PTMR and the PWM time base is counting

downwards (PTDIR = 1). The PWM compare output

will be driven to the inactive state when the PWM time

base is counting upwards (PTDIR = 0) and the value in

the PTMR register matches the duty cycle value. If the

value in a particular Duty Cycle register is zero, then

the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the

output on the PWM pin will be active for the entire PWM

period if the value in the Duty Cycle register is equal to

or greater than the value in the PTPER register.

FIGU RE 18-15: START OF C ENT ER - AL I GNED P WM

PTMR Value

PWM Output

Duty Cycle Value Loaded from Buffer Register

New Values Written to Duty Cycle Buffer

Note: When the PWM is started in

Center-Aligned mode, the PWM Time

Base Period register (PTPER) is loaded

into the PWM Time Base register (PTMR)

and the PTMR is configured automatically

to start down counting. This is done to

ensure that all the PWM signals don’t start

at the same time.

PTPER

PTMR

Value

Period

Period/2

Duty

Cycle

Start of

First

PWM

Period

Duty Cycle

PIC18F2331/2431/4331/4431

DS39616D-page 190  2010 Microchip Technology Inc.

18.6.5 COMPLEMENTARY PWM

OPERATION

The Complementary mode of PWM operation is useful

to drive one or more power switches in half-bridge

configuration as shown in Figure 18-16. This inverter

topology is typical for a 3-phase induction motor,

brushless DC motor or a 3-phase Uninterruptible

Power Supply (UPS) control applications.

Each upper/lower power switch pair is fed by a

complementary PWM signal. Dead time may be

optionally inserted during device switching, where both

outputs are inactive for a short period (see

Section 18.7 “Dead-Time Generators”).

In Complementary mode, the duty cycle comparison

units are assigned to the PWM outputs as follows:

• PDC0 register controls PWM1/PWM0 outputs

• PDC1 register controls PWM3/PWM2 outputs

• PDC2 register controls PWM5/PWM4 outputs

• PDC3 register controls PWM7/PWM6 outputs

PWM1/3/5/7 are the main PWMs that are controlled by

the PDCx registers and PWM0/2/4/6 are the

complemented outputs. When using the PWMs to

control the half bridge, the odd numbered PWMs can

be used to control the upper power switch and the even

numbered PWMs used for the lower switches.

FIGURE 18-16: TYPICAL LOAD FOR

COMPLEMEN T ARY PWM

OUTPUTS

The Complementary mode is selected for each PWM

I/O pin pair by clearing the appropriate PMODx bit in

the PWMCON0 register. The PWM I/O pins are set to

Complementary mode by default upon all kinds of

device Resets.

PWM1

PWM0

PWM3

PWM2

PWM5

PWM4

3-Phase

Load

 2010 Microchip Technology Inc. DS39616D-page 191

PIC18F2331/2431/4331/4431

18.7 Dead-Time Generators

In power inverter applications, where the PWMs are

used in Complementary mode to control the upper and

lower switches of a half-bridge, a dead-time insertion is

highly recommended. The dead-time insertion keeps

both outputs in inactive state for a brief time. This

avoids any overlap in the switching during the state

change of the power devices due to TON and TOFF

characteristics.

Because the power output devices cannot switch

instantaneously, some amount of time must be pro-

vided between the turn-off event of one PWM output in

a complementary pair and the turn-on event of the

other transistor. The PWM module allows dead time to

be programmed. The following sections explain the

dead-time block in detail.

18.7.1 DEAD-TIME INSERTION

Each complementary output pair for the PWM module

has a 6-bit down counter used to produce the

dead-time insertion. As shown in Figure 18-17, each

dead-time unit has a rising and falling edge detector

connected to the duty cycle comparison output. The

dead time is loaded into the timer on the detected PWM

edge event. Depending on whether the edge is rising or

falling, one of the transitions on the complementary

outputs is delayed until the timer counts down to zero.

A timing diagram, indicating the dead-time insertion for

one pair of PWM outputs, is shown in Figure 18-18.

FIGU RE 18-17: DEAD- T I ME CONT R OL UN IT BLO CK D I AGRA M F OR O N E PWM OUT PUT PAI R

FIGURE 18-18: DEAD-TI ME IN SERTION FOR COMPLEMEN TARY PWM

Even PWM Signal to

Output Control Block

Odd PWM Signal to

Output Control Block

Zero Compare

Clock Control

and Prescaler 6-Bit Down Counter

Duty Cycle

Compare Input

Dead Time

Prescale

FOSC

Dead Time

Select Bits

Dead-Time Register

PDC1

Compare

Output

PWM1

PWM0

PIC18F2331/2431/4331/4431

DS39616D-page 192  2010 Microchip Technology Inc.

18.7.2 DEAD-TIME RANGES

The amount of dead time provided by the dead-time

unit is selected by specifying the input clock prescaler

value and a 6-bit unsigned value defined in the DTCON

been provided to allow a suitable range of dead times

based on the device operating frequency. FOSC/2,

FOSC/4, FOSC/8 and FOSC/16 are the clock prescaler

options available using the DTPS<1:0> control bits in

the DTCON register.

After selecting an appropriate prescaler value, the

dead time is adjusted by loading a 6-bit unsigned value

into DTCON<5:0>. The dead-time unit prescaler is

cleared on any of the following events:

• On a load of the down timer due to a duty cycle

comparison edge event;

• On a write to the DTCON register; or

• On any device Reset.

18.7.3 DECREMENTING THE DEAD-TIME

COUNTER

The dead-time counter is clocked from any of the Q

clocks based on the following conditions.

1. The dead-time counter is clocked on Q1 when:

• The DTPS bits are set to any of the following

dead-time prescaler settings: FOSC/4,

FOSC/8, FOSC/16

• The PWM Time Base Prescale bits

(PTCKPS) are set to any of the following

prescale ratios: FOSC/16, FOSC/64, FOSC/256

2. The dead-time counter is clocked by a pair of Q

clocks when the PWM Time Base Prescale bits

are set to 1:1 (PTCKPS<1:0> = 00, FOSC/4) and

the dead-time counter is clocked by the FOSC/2

(DTPS<1:0> = 00).

3. The dead-time counter is clocked using every

other Q clock, depending on the two LSbs in the

Duty Cycle registers:

• If the PWM duty cycle match occurs on Q1 or

Q3, then the dead-time counter is clocked

using every Q1 and Q3.

• If the PWM duty cycle match occurs on Q2 or

Q4, then the dead-time counter is clocked

using every Q2 and Q4.

4. When the DTPS<1:0> bits are set to any of the

other dead-time prescaler settings (i.e., FOSC/4,

FOSC/8 or FOSC/16) and the PWM time base

prescaler is set to 1:1, the dead-time counter is

clocked by the Q clock corresponding to the Q

clocks on which the PWM duty cycle match

occurs.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

DTPS1 DTPS0 DT5 DT4 DT3 DT2 DT1 DT0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 DTPS<1:0>: Dead-Time Unit A Prescale Select bits

11 = Clock source for dead-time unit is FOSC/16

10 = Clock source for dead-time unit is FOSC/8

01 = Clock source for dead-time unit is FOSC/4

00 = Clock source for dead-time unit is FOSC/2

bit 5-0 DT<5:0>: Unsigned 6-Bit Dead-Time Value for Dead-Time Unit bits

 2010 Microchip Technology Inc. DS39616D-page 193

PIC18F2331/2431/4331/4431

The actual dead time is calculated from the DTCON

Dead Time = Dead-Time Value/(FOSC/Prescaler)

Table 18-3 shows example dead-time ranges as a

function of the input clock prescaler selected and the

device operating frequency.

TABLE 18-3: EXAMPLE DEAD-TIME

RANGES

18.7.4 DEAD-TIME DISTORTION

18.8 Independent PWM Output

Independent PWM mode is used for driving the loads

(as shown in Figure 18-19) for driving one winding of a

switched reluctance motor. A particular PWM output

pair is configured in the Independent Output mode

when the corresponding PMOD bit in the PWMCON0

between the PWM I/O pins when the module is operat-

ing in the Independent PWM mode and both I/O pins

are allowed to be active simultaneously. This mode can

also be used to drive stepper motors.

18.8.1 DUTY CYCLE ASSIGNMENT IN THE

INDEPENDENT PWM MODE

In the Independent PWM mode, each duty cycle gener-

ator is connected to both PWM output pins in a given

PWM output pair. The odd and even PWM output pins

are driven with a single PWM duty cycle generator.

PWM1 and PWM0 are driven by the PWM channel

which uses the PDC0 register to set the duty cycle,

PWM3 and PWM2 with PDC1, PWM5 and PWM4 with

PDC2, and PWM7 and PWM6 with PDC3 (see

Figure 18-3 and Register 18-4).

FOSC

(MHz) MIPS Prescaler

Selection Dead-Time

Min Dead-Time

Max

40 10 FOSC/2 50 ns 3.2 s

40 10 FOSC/4 100 ns 6.4 s

40 10 FOSC/8 200 ns 12.8 s

40 10 FOSC/16 400 ns 25.6 s

32 8 FOSC/2 62.5 ns 4 s

32 8 FOSC/4 125 ns 8 s

32 8 FOSC/8 250 ns 16 s

32 8 FOSC/16 500 ns 32 s

25 6.25 FOSC/2 80 ns 5.12 s

25 6.25 FOSC/4 160 ns 10.2 s

25 6.25 FOSC/8 320 ns 20.5 s

25 6.25 FOSC/16 640 ns 41 s

20 5 FOSC/2 100 ns 6.4 s

20 5 FOSC/4 200 ns 12.8 s

20 5 FOSC/8 400 ns 25.6 s

20 5 FOSC/16 800 ns 51.2 s

10 2.5 FOSC/2 200 ns 12.8 s

10 2.5 FOSC/4 400 ns 25.6 s

10 2.5 FOSC/8 800 ns 51.2 s

10 2.5 FOSC/16 1.6 s 102.4 s

51.25FOSC/2 400 ns 25.6 s

51.25FOSC/4 800 ns 51.2 s

51.25F

OSC/8 1.6 s 102.4 s

51.25FOSC/16 3.2 s 204.8 s

41F

OSC/2 0.5 s32 s

41F

OSC/4 1 s64 s

41FOSC/8 2 s 128 s

41F

OSC/16 4 s 256 s

Note 1: For small PWM duty cycles, the ratio of

dead time to the active PWM time may

become large. In this case, the inserted

dead time will introduce distortion into

waveforms produced by the PWM

module. The user can ensure that

dead-time distortion is minimized by

keeping the PWM duty cycle at least

three times larger than the dead time. A

similar effect occurs for duty cycles at or

near 100%. The maximum duty cycle

used in the application should be chosen

such that the minimum inactive time of

the signal is at least three times larger

than the dead time. If the dead time is

greater or equal to the duty cycle of one

of the PWM output pairs, then that PWM

pair will be inactive for the whole period.

2: Changing the dead-time values in

DTCON when the PWM is enabled may

result in an undesired situation. Disable

the PWM (PTEN = 0) before changing

the dead-time value

PIC18F2331/2431/4331/4431

DS39616D-page 194  2010 Microchip Technology Inc.

18.8.2 PWM CHANNEL OVERRIDE

PWM output may be manually overridden for each

PWM channel by using the appropriate bits in the

OVDCOND and OVDCONS registers. The user may

select the following signal output options for each PWM

output pin operating in the Independent PWM mode:

• I/O pin outputs PWM signal

• I/O pin inactive

• I/O pin active

Refer to Section 18.10 “PWM Output Override” for

details for all the override functions.

FIGU RE 18-19: CENTER C ONN E CTE D

LOAD

18.9 Single-Pulse PWM Operation

The single-pulse PWM operation is available only in

Edge-Aligned mode. In this mode, the PWM module

will produce single-pulse output. Single-pulse

operation is configured when the PTMOD<1:0> bits are

set to ‘01’ in the PTCON0 register. This mode of

operation is useful for driving certain types of ECMs.

In Single-Pulse mode, the PWM I/O pin(s) are driven to

the active state when the PTEN bit is set. When the

PWM timer match with the Duty Cycle register occurs,

the PWM I/O pin is driven to the inactive state. When

the PWM timer match with the PTPER register occurs,

the PTMR register is cleared, all active PWM I/O pins

are driven to the inactive state, the PTEN bit is cleared

and an interrupt is generated if the corresponding

interrupt bit is set.

18.10 PWM Output Override

The PWM output override bits allow the user to manu-

ally drive the PWM I/O pins to specified logic states,

independent of the duty cycle comparison units. The

PWM override bits are useful when controlling various

types of ECMs like a BLDC motor.

OVDCOND and OVDCONS registers are used to

define the PWM override options. The OVDCOND

determine which PWM I/O pins will be overridden. The

OVDCONS register contains eight bits, POUT<7:0>,

that determine the state of the PWM I/O pins when a

particular output is overridden via the POVD bits.

The POVD bits are active-low control bits. When the

POVD bits are set, the corresponding POUT bit will

have no effect on the PWM output. In other words, the

pins corresponding to POVD bits that are set will have

the duty PWM cycle set by the PDCx registers. When

one of the POVD bits is cleared, the output on the cor-

responding PWM I/O pin will be determined by the

state of the POUT bit. When a POUT bit is set, the

PWM pin will be driven to its active state. When the

POUT bit is cleared, the PWM pin will be driven to its

inactive state.

18.10.1 COMPLEMENTARY OUTPUT MODE

The even numbered PWM I/O pins have override

restrictions when a pair of PWM I/O pins are operating

in the Complementary mode (PMODx = 0). In Comple-

mentary mode, if the even numbered pin is driven

active by clearing the corresponding POVD bit and by

setting POUT bits in the OVDCOND and OVDCONS

registers, the output signal is forced to be the comple-

ment of the odd numbered I/O pin in the pair (see

Figure 18-2 for details).

18.10.2 OVERRIDE SYNCHRONIZATION

If the OSYNC bit in the PWMCON1 register is set, all

output overrides performed via the OVDCOND and

OVDCONS registers will be synchronized to the PWM

time base. Synchronous output overrides will occur on

the following conditions:

• When the PWM is in Edge-Aligned mode,

synchronization occurs when PTMR is zero.

• When the PWM is in Center-Aligned mode,

synchronization occurs when PTMR is zero and

when the value of PTMR matches PTPER.

Note: PTPER and PDCx values are held as they

are after the single-pulse output. To have

another cycle of single pulse, only PTEN

has to be enabled.

PWM1

PWM0

Load

Note 1: In the Complementary mode, the even

channel cannot be forced active by a

Fault or override event when the odd

channel is active. The even channel is

always the complement of the odd

channel with dead time inserted, before

the odd channel can be driven to its

active state, as shown in Figure 18-20.

2: Dead time is inserted in the PWM

channels even when they are in Override

mode.

 2010 Microchip Technology Inc. DS39616D-page 195

PIC18F2331/2431/4331/4431

FIGU RE 18 - 20: PWM O VER RI DE BI TS IN C OMP LE MEN TARY MODE

1. Even override bits have no effect in Complementary mode.

2. Odd override bit is activated, which causes the even PWM to deactivate.

3. Dead-time insertion.

4. Odd PWM activated after the dead time.

5. Odd override bit is deactivated, which causes the odd PWM to deactivate.

6. Dead-time insertion.

7. Even PWM is activated after the dead time.

POUT0

POUT1

PWM1

PWM0

Assume: POVD0 = 0; POVD1 = 0; PMOD0 = 0

PIC18F2331/2431/4331/4431

DS39616D-page 196  2010 Microchip Technology Inc.

18.10.3 OUTPUT OVERRIDE EXAMPLES

Figure 18-21 shows an example of a waveform that

might be generated using the PWM output override

feature. The figure shows a six-step commutation

sequence for a BLDC motor. The motor is driven

through a 3-phase inverter as shown in Figure 18-16.

When the appropriate rotor position is detected, the

PWM outputs are switched to the next commutation

state in the sequence. In this example, the PWM out-

puts are driven to specific logic states. The OVDCOND

and OVDCONS register values used to generate the

signals in Figure 18-21 are given in Table 18-4.

The PWM Duty Cycle registers may be used in con-

junction with the OVDCOND and OVDCONS registers.

The Duty Cycle registers control the average voltage

across the load and the OVDCOND and OVDCONS

registers control the commutation sequence.

Figure 18-22 shows the waveforms, while Tab le 18-4

and Table 18-5 show the OVDCOND and OVDCONS

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

POVD7(1) POVD6(1) POVD5 POVD4 POVD3 POVD2 POVD1 POVD0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 POVD<7:0>: PWM Output Override bits

1 = Output on PWM I/O pin is controlled by the value in the Duty Cycle register and the PWM time base

0 = Output on PWM I/O pin is controlled by the value in the corresponding POUT bit

Note 1: Unimplemented in PIC18F2331/2431 devices; maintain these bits clear.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

POUT7(1) POUT6(1) POUT5 POUT4 POUT3 POUT2 POUT1 POUT0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 POUT<7:0>: PWM Manual Output bits

1 = Output on PWM I/O pin is active when the corresponding PWM output override bit is cleared

0 = Output on PWM I/O pin is inactive when the corresponding PWM output override bit is cleared

Note 1: Unimplemented in PIC18F2331/2431 devices; maintain these bits clear.

2: With PWMs configured in Complementary mode, the output of even numbered PWM (PM0,2,4) will be

complementary of the output of odd PWM (PWM1,3,5), irrespective of the POUT bit setting.

 2010 Microchip Technology Inc. DS39616D-page 197

PIC18F2331/2431/4331/4431

FIGU RE 18-21: PWM OUTP U T O VE R RI DE

EXAMPLE #1

TABLE 18-4: PWM OUTPUT OVERRIDE

EXAMPL E #1

TABLE 18-5: PWM OUTPUT OVERRIDE

EXAMPL E #2

FIGURE 18 -22: PWM OUTPUT O VER RI DE

EXAMPLE #2

State OVDCOND (POVD) OVDCONS (POUT)

100000000b 00100100b

200000000b 00100001b

300000000b 00001001b

400000000b 00011000b

500000000b 00010010b

600000000b 00000110b

State OVDCOND (POVD) OVDCONS (POUT)

111000011b 00000000b

211110000b 00000000b

300111100b 00000000b

400001111b 00000000b

PWM5

PWM4

PWM3

PWM2

PWM1

PWM0

123456

PWM7

PWM6

PWM5

PWM4

PWM3

PWM2

1234

PWM1

PWM0

PIC18F2331/2431/4331/4431

DS39616D-page 198  2010 Microchip Technology Inc.

18.11 PWM Output and Polarity Control

There are three device Configuration bits associated

with the PWM module that provide PWM output pin

control defined in the CONFIG3L Configuration

•HPOL

•LPOL

•PWMPIN

These three Configuration bits work in conjunction with

the three PWM Enable bits (PWMEN<2:0>) in the

PWMCON0 register. The Configuration bits and PWM

enable bits ensure that the PWM pins are in the correct

states after a device Reset occurs.

18.11.1 OUTPUT PIN CONTROL

The PWMEN<2:0> control bits enable each PWM

output pin as required in the application.

All PWM I/O pins are general purpose I/O. When a pair

of pins are enabled for PWM output, the PORT and

TRIS registers controlling the pins are disabled. Refer

to Figure 18-23 for details.

18.11.2 OUTPUT POLARITY CONTROL

The polarity of the PWM I/O pins is set during device

programming via the HPOL and LPOL Configuration

bits in the CONFIG3L Configuration register. The

HPOL Configuration bit sets the output polarity for the

high side PWM outputs: PWM1, PWM3, PWM5 and

PWM7. The polarity is active-low when HPOL is

cleared (= 0), and active-high when it is set (= 1).

The LPOL Configuration bit sets the output polarity for

the low side PWM outputs: PWM0, PWM2, PWM4 and

PWM6. As with HPOL, they are active-low when LPOL

is cleared and active-high when it is set.

All output signals generated by the PWM module are

referenced to the polarity control bits, including those

generated by Fault inputs or manual override (see

Section 18.10 “PWM Output Override”).

The default polarity Configuration bits have the PWM

I/O pins in active-high output polarity.

FIGURE 18-23: PWM I/O PIN BLOCK DIAGRAM

Data Bus

WR PORT

WR TRIS

RD PORT

Data Latch

TRIS Latch

VSS

I/O Pin

VDD

RD TRIS Schmitt

Trigger

TTL or

PWM Pin Enable

PWM Signal from Module

Note: I/O pin has protection diodes to VDD and VSS. PWM polarity selection logic not shown for clarity.

 2010 Microchip Technology Inc. DS39616D-page 199

PIC18F2331/2431/4331/4431

18.11.3 PWM OUTPUT PIN RESET STATES

The PWMPIN Configuration bit determines the PWM

output pins to be PWM output pins or digital I/O pins,

after the device comes out of Reset. If the PWMPIN

Configuration bit is unprogrammed (default), the

PWMEN<2:0> control bits will be cleared on a device

Reset. Consequently, all PWM outputs will be tri-stated

and controlled by the corresponding PORT and TRIS

registers. If the PWMPIN Configuration bit is pro-

grammed low, the PWMEN<2:0> control bits will be

set, as follows, on a device Reset:

• PWMEN<2:0> = 101 if device has 8 PWM pins

(PIC18F4331/4431 devices)

• PWMEN<2:0> = 100 if device has 6 PWM pins

(PIC18F2331/2431 devices)

All PWM pins will be enabled for PWM output and will

have the output polarity defined by the HPOL and

LPOL Configuration bits.

18.12 PWM Fault Inputs

There are two Fault inputs associated with the PWM

module. The main purpose of the input Fault pins is to

disable the PWM output signals and drive them into an

inactive state. The action of the Fault inputs is

performed directly in hardware so that when a Fault

occurs, it can be managed quickly and the PWM

outputs are put into an inactive state to save the power

devices connected to the PWMs.

The PWM Fault inputs are FLTA and FLTB, which can

come from I/O pins, the CPU or another module. The

FLTA and FLTB pins are active-low inputs so it is easy to

“OR” many sources to the same input. FLTB and its asso-

ciated logic are not implemented on PIC18F2331/2431

devices.

The FLTCONFIG register (Register 18-8) defines the

settings of FLTA and FLTB inputs.

18.12.1 FAULT PIN ENABLE BITS

By setting the bits, FLTAEN and FLTBEN in the

FLTCONFIG register, the corresponding Fault inputs

are enabled. If both bits are cleared, then the Fault

inputs have no effect on the PWM module.

18.12.2 MFAULT INPUT MODES

The FLTAMOD and FLTBMOD bits in the FLTCONFIG

deactivated when they are overridden by Fault input.

The FLTAS and FLTBS bits in the FLTCONFIG register

give the status of Fault A and Fault B inputs.

Each of the Fault inputs have two modes of operation:

• Inactive Mode (FLTxMOD = 0)

This is a Catastrophic Fault Management mode.

When the Fault occurs in this mode, the PWM out-

puts are deactivated. The PWM pins will remain in

Inactivate mode until the Fault is cleared (Fault

input is driven high) and the corresponding Fault

Status bit has been cleared in software. The PWM

outputs are enabled immediately at the beginning

of the following PWM period, after the Fault Status

bit (FLTxS) is cleared.

• Cycle-by-Cycle Mode (FLTxMOD = 1)

When the Fault occurs in this mode, the PWM

outputs are deactivated. The PWM outputs will

remain in the defined Fault states (all PWM

outputs inactive) for as long as the Fault pin is held

low. After the Fault pin is driven high, the PWM

outputs will return to normal operation at the begin-

ning of the following PWM period and the FLTxS

bit is automatically cleared.

Note: The inactive state of the PWM pins are

dependent on the HPOL and LPOL Con-

figuration bit settings, which define the

active and inactive state for PWM outputs.

PIC18F2331/2431/4331/4431

DS39616D-page 200  2010 Microchip Technology Inc.

18.12.3 PWM OUTPUTS WHILE IN FAULT

CONDITION

While in the Fault state (i.e., one or both FLTA and

FLTB inputs are active), the PWM output signals are

driven into their inactive states. The selection of which

PWM outputs are deactivated (while in the Fault state)

is determined by the FLTCON bit in the FLTCONFIG

• FLTCON = 1: When FLTA or FLTB is asserted,

the PWM outputs (i.e., PWM<7:0>) are driven into

their inactive state.

• FLTCON = 0: When FLTA or FLTB is asserted,

only PWM<5:0> outputs are driven inactive,

leaving PWM<7:6> activated.

18.12.4 PWM OUTPUTS IN DEBUG MODE

The BRFEN bit in the FLTCONFIG register controls the

simulation of a Fault condition, when a breakpoint is hit,

while debugging the application using an In-Circuit

Emulator (ICE) or an In-Circuit Debugger (ICD). Setting

the BRFEN to high, enables the Fault condition on

breakpoint, thus driving the PWM outputs to the inactive

state. This is done to avoid any continuous keeping of

status on the PWM pin, which may result in damage of

the power devices connected to the PWM outputs.

If BRFEN = 0, the Fault condition on breakpoint is

disabled.

Note: Disabling only three PWM channels and

leaving one PWM channel enabled when

in the Fault state, allows the flexibility to

have at least one PWM channel enabled.

None of the PWM outputs can be enabled

(driven with the PWM Duty Cycle

registers) while FLTCON = 1 and the Fault

condition is present.

Note: It is highly recommended to enable the

Fault condition on breakpoint if a debug-

ging tool is used while developing the

firmware and high-power circuitry. When

the device is ready to program after

debugging the firmware, the BRFEN bit

can be disabled.

 2010 Microchip Technology Inc. DS39616D-page 201

PIC18F2331/2431/4331/4431

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

BRFEN FLTBS(1) FLTBMOD(1) FLTBEN(1) FLTCON(2) FLTAS FLTAMOD FLTAEN

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 BRFEN: Breakpoint Fault Enable bit

1 = Enable Fault condition on a breakpoint (i.e., only when PWMPIN = 1)

0 = Disable Fault condition

bit 6 FLTBS: Fault B Status bit(1)

1 =FLTB is asserted:

if FLTBMOD = 0, cleared by the user;

if FLTBMOD = 1, cleared automatically at beginning of the new period when FLTB is deasserted

0 = No Fault

bit 5 FLTBMOD: Fault B Mode bit(1)

1 = Cycle-by-Cycle mode: Pins are inactive for the remainder of the current PWM period or until FLTB

is deasserted; FLTBS is cleared automatically when FLTB is inactive (no Fault present)

0 = Inactive mode: Pins are deactivated (catastrophic failure) until FLTB is deasserted and FLTBS is

cleared by the user only

bit 4 FLTBEN: Fault B Enable bit(1)

1 = Enable Fault B

0 = Disable Fault B

bit 3 FLTCON: Fault Configuration bit(2)

1 =FLTA, FLTB or both deactivates all PWM outputs

0 =FLTA

or FLTB deactivates PWM<5:0>

bit 2 FLTAS: Fault A Status bit

1 =FLTA is asserted:

if FLTAMOD = 0, cleared by the user;

if FLTAMOD = 1, cleared automatically at beginning of the new period when FLTA is deasserted

0 = No Fault

bit 1 FLTAMOD: Fault A Mode bit

1 = Cycle-by-Cycle mode: Pins are inactive for the remainder of the current PWM period or until FLTA is

deasserted; FLTAS is cleared automatically

0 = Inactive mode: Pins are deactivated (catastrophic failure) until FLTA is deasserted and FLTAS is

cleared by the user only

bit 0 FLTAEN: Fault A Enable bit

1 = Enable Fault A

0 = Disable Fault A

Note 1: Unimplemented in PIC18F2331/2431 devices; maintain these bits clear.

2: PWM<7:6> are implemented only on PIC18F4331/4431 devices. On PIC18F2331/2431 devices, setting or

clearing FLTCON has no effect.

PIC18F2331/2431/4331/4431

DS39616D-page 202  2010 Microchip Technology Inc.

18.13 PWM Up date Lockout

For a complex PWM application, the user may need to

write up to four Duty Cycle registers and the PWM Time

Base Period register, PTPER, at a given time. In some

applications, it is important that all buffer registers be

written before the new duty cycle and period values are

loaded for use by the module.

A PWM update lockout feature may optionally be

enabled so the user may specify when new duty cycle

buffer values are valid. The PWM update lockout

feature is enabled by setting the control bit, UDIS, in

the PWMCON1 register. This bit affects all Duty Cycle

Buffer registers and the PWM Time Base Period

To perform a PWM update lockout:

1. Set the UDIS bit.

2. Write all Duty Cycle registers and PTPER, if

applicable.

3. Clear the UDIS bit to re-enable updates.

4. With this, when UDIS bit is cleared, the buffer

values will be loaded to the actual registers. This

makes a synchronous loading of the registers.

18.14 PWM Special Event Trigger

The PWM module has a Special Event Trigger capabil-

ity that allows A/D conversions to be synchronized to

the PWM time base. The A/D sampling and conversion

time may be programmed to occur at any point within

the PWM period. The Special Event Trigger allows the

user to minimize the delay between the time when A/D

conversion results are acquired and the time when the

duty cycle value is updated.

The PWM 16-bit Special Event Trigger register,

SEVTCMP (high and low), and five control bits in the

PWMCON1 register are used to control its operation.

The PTMR value for which a Special Event Trigger

should occur is loaded into the SEVTCMP register pair.

The SEVTDIR bit in the PWMCON1 register specifies

the counting phase when the PWM time base is in a

Continuous Up/Down Count mode.

If the SEVTDIR bit is cleared, the Special Event Trigger

will occur on the upward counting cycle of the PWM

time base. If SEVTDIR is set, the Special Event Trigger

will occur on the downward count cycle of the PWM

time base. The SEVTDIR bit has effect only when the

PWM timer is in the Continuous Up/Down Count mode.

18.14.1 SPECIAL EVENT TRIGGER ENABLE

The PWM module will always produce Special Event

Trigger pulses. This signal may optionally be used by

the A/D module. Refer to Section 21.0 “10-Bit

High-Speed Analog-to-Digital Converter (A/D)

Module” for details.

18.14.2 SPECIAL EVENT TRIGGER

POSTSCALER

The PWM Special Event Trigger has a postscaler that

allows a 1:1 to 1:16 postscale ratio. The postscaler is

configured by writing the SEVOPS<3:0> control bits in

the PWMCON1 register.

The Special Event Trigger output postscaler is cleared

on any write to the SEVTCMP register pair, or on any

device Reset.

 2010 Microchip Technology Inc. DS39616D-page 203

PIC18F2331/2431/4331/4431

TABLE 18-6: REGISTERS ASSOCIATED WITH THE POWER CONTROL PWM MODULE

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset

Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

IPR3 — — —PTIPIC3DRIP IC2QEIP IC1IP TMR5IP 56

PIE3 — — —PTIEIC3DRIE IC2QEIE IC1IE TMR5IE 56

PIR3 — — —PTIFIC3DRIF IC2QEIF IC1IF TMR5IF 56

PTCON0 PTOPS3 PTOPS2 PTOPS1 PTOPS0 PTCKPS1 PTCKPS0 PTMOD1 PTMOD0 58

PTCON1 PTEN PTDIR — — — — — — 58

PTMRL(1) PWM Time Base Register (lower 8 bits) 58

PTMRH(1) UNUSED PWM Time Base Register (upper 4 bits) 58

PTPERL(1) PWM Time Base Period Register (lower 8 bits) 58

PTPERH(1) UNUSED PWM Time Base Period Register (upper 4 bits) 58

SEVTCMPL(1) PWM Special Event Compare Register (lower 8 bits) 58

SEVTCMPH(1) UNUSED PWM Special Event Compare Register

(upper 4 bits)

PWMCON0 —PWMEN2 PWMEN1 PWMEN0 PMOD3(2) PMOD2 PMOD1 PMOD0 58

PWMCON1 SEVOPS3 SEVOPS2 SEVOPS1 SEVOPS0 SEVTDIR — UDIS OSYNC 58

DTCON DTPS1 DTPS0 DT5 DT4 DT3 DT2 DT1 DT0 58

FLTCONFIG BRFEN FLTBS(2) FLTBMOD(2) FLTBEN(2) FLTCON FLTAS FLTAMOD FLTAEN 58

OVDCOND POVD7(2) POVD6(2) POVD5 POVD4 POVD3 POVD2 POVD1 POVD0 58

OVDCONS POUT7(2) POUT6(2) POUT5 POUT4 POUT3 POUT2 POUT1 POUT0 58

PDC0L(1) PWM Duty Cycle #0L Register (lower 8 bits) 58

PDC0H(1) UNUSED PWM Duty Cycle #0H Register (upper 6 bits) 58

PDC1L(1) PWM Duty Cycle #1L register (lower 8 bits) 58

PDC1H(1) UNUSED PWM Duty Cycle #1H Register (upper 6 bits) 58

PDC2L(1) PWM Duty Cycle #2L Register (lower 8 bits) 58

PDC2H(1) UNUSED PWM Duty Cycle #2H Register (upper 6 bits) 58

PDC3L(1,2) PWM Duty Cycle #3L Register (lower 8 bits) 58

PDC3H(1,2) UNUSED PWM Duty Cycle #3H Register (upper 6 bits) 58

Legend: — = Unimplemented, read as ‘0’. Shaded cells are not used with the power control PWM.

Note 1: Double-buffered register pairs. Refer to text for explanation of how these registers are read and written to.

2: Unimplemented in PIC18F2331/2431 devices; maintain these bits clear. Reset values shown are for

PIC18F4331/4431 devices.

PIC18F2331/2431/4331/4431

DS39616D-page 204  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 205

PIC18F2331/2431/4331/4431

19.0 SYNCHRONOUS SERIAL PORT

(SSP) MODULE

19.1 SSP Module Overview

The Synchronous Serial Port (SSP) module is a serial

interface useful for communicating with other periph-

eral or microcontroller devices. These peripheral

devices may be serial EEPROMs, shift registers,

display drivers, A/D Converters, etc. The SSP module

can operate in one of two modes:

• Serial Peripheral Interface (SPI)

• Inter-Integrated Circuit (I2C™)

An overview of I2C operations and additional

information on the SSP module can be found in the

“PIC® Mid-Range MCU Family Reference Manual”

(DS33023).

Refer to application note AN578, “Use of the SSP

Module in the I2C™ Multi-Master Environment”

(DS00578).

19.2 SPI Mode

This section contains register definitions and opera-

tional characteristics of the SPI module. Additional

information on the SPI module can be found in the

”PIC® Mid-Range MCU Family Reference Manual”

(DS33023).

SPI mode allows 8 bits of data to be synchronously

transmitted and received simultaneously. To accomplish

communication, typically three pins are used:

• Serial Data Out (SDO)

• Serial Data In (SDI)

• Serial Clock (SCK)

Additionally, a fourth pin may be used when in a Slave

mode of operation:

• Slave Select (SS)

When initializing the SPI, several options need to be

specified. This is done by programming the appropriate

control bits in the SSPCON (SSPCON<5:0>) and

SSPSTAT<7:6> registers. These control bits allow the

following to be specified:

• Master mode (SCK is the clock output)

• Slave mode (SCK is the clock input)

• Clock polarity (Idle state of SCK)

• Clock edge (output data on rising/falling edge of

SCK)

• Clock rate (Master mode only)

• Slave Select mode (Slave mode only)

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DS39616D-page 206  2010 Microchip Technology Inc.

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A PSR/WUA BF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 SMP: Sample bit

SPI Master mode:

1 = Input data sampled at end of data output time

0 = Input data sampled at middle of data output time

SPI Slave mode:

SMP must be cleared when SPI is used in Slave mode.

bit 6 CKE: SPI Clock Edge Select bit (Figure 19-2, Figure 19-3 and Figure 19-4)

SPI mode, CKP = 0:

1 = Data transmitted on rising edge of SCK

0 = Data transmitted on falling edge of SCK

SPI mode, CKP = 1:

1 = Data transmitted on falling edge of SCK

0 = Data transmitted on rising edge of SCK

I2 C™ mode:

This bit must be maintained clear.

bit 5 D/A: Data/Address bit (I2C mode only)

1 = Indicates that the last byte received or transmitted was data

0 = Indicates that the last byte received or transmitted was address

bit 4 P: Stop bit (I2C mode only)

This bit is cleared when the SSP module is disabled or when the Start bit is detected last; SSPEN is

cleared.

1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)

0 = Stop bit was not detected last

bit 3 S: Start bit (I2C mode only)

This bit is cleared when the SSP module is disabled or when the Stop bit is detected last; SSPEN is

cleared.

1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)

0 = Start bit was not detected last

bit 2 R/W: Read/Write Information bit (I2C mode only)

This bit holds the R/W bit information following the last address match. This bit is only valid from the

address match to the next Start bit, Stop bit or ACK bit.

1 = Read

0 = Write

bit 1 UA: Update Address bit (10-Bit I2C mode only)

1 = Indicates that the user needs to update the address in the SSPADD register

0 = Address does not need to be updated

bit 0 BF: Buffer Full Status bit

Receive (SPI and I2 C modes):

1 = Receive complete, SSPBUF is full

0 = Receive not complete, SSPBUF is empty

Transmit (I2 C mode only):

1 = Transmit in progress, SSPBUF is full

0 = Transmit complete, SSPBUF is empty

 2010 Microchip Technology Inc. DS39616D-page 207

PIC18F2331/2431/4331/4431

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV(1) SSPEN(2) CKP SSPM3(3) SSPM2(3) SSPM1(3) SSPM0(3)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 WCOL: Write Collision Detect bit

1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in

software)

0 = No collision

bit 6 SSPOV: Receive Overflow Indicator bit(1)

In SPI mode:

1 = A new byte is received while the SSPBUF register is still holding the previous data. In case

of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user

must read the SSPBUF, even if only transmitting data, to avoid setting overflow. In

Master mode, the overflow bit is not set since each new reception (and transmission) is

initiated by writing to the SSPBUF register.

0 = No overflow

In I2 C™ mode:

1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV

is a “don’t care” in Transmit mode. SSPOV must be cleared in software in either mode.

0 = No overflow

bit 5 SSPEN: Synchronous Serial Port Enable bit(2)

In SPI mode:

1 = Enables serial port and configures SCK, SDO and SDI as serial port pins

0 = Disables serial port and configures these pins as I/O port pins

In I2 C mode:

1 = Enables the serial port and configures the SDA and SCL pins as serial port pins

0 = Disables serial port and configures these pins as I/O port pins

In both modes, when enabled, these pins must be properly configured as input or output.

bit 4 CKP: Clock Polarity Select bit

In SPI mode:

1 = Idle state for clock is a high level

0 = Idle state for clock is a low level

In I2 C mode:

SCK release control.

1 = Enables clock

0 = Holds clock low (clock stretch). (Used to ensure data setup time.)

Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by

writing to the SSPBUF register.

2: When enabled, these pins must be properly configured as inputs or outputs.

3: Bit combinations not specifically listed here are either reserved or implemented in I2C™ mode only.

PIC18F2331/2431/4331/4431

DS39616D-page 208  2010 Microchip Technology Inc.

bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits(3)

0000 = SPI Master mode, Clock = FOSC/4

0001 = SPI Master mode, Clock = FOSC/16

0010 = SPI Master mode, Clock = FOSC/64

0011 = SPI Master mode, Clock = TMR2 output/2

0100 = SPI Slave mode, Clock = SCK pin, SS pin control enabled

0101 = SPI Slave mode, Clock = SCK pin, SS pin control disabled, SS can be used as I/O pin

0110 = I2C Slave mode, 7-bit address

0111 = I2C Slave mode, 10-bit address

1011 = I2C Firmware Controlled Master mode (slave Idle)

1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled

1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled

Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by

writing to the SSPBUF register.

2: When enabled, these pins must be properly configured as inputs or outputs.

3: Bit combinations not specifically listed here are either reserved or implemented in I2C™ mode only.

 2010 Microchip Technology Inc. DS39616D-page 209

PIC18F2331/2431/4331/4431

FIGU RE 19-1 : SSP BLOC K DI AG R AM

(SPI MODE) To enable the serial port, SSP Enable bit, SSPEN

(SSPCON<5>), must be set. To reset or reconfigure

SPI mode, clear bit SSPEN, reinitialize the SSPCON

SDI, SDO, SCK and SS pins as serial port pins. For the

pins to behave as the serial port function, they must

have their data direction bits (in the TRISC register)

appropriately programmed. That is:

• Serial Data Out (SDO) – RC7/RX/DT/SDO or

RD1/SDO

• SDI must have TRISC<4> or TRISD<2> set

• SDO must have TRISC<7> or TRISD<1> cleared

• SCK (Master mode) must have TRISC<5> or

TRISD<3> cleared

• SCK (Slave mode) must have TRISC<5> or

TRISD<3> set

•SS

must have TRISA<6> set

Read Write

Internal

Data Bus

SDI

SDO

SCK

SSPSR Reg

SSPBUF Reg

SSPM<3:0>

bit 0 Shift

Clock

SS Control

Enable

Edge

Select

Clock Select

TMR2 Output

TCY

Prescaler

4, 16, 64

TRISC<3>

Edge

Select

Peripheral OE

Note 1: When the SPI is in Slave mode, with

the SSpin control enabled,

(SSPCON<3:0> = 0100), the SPI

module will reset if the SS pin is set to

VDD.

2: If the SPI is used in Slave mode with

CKE = 1, then the SS pin control must be

enabled.

3: When the SPI is in Slave mode with SS pin

control enabled (SSPCON<3:0> = 0100),

the state of the SS pin can affect the state

read back from the TRISC<6> bit. The

peripheral OE signal from the SSP module

into PORTC controls the state that is read

back from the TRISC<6> bit (see

Section 11.3 “PORTC, TR ISC and LATC

Registers” for information on PORTC). If

Read-Modify-Write instructions, such as

BSF, are performed on the TRISC register

while the SS pin is high, this will cause the

TRISC<6> bit to be set, thus disabling the

SDO output.

PIC18F2331/2431/4331/4431

DS39616D-page 210  2010 Microchip Technology Inc.

FIGURE 19-2: SPI MODE T I MING, MASTE R MODE

FIGURE 19-3: SPI MODE TI MING (SLA VE M ODE WITH CKE = 0)

SCK (CKP = 0,

SDI (SMP = 0)

SSPIF

bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

SDI (SMP = 1)

SCK (CKP = 0,

SCK (CKP = 1,

SDO

bit 7

bit 7 bit 0

bit 0

CKE = 0)

CKE = 1)

CKE = 0)

CKE = 1)

SCK (CKP = 0)

SDI (SMP = 0)

SSPIF

bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

SCK (CKP = 1)

SDO

bit 7 bit 0

SS (optional)

 2010 Microchip Technology Inc. DS39616D-page 211

PIC18F2331/2431/4331/4431

FIGURE 19-4: SPI MODE TI MING (SLA VE M ODE WITH CKE = 1)

TABLE 19-1: REGISTERS ASSOCIATED WITH SPI OPERATION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

TRISC PORTC Data Direction Register 57

SSPBUF SSP Receive Buffer/Transmit Register 55

SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 55

TRISA TRISA7(1) TRISA6(2) PORTA Data Direction Register 57

SSPSTAT SMP CKE D/A P S R/W UA BF 55

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the SSP in SPI mode.

Note 1: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other

oscillator modes.

2: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6)

Oscillator modes only and read ‘0’ in all other oscillator modes.

SCK (CKP = 0)

SDI (SMP = 0)

SSPIF

bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

SCK (CKP = 1)

SDO

bit 7 bit 0

PIC18F2331/2431/4331/4431

DS39616D-page 212  2010 Microchip Technology Inc.

19.3 SSP I2 C Operation

The SSP module, in I2C mode, fully implements all slave

functions except general call support and provides

interrupts on Start and Stop bits in hardware to facilitate

firmware implementations of the master functions. The

SSP module implements the standard mode

specifications, as well as 7-bit and 10-bit addressing.

Two pins are used for data transfer. These are the SCK/

SCL pin, which is the clock (SCL), and the SDI/SDA

pin, which is the data (SDA). The user must configure

these pins as inputs or outputs through the

TRISC<5:4> or TRISD<3:2> bits.

The SSP module functions are enabled by setting SSP

Enable bit SSPEN (SSPCON<5>).

FIGU RE 19-5 : SSP BLOC K DI AG R AM

(I2C™ M ODE )

The SSP module has five registers for I2C operation.

These are the:

• SSP Control Register (SSPCON)

• SSP Status Register (SSPSTAT)

• Serial Receive/Transmit Buffer (SSPBUF)

• SSP Shift Register (SSPSR) – Not directly

accessible

• SSP Address Register (SSPADD)

The SSPCON register allows control of the I2C opera-

tion. Four mode selection bits (SSPCON<3:0>) allow

one of the following I2C modes to be selected:

•I

2C Slave mode (7-bit address)

•I

2C Slave mode (10-bit address)

•I

2C Slave mode (7-bit address), with Start and

Stop bit interrupts enabled to support Firmware

Controlled Master mode

•I

2C Slave mode (10-bit address), with Start and

Stop bit interrupts enabled to support Firmware

Controlled Master mode

•I

2C Start and Stop bit interrupts enabled to

support Firmware Controlled Master mode;

Slave is Idle

Selection of any I2C mode, with the SSPEN bit set,

forces the SCL and SDA pins to be open-drain,

provided these pins are programmed as inputs by

setting the appropriate TRISC or TRISD bits. Pull-up

resistors must be provided externally to the SCL and

SDA pins for proper operation of the I2C module.

Additional information on SSP I2C operation can be

found in the “PIC® Mid-Range MCU Fami ly Reference

Manual” (DS33023).

19.3.1 SLAVE MODE

In Slave mode, the SCL and SDA pins must be config-

ured as inputs (TRISC<5:4> or TRISD<3:2> set). The

SSP module will override the input state with the output

data when required (slave-transmitter).

When an address is matched, or the data transfer after

an address match is received, the hardware automati-

cally will generate the Acknowledge (ACK) pulse and

then load the SSPBUF register with the received value

currently in the SSPSR register.

There are certain conditions that will cause the SSP

module not to give this ACK pulse. They include (either

or both):

a) The Buffer Full bit, BF (SSPSTAT<0>), was set

before the transfer was received.

b) The SSP Overflow bit, SSPOV (SSPCON<6>),

was set before the transfer was received.

In this case, the SSPSR register value is not loaded

into the SSPBUF, but bit, SSPIF (PIR1<3>), is set.

Table 19-2 shows what happens when a data transfer

byte is received, given the status of bits BF and

SSPOV. The shaded cells show the condition where

user software did not properly clear the overflow

condition. Flag bit, BF, is cleared by reading the

SSPBUF register, while bit, SSPOV, is cleared through

software.

The SCL clock input must have a minimum high and

low for proper operation. The high and low times of the

I2C specification, as well as the requirements of the

SSP module, are shown in timing Parameter 100 and

Parameter 101.

Read Write

SSPSR Reg

Match Detect

SSPADD Reg

SSPBUF Reg

Internal

Data Bus

Addr Match

Set, Reset

S, P bits

(SSPSTAT Reg)

SCK/SCL

(1)

Shift

Clock

MSb

SDI/SDA

(1)

LSb

Note 1: When SSPMX = 1 in CONFIG3H:

SCK/SCL is multiplexed to the RC5 pin, SDA/

SDI is multiplexed to the RC4 pin and SDO is

multiplexed to pin, RC7.

When SSPMX = 0 in CONFIG3H:

SCK/SCL is multiplexed to the RD3 pin, SDA/

SDI is multiplexed to the RD2 pin and SDO is

multiplexed to pin, RD1.

Start and

Stop bit Detect

 2010 Microchip Technology Inc. DS39616D-page 213

PIC18F2331/2431/4331/4431

19.3.1.1 Addressing

Once the SSP module has been enabled, it waits for a

Start condition to occur. Following the Start condition,

the 8 bits are shifted into the SSPSR register. All incom-

ing bits are sampled with the rising edge of the clock

(SCL) line. The value of register SSPSR<7:1> is

compared to the value of the SSPADD register. The

address is compared on the falling edge of the eighth

clock (SCL) pulse. If the addresses match, and the BF

and SSPOV bits are clear, the following events occur:

a) The SSPSR register value is loaded into the

SSPBUF register.

b) The Buffer Full bit, BF, is set.

c) An ACK pulse is generated.

d) SSP Interrupt Flag bit, SSPIF (PIR1<3>), is set

(interrupt is generated if enabled) on the falling

edge of the ninth SCL pulse.

In 10-Bit Addressing mode, two address bytes need to

be received by the slave (Figure 19-7). The five Most

Significant bits (MSbs) of the first address byte specify

if this is a 10-bit address. Bit R/W (SSPSTAT<2>) must

specify a write so the slave device will receive the

second address byte. For a 10-bit address, the first

byte would equal ‘1111 0 A9 A8 0’, where A9 and

A8 are the two MSbs of the address.

The sequence of events for 10-Bit Addressing mode is

as follows, with Steps 7-9 for slave-transmitter:

1. Receive first (high) byte of address (SSPIF, BF

and UA bits are set).

2. Update the SSPADD register with second (low)

byte of address (clears bit, UA, and releases the

SCL line).

3. Read the SSPBUF register (clears bit, BF) and

clear flag bit, SSPIF.

4. Receive second (low) byte of address (SSPIF,

BF and UA bits are set).

5. Update the SSPADD register with the first (high)

byte of address. If match releases SCL line, this

will clear bit, UA.

6. Read the SSPBUF register (clears bit, BF) and

clear flag bit, SSPIF.

7. Receive Repeated Start condition.

8. Receive first (high) byte of address (SSPIF and

BF bits are set).

9. Read the SSPBUF register (clears bit, BF) and

clear flag bit, SSPIF.

TABLE 19-2: DATA TRANSFER RECEIVED BYTE ACTIONS

Status Bits as Data

Transfer is Received SSPSR  SSPBUF Generate ACK

Pulse

Set SSPIF Bit

(SSP interrupt occurs

if enabled)

BF SSPOV

00 Yes Yes Yes

10 No No Yes

11 No No Yes

0 1 No No Yes

Note: Shaded cells show the conditions where the user software did not properly clear the overflow condition.

PIC18F2331/2431/4331/4431

DS39616D-page 214  2010 Microchip Technology Inc.

19.3.1.2 Reception

When the R/W bit of the address byte is clear and an

address match occurs, the R/W bit of the SSPSTAT

the SSPBUF register.

When the address byte overflow condition exists, then

the no Acknowledge (ACK) pulse is given. An overflow

condition is defined as either bit BF (SSPSTAT<0>) is

set, or bit SSPOV (SSPCON<6>) is set. This is an error

condition due to the user’s firmware.

An SSP interrupt is generated for each data transfer

byte. Flag bit, SSPIF (PIR1<3>), must be cleared in

software. The SSPSTAT register is used to determine

the status of the byte.

FIGURE 19-6: I2C™ WA VEFORMS FOR RE CEPTION (7-BIT A DDRESS)

D0D1

D2D3D4D5D6D7

A7 A6 A5 A4 A3 A2 A1SDA

SCL 123456789123456789123

Bus master

terminates

transfer

SSPOV bit is set because the SSPBUF register is still full

Cleared in software

SSPBUF register is read

ACK Receiving Data

Receiving Data

D0D1D2D3D4D5D6D7

ACK

R/W = 0

Receiving Address

SSPIF (PIR1<3>)

BF (SSPSTAT<0>)

SSPOV (SSPCON<6>)

ACK

ACK is not sent

 2010 Microchip Technology Inc. DS39616D-page 215

PIC18F2331/2431/4331/4431

19.3.1.3 Transmission

When the R/W bit of the incoming address byte is set

and an address match occurs, the R/W bit of the

SSPSTAT register is set. The received address is

loaded into the SSPBUF register. The ACK pulse will

be sent on the ninth bit and pin, SCK/SCL, is held low.

The transmit data must be loaded into the SSPBUF

pin, SCK/SCL, should be enabled by setting bit, CKP

(SSPCON<4>). The master must monitor the SCL pin

prior to asserting another clock pulse. The slave

devices may be holding off the master by stretching the

clock. The eight data bits are shifted out on the falling

edge of the SCL input. This ensures that the SDA signal

is valid during the SCL high time (Figure 19-7).

An SSP interrupt is generated for each data transfer

byte. Flag bit, SSPIF, must be cleared in software and

the SSPSTAT register is used to determine the status

of the byte. Flag bit, SSPIF, is set on the falling edge of

the ninth clock pulse.

As a slave-transmitter, the ACK pulse from the master-

receiver is latched on the rising edge of the ninth SCL

input pulse. If the SDA line was high (not ACK), then the

data transfer is complete. When the ACK is latched by

the slave, the slave logic is reset and the slave then

monitors for another occurrence of the Start bit. If the

SDA line was low (ACK), the transmit data must be

loaded into the SSPBUF register, which also loads the

SSPSR register. Then pin, SCK/SCL, should be enabled

by setting bit CKP.

FIGURE 19-7: I2C™ WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)

SDA

SCL

SSPIF (PIR1<3>)

BF (SSPSTAT<0>)

CKP (SSPCON<4>)

A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0

ACK

Transmitting DataR/W = 1Receiving Address

123456789 123456789 P

Cleared in software

SSPBUF is written in software From SSP Interrupt

Service Routine

Set bit after writing to SSPBUF

SData in

sampled

SCL held low

while CPU

responds to SSPIF

(SSPBUF must be written to

before the CKP bit can be set)

PIC18F2331/2431/4331/4431

DS39616D-page 216  2010 Microchip Technology Inc.

19.3.2 MASTER MODE

Master mode of operation is supported in firmware

using interrupt generation on the detection of the Start

and Stop conditions. The Stop (P) and Start (S) bits are

cleared from a Reset or when the SSP module is

disabled. The Stop (P) and Start (S) bits will toggle

based on the Start and Stop conditions. Control of the

I2C bus may be taken when the P bit is set, or the bus

is Idle and both the S and P bits are clear.

In Master mode, the SCL and SDA lines are manipu-

lated by clearing the corresponding TRISC<5:4> or

TRISD<3:2> bits. The output level is always low,

regardless of the value(s) in PORTC<5:4> or

PORTD<3:2>. So when transmitting data, a ‘1’ data bit

must have the TRISC<4> bit set (input) and a ‘0’ data

bit must have the TRISC<4> bit cleared (output). The

same scenario is true for the SCL line with the

TRISC<4> or TRISD<2> bit. Pull-up resistors must be

provided externally to the SCL and SDA pins for proper

operation of the I2C module.

The following events will cause the SSP Interrupt Flag

bit, SSPIF, to be set (SSP interrupt will occur if

enabled):

• Start condition

• Stop condition

• Data transfer byte transmitted/received

Master mode of operation can be done with either the

Slave mode Idle (SSPM<3:0> = 1011) or with the

Slave active. When both Master and Slave modes are

enabled, the software needs to differentiate the

source(s) of the interrupt.

19.3.3 MULTI-MASTER MODE

In Multi-Master mode, the interrupt generation on the

detection of the Start and Stop conditions allows the

determination of when the bus is free. The Stop (P) and

Start (S) bits are cleared from a Reset or when the SSP

module is disabled. The Stop (P) and Start (S) bits will

toggle based on the Start and Stop conditions. Control

of the I2C bus may be taken when bit P (SSPSTAT<4>)

is set, or the bus is Idle and both the S and P bits clear.

When the bus is busy, enabling the SSP interrupt will

generate the interrupt when the Stop condition occurs.

In Multi-Master mode, the SDA line must be monitored

to see if the signal level is the expected output level.

This check only needs to be done when a high level is

output. If a high level is expected and a low level is

present, the device needs to release the SDA and SCL

lines (set TRISC<5:4> or TRISD<3:2>). There are two

stages where this arbitration can be lost, these are:

• Address Transfer

• Data Transfer

When the slave logic is enabled, the slave continues to

receive. If arbitration was lost during the address

transfer stage, communication to the device may be in

progress. If addressed, an ACK pulse will be gener-

ated. If arbitration was lost during the data transfer

stage, the device will need to retransfer the data at a

later time.

TABLE 19-3: REGISTERS ASSOCIATED WITH I2C™ OPERATION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

SSPBUF SSP Receive Buffer/Transmit Register 55

SSPADD SSP Address Register (I2C mode) 55

SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 55

SSPSTAT SMP(1) CKE(1) D/A PSR/WUA BF 55

TRISC(2) PORTC Data Direction Register 57

TRISD(2) PORTD Data Direction Register 57

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the SSP module in I2C mode.

Note 1: Maintain these bits clear in I2C mode.

2: Depending upon the setting of SSPMX in CONFIG3H, these pins are multiplexed to PORTC or PORTD.

 2010 Microchip Technology Inc. DS39616D-page 217

PIC18F2331/2431/4331/4431

20.0 ENHANCED UNIVE R SA L

SYNCHRONOUS

ASYNCHRONOUS RECEIVER

TRANSMITTER (EUSART)

The Enhanced Universal Synchronous Asynchronous

Receiver Transmitter (EUSART) module is one of the

two serial I/O modules available in the PIC18F2331/

2431/4331/4431 family of microcontrollers. EUSART is

also known as a Serial Communications Interface or

SCI.

The EUSART can be configured as a full-duplex

asynchronous system that can communicate with

peripheral devices, such as CRT terminals and

personal computers. It can also be configured as a half-

duplex synchronous system that can communicate

with peripheral devices, such as A/D or D/A integrated

circuits, serial EEPROMs, etc.

The EUSART module implements additional features,

including automatic baud rate detection and

calibration, automatic wake-up on Sync Break

reception and 12-bit Break character transmit. These

features make it ideally suited for use in Local

Interconnect Network (LIN/J2602) bus systems.

The EUSART can be configured in the following

modes:

• Asynchronous (full-duplex) with:

- Auto-wake-up on character reception

- Auto-baud calibration

- 12-bit Break character transmission

• Synchronous – Master (half-duplex) with

selectable clock polarity

• Synchronous – Slave (half-duplex) with selectable

clock polarity

In order to configure pins, TX and RX, as the Enhanced

Universal Synchronous Asynchronous Receiver

Transmitter:

• SPEN (RCSTA<7>) bit must be set ( = 1),

• TRISC<6> bit must be set ( = 1), and

• TRISC<7> bit must be set ( = 1).

The operation of the Enhanced USART module is

controlled through three registers:

• Transmit Status and Control (TXSTA)

• Receive Status and Control (RCSTA)

• Baud Rate Control (BAUDCON)

These are detailed on the following pages in

respectively.

20.1 Asynchronous Operation in

Power-Managed Modes

The EUSART may operate in Asynchronous mode

while the peripheral clocks are being provided by the

internal oscillator block. This makes it possible to

remove the crystal or resonator that is commonly con-

nected as the primary clock on the OSC1 and OSC2

pins.

The factory calibrates the internal oscillator block out-

put (INTOSC) for 8 MHz (see Ta b l e 2 6 - 6 ). However,

this frequency may drift as VDD or temperature

changes, and this directly affects the asynchronous

baud rate. Two methods may be used to adjust the

baud rate clock, but both require a reference clock

source of some kind.

The first (preferred) method uses the OSCTUNE

Adjusting the value in the OSCTUNE register allows for

fine resolution changes to the system clock source (see

Section 3.6.4 “INTOSC Frequency Drift” for more

information).

The other method adjusts the value in the Baud Rate

Generator (BRG). There may not be fine enough

resolution when adjusting the Baud Rate Generator to

compensate for a gradual change in the peripheral

clock frequency.

Note: The EUSART control will automatically

reconfigure the pin from input to output as

needed.

PIC18F2331/2431/4331/4431

DS39616D-page 218  2010 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0

CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 CSRC: Clock Source Select bit

Asynchronous mode:

Don’t care.

Synchronous mode:

1 = Master mode (clock generated internally from BRG)

0 = Slave mode (clock from external source)

bit 6 TX9: 9-Bit Transmit Enable bit

1 = Selects 9-bit transmission

0 = Selects 8-bit transmission

bit 5 TXEN: Transmit Enable bit(1)

1 = Transmit enabled

0 = Transmit disabled

bit 4 SYNC: EUSART Mode Select bit

1 = Synchronous mode

0 = Asynchronous mode

bit 3 SENDB: Send Break Character bit

Asynchronous mode:

1 = Send Sync Break on next transmission (cleared by hardware upon completion)

0 = Sync Break transmission completed

Synchronous mode:

Don’t care.

bit 2 BRGH: High Baud Rate Select bit

Asynchronous mode:

1 = High speed

0 = Low speed

Synchronous mode:

Unused in this mode.

bit 1 TRMT: Transmit Shift Register Status bit

1 = TSR is empty

0 = TSR is full

bit 0 TX9D: 9th Bit of Transmit Data

Can be address/data bit or a parity bit.

Note 1: SREN/CREN overrides TXEN in Sync mode.

 2010 Microchip Technology Inc. DS39616D-page 219

PIC18F2331/2431/4331/4431

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x

SPEN RX9 SREN CREN ADDEN FERR OERR RX9D

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 SPEN: Serial Port Enable bit

1 = Serial port enabled

0 = Serial port disabled

bit 6 RX9: 9-Bit Receive Enable bit

1 = Selects 9-bit reception

0 = Selects 8-bit reception

bit 5 SREN: Single Receive Enable bit

Asynchronous mode:

Don’t care.

Synchronous mode – Master:

1 = Enables single receive

0 = Disables single receive

This bit is cleared after reception is complete.

Synchronous mode – Slave:

Don’t care.

bit 4 CREN: Continuous Receive Enable bit

Asynchronous mode:

1 = Enables receiver

0 = Disables receiver

Synchronous mode:

1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN)

0 = Disables continuous receive

bit 3 ADDEN: Address Detect Enable bit

Asynchronous mode 9-Bit (RX9 = 1):

1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set

0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit

Asynchronous mode 8-Bit (RX9 = 0):

Don’t care.

bit 2 FERR: Framing Error bit

1 = Framing error (can be cleared by reading RCREGx register and receiving next valid byte)

0 = No framing error

bit 1 OERR: Overrun Error bit

1 = Overrun error (can be cleared by clearing bit, CREN)

0 = No overrun error

bit 0 RX9D: 9th Bit of Received Data

This can be address/data bit or a parity bit and must be calculated by user firmware.

PIC18F2331/2431/4331/4431

DS39616D-page 220  2010 Microchip Technology Inc.

U-0 R-1 U-0 R/W-1 R/W-0 U-0 R/W-0 R/W-0

— RCIDL — SCKP BRG16 — WUE ABDEN

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 Unimplemented: Read as ‘0’

bit 6 RCIDL: Receive Operation Idle Status bit

1 = Receiver is Idle

0 = Receive in progress

bit 5 Unimplemented: Read as ‘0’

bit 4 SCKP: Synchronous Clock Polarity Select bit

Asynchronous mode:

Unused in this mode.

Synchronous mode:

1 = Idle state for clock (CK) is a high level

0 = Idle state for clock (CK) is a low level

bit 3 BRG16: 16-Bit Baud Rate Register Enable bit

1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG

0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored

bit 2 Unimplemented: Read as ‘0’

bit 1 WUE: Wake-up Enable bit

Asynchronous mode:

1 = EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit cleared in

hardware on following rising edge

0 = RX pin not monitored or rising edge detected

Synchronous mode:

Unused in this mode.

bit 0 ABDEN: Auto-Baud Detect Enable bit

Asynchronous mode:

1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h);

cleared in hardware upon completion.

0 = Baud rate measurement disabled or completed

Synchronous mode:

Unused in this mode.

 2010 Microchip Technology Inc. DS39616D-page 221

PIC18F2331/2431/4331/4431

20.2 EUSART Baud Rate Generator

(BRG)

The BRG is a dedicated 8-bit or 16-bit generator, that

supports both the Asynchronous and Synchronous

modes of the EUSART. By default, the BRG operates

in 8-bit mode. Setting the BRG16 bit (BAUDCON<3>)

selects 16-bit mode.

The SPBRGH:SPBRG register pair controls the period

of a free-running timer. In Asynchronous mode, bits

BRGH (TXSTA<2>) and BRG16 also control the baud

rate. In Synchronous mode, bit BRGH is ignored.

Table 20-1 shows the formula for computation of the

baud rate for different EUSART modes, which only

apply in Master mode (internally generated clock).

Given the desired baud rate and FOSC, the nearest

integer value for the SPBRGH:SPBRG registers can be

calculated using the formulas in Table 20-1. From this,

the error in baud rate can be determined. An example

calculation is shown in Example 20-1. Typical baud

rates and error values for the various Asynchronous

modes are shown in Table 20-2. It may be

advantageous to use the high baud rate (BRGH = 1),

or the 16-bit BRG, to reduce the baud rate error or

achieve a slow baud rate for a fast oscillator frequency.

Writing a new value to the SPBRGH:SPBRG registers

causes the BRG timer to be reset (or cleared). This

ensures the BRG does not wait for a timer overflow

before outputting the new baud rate.

20.2.1 POWER-MANAGED MODE

OPERATION

The system clock is used to generate the desired baud

rate. However, when a power-managed mode is

entered, the clock source may be operating at a

different frequency than in PRI_RUN mode. In Sleep

mode, no clocks are present and in PRI_IDLE, the

primary clock source continues to provide clocks to the

Baud Rate Generator. However, in other power-

managed modes, the clock frequency will probably

change. This may require the value in SPBRG to be

adjusted.

If the system clock is changed during an active receive

operation, a receive error or data loss may result. To

avoid this problem, check the status of the RCIDL bit

and make sure that the receive operation is Idle before

changing the system clock.

20.2.2 SAMPLING

The data on the RC7/RX/DT/SDO pin is sampled three

times by a majority detect circuit to determine if a high

or a low level is present at the RX pin.

TABLE 20-1: BAUD RATE FORMULAS

Configuration Bits BRG/EUSART Mode Baud Rate Formula

SYNC BRG16 BRGH

000 8-Bit/Asynchronous FOSC/[64 (n + 1)]

001 8-Bit/Asynchronous FOSC/[16 (n + 1)]

010 16-Bit/Asynchronous

011 16-Bit/Asynchronous

FOSC/[4 (n + 1)]10x 8-Bit/Synchronous

11x 16-Bit/Synchronous

Legend: x = Don’t care, n = value of SPBRGH:SPBRG register pair

PIC18F2331/2431/4331/4431

DS39616D-page 222  2010 Microchip Technology Inc.

EXAMPL E 20-1 : CALCULATI NG BA UD RATE ERROR

TABLE 20-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

BAUDCON —RCIDL —SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.

TABLE 20-3: BAUD RATES FOR ASYNCHRONOUS MODES

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 0

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3————————————

1.2 — — — 1.221 1.73 255 1.202 0.16 129 1.201 -0.16 103

2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2.403 -0.16 51

9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9.615 -0.16 12

19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7 — — —

57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2 — — —

115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 0

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.16 207 0.300 -0.16 103 0.300 -0.16 51

1.2 1.202 0.16 51 1.201 -0.16 25 1.201 -0.16 12

2.4 2.404 0.16 25 2.403 -0.16 12 — — —

9.6 8.929 -6.99 6 — — — — — —

19.2 20.833 8.51 2 — — — — — —

57.6 62.500 8.51 0 — — — — — —

115.2 62.500 -45.75 0 — — — — — —

For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchr onous mode, 8-bit BRG:

Desired Baud Rate = FOSC/(64 ([SPBRGH:SPBRG] + 1))

Sol ving for SPBRGH:SP BRG:

X = ((FOSC/Desired Baud Rate)/64) – 1

= ((16000 000/9 600)/64) – 1

= [25.042] = 25

Calculated B aud Rate = 16000000/(64 (25 + 1))

= 9615

Error = (Cal culated Baud R ate – Desired Baud Rate)/Desired Baud Rate

= (9615 – 9600)/9600 = 0.16%

 2010 Microchip Technology Inc. DS39616D-page 223

PIC18F2331/2431/4331/4431

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 0

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

2.4 — — — — — — 2.441 1.73 255 2.403 -0.16 207

9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51

19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25

57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8

115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 0

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 — — — — — — 0.300 -0.16 207

1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51

2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25

9.6 9.615 0.16 25 9.615 -0.16 12 — — —

19.2 19.231 0.16 12 — — — — — —

57.6 62.500 8.51 3 — — — — — —

115.2 125.000 8.51 1 — — — — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 1

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 0.300 -0.04 1665

1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1.201 -0.16 415

2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2.403 -0.16 207

9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51

19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25

57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8

115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 1

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.04 832 0.300 -0.16 415 0.300 -0.16 207

1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51

2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25

9.6 9.615 0.16 25 9.615 -0.16 12 — — —

19.2 19.231 0.16 12 — — — — — —

57.6 62.500 8.51 3 — — — — — —

115.2 125.000 8.51 1 — — — — — —

TABLE 20-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)

PIC18F2331/2431/4331/4431

DS39616D-page 224  2010 Microchip Technology Inc.

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 0.300 -0.01 6665

1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1.200 -0.04 1665

2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2.400 -0.04 832

9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9.615 -0.16 207

19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19.230 -0.16 103

57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57.142 0.79 34

115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117.647 -2.12 16

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.01 3332 0.300 -0.04 1665 0.300 -0.04 832

1.2 1.200 0.04 832 1.201 -0.16 415 1.201 -0.16 207

2.4 2.404 0.16 415 2.403 -0.16 207 2.403 -0.16 103

9.6 9.615 0.16 103 9.615 -0.16 51 9.615 -0.16 25

19.2 19.231 0.16 51 19.230 -0.16 25 19.230 -0.16 12

57.6 58.824 2.12 16 55.555 3.55 8 — — —

115.2 111.111 -3.55 8 — — — — — —

TABLE 20-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)

 2010 Microchip Technology Inc. DS39616D-page 225

PIC18F2331/2431/4331/4431

20.2.3 AUTO-BAUD RATE DETECT

The Enhanced USART module supports the automatic

detection and calibration of baud rate. This feature is

active only in Asynchronous mode and while the WUE

bit is clear.

The automatic baud rate measurement sequence

(Figure 20-1) begins whenever a Start bit is received and

the ABDEN bit is set. The calculation is self-averaging.

In the Auto-Baud Rate Detect (ABD) mode, the clock to

the BRG is reversed. Rather than the BRG clocking the

incoming RX signal, the RX signal is timing the BRG. In

ABD mode, the internal Baud Rate Generator is used

as a counter to time the bit period of the incoming serial

byte stream.

Once the ABDEN bit is set, the state machine will clear

the BRG and look for a Start bit. The Auto-Baud Detect

must receive a byte with the value of 55h (ASCII “U”,

which is also the LIN/J2602 bus Sync character) in

order to calculate the proper bit rate. The measurement

takes over both a low and a high bit time in order to

minimize any effects caused by asymmetry of the

incoming signal. After a Start bit, the SPBRG begins

counting up, using the preselected clock source on the

first rising edge of RX. After eight bits on the RX pin, or

the fifth rising edge, an accumulated value totalling the

proper BRG period is left in the SPBRGH:SPBRG

registers. Once the 5th edge is seen (should

correspond to the Stop bit), the ABDEN bit is

automatically cleared.

While calibrating the baud rate period, the BRG regis-

ters are clocked at 1/8th the preconfigured clock rate.

The BRG clock can be configured by the BRG16 and

BRGH bits. The BRG16 bit must be set to use both

SPBRG and SPBRGH as a 16-bit counter.

This allows the user to verify that no carry occurred for 8-

bit modes by checking for 00h in the SPBRGH register.

Refer to Table 20-4 for counter clock rates to the BRG.

While the ABD sequence takes place, the EUSART

state machine is held in Idle. The RCIF interrupt is set

once the fifth rising edge on RX is detected. The value

in the RCREG needs to be read to clear the RCIF

interrupt. RCREG content should be discarded.

TABLE 20-4: BRG COUNTER CLOCK

RATES

FIGURE 20-1: AUTOMATIC BAUD RATE CALCULATION(1)

Note 1: If the WUE bit is set with the ABDEN bit,

Auto-Baud Rate Detection will occur on

the byte following the Break character

(see Section 20.3.4 “Auto-Wake-up on

Sync Break Character”).

2: It is up to the user to determine that the

incoming character baud rate is within the

range of the selected BRG clock source.

Some combinations of oscillator frequency

and EUSART baud rates are not possible

due to bit error rates. Overall system timing

and communication baud rates must be

taken into consideration when using the

Auto-Baud Rate Detection feature.

3: To maximize baud rate range, setting

the BRG16 bit is recommended if the

auto-baud feature is used.

BRG16 BRGH BRG Counter Clock

00 FOSC/512

01 FOSC/256

10 FOSC/128

11 FOSC/32

BRG Value

RX Pin

ABDEN bit

RCIF bit

Bit 0 Bit 1

(Interrupt)

Read

RCREG

BRG Clock

Start

Auto-Cleared

Set by user

XXXXh 0000h

Edge #1

Bit 2 Bit 3

Edge #2

Bit 4 Bit 5

Edge #3

Bit 6 Bit 7

Edge #4

001Ch

Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.

SPBRG XXXXh 1Ch

SPBRGH XXXXh 00h

Edge #5

Stop Bit

PIC18F2331/2431/4331/4431

DS39616D-page 226  2010 Microchip Technology Inc.

20.3 EUSART Asynchronous Mode

The Asynchronous mode of operation is selected by

clearing the SYNC bit (TXSTA<4>). In this mode, the

EUSART uses standard Non-Return-to-Zero (NRZ) for-

mat (one Start bit, eight or nine data bits and one Stop

bit). The most common data format is 8 bits. An on-chip

dedicated 8-bit/16-bit Baud Rate Generator can be

used to derive standard baud rate frequencies from the

oscillator.

The EUSART transmits and receives the LSb first. The

EUSART’s transmitter and receiver are functionally

independent, but use the same data format and baud

rate. The Baud Rate Generator produces a clock, either

x16 or x64 of the bit shift rate, depending on the BRGH

and BRG16 bits (TXSTA<2> and BAUDCON<3>). Par-

ity is not supported by the hardware but can be

implemented in software and stored as the 9th data bit.

Asynchronous mode is available in all Low-Power

modes; it is available in Sleep mode only when Auto-

Wake-up on Sync Break is enabled. When in PRI_IDLE

mode, no changes to the Baud Rate Generator values

are required; however, other Low-Power mode clocks

may operate at another frequency than the primary

clock. Therefore, the Baud Rate Generator values may

need to be adjusted.

When operating in Asynchronous mode, the EUSART

module consists of the following important elements:

• Baud Rate Generator

• Sampling Circuit

• Asynchronous Transmitter

• Asynchronous Receiver

• Auto-Wake-up on Sync Break Character

• 12-Bit Break Character Transmit

• Auto-Baud Rate Detection

20.3.1 EUSART ASYNCHRONOUS

TRANSMITTER

The EUSART transmitter block diagram is shown in

Figure 20-2. The heart of the transmitter is the Transmit

(Serial) Shift Register (TSR). The Shift register obtains

its data from the Read/Write Transmit Buffer register,

TXREG. The TXREG register is loaded with data in

software. The TSR register is not loaded until the Stop

bit has been transmitted from the previous load. As

soon as the Stop bit is transmitted, the TSR is loaded

with new data from the TXREG register (if available).

Once the TXREG register transfers the data to the TSR

empty and flag bit, TXIF (PIR1<4>), is set. This inter-

rupt can be enabled/disabled by setting/clearing

enable bit, TXIE (PIE1<4>). Flag bit, TXIF, will be set,

regardless of the state of enable bit TXIE and cannot be

cleared in software. Flag bit, TXIF, is not cleared

immediately upon loading the Transmit Buffer register,

TXREG. TXIF becomes valid in the second instruction

cycle following the load instruction. Polling TXIF

immediately following a load of TXREG will return

invalid results.

While flag bit, TXIF, indicates the status of the TXREG

status of the TSR register. Status bit, TRMT, is a read-

only bit, which is set when the TSR register is empty.

No interrupt logic is tied to this bit, so the user has to

poll this bit in order to determine if the TSR register is

empty.

To set up an Asynchronous Transmission:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

bit, SYNC, and setting bit, SPEN.

3. If interrupts are desired, set enable bit, TXIE.

4. If 9-bit transmission is desired, set transmit bit,

TX9. Can be used as address/data bit.

5. Enable the transmission by setting bit, TXEN,

which will also set bit, TXIF.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit, TX9D.

7. Load data to the TXREG register (starts

transmission).

If using interrupts, ensure that the GIE and PEIE bits in

the INTCON register (INTCON<7:6>) are set.

Note 1: The TSR register is not mapped in data

memory, so it is not available to the user.

2: Flag bit, TXIF, is set when enable bit,

TXEN, is set.

 2010 Microchip Technology Inc. DS39616D-page 227

PIC18F2331/2431/4331/4431

FIGURE 20-2: EUSART TRANSMIT BLOCK DIAGRAM

FIGURE 20-3: ASYNCHRONOUS TRANSMISSION

FIGURE 20-4: ASYNCHRONOUS T RANSMISSION (BACK TO BACK)

TXIF

TXIE

Interrupt

TXEN Baud Rate CLK

SPBRG

Baud Rate Generator

TX9D

MSb LSb

Data Bus

TXREG Register

TSR Register

(8) 0

TX9

TRMT SPEN

RC6/TX/CK/SS Pin

Pin Buffer

and Control



SPBRGH

BRG16

Word 1

Transmit Shift Reg

Start bit bit 0 bit 1 bit 7/8

Write to TXREG

BRG Output

(Shift Clock)

RC6/TX/CK/SS

TXIF bit

(Interrupt Reg. Flag)

TRMT bit

(Transmit Shift

Reg. Empty Flag)

1 TCY

(pin)

Word 1

Stop bit

Transmit Shift Reg.

Write to TXREG

BRG Output

(Shift Clock)

RC6/TX/CK/SS

TXIF bit

(Interrupt Reg. Flag)

TRMT bit

(Transmit Shift

Reg. Empty Flag)

Word 1 Word 2

Stop bit Start bit

Transmit Shift Reg.

Word 1 Word 2

bit 0 bit 1 bit 7/8 bit 0

Note: This timing diagram shows two consecutive transmissions.

1 TCY

(pin) Start bit

PIC18F2331/2431/4331/4431

DS39616D-page 228  2010 Microchip Technology Inc.

TABLE 20-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

TXREG EUSART Transmit Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON —RCIDL —SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for asynchronous transmission.

 2010 Microchip Technology Inc. DS39616D-page 229

PIC18F2331/2431/4331/4431

20.3.2 EUSART ASYNCHRONOUS

RECEIVER

The receiver block diagram is shown in Figure 20-5.

The data is received on the RC7/RX/DT/SDO pin and

drives the data recovery block. The data recovery block

is actually a high-speed shifter operating at x16 times

the baud rate, whereas the main receive serial shifter

operates at the bit rate or at FOSC. This mode would

typically be used in RS-232 systems.

To set up an Asynchronous Reception:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

bit, SYNC, and setting bit, SPEN.

3. If interrupts are desired, set enable bit, RCIE.

4. If 9-bit reception is desired, set bit, RX9.

5. Enable the reception by setting bit, CREN.

6. Flag bit, RCIF, will be set when reception is com-

plete and an interrupt will be generated if enable

bit, RCIE, was set.

7. Read the RCSTA register to get the 9th bit (if

enabled) and determine if any error occurred

during reception.

8. Read the 8-bit received data by reading the

RCREG register.

9. If any error occurred, clear the error by clearing

enable bit, CREN.

10. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

20.3.3 SETTING UP 9-BIT MODE WITH

ADDRESS DETECT

This mode would typically be used in RS-485 systems.

To set up an Asynchronous Reception with Address

Detect Enable:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

the SYNC bit and setting the SPEN bit.

3. If interrupts are required, set the RCEN bit and

select the desired priority level with the RCIP bit.

4. Set the RX9 bit to enable 9-bit reception.

5. Set the ADDEN bit to enable address detect.

6. Enable reception by setting the CREN bit.

7. The RCIF bit will be set when reception is com-

plete. The interrupt will be Acknowledged if the

RCIE and GIE bits are set.

8. Read the RCSTA register to determine if any

error occurred during reception, as well as read

bit 9 of data (if applicable).

9. Read RCREG to determine if the device is being

addressed.

10. If any error occurred, clear the CREN bit.

11. If the device has been addressed, clear the

ADDEN bit to allow all received data into the

receive buffer and interrupt the CPU.

FIGU RE 20-5: EUS ART RE CEIVE BLOC K DIAG RAM

x64 Baud Rate CLK

Baud Rate Generator

RC7/RX/DT/SDO

Pin Buffer

and Control

SPEN

Data

Recovery

CREN OERR FERR

RSR Register

MSb LSb

RX9D RCREG Register

FIFO

Interrupt RCIF

RCIE

Data Bus

 64

 16

Stop Start

(8) 7 1 0

RX9



SPBRG

SPBRGHBRG16

 4

PIC18F2331/2431/4331/4431

DS39616D-page 230  2010 Microchip Technology Inc.

To set up an Asynchronous Transmission:

1. Initialize the SPBRG register for the appropriate

baud rate. If a high-speed baud rate is desired,

set bit, BRGH (see Section 20.2 “EUSART

Baud Rate Generator (BRG)”).

2. Enable the asynchronous serial port by clearing

bit, SYNC, and setting bit, SPEN.

3. If interrupts are desired, set enable bit, TXIE.

4. If 9-bit transmission is desired, set transmit bit,

TX9. Can be used as address/data bit.

5. Enable the transmission by setting bit, TXEN,

which will also set bit, TXIF.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit, TX9D.

7. Load data to the TXREG register (starts

transmission).

If using interrupts, ensure that the GIE and PEIE bits in

the INTCON register (INTCON<7:6>) are set.

FIGURE 20-6: ASYNCHRONOUS RECEPTION

TABLE 20-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

RCREG EUSART Receive Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON — RCIDL —SCKP BRG16 — WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for asynchronous reception.

Start

bit bit 7/8bit 1bit 0 bit 7/8 bit 0

Stop

bit

Start

bit bit 7/8

RX (Pin)

Reg

Rcv Buffer Reg

Rcv Shift

Read Rcv

Buffer Reg

RCREG

RCIF

(Interrupt Flag)

OERR bit

CREN

Word 1

RCREG

Word 2

RCREG

Stop

bit

Note: This timing diagram shows three words appearing on the RX input. The RCREG (Receive Buffer) is read after

the third word, causing the OERR (Overrun) bit to be set.

Start

bit

Stop

bit

 2010 Microchip Technology Inc. DS39616D-page 231

PIC18F2331/2431/4331/4431

20.3.4 AUTO-WAKE-UP ON SYNC BREAK

CHARACTER

During Sleep mode, all clocks to the EUSART are

suspended. Because of this, the Baud Rate Generator

is inactive and a proper byte reception cannot be per-

formed. The auto-wake-up feature allows the controller

to wake-up due to activity on the RX/DT line, while the

EUSART is operating in Asynchronous mode.

The auto-wake-up feature is enabled by setting the

WUE bit (BAUDCON<1>). Once set, the typical receive

sequence on RX/DT is disabled and the EUSART

remains in an Idle state, monitoring for a wake-up event

independent of the CPU mode. A wake-up event con-

sists of a high-to-low transition on the RX/DT line. (This

coincides with the start of a Sync Break or a Wake-up

Signal character for the LIN/J2602 protocol.)

Following a wake-up event, the module generates an

RCIF interrupt. The interrupt is generated synchro-

nously to the Q clocks in normal operating modes

(Figure 20-7), and asynchronously if the device is in

Sleep mode (Figure 20-8). The interrupt condition is

cleared by reading the RCREG register.

The WUE bit is automatically cleared once a low-to-

high transition is observed on the RX line following the

wake-up event. At this point, the EUSART module is in

Idle mode and returns to normal operation. This signals

to the user that the Sync Break event is over.

20.3.4.1 Special Considerations Using

Auto-Wake-up

Since Auto-Wake-up functions by sensing rising edge

transitions on RX/DT, information with any state changes

before the Stop bit may signal a false end-of-character

and cause data or framing errors. To work properly,

therefore, the initial characters in the transmission must

be all ‘0’s. This can be 00h (8 bits) for standard RS-232

devices, or 000h (12 bits) for LIN/J2602 bus.

Oscillator start-up time must also be considered,

especially in applications using oscillators with longer

start-up intervals (i.e., LP, XT or HS/PLL mode). The

Sync Break (or Wake-up Signal) character must be of

sufficient length, and be followed by a sufficient inter-

val, to allow enough time for the selected oscillator to

start and provide proper initialization of the EUSART.

20.3.4.2 Special Considerations Using the

WUE Bit

The timing of WUE and RCIF events may cause some

confusion when it comes to determining the validity of

received data. As noted, setting the WUE bit places the

EUSART in an Idle mode. The wake-up event causes

a receive interrupt by setting the RCIF bit. The WUE bit

is cleared after this when a rising edge is seen on RX/

DT. The interrupt condition is then cleared by reading

the RCREG register. Ordinarily, the data in RCREG will

be dummy data and should be discarded.

The fact that the WUE bit has been cleared (or is still

set), and the RCIF flag is set, should not be used as an

indicator of the integrity of the data in RCREG. Users

should consider implementing a parallel method in

firmware to verify received data integrity.

To assure that no actual data is lost, check the RCIDL

bit to verify that a receive operation is not in process. If

a receive operation is not occurring, the WUE bit may

then be set just prior to entering the Sleep mode.

FIGURE 20-7: AUTO-W AKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION

FIGURE 20-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

WUE bit(1)

RX/DT Line

RCIF

Cleared Due to User Read of RCREG

Note 1: The EUSART remains in Idle while the WUE bit is set.

Bit Set by User Auto-Cleared

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

WUE bit(2)

RX/DT Line

RCIF

Cleared Due to User Read of RCREG

Sleep Command Executed

Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur while the stposc signal is still active.

This sequence should not depend on the presence of Q clocks.

2: The EUSART remains in Idle while the WUE bit is set.

Sleep Ends

Bit Set by User

Note 1

Auto-Cleared

PIC18F2331/2431/4331/4431

DS39616D-page 232  2010 Microchip Technology Inc.

20.3.5 BREAK CHARACTER SEQUENCE

The Enhanced USART module has the capability of

sending the special Break character sequences that

are required by the LIN/J2602 bus standard. The Break

character transmit consists of a Start bit, followed by

twelve ‘0’ bits and a Stop bit. The Frame Break charac-

ter is sent whenever the SENDB and TXEN bits

(TXSTA<3> and TXSTA<5>) are set while the Transmit

Shift register is loaded with data. Note that the value of

data written to TXREG will be ignored and all ‘0’s will

be transmitted.

The SENDB bit is automatically reset by hardware after

the corresponding Stop bit is sent. This allows the user

to preload the transmit FIFO with the next transmit byte

following the Break character (typically, the Sync

character in the LIN/J2602 specification).

Note that the data value written to the TXREG for the

Break character is ignored. The write simply serves the

purpose of initiating the proper sequence.

The TRMT bit indicates when the transmit operation is

active or Idle, just as it does during normal transmis-

sion. See Figure 20-9 for the timing of the Break

character sequence.

20.3.5.1 Break and Sync Transmit Sequence

The following sequence will send a message frame

header made up of a Break, followed by an Auto-Baud

Sync byte. This sequence is typical of a LIN/J2602 bus

master.

1. Configure the EUSART for the desired mode.

2. Set the TXEN and SENDB bits to setup the

Break character.

3. Load the TXREG with a dummy character to

initiate transmission (the value is ignored).

4. Write ‘55h’ to TXREG to load the Sync character

into the transmit FIFO buffer.

5. After the Break has been sent, the SENDB bit is

reset by hardware. The Sync character now

transmits in the preconfigured mode.

When the TXREG becomes empty, as indicated by the

TXIF, the next data byte can be written to TXREG.

20.3.6 RECEIVING A BREAK CHARACTER

The Enhanced USART module can receive a Break

character in two ways.

The first method forces configuration of the baud rate

at a frequency of 9/13 of the typical speed. This allows

for the Stop bit transition to be at the correct sampling

location (13 bits for Break versus Start bit and 8 data

bits for typical data).

The second method uses the auto-wake-up feature

described in Section 20.3.4 “Auto-Wake-up on Sync

Break Character”. By enabling this feature, the

EUSART will sample the next two transitions on RX/DT,

cause an RCIF interrupt and receive the next data byte

followed by another interrupt.

Note that following a Break character, the user will

typically want to enable the Auto-Baud Rate Detect

feature. For both methods, the user can set the ABD bit

before placing the EUSART in its Sleep mode.

FIGU RE 20-9: SEND BREA K CHAR ACT ER SEQUE NC E

Write to TXREG

BRG Output

(Shift Clock)

Start Bit Bit 0 Bit 1 Bit 11 Stop Bit

Break

TXIF bit

(Interrupt Reg. Flag)

TX (Pin)

TRMT bit

(Transmit Shift

Reg. Empty Flag)

SENDB

(Transmit Shift

Reg. Empty Flag)

SENDB sampled here Auto-Cleared

Dummy Write

 2010 Microchip Technology Inc. DS39616D-page 233

PIC18F2331/2431/4331/4431

20.4 EUSART Synchronous Master

Mode

The Synchronous Master mode is entered by setting

the CSRC bit (TXSTA<7>). In this mode, the data is

transmitted in a half-duplex manner (i.e., transmission

and reception do not occur at the same time). When

transmitting data, the reception is inhibited and vice

versa. Synchronous mode is entered by setting bit

SYNC (TXSTA<4>). In addition, enable bit SPEN

(RCSTA<7>) is set in order to configure the RC6/TX/

CK/SS and RC7/RX/DT/SDO I/O pins to CK (clock)

and DT (data) lines, respectively.

The Master mode indicates that the processor trans-

mits the master clock on the CK line. Clock polarity is

selected with the SCKP bit (BAUDCON<4>). Setting

SCKP sets the Idle state on CK as high, while clearing

the bit, sets the Idle state low. This option is provided to

support Microwire devices with this module.

20.4.1 EUSART SYNCHRONOUS MASTER

TRANSMISSION

The EUSART transmitter block diagram is shown in

Figure 20-2. The heart of the transmitter is the Transmit

(Serial) Shift Register (TSR). The Shift register obtains

its data from the Read/Write Transmit Buffer register,

TXREG. The TXREG register is loaded with data in

software. The TSR register is not loaded until the last

bit has been transmitted from the previous load. As

soon as the last bit is transmitted, the TSR is loaded

with new data from the TXREG (if available).

Once the TXREG register transfers the data to the TSR

and interrupt bit, TXIF (PIR1<4>), is set. The interrupt

can be enabled/disabled by setting/clearing enable bit,

TXIE (PIE1<4>). Flag bit, TXIF, will be set, regardless

of the state of enable bit, TXIE, and cannot be cleared

in software. It will reset only when new data is loaded

into the TXREG register.

While flag bit, TXIF, indicates the status of the TXREG

status of the TSR register. TRMT is a read-only bit which

is set when the TSR is empty. No interrupt logic is tied to

this bit, so the user must poll this bit in order to determine

if the TSR register is empty. The TSR is not mapped in

data memory, so it is not available to the user.

To set up a Synchronous Master Transmission:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the synchronous master serial port by

setting bits, SYNC, SPEN and CSRC.

3. If interrupts are desired, set enable bit, TXIE.

4. If 9-bit transmission is desired, set bit, TX9.

5. Enable the transmission by setting bit, TXEN.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit, TX9D.

7. Start transmission by loading data to the TXREG

8. If using interrupts, ensure that the GIE and PEIE bits

in the INTCON register (INTCON<7:6>) are set.

FIGURE 20-10: SYNCHRONOUS TRANSMISSION

bit 0 bit 1 bit 7

Word 1

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

bit 2 bit 0 bit 1 bit 7

RC7/RX/DT/

RC6/TX/CK/

Write to

TXREG Reg

TXIF bit

(Interrupt Flag)

TXEN bit ‘1’ ‘1’

Word 2

TRMT bit

Write Word 1 Write Word 2

Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.

SDO Pin

SS Pin

RC6/TX/CK/

SS pin

(SCKP = 0)

(SCKP = 1)

PIC18F2331/2431/4331/4431

DS39616D-page 234  2010 Microchip Technology Inc.

FIGURE 20-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)

TABLE 20-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page :

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

TXREG EUSART Transmit Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON —RCIDL — SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission.

RC7/RX/DT/SDO Pin

RC6/TX/CK/SS Pin

Write to

TXREG Reg

TXIF bit

TRMT bit

bit 0 bit 1 bit 2 bit 6 bit 7

TXEN bit

 2010 Microchip Technology Inc. DS39616D-page 235

PIC18F2331/2431/4331/4431

20.4.2 EUSART SYNCHRONOUS MASTER

RECEPTION

Once Synchronous mode is selected, reception is

enabled by setting either the Single Receive Enable bit,

SREN (RCSTA<5>), or the Continuous Receive

Enable bit, CREN (RCSTA<4>). Data is sampled on the

RC7/RX/DT/SDO pin on the falling edge of the clock.

If enable bit SREN is set, only a single word is received.

If enable bit CREN is set, the reception is continuous

until CREN is cleared. If both bits are set, then CREN

takes precedence.

To set up a Synchronous Master Reception:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the synchronous master serial port by

setting bits, SYNC, SPEN and CSRC.

3. Ensure bits, CREN and SREN, are clear.

4. If interrupts are desired, set enable bit, RCIE.

5. If 9-bit reception is desired, set bit, RX9.

6. If a single reception is required, set bit, SREN.

For continuous reception, set bit, CREN.

7. Interrupt flag bit, RCIF, will be set when

reception is complete and an interrupt will be

generated if the enable bit, RCIE, was set.

8. Read the RCSTA register to get the 9th bit (if

enabled) and determine if any error occurred

during reception.

9. Read the 8-bit received data by reading the

RCREG register.

10. If any error occurred, clear the error by clearing

bit, CREN.

11. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 20-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)

CREN bit

RC7/RX/DT/SDO

RC6/TX/CK/SS

Write to

SREN bit

RCIF bit

(Interrupt)

Read

RXREG

Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

‘

’

bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7

‘

’

Q1 Q2 Q3 Q4

Note: Timing diagram demonstrates Sync Master mode with SREN bit = 1 and BRGH bit = 0.

RC6/TX/CK/SS

(SCKP = 0)

(SCKP = 1)

PIC18F2331/2431/4331/4431

DS39616D-page 236  2010 Microchip Technology Inc.

TABLE 20-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

RCREG EUSART Receive Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON — RCIDL — SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception.

 2010 Microchip Technology Inc. DS39616D-page 237

PIC18F2331/2431/4331/4431

20.5 EUSART Synchronous Slave

Mode

Synchronous Slave mode is entered by clearing bit,

CSRC (TXSTA<7>). This mode differs from the

Synchronous Master mode in that the shift clock is

supplied externally at the RC6/TX/CK/SS pin (instead

of being supplied internally in Master mode). This

allows the device to transfer or receive data while in

any low-power mode.

20.5.1 EUSART SYNCHRONOUS SLAVE

TRANSMIT

The operation of the Synchronous Master and Slave

modes are identical, except in the case of Sleep mode.

If two words are written to the TXREG and then the

SLEEP instruction is executed, the following will occur:

a) The first word will immediately transfer to the

TSR register and transmit.

b) The second word will remain in TXREG register.

c) Flag bit, TXIF, will not be set.

d) When the first word has been shifted out of TSR,

the TXREG register will transfer the second word

to the TSR and flag bit, TXIF, will now be set.

e) If enable bit, TXIE, is set, the interrupt will wake

the chip from Sleep. If the global interrupt is

enabled, the program will branch to the interrupt

vector.

To set up a Synchronous Slave Transmission:

1. Enable the synchronous slave serial port by

setting bits, SYNC and SPEN, and clearing bit,

CSRC.

2. Clear bits, CREN and SREN.

3. If interrupts are desired, set enable bit, TXIE.

4. If 9-bit transmission is desired, set bit, TX9.

5. Enable the transmission by setting enable bit,

TXEN.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit, TX9D.

7. Start transmission by loading data to the TXREG

8. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

TABLE 20-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page :

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

TXREG EUSART Transmit Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON —RCIDL — SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.

PIC18F2331/2431/4331/4431

DS39616D-page 238  2010 Microchip Technology Inc.

20.5.2 EUSART SYNCHRONOUS SLAVE

RECEPTION

The operation of the Synchronous Master and Slave

modes is identical, except in the case of Sleep, or any

Idle mode and bit SREN, which is a “don’t care” in

Slave mode.

If receive is enabled by setting the CREN bit prior to

entering Sleep or any Idle mode, then a word may be

received while in this Low-Power mode. Once the word

is received, the RSR register will transfer the data to the

RCREG register. If the RCIE enable bit is set, the inter-

rupt generated will wake the chip from Low-Power

mode. If the global interrupt is enabled, the program will

branch to the interrupt vector.

To set up a Synchronous Slave Reception:

1. Enable the synchronous master serial port by

setting bits, SYNC and SPEN, and clearing bit,

CSRC.

2. If interrupts are desired, set enable bit, RCIE.

3. If 9-bit reception is desired, set bit, RX9.

4. To enable reception, set enable bit, CREN.

5. Flag bit, RCIF, will be set when reception is

complete. An interrupt will be generated if

enable bit, RCIE, was set.

6. Read the RCSTA register to get the 9th bit (if

enabled) and determine if any error occurred

during reception.

7. Read the 8-bit received data by reading the

RCREG register.

8. If any error occurred, clear the error by clearing

bit, CREN.

9. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

TABLE 20-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values

on Page:

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 56

RCREG EUSART Receive Register 56

TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 56

BAUDCON — RCIDL — SCKP BRG16 —WUE ABDEN 56

SPBRGH EUSART Baud Rate Generator Register High Byte 56

SPBRG EUSART Baud Rate Generator Register Low Byte 56

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.

 2010 Microchip Technology Inc. DS39616D-page 239

PIC18F2331/2431/4331/4431

21.0 10-BIT HIGH-SPEED

ANALOG-TO-DIGITAL

CONVERTER (A/D) MODULE

The high-speed Analog-to-Digital (A/D) Converter

module allows conversion of an analog signal to a

corresponding 10-bit digital number.

The A/D module supports up to 5 input channels on

PIC18F2331/2431 devices, and up to 9 channels on

the PIC18F4331/4431 devices.

This high-speed 10-bit A/D module offers the following

features:

• Up to 200K samples per second

• Two sample and hold inputs for dual-channel

simultaneous sampling

• Selectable Simultaneous or Sequential Sampling

modes

• 4-word data buffer for A/D results

• Selectable data acquisition timing

• Selectable A/D event trigger

• Operation in Sleep using internal oscillator

These features lend themselves to many applications

including motor control, sensor interfacing, data

acquisition and process control. In many cases, these

features will reduce the software overhead associated

with standard A/D modules.

The module has 9 registers:

• A/D Result High Register (ADRESH)

• A/D Result Low Register (ADRESL)

• A/D Control Register 0 (ADCON0)

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

• A/D Control Register 3 (ADCON3)

• A/D Channel Select Register (ADCHS)

• Analog I/O Select Register 0 (ANSEL0)

• Analog I/O Select Register 1 (ANSEL1)

PIC18F2331/2431/4331/4431

DS39616D-page 240  2010 Microchip Technology Inc.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— ACONV ACSCH ACMOD1 ACMOD0 GO/DONE ADON

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’

bit 5 ACONV: Auto-Conversion Continuous Loop or Single-Shot Mode Select bit

1 = Continuous Loop mode enabled

0 = Single-Shot mode enabled

bit 4 ACSCH: Auto-Conversion Single or Multi-Channel Mode bit

1 = Multi-Channel mode enabled, Single Channel mode disabled

0 = Single Channel mode enabled, Multi-Channel mode disabled

bit 3-2 ACMOD<1:0>: Auto-Conversion Mode Sequence Select bits

If ACSCH = 1:

00 = Sequential Mode 1 (SEQM1); two samples are taken in sequence:

1st sample: Group A(1)

2nd sample: Group B(1)

01 = Sequential Mode 2 (SEQM2); four samples are taken in sequence:

1st sample: Group A(1)

2nd sample: Group B(1)

3rd sample: Group C(1)

4th sample: Group D(1)

10 = Simultaneous Mode 1 (STNM1); two samples are taken simultaneously:

1st sample: Group A and Group B(1)

11 = Simultaneous Mode 2 (STNM2); two samples are taken simultaneously:

1st sample: Group A and Group B(1)

2nd sample: Group C and Group D(1)

If ACSCH = 0, Auto-Conversion Single Channel Sequence Mode Enabled:

00 = Single Channel Mode 1 (SCM1); Group A is taken and converted(1)

01 = Single Channel Mode 2 (SCM2); Group B is taken and converted(1)

10 = Single Channel Mode 3 (SCM3); Group C is taken and converted(1)

11 = Single Channel Mode 4 (SCM4); Group D is taken and converted(1)

bit 1 GO/DONE: A/D Conversion Status bit

1 = A/D conversion cycle in progress. Setting this bit starts the A/D conversion cycle. If Auto-

Conversion Single-Shot mode is enabled (ACONV = 0), this bit is automatically cleared by

hardware when the A/D conversion (single or multi-channel depending on ACMOD settings) has

completed. If Auto-Conversion Continuous Loop mode is enabled (ACONV = 1), this bit remains

set after the user/trigger has set it (continuous conversions). It may be cleared manually by the user

to stop the conversions.

0 = A/D conversion or multiple conversions completed/not in progress

bit 0 ADON: A/D On bit

1 = A/D Converter module is enabled (after brief power-up delay, starts continuous sampling)

0 = A/D Converter module is disabled

Note 1: Groups A, B, C, and D refer to the ADCHS register.

 2010 Microchip Technology Inc. DS39616D-page 241

PIC18F2331/2431/4331/4431

R/W-0 R/W-0 U-0 R/W-0 R-0 R-0 R-0 R-0

VCFG1 VCFG0 — FIFOEN BFEMT BFOVL ADPNT1 ADPNT0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 VCFG<1:0>: A/D VREF+ and A/D VREF- Source Selection bits

00 =V

REF+ = AVDD, VREF- = AVSS (AN2 and AN3 are analog inputs or digital I/O)

01 =V

REF+ = External VREF+, VREF- = AVSS (AN2 is an analog input or digital I/O)

10 =V

REF+ = AVDD, VREF- = External VREF- (AN3 is an analog input or digital I/O)

11 =V

REF+ = External VREF-, VREF- = External VREF-

bit 5 Unimplemented: Read as ‘0’

bit 4 FIFOEN: FIFO Buffer Enable bit

1 = FIFO is enabled

0 = FIFO is disabled

bit 3 BFEMT: Buffer Empty bit

1 = FIFO is empty

0 = FIFO is not empty (at least one of four locations has unread A/D result data)

bit 2 BFOVFL: Buffer Overflow bit

1 = A/D result has overwritten a buffer location that has unread data

0 = A/D result has not overflowed

bit 1-0 ADPNT<1:0>: Buffer Read Pointer Location bits

Designates the location to be read next.

00 = Buffer Address 0

01 = Buffer Address 1

10 = Buffer Address 2

11 = Buffer Address 3

PIC18F2331/2431/4331/4431

DS39616D-page 242  2010 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADFM ACQT3 ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 ADFM: A/D Result Format Select bit

1 = Right justified

0 = Left justified

bit 6-3 ACQT<3:0>: A/D Acquisition Time Select bits

0000 = No delay (conversion starts immediately when GO/DONE is set)(1)

0001 = 2 TAD

0010 = 4 TAD

0011 = 6 TAD

0100 = 8 TAD

0101 = 10 TAD

0110 = 12 TAD

0111 = 16 TAD

1000 = 20 TAD

1001 = 24 TAD

1010 = 28 TAD

1011 = 32 TAD

1100 = 36 TAD

1101 = 40 TAD

1110 = 48 TAD

1111 = 64 TAD

bit 2-0 ADCS<2:0>: A/D Conversion Clock Select bits

000 = FOSC/2

001 = FOSC/8

010 = FOSC/32

011 = FRC/4

100 = FOSC/4

101 = FOSC/16

110 = FOSC/64

111 = FRC (Internal A/D RC Oscillator)

Note 1: If the A/D RC clock source is selected, a delay of one T

CY (instruction cycle) is added before the A/D clock

starts. This allows the SLEEP instruction to be executed before starting a conversion.

 2010 Microchip Technology Inc. DS39616D-page 243

PIC18F2331/2431/4331/4431

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADRS1 ADRS0 — SSRC4(1) SSRC3(1) SSRC2(1) SSRC1(1) SSRC0(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 ADRS<1:0>: A/D Result Buffer Depth Interrupt Select Control for Continuous Loop Mode bits

The ADRS bits are ignored in Single-Shot mode.

00 = Interrupt is generated when each word is written to the buffer

01 = Interrupt is generated when the 2nd and 4th words are written to the buffer

10 = Interrupt is generated when the 4th word is written to the buffer

11 = Unimplemented

bit 5 Unimplemented: Read as ‘0’

bit 4-0 SSRC<4:0>: A/D Trigger Source Select bits(1)

00000 = All triggers disabled

xxxx1 = External interrupt RC3/INT0 starts A/D sequence

xxx1x = Timer5 starts A/D sequence

xx1xx = Input Capture 1 (IC1) starts A/D sequence

x1xxx = CCP2 compare match starts A/D sequence

1xxxx = Power Control PWM module rising edge starts A/D sequence

Note 1: The SSRC<4:0> bits can be set such that any of the triggers will start a conversion (e.g., SSRC<4:0> = 00101

will trigger the A/D conversion sequence when RC3/INT0 or Input Capture 1 event occurs).

PIC18F2331/2431/4331/4431

DS39616D-page 244  2010 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GDSEL1 GDSEL0 GBSEL1 GBSEL0 GCSEL1 GCSEL0 GASEL1 GASEL0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 GDSEL<1:0>: Group D Select bits

S/H-2 positive input.

00 = AN3

01 = AN7(1)

1x = Reserved

bit 5-4 GBSEL<1:0>: Group B Select bits

S/H-2 positive input.

00 = AN1

01 = AN5(1)

1x = Reserved

bit 3-2 GCSEL<1:0>: Group C Select bits

S/H-1 positive input.

00 = AN2

01 = AN6(1)

1x = Reserved

bit 1-0 GASEL<1:0>: Group A Select bits

S/H-1 positive input.

00 = AN0

01 = AN4

10 = AN8(1)

11 = Reserved

Note 1: AN5 through AN8 are available only in PIC18F4331/4431 devices.

 2010 Microchip Technology Inc. DS39616D-page 245

PIC18F2331/2431/4331/4431

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-0 ANS<7:0>: Analog Input Function Select bits

Correspond to pins, AN<7:0>.

1 = Analog input

0 = Digital I/O

Note 1: Setting a pin to an analog input disables the digital input buffer. The corresponding TRIS bit should be set

for an input and cleared for an output (analog or digital). The ANSx bits directly correspond to the ANx pins

(e.g., ANS0 = AN0, ANS1 = AN1, etc.). Unused ANSx bits are read as ‘0’.

2: ANS7 through ANS5 are available only on PIC18F4331/4431 devices.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-1

— — — — — — —ANS8

(2)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-1 Unimplemented: Read as ‘0’

bit 0 ANS8: Analog Input Function Select bit(2)

1 = Analog input

0 = Digital I/O

Note 1: Setting a pin to an analog input disables the digital input buffer. The corresponding TRIS bit should be set

for an input and cleared for an output (analog or digital). The ANSx bits directly correspond to the ANx pins

(e.g., ANS8 = AN8, ANS9 = AN9, etc.). Unused ANSx bits are read as ‘0’.

2: ANS8 is available only on PIC18F4331/4431 devices.

PIC18F2331/2431/4331/4431

DS39616D-page 246  2010 Microchip Technology Inc.

The A/D channels are grouped into four sets of 2 or

3 channels. For the PIC18F2331/2431 devices, AN0

and AN4 are in Group A, AN1 is in Group B, AN2 is in

Group C and AN3 is in Group D. For the PIC18F4331/

4431 devices, AN0, AN4 and AN8 are in Group A, AN1

and AN5 are in Group B, AN2 and AN6 are in Group C

and AN3 and AN7 are in Group D. The selected chan-

nel in each group is selected by configuring the A/D

Channel Select Register, ADCHS.

The analog voltage reference is software selectable to

either the device’s positive and negative analog supply

voltage (AVDD and AVSS), or the voltage level on the

RA3/AN3/VREF+/CAP2/QEA and RA2/AN2/VREF-/

CAP1/INDX, or some combination of supply and

external sources. Register ADCON1 controls the

voltage reference settings.

The A/D Converter has a unique feature of being able

to operate while the device is in Sleep mode. To

operate in Sleep, the A/D conversion clock must be

derived from the A/D’s internal RC oscillator.

A device Reset forces all registers to their Reset state.

This forces the A/D module to be turned off and any

conversion in progress is aborted.

Each port pin associated with the A/D Converter can

individually be configured as an analog input or digital

I/O using the ANSEL0 and ANSEL1 registers. The

ADRESH and ADRESL registers contain the value in

the result buffer pointed to by ADPNT<1:0>

(ADCON1<1:0>). The result buffer is a 4-deep circular

buffer that has a Buffer Empty status bit, BFEMT

(ADCON1<3>), and a Buffer Overflow status bit,

BFOVFL (ADCON1<2>).

FIGURE 21-1: A/D BLOCK DIAGRAM

ADRESH, ADRESL

VREF+

AVSS(2)

AVDD(2)

ADC

AN0

AN4

S/H-1

S/H-2

VREF-

Analog

MUX

Analog

MUX

AN8(1)

AN2/VREF-

AN6(1)

Seq.

Cntrl.

MUX

4x10-Bit FIFO

VCFG<1:0>

VREFL VREFH

ACMOD<1:0>,

AVSS(2)

AVSS

ADPNT<1:0>

ACMOD<1:0>,

AN1

AN5(1)

AN3/VREF+

AN7(1)

ACONV

ACSCH

ACMODx

Note 1: AN5 through AN8 are available only on PIC18F4331/4431 devices.

2: I/O pins have diode protection to VDD and VSS.

GxSEL<1:0>

S/H

 2010 Microchip Technology Inc. DS39616D-page 247

PIC18F2331/2431/4331/4431

21.1 Configuring the A/D Converter

The A/D Converter has two types of conversions, two

modes of operation and eight different Sequencing

modes. These features are controlled by the ACONV

bit (ADCON0<5>), ACSCH bit (ADCON0<4>) and

ACMOD<1:0> bits (ADCON0<3:2>). In addition, the

A/D channels are divided into four groups as defined

in the ADCHS register. Ta b l e 2 1 - 1 shows the

sequence configurations as controlled by the ACSCH

and ACMOD<1:0> bits.

21.1.1 CONVERSION TYPE

Two types of conversions exist in the high-speed 10-bit

A/D Converter module that are selected using the

ACONV bit. Single-Shot mode allows a single conversion

or sequence to be enabled when ACONV = 0. At the end

of the sequence, the GO/DONE bit will be automatically

cleared and the interrupt flag, ADIF, will be set. When

using Single-Shot mode and configured for

Simultaneous mode, STNM2, acquisition time must be

used to ensure proper conversion of the analog input

signals.

Continuous Loop mode allows the defined sequence to

be executed in a continuous loop when ACONV = 1. In

this mode, either the user can trigger the start of

conversion by setting the GO/DONE bit, or one of the

A/D triggers can start the conversion. The interrupt flag,

ADIF, is set based on the configuration of the bits,

ADRS<1:0> (ADCON3<7:6>). In Simultaneous modes,

STNM1 and STNM2 acquisition time must be config-

ured to ensure proper conversion of the analog input

signals.

21.1.2 CONVERSION MODE

The ACSCH bit (ADCON0<4>) controls how many

channels are used in the configured sequence. When

clear, the A/D is configured for single channel conver-

sion and will convert the group selected by the

ACMOD<1:0> bits and the channel selected by the

GxSEL<1:0> bits (ADCHS register). When ACSCH = 1,

the A/D is configured for multiple channel conversion

and the sequence is defined by ACMOD<1:0>.

TABLE 21-1: AUTO-CONVERSION SEQUENCE CONFIGURATION S

Mode ACSCH ACMOD<1:0> Description

Multi-Channel Sequential Mode 1

(SEQM1)

100Groups A and B are sampled and converted

sequentially.

Multi-Channel Sequential Mode 2

(SEQM2)

101Groups A, B, C and D are sampled and converted

sequentially.

Multi-Channel Simultaneous Mode 1

(STNM1)

110Groups A and B are sampled simultaneously and

converted sequentially.

Multi-Channel Simultaneous Mode 2

(STNM2)

111Groups A and B are sampled simultaneously, then

converted sequentially. Then, Group C and D are

sampled simultaneously, then converted

sequentially.

Single Channel Mode 1 (SCM1) 000Group A is sampled and converted.

Single Channel Mode 2 (SCM2) 001Group B is sampled and converted.

Single Channel Mode 3 (SCM3) 010Group C is sampled and converted.

Single Channel Mode 4 (SCM4) 011Group D is sampled and converted.

PIC18F2331/2431/4331/4431

DS39616D-page 248  2010 Microchip Technology Inc.

21.1.3 CONVERSION SEQUENCING

The ACMOD<1:0> bits control the sequencing of the

A/D conversions. When ACSCH = 0, the A/D is

configured to sample and convert a single channel.

The ACMOD bits select which group to perform the

conversions and the GxSEL<1:0> bits select which

channel in the group is to be converted. If Single-Shot

mode is enabled, the A/D interrupt flag will be set after

the channel is converted. If Continuous Loop mode is

enabled, the A/D interrupt flag will be set according to

the ADRS<1:0> bits.

When ACSCH = 1, multiple channel sequencing is

enabled and two submodes can be selected. The first

mode is Sequential mode with two settings. The first set-

ting is called SEQM1, and first samples and converts the

selected Group A channel, and then samples and

converts the selected Group B channel. The second

mode is called SEQM2, and it samples and converts a

Group A channel, Group B channel, Group C channel

and finally, a Group D channel.

The second multiple channel sequencing submode is

Simultaneous Sampling mode. In this mode, there are

also two settings. The first setting is called STNM1, and

uses the two sample and hold circuits on the A/D

module. The selected Group A and B channels are

simultaneously sampled and then the Group A channel

is converted followed by the conversion of the Group B

channel. The second setting is called STNM2, and

starts the same as STNM1, but follows it with a

simultaneous sample of Group C and D channels. The

A/D module will then convert the Group C channel

followed by the Group D channel.

21.1.4 TRIGGERING A/D CONVERSIONS

The PIC18F2331/2431/4331/4431 devices are capable

of triggering conversions from many different sources.

The same method used by all other microcontrollers of

setting the GO/DONE bit still works. The other trigger

sources are:

• RC3/INT0 Pin

• Timer5 Overflow

• Input Capture 1 (IC1)

• CCP2 Compare Match

• Power Control PWM Rising Edge

These triggers are enabled using the SSRC<4:0> bits

(ADCON3<4:0>). Any combination of the five sources

can trigger a conversion by simply setting the corre-

sponding bit in ADCON3. When the trigger occurs, the

GO/DONE bit is automatically set by the hardware and

then cleared once the conversion completes.

21.1.5 A/D MODULE INITIALIZATION

STEPS

The following steps should be followed to initialize the

A/D module:

1. Configure the A/D module:

a) Configure the analog pins, voltage reference

and digital I/O.

b) Select the A/D input channels.

c) Select the A/D Auto-Conversion mode

(Single-Shot or Continuous Loop).

d) Select the A/D conversion clock.

e) Select the A/D conversion trigger.

2. Configure the A/D interrupt (if required):

a) Set the GIE bit.

b) Set the PEIE bit.

c) Set the ADIE bit.

d) Clear the ADIF bit.

e) Select the A/D trigger setting.

f) Select the A/D interrupt priority.

3. Turn on ADC:

a) Set the ADON bit in the ADCON0 register.

b) Wait the required power-up setup time,

about 5-10 s.

4. Start the sample/conversion sequence:

a) Sample for a minimum of 2 T

AD and start

the conversion by setting the GO/DONE bit.

The GO/DONE bit is set by the user in

software or by the module if initiated by a

trigger.

b) If T

ACQ is assigned a value (multiple of TAD),

then setting the GO/DONE bit starts a

sample period of the TACQ value, then starts

a conversion.

5. Wait for A/D conversion/conversions to

complete using one of the following options:

a) Poll for the GO/DONE bit to be cleared if in

Single-Shot mode.

b) Wait for the A/D Interrupt Flag (ADIF) to be

set.

c) Poll for the BFEMT bit to be cleared to

signify that at least the first conversion has

completed.

6. Read the A/D results, clear the ADIF flag,

reconfigure the trigger.

 2010 Microchip Technology Inc. DS39616D-page 249

PIC18F2331/2431/4331/4431

21.2 A/D Result Buffer

The A/D module has a 4-level result buffer with an

address range of 0 to 3, enabled by setting the FIFOEN

bit in the ADCON1 register. This buffer is implemented

in a circular fashion, where the A/D result is stored in

one location and the address is incremented. If the

address is greater than 3, the pointer is wrapped back

around to 0. The result buffer has a Buffer Empty Flag,

BFEMT, indicating when any data is in the buffer. It also

has a Buffer Overflow Flag, BFOVFL, which indicates

when a new sample has overwritten a location that was

not previously read.

Associated with the buffer is a pointer to the address for

the next read operation. The ADPNT<1:0> bits

configure the address for the next read operation.

These bits are read-only.

The Result Buffer also has a configurable interrupt

trigger level that is configured by the ADRS<1:0> bits.

The user has three selections: interrupt flag set on

every write to the buffer, interrupt on every second write

to the buffer, or interrupt on every fourth write to the

buffer. ADPNT<1:0> are reset to ‘00’ every time a

conversion sequence is started (either by setting the

GO/DONE bit or on a trigger).

21.3 A/D Acquisition Requirements

For the A/D Converter to meet its specified accuracy,

the charge holding capacitor (CHOLD) must be allowed

to fully charge to the input channel voltage level. The

analog input model is shown in Figure 21-2. The

source impedance (RS) and the internal sampling

switch (RSS) impedance directly affect the time

required to charge the capacitor CHOLD. The sampling

switch (RSS) impedance varies over the device voltage

(VDD). The source impedance affects the offset voltage

at the analog input (due to pin leakage current). The

maximum recommended impedance for analog

sources is 2.5 k. After the analog input channel is

selected (changed), the channel must be sampled for

at least the minimum acquisition time before starting a

conversion.

To calculate the minimum acquisition time,

Equation 21-1 may be used. This equation assumes

that 1/2 LSb error is used (1024 steps for the A/D). The

1/2 LSb error is the maximum error allowed for the A/D

to meet its specified resolution.

Example 21-1 shows the calculation of the minimum

required acquisition time T

ACQ. In this case, the

converter module is fully powered up at the outset and

therefore, the amplifier settling time, TAMP, is negligible.

This calculation is based on the following application

system assumptions:

CHOLD =9 pF

Rs = 100

Conversion Error 1/2 LSb

VDD =5V  Rss = 6 k

Temperature = 50°C (system max.)

VHOLD = 0V @ time = 0

EQUATION 21-1: ACQUISITION TIME

EQUATION 21-2: MINIMUM A/D HOLDING CAPACITOR CHARGING TIME

Note: When right justified, reading ADRESL

increments the ADPNT<1:0> bits. When

left justified, reading ADRESH increments

the ADPNT<1:0> bits.

Note: When the conversion is started, the

holding capacitor is disconnected from the

input pin.

TACQ = Amplifier Settling Time + Holdi ng Capacit or Charging Time + Temperature Coefficient

AMP + TC + TCOFF

VHOLD = (VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS)))

TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048)

PIC18F2331/2431/4331/4431

DS39616D-page 250  2010 Microchip Technology Inc.

EXAMPL E 21-1 : CALCULAT ING TH E MINIM UM RE QUI RED ACQU ISI TION T I ME

FIGURE 21-2: ANALOG INPUT MODEL

TACQ =TAMP + TC + TCOFF

TAMP = Negligible

TCOFF = (Temp – 25°C)(0.005 s/°C)

(50°C – 25°C)(0.005 s/°C) = .13 s

Temperatur e coeffici ent is only required for tempera tu res > 25°C. Below 25°C, TCOFF = 0 s.

TC =-(CHOLD) (RIC + RSS + RS) ln(1/2047) s

-(9 pF) (1 k + 6 k + 100) ln(0.000488 3) s = .49 s

TACQ =0 + .49 s + . 13 s = . 62 s

Note: If the converter module has been in Sleep mode, TAMP is 2.0 s from the time the part exits Sleep mode.

VAIN CPIN

Rs ANx

5 pF

VDD

VT = 0.6V

VT = 0.6V ILEAKAGE

RIC 1k

Sampling

Switch

SS RSS

CHOLD = 9 pF

VSS

Sampling Switch

567891011

(k)

VDD

±100 nA

Legend: CPIN

ILEAKAGE

RIC

CHOLD

= Input Capacitance

= Threshold Voltage

= Leakage Current at the pin due to

= Interconnect Resistance

= Sampling Switch

= Sample/Hold Capacitance (from DAC)

various junctions

= Sampling Switch Resistance RSS

Note: For VDD < 2.7V and temperatures below 0°C, VAIN should be restricted to range: VAIN < VDD/2.

 2010 Microchip Technology Inc. DS39616D-page 251

PIC18F2331/2431/4331/4431

21.4 A/D Voltage References

If external voltage references are used instead of the

internal AVDD and AVSS sources, the source

impedance of the VREF+ and VREF- voltage sources

must be considered. During acquisition, currents

supplied by these sources are insignificant. However,

during conversion, the A/D module sinks and sources

current through the reference sources.

In order to maintain the A/D accuracy, the voltage

reference source impedances should be kept low to

reduce voltage changes. These voltage changes occur

as reference currents flow through the reference

source impedance.

21.5 Selecting and Configuri ng

Auto mati c A c q u is i tion Time

The ADCON2 register allows the user to select an acqui-

sition time that occurs each time an A/D conversion is

triggered.

When the GO/DONE bit is set, sampling is stopped and

a conversion begins. The user is responsible for ensuring

the required acquisition time has passed between

selecting the desired input channel and the start of

conversion. This occurs when the ACQT<3:0> bits

(ADCON2<6:3>) remain in their Reset state (‘0000’).

If desired, the ACQT bits can be set to select a

programmable acquisition time for the A/D module.

When triggered, the A/D module continues to sample

the input for the selected acquisition time, then

automatically begins a conversion. Since the

acquisition time is programmed, there may be no need

to wait for an acquisition time between selecting a

channel and triggering the A/D. If an acquisition time is

programmed, there is nothing to indicate if the

acquisition time has ended or if the conversion has

begun.

21.6 Selecting the A/D Conversion

Clock

The A/D conversion time per bit is defined as TAD. The

A/D conversion requires 12 TAD per 10-bit conversion.

The source of the A/D conversion clock is software

selectable. There are eight possible options for TAD:

•2 T

OSC

•4 TOSC

•8 TOSC

•16 TOSC

•32 TOSC

•64 TOSC

• Internal RC Oscillator

• Internal RC Oscillator/4

For correct A/D conversions, the A/D conversion clock

AD) must be as short as possible, but greater than the

minimum TAD (approximately 416 ns, see parameter

A11 for more information).

Table 21-2 shows the resultant T

AD times derived from

the device operating frequencies and the A/D clock

source selected.

TABLE 21-2: TAD vs. DEVICE OPERATING FREQUENCIES

Note: When using external references, the

source impedance of the external voltage

references must be less than 75 in order

to achieve the specified ADC resolution. A

higher reference source impedance will

increase the ADC offset and gain errors.

Resistive voltage dividers will not provide a

low enough source impedance. To ensure

the best possible ADC performance, exter-

nal VREF inputs should be buffered with an

op amp or other low-impedance circuit.

AD Clock Source (TAD) Maximum Device Frequency

Operation ADCS<2:0> PIC18FXX31 PIC18LFXX31(4)

2 T

OSC 000 4.8 MHz 666 kHz

4 T

OSC 100 9.6 MHz 1.33 MHz

8 TOSC 001 19.2 MHz 2.66 MHz

16 T

OSC 101 38.4 MHz 5.33 MHz

32 T

OSC 010 40.0 MHz 10.65 MHz

64 TOSC 110 40.0 MHz 21.33 MHz

RC/4(3) 011 1.00 MHz(1) 1.00 MHz(2)

RC(3) 111 4.0 MHz(2) 4.0 MHz(2)

Note 1: The RC source has a typical TAD time of 2-6 s.

2: The RC source has a typical TAD time of 0.5-1.5 s.

3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D

accuracy may be out of specification unless in Single-Shot mode.

4: Low-power devices only.

PIC18F2331/2431/4331/4431

DS39616D-page 252  2010 Microchip Technology Inc.

21.7 Operation in Power-Managed

Modes

The selection of the automatic acquisition time and A/D

conversion clock is determined in part by the clock

source and frequency while in a power-managed mode.

If the A/D is expected to operate while the device is in

a power-managed mode, the ACQT<3:0> and

ADCS<2:0> bits in ADCON2 should be updated in

accordance with the power-managed mode clock that

will be used. After the power-managed mode is entered

(either of the power-managed Run modes), an A/D

acquisition or conversion may be started. Once an

acquisition or conversion is started, the device should

continue to be clocked by the same power-managed

mode clock source until the conversion has been com-

pleted. If desired, the device may be placed into the

corresponding power-managed Idle mode during the

conversion.

If the power-managed mode clock frequency is less

than 1 MHz, the A/D RC clock source should be

selected.

Operation in Sleep mode requires the A/D RC clock to

be selected. If bits, ACQT<3:0>, are set to ‘0000’ and

a conversion is started, the conversion will be delayed

one instruction cycle to allow execution of the SLEEP

instruction and entry to Sleep mode. The IDLEN and

SCS bits in the OSCCON register must have already

been cleared prior to starting the conversion.

21.8 Configuring Anal og Port Pins

The ANSEL0, ANSEL1, TRISA and TRISE registers all

configure the A/D port pins. The port pins needed as

analog inputs must have their corresponding TRIS bits

set (input). If the TRIS bit is cleared (output), the digital

output level (VOH or VOL) will be converted.

The A/D operation is independent of the state of the

ANSEL0, ANSEL1 and TRIS bits.

Note: The A/D can operate in Sleep mode only

when configured for Single-Shot mode. If

the part is in Sleep mode, and it is possible

for a source other than the A/D module to

wake the part, the user must poll

ADCON0<GO/DONE> to ensure it is clear

before reading the result.

Note 1: When reading the PORT register, all pins

configured as analog input channels will

read as cleared (a low level). Pins

configured as digital inputs will convert an

analog input. Analog levels on a digitally

configured input will be accurately

converted.

2: Analog levels on any pin defined as a

digital input may cause the digital input

buffer to consume current out of the

device’s specification limits.

 2010 Microchip Technology Inc. DS39616D-page 253

PIC18F2331/2431/4331/4431

21.9 A/D Conversions

Figure 21-3 shows the operation of the A/D Converter

after the GO/DONE bit has been set and the

ACQT<2:0> bits are cleared. A conversion is started

after the following instruction to allow entry into Sleep

mode before the conversion begins. The internal A/D

RC oscillator must be selected to perform a conversion

in Sleep.

Figure 21-4 shows the operation of the A/D Converter

after the GO/DONE bit has been set, the ACQT<3:0>

bits are set to ‘010’ and a 4 TAD acquisition time is

selected before the conversion starts.

Clearing the GO/DONE bit during a conversion will

abort the current conversion. The resulting buffer loca-

tion will contain the partially completed A/D conversion

sample. This will not set the ADIF flag, therefore, the

user must read the buffer location before a conversion

sequence overwrites it.

After the A/D conversion is completed or aborted, a

AD wait is required before the next acquisition can be

started. After this wait, acquisition on the selected

channel is automatically started.

FIGURE 21 -3: A/D C ONVERSI ON TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)

FIGURE 21 -4: A/D C ONVERSI ON TAD CYCLES (ACQT<3:0> = 0010, TACQ = 4 TAD)

Note: The GO/DONE bit should NOT be set in

the same instruction that turns on the A/D.

TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11TAD9 TAD10

GO/DONE bit cleared on the rising edge of Q1 after the first Q3

Conversion Starts

b8 b7 b6 b5 b4 b3

b9 b1 b0

following TAD11 and result buffer is loaded.(1)

GO/DONE bit is

set and holding

cap is

disconnected

from analog

input

Note 1: Conversion time is a minimum of 11 TAD + 2 TCY and a maximum of 11 TAD + 6 TCY.

A/D Triggered

(Holding capacitor is disconnected)

1 2 3 4

TACQT Cycles

Automatic

Acquisition

Time

TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11TAD9 TAD10

GO/DONE bit cleared on the rising edge of Q1 after the first Q3

Conversion Starts

b8 b7 b6 b5 b4 b3

b9 b1 b0

following TAD11 and result buffer is loaded.(1)

AD Cycles

Note 1: In Continuous modes, next conversion starts at the end of TAD12.

PIC18F2331/2431/4331/4431

DS39616D-page 254  2010 Microchip Technology Inc.

21.9.1 A/D RESULT REGISTER

The ADRESH:ADRESL register pair is the location

where the 10-bit A/D result is loaded at the completion

of the A/D conversion. This register pair is 16 bits wide.

The A/D module gives the flexibility to left or right justify

the 10-bit result in the 16-bit result register. The A/D

Format Select bit (ADFM) controls this justification.

Figure 21-5 shows the operation of the A/D result

justification. The extra bits are loaded with ‘0’s. When

an A/D result will not overwrite these locations (A/D

disable), these registers may be used as two general

purpose 8-bit registers.

FIGURE 21-5: A/D RESULT JU STI FIC AT I ON

EQUATION 21-3: CONVERSION TIME FOR MULTI-CHANNEL MODES

10-Bit Result

ADRESH ADRESL

0000 00

ADFM = 0

2 1 0 77

10-Bit Result

ADRESH ADRESL

10-Bit Result

0000 00

70 7 6 5 0

ADFM = 1

Right Justified Left Justified

Sequential Mode:

Simultaneous Mode:

T = (TACQ)A + ( TCON)A + [(TACQ)B – 12 TAD] + (TCON)B + [(TACQ)C – 12 TAD] + (TCON)C + [(TACQ)D – 12 TAD] + (TCON)D

T = TACQ + (TCON)A + ( TCON)B + TACQ + (TCON)C + (TCON)D

 2010 Microchip Technology Inc. DS39616D-page 255

PIC18F2331/2431/4331/4431

TABLE 21-3: SUMMARY OF A/D REGISTERS

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset V alues

on Page :

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 54

PIR1 —ADIFRCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 57

PIE1 —ADIERCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 57

IPR1 —ADIPRCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 57

PIR2 OSCFIF — — EEIF —LVDIF — CCP2IF 57

PIE2 OSCFIE — — EEIE —LVDIE — CCP2IE 57

IPR2 OSCFIP — — EEIP —LVDIP — CCP2IP 57

ADRESH A/D Result Register High Byte 56

ADRESL A/D Result Register Low Byte 56

ADCON0 —— ACONV ACSCH ACMOD1 ACMOD0 GO/DONE ADON 56

ADCON1 VCFG1 VCFG0 — FIFOEN BFEMT BFOVFL ADPNT1 ADPNT0 56

ADCON2 ADFM ACQT3 ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 56

ADCON3 ADRS1 ADRS0 — SSRC4 SSRC3 SSRC2 SSRC1 SSRC0 56

ADCHS GDSEL1 GDSEL0 GBSEL1 GBSEL0 GCSEL1 GCSEL0 GASEL1 GASEL0 56

ANSEL0 ANS7(6) ANS6(6) ANS5(6) ANS4 ANS3 ANS2 ANS1 ANS0 56

ANSEL1 — — — — — — —ANS8

(5) 56

PORTA RA7(4) RA6(4) RA5 RA4 RA3 RA2 RA1 RA0 57

TRISA TRISA7(4) TRISA6(4) PORTA Data Direction Register 57

PORTE(2) — — — — RE3(1,3) RA2(3) RA1(3) RA0(3) 57

TRISE(3) — — — — — PORTE Data Direction Register 57

LATE(3) — — — — — LATE Data Output Register 57

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion.

Note 1: The RE3 port bit is available only as an input pin when the MCLRE bit in the CONFIG3H register is ‘0’.

2: This register is not implemented on PIC18F2331/2431 devices.

3: These bits are not implemented on PIC18F2331/2431 devices.

4: These pins may be configured as port pins depending on the oscillator mode selected.

5: ANS5 through ANS8 are available only on the PIC18F4331/4431 devices.

6: Not available on 28-pin devices.

PIC18F2331/2431/4331/4431

DS39616D-page 256  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 257

PIC18F2331/2431/4331/4431

22.0 LOW-VOLTAGE DETECT (LVD)

PIC18F2331/2431/4331/4431 devices have a Low-

Voltage Detect module (LVD), a programmable circuit

that enables the user to specify a device voltage trip

point. If the device experiences an excursion below the

trip point, an interrupt flag is set. If the interrupt is

enabled, the program execution will branch to the inter-

rupt vector address and the software can then respond

to the interrupt.

The Low-Voltage Detect Control register (Register 22-1)

completely controls the operation of the LVD module.

This allows the circuitry to be “turned off” by the user

under software control, which minimizes the current

consumption for the device.

The block diagram for the LVD module is shown in

Figure 22-1.

The module is enabled by setting the LVDEN bit, but

the circuitry requires some time to stabilize each time

that it is enabled. The IRVST bit is a read-only bit used

to indicate when the circuit is stable. The module can

only generate an interrupt after the circuit is stable and

the IRVST bit is set. The module monitors for drops in

VDD below a predetermined set point.

U-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1

—— IRVST LVDEN LVDL3(1) LVDL2(1) LVDL1(1) LVDL0(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-6 Unimplemented: Read as ‘0’

bit 5 IRVST: Internal Reference Voltage Stable Flag bit

1 = Indicates that the Low-Voltage Detect logic will generate the interrupt flag at the specified voltage

range

0 = Indicates that the Low-Voltage Detect logic will not generate the interrupt flag at the specified

voltage range and the LVD interrupt should not be enabled

bit 4 LVDEN: Low-Voltage Detect Power Enable bit

1 = Enables LVD, powers up LVD circuit

0 = Disables LVD, powers down LVD circuit

bit 3-0 LVDL<3:0>: Low-Voltage Detection Limit bits(1)

1111 = External analog input is used (input comes from the LVDIN pin)

1110 = Maximum setting

0010 = Minimum setting

0001 = Reserved

0000 = Reserved

Note 1: LVDL<3:0> bit modes, which result in a trip point below the valid operating voltage of the device, are not

tested.

PIC18F2331/2431/4331/4431

DS39616D-page 258  2010 Microchip Technology Inc.

FIGURE 22-1: LVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT)

Set

VDD

16-to-1 MUX

LVDEN

LVDCON

LVDIN

LVDL<3:0> Register

LVDIN

VDD

Externally Generated

Trip Point

LVDIF

LVDEN

BOREN

Internal Vol tage

Reference

VDIRMAG

 2010 Microchip Technology Inc. DS39616D-page 259

PIC18F2331/2431/4331/4431

22.1 Operation

When the LVD module is enabled, a comparator uses

an internally generated reference voltage as the set

point. The set point is compared with the trip point,

where each node in the resistor divider represents a

trip point voltage. The “trip point” voltage is the voltage

level at which the device detects a low-voltage event,

depending on the configuration of the module. When

the supply voltage is equal to the trip point, the voltage

tapped off of the resistor array is equal to the internal

reference voltage generated by the voltage reference

module. The comparator then generates an interrupt

signal by setting the LVDIF bit.

The trip point voltage is software programmable to any

one of 16 values, selected by programming the

LVDL<3:0> bits (LVDCON<3:0>).

The LVD module has an additional feature that allows

the user to supply the trip voltage to the module from an

external source. This mode is enabled when bits,

LVDL<3:0>, are set to ‘1111’. In this state, the compar-

ator input is multiplexed from the external input pin,

LVDIN. This gives users flexibility because it allows

them to configure the Low-Voltage Detect interrupt to

occur at any voltage in the valid operating range.

22.2 LVD Setup

The following steps are needed to set up the LVD

module:

1. Disable the module by clearing the LVDEN bit

(LVDCON<4>).

2. Write the value to the LVDL<3:0> bits that

selects the desired LVD trip point.

3. Enable the LVD module by setting the LVDEN

bit.

4. Clear the LVD interrupt flag (PIR2<2>), which

may have been set from a previous interrupt.

5. Enable the LVD interrupt, if interrupts are

desired, by setting the LVDIE and GIE bits

(PIE<2> and INTCON<7>).

An interrupt will not be generated until the IRVST bit is set.

22.3 Current Consumption

When the module is enabled, the LVD comparator and

voltage divider are enabled and will consume static cur-

rent. The total current consumption, when enabled, is

specified in electrical specification Parameter D022B.

Depending on the application, the LVD module does

not need to be operating constantly. To decrease the

current requirements, the LVD circuitry may only need

to be enabled for short periods where the voltage is

checked. After doing the check, the LVD module may

be disabled.

PIC18F2331/2431/4331/4431

DS39616D-page 260  2010 Microchip Technology Inc.

22.4 LVD Start-up Time

The internal reference voltage of the LVD module,

specified in electrical specification Parameter D420,

may be used by other internal circuitry, such as the

Programmable Brown-out Reset. If the LVD, or other

circuits using the voltage reference, are disabled to

lower the device’s current consumption, the reference

voltage circuit will require time to become stable before

a low-voltage condition can be reliably detected. This

start-up time, TIRVST, is an interval that is independent

of device clock speed. It is specified in electrical

specification Parameter 36.

The LVD interrupt flag is not enabled until TIRVST has

expired and a stable reference voltage is reached. For

this reason, brief excursions beyond the set point may

not be detected during this interval (refer to Figure 22-2).

FIGURE 22-2: LOW-VOLTAGE DETECT WAVEFORMS

VLVD

VDD

LVDIF

VLVD

VDD

Enable LVD

Internally Generated TIRVST

LVDIF may not be set

Enable LVD

LVDIF

LVDIF cleared in software

LVDIF cleared in software,

CASE 1:

CASE 2:

LVDIF remains set since LVD condition still exists

Reference Stable

Internally Generated

Reference Stable

TIRVST

 2010 Microchip Technology Inc. DS39616D-page 261

PIC18F2331/2431/4331/4431

22.5 Operation During Sleep

When enabled, the LVD circuitry continues to operate

during Sleep. If the device voltage crosses the trip

point, the LVDIF bit will be set and the device will wake-

up from Sleep. Device execution will continue from the

interrupt vector address if interrupts have been globally

enabled.

22.6 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the LVD module to be turned off.

22.7 Applications

Figure 22-3 shows a possible application voltage curve

(typically for batteries). Over time, the device voltage

decreases. When the device voltage equals voltage,

VA, the LVD logic generates an interrupt. This occurs at

time, T

A. The application software then has the time,

until the device voltage is no longer in valid operating

range, to perform “housekeeping tasks” and to shut

down the system. Voltage point, VB, is the minimum

valid operating voltage specification. This occurs at

time, TB. The difference, TB – TA, is the total time for

shutdown.

FIGURE 22-3: TYPICAL LOW-VOLTAGE DETECT APPLICATION

TABLE 22-1: REGISTERS ASSOCIATED WITH LOW-VOLTAGE DETECT MODULE

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

LVDCON —— IRVST LVDEN LVDL3 LVDL2 LVDL1 LVDL0

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF

IPR2 OSCFIP — — EEIP —LVDIP —CCP2IP

PIR2 OSCFIF — — EEIF —LVDIF —CCP2IF

PIE2 OSCFIE — — EEIE —LVDIE —CCP2IE

Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the LVD module.

Time

Voltage

TATB

VA = LVD trip point

VB = Minimum valid device

operating voltage

Legend:

PIC18F2331/2431/4331/4431

DS39616D-page 262  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 263

PIC18F2331/2431/4331/4431

23.0 SPECIAL FEATURES OF THE

CPU

PIC18F2331/2431/4331/4431 devices include several

features intended to maximize system reliability and min-

imize cost through elimination of external components.

These are:

• Oscillator Selection

• Resets:

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Brown-out Reset (BOR)

• Interrupts

• Watchdog Timer (WDT)

• Fail-Safe Clock Monitor

• Two-Speed Start-up

• Code Protection

• ID Locations

• In-Circuit Serial Programming™ (ICSP™)

The oscillator can be configured for the application

depending on frequency, power, accuracy and cost. All

of the options are discussed in detail in Section 3.0

“Oscillator Configurations”.

A complete discussion of device Resets and interrupts

is available in previous sections of this data sheet.

In addition to their Power-up and Oscillator Start-up

Timers provided for Resets, PIC18F2331/2431/4331/

4431 devices have a Watchdog Timer, which is either

permanently enabled via the Configuration bits, or

software-controlled (if configured as disabled).

The inclusion of an internal RC oscillator also provides

the additional benefits of a Fail-Safe Clock Monitor

(FSCM) and Two-Speed Start-up. FSCM provides for

background monitoring of the peripheral clock and

automatic switchover in the event of its failure. Two-

Speed Start-up enables code to be executed almost

immediately on start-up, while the primary clock source

completes its start-up delays.

All of these features are enabled and configured by

setting the appropriate Configuration register bits.

23.1 Configurati on Bits

The Configuration bits can be programmed (read as

‘0’), or left unprogrammed (read as ‘1’), to select

various device configurations. These bits are mapped

starting at program memory location 300000h.

The user will note that address 300000h is beyond the

user program memory space. In fact, it belongs to the

configuration memory space (300000h-3FFFFFh),

which can only be accessed using table reads and

table writes.

Programming the Configuration registers is done in a

manner similar to programming the Flash memory. The

EECON1 register WR bit starts a self-timed write to the

Configuration register. In normal operation mode, a

TBLWT instruction with the TBLPTR pointing to the

Configuration register sets up the address and the data

for the Configuration register write. Setting the WR bit

starts a long write to the Configuration register. The

Configuration registers are written a byte at a time. To

write or erase a configuration cell, a TBLWT instruction

can write a ‘1’ or a ‘0’ into the cell. For additional details

on Flash programming, refer to Section 8.5 “Writing

to Flash Program Memory”.

PIC18F2331/2431/4331/4431

DS39616D-page 264  2010 Microchip Technology Inc.

TABLE 23-1: CONFIGURATION BITS AND DEVICE IDs

File Na me Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default/

Unprogrammed

Value

300000h CONFIG1L — — — — — — — — ---- -- --

300001h CONFIG1H IESO FCMEN —— FOSC3 FOSC2 FOSC1 FOSC0 11-- 11 11

300002h CONFIG2L — — — — BORV1 BORV0 BOREN PWRTEN ---- 11 11

300003h CONFIG2H ——WINENWDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN --11 1111

300004h CONFIG3L ——T1OSCMX HPOL LPOL PWMPIN — — --11 11--

300005h CONFIG3H MCLRE(1) ——EXCLKMX

(1) PWM4MX(1) SSPMX(1) —FLTAMX

(1) 1--1 11-1

300006h CONFIG4L DEBUG — — — —LVP—STVREN1--- -1 -1

300007h CONFIG4H — — — — — — — — ---- ----

300008h CONFIG5L — — — —CP3

(1) CP2(1) CP1 CP0 ---- 1111

300009h CONFIG5H CPD CPB — — — — — — 11-- ----

30000Ah CONFIG6L — — — —WRT3

(1) WRT2(1) WRT1 WRT0 ---- 11 11

30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- -- --

30000Ch CONFIG7L — — — — EBTR3(1) EBTR2(1) EBTR1 EBTR0 ---- 11 11

30000Dh CONFIG7H —EBTRB — — — — — — -1-- ----

3FFFFEh DEVID1(2) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(2)

3FFFFFh DEVID2(2) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 0101

Legend: x = unknown, u = unchanged, - = unimplemented. Shaded cells are unimplemented, read as ‘0’.

Note 1: Unimplemented in PIC18F2331/4331 devices; maintain this bit set.

2: See Register 23-13 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user.

R/P-1 R/P-1 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

IESO FCMEN —— FOSC3 FOSC2 FOSC1 FOSC0

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 IESO: Internal External Switchover bit

1 = Internal External Switchover mode enabled

0 = Internal External Switchover mode disabled

bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit

1 = Fail-Safe Clock Monitor enabled

0 = Fail-Safe Clock Monitor disabled

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 FOSC<3:0>: Oscillator Selection bits

11xx = External RC oscillator, CLKO function on RA6

1001 = Internal oscillator block, CLKO function on RA6 and port function on RA7 (INTIO1)

1000 = Internal oscillator block, port function on RA6 and port function on RA7 (INTIO2)

0111 = External RC oscillator, port function on RA6

0110 = HS oscillator, PLL enabled (clock frequency = 4 x FOSC1)

0101 = EC oscillator, port function on RA6 (ECIO)

0100 = EC oscillator, CLKO function on RA6 (EC)

0010 = HS oscillator

0001 = XT oscillator

0000 = LP oscillator

 2010 Microchip Technology Inc. DS39616D-page 265

PIC18F2331/2431/4331/4431

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

———— BORV1 BORV0 BOREN(1) PWRTEN(1)

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-4 Unimplemented: Read as ‘0’

bit 3-2 BORV<1:0>: Brown-out Reset Voltage bits

11 = Reserved

10 = VBOR set to 2.7V

01 = VBOR set to 4.2V

00 = VBOR set to 4.5V

bit 1 BOREN: Brown-out Reset Enable bit(1)

1 = Brown-out Reset is enabled

0 = Brown-out Reset is disabled

bit 0 PWRTEN: Power-up Timer Enable bit(1)

1 = PWRT is disabled

0 = PWRT is enabled

Note 1: Having BOREN = 1 does not automatically override the PWRTEN to ‘0’, nor automatically enables the

Power-up Timer.

PIC18F2331/2431/4331/4431

DS39616D-page 266  2010 Microchip Technology Inc.

U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1

——WINENWDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-6 Unimplemented: Read as ‘0’

bit 5 WINEN: Watchdog Timer Window Enable bit

1 = WDT window is disabled

0 = WDT window is enabled

bit 4-1 WDTPS<3:0>: Watchdog Timer Postscale Select bits

1111 = 1:32,768

1110 = 1:16,384

1101 = 1:8,192

1100 = 1:4,096

1011 = 1:2,048

1010 = 1:1,024

1001 = 1:512

1000 = 1:256

0111 = 1:128

0110 = 1:64

0101 = 1:32

0100 = 1:16

0011 = 1:8

0010 = 1:4

0001 = 1:2

0000 = 1:1

bit 0 WDTEN: Watchdog Timer Enable bit

1 = WDT is enabled

0 = WDT is disabled (control is placed on the SWDTEN bit)

 2010 Microchip Technology Inc. DS39616D-page 267

PIC18F2331/2431/4331/4431

U-0 U R/P-1 R/P-1 R/P-1 R/P-1 U U

——T1OSCMXHPOL(1) LPOL(1) PWMPIN(3) — —

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-6 Unimplemented: Read as ‘0’

bit 5 T1OSCMX: Timer1 Oscillator Mode bit

1 = Low-power Timer1 operation when microcontroller is in Sleep mode

0 = Standard (legacy) Timer1 oscillator operation

bit 4 HPOL: High Side Transistors Polarity bit (i.e., Odd PWM Output Polarity Control bit)(1)

1 = PWM1, 3, 5 and 7 are active-high (default)(2)

0 = PWM1, 3, 5 and 7 are active-low(2)

bit 3 LPOL: Low Side Transistors Polarity bit (i.e., Even PWM Output Polarity Control bit)(1)

1 = PWM0, 2, 4 and 6 are active-high (default)(2)

0 = PWM0, 2, 4 and 6 are active-low(2)

bit 2 PWMPIN: PWM Output Pins Reset State Control bit(3)

1 = PWM outputs are disabled upon Reset (default)

0 = PWM outputs drive active states upon Reset

bit 1-0 Unimplemented: Read as ‘0’

Note 1: Polarity control bits, HPOL and LPOL, define PWM signal output active and inactive states; PWM states

generated by the Fault inputs or PWM manual override.

2: PWM6 and PWM7 output channels are only available on PIC18F4331/4431 devices.

3: When PWMPIN = 0, PWMEN<2:0> = 101 if the device has eight PWM output pins (40 and 44-pin

devices) and PWMEN<2:0> = 100 if the device has six PWM output pins (28-pin devices). PWM output

polarity is defined by HPOL and LPOL.

PIC18F2331/2431/4331/4431

DS39616D-page 268  2010 Microchip Technology Inc.

R/P-1 U U R/P-1 R/P-1 R/P-1 U R/P-1

MCLRE(1) ——EXCLKMX

(1) PWM4MX(1) SSPMX(1) —FLTAMX

(1)

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 MCLRE: MCLR Pin Enable bit(1)

1 =MCLR pin is enabled; RE3 input pin is disabled

0 = RE3 input pin is enabled; MCLR is disabled

bit 6-5 Unimplemented: Read as ‘0’

bit 4 EXCLKMX: TMR0/T5CKI External Clock MUX bit(1)

1 = TMR0/T5CKI external clock input is multiplexed with RC3

0 = TMR0/T5CKI external clock input is multiplexed with RD0

bit 3 PWM4MX: PWM4 MUX bit(1)

1 = PWM4 output is multiplexed with RB5

0 = PWM4 output is multiplexed with RD5

bit 2 SSPMX: SSP I/O MUX bit(1)

1 = SCK/SCL clocks and SDA/SDI data are multiplexed with RC5 and RC4, respectively. SDO output

is multiplexed with RC7.

0 = SCK/SCL clocks and SDA/SDI data are multiplexed with RD3 and RD2, respectively. SDO output

is multiplexed with RD1.

bit 1 Unimplemented: Read as ‘0’

bit 0 FLTAMX: FLTA MUX bit(1)

1 =FLTA input is multiplexed with RC1

0 =FLTA

input is multiplexed with RD4

Note 1: Unimplemented in PIC18F2331/2431 devices; maintain this bit set.

 2010 Microchip Technology Inc. DS39616D-page 269

PIC18F2331/2431/4331/4431

R/P-1 U-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1

DEBUG — — — —LVP—STVREN

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 DEBUG: Background Debugger Enable bit

1 = Background debugger is disabled; RB6 and RB7 are configured as general purpose I/O pins

0 = Background debugger is enabled; RB6 and RB7 are dedicated to In-Circuit Debug

bit 6-3 Unimplemented: Read as ‘0’

bit 2 LVP: Single-Supply ICSP™ Enable bit

1 = Single-Supply ICSP is enabled

0 = Single-Supply ICSP is disabled

bit 1 Unimplemented: Read as ‘0’

bit 0 STVREN: Stack Full/Underflow Reset Enable bit

1 = Stack full/underflow will cause Reset

0 = Stack full/underflow will not cause Reset

PIC18F2331/2431/4331/4431

DS39616D-page 270  2010 Microchip Technology Inc.

U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1

————CP3

(1,2) CP2(1,2) CP1(2) CP0(2)

bit 7 bit 0

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-4 Unimplemented: Read as ‘0’

bit 3 CP3: Code Protection bit(1,2)

1 = Block 3 is not code-protected

0 = Block 3 is code-protected

bit 2 CP2: Code Protection bit(1,2)

1 = Block 2 is not code-protected

0 = Block 2 is code-protected

bit 1 CP1: Code Protection bit(2)

1 = Block 1 is not code-protected

0 = Block 1 is code-protected

bit 0 CP0: Code Protection bit(2)

1 = Block 0 is not code-protected

0 = Block 0 is code-protected

Note 1: Unimplemented in PIC18F2331/4331 devices; maintain this bit set.

2: Refer to Figure 23-5 for block boundary addresses.

R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0

CPD(1) CPB(1) — — — — — —

bit 7 bit 0

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 CPD: Data EEPROM Code Protection bit(1)

1 = Data EEPROM is not code-protected

0 = Data EEPROM is code-protected

bit 6 CPB: Boot Block Code Protection bit(1)

1 = Boot Block is not code-protected

0 = Boot Block is code-protected

bit 5-0 Unimplemented: Read as ‘0’

Note 1: Refer to Figure 23-5 for block boundary addresses.

 2010 Microchip Technology Inc. DS39616D-page 271

PIC18F2331/2431/4331/4431

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

————WRT3

(1,2) WRT2(1,2) WRT1(2) WRT0(2)

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-4 Unimplemented: Read as ‘0’

bit 3 WRT3: Write Protection bit(1,2)

1 = Block 3 is not write-protected

0 = Block 3 is write-protected

bit 2 WRT2: Write Protection bit(1,2)

1 = Block 2 is not write-protected

0 = Block 2 is write-protected

bit 1 WRT1: Write Protection bit(2)

1 = Block 1 is not write-protected

0 = Block 1 is write-protected

bit 0 WRT0: Write Protection bit(2)

1 = Block 0 is not write-protected

0 = Block 0 is write-protected

Note 1: Unimplemented in PIC18F2331/4331 devices; maintain this bit set.

2: Refer to Figure 23-5 for block boundary addresses.

R/P-1 R/P-1 R-1 U-0 U-0 U-0 U-0 U-0

WRTD(2) WRTB(2) WRTC(1,2) —————

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 WRTD: Data EEPROM Write Protection bit(2)

1 = Data EEPROM is not write-protected

0 = Data EEPROM is write-protected

bit 6 WRTB: Boot Block Write Protection bit(2)

1 = Boot block is not write-protected

0 = Boot block is write-protected

bit 5 WRTC: Configuration Register Write Protection bit(1,2)

1 = Configuration registers are not write-protected

0 = Configuration registers are write-protected

bit 4-0 Unimplemented: Read as ‘0’

Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode.

2: Refer to Figure 23-5 for block boundary addresses.

PIC18F2331/2431/4331/4431

DS39616D-page 272  2010 Microchip Technology Inc.

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

———— EBTR3(1,2,3) EBTR2(1,2,3) EBTR1(2,3) EBTR0(2,3)

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-4 Unimplemented: Read as ‘0’

bit 3 EBTR3: Table Read Protection bit(1,2,3)

1 = Block 3 is not protected from table reads executed in other blocks

0 = Block 3 is protected from table reads executed in other blocks

bit 2 EBTR2: Table Read Protection bit(1,2,3)

1 = Block 2 is not protected from table reads executed in other blocks

0 = Block 2 is protected from table reads executed in other blocks

bit 1 EBTR1: Table Read Protection bit(2,3)

1 = Block 1 is not protected from table reads executed in other blocks

0 = Block 1 is protected from table reads executed in other blocks

bit 0 EBTR0: Table Read Protection bit(2,3)

1 = Block 0 is not protected from table reads executed in other blocks

0 = Block 0 is protected from table reads executed in other blocks

Note 1: Unimplemented in PIC18F2331/4331 devices; maintain this bit set.

2: Refer to Figure 23-5 for block boundary addresses.

3: Enabling the corresponding CPx bit is recommended to protect the block from external read operations.

U-0 R/P-1 U-0 U-0 U-0 U-0 U-0 U-0

— EBTRB(1,2) — — — — — —

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7 Unimplemented: Read as ‘0’

bit 6 EBTRB: Boot Block Table Read Protection bit(1,2)

1 = Boot block is not protected from table reads executed in other blocks

0 = Boot block is protected from table reads executed in other blocks

bit 5-0 Unimplemented: Read as ‘0’

Note 1: Enabling the corresponding CPx bit is recommended to protect the block from external read operations.

2: Refer to Figure 23-5 for block boundary addresses.

 2010 Microchip Technology Inc. DS39616D-page 273

PIC18F2331/2431/4331/4431

RRRRRRRR

DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-5 DEV<2:0>: Device ID bits

These bits are used with the DEV<10:3> bits in the Device ID Register 2 to identify the part number.

000 = PIC18F4331

001 = PIC18F4431

100 = PIC18F2331

101 = PIC18F2431

bit 4-0 REV<4:0>: Revision ID bits

These bits are used to indicate the device revision.

RRRRRRRR

DEV10(1) DEV9(1) DEV8(1) DEV7(1) DEV6(1) DEV5(1) DEV4(1) DEV3(1)

bit 7 bit 0

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed U = Unchanged from programmed state

bit 7-0 DEV<10:3>: Device ID bits(1)

These bits are used with the DEV<2:0> bits in the Device ID Register 1 to identify the

part number

0000 0101 = PIC18F2331/2431/4331/4431 devices

Note 1: These values for DEV<10:3> may be shared with other devices. The specific device is always identified by

using the entire DEV<10:0> bit sequence.

PIC18F2331/2431/4331/4431

DS39616D-page 274  2010 Microchip Technology Inc.

23.2 Watchdog Ti mer (WDT)

For PIC18F2331/2431/4331/4431 devices, the WDT is

driven by the INTRC source. When the WDT is

enabled, the clock source is also enabled. The nominal

WDT period is 4 ms and has the same stability as the

INTRC oscillator.

The 4 ms period of the WDT is multiplied by a 16-bit

postscaler. Any output of the WDT postscaler is

selected by a multiplexer, controlled by bits in

Configuration Register 2H (see Register 23-3).

Available periods range from 4 ms to 131.072 seconds

(2.18 minutes). The WDT and postscaler are cleared

when any of the following events occur: execute a

SLEEP or CLRWDT instruction, the IRCF bits

(OSCCON<6:4>) are changed or a clock failure has

occurred (see Section 23.4.1 “FSCM and the

Watchdog Timer”).

Adjustments to the internal oscillator clock period using

the OSCTUNE register also affect the period of the

WDT by the same factor. For example, if the INTRC

period is increased by 3%, then the WDT period is

increased by 3%.

23.2.1 CONTROL REGISTER

readable and writable register. The SWDTEN bit allows

software to enable or disable the WDT, but only if the

Configuration bit has disabled the WDT. The WDTW bit

is a read-only bit that indicates when the WDT count is

in the fourth quadrant (i.e., when the 8-bit WDT value is

b’11000000’ or greater).

FIGU RE 23-1 : WDT BLOC K DI AG RAM

Note 1: The CLRWDT and SLEEP instructions

clear the WDT and postscaler counts

when executed.

2: Changing the setting of the IRCF bits

(OSCCON<6:4>) clears the WDT and

postscaler counts.

3: When a CLRWDT instruction is executed,

the postscaler count will be cleared.

4: If WINEN = 0, then CLRWDT must be exe-

cuted only when WDTW = 1; otherwise, a

device Reset will result.

INTRC Source

WDT

Wake-up

Reset

WDT

WDT Counter

Programmable Postscaler

1:1 to 1:32,768

Enable WDT

WDTPS<3:0>

SWDTEN

WDTEN

CLRWDT

from Sleep

Reset

All Device Resets

Sleep

INTRC Control

125

Change on IRCF bits

 2010 Microchip Technology Inc. DS39616D-page 275

PIC18F2331/2431/4331/4431

TABLE 23-2: SUMMARY OF WATCHDOG TIMER REGISTERS

R-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

WDTW — — — — — —SWDTEN

(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7 WDTW: Watchdog Timer Window bit

1 = WDT count is in fourth quadrant

0 = WDT count is not in fourth quadrant

bit 6-1 Unimplemented: Read as ‘0’

bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit(1)

1 = WDT is turned on

0 = WDT is turned off

Note 1: If the WDTEN Configuration bit = 1, then WDT is always enabled, irrespective of this control bit. If WDTEN

Configuration bit = 0, then it is possible to turn WDT on/off with this control bit.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

CONFIG2H ——WINENWDTPS3 WDTPS2 WDTPS2 WDTPS0 WDTEN

RCON IPEN — — RI TO PD POR BOR

WDTCON WDTW ——————SWDTEN

Legend: Shaded cells are not used by the Watchdog Timer.

PIC18F2331/2431/4331/4431

DS39616D-page 276  2010 Microchip Technology Inc.

23.3 Two-Speed Start-up

The Two-Speed Start-up feature helps to minimize the

latency period from oscillator start-up to code execution

by allowing the microcontroller to use the INTRC oscil-

lator as a clock source until the primary clock source is

available. It is enabled by setting the IESO bit in

Configuration Register 1H (CONFIG1H<7>).

Two-Speed Start-up is available only if the primary

oscillator mode is LP, XT, HS or HSPLL (Crystal-Based

modes). Other sources do not require a OST start-up

delay; for these, Two-Speed Start-up is disabled.

When enabled, Resets and wake-ups from Sleep mode

cause the device to configure itself to run from the

internal oscillator block as the clock source, following

the time-out of the Power-up Timer after a Power-on

Reset is enabled. This allows almost immediate code

execution while the primary oscillator starts and the

OST is running. Once the OST times out, the device

automatically switches to PRI_RUN mode.

Because the OSCCON register is cleared on Reset

events, the INTOSC (or postscaler) clock source is not

initially available after a Reset event; the INTRC clock

is used directly at its base frequency. To use a higher

clock speed on wake-up, the INTOSC or postscaler

clock sources can be selected to provide a higher clock

speed by setting bits IRCF<2:0> immediately after

Reset. For wake-ups from Sleep, the INTOSC or post-

scaler clock sources can be selected by setting

IRCF<2:0> prior to entering Sleep mode.

In all other power-managed modes, Two-Speed Start-

up is not used. The device will be clocked by the

currently selected clock source until the primary clock

source becomes available. The setting of the IESO

Configuration bit is ignored.

23.3.1 SPECIAL CONSIDERATIONS FOR

USING TWO-SPEED START-UP

While using the INTRC oscillator in Two-Speed Start-

up, the device still obeys the normal command

sequences for entering power-managed modes,

including serial SLEEP instructions (refer to

Section 4.1.4 “Multiple Sleep Commands”). In

practice, this means that user code can change the

SCS<1:0> bit settings and issue SLEEP commands

before the OST times out. This would allow an applica-

tion to briefly wake-up, perform routine “housekeeping”

tasks and return to Sleep before the device starts to

operate from the primary oscillator.

User code can also check if the primary clock source is

currently providing the system clocking by checking the

status of the OSTS bit (OSCCON<3>). If the bit is set,

the primary oscillator is providing the system clock.

Otherwise, the internal oscillator block is providing the

clock during wake-up from Reset or Sleep mode.

FIGU RE 23- 2: TIMI NG TRANS IT I ON F OR TW O- S PEED S TA RT - U P ( I NTOS C TO HSP LL )

Q1 Q3 Q4

OSC1

Peripheral

Program PC PC + 2

INTOSC

PLL Clock

PC + 6

Output

Q3 Q4 Q1

CPU Clock

PC + 4

Clock

Counter

Q2 Q2 Q3 Q4

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

Wake from Interrupt Event

TPLL(1)

12345678

Clock Transition

OSTS bit Set

Multiplexer

TOST(1)

 2010 Microchip Technology Inc. DS39616D-page 277

PIC18F2331/2431/4331/4431

23.4 Fail-Safe Clock Monitor

The Fail-Safe Clock Monitor (FSCM) allows the

microcontroller to continue operation, in the event of an

external oscillator failure, by automatically switching

the system clock to the internal oscillator block. The

FSCM function is enabled by setting the Fail-Safe

Clock Monitor Enable bit, FCMEN (CONFIG1H<6>).

When FSCM is enabled, the INTRC oscillator runs at

all times to monitor clocks to peripherals and provide

an instant backup clock in the event of a clock failure.

Clock monitoring (shown in Figure 23-3) is

accomplished by creating a sample clock signal, which

is the INTRC output divided by 64. This allows ample

time between FSCM sample clocks for a peripheral

clock edge to occur. The peripheral system clock and

the sample clock are presented as inputs to the Clock

Monitor latch (CM). The CM is set on the falling edge of

the system clock source, but cleared on the rising edge

of the sample clock.

FIGURE 23-3: FSCM BLOCK DIAGRAM

Clock failure is tested for on the falling edge of the

sample clock. If a sample clock falling edge occurs

while the CM is still set, a clock failure has been

detected (Figure 23-4). This causes the following:

• the FSCM generates an oscillator fail interrupt by

setting bit, OSCFIF (PIR2<7>);

• the system clock source is switched to the internal

oscillator block (OSCCON is not updated to show

the current clock source – this is the fail-safe

condition); and

•the WDT is reset.

Since the postscaler frequency from the internal

oscillator block may not be sufficiently stable, it may be

desirable to select another clock configuration and

enter an alternate power-managed mode (see

Section 23.3.1 “Special Considerations for Using

Two-Speed Start-up” and Section 4.1.4 “Multiple

Sleep Commands” for more details). This can be

done to attempt a partial recovery or execute a

controlled shutdown.

To use a higher clock speed on wake-up, the INTOSC

or postscaler clock sources can be selected to provide

a higher clock speed by setting bits, IRCF<2:0>, imme-

diately after Reset. For wake-ups from Sleep, the

INTOSC or postscaler clock sources can be selected

by setting the IRCF<2:0> bits prior to entering Sleep

mode.

Adjustments to the internal oscillator block using the

OSCTUNE register also affect the period of the FSCM

by the same factor. This can usually be neglected, as

the clock frequency being monitored is generally much

higher than the sample clock frequency.

The FSCM will detect failures of the primary or second-

ary clock sources only. If the internal oscillator block

fails, no failure would be detected, nor would any action

be possible.

23.4.1 FSCM AND THE WATCHDOG TIMER

Both the FSCM and the WDT are clocked by the

INTRC oscillator. Since the WDT operates with a

separate divider and counter, disabling the WDT has

no effect on the operation of the INTRC oscillator when

the FSCM is enabled.

As already noted, the clock source is switched to the

INTOSC clock when a clock failure is detected.

Depending on the frequency selected by the

IRCF<2:0> bits, this may mean a substantial change in

the speed of code execution. If the WDT is enabled

with a small prescale value, a decrease in clock speed

allows a WDT time-out to occur and a subsequent

device Reset. For this reason, Fail-Safe Clock Monitor

events also reset the WDT and postscaler, allowing it to

start timing from when execution speed was changed

and decreasing the likelihood of an erroneous time-out.

23.4.2 EXITING FAIL-SAFE OPERATION

The fail-safe condition is terminated by either a device

Reset, or by entering a power-managed mode. On Reset,

the controller starts the primary clock source specified in

Configuration Register 1H (with any required start-up

delays that are required for the oscillator mode, such as

the OST or PLL timer). The INTOSC multiplexer provides

the system clock until the primary clock source becomes

ready (similar to a Two-Speed Start-up). The clock system

source is then switched to the primary clock (indicated by

the OSTS bit in the OSCCON register becoming set). The

Fail-Safe Clock Monitor then resumes monitoring the

peripheral clock.

The primary clock source may never become ready

during start-up. In this case, operation is clocked by the

INTOSC multiplexer. The OSCCON register will remain in

its Reset state until a power-managed mode is entered.

Entering a power-managed mode by loading the

OSCCON register and executing a SLEEP instruction

will clear the fail-safe condition. When the fail-safe

condition is cleared, the clock monitor will resume

monitoring the peripheral clock.

Peripheral

INTRC ÷ 64

(32 s) 488 Hz

(2.048 ms)

Clock Monitor

Latch (CM)

(edge-triggered)

Clock

Failure

Detected

Source

Clock

PIC18F2331/2431/4331/4431

DS39616D-page 278  2010 Microchip Technology Inc.

FIGU RE 23-4: FSC M TIMIN G DI AGR AM

23.4.3 FSCM INTERRUPTS IN

POWER-MANAGED MODES

As previously mentioned, entering a power-managed

mode clears the fail-safe condition. By entering a

power-managed mode, the clock multiplexer selects

the clock source selected by the OSCCON register.

Fail-safe monitoring of the power-managed clock

source resumes in the power-managed mode.

If an oscillator failure occurs during power-managed

operation, the subsequent events depend on whether

or not the oscillator failure interrupt is enabled. If

enabled (OSCFIF = 1), code execution will be clocked

by the INTOSC multiplexer. An automatic transition

back to the failed clock source will not occur.

If the interrupt is disabled, the device will not exit the

power-managed mode on oscillator failure. Instead, the

device will continue to operate as before, but clocked

by the INTOSC multiplexer. While in Idle mode, subse-

quent interrupts will cause the CPU to begin executing

instructions while being clocked by the INTOSC

multiplexer. The device will not transition to a different

clock source until the fail-safe condition is cleared.

23.4.4 POR OR WAKE FROM SLEEP

The FSCM is designed to detect oscillator failure at any

point after the device has exited Power-on Reset

(POR) or low-power Sleep mode. When the primary

system clock is EC, RC or INTRC modes, monitoring

can begin immediately following these events.

For oscillator modes involving a crystal or resonator

(HS, HSPLL, LP or XT), the situation is somewhat

different. Since the oscillator may require a start-up

time considerably longer than the FCSM sample clock

time, a false clock failure may be detected. To prevent

this, the internal oscillator block is automatically

configured as the system clock and functions until the

primary clock is stable (the OST and PLL timers have

timed out). This is identical to Two-Speed Start-up

mode. Once the primary clock is stable, the INTRC

returns to its role as the FSCM source.

As noted in Sect ion 23. 3.1 “Spec ial Cons idera tions

for Using Two-Speed Start-up”, it is also possible to

select another clock configuration, and enter an

alternate power-managed mode, while waiting for the

primary system clock to become stable. When the new

powered-managed mode is selected, the primary clock

is disabled.

OSCFIF

CM Output

System

Clock

Output

Sample Clock

Failure

Detected

Oscillator

Failure

Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in

this example have been chosen for clarity.

(Q)

CM Test CM Test CM Test

Note: The same logic that prevents false

oscillator failure interrupts on POR or wake

from Sleep will also prevent the detection

of the oscillator’s failure to start at all

following these events. This can be

avoided by monitoring the OSTS bit and

using a timing routine to determine if the

oscillator is taking too long to start. Even

so, no oscillator failure interrupt will be

flagged.

 2010 Microchip Technology Inc. DS39616D-page 279

PIC18F2331/2431/4331/4431

23.5 Program Verification and

Code Protection

The overall structure of the code protection on the

PIC18 Flash devices differs significantly from other

PIC® devices.

The user program memory is divided into five blocks.

One of these is a Boot Block of 512 bytes. The

remainder of the memory is divided into four blocks on

binary boundaries.

Each of the five blocks has three code protection bits

associated with them. They are:

• Code-Protect bit (CPn)

• Write-Protect bit (WRTn)

• External Block Table Read bit (EBTRn)

Figure 23-5 shows the program memory organization

for 8 and 16-Kbyte devices, and the specific code

protection bit associated with each block. The actual

locations of the bits are summarized in Ta b l e 2 3 - 3 .

FIGURE 23-5: CODE-PROTE CTED PROGRAM MEMORY FOR PIC 18F2331 /2431 /4331 /4431

TABLE 23-3: SUMMARY OF CODE PROTECTION REGISTERS

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

300008h CONFIG5L ————CP3

(1) CP2(1) CP1 CP0

300009h CONFIG5H CPD CPB — — — — — —

30000Ah CONFIG6L ————WRT3

(1) WRT2(1) WRT1 WRT0

30000Bh CONFIG6H WRTD WRTB WRTC — — — — —

30000Ch CONFIG7L ———— EBTR3(1) EBTR2(1) EBTR1 EBTR0

30000Dh CONFIG7H — EBTRB — — — — — —

Legend: Shaded cells are unimplemented.

Note 1: Unimplemented in PIC18F2331/4331 devices; maintain this bit set.

MEMORY SIZE/DEVICE

Block Code Protection

Controlled By:

8Kbytes

(PIC18F2331/4331) Address

Range 16 Kbytes

(PIC18F2431/4431) Address

Range

Boot Block 0000h

0FFFh Boot Block 0000h

01FFh CPB, WRTB, EBTRB

Block 0

0200h

0FFFh

Block 0

0200h

0FFFh

CP0, WRT0, EBTR0

Block 1

1000h

1FFFh

Block 1

1000h

1FFFh

CP1, WRT1, EBTR1

Unimplemented

Read ‘0’s

Block 2

2000h

2FFFh

CP2, WRT2, EBTR2

3FFFh

Block 3

3000h

3FFFh

CP3, WRT3, EBTR3

PIC18F2331/2431/4331/4431

DS39616D-page 280  2010 Microchip Technology Inc.

23.5.1 PROGRAM MEMORY

CODE PROTECTION

The program memory may be read to, or written from,

any location using the table read and table write

instructions. The Device ID may be read with table

reads. The Configuration registers may be read and

written with the table read and table write instructions.

In normal execution mode, the CPn bits have no direct

effect. CPn bits inhibit external reads and writes. A block

of user memory may be protected from table writes if the

WRTn Configuration bit is ‘0’. The EBTRn bits control

table reads. For a block of user memory with the EBTRn

bit set to ‘0’, a table read instruction that executes from

within that block is allowed to read. A table read instruc-

tion that executes from a location outside of that block is

not allowed to read, and will result in reading ‘0’s.

Figures 23-6 through 23-8 illustrate table write and table

read protection.

FIGURE 23-6: TABLE WRITE (WRTn) DISALLOWED

Note: Code protection bits may only be written

to a ‘0’ from a ‘1’ state. It is not possible to

write a ‘1’ to a bit in the ‘0’ state. Code

protection bits are only set to ‘1’ by a full

chip erase or block erase function. The full

chip erase and block erase functions can

only be initiated via ICSP or an external

programmer.

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 01

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLWT *

TBLPTR = 0002FFh

PC = 0007FEh

TBLWT *

PC = 0017FEh

Results: All table writes are disabled to Blockn whenever WRTn = 0.

 2010 Microchip Technology Inc. DS39616D-page 281

PIC18F2331/2431/4331/4431

FIGU RE 23-7 : EXT ER NA L BLO C K TABL E R EAD (E BT Rn ) DI S ALL O WED

FIGU RE 23-8 : EXT ER NA L BLO C K TABL E R EAD (E BT Rn ) AL L OWE D

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD *

TBLPTR = 0002FFh

PC = 000FFEh

Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.

The TABLAT register returns a value of ‘0’.

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD *

TBLPTR = 0002FFh

PC = 0007FEh

Results: Table reads permitted within Blockn, even when EBTRBn = 0.

The TABLAT register returns the value of the data at the location TBLPTR.

PIC18F2331/2431/4331/4431

DS39616D-page 282  2010 Microchip Technology Inc.

23.5.2 DATA EEPROM

CODE PROTECTION

The entire data EEPROM is protected from external

reads and writes by two bits: CPD and WRTD. CPD

inhibits external reads and writes of data EEPROM.

WRTD inhibits external writes to data EEPROM. The

CPU can continue to read and write data EEPROM

regardless of the protection bit settings.

23.5.3 CONFIGURATION REGISTER

PROTECTION

The Configuration registers can be write-protected.

The WRTC bit controls protection of the Configuration

registers. In normal execution mode, the WRTC bit is

readable only. WRTC can only be written via ICSP or

an external programmer.

23.6 ID Locations

Eight memory locations (200000h-200007h) are

designated as ID locations, where the user can store

checksum or other code identification numbers. These

locations are both readable and writable during normal

execution through the TBLRD and TBLWT instructions,

or during program/verify. The ID locations can be read

when the device is code-protected.

23.7 In-Circuit Serial Programming

PIC18F2331/2431/4331/4431 microcontrollers can be

serially programmed while in the end application circuit.

This is simply done with two lines for clock and data,

and three other lines for power, ground and the

programming voltage. This allows customers to manu-

facture boards with unprogrammed devices, and then

program the microcontroller just before shipping the

product. This also allows the most recent firmware or a

custom firmware to be programmed.

23.8 In-Circuit Debugger

When the DEBUG bit in the CONFIG4L Configuration

functionality is enabled. This function allows simple

debugging functions when used with MPLAB® IDE.

When the microcontroller has this feature enabled,

some resources are not available for general use.

Table 23-4 shows which resources are required by the

background debugger.

TABLE 23-4: DEBUGGER RESOURCES

To use the In-Circuit Debugger function of the micro-

controller, the design must implement In-Circuit Serial

Programming connections to MCLR/VPP, VDD, VSS,

RB7 and RB6. This will interface to the In-Circuit

Debugger module available from Microchip or one of

the third party development tool companies.

23.9 Single-Supply ICSP™

Programming

The LVP bit in Configuration Register 4L

(CONFIG4L<2>) enables Single-Supply ICSP

Programming. When LVP is enabled, the microcontroller

can be programmed without requiring high voltage being

applied to the MCLR/VPP pin, but the RB5/PGM pin is

then dedicated to controlling Program mode entry and is

not available as a general purpose I/O pin.

LVP is enabled in erased devices.

While programming, using Single-Supply Program-

ming, VDD is applied to the MCLR/VPP pin as in normal

execution mode. To enter Programming mode, VDD is

applied to the PGM pin.

If Single-Supply ICSP Programming mode will not be

used, the LVP bit can be cleared and RB5/PGM

becomes available as the digital I/O pin RB5. The LVP

bit may be set or cleared only when using standard

high-voltage programming (VIHH applied to the MCLR/

VPP pin). Once LVP has been disabled, only the

standard high-voltage programming is available and

must be used to program the device.

Memory that is not code-protected can be erased using

either a block erase, or erased row by row, then written

at any specified VDD. If code-protected memory is to be

erased, a block erase is required. If a block erase is to

be performed when using Single-Supply Programming,

the device must be supplied with VDD of 4.5V to 5.5V.

I/O pins: RB6, RB7

Stack: 2 levels

Program Memory: <1 Kbytes

Data Memory: 16 bytes

Note 1: High-voltage programming is always

available, regardless of the state of the

LVP bit or the PGM pin, by applying VIHH

to the MCLR pin.

2: When Single-Supply Programming is

enabled, the RB5 pin can no longer be

used as a general purpose I/O pin.

3: When LVP is enabled externally, pull the

PGM pin to VSS to allow normal program

execution.

 2010 Microchip Technology Inc. DS39616D-page 283

PIC18F2331/2431/4331/4431

24.0 INSTRUCTION SET SUMMARY

The PIC18 instruction set adds many enhancements to

the previous PIC® instruction sets, while maintaining an

easy migration from these PIC instruction sets.

Most instructions are a single program memory word

(16 bits), but there are three instructions that require

two program memory locations.

Each single-word instruction is a 16-bit word divided

into an opcode, which specifies the instruction type and

one or more operands, which further specify the

operation of the instruction.

The instruction set is highly orthogonal and is grouped

into four basic categories:

•Byte-oriented operations

•Bit-oriented operations

•Literal operations

•Control operations

The PIC18 instruction set summary in Table 24-2 lists

byte-oriented, bit-oriented, literal and control

operations. Table 24-1 shows the opcode field

descriptions.

Most byte-oriented instructions have three operands:

1. The file register (specified by ‘f’)

2. The destination of the result

(specified by ‘d’)

3. The accessed memory

(specified by ‘a’)

The file register designator, ‘f’, specifies which file

The destination designator, ‘d’, specifies where the result

of the operation is to be placed. If ‘d’ is ‘0’, the result is

placed in the WREG register. If ‘d’ is ‘1’, the result is

placed in the file register specified in the instruction.

All bit-oriented instructions have three operands:

1. The file register (specified by ‘f’)

2. The bit in the file register

(specified by ‘b’)

3. The accessed memory

(specified by ‘a’)

The bit field designator, ‘b’, selects the number of the bit

affected by the operation, while the file register desig-

nator, ‘f’, represents the number of the file in which the

bit is located.

The literal instructions may use some of the following

operands:

• A literal value to be loaded into a file register

(specified by ‘k’)

• The desired FSR register to load the literal value

into (specified by ‘f’)

• No operand required

(specified by ‘—’)

The control instructions may use some of the following

operands:

• A program memory address (specified by ‘n’)

• The mode of the call or return instructions

(specified by ‘s’)

• The mode of the table read and table write

instructions (specified by ‘m’)

• No operand required

(specified by ‘—’)

All instructions are a single word, except for three

double-word instructions. These three instructions were

made double word instructions so that all the required

information is available in these 32 bits. In the second

word, the 4 MSbs are ‘1’s. If this second word is

executed as an instruction (by itself), it will execute as a

NOP.

All single-word instructions are executed in a single

instruction cycle, unless a conditional test is true or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles with the additional instruction cycle(s) executed

as a NOP.

The double word instructions execute in two instruction

cycles.

One instruction cycle consists of four oscillator periods.

Thus, for an oscillator frequency of 4 MHz, the normal

instruction execution time is 1 s. If a conditional test is

true or the program counter is changed as a result of

an instruction, the instruction execution time is 2 s.

Two-word branch instructions (if true) would take 3 s.

Figure 24-1 shows the general formats that the

instructions can have.

All examples use the format ‘nnh’ to represent a hexa-

decimal number, where ‘h’ signifies a hexadecimal

digit.

The Instruction Set Summary, shown in Tabl e 2 4-2,

lists the instructions recognized by the Microchip

Assembler (MPASMTM Assembler). Section 24.2

“Instruction Set” provides a description of each

instruction.

24.1 Read-Modify-Write Ope rations

Any instruction that specifies a file register as part of

the instruction performs a Read-Modify-Write (R-M-W)

operation. The register is read, the data is modified,

and the result is stored according to either the instruc-

tion or the destination designator, ‘d’. A read operation

is performed on a register even if the instruction writes

to that register.

For example, a “BCF PORTB, 1” instruction will read

PORTB, clear bit 1 of the data, then write the result back

to PORTB. The read operation would have the unin-

tended result that any condition that sets the RBIF flag

would be cleared. The R-M-W operation may also copy

the level of an input pin to its corresponding output latch.

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TABLE 24-1: OPCODE FIELD DESCRIPTIONS

Field Description

aRAM access bit:

a = 0: RAM location in Access RAM (BSR register is ignored)

a = 1: RAM bank is specified by BSR register

bbb Bit address within an 8-bit file register (0 to 7).

BSR Bank Select Register. Used to select the current RAM bank.

dDestination select bit:

d = 0: store result in WREG

d = 1: store result in file register f

dest Destination either the WREG register or the specified register file locations.

f8-bit register file address (0x00 to 0xFF).

fs 12-bit register file address (0x000 to 0xFFF). This is the source address.

fd 12-bit register file address (0x000 to 0xFFF). This is the destination address.

kLiteral field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).

label Label name.

mm The mode of the TBLPTR register for the table read and table write instructions.

Only used with table read and table write instructions:

*No Change to register (such as TBLPTR with table reads and writes).

*+ Post-Increment register (such as TBLPTR with table reads and writes).

*- Post-Decrement register (such as TBLPTR with table reads and writes).

+* Pre-Increment register (such as TBLPTR with table reads and writes).

nThe relative address (2’s complement number) for relative branch instructions, or the direct address for

Call/Branch and Return instructions.

PRODH Product of Multiply High Byte.

PRODL Product of Multiply Low Byte.

sFast Call/Return Mode Select bit:

s = 0: do not update into/from Shadow registers

s = 1: certain registers loaded into/from shadow registers (Fast mode)

uUnused or Unchanged.

WREG Working register (accumulator).

xDon’t care (‘0’ or ‘1’).

The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all

Microchip software tools.

TBLPTR 21-bit Table Pointer (points to a Program Memory location).

TABLAT 8-bit Table Latch.

TOS Top-of-Stack.

PC Program Counter.

PCL Program Counter Low Byte.

PCH Program Counter High Byte.

PCLATH Program Counter High Byte Latch.

PCLATU Program Counter Upper Byte Latch.

GIE Global Interrupt Enable bit.

WDT Watchdog Timer.

TO Time-out bit.

PD Power-Down bit.

C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.

[ ] Optional.

( ) Contents.

Assigned to.

< > Register bit field.

In the set of.

italics User-defined term (font is Courier New).

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FIGURE 24-1: GENERAL FORMAT FOR INSTRUCTIONS

Byte-oriented file register operations

15 10 9 8 7 0

d = 0 for result destination to be WREG register

OPCODE d a f (FILE #)

d = 1 for result destination to be file register (f)

a = 0 to force Access Bank

Bit-oriented file register operations

15 12 11 9 8 7 0

OPCODE b (BIT #) a f (FILE #)

b = 3-bit position of bit in file register (f)

Literal operations

15 8 7 0

OPCODE k (literal)

k = 8-bit immediate value

Byte to Byte move operations (2-word)

15 12 11 0

OPCODE f (Source FILE #)

CALL, GOTO and Branch operations

15 8 7 0

OPCODE n<7:0> (literal)

n = 20-bit immediate value

a = 1 for BSR to select bank

f = 8-bit file register address

a = 0 to force Access Bank

a = 1 for BSR to select bank

f = 8-bit file register address

15 12 11 0

1111 n<19:8> (literal)

15 12 11 0

1111 f (Destination FILE #)

f = 12-bit file register address

Control operations

Example Instruction

ADDWF MYREG, W, B

MOVFF MYREG1, MYREG2

BSF MYREG, bit, B

MOVLW 0x7F

GOTO Label

15 8 7 0

OPCODE n<7:0> (literal)

15 12 11 0

n<19:8> (literal)

CALL MYFUNC

15 11 10 0

OPCODE n<10:0> (literal)

S = Fast bit

BRA MYFUNC

15 8 7 0

OPCODE n<7:0> (literal) BC MYFUNC

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TABLE 24-2: PIC18FXXXX INSTRUCTION SET

Mnemonic,

Operands Description Cycles 1 6 -Bit Instru ct i o n Wor d Status

Affected Notes

MSb LSb

BYTE-ORIENT ED FILE REGISTE R OPERATIONS

ADDWF

ADDWFC

ANDWF

CLRF

COMF

CPFSEQ

CPFSGT

CPFSLT

DECF

DECFSZ

DCFSNZ

INCF

INCFSZ

INFSNZ

IORWF

MOVF

MOVFF

MOVWF

MULWF

NEGF

RLCF

RLNCF

RRCF

RRNCF

SETF

SUBFWB

SUBWF

SUBWFB

SWAPF

TSTFSZ

XORWF

f, d, a

f, a

f, d, a

f, a

f, d, a

fs, fd

f, a

f, d, a

f, a

f, d, a

f, a

f, d, a

Add WREG and f

Add WREG and Carry bit to f

AND WREG with f

Clear f

Complement f

Compare f with WREG, Skip =

Compare f with WREG, Skip >

Compare f with WREG, Skip <

Decrement f

Decrement f, Skip if 0

Decrement f, Skip if Not 0

Increment f

Increment f, Skip if 0

Increment f, Skip if Not 0

Inclusive OR WREG with f

Move f

Move fs (source) to 1st word

fd (destination) 2nd word

Move WREG to f

Multiply WREG with f

Negate f

Rotate Left f through Carry

Rotate Left f (No Carry)

Rotate Right f through Carry

Rotate Right f (No Carry)

Set f

Subtract f from WREG with

Borrow

Subtract WREG from f

Subtract WREG from f with

Borrow

Swap Nibbles in f

Test f, Skip if 0

Exclusive OR WREG with f

1 (2 or 3)

0010

0001

0110

0001

0110

0000

0010

0100

0010

0011

0100

0001

0101

1100

1111

0110

0000

0110

0011

0100

0011

0100

0110

0101

0011

0110

0001

01da

00da

01da

101a

11da

001a

010a

000a

01da

11da

10da

11da

10da

00da

ffff

111a

001a

110a

01da

00da

100a

01da

11da

10da

011a

10da

ffff

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

None

C, DC, Z, OV, N

None

Z, N

None

C, DC, Z, OV, N

C, Z, N

Z, N

C, Z, N

Z, N

None

C, DC, Z, OV, N

None

Z, N

1, 2

1,2

1, 2

1, 2, 3, 4

1, 2

1, 2, 3, 4

1, 2

BIT-ORIENTED FILE REGISTER OPER ATIONS

BCF

BSF

BTFSC

BTFSS

BTG

f, b, a

Bit Clear f

Bit Set f

Bit Test f, Skip if Clear

Bit Test f, Skip if Set

Bit Toggle f

1 (2 or 3)

1001

1000

1011

1010

0111

bbba

ffff

None

1, 2

3, 4

1, 2

Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as an input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if

assigned.

3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

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CONTROL OPERATIONS

BNC

BNN

BNOV

BNZ

BOV

BRA

CALL

CLRWDT

DAW

GOTO

NOP

POP

PUSH

RCALL

RESET

RETFIE

RETLW

RETURN

SLEEP

n, s

—

Branch if Carry

Branch if Negative

Branch if Not Carry

Branch if Not Negative

Branch if Not Overflow

Branch if Not Zero

Branch if Overflow

Branch Unconditionally

Branch if Zero

Call Subroutine 1st word

2nd word

Clear Watchdog Timer

Decimal Adjust WREG

Go to Address 1st word

2nd word

No Operation

Pop Top of Return Stack (TOS)

Push Top of Return Stack (TOS)

Relative Call

Software Device Reset

Return from Interrupt Enable

Return with Literal in WREG

Return from Subroutine

Go into Standby mode

1 (2)

1110

1101

1110

1111

0000

1110

1111

0000

1111

0000

1101

0000

0010

0110

0011

0111

0101

0001

0100

0nnn

0000

110s

kkkk

0000

1111

kkkk

0000

xxxx

0000

1nnn

0000

1100

0000

nnnn

kkkk

0000

kkkk

0000

xxxx

0000

nnnn

1111

0001

kkkk

0001

0000

nnnn

kkkk

0100

0111

kkkk

0000

xxxx

0110

0101

nnnn

1111

000s

kkkk

001s

0011

None

TO, PD

C, DC

None

All

GIE/GIEH,

PEIE/GIEL

None

TO, PD

TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles 1 6 -Bit Instru ct i o n Wor d Status

Affected Notes

MSb LSb

Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as an input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if

assigned.

3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

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LITERAL OPERATIONS

ADDLW

ANDLW

IORLW

LFSR

MOVLB

MOVLW

MULLW

RETLW

SUBLW

XORLW

f, k

Add Literal and WREG

AND Literal with WREG

Inclusive OR Literal with WREG

Load Literal (12-bit) 2nd word

to FSRx 1st word

Move Literal to BSR<3:0>

Move Literal to WREG

Multiply Literal with WREG

Return with Literal in WREG

Subtract WREG from Literal

Exclusive OR Literal with WREG

0000

1110

1111

0000

1111

1011

1001

1110

0000

0001

1110

1101

1100

1000

1010

kkkk

00ff

kkkk

0000

kkkk

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

Z, N

DATA MEMOR Y  PROGRAM MEMORY OPERATIONS

TBLRD*

TBLRD*+

TBLRD*-

TBLRD+*

TBLWT*

TBLWT*+

TBLWT*-

TBLWT+*

Table Read

Table Read with Post-Increment

Table Read with Post-Decrement

Table Read with Pre-Increment

Table Write

Table Write with Post-Increment

Table Write with Post-Decrement

Table Write with Pre-Increment

2 (5)

0000

1000

1001

1010

1011

1100

1101

1110

1111

None

TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles 1 6 -Bit Instru ct i o n Wor d Status

Affected Notes

MSb LSb

Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as an input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if

assigned.

3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

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24.2 Instruction Set

ADDLW ADD Literal to W

Syntax: [ lab el ] ADDLW k

Operands: 0  k  255

Operation: (W) + k  W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1111 kkkk kkkk

Description: The contents of W are added to the

8-bit literal ‘k’ and the result is placed in

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

Example: ADDLW 0x15

Before Instruction

W = 0x10

After Instruction

W = 0x25

ADDWF ADD W to f

Syntax: [ label ] ADDWF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (W) + (f)  dest

Status Affected: N, OV, C, DC, Z

Encoding: 0010 01da ffff ffff

Description: Add W to register, ‘f’. If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register, ‘f’. If ‘a’

is ‘0’, the Access Bank will be selected.

If ‘a’ is ‘1’, the BSR is used.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ADDWF REG, W

Before Instruction

W = 0x17

REG = 0xC2

After Instruction

W=0xD9

REG = 0xC2

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ADDWFC ADD W and Carry bit to f

Syntax: [ label ] ADDWFC f [,d [,a]]

Operands: 0  f  255

d [0,1]

a [0,1]

Operation: (W) + (f) + (C)  dest

Status Affected: N, OV, C, DC, Z

Encoding: 0010 00da ffff ffff

Description: Add W, the Carry flag and data memory

location, ‘f’. If ‘d’ is ‘0’, the result is placed

in W. If ‘d’ is ‘1’, the result is placed in

data memory location, ‘f’. If ‘a’ is ‘0’, the

Access Bank will be selected. If ‘a’ is ‘1’,

the BSR will not be overridden.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ADDWFC REG, W

Before Instruction

Carry bit = 1

REG = 0x02

W = 0x4D

After Instruction

Carry bit = 0

REG = 0x02

W = 0x50

ANDLW AND Literal with W

Syntax: [ label ] ANDLW k

Operands: 0  k  255

Operation: (W) .AND. k  W

Status Affected: N, Z

Encoding: 0000 1011 kkkk kkkk

Description: The contents of W are ANDed with the

8-bit literal ‘k’. The result is placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’

Process

Data

Write to

Example: ANDLW 0x5F

Before Instruction

W=0xA3

After Instruction

W = 0x03

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ANDWF AND W with f

Syntax: [ label ] ANDWF f [,d [,a]]

Operands: 0  f  255

d [0,1]

a [0,1]

Operation: (W) .AND. (f)  dest

Status Affected: N, Z

Encoding: 0001 01da ffff ffff

Description: The contents of W are ANDed with

stored in W. If ‘d’ is ‘1’, the result is

stored back in register, ‘f’. If ‘a’ is ‘0’, the

Access Bank will be selected. If ‘a’ is ‘1’,

the BSR will not be overridden.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ANDWF REG, W

Before Instruction

W = 0x17

REG = 0xC2

After Instruction

W = 0x02

REG = 0xC2

BC Bra nch if Carry

Syntax: [ label ] BC n

Operands: -128  n  127

Operation: if Carry bit is ‘1’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0010 nnnn nnnn

Description: If the Carry bit is ‘1’, then the program

will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BC JUMP

Before Instruction

PC = address (HERE)

After Instruction

If Carry = 1;

PC = address (JUMP)

If Carry = 0;

PC = address (HERE + 2)

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BCF Bit Clear f

Syntax: [ label ] BCF f,b[,a]

Operands: 0  f  255

0  b  7

a [0,1]

Operation: 0  f

Status Affected: None

Encoding: 1001 bbba ffff ffff

Description: Bit ‘b’ in register, ‘f’, is cleared. If ‘a’ is

‘0’, the Access Bank will be selected,

overriding the BSR value. If ‘a’ = 1, then

the bank will be selected as per the

BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BCF FLAG_REG, 7

Before Instruction

FLAG_REG = 0xC7

After Instruction

FLAG_REG = 0x47

BN Branch if Negative

Syntax: [ label ] BN n

Operands: -128  n  127

Operation: if Negative bit is ‘1’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0110 nnnn nnnn

Description: If the Negative bit is ‘1’, then the

program will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BN Jump

Before Instruction

PC = address (HERE)

After Instruction

If Negative = 1;

PC = address (Jump)

If Negative = 0;

PC = address (HERE + 2)

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BNC Branch if Not Carry

Syntax: [ label ] BNC n

Operands: -128  n  127

Operation: if Carry bit is ‘0’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0011 nnnn nnnn

Description: If the Carry bit is ‘0’, then the program

will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNC Jump

Before Instruction

PC = address (HERE)

After Instruction

If Carry = 0;

PC = address (Jump)

If Carry = 1;

PC = address (HERE + 2)

BNN Branch if Not Negative

Syntax: [ label ] BNN n

Operands: -128  n  127

Operation: if Negative bit is ‘0’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0111 nnnn nnnn

Description: If the Negative bit is ‘0’, then the

program will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNN Jump

Before Instruction

PC = address (HERE)

After Instruction

If Negative = 0;

PC = address (Jump)

If Negative = 1;

PC = address (HERE + 2)

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BNOV Branch if Not Overflow

Syntax: [ label ] BNOV n

Operands: -128  n  127

Operation: if Overflow bit is ‘0’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0101 nnnn nnnn

Description: If the Overflow bit is ‘0’, then the

program will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNOV Jump

Before Instruction

PC = address (HERE)

After Instruction

If Overflow = 0;

PC = address (Jump)

If Overflow = 1;

PC = address (HERE + 2)

BNZ Branch if Not Zero

Syntax: [ label ] BNZ n

Operands: -128  n  127

Operation: if Zero bit is ‘0’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0001 nnnn nnnn

Description: If the Zero bit is ‘0’, then the program

will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNZ Jump

Before Instruction

PC = address (HERE)

After Instruction

If Zero = 0;

PC = address (Jump)

If Zero = 1;

PC = address (HERE + 2)

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BRA Unconditional Branch

Syntax: [ label ] BRA n

Operands: -1024  n  1023

Operation: (PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1101 0nnn nnnn nnnn

Description: Add the 2’s complement number, ‘2n’,

to the PC. Since the PC will have incre-

mented to fetch the next instruction, the

new address will be PC + 2 + 2n. This

instruction is a two-cycle instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

Example: HERE BRA Jump

Before Instruction

PC = address (HERE)

After Instruction

PC = address (Jump)

BSF B it Set f

Syntax: [ label ] BSF f,b[,a]

Operands: 0  f  255

0  b  7

a [0,1]

Operation: 1  f

Status Affected: None

Encoding: 1000 bbba ffff ffff

Description: Bit ‘b’ in register, ‘f’, is set. If ‘a’ is ‘0’,

Access Bank will be selected, over-

riding the BSR value. If ‘a’ = 1, then the

bank will be selected as per the BSR

value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BSF FLAG_REG, 7

Before Instruction

FLAG_REG = 0x0A

After Instruction

FLAG_REG = 0x8A

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BTFSC Bit Test File, Skip if Clear

Syntax: [ label ] BTFSC f,b[,a]

Operands: 0  f  255

0  b  7

a [0,1]

Operation: skip if (f) = 0

Status Affected: None

Encoding: 1011 bbba ffff ffff

Description: If bit ‘b’ in register, ‘f’, is ‘0’, then the next

instruction is skipped.

If bit ‘b’ is ‘0’, then the next instruction

fetched during the current instruction

execution is discarded, and a NOP is

executed instead, making this a two-cycle

instruction. If ‘a’ is ‘0’, the Access Bank

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE

FALSE

TRUE

BTFSC

FLAG, 1

Before Instruction

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (TRUE)

If FLAG<1> = 1;

PC = address (FALSE)

BTFSS Bit Test File, Skip if Set

Syntax: [ label ] BTFSS f,b[,a]

Operands: 0  f  255

0  b < 7

a [0,1]

Operation: skip if (f) = 1

Status Affected: None

Encoding: 1010 bbba ffff ffff

Description: If bit ‘b’ in register, ‘f’, is ‘1’, then the next

instruction is skipped.

If bit ‘b’ is ‘1’, then the next instruction

fetched during the current instruction

execution, is discarded and a NOP is

executed instead, making this a two-cycle

instruction. If ‘a’ is ‘0’, the Access Bank

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE

FALSE

TRUE

BTFSS

FLAG, 1

Before Instruction

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (FALSE)

If FLAG<1> = 1;

PC = address (TRUE)

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BTG Bit Toggle f

Syntax: [ label ] BTG f,b[,a]

Operands: 0  f  255

0  b < 7

a [0,1]

Operation: (f)  f

Status Affected: None

Encoding: 0111 bbba ffff ffff

Description: Bit ‘b’ in data memory location, ‘f’, is

inverted. If ‘a’ is ‘0’, the Access Bank will

be selected, overriding the BSR value. If

‘a’ = 1, then the bank will be selected as

per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BTG PORTC, 4

Before Instruction:

PORTC = 0111 0101 [0x75]

After Instruction:

PORTC = 0110 0101 [0x65]

BOV Branch if Overf low

Syntax: [ label ] BOV n

Operands: -128  n  127

Operation: if Overflow bit is ‘1’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0100 nnnn nnnn

Description: If the Overflow bit is ‘1’, then the

program will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BOV JUMP

Before Instruction

PC = address (HERE)

After Instruction

If Overflow = 1;

PC = address (JUMP)

If Overflow = 0;

PC = address (HERE + 2)

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BZ Branch if Zero

Syntax: [ label ] BZ n

Operands: -128  n  127

Operation: if Zero bit is ‘1’,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1110 0000 nnnn nnnn

Description: If the Zero bit is ‘1’, then the program

will branch.

The 2’s complement number, ‘2n’, is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BZ Jump

Before Instruction

PC = address (HERE)

After Instruction

If Zero = 1;

PC = address (Jump)

If Zero = 0;

PC = address (HERE + 2)

CALL Subroutine Call

Syntax: [ label ] CALL k [,s]

Operands: 0  k  1048575

s [0,1]

Operation: (PC) + 4  TOS,

k  PC<20:1>;

if s = 1:

(W)  WS,

(STATUS)  STATUSS,

(BSR)  BSRS

Status Affected: None

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>)

1110

1111 110s

k19kkk k7kkk

kkkk kkkk0

kkkk8

Description: Subroutine call of entire 2-Mbyte

memory range. First, the return address

(PC + 4) is pushed onto the return

stack. If ‘s’ = 1, the W, STATUS and

BSR registers are also pushed into their

respective shadow registers, WS,

STATUSS and BSRS. If ‘s’ = 0, no

update occurs. Then, the

20-bit value, ‘k’, is loaded into

PC<20:1>. CALL is a two-cycle

instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>,

Push PC to

Stack

Read literal

‘k’<19:8>,

Write to PC

operation

Example: HERE CALL THERE,FAST

Before Instruction

PC = address (HERE)

After Instruction

PC = address (THERE)

TOS = address (HERE + 4)

WS = W

BSRS = BSR

STATUSS

= STATUS

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CLRF Clear f

Syntax: [ label ] CLRF f [,a]

Operands: 0  f  255

a [0,1]

Operation: 000h  f,

1  Z

Status Affected: Z

Encoding: 0110 101a ffff ffff

Description: Clears the contents of the specified reg-

ister. If ‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ = 1, then the bank will be selected as

per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: CLRF FLAG_REG

Before Instruction

FLAG_REG = 0x5A

After Instruction

FLAG_REG = 0x00

CLRWDT Clear Watchdog Timer

Syntax: [ label ] CLRWDT

Operands: None

Operation: 000h  WDT,

000h  WDT postscaler,

1  TO,

1  PD

Status Affected: TO, PD

Encoding: 0000 0000 0000 0100

Description: CLRWDT instruction resets the

Watchdog Timer. It also resets the post-

scaler of the WDT. Status bits TO and

PD are set.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

operation

Example: CLRWDT

Before Instruction

WDT Counter = ?

After Instruction

WDT Counter = 0x00

WDT Postscaler = 0

TO =1

PD =1

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COMF Complement f

Syntax: [ label ] COMF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f)  dest

Status Affected: N, Z

Encoding: 0001 11da ffff ffff

Description: The contents of register, ‘f’, are comple-

mented. If ‘d’ is ‘0’, the result is stored in

W. If ‘d’ is ‘1’, the result is stored back in

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: COMF REG, W

Before Instruction

REG = 0x13

After Instruction

REG = 0x13

W=0xEC

CPFSEQ Compare f with W, Skip if f = W

Syntax: [ label ] CPFSEQ f [,a]

Operands: 0  f  255

a  [0,1]

Operation: (f) – (W),

skip if (f) = (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 001a ffff ffff

Description: Compares the contents of data memory

location, ‘f’, to the contents of W by

performing an unsigned subtraction.

If ‘f’ = W, then the fetched instruction is

discarded and a NOP is executed

instead, making this a two-cycle

instruction. If ‘a’ is ‘0’, the Access Bank

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSEQ REG

NEQUAL :

EQUAL :

Before Instruction

PC Address = HERE

W=?

REG = ?

After Instruction

If REG = W;

PC = Address (EQUAL)

If REG  W;

PC = Address (NEQUAL)

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CPFSGT Compare f with W, Skip if f > W

Syntax: [ label ] CPFSGT f [,a]

Operands: 0  f  255

a  [0,1]

Operation: (f) W),

skip if (f) > (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 010a ffff ffff

Description: Compares the contents of data memory

location, ‘f’, to the contents of the W by

performing an unsigned subtraction.

If the contents of ‘f’ are greater than the

contents of WREG, then the fetched

instruction is discarded and a NOP is

executed instead, making this a two-

cycle instruction. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding the

BSR value. If ‘a’ = 1, then the bank will

be selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSGT REG

NGREATER :

GREATER :

Before Instruction

PC = Address (HERE)

W= ?

After Instruction

If REG  W;

PC = Address (GREATER)

If REG  W;

PC = Address (NGREATER)

CPFSLT Compare f with W, Skip if f < W

Syntax: [ label ] CPFSLT f [,a]

Operands: 0  f  255

a  [0,1]

Operation: (f) –W),

skip if (f) < (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 000a ffff ffff

Description: Compares the contents of data memory

location, ‘f’, to the contents of W by

performing an unsigned subtraction.

If the contents of ‘f’ are less than the

contents of W, then the fetched

instruction is discarded and a NOP is

executed instead, making this a

two-cycle instruction. If ‘a’ is ‘0’, the

Access Bank will be selected. If ‘a’ is ‘1’,

the BSR will not be overridden.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSLT REG

NLESS :

LESS :

Before Instruction

PC = Address (HERE)

W= ?

After Instruction

If REG < W;

PC = Address (LESS)

If REG  W;

PC = Address (NLESS)

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DAW Decimal Adjust W Register

Syntax: [ label ] DAW

Operands: None

Operation: If [W<3:0> > 9] or [DC = 1] then,

(W<3:0>) + 6  W<3:0>;

else,

(W<3:0>)  W<3:0>;

If [W<7:4> 9] or [C = 1] then,

(W<7:4>) + 6  W<7:4>;

else,

(W<7:4>)  W<7:4>

Status Affected: C, DC

Encoding: 0000 0000 0000 0111

Description: DAW adjusts the 8-bit value in W,

resulting from the earlier addition of two

variables (each in packed BCD format)

and produces a correct packed BCD

result. The Carry bit may be set by DAW

regardless of its setting prior to the DAW

instruction.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example 1: DAW

Before Instruction

W=0xA5

C=0

DC = 0

After Instruction

W = 0x05

C=1

DC = 0

Example 2:

Before Instruction

W=0xCE

C=0

DC = 0

After Instruction

W = 0x34

C=1

DC = 0

DECF Decrement f

Syntax: [ label ] DECF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) – 1  dest

Status Affected: C, DC, N, OV, Z

Encoding: 0000 01da ffff ffff

Description: Decrement register, ‘f’,. If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register, ‘f’. If ‘a’

is ‘0’, the Access Bank will be selected,

overriding the BSR value. If ‘a’ = 1, then

the bank will be selected as per the

BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: DECF CNT,

Before Instruction

CNT = 0x01

Z=0

After Instruction

CNT = 0x00

Z=1

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DECFSZ Decrement f, Skip if 0

Syntax: [ label ] DECFSZ f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) – 1  dest,

skip if result = 0

Status Affected: None

Encoding: 0010 11da ffff ffff

Description: The contents of register, ‘f’, are

decremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’.

If the result is ‘0’, the next instruction,

which is already fetched, is discarded,

and a NOP is executed instead, making

it a two-cycle instruction. If ‘a’ is ‘0’, the

Access Bank will be selected,

overriding the BSR value. If ‘a’ = 1,

then the bank will be selected as per

the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE DECFSZ CNT

GOTO LOOP

CONTINUE

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT – 1

If CNT = 0;

PC = Address (CONTINUE)

If CNT 0;

PC = Address (HERE + 2)

DCFSNZ Decrement f, Skip if Not 0

Syntax: [ label ] DCFSNZ f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) – 1  dest,

skip if result  0

Status Affected: None

Encoding: 0100 11da ffff ffff

Description: The contents of register, ‘f’, are

decremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’.

If the result is not ‘0’, the next

instruction, which is already fetched, is

discarded, and a NOP is executed

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access Bank

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE DCFSNZ TEMP

ZERO :

NZERO :

Before Instruction

TEMP = ?

After Instruction

TEMP = TEMP – 1,

If TEMP = 0;

PC = Address (ZERO)

If TEMP 0;

PC = Address (NZERO)

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GOTO Unconditional Branch

Syntax: [ label ] GOTO k

Operands: 0  k  1048575

Operation: k  PC<20:1>

Status Affected: None

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>)

1110

1111 1111

k19kkk k7kkk

kkkk kkkk0

kkkk8

Description: GOTO allows an unconditional branch

anywhere within entire 2-Mbyte memory

range. The 20-bit value, ‘k’, is loaded

into PC<20:1>. GOTO is always a

two-cycle

instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>,

operation

Read literal

‘k’<19:8>,

Write to PC

operation

Example: GOTO THERE

After Instruction

PC = Address (THERE)

INCF Increment f

Syntax: [ label ] INCF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) + 1  dest

Status Affected: C, DC, N, OV, Z

Encoding: 0010 10da ffff ffff

Description: The contents of register, ‘f’, are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’. If ‘a’ is ‘0’,

the Access Bank will be selected, over-

riding the BSR value. If ‘a’ = 1, then the

bank will be selected as per the BSR

value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: INCF CNT,

Before Instruction

CNT = 0xFF

Z=0

C=?

DC = ?

After Instruction

CNT = 0x00

Z=1

C=1

DC = 1

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INCFSZ Increment f, Skip if 0

Syntax: [ label ] INCFSZ f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) + 1  dest,

skip if result = 0

Status Affected: None

Encoding: 0011 11da ffff ffff

Description: The contents of register, ‘f’, are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’.

If the result is ‘0’, the next instruction,

which is already fetched, is discarded,

and a NOP is executed instead, making

it a two-cycle instruction. If ‘a’ is ‘0’, the

Access Bank will be selected,

overriding the BSR value. If ‘a’ = 1, then

the bank will be selected as per the

BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE INCFSZ CNT

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT + 1

If CNT = 0;

PC = Address (ZERO)

If CNT 0;

PC = Address (NZERO)

INFSNZ Increment f, Skip if Not 0

Syntax: [ label ] INFSNZ f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) + 1  dest,

skip if result  0

Status Affected: None

Encoding: 0100 10da ffff ffff

Description: The contents of register, ‘f’, are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’.

If the result is not ‘0’, the next

instruction, which is already fetched, is

discarded, and a NOP is executed

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access Bank

will be selected, overriding the BSR

value. If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE INFSNZ REG

ZERO

NZERO

Before Instruction

PC = Address (HERE)

After Instruction

REG = REG + 1

If REG 0;

PC = Address (NZERO)

If REG = 0;

PC = Address (ZERO)

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IORLW Inclusive OR Literal with W

Syntax: [ label ] IORLW k

Operands: 0  k  255

Operation: (W) .OR. k  W

Status Affected: N, Z

Encoding: 0000 1001 kkkk kkkk

Description: The contents of W are ORed with the

8-bit literal, ‘k’. The result is placed in

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

Example: IORLW 0x35

Before Instruction

W = 0x9A

After Instruction

W=0xBF

IORWF Inclusive OR W with f

Syntax: [ label ] IORWF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (W) .OR. (f)  dest

Status Affected: N, Z

Encoding: 0001 00da ffff ffff

Description: Inclusive OR W with register, ‘f’. If ‘d’ is

‘0’, the result is placed in W. If ‘d’ is ‘1’,

the result is placed back in register, ‘f’. If

‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ = 1, then the bank will be selected as

per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: IORWF RESULT, W

Before Instruction

RESULT = 0x13

W = 0x91

After Instruction

RESULT = 0x13

W = 0x93

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LFSR Load FSR

Syntax: [ label ] LFSR f,k

Operands: 0  f  2

0  k  4095

Operation: k  FSRf

Status Affected: None

Encoding: 1110

1111 1110

0000 00ff

k7kkk k11kkk

kkkk

Description: The 12-bit literal ‘k’ is loaded into the

file select register pointed to by ‘f’.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’ MSB

Process

Data

Write

literal ‘k’

MSB to

FSRfH

Decode Read literal

‘k’ LSB

Process

Data

Write literal

‘k’ to FSRfL

Example: LFSR 2, 0x3AB

After Instruction

FSR2H = 0x03

FSR2L = 0xAB

MOVF Move f

Syntax: [ label ] MOVF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: f  dest

Status Affected: N, Z

Encoding: 0101 00da ffff ffff

Description: The contents of register, ‘f’, are moved

to a destination dependent upon the

status of ‘d’. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’. Location, ‘f’,

can be anywhere in the 256-byte bank.

If ‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ = 1, then the bank will be selected as

per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: MOVF REG, W

Before Instruction

REG = 0x22

W=0xFF

After Instruction

REG = 0x22

W = 0x22

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MOVFF Move f to f

Syntax: [ label ] MOVFF fs,fd

Operands: 0  fs  4095

0  fd  4095

Operation: (fs)  fd

Status Affected: None

Encoding:

1st word (source)

2nd word (destin.)

1100

1111 ffff

ffff ffff

ffff ffffs

ffffd

Description: The contents of source register, ‘fs’, are

moved to destination register, ‘fd’.

Location of source, ‘fs’, can be any-

where in the 4096-byte data space

(000h to FFFh) and location of destina-

tion, ‘fd’, can also be anywhere from

000h to FFFh.

Either source or destination can be W

(a useful special situation).

MOVFF is particularly useful for

transferring a data memory location to a

peripheral register (such as the transmit

buffer or an I/O port).

The MOVFF instruction cannot use the

PCL, TOSU, TOSH or TOSL as the

destination register.

The MOVFF instruction should not be

used to modify interrupt settings while

any interrupt is enabled (see the note

on page 97).

Words: 2

Cycles: 2 (3)

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

(src)

Process

Data

operation

Decode No

operation

No dummy

read

operation

Write

(dest)

Example: MOVFF REG1, REG2

Before Instruction

REG1 = 0x33

REG2 = 0x11

After Instruction

REG1 = 0x33

REG2 = 0x33

MOVLB Move Litera l to Lo w Nibble in BSR

Syntax: [ label ] MOVLB k

Operands: 0  k  255

Operation: k  BSR

Status Affected: None

Encoding: 0000 0001 0000 kkkk

Description: The 8-bit literal, ‘k’, is loaded into the

Bank Select Register (BSR).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’

Process

Data

Write

literal ‘k’ to

BSR

Example: MOVLB 5

Before Instruction

BSR register = 0x02

After Instruction

BSR register = 0x05

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MOVLW Move Literal to W

Syntax: [ label ] MOVLW k

Operands: 0  k  255

Operation: k  W

Status Affected: None

Encoding: 0000 1110 kkkk kkkk

Description: The 8-bit literal, ‘k’, is loaded into W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

Example: MOVLW 0x5A

After Instruction

W = 0x5A

MOVWF Move W to f

Syntax: [ label ] MOVWF f [,a]

Operands: 0  f  255

a  [0,1]

Operation: (W)  f

Status Affected: None

Encoding: 0110 111a ffff ffff

Description: Move data from W to register, ‘f’.

Location, ‘f’, can be anywhere in the

256-byte bank. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding the

BSR value. If ‘a’ = 1, then the bank will

be selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: MOVWF REG

Before Instruction

W = 0x4F

REG = 0xFF

After Instruction

W = 0x4F

REG = 0x4F

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MULLW Multiply Literal with W

Syntax: [ label ] MULLW k

Operands: 0  k  255

Operation: (W) x k  PRODH:PRODL

Status Affected: None

Encoding: 0000 1101 kkkk kkkk

Description: An unsigned multiplication is carried

out between the contents of W and

the 8-bit literal, ‘k’. The 16-bit result

is placed in PRODH:PRODL register

pair. PRODH contains the high byte.

W is unchanged.

None of the Status flags are affected.

Note that neither Overflow nor Carry

is possible in this operation. A Zero

result is possible but not detected.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write

registers

PRODH:

PRODL

Example: MULLW 0xC4

Before Instruction

W=0xE2

PRODH = ?

PRODL = ?

After Instruction

W=0xE2

PRODH = 0xAD

PRODL = 0x08

MULWF Multiply W with f

Syntax: [ label ] MULWF f [,a]

Operands: 0  f  255

a  [0,1]

Operation: (W) x (f)  PRODH:PRODL

Status Affected: None

Encoding: 0000 001a ffff ffff

Description: An unsigned multiplication is carried

out between the contents of W and

the register file location, ‘f’. The

16-bit result is stored in the

PRODH:PRODL register pair.

PRODH contains the high byte.

Both W and ‘f’ are unchanged.

None of the Status flags are affected.

Note that neither Overflow nor Carry

is possible in this operation. A Zero

result is possible but not detected. If

‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’= 1, then the bank will be selected

as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

registers

PRODH:

PRODL

Example: MULWF REG

Before Instruction

W=0xC4

REG = 0xB5

PRODH = ?

PRODL = ?

After Instruction

W=0xC4

REG = 0xB5

PRODH = 0x8A

PRODL = 0x94

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NEGF Negate f

Syntax: [ label ] NEGF f [,a]

Operands: 0  f  255

a  [0,1]

Operation: ( f ) + 1  f

Status Affected: N, OV, C, DC, Z

Encoding: 0110 110a ffff ffff

Description: Location, ‘f’, is negated using two’s

complement. The result is placed in the

data memory location, ‘f’. If ‘a’

is ‘0’, the Access Bank will be selected,

overriding the BSR value. If ‘a’ = 1, then

the bank will be selected as per the

BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: NEGF REG, 1

Before Instruction

REG = 0011 1010 [0x3A]

After Instruction

REG = 1100 0110 [0xC6]

NOP No Operation

Syntax: [ label ] NOP

Operands: None

Operation: No operation

Status Affected: None

Encoding: 0000

1111 0000

xxxx 0000

xxxx

Description: No operation.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Example:

None.

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POP Pop Top of Return Stack

Syntax: [ label ] POP

Operands: None

Operation: (TOS)  bit bucket

Status Affected: None

Encoding: 0000 0000 0000 0110

Description: The TOS value is pulled off the return

stack and is discarded. The TOS value

then becomes the previous value that

was pushed onto the return stack.

This instruction is provided to enable

the user to properly manage the return

stack to incorporate a software stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

POP TOS

value

operation

Example: POP

GOTO NEW

Before Instruction

TOS = 0x0031A2

Stack (1 level down) = 0x014332

After Instruction

TOS = 0x014332

PC = NEW

PUSH Push Top of Return Stack

Syntax: [ label ] PUSH

Operands: None

Operation: (PC + 2)  TOS

Status Affected: None

Encoding: 0000 0000 0000 0101

Description: The PC + 2 is pushed onto the top of

the return stack. The previous TOS

value is pushed down on the stack.

This instruction allows to implement a

software stack by modifying TOS, and

then push it onto the return stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode PUSH

PC + 2 onto

return stack

operation

Example: PUSH

Before Instruction

TOS = 0x00345A

PC = 0x000124

After Instruction

PC = 0x000126

TOS = 0x000126

Stack (1 level down) = 0x00345A

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RCALL Relative Call

Syntax: [ label ] RCALL n

Operands: -1024  n  1023

Operation: (PC) + 2  TOS,

(PC) + 2 + 2n  PC

Status Affected: None

Encoding: 1101 1nnn nnnn nnnn

Description: Subroutine call with a jump up to 1K

from the current location. First, return

address (PC + 2) is pushed onto the

stack. Then, add the 2’s complement

number ‘2n’ to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is a

two-cycle instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

PUSH PC to

stack

Process

Data

Write to PC

operation

Example: HERE RCALL Jump

Before Instruction

PC = Address (HERE)

After Instruction

PC = Address (Jump)

TOS = Address (HERE + 2)

RESET Reset

Syntax: [ label ] RESET

Operands: None

Operation: Reset all registers and flags that are

affected by a MCLR Reset.

Status Affected: All

Encoding: 0000 0000 1111 1111

Description: This instruction provides a way to

execute a MCLR Reset in software.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Start

Reset

operation

Example: RESET

After Instruction

Registers = Reset Value

Flags* = Reset Value

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RETFIE Return from Interrupt

Syntax: [ label ] RETFIE [s]

Operands: s  [0,1]

Operation: (TOS)  PC,

1  GIE/GIEH or PEIE/GIEL;

if s = 1:

(WS)  W,

(STATUSS)  STATUS,

(BSRS)  BSR,

PCLATU, PCLATH are unchanged

Status Affected: GIE/GIEH, PEIE/GIEL.

Encoding: 0000 0000 0001 000s

Description: Return from interrupt. Stack is popped

and Top-of-Stack (TOS) is loaded into

the PC. Interrupts are enabled by

setting either the high or low-priority

global interrupt enable bit. If ‘s’ = 1, the

contents of the shadow registers, WS,

STATUSS and BSRS, are loaded into

their corresponding registers, W,

STATUS and BSR. If ‘s’ = 0, no update

of these registers occurs.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

POP PC

from stack

Set GIEH or

GIEL

operation

Example: RETFIE 1

After Interrupt

PC = TOS

W=WS

BSR = BSRS

STATUS = STATUSS

GIE/GIEH, PEIE/GIEL = 1

RETLW Return Literal to W

Syntax: [ label ] RETLW k

Operands: 0  k  255

Operation: k  W,

(TOS)  PC,

PCLATU, PCLATH are unchanged

Status Affected: None

Encoding: 0000 1100 kkkk kkkk

Description: W is loaded with the 8-bit literal, ‘k’. The

program counter is loaded from the top

of the stack (the return address). The

high address latch (PCLATH) remains

unchanged.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

POP PC

from stack,

Write to W

operation

Example:

CALL TABLE ; W contains table

; offset value

; W now has

; table value

TABLE

ADDWF PCL ; W = offset

RETLW k0 ; Begin table

RETLW k1 ;

:RETLW kn ; End of table

Before Instruction

W = 0x07

After Instruction

W = value of kn

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RETURN Return from Subroutine

Syntax: [ label ] RETURN [s]

Operands: s  [0,1]

Operation: (TOS)  PC;

if s = 1:

(WS)  W,

(STATUSS)  STATUS,

(BSRS)  BSR,

PCLATU, PCLATH are unchanged

Status Affected: None

Encoding: 0000 0000 0001 001s

Description: Return from subroutine. The stack is

popped and the top of the stack (TOS)

is loaded into the program counter. If

‘s’= 1, the contents of the shadow

registers, WS, STATUSS and BSRS,

are loaded into their corresponding

registers, W, STATUS and BSR. If

‘s’ = 0, no update of these registers

occurs.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

POP PC

from stack

operation

Example: RETURN

After Interrupt

PC = TOS

RLCF Rotate Left f through Carry

Syntax: [ label ] RLCF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f<n>)  dest<n + 1>,

(f<7>)  C,

Status Affected: C, N, Z

Encoding: 0011 01da ffff ffff

Description: The contents of register, ‘f’, are rotated

one bit to the left through the Carry flag.

If ‘d’ is ‘0’, the result is placed in W. If ‘d’

is ‘1’, the result is stored back in regis-

ter, ‘f’. If ‘a’ is ‘0’, the Access Bank will

be selected, overriding the BSR value.

If ‘a’ = 1, then the bank will be selected

as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RLCF REG, W

Before Instruction

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=1100 1100

C=1

Cregister f

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RLNCF Rotate Left f (No Carry)

Syntax: [ label ] RLNCF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f<n>)  dest<n + 1>,

(f<7>)  dest<0>

Status Affected: N, Z

Encoding: 0100 01da ffff ffff

Description: The contents of register, ‘f’, are rotated

one bit to the left. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

stored back in register, ‘f’. If ‘a’ is ‘0’, the

Access Bank will be selected, overrid-

ing the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the BSR

value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RLNCF REG

Before Instruction

REG = 1010 1011

After Instruction

REG = 0101 0111

RRCF Rotate Right f through Carry

Syntax: [ label ] RRCF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f<n>)  dest<n – 1>,

(f<0>)  C,

Status Affected: C, N, Z

Encoding: 0011 00da ffff ffff

Description: The contents of register, ‘f’, are rotated

one bit to the right through the Carry

Flag. If ‘d’ is ‘0’, the result is placed in

W. If ‘d’ is ‘1’, the result is placed back

in register, ‘f’. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding the

BSR value. If ‘a’ is ‘1’, then the bank will

be selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RRCF REG, W

Before Instruction

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=0111 0011

C=0

Cregister f

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RRNCF Rotate Right f (No Carry)

Syntax: [ label ] RRNCF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f<n>)  dest<n – 1>,

(f<0>)  dest<7>

Status Affected: N, Z

Encoding: 0100 00da ffff ffff

Description: The contents of register, ‘f’, are rotated

one bit to the right. If ‘d’ is ‘0’, the result

is placed in W. If ‘d’ is ‘1’, the result is

placed back in register, ‘f’. If ‘a’ is ‘0’,

the Access Bank will be selected, over-

riding the BSR value. If ‘a’ is ‘1’, then

the bank will be selected as per the

BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: RRNCF REG, 1, 0

Before Instruction

REG = 1101 0111

After Instruction

REG = 1110 1011

Example 2: RRNCF REG, W

Before Instruction

W=?

REG = 1101 0111

After Instruction

W=1110 1011

REG = 1101 0111

SETF Set f

Syntax: [ label ] SETF f [,a]

Operands: 0  f  255

a [0,1]

Operation: FFh  f

Status Affected: None

Encoding: 0110 100a ffff ffff

Description: The contents of the specified register

are set to FFh. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding the

BSR value. If ‘a’ is ‘1’, then the bank will

be selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: SETF REG

Before Instruction

REG = 0x5A

After Instruction

REG = 0xFF

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SLEEP Enter Sleep Mode

Syntax: [ label ] SLEEP

Operands: None

Operation: 00h  WDT,

0  WDT postscaler,

1  TO,

0  PD

Status Affected: TO, PD

Encoding: 0000 0000 0000 0011

Description: The Power-Down status bit (PD) is

cleared. The Time-out status bit (TO)

is set. Watchdog Timer and its post-

scaler are cleared.

The processor is put into Sleep mode

with the oscillator stopped.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

Go to

Sleep

Example: SLEEP

Before Instruction

TO =?

PD =?

After Instruction

TO =1 †

PD =0

† If WDT causes wake-up, this bit is cleared.

SUBFWB Subtract f from W with Borrow

Syntax: [ label ] SUBFWB f [,d [,a]]

Operands: 0 f 255

d  [0,1]

a  [0,1]

Operation: (W) – (f) – (C) dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 01da ffff ffff

Description: Subtract register, ‘f’, and the Carry flag

(borrow) from W (2’s complement

method). If ‘d’ is ‘0’, the result is stored

in W. If ‘d’ is ‘1’, the result is stored in

will be selected, overriding the BSR

value. If ‘a’ is ‘1’, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBFWB REG

Before Instruction

REG = 0x03

W = 0x02

C = 0x01

After Instruction

REG = 0xFF

W = 0x02

C = 0x00

Z = 0x00

N = 0x01 ; result is negative

Example 2: SUBFWB REG, 0, 0

Before Instruction

REG = 2

W=5

C=1

After Instruction

REG = 2

W=3

C=1

Z=0

N = 0 ; result is positive

Example 3: SUBFWB REG, 1, 0

Before Instruction

REG = 1

W=2

C=0

After Instruction

REG = 0

W=2

C=1

Z = 1 ; result is zero

N=0

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SUBLW Subtract W from Literal

Syntax: [ label ]SUBLW k

Operands: 0 k 255

Operation: k – (W) W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1000 kkkk kkkk

Description: W is subtracted from the 8-bit

literal, ‘k’. The result is placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

Example 1: SUBLW 0x02

Before Instruction

W=1

C=?

After Instruction

W=1

C = 1 ; result is positive

Z=0

N=0

Example 2: SUBLW 0x02

Before Instruction

W=2

C=?

After Instruction

W=0

C = 1 ; result is zero

Z=1

N=0

Example 3: SUBLW 0x02

Before Instruction

W=3

C=?

After Instruction

W = FF ; (2’s complement)

C=0 ; result is negative

Z=0

N=1

SUBWF Subtract W from f

Syntax: [ label ] SUBWF f [,d [,a]]

Operands: 0 f 255

d  [0,1]

a  [0,1]

Operation: (f) – (W) dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 11da ffff ffff

Description: Subtract W from register, ‘f’ (2’s

complement method). If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register, ‘f’.

If = ‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ is ‘1’, then the bank will be selected

as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBWF REG

Before Instruction

REG = 3

W=2

C=?

After Instruction

REG = 1

W=2

C = 1 ; result is positive

Z=0

N=0

Example 2: SUBWF REG, W

Before Instruction

REG = 2

W=2

C=?

After Instruction

REG = 2

W=0

C = 1 ; result is zero

Z=1

N=0

Example 3: SUBWF REG

Before Instruction

REG = 0x01

W = 0x02

C=?

After Instruction

REG = 0xFFh ; (2’s complement)

W = 0x02

C = 0x00 ; result is negative

Z = 0x00

N = 0x01

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DS39616D-page 320  2010 Microchip Technology Inc.

SUBWFB Subtract W from f with Borrow

Syntax: [ label ] SUBWFB f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f) – (W) – (C) dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 10da ffff ffff

Description: Subtract W and the Carry flag (borrow)

from register, ‘f’ (2’s complement

method). If ‘d’ is ‘0’, the result is stored in

W. If ‘d’ is ‘1’, the result is stored back in

will be selected, overriding the BSR

value. If ‘a’ is ‘1’, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBWFB REG, 1, 0

Before Instruction

REG = 0x19 (0001 1001)

W = 0x0D (0000 1101)

C = 0x01

After Instruction

REG = 0x0C (0000 1011)

W = 0x0D (0000 1101)

C = 0x01

Z = 0x00

N = 0x00 ; result is positive

Example 2: SUBWFB REG, 0, 0

Before Instruction

REG = 0x1B (0001 1011)

W = 0x1A (0001 1010)

C = 0x00

After Instruction

REG = 0x1B (0001 1011)

W = 0x00

C = 0x01

Z = 0x01 ; result is zero

N = 0x00

Example 3: SUBWFB REG, 1, 0

Before Instruction

REG = 0x03 (0000 0011)

W = 0x0E (0000 1101)

C = 0x01

After Instruction

REG = 0xF5 (1111 0100)

; [2’s comp]

W = 0x0E (0000 1101)

C = 0x00

Z = 0x00

N = 0x01 ; result is negative

SWAPF Swap f

Syntax: [ label ] SWAPF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (f<3:0>)  dest<7:4>,

(f<7:4>)  dest<3:0>

Status Affected: None

Encoding: 0011 10da ffff ffff

Description: The upper and lower nibbles of register,

‘f’, are exchanged. If ‘d’ is ‘0’, the result

is placed in W. If ‘d’ is ‘1’, the result is

placed in register, ‘f’. If ‘a’ is ‘0’, the

Access Bank will be selected, overrid-

ing the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the BSR

value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: SWAPF REG

Before Instruction

REG = 0x53

After Instruction

REG = 0x35

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TBLRD Table Read

Syntax: [ label ] TBLRD ( *; *+; *-; +*)

Operands: None

Operation: if TBLRD *,

(Prog Mem (TBLPTR))  TABLAT,

TBLPTR – No Change;

if TBLRD *+,

(Prog Mem (TBLPTR))  TABLAT,

(TBLPTR) + 1  TBLPTR;

if TBLRD *-,

(Prog Mem (TBLPTR))  TABLAT,

(TBLPTR) – 1  TBLPTR;

if TBLRD +*,

(TBLPTR) + 1  TBLPTR,

(Prog Mem (TBLPTR))  TABLAT

Status Affected: None

Encoding: 0000 0000 0000 10nn

nn = 0

=1 *+

=2 *-

=3 +*

Description: This instruction is used to read the contents

of Program Memory (P.M.). To address the

program memory, a pointer called Table

Pointer (TBLPTR) is used.

The TBLPTR (a 21-bit pointer) points to

each byte in the program memory. TBLPTR

has a 2-Mbyte address range.

TBLPTR[0] = 0: Least Significant Byte of

Program Memory Word

TBLPTR[0] = 1: Most Significant Byte of

Program Memory Word

The TBLRD instruction can modify the value

of TBLPTR as follows:

• no change

• post-increment

• post-decrement

• pre-increment

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

No operation

(Read Program

Memory)

operation

No operation

(Write

TABLAT)

TBLRD Table Read (cont’d)

Example 1: TBLRD *+ ;

Before Instruction

TABLAT = 0x55

TBLPTR = 0x00A356

MEMORY(0x00A356) = 0x34

After Instruction

TABLAT = 0x34

TBLPTR = 0x00A357

Example 2: TBLRD +* ;

Before Instruction

TABLAT = 0xAA

TBLPTR = 0x01A357

MEMORY(0x01A357) = 0x12

MEMORY(0x01A358) = 0x34

After Instruction

TABLAT = 0x34

TBLPTR = 0x01A358

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TBLWT Table Write

Syntax: [ label ] TBLWT ( *; *+; *-; +*)

Operands: None

Operation: if TBLWT*,

(TABLAT)  Holding Register,

TBLPTR – No Change;

if TBLWT*+,

(TABLAT)  Holding Register,

(TBLPTR) + 1  TBLPTR;

if TBLWT*-,

(TABLAT)  Holding Register,

(TBLPTR) – 1  TBLPTR;

if TBLWT+*,

(TBLPTR) + 1  TBLPTR,

(TABLAT)  Holding Register

Status Affected: None

Encoding: 0000 0000 0000 11nn

nn = 0 *

=1 *+

=2 *-

=3 +*

Description: This instruction uses the 3 LSBs of

TBLPTR to determine which of the

8 holding registers the TABLAT is written

to. The holding registers are used to

program the contents of Program Memory

(P.M.). (Refer to Section 8.0 “Flash Pro-

gram Memory” for additional details on

programming Flash memory.)

The TBLPTR (a 21-bit pointer) points to

each byte in the program memory.

TBLPTR has a 2-Mbyte address range.

The LSb of the TBLPTR selects which

byte of the program memory location to

access.

TBLPTR[0] = 0: Least Significant Byte

of Program Memory

Word

TBLPTR[0] = 1: Most Significant Byte

of Program Memory

Word

The TBLWT instruction can modify the

value of TBLPTR as follows:

• no change

• post-increment

• post-decrement

• pre-increment

TBLWT Table Write (Continued)

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

(Read

TABLAT)

operation

(Write to

Holding

Example 1: TBLWT *+;

Before Instruction

TABLAT = 0x55

TBLPTR = 0x00A356

HOLDING REGISTER

(0x00A356) = 0xFF

After Instructions (table write completion)

TABLAT = 0x55

TBLPTR = 0x00A357

HOLDING REGISTER

(0x00A356) = 0x55

Example 2: TBLWT +*;

Before Instruction

TABLAT = 0x34

TBLPTR = 0x01389A

HOLDING REGISTER

(0x01389A) = 0xFF

HOLDING REGISTER

(0x01389B) = 0xFF

After Instruction (table write completion)

TABLAT = 0x34

TBLPTR = 0x01389B

HOLDING REGISTER

(0x01389A) = 0xFF

HOLDING REGISTER

(0x01389B) = 0x34

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TSTFSZ Test f, Skip if 0

Syntax: [ label ] TSTFSZ f [,a]

Operands: 0  f  255

a  [0,1]

Operation: skip if f = 0

Status Affected: None

Encoding: 0110 011a ffff ffff

Description: If ‘f’ = 0, the next instruction, fetched

during the current instruction execution,

is discarded and a NOP is executed,

making this a two-cycle instruction. If ‘a’

is ‘0’, the Access Bank will be selected,

overriding the BSR value. If ‘a’ is ‘1’,

then the bank will be selected as per

the BSR value.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE TSTFSZ CNT

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

If CNT = 0x00,

PC = Address (ZERO)

If CNT 0x00,

PC = Address (NZERO)

XORLW Exclusive OR Literal with W

Syntax: [ label ] XORLW k

Operands: 0 k 255

Operation: (W) .XOR. k W

Status Affected: N, Z

Encoding: 0000 1010 kkkk kkkk

Description: The contents of W are XORed with

the 8-bit literal, ‘k’. The result is placed

in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example: XORLW 0xAF

Before Instruction

W=0xB5

After Instruction

W = 0x1A

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XORWF Exclusive OR W with f

Syntax: [ label ] XORWF f [,d [,a]]

Operands: 0  f  255

d  [0,1]

a  [0,1]

Operation: (W) .XOR. (f) dest

Status Affected: N, Z

Encoding: 0001 10da ffff ffff

Description: Exclusive OR the contents of W with

stored in W. If ‘d’ is ‘1’, the result is

stored back in the register, ‘f’. If ‘a’ is

‘0’, the Access Bank will be selected,

overriding the BSR value. If ‘a’ is ‘1’,

then the bank will be selected as per

the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: XORWF REG

Before Instruction

REG = 0xAF

W=0xB5

After Instruction

REG = 0x1A

W=0xB5

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25.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers and dsPIC® digital signal

controllers are supported with a full range of software

and hardware development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Various Device

Families

- HI-TECH C for Various Device Families

- MPASMTM Assembler

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

- MPLAB ICD 3

- PICkit™ 3 Debug Express

• Device Programmers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

• Low-Cost Demonstration/Development Boards,

Evaluation Kits, and Starter Kits

25.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- In-Circuit Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Extensive on-line help

• Integration of select third party tools, such as

IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either C or assembly)

• One-touch compile or assemble, and download to

emulator and simulator tools (automatically

updates all project information)

• Debug using:

- Source files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

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DS39616D-page 326  2010 Microchip Technology Inc.

25.2 MPLAB C Compilers for Various

Device Families

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

25.3 HI-TECH C for Various Device

Families

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontrollers and the dsPIC family of digital

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker, pre-

processor, and one-step driver, and can run on multiple

platforms.

25.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker, Intel® standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

25.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

25.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

• MPLAB IDE compatibility

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25.7 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The soft-

ware simulator offers the flexibility to develop and

debug code outside of the hardware laboratory envi-

ronment, making it an excellent, economical software

development tool.

25.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC® Flash MCUs and dsPIC® Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The emulator is connected to the design engineer’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The emulator is field upgradable through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers

significant advantages over competitive emulators

including low-cost, full-speed emulation, run-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

25.9 MPLAB ICD 3 In-Circuit Debugger

System

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip’s most cost effective high-speed hardware

debugger/programmer for Microchip Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

devices. It debugs and programs PIC® Flash micro-

controllers and dsPIC® DSCs with the powerful, yet

easy-to-use graphical user interface of MPLAB

Integrated Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nected to the design engineer’s PC using a high-speed

USB 2.0 interface and is connected to the target with a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 supports all

MPLAB ICD 2 headers.

25.10 PICkit 3 In-Circuit Debugger/

Programmer and

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and program-

ming of PIC® and dsPIC® Flash microcontrollers at a

most affordable price point using the powerful graphical

user interface of the MPLAB Integrated Development

Environment (IDE). The MPLAB PICkit 3 is connected

to the design engineer’s PC using a full speed USB

interface and can be connected to the target via an

Microchip debug (RJ-11) connector (compatible with

MPLAB ICD 3 and MPLAB REAL ICE). The connector

uses two device I/O pins and the Reset line to imple-

ment in-circuit debugging and In-Circuit Serial Pro-

gramming™.

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

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DS39616D-page 328  2010 Microchip Technology Inc.

25.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

The PICkit™ 2 Development Programmer/Debugger is

a low-cost development tool with an easy to use inter-

face for programming and debugging Microchip’s Flash

families of microcontrollers. The full featured

Windows® programming interface supports baseline

(PIC10F, PIC12F5xx, PIC16F5xx), midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit

microcontrollers, and many Microchip Serial EEPROM

products. With Microchip’s powerful MPLAB Integrated

Development Environment (IDE) the PICkit™ 2

enables in-circuit debugging on most PIC® microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the application. When halted at a break-

point, the file registers can be examined and modified.

The PICkit 2 Debug Express include the PICkit 2, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

25.12 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an MMC card for file

storage and data applications.

25.13 Demonstration/Development

Boards, Evaluation Kits, and

Starter Kits

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Also available are starter kits that contain everything

needed to experience the specified device. This usually

includes a single application and debug capability, all

on one board.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

 2010 Microchip Technology Inc. DS39616D-page 329

PIC18F2331/2431/4331/4431

26.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-55°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4) ......................................... -0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V

Voltage on MCLR with respect to VSS (Note 2)......................................................................................... 0V to +13.25V

Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +8.5V

Total power dissipation (Note 1) ...............................................................................................................................1.0W

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin ..............................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA

Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin ....................................................................................................25 mA

Maximum current sunk byall ports .......................................................................................................................200 mA

Maximum current sourced by all ports ..................................................................................................................200 mA

Note 1: Power dissipation is calculated as follows:

Pdis = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOL x IOL)

2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.

Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin, rather

than pulling this pin directly to VSS.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

PIC18F2331/2431/4331/4431

DS39616D-page 330  2010 Microchip Technology Inc.

FIGURE 26-1: PIC18F233 1/2 43 1/4 331 /4 431 VOLTA GE- FREQU ENC Y G RAPH ( I NDUS TR IA L )

FIGURE 26 - 2: PIC1 8LF 2331/ 243 1/4 33 1/4 431 VOLTAG E-F REQUENC Y GR APH (I ND USTR IA L)

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18F2X31/4X31

4.2V

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18LF2X31/4X31

FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz

Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application.

4 MHz

4.2V

 2010 Microchip Technology Inc. DS39616D-page 331

PIC18F2331/2431/4331/4431

26.1 DC Characteristics: Supply Voltage

PIC18F2331/2431/ 4331/4431 (Industrial, Exte nded)

PIC18LF2331/2431/ 4331/4431 (Industrial)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

D001 VDD Supply Voltage

PIC18LF2X31/4X31 2.0 — 5.5 V

PIC18F2X31/4X31 4.2 —5.5 V

D001C AVDD Analog Supply Voltage VDD – 0.3 — VDD + 0.3 V

D001D AVSS Anal og Gr ound Vo ltage VSS – 0.3 — VSS + 0.3 V

D002 VDR RAM Data Retention

Voltage(1) 1.5 — — V

D003 VPOR VDD Start Voltage

to Ensure Internal

Power-on Reset Signal

— — 0.7 V See section on Power-on Reset for details

D004 SVDD VDD Rise Rate

to Ensure Internal

Power-on Reset Signal

0.05 — — V/ms See section on Power-on Reset for details

D005A VBOR Brown-out Reset Volta ge

PIC18LF2X31/4X31 Industrial Low Voltage (-10C to +85C)

BORV<1:0> = 11 N/A N/A N/A V Reserved

BORV<1:0> = 10 2.50 2.72 2.94 V

BORV<1:0> = 01 3.88 4.22 4.56 V

BORV<1:0> = 00 4.18 4.54 4.90 V

D005B PIC18LF2X31/4X31 Industrial Low Voltage (-40C to -10C)

BORV<1:0> = 11 N/A N/A N/A V Reserved

BORV<1:0>= 10 2.34 2.72 3.10 V

BORV<1:0> = 01 3.63 4.22 4.81 V

BORV<1:0> = 00 3.90 4.54 5.18 V

D005C PIC18F2X31/4X31 Industrial (-10C to +85C)

BORV<1:0>= 1x N/A N/A N/A VReserved

BORV<1:0> = 01 3.88 4.22 4.56 V(Note 2)

BORV<1:0> = 00 4.18 4.54 4.90 V(Note 2)

D005D PIC18F2X31/4X31 Industrial (-40C to -10C)

BORV<1:0>= 1x N/A N/A N/A VReserved

BORV<1:0> = 01 N/A N/A N/A VReserved

BORV<1:0> = 00 3.90 4.54 5.18 V(Note 2)

D005E PIC18F2X31/4X31 Extended (-10C to +85C)

BORV<1:0> = 1x N/A N/A N/A VReserved

BORV<1:0> = 01 3.88 4.22 4.56 V(Note 2)

BORV<1:0> = 00 4.18 4.54 4.90 V(Note 2)

D005F PIC18F2X31/4X31 Extended (-40C to -10C, +85C to +125C)

BORV<1:0> = 1x N/A N/A N/A VReserved

BORV<1:0> = 01 N/A N/A N/A VReserved

BORV<1:0> = 00 3.90 4.54 5.18 V(Note 2)

Legend: Shading of rows is to assist in readability of the table.

Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.

2: When BOR is on and BORV<1:0> = 0x, the device will operate correctly at 40 MHz for any VDD at which the BOR allows

execution.

PIC18F2331/2431/4331/4431

DS39616D-page 332  2010 Microchip Technology Inc.

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/4331/4431 (Industrial)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Power-Down Current (IPD)(1)

PIC18LF2X31/4X31 0.1 0.5 A -40°C VDD = 2.0V

(Sleep mode)

0.1 0.5 A +25°C

0.2 1.9 A +85°C

PIC18LF2X31/4X31 0.1 0.5 A -40°C VDD = 3.0V

(Sleep mode)

0.1 0.5 A +25°C

0.3 1.9 A +85°C

All devices 0.1 2.0 A -40°C

VDD = 5.0V

(Sleep mode)

0.1 2.0 A +25°C

0.4 6.5 A +85°C

533A +125°C

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

 2010 Microchip Technology Inc. DS39616D-page 333

PIC18F2331/2431/4331/4431

Supply Current (IDD)(2,3)

PIC18LF2X31/4X31 8 40 A -40°C

VDD = 2.0V

FOSC = 31 kHz

(RC_RUN mode,

Internal oscillator source)

940A+25°C

11 40 A+85°C

PIC18LF2X31/4X31 25 68 A -40°C

25 68 A+25°C V

DD = 3.0V

20 68 A+85°C

All devices 55 180 A -40°C

VDD = 5.0V

55 180 A+25°C

50 180 A+85°C

0.25 1 mA +125°C

PIC18LF2X31/4X31 140 220 A -40°C

VDD = 2.0V

FOSC = 1 MHz

(RC_RUN mode,

Internal oscillator source)

145 220 A+25°C

155 220 A+85°C

PIC18LF2X31/4X31 215 330 A -40°C

VDD = 3.0V225 330 A+25°C

235 330 A+85°C

All devices 385 550 A -40°C

VDD = 5.0V

390 550 A+25°C

405 550 A+85°C

0.7 2.8 mA +125°C

PIC18LF2X31/4X31 410 600 A -40°C

VDD = 2.0V

FOSC = 4 MHz

(RC_RUN mode,

Internal oscillator source)

425 600 A+25°C

435 600 A+85°C

PIC18LF2X31/4X31 650 900 A -40°C

VDD = 3.0V670 900 A+25°C

680 900 A+85°C

All devices 1.2 1.8 mA -40°C

VDD = 5.0V

1.2 1.8 mA +25°C

1.2 1.8 mA +85°C

2.2 6 mA +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/ 4331/4431 (Industrial) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2331/2431/4331/4431

DS39616D-page 334  2010 Microchip Technology Inc.

Supply Current (IDD)(2,3)

PIC18LF2X31/4X31 4.7 8 A -40°C

VDD = 2.0V

FOSC = 31 KHz

(RC_IDLE mode,

Internal oscillator source)

5.0 8 A+25°C

5.8 11 A+85°C

PIC18LF2X31/4X31 7.0 11 A -40°C

VDD = 3.0V7.8 11 A+25°C

8.7 15 A+85°C

All devices 12 16 A -40°C

VDD = 5.0V

14 16 A+25°C

14 22 A+85°C

200 850 A +125°C

PIC18LF2X31/4X31 75 150 A -40°C

VDD = 2.0V

FOSC = 1 MHz

(RC_IDLE mode,

Internal oscillator source)

85 150 A+25°C

95 150 A+85°C

PIC18LF2X31/4X31 110 180 A -40°C

VDD = 3.0V125 180 A+25°C

135 180 A+85°C

All devices 180 300 A -40°C

VDD = 5.0V

195 300 A+25°C

200 300 A+85°C

300 750 A +125°C

PIC18LF2X31/4X31 175 275 A -40°C

VDD = 2.0V

FOSC = 4 MHz

(RC_IDLE mode,

Internal oscillator source)

185 275 A+25°C

195 275 A+85°C

PIC18LF2X31/4X31 265 375 A -40°C

VDD = 3.0V280 375 A+25°C

300 375 A+85°C

All devices 475 800 A -40°C

VDD = 5.0V

500 800 A+25°C

505 800 A+85°C

0.7 1.6 mA +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/4331/4431 (Industria l) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

 2010 Microchip Technology Inc. DS39616D-page 335

PIC18F2331/2431/4331/4431

Supply Current (IDD)(2,3)

PIC18LF2X31/4X31 150 250 A -40°C

VDD = 2.0V

FOSC = 1 MHZ

(PRI_RUN,

EC oscillator)

150 250 A+25°C

160 250 A+85°C

PIC18LF2X31/4X31 340 350 A -40°C

VDD = 3.0V300 350 A+25°C

280 350 A+85°C

All devices 0.72 1.0 mA -40°C

VDD = 5.0V

0.63 1.0 mA +25°C

0.57 1.0 mA +85°C

0.9 2.1 mA +125°C

PIC18LF2X31/4X31 440 600 A -40°C

VDD = 2.0V

FOSC = 4 MHz

(PRI_RUN,

EC oscillator)

450 600 A+25°C

460 600 A+85°C

PIC18LF2X31/4X31 0.80 1.0 mA -40°C

VDD = 3.0V0.78 1.0 mA +25°C

0.77 1.0 mA +85°C

All devices 1.6 2.0 mA -40°C

VDD = 5.0V

1.5 2.0 mA +25°C

1.5 2.0 mA +85°C

2.0 4.2 mA +125°C

All devices

10 28 mA +125°C VDD = 5.0V

FOSC = 25 MHz

(PRI_RUN,

EC oscillator)

All devices 9.5 12 mA -40°C

VDD = 4.2V

FOSC = 40 MHZ

(PRI_RUN,

EC oscillator)

9.7 12 mA +25°C

9.9 12 mA +85°C

All devices 11.9 15 mA -40°C

VDD = 5.0V12.1 15 mA +25°C

12.3 15 mA +85°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/ 4331/4431 (Industrial) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2331/2431/4331/4431

DS39616D-page 336  2010 Microchip Technology Inc.

Supply Current (IDD)(2,3)

PIC18LF2X31/4X31 35 50 A -40°C

FOSC = 1 MHz

(PRI_IDLE mode,

EC oscillator)

35 50 A+25°C V

DD = 2.0V

35 60 A+85°C

PIC18LF2X31/4X31 55 80 A -40°C

50 80 A+25°C V

DD = 3.0V

60 100 A+85°C

All devices 105 150 A -40°C

VDD = 5.0V

110 150 A+25°C

115 150 A+85°C

300 400 A +125°C

PIC18LF2X31/4X31 135 180 A -40°C

FOSC = 4 MHz

(PRI_IDLE mode,

EC oscillator)

140 180 A+25°C V

DD = 2.0V

140 180 A+85°C

PIC18LF2X31/4X31 215 280 A -40°C

225 280 A+25°C V

DD = 3.0V

230 280 A+85°C

All devices 410 525 A -40°C

VDD = 5.0V

420 525 A+25°C

430 525 A+85°C

1.2 1.7 mA +125°C

All devices

18 22 mA +125°C VDD = 5.0V

FOSC = 25 MHz

(PRI_IDLE mode,

EC oscillator)

All devices 3.2 4.1 mA -40°C

FOSC = 40 MHz

(PRI_IDLE mode,

EC oscillator)

3.2 4.1 mA +25°C VDD = 4.2 V

3.3 4.1 mA +85°C

All devices 4.0 5.1 mA -40°C

4.1 5.1 mA +25°C VDD = 5.0V

4.1 5.1 mA +85°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/4331/4431 (Industria l) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

 2010 Microchip Technology Inc. DS39616D-page 337

PIC18F2331/2431/4331/4431

Supply Current (IDD)(2,3)

PIC18LF2X31/4X31 5.1 9 A -10°C

VDD = 2.0V

FOSC = 32 kHz(4)

(SEC_RUN mode,

Timer1 as clock)

5.8 9 A+25°C

7.9 11 A+70°C

PIC18LF2X31/4X31 7.9 12 A -10°C

VDD = 3.0V8.9 12 A+25°C

10.5 14 A+70°C

All devices 12.5 20 A -10°C

VDD = 5.0V

16.3 20 A+25°C

18.9 25 A+70°C

150 850 A +125°C

PIC18LF2X31/4X31 9.2 15 A -10°C

VDD = 2.0V

FOSC = 32 kHz(4)

(SEC_IDLE mode,

Timer1 as clock)

9.6 15 A+25°C

12.7 18 A+70°C

PIC18LF2X31/4X31 22.0 30 A -10°C

VDD = 3.0V21.0 30 A+25°C

20.0 35 A+70°C

All devices 30 80 A -10°C

VDD = 5.0V

45 80 A+25°C

45 85 A+70°C

250 850 A +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/ 4331/4431 (Industrial) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2331/2431/4331/4431

DS39616D-page 338  2010 Microchip Technology Inc.

Module Differential Currents (IWDT, IBOR, ILVD, IOSCB, IAD)

D022

(IWDT)

Wa tchdog Timer 1.5 4.0 A -40°C

2.2 4.0 A+25°C V

DD = 2.0V

3.1 5.0 A+85°C

2.5 6.0 A -40°C

3.3 6.0 A+25°C V

DD = 3.0V

4.7 7.0 A+85°C

3.7 10.0 A -40°C

VDD = 5.0V

4.5 10.0 A+25°C

6.1 13.0 A+85°C

22 44 A +125°C

D022A

(IBOR)

Brown-out Reset 19 35.0 A-40C to +85CV

DD = 3.0V

24 45.0 A-40C to +85CVDD = 5.0V

40 75 A +125°C

D022B

(ILVD)

Low-Voltage Detect 8.5 25.0 A-40C to +85CV

DD = 2.0V

16 35.0 A-40C to +85CV

DD = 3.0V

20 45.0 A-40C to +85CVDD = 5.0V

35 66 A +125°C

D025

(IOSCB)

Timer1 Oscillator 1.7 3.5 A-40C

1.8 3.5 A+25°C V

DD = 2.0V 32 kHz on Timer1(4)

2.1 4.5 A+85°C

2.2 4.5 A-40C

2.6 4.5 A+25°C V

DD = 3.0V 32 kHz on Timer1(4)

2.8 5.5 A+85°C

3.0 6.0 A-40C

VDD = 5.0V 32 kHz on Timer1(4)

3.3 6.0 A+25°C

3.6 7.0 A+85°C

42 70 A +125°C

D026

(IAD)

A/D Converter 1.0 3.0 A-40C to +85CV

DD = 2.0V

A/D on, not converting

1.0 4.0 A-40C to +85CV

DD = 3.0V

2.0 10.0 A-40C to +85CVDD = 5.0V

150 950 A +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2331/2431/ 4331/4431 (Industrial, Extended)

PIC18LF2331/2431/4331/4431 (Industria l) (Continued)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stat ed)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula: Ir = VDD/2REXT (mA) with REXT in k.

4: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

 2010 Microchip Technology Inc. DS39616D-page 339

PIC18F2331/2431/4331/4431

26.3 DC Characteristics: PIC18F2331/2431/4331/4431 (I ndustrial, Extended)

PIC18LF2331/2431/ 4331/4431 (Industrial)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C TA  +85°C for industrial

-40°C T

A  +125°C for extended

Param

No. Symbol Characteristic Min Max Units Conditions

VIL Input Low Volta ge

I/O Ports:

D030 with TTL Buffer VSS 0.15 VDD VVDD < 4.5V

D030A — 0.8 V 4.5V  VDD 5.5V

D031 with Schmitt Trigger Buffer

RC3 and RC4

VSS

0.2 VDD

0.3 VDD

2C™ enabled

D032 MCLR VSS 0.2 VDD V

D032A OSC1 and T1OSI VSS 0.3 VDD V LP, XT, HS, HSPLL

modes(1)

D033 OSC1 VSS 0.2 VDD VEC mode

(1)

VIH Input High Volt age

I/O Ports:

D040 with TTL Buffer 0.25 VDD + 0.8V VDD VVDD < 4.5V

D040A 2.0 VDD V4.5V  VDD 5.5V

D041 with Schmitt Trigger Buffer

RC3 and RC4

0.8 VDD

0.7 VDD

VDD

2C™ enabled

D042 MCLR 0.8 VDD VDD V

D042A OSC1 and T1OSI 0.7 VDD VDD V LP, XT, HS, HSPLL

modes(1)

D043 OSC1 0.8 VDD VDD VEC mode

(1)

IIL Input Leakage Current (2,3)

D060 I/O Ports — +200 nA AV

DD < 5.5V,

VSS VPIN VDD,

Pin at high-impedance

— +50 nA VDD < 3V,

VSS VPIN VDD,

Pin at high-impedance

D061 MCLR —1AVss VPIN VDD

D063 OSC1 — 1AVss VPIN VDD

IPU Weak Pull-up Current

D070 IPURB PORTB Weak Pull-up Current 50 400 AVDD = 5V, VPIN = VSS

Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the

PIC® device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

PIC18F2331/2431/4331/4431

DS39616D-page 340  2010 Microchip Technology Inc.

VOL Output Low Voltage

D080 I/O Ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V,

-40C to +85C

D083 OSC2/CLKO

(RC, RCIO, EC, ECIO modes)

—0.6VI

OL = 1.6 mA, VDD = 4.5V,

-40C to +85C

VOH Output High Voltage(3)

D090 I/O Ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V,

-40C to +85C

D092 OSC2/CLKO

(RC, RCIO, EC, ECIO modes)

VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V,

-40C to +85C

Capacitive Loading Specs

on Output Pins

D100 COSC2 OSC2 Pin —15 pF In XT, HS and LP modes

when external clock is

used to drive OSC1

D101 CIO All I/O Pins and OSC2

(in RC mode)

— 50 pF To meet the AC Timing

Specifications

D102 CBSCL, SDA — 400 pF I2C™ Specification

26.3 DC Characteristics: PIC18F2331/2431/4331/4431 (I ndustrial, Extended)

PIC18LF2331/2431/ 4331/4431 (Industrial) ( Con tinued)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C TA  +85°C for industrial

-40°C T

A  +125°C for extended

Param

No. Symbol Characteristic Min Max Units Conditions

Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the

PIC® device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

 2010 Microchip Technology Inc. DS39616D-page 341

PIC18F2331/2431/4331/4431

TABLE 26-1: MEMORY PROGRAMMING REQUIREMENTS

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C T

A  +125°C for extended

Param

No. Sym Characteristic Min Typ† Max Units Conditions

Internal Program Memory

Programming Specifications(1)

D110 VPP Voltage on MCLR/VPP pin 9.00 — 13.25 V (Note 3)

D112 IPP Current into MCLR/VPP pin — — 300 A

D113 IDDP Supply Current during

Programming

—— 1mA

Data EEPROM Memory

D120 EDByte Endurance 100K 1M —E/W -40C to +85C

D121 VDRW VDD for Read/Write VMIN —5.5 V Using EECON to read/write

VMIN = Minimum operating

voltage

D122 TDEW Erase/Write Cycle Time —4—ms

D123 TRETD Characteristic Retention 40 — —Year Provided no other

specifications are violated

D124 TREF Number of Total Erase/Write

Cycles before Refresh(2) 1M 10M —E/W -40°C to +85°C

Program Flash Memory

D130 EPCell Endurance 10K 100K —E/W -40C to +85C

D131 VPR VDD for Read VMIN —5.5 V VMIN = Minimum operating

voltage

D132 VIE VDD for Block Erase 4.5 —5.5 V Using ICSP™ port

D132A VIW VDD for Externally Timed Erase

or Write

4.5 —5.5 V Using ICSP port

D132B VPEW VDD for Self-Timed Write VMIN —5.5 V VMIN = Minimum operating

voltage

D133 TIE ICSP™ Block Erase Cycle Time — 4 — ms VDD > 4.5V

D133A TIW ICSP Erase or Write Cycle Time

(externally timed)

1——msVDD > 4.5V

D133A TIW Self-Timed Write Cycle Time — 2 — ms

D134 TRETD Characteristic Retention 40 100 — Year Provided no other

specifications are violated

† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: These specifications are for programming the on-chip program memory through the use of table write

instructions.

2: Refer to Section 7.9 “Using the Data EEPROM” for a more detailed discussion on data EEPROM

endurance.

3: Required only if Single-Supply Programming is disabled.

PIC18F2331/2431/4331/4431

DS39616D-page 342  2010 Microchip Technology Inc.

FIGURE 26-3: LOW-VOLT AGE DETECT CHARACTERISTICS

VLVD

LVDIF

VDD

(LVDIF set by hardware)

(LVDIF can be

cleared in software)

TABLE 26-2: LOW-VOLTAGE DETECT CHARACTERISTICS

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Condi tions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Symbol Characteristic Min Typ† Max Units Conditions

D420A VLVD LVD Voltage on VDD Transition High-to-Low Industrial Low Voltage (-10°C to +85°C)

PIC18LF2X31/4X31 LVDL<3:0> = 0000 N/A N/A N/A V Reserved

LVDL<3:0> = 0001 N/A N/A N/A V Reserved

LVDL<3:0> = 0010 2.08 2.26 2.44 V

LVDL<3:0> = 0011 2.26 2.45 2.65 V

LVDL<3:0> = 0100 2.35 2.55 2.76 V

LVDL<3:0> = 0101 2.55 2.77 2.99 V

LVDL<3:0> = 0110 2.64 2.87 3.10 V

LVDL<3:0> = 0111 2.82 3.07 3.31 V

LVDL<3:0> = 1000 3.09 3.36 3.63 V

LVDL<3:0> = 1001 3.29 3.57 3.86 V

LVDL<3:0> = 1010 3.38 3.67 3.96 V

LVDL<3:0> = 1011 3.56 3.87 4.18 V

LVDL<3:0> = 1100 3.75 4.07 4.40 V

LVDL<3:0> = 1101 3.93 4.28 4.62 V

LVDL<3:0> = 1110 4.23 4.60 4.96 V

Legend: Shading of rows is to assist in readability of the table.

† Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.

 2010 Microchip Technology Inc. DS39616D-page 343

PIC18F2331/2431/4331/4431

D420B VLVD LVD Voltage on VDD Transition High-to-Low Industrial Low Voltage (-40°C to -10°C)

PIC18LF2X31/4X31 LVDL<3:0> = 0000 N/A N/A N/A V Reserved

LVDL<3:0> = 0001 N/A N/A N/A V Reserved

LVDL<3:0> = 0010 1.99 2.26 2.53 V

LVDL<3:0> = 0011 2.16 2.45 2.75 V

LVDL<3:0> = 0100 2.25 2.55 2.86 V

LVDL<3:0> = 0101 2.43 2.77 3.10 V

LVDL<3:0> = 0110 2.53 2.87 3.21 V

LVDL<3:0> = 0111 2.70 3.07 3.43 V

LVDL<3:0> = 1000 2.96 3.36 3.77 V

LVDL<3:0> = 1001 3.14 3.57 4.00 V

LVDL<3:0> = 1010 3.23 3.67 4.11 V

LVDL<3:0> = 1011 3.41 3.87 4.34 V

LVDL<3:0> = 1100 3.58 4.07 4.56 V

LVDL<3:0> = 1101 3.76 4.28 4.79 V

LVDL<3:0> = 1110 4.04 4.60 5.15 V

D420C VLVD LVD Voltage on VDD Transition High-to-Low Industrial (-10°C to +85°C)

PIC18F2X31/4X31 LVDL<3:0> = 1101 3.93 4.28 4.62 V

LVDL<3:0> = 1110 4.23 4.60 4.96 V

D420D VLVD LVD Voltage on VDD Transition High-to-Low Industrial (-40°C to -10°C)

PIC18F2X31/4X31 LVDL<3:0> = 1101 3.76 4.28 4.79 VReserved

LVDL<3:0> = 1110 4.04 4.60 5.15 V

D420E VLVD LVD Voltage on VDD Transition High-to-Low Extended (-10°C to +85°C)

PIC18F2X31/4X31 LVDL<3:0> = 1101 3.94 4.28 4.62 V

LVDL<3:0> = 1110 4.23 4.60 4.96 V

D420F VLVD LVD Voltage on VDD Transition High-to-Low Extended (-40°C to -10°C, +85°C to +125°C)

PIC18F2X31/4X31 LVDL<3:0> = 1101 3.77 4.28 4.79 VReserved

LVDL<3:0> = 1110 4.05 4.60 5.15 V

TABLE 26-2: LOW-VOLTAGE DETECT CHARACTERISTICS (CONTINUED)

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial, Extended)

Standard Operating Condi tions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Symbol Characteristic Min Typ† Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

† Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.

PIC18F2331/2431/4331/4431

DS39616D-page 344  2010 Microchip Technology Inc.

26.4 AC (Timing) Characteristi cs

26.4.1 TIMING PARAMETER SYMBOLOGY

The timing parameter symbols have been created

following one of the following formats:

1. TppS2ppS 3. TCC:ST (I2C specifications only)

2. TppS 4. Ts (I2C specifications only)

F Frequency T Time

Lowercase letters (pp) and their meanings:

cc CCP1 osc OSC1

ck CLKO rd RD

cs CS rw RD or WR

di SDI sc SCK

do SDO ss SS

dt Data in t0 T0CKI

io I/O port t1 T1CKI

mc MCLR wr WR

Uppercase letters and their meanings:

F Fall P Period

HHigh RRise

I Invalid (High-Impedance) V Valid

L Low Z High-Impedance

I2C only

AA output access High High

BUF Bus free Low Low

CC:ST (I2C specifications only)

HD Hold SU Setup

DAT DATA input hold STO Stop condition

STA Start condition

 2010 Microchip Technology Inc. DS39616D-page 345

PIC18F2331/2431/4331/4431

26.4.2 TIMING CONDITIONS

The temperature and voltages specified in Tabl e 2 6-3

apply to all timing specifications unless otherwise

noted. Figure 26-4 specifies the load conditions for the

timing specifications.

TABLE 26-3: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGU RE 26-4: LOAD C OND IT I O NS FO R D E VI CE TIMIN G SPEC IFIC AT I ONS

Note: Because of space limitations, the generic

terms “PIC18FXX31” and “PIC18LFXX31”

are used throughout this section to refer to

the PIC18F2331/2431/4331/4431 and

PIC18LF2331/2431/4331/4431 families of

devices specifically, and only those

devices.

AC CHARACTERISTICS

Standard Opera ting Conditions (unless otherwise stated)

Operating temperature -40°C  TA +85°C for industrial

-40°C  TA +125°C for extended

Operating voltage VDD range as described in DC spec Section 26.1 and

Section 26.3. LF parts operate for industrial temperatures only.

VDD/2

VSS

RL=464

CL= 50 pF for all pins except OSC2/CLKO

and including D and E outputs as ports

Load Condition 1 Load Condition 2

PIC18F2331/2431/4331/4431

DS39616D-page 346  2010 Microchip Technology Inc.

26.4.3 TIMING DIAGRAMS AND SPECIFICATIONS

FIGURE 26-5: EXTERNAL CLOCK T IMI NG (ALL MODES EX CEPT PLL)

TABLE 26-4: EXTERNAL CLOCK TIMING REQUIREMENTS

Param.

No. Symbol Characteristic Min Max Units Conditions

1A FOSC External CLKI Frequency(1) DC 40 MHz EC, ECIO

Oscillator Frequency(1) DC 4 MHz RC osc

0.1 4 MHz XT osc

4 25 MHz HS osc

4 10 MHz HS + PLL osc

5 200 kHz LP Osc mode

OSC External CLKI Period(1) 25 — ns EC, ECIO

Oscillator Period(1) 250 — ns RC osc

250 10,000 ns XT osc

100

250

HS osc

HS + PLL osc

25 — sLP osc

CY Instruction Cycle Time(1) 100 — ns TCY = 4/FOSC

3 TosL,

To s H

External Clock in (OSC1)

High or Low Time

30 — ns XT osc

2.5 — sLP osc

10 — ns HS osc

4TosR,

To s F

External Clock in (OSC1)

Rise or Fall Time

— 20 ns XT osc

— 50 ns LP osc

—7.5nsHS osc

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations

except PLL. All specified values are based on characterization data for that particular oscillator type under

standard operating conditions with the device executing code. Exceeding these specified limits may result

in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested

to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock

input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.

OSC1

CLKO

Q4 Q1 Q2 Q3 Q4 Q1

3344

 2010 Microchip Technology Inc. DS39616D-page 347

PIC18F2331/2431/4331/4431

TABLE 26-5: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V)

Param

No. Sym Characteristic Min Typ† Max Units Conditions

F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS mode only

F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HS mode only

F12 TPLL PLL Start-up Time (Lock Time) — — 2 ms

F13 CLK CLKO Stability (Jitter) -2 — +2 %

† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only

and are not tested.

TABLE 26-6: INTERNAL RC ACCURACY

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Device Min Typ Max Units Conditions

INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1)

F2 PIC18LF2331/2431/4331/4431 -15 +/-5 +15 % 25°C VDD = 3.0V

F3 All devices -15 +/-5 +15 % 25°C VDD = 5.0V

INTRC Accuracy @ Freq = 31 kHz(2)

F5 PIC18LF2331/2431/4331/4431 26.562 — 35.938 kHz 25°C VDD = 3.0V

F6 All devices 26.562 — 35.938 kHz 25°C VDD = 5.0V

Legend: Shading of rows is to assist in readability of the table.

Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.

2: INTRC frequency after calibration.

PIC18F2331/2431/4331/4431

DS39616D-page 348  2010 Microchip Technology Inc.

FIGURE 26-6: CLKO AND I/ O T I MIN G

TABLE 26-7: CLKO AND I/O TIMING REQUIREMENTS

Param

No. Symbol Characteristic Min Typ† Max Units Conditions

10 TosH2ckL OSC1  to CLKO  — 75 200 ns (Note 1)

11 TosH2ckH OSC1  to CLKO  — 75 200 ns (Note 1)

12 TckR CLKO Rise Time — 35 100 ns (Note 1)

13 TckF CLKO Fall Time — 35 100 ns (Note 1)

14 TckL2ioV CLKO  to Port Out Valid — — 0.5 T

CY + 20 ns (Note 1)

15 TioV2ckH Port In Valid before CLKO  0.25 T

CY + 25 — — ns (Note 1)

16 TckH2ioI Port In Hold after CLKO  0——ns(Note 1)

17 TosH2ioV OSC1  (Q1 cycle) to Port Out Valid — 50 150 ns

18 TosH2ioI OSC1  (Q2 cycle) to

Port Input Invalid

(I/O in hold time)

PIC18FXX31 100 — — ns

18A PIC18LFXX31 200 — — ns

19 TioV2osH Port Input Valid to OSC1 (I/O in setup

time)

0——ns

20 TioR Port Output Rise Time PIC18FXX31 — 10 25 ns

20A PIC18LFXX31 — — 60 ns

21 TioF Port Output Fall Time PIC18FXX31 — 10 25 ns

21A PIC18LFXX31 — — 60 ns

22† TINP INTx Pin High or Low Time TCY ——ns

23† TRBP RB<7:4> Change INTx High or Low Time TCY ——ns

† These parameters are asynchronous events not related to any internal clock edges.

Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.

OSC1

CLKO

I/O Pin

(Input)

I/O Pin

(Output)

Q4 Q1 Q2 Q3

13 14

20, 21

19 18

Old Value New Value

 2010 Microchip Technology Inc. DS39616D-page 349

PIC18F2331/2431/4331/4431

FIGURE 26-7: RESET, WATCHDOG TI MER, OSCILLATOR S TART-UP T IMER AND POWER -UP

TI MER TIMIN G

FIGURE 26-8: BROWN-OUT RESET T IMIN G

VDD

MCLR

Internal

POR

PWRT

Time-out

Oscillator

Time-out

Internal

Reset

Watchdog

Timer Reset

I/O Pins

VDD BVDD

35 VBGAP = 1.2V

VIRVST

Enable Internal

Internal Reference

Reference Voltage

Voltage Stable

(nominal)

PIC18F2331/2431/4331/4431

DS39616D-page 350  2010 Microchip Technology Inc.

TABLE 26-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET REQUIREMENTS

Param.

No. Symbol Characteristic Min Typ Max Units Conditions

30 TMCL MCLR Pulse Width (low) 2 — — s

31 TWDT Watchdog Timer Time-out Period

(no postscaler)

—4.00—ms

32 TOST Oscillation Start-up Timer Period 1024 TOSC — 1024 TOSC —TOSC = OSC1 period

33 TPWRT Power-up Timer Period — 65.5 —ms

34 TIOZ I/O High-impedance from MCLR

Low or Watchdog Timer Reset

—2—s

35 TBOR Brown-out Reset Pulse Width 200 — — sVDD  BVDD (see D005)

36 TIRVST Time for Internal Reference

Voltage to become Stable

—2050 s

37 TLVD Low-Voltage Detect Pulse Width 200 — — sVDD  VLVD

38 TCSD CPU Start-up Time — 10 — s

39 TIOBST Time for INTOSC to Stabilize — 1 — ms

 2010 Microchip Technology Inc. DS39616D-page 351

PIC18F2331/2431/4331/4431

FIGU RE 26-9: TI ME R 0 AN D T I ME R1 E XTERNAL C L OCK TIMI NGS

TABLE 26-9: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS

Param

No. Symbol Characteristic Min Max Units Conditions

40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 — ns VDD = 2V

With prescaler 10 — ns

41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

42 Tt0P T0CKI Period No prescaler T

CY + 10 — ns

With prescaler Greater of:

20 ns or TCY + 40

— ns N = prescale value

(1, 2, 4,..., 256)

45 Tt1H T1CKI High

Time

Synchronous, no prescaler 0.5 T

CY + 20 — ns

Synchronous,

with prescaler

PIC18FXX31 10 — ns

PIC18LFXX31 25 — ns

Asynchronous PIC18FXX31 30 — ns

PIC18LFXX31 50 — ns

46 Tt1L T1CKI

Low Time

Synchronous, no prescaler 0.5 TCY + 5 — ns

Synchronous,

with prescaler

PIC18FXX31 10 — ns

PIC18LFXX31 25 — ns

Asynchronous PIC18FXX31 30 — ns

PIC18LFXX31 50 — ns

47 Tt1P T1CKI Input

Period

Synchronous Greater of:

20 ns or TCY + 40

— ns N = prescale value

(1, 2, 4, 8)

Asynchronous 60 — ns

Ft1 T1CKI Oscillator Input Frequency Range DC 50 kHz

48 Tcke2tmrI Delay from External T1CKI Clock Edge to

Timer Increment

2 TOSC 7 TOSC —

T0CKI

T1OSO/T1CKI

TMR0 or TMR1

PIC18F2331/2431/4331/4431

DS39616D-page 352  2010 Microchip Technology Inc.

FIGURE 26 -10: CAPTURE/COMP AR E/PWM TIMINGS (ALL CCP M ODU LES)

TABLE 26-10: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)

Param

No. Symbol Characteristic Min Max Units Conditions

50 TccL CCPx Input Low

Time

No prescaler 0.5 T

CY + 20 — ns

With

prescaler

PIC18FXX31 10 — ns

PIC18LFXX31 20 — ns

51 TccH CCPx Input High

Time

No prescaler 0.5 T

CY + 20 — ns

With

prescaler

PIC18FXX31 10 — ns

PIC18LFXX31 20 — ns

52 TccP CCPx Input Period 3 TCY + 40

—nsN = prescale

value (1, 4 or 16)

53 TccR CCPx Output Fall Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

54 TccF CCPx Output Fall Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

CCPx

(Capture Mode)

50 51

CCPx

53 54

(Compare or PWM Mode)

 2010 Microchip Technology Inc. DS39616D-page 353

PIC18F2331/2431/4331/4431

FIGURE 26-11: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)

TABLE 26-11: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)

Param

No. Symbol Characteristic Min Max Units Conditions

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 20 — ns

73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge

of Byte 2

1.5 TCY + 40 — ns

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 40 — ns

75 TdoR SDO Data Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

76 TdoF SDO Data Output Fall Time — 25 ns

78 TscR SCK Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

79 TscF SCK Output Fall Time — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after

SCK Edge

PIC18FXX31 — 50 ns

PIC18LFXX31 — 100 ns

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

75, 76

MSb LSb

bit 6 - - - - - -1

MSb In LSb In

bit 6 - - - -1

PIC18F2331/2431/4331/4431

DS39616D-page 354  2010 Microchip Technology Inc.

FIGURE 26-12: EXAMPLE SPI MASTER MODE TIMI NG (CKE = 1)

TABLE 26-12: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)

Param.

No. Symbol Characteristic Min Max Units Conditions

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 20 — ns

73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge

of Byte 2

1.5 TCY + 40 — ns

74 TscH2diL,

Ts c L 2 d i L

Hold Time of SDI Data Input to SCK Edge 40 — ns

75 TdoR SDO Data Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

76 TdoF SDO Data Output Fall Time — 25 ns

78 TscR SCK Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

79 TscF SCK Output Fall Time — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after

SCK Edge

PIC18FXX31 — 50 ns

PIC18LFXX31 — 100 ns

81 TdoV2scH,

TdoV2scL

SDO Data Output Setup to SCK Edge T

CY —ns

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

75, 76

MSb

MSb In

bit 6 - - - - - -1

LSb In

bit 6 - - - -1

LSb

 2010 Microchip Technology Inc. DS39616D-page 355

PIC18F2331/2431/4331/4431

FIGURE 26-13: EXAMPLE SPI SLAVE MOD E TIMING (CK E = 0)

TABLE 26-13: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE, CKE = 0)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

TssL2scL

SS  to SCK  or SCK  Input TCY —ns

71 TscH SCK Input High Time Continuous 1.25 TCY + 30 — ns

71A Single byte 40 — ns (Note 1)

72 TscL SCK Input Low Time Continuous 1.25 TCY + 30 — ns

72A Single byte 40 — ns (Note 1)

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 20 — ns

73A TB2BLast Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 40 — ns

75 TdoR SDO Data Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

76 TdoF SDO Data Output Fall Time — 25 ns

77 TssH2doZ SS  to SDO Output High-Impedance 10 50 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after SCK Edge PIC18FXX31 — 50 ns

PIC18LFXX31 — 100 ns

83 TscH2ssH,

TscL2ssH

SS  after SCK Edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter 73A.

2: Only if Parameter 71A and 72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

75, 76 77

SDI

MSb LSb

bit 6 - - - - - -1

MSb In bit 6 - - - -1 LSb In

PIC18F2331/2431/4331/4431

DS39616D-page 356  2010 Microchip Technology Inc.

FIGURE 26-14: EXAMPLE SPI SLAVE MOD E TIMING (CKE = 1)

TABLE 26-14: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

TssL2scL

SS  to SCK  or SCK  Input TCY —ns

71 TscH SCK Input High Time Continuous 1.25 T

CY + 30 — ns

71A Single byte 40 — ns (Note 1)

72 TscL SCK Input Low Time Continuous 1.25 T

CY + 30 — ns

72A Single byte 40 — ns (Note 1)

73A TB2BLast Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 40 — ns

75 TdoR SDO Data Output Rise Time PIC18FXX31 — 25 ns

PIC18LFXX31 — 45 ns

76 TdoF SDO Data Output Fall Time — 25 ns

77 TssH2doZ SS  to SDO Output High-Impedance 10 50 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after SCK

Edge

PIC18FXX31 — 50 ns

PIC18LFXX31 — 100 ns

82 TssL2doV SDO Data Output Valid after SS 

Edge

PIC18FXX31 — 50 ns

PIC18LFXX31 — 100 ns

83 TscH2ssH,

TscL2ssH

SS  after SCK Edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter 73A.

2: Only if Parameter 71A and 72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

SDI

75, 76

MSb bit 6 - - - - - -1 LSb

bit 6 - - - -1 LSb In

MSb In

 2010 Microchip Technology Inc. DS39616D-page 357

PIC18F2331/2431/4331/4431

FIGURE 26 - 15: I2C™ BUS ST ART/STOP BITS T IMING

TABLE 26-15: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)

FIGURE 26 - 16: I2C™ BUS DATA TIMING

Param.

No. Symbol Characteristic Min Max Units Conditions

90 TSU:STA Start Condition 100 kHz mode 4700 — ns Only relevant for repeated

Start condition

Setup Time 400 kHz mode 600 —

91 THD:STA Start Condition 100 kHz mode 4000 — ns After this period, the first

clock pulse is generated

Hold Time 400 kHz mode 600 —

92 TSU:STO Stop Condition 100 kHz mode 4000 — ns

Setup Time 400 kHz mode 600 —

93 THD:STO Stop Condition 100 kHz mode 4700 — ns

Hold Time 400 kHz mode 600 —

SCL

SDA

Start

Condition

Stop

Condition

91 92

100

101

103

106 107

109 109

110

102

SCL

SDA

Out

PIC18F2331/2431/4331/4431

DS39616D-page 358  2010 Microchip Technology Inc.

TABLE 26-16: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE)

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 4.0 — s PIC18FXX31 must operate at

a minimum of 1.5 MHz

400 kHz mode 0.6 — s PIC18FXX31 must operate at

a minimum of 10 MHz

SSP module 1.5 TCY —

101 TLOW Clock Low Time 100 kHz mode 4.7 — s PIC18FXX31 must operate at

a minimum of 1.5 MHz

400 kHz mode 1.3 — s PIC18FXX31 must operate at

a minimum of 10 MHz

SSP Module 1.5 TCY —

102 TRSDA and SCL Rise

Time

100 kHz mode — 1000 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from

10 to 400 pF

103 TFSDA and SCL Fall

Time

100 kHz mode — 300 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from

10 to 400 pF

90 TSU:STA Start Condition Setup

Time

100 kHz mode 4.7 — s Only relevant for Repeated

Start condition

400 kHz mode 0.6 — s

91 THD:STA Start Condition Hold

Time

100 kHz mode 4.0 — s After this period, the first clock

pulse is generated

400 kHz mode 0.6 — s

106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 s

107 TSU:DAT Data Input Setup

Time

100 kHz mode 250 — ns (Note 2)

400 kHz mode 100 — ns

92 TSU:STO Stop Condition Setup

Time

100 kHz mode 4.7 — s

400 kHz mode 0.6 — s

109 TAA Output Valid From

Clock

100 kHz mode — 3500 ns (Note 1)

400 kHz mode — — ns

110 TBUF Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free

before a new transmission can

start

400 kHz mode 1.3 — s

D102 CBBus Capacitive Loading — 400 pF

Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns)

of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement, TSU:DAT 250 ns,

must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If

such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line,.

TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line

is released.

 2010 Microchip Technology Inc. DS39616D-page 359

PIC18F2331/2431/4331/4431

TABLE 26-17: SSP I2C™ BUS DATA REQUIREMENTS

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

102 TRSDA and SCL

Rise Time

100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

103 TFSDA and SCL

Fall Time

100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB 300 ns

90 TSU:STA Start Condition

Setup Time

100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for

Repeated Start

condition

400 kHz mode 2(T

OSC)(BRG + 1) — ms

91 THD:STA Start Condition

Hold Time

100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first

clock pulse is generated

400 kHz mode 2(T

OSC)(BRG + 1) — ms

106 THD:DAT Data Input

Hold Time

100 kHz mode 0 — ns

400 kHz mode 0 0.9 ms

107 TSU:DAT Data Input

Setup Time

100 kHz mode 250 — ns

400 kHz mode 100 — ns

92 TSU:STO Stop Condition

Setup Time

100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

109 TAA Output Valid

from Clock

100 kHz mode — 3500 ns

400 kHz mode — 1000 ns

110 TBUF Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — ms

D102 CBBus Capacitive Loading — 400 pF

PIC18F2331/2431/4331/4431

DS39616D-page 360  2010 Microchip Technology Inc.

FIGURE 26-17: EUSART SYNC HRONOUS TRANSMISSION (M ASTER/SLAVE) TIMING

TABLE 26-18: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS

FIGURE 26-18: EUSART SYNCHR ONOUS RECEI VE (MASTER /SLAVE) TIMING

TABLE 26-19: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS

Param

No. Symbol Characteristic Min Max Units Conditions

120 TckH2dtV SYNC XMIT (MASTER & SLAVE)

Clock High to Data Out Valid PIC18FXX31 — 40 ns

PIC18LFXX31 — 100 ns

121 Tckrf Clock Out Rise Time and Fall Time

(Master mode)

PIC18FXX31 — 20 ns

PIC18LFXX31 — 50 ns

122 Tdtrf Data Out Rise Time and Fall Time PIC18FXX31 — 20 ns

PIC18LFXX31 — 50 ns

Param.

No. Symbol Characteristic Min Max Units Conditions

125 TdtV2ckl SYNC RCV (MASTER & SLAVE)

Data Hold before CK  (DT hold time) 10 — ns

126 TckL2dtl Data Hold after CK  (DT hold time) 15 — ns

121 121

120 122

RC6/TX/CK/SS

RC7/RX/DT/SDO

125

126

RC6/TX/CK/SS

RC7/RX/DT/SDO

 2010 Microchip Technology Inc. DS39616D-page 361

PIC18F2331/2431/4331/4431

TABLE 26-20: A/D CONVERTER CHARACTERISTICS

PIC18LF2331/2431/4331/4431

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

PIC18F2331/2431/4331/4431

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

-40°C  T

A  +125°C for extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Device Supply

AVDD Analog VDD Supply VDD – 0.3 — VDD + 0.3 V

AVSS Analog VSS Supply VSS – 0.3 — VSS + 0.3 V

IAD Module Current

(during conversion)

—

500

250

—

A

VDD = 5V

VDD = 2.5V

IADO Module Current Off — — 1.0 A

AC Timing Parameters

A10 FTHR Throughput Rate —

—

200

ksps

VDD = 5V, single channel

VDD < 3V, single channel

A11 T

AD A/D Clock Period 385

1000

—

20,000

VDD = 5V

VDD = 3V

A12 TRC A/D Internal RC Oscillator Period —

—

500

750

10000

1500

2250

20000

PIC18F parts

PIC18LF parts

AVDD < 3.0V

A13 T

CNV Conversion Time(1) 12 12 12 TAD

A14 TACQ Acquisition Time(2) 2(2) ——TAD

A16 TTC Conversion Start from External 1/4 TCY ——

Reference Inputs

A20 VREF Reference Voltage for 10-Bit

Resolution (VREF+ – VREF-)

1.5

1.8

—

AVDD – AVSS

VDD 3V

VDD < 3V

A21 VREFH Reference Voltage High (AVDD or VREF+) 1.5V — AVDD VVDD 3V

A22 VREFL Reference Voltage Low (AVSS or VREF-) AVSS —VREFH – 1.5V V

A23 IREF Reference Current —

—

150 A

75 A

—

VDD = 5V

VDD = 2.5V

Analog Input Characteristics

A26 VAIN Input Voltage(3) AVSS – 0.3 — AVDD + 0.3 V

A30 ZAIN Recommended Impedance of Analog

Voltage Source

—— 2.5k

A31 ZCHIN Analog Channel Input Impedance — — 10.0 kVDD = 3.0V

DC Performance

A41 NRResolution 10 bits —

A42 EIL Integral Nonlinearity — — <1LSbVDD  3.0V

VREFH  3.0V

A43 EIL Differential Nonlinearity — — <1LSbVDD  3.0V

VREFH  3.0V

A45 EOFF Offset Error — 0.5 <1.5 LSb VDD  3.0V

VREFH  3.0V

A46 EGA Gain Error — 0.5 <1.5 LSb VDD  3.0V

VREFH  3.0V

A47 — Monotonicity(4) guaranteed — VDD  3.0V

VREFH  3.0V

Note 1: Conversion time does not include acquisition time. See Section 21.0 “10-Bit High-Speed Analog-to-Digital Converter

(A/D) Module” for a full discussion of acquisition time requirements.

2: In Sequential modes, TACQ should be 12 TAD or greater.

3: For VDD < 2.7V and temperature below 0°C, VAIN should be limited to range < VDD/2.

4: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.

PIC18F2331/2431/4331/4431

DS39616D-page 362  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 363

PIC18F2331/2431/4331/4431

27.0 PACKAGING INFORMATION

27.1 Package Marking Information

28-Lead SPDIP (Skinny PDIP)

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2331-I/SP

1010017

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2431-E/SO

1010017

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

28-Lead QFN

XXXXXXXX

YYWWNNN

Example

18F2431

-I/ML

1010017

PIC18F2331/2431/4331/4431

DS39616D-page 364  2010 Microchip Technology Inc.

27.1 Package Marking Information (Continued)

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

PIC18F4431

-I/PT

1010017

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

PIC18F4431

Example

-I/ML

1010017

40-Lead PDIP

XXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F4331-I/P

1010017

 2010 Microchip Technology Inc. DS39616D-page 365

PIC18F2331/2431/4331/4431

27.2 Package Details

The following sections give the technical details of the packages.



!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 +%&,&!&

- '!!#.#&"#'#%!&"!!#%!&"!!!&$#/!#

 '!#&.0

1,2 1!'!&$& "!**&"&&!

!" 3&'!&"&4#*!(!!&4%&&#&

&&255***''54

6&! 7,8.

'!9'&! 7 7: ;

7"')%! 7 <

&  1,

&&  = = 

##44!!   - 

1!&&   = =

"#&"#>#& .  - --

##4>#& .  < 

: 9&  - -? 

&& 9  - 

9#4!!  <  

69#>#& )   

9*9#>#& )  < 

: *+ 1 = = -

NOTE 1

  * ,1

PIC18F2331/2431/4331/4431

DS39616D-page 366  2010 Microchip Technology Inc.

##$%&'(#)

!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 +%&,&!&

- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#

 '!#&.0

1,2 1!'!&$& "!**&"&&!

.32 %'!("!"*&"&&(%%'&"!!

&&255***''54

6&! 99..

'!9'&! 7 7: ;

7"')%! 7 <

&  1,

: 8&  = = ?

##44!!   = =

&#%%+   = -

: >#& . -1,

##4>#& . 1,

: 9&  1,

,'%@&A   = 

3&9& 9  = 

3&& 9 .3

3& IB = <B

9#4!!  < = --

9#>#& ) - = 

#%& DB = B

#%&1&&' EB = B

NOTE 1

123

  * ,1

 2010 Microchip Technology Inc. DS39616D-page 367

PIC18F2331/2431/4331/4431

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

PIC18F2331/2431/4331/4431

DS39616D-page 368  2010 Microchip Technology Inc.

*+%!,-./.*+!

01'((),1

!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 4!!*!"&#

- '!#&.0

1,2 1!'!&$& "!**&"&&!

.32 %'!("!"*&"&&(%%'&"!!

&&255***''54

6&! 99..

'!9'&! 7 7: ;

7"')%! 7 <

&  ?1,

: 8&  <  

&#%%    

,&&4!! - .3

: >#& . ?1,

.$!##>#& . -? - 

: 9&  ?1,

.$!##9&  -? - 

,&&>#& ) - - -

,&&9& 9   

,&&&.$!## C  = =

DEXPOSED D2

NOTE 1

TOP VIEW BOTTOM VIEW

PAD

  * ,1

 2010 Microchip Technology Inc. DS39616D-page 369

PIC18F2331/2431/4331/4431

*+%!,-./.*+!

01'((),1

&&255***''54

PIC18F2331/2431/4331/4431

DS39616D-page 370  2010 Microchip Technology Inc.

2.

!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 +%&,&!&

 '!#&.0

1,2 1!'!&$& "!**&"&&!

&&255***''54

6&! 7,8.

'!9'&! 7 7: ;

7"')%! 7 

&  1,

&&  = = 

##44!!   = 

1!&&   = =

"#&"#>#& .  = ?

##4>#& . < = <

: 9&  < = 

&& 9  = 

9#4!!  < = 

69#>#& ) - = 

9*9#>#& )  = -

: *+ 1 = = 

NOTE 1

123

A1 b1

  * ,?1

 2010 Microchip Technology Inc. DS39616D-page 371

PIC18F2331/2431/4331/4431

2231*+435/5/5%'3*+

!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 ,'%!&!&D!E' 

- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#

 '!#&.0

1,2 1!'!&$& "!**&"&&!

.32 %'!("!"*&"&&(%%'&"!!

&&255***''54

6&! 99..

'!9'&! 7 7: ;

7"')%9#! 7 

9#&  <1,

: 8&  = = 

##44!!    

&#%%   = 

3&9& 9  ? 

3&& 9 .3

3& IB -B B

: >#& . 1,

: 9&  1,

##4>#& . 1,

##49&  1,

9#4!!   = 

9#>#& ) - - 

#%& DB B -B

#%&1&&' EB B -B

NOTE 1 NOTE 2

123

  * ,?1

PIC18F2331/2431/4331/4431

DS39616D-page 372  2010 Microchip Technology Inc.

2231*+435/5/5%'3*+

&&255***''54

 2010 Microchip Technology Inc. DS39616D-page 373

PIC18F2331/2431/4331/4431

22*+%!,-/*+!

!"

  !"#$%&"' ()"&'"!&)&#*&&&#

 4!!*!"&#

- '!#&.0

1,2 1!'!&$& "!**&"&&!

.32 %'!("!"*&"&&(%%'&"!!

&&255***''54

6&! 99..

'!9'&! 7 7: ;

7"')%! 7 

&  ?1,

: 8&  <  

&#%%    

,&&4!! - .3

: >#& . <1,

.$!##>#& . ?- ? ?<

: 9&  <1,

.$!##9&  ?- ? ?<

,&&>#& )  - -<

,&&9& 9 -  

,&&&.$!## C  = =

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3 A1

  * ,-1

PIC18F2331/2431/4331/4431

DS39616D-page 374  2010 Microchip Technology Inc.

22*+%!,-/*+!

&&255***''54

 2010 Microchip Technology Inc. DS39616D-page 375

PIC18F2331/2431/4331/4431

APPENDIX A: REVISION HISTORY

Revision A (June 2003)

Original data sheet for PIC18F2331/2431/4331/4431

devices.

Revision B (December 2003)

The Electrical Specifications in Section 26.0 “Electri-

cal Characteristics” have been updated and there

have been minor corrections to the data sheet text.

Revision C (June 2007)

The data sheet has been updated with all known Data

Sheet Errata items and there have been minor

corrections made to the data sheet text. Also, the

packaging diagrams have been updated in

Section 27.0 “Packaging Information”.

Revision D (September 2010)

Section 2.0 “Guidelines for Getting Started with

PIC18F Microcontrollers” has been updated with

more detailed explanations. Changes have been made

to the port summary tables in Section 11.0 “I/O

Ports”. Section 26.0 “Electrical Characteristics”

has been updated to include extended temperature

data. Packaging diagrams have been replaced with

new diagrams in Section 27.0 “Packaging

Information”. There have been minor text edits

throughout the document.

APPENDIX B: DEVICE

DIFFERENCES

The differences between the devices listed in this data

sheet are shown in Tabl e B-1.

TABLE B-1: DEVICE DIFFERENCES

Features PIC18F2331 PIC18F2431 PIC18F4331 PIC18F4431

Program Memory (Bytes) 4096 8192 4096 8192

Program Memory (Instructions) 2048 4096 2048 4096

Interrupt Sources 22 22 34 34

I/O Ports Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E

Capture/Compare/PWM Modules 2 2 2 2

Enhanced Capture/Compare/

PWM Modules

1111

10-Bit Analog-to-Digital Module 5 Input Channels 5 Input Channels 9 Input Channels 9 Input Channels

Packages 28-Pin SPDIP

28-Pin SOIC

28-Pin QFN

28-Pin SPDIP

28-Pin SOIC

28-Pin QFN

40-Pin PDIP

44-Pin TQFP

44-Pin QFN

40-Pin PDIP

44-Pin TQFP

44-Pin QFN

PIC18F2331/2431/4331/4431

DS39616D-page 376  2010 Microchip Technology Inc.

APPENDIX C: CONVERSION

CONSIDERATIONS

This appendix discusses the considerations for

converting from previous versions of a device to the

ones listed in this data sheet. Typically, these changes

are due to the differences in the process technology

used. An example of this type of conversion is from a

PIC16C74A to a PIC16C74B.

Not Applicable

APPENDIX D: MIGRATION FROM

BASELINE TO

ENHANCED DEVICES

This section discusses how to migrate from a baseline

device (i.e., PIC16C5X) to an enhanced MCU device

(i.e., PIC18FXXX).

The following are the list of modifications over the

PIC16C5X microcontroller family:

Not Currently Av ail able

 2010 Microchip Technology Inc. DS39616D-page 377

PIC18F2331/2431/4331/4431

APPENDIX E: MIGRATION FROM

MID-RANGE TO

ENHANCED DE VICES

A detailed discussion of the differences between the

mid-range MCU devices (i.e., PIC16CXXX) and the

enhanced devices (i.e., PIC18FXXX) is provided in

AN716, “Migrating Designs from PIC16C74A/74B to

PIC18F442.” The changes discussed, while device-

specific, are generally applicable to all mid-range to

enhanced device migrations.

This Application Note is available on Microchip’s

web site: www.Microchip.com.

APPENDIX F: MIGRATION FROM

HIGH-END TO

ENHANCED DEVICES

A detailed discussion of the migration pathway and

differences between the high-end MCU devices (i.e.,

PIC17CXXX) and the enhanced devices (i.e.,

PIC18FXXX) is provided in AN726, “PIC17CXXX to

PIC18FXXX Migration.”

This Application Note is available on Microchip’s

web site: www.Microchip.com.

PIC18F2331/2431/4331/4431

DS39616D-page 378  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 379

PIC18F2331/2431/4331/4431

INDEX

A/D .................................................................................... 239

Acquisition Requirements ......................................... 249

Associated Registers ................................................ 255

Calculating the Minimum Required

Acquisition Time ............................................... 250

Configuring................................................................ 247

Configuring Analog Port Pins.................................... 252

Conversions .............................................................. 253

Converter Characteristics ......................................... 361

Operation in Power-Managed Modes ....................... 252

Result Buffer ............................................................. 249

Selecting and Configuring Automatic

Acquisition Time ............................................... 251

Selecting the Conversion Clock ................................ 251

Special Event Trigger (CCP)..................................... 147

Voltage References .................................................. 251

Absolute Maximum Ratings .............................................. 329

AC (Timing) Characteristics .............................................. 344

Load Conditions for Device

Timing Specifications........................................ 345

Parameter Symbology .............................................. 344

Temperature and Voltage Specifications .................. 345

Timing Conditions ..................................................... 345

ACK Pulse................................................................. 212, 214

ADDLW ............................................................................. 289

ADDWF............................................................................. 289

ADDWFC .......................................................................... 290

Analog-to-Digital Converter. See A/D.

ANDLW ............................................................................. 290

ANDWF............................................................................. 291

Application Notes

AN578 (Use of the SSP Module in the

I2C Multi-Master Environment) ......................... 205

Assembler

MPASM Assembler................................................... 326

Auto-Wake-up on Sync Break Character .......................... 231

BC ..................................................................................... 291

BCF................................................................................... 292

BF Bit ................................................................................ 206

Block Diagrams

A/D ............................................................................ 246

Analog Input Model ................................................... 250

Capture Mode Operation .......................................... 146

Center Connected Load............................................ 194

Compare Mode Operation ........................................ 147

Dead-Time Control Unit for One

PWM Output Pair.............................................. 191

EUSART Receive ..................................................... 229

EUSART Transmit .................................................... 227

External Clock Input, EC............................................. 31

External Components for Timer1 LP Oscillator......... 133

External Power-on Reset Circuit

(Slow VDD Power-up).......................................... 49

Fail-Safe Clock Monitor............................................. 277

Generic I/O Port ........................................................ 113

Input Capture for IC1 ................................................ 153

Input Capture for IC2 and IC3................................... 154

Interrupt Logic............................................................. 98

Low-Voltage Detect with External Input .................... 258

Motion Feedback Module.......................................... 152

On-Chip Reset Circuit................................................. 47

PIC18F2331/2431 ...................................................... 14

PIC18F4331/4431 ...................................................... 15

PLL ............................................................................. 30

Power Control PWM Module .................................... 174

PWM (Standard) ....................................................... 149

PWM I/O Pin............................................................. 198

PWM Module, One Output Pair,

Complementary Mode ...................................... 175

PWM Module, One Output Pair,

Independent Mode ........................................... 175

PWM Time Base....................................................... 177

QEI ........................................................................... 161

RC Oscillator .............................................................. 31

RCIO Oscillator........................................................... 31

Reads from Flash Program Memory .......................... 89

Recommended Minimum Connections....................... 25

SSP (I2C Mode)........................................................ 212

SSP (SPI Mode) ....................................................... 209

System Clock.............................................................. 35

Table Read Operation ................................................ 85

Table Write Operation ................................................ 86

Table Writes to Flash Program Memory..................... 91

Timer0 in 16-Bit Mode .............................................. 128

Timer0 in 8-Bit Mode ................................................ 128

Timer1 ...................................................................... 132

Timer1 (16-Bit Read/Write Mode)............................. 132

Timer2 ...................................................................... 137

Timer5 ...................................................................... 140

Velocity Measurement .............................................. 167

Watchdog Timer ....................................................... 274

BN..................................................................................... 292

BNC .................................................................................. 293

BNN .................................................................................. 293

BNOV ............................................................................... 294

BNZ .................................................................................. 294

BOR. See Brown-out Reset.

BOV .................................................................................. 297

BRA .................................................................................. 295

Brown-out Reset (BOR).............................................. 49, 263

BSF................................................................................... 295

BTFSC.............................................................................. 296

BTFSS .............................................................................. 296

BTG .................................................................................. 297

BZ ..................................................................................... 298

C Compilers

MPLAB C18.............................................................. 326

CALL................................................................................. 298

Capture (CCP Module) ..................................................... 146

Associated Registers ................................................ 148

CCP Pin Configuration ............................................. 146

CCPR1H:CCPR1L Registers ................................... 146

Prescaler .................................................................. 146

Software Interrupt ..................................................... 146

Timer1 Mode Selection............................................. 146

Capture/Compare/PWM (CCP) ........................................ 145

Capture Mode. See Capture.

CCP1 ........................................................................ 145

CCPR1H Register ............................................ 145

CCPR1L Register ............................................. 145

PIC18F2331/2431/4331/4431

DS39616D-page 380  2010 Microchip Technology Inc.

CCP2 ........................................................................ 145

CCPR2H Register.............................................145

CCPR2L Register ............................................. 145

Compare Mode. See Compare.

Timer Resources....................................................... 145

CKE Bit..............................................................................206

CKP Bit..............................................................................207

Clock Sources ..................................................................... 34

Effects of Power-Managed Modes .............................. 37

Selection Using OSCCON Register............................34

Clocking Scheme/Instruction Cycle..................................... 65

CLRF................................................................................. 299

CLRWDT........................................................................... 299

Code Examples

Changing Between Capture Prescalers .................... 146

Computed GOTO Using an Offset Value.................... 64

Data EEPROM Read .................................................. 81

Data EEPROM Refresh Routine................................. 82

Data EEPROM Write .................................................. 81

Erasing a Flash Program Memory Row ...................... 90

Fast Register Stack.....................................................64

How to Clear RAM (Bank 1) Using

Indirect Addressing .............................................75

Implementing a Real-Time Clock Using a

Timer1 Interrupt Service ...................................135

Initializing PORTA..................................................... 113

Initializing PORTB..................................................... 116

Initializing PORTC..................................................... 119

Initializing PORTD..................................................... 122

Initializing PORTE..................................................... 124

Reading a Flash Program Memory Word ................... 89

Saving STATUS, WREG and BSR

Registers in RAM.............................................. 112

Writing to Flash Program Memory ........................ 93–94

16 x 16 Signed Multiply Routine ................................. 96

16 x 16 Unsigned Multiply Routine ............................. 96

8 x 8 Signed Multiply Routine ..................................... 95

8 x 8 Unsigned Multiply Routine ................................. 95

Code Protection ........................................................ 263, 279

Associated Registers ................................................ 279

Data EEPROM.......................................................... 282

Program Memory ...................................................... 280

COMF................................................................................ 300

Compare (CCP Module).................................................... 147

Associated Registers ................................................ 148

CCP Pin Configuration.............................................. 147

CCPR1 Register .......................................................147

CCPR2 Register .......................................................147

Software Interrupt Mode ........................................... 147

Special Event Trigger................................................ 147

Timer1 Mode Selection ............................................. 147

Configuration Bits..............................................................263

Configuration Register Protection ..................................... 282

Conversion Considerations ...............................................376

CPFSEQ ........................................................................... 300

CPFSGT............................................................................ 301

CPFSLT ............................................................................ 301

Crystal Oscillator/Ceramic Resonators ............................... 29

Customer Change Notification Service ............................. 387

Customer Notification Service........................................... 387

Customer Support ............................................................. 387

D/A Bit............................................................................... 206

Data Addressing Modes ..................................................... 75

Direct .......................................................................... 75

Indirect ........................................................................ 75

Inherent and Literal..................................................... 75

Data EEPROM Memory...................................................... 79

Associated Registers .................................................. 83

EEADR Register......................................................... 79

EECON1 and EECON2 Registers .............................. 79

Operation During Code-Protect .................................. 82

Protection Against Spurious Write .............................. 81

Reading ...................................................................... 81

Using .......................................................................... 82

Write Verify ................................................................. 81

Writing ........................................................................ 81

Data Memory ...................................................................... 67

Access Bank............................................................... 68

Bank Select Register (BSR) ....................................... 68

General Purpose Register (GPR) File ........................ 68

Map for PIC18F2331/2431/4331/4431 ....................... 67

Special Function Registers (SFRs)............................. 69

DAW ................................................................................. 302

DC Characteristics............................................................ 339

Power-Down and Supply Current ............................. 332

Supply Voltage ......................................................... 331

DCFSNZ ........................................................................... 303

DECF ................................................................................ 302

DECFSZ ........................................................................... 303

Development Support....................................................... 325

Device Differences............................................................ 375

Device Overview................................................................. 11

Features (table) .......................................................... 13

New Core Features..................................................... 11

Other Special Features............................................... 12

Device Reset Timers

Oscillator Start-up Timer (OST).................................. 50

PLL Lock Time-out...................................................... 50

Power-up Timer (PWRT) ............................................ 50

Time-out Sequence .................................................... 50

Direct Addressing ............................................................... 76

Electrical Characteristics .................................................. 329

Enhanced Universal Synchronous Asynchronous

Receiver Transmitter (EUSART) .............................. 217

Equations

A/D Acquisition Time ................................................ 249

Conversion Time for Multi-Channel Modes .............. 254

Minimum A/D Holding Capacitor Charging Time ...... 249

PWM Period for Free-Running Mode ....................... 185

PWM Period for Up/Down Count Mode .................... 185

PWM Resolution ....................................................... 185

16 x 16 Signed Multiplication Algorithm...................... 96

16 x 16 Unsigned Multiplication Algorithm.................. 96

Errata .................................................................................... 9

 2010 Microchip Technology Inc. DS39616D-page 381

PIC18F2331/2431/4331/4431

EUSART

Asynchronous Mode ................................................. 226

Associated Registers, Receive ......................... 230

Associated Registers, Transmit ........................ 228

Auto-Wake-up on Sync Break .......................... 231

Receiver............................................................ 229

Receiving a Break Character............................ 232

Setting Up 9-Bit Mode with Address Detect...... 229

Transmitter........................................................ 226

12-Bit Break Character Sequence .................... 232

Baud Rate Generator (BRG)..................................... 221

Associated Registers ........................................ 222

Auto-Baud Rate Detect..................................... 225

Baud Rate Error, Calculating ............................ 222

Baud Rates, Asynchronous Modes .................. 222

High Baud Rate Select (BRGH Bit) .................. 221

Power-Managed Mode Operation..................... 221

Sampling ........................................................... 221

Serial Port Enable (SPEN Bit)................................... 217

Synchronous Master Mode ....................................... 233

Associated Registers, Receive ......................... 236

Associated Registers, Transmit ........................ 234

Reception.......................................................... 235

Transmission .................................................... 233

Synchronous Slave Mode ......................................... 237

Associated Registers, Receive ......................... 238

Associated Registers, Transmit ........................ 237

Reception.......................................................... 238

Transmission .................................................... 237

External Clock Input............................................................ 31

Fail-Safe Clock Monitor............................................. 263, 277

Exiting ....................................................................... 277

Interrupts in Power-Managed Modes........................ 278

POR or Wake From Sleep ........................................ 278

WDT During Oscillator Failure .................................. 277

Fail-Safe Clock Monitor (FSCM) ....................................... 263

Fast Register Stack............................................................. 64

Flash Program Memory ...................................................... 85

Associated Registers .................................................. 94

Control Registers ........................................................ 86

EECON1 and EECON2 ...................................... 86

Erase Sequence ......................................................... 90

Erasing........................................................................ 90

Operation During Code-Protect .................................. 94

Reading....................................................................... 89

TABLAT Register ........................................................ 88

Table Pointer............................................................... 88

Boundaries Based on Operation......................... 88

Table Pointer Boundaries ........................................... 88

Table Reads and Table Writes ................................... 85

Unexpected Termination of Write Operation............... 94

Write Sequence .......................................................... 92

Write Verify ................................................................. 94

Writing......................................................................... 91

FSCM. See Fail-Safe Clock Monitor.

Getting Started.................................................................... 25

GOTO ............................................................................... 304

Hardware Multiplier............................................................. 95

Introduction................................................................. 95

Operation.................................................................... 95

Performance Comparison........................................... 95

I/O Ports ........................................................................... 113

ID Locations.............................................................. 263, 282

INCF ................................................................................. 304

INCFSZ............................................................................. 305

In-Circuit Debugger........................................................... 282

In-Circuit Serial Programming (ICSP)....................... 263, 282

Independent PWM Mode .................................................. 193

Duty Cycle Assignment ............................................ 193

Indirect Addressing ............................................................. 76

INFSNZ............................................................................. 305

Initialization Conditions for All Registers....................... 54–59

Instruction Flow/Pipelining .................................................. 65

Instruction Set

ADDLW..................................................................... 289

ADDWF .................................................................... 289

ADDWFC.................................................................. 290

ANDLW..................................................................... 290

ANDWF .................................................................... 291

BC............................................................................. 291

BCF .......................................................................... 292

BN............................................................................. 292

BNC .......................................................................... 293

BNN .......................................................................... 293

BNOV ....................................................................... 294

BNZ .......................................................................... 294

BOV .......................................................................... 297

BRA .......................................................................... 295

BSF........................................................................... 295

BTFSC...................................................................... 296

BTFSS ...................................................................... 296

BTG .......................................................................... 297

BZ ............................................................................. 298

CALL......................................................................... 298

CLRF ........................................................................ 299

CLRWDT .................................................................. 299

COMF ....................................................................... 300

CPFSEQ................................................................... 300

CPFSGT ................................................................... 301

CPFSLT.................................................................... 301

DAW ......................................................................... 302

DCFSNZ ................................................................... 303

DECF........................................................................ 302

DECFSZ ................................................................... 303

General Format ........................................................ 285

GOTO ....................................................................... 304

INCF ......................................................................... 304

INCFSZ..................................................................... 305

INFSNZ..................................................................... 305

IORLW...................................................................... 306

IORWF...................................................................... 306

LFSR ........................................................................ 307

MOVF ....................................................................... 307

MOVFF ..................................................................... 308

MOVLB ..................................................................... 308

PIC18F2331/2431/4331/4431

DS39616D-page 382  2010 Microchip Technology Inc.

MOVLW .................................................................... 309

MOVWF .................................................................... 309

MULLW ..................................................................... 310

MULWF..................................................................... 310

NEGF ........................................................................ 311

NOP .......................................................................... 311

POP .......................................................................... 312

PUSH ........................................................................ 312

RCALL ...................................................................... 313

Read-Modify-Write Operations ................................. 283

RESET ...................................................................... 313

RETFIE ..................................................................... 314

RETLW ..................................................................... 314

RETURN ................................................................... 315

RLCF......................................................................... 315

RLNCF ...................................................................... 316

RRCF ........................................................................ 316

RRNCF ..................................................................... 317

SETF......................................................................... 317

SLEEP ...................................................................... 318

SUBFWB................................................................... 318

SUBLW ..................................................................... 319

SUBWF ..................................................................... 319

SUBWFB................................................................... 320

Summary................................................................... 283

Summary Table......................................................... 286

SWAPF ..................................................................... 320

TBLRD ...................................................................... 321

TBLWT ...................................................................... 322

TSTFSZ .................................................................... 323

XORLW..................................................................... 323

XORWF..................................................................... 324

INTCON Register

RBIF Bit..................................................................... 116

INTCON Registers .............................................................. 99

Inter-Integrated Circuit (I2C). See I2C Mode.

Internal Oscillator Block ...................................................... 32

Adjustment .................................................................. 32

INTIO Modes............................................................... 32

INTRC Output Frequency ...........................................32

OSCTUNE Register .................................................... 32

Internal RC Oscillator

Use with WDT ........................................................... 274

Internet Address................................................................ 387

Interrupt Sources............................................................... 263

Capture Complete (CCP).......................................... 146

Interrupt-on-Change (RB7:RB4) ............................... 116

INTx Pin .................................................................... 112

PORTB, Interrupt-on-Change ................................... 112

TMR0 ........................................................................ 112

TMR1 Overflow ......................................................... 131

TMR2 to PR2 Match (PWM) ............................. 136, 149

Interrupts ............................................................................. 97

Context Saving, During ............................................. 112

Interrupts, Enable Bits

CCP1 Enable (CCP1IE Bit).......................................146

Interrupts, Flag Bits

CCP1 Flag (CCP1IF Bit) ........................................... 146

CCP1IF Flag (CCP1IF Bit)........................................ 147

CCP2IF Flag (CCP2IF Bit)........................................ 147

Interrupt-on-Change (RB7:RB4) Flag

(RBIF Bit) .......................................................... 116

INTOSC, INTRC. See Internal Oscillator Block.

IORLW .............................................................................. 306

IORWF .............................................................................. 306

IPR Registers ....................................................................108

I2C Mode

Operation.................................................................. 212

I2C Mode (SSP)

Addressing................................................................ 213

Associated Registers ................................................ 216

Master Mode............................................................. 216

Mode Selection......................................................... 212

Multi-Master Mode .................................................... 216

Operation.................................................................. 212

Reception ................................................................. 214

Slave Mode............................................................... 212

SCL and SDA Pins ........................................... 212

Transmission ............................................................ 215

LFSR................................................................................. 307

Low-Voltage Detect .......................................................... 257

Applications .............................................................. 261

Associated Registers ................................................ 261

Characteristics.......................................................... 342

Current Consumption................................................ 259

Effects of a Reset ..................................................... 261

Operation.................................................................. 259

Operation During Sleep ............................................ 261

Setup ........................................................................ 259

Start-up Time............................................................ 260

LVD. See Low-Voltage Detect.

Master Clear (MCLR).......................................................... 49

Memory Organization ......................................................... 61

Data Memory .............................................................. 67

Program Memory........................................................ 61

Memory Programming Requirements............................... 341

MFM

Input Capture

Edge Capture Mode ......................................... 156

Entering and Timing ......................................... 159

IC Interrupts...................................................... 159

Pulse-Width Measurement Mode ..................... 157

Special Event Trigger (CAP1 Only) .................. 160

State Change.................................................... 158

Time Base Reset Summary.............................. 160

Timer5 Reset .................................................... 159

Input Capture (IC) Submode..................................... 153

Input Capture Mode

Period Measurement Mode .............................. 157

Noise Filters.............................................................. 169

Microchip Internet Web Site.............................................. 387

Migration From Baseline to Enhanced Devices................ 376

Migration From High-End to Enhanced Devices............... 377

Migration From Mid-Range to Enhanced Devices ............ 377

Motion Feedback Module (MFM)...................................... 151

Associated Registers ................................................ 171

Summary of Features ............................................... 151

MOVF ............................................................................... 307

MOVFF ............................................................................. 308

MOVLB ............................................................................. 308

MOVLW ............................................................................ 309

MOVWF ............................................................................ 309

MPLAB ASM30 Assembler, Linker, Librarian ................... 326

MPLAB Integrated Development

Environment Software .............................................. 325

MPLAB PM3 Device Programmer .................................... 328

MPLAB REAL ICE In-Circuit Emulator System ................ 327

 2010 Microchip Technology Inc. DS39616D-page 383

PIC18F2331/2431/4331/4431

MPLINK Object Linker/MPLIB Object Librarian ................ 326

MULLW ............................................................................. 310

MULWF............................................................................. 310

NEGF ................................................................................ 311

NOP .................................................................................. 311

Opcode Field Descriptions................................................ 284

Oscillator Configuration....................................................... 29

EC ............................................................................... 29

ECIO ........................................................................... 29

HS ............................................................................... 29

HSPLL......................................................................... 29

Internal Oscillator Block .............................................. 32

INTIO1 ........................................................................ 29

INTIO2 ........................................................................ 29

LP................................................................................ 29

RC............................................................................... 29

RCIO ........................................................................... 29

XT ............................................................................... 29

Oscillator Selection ........................................................... 263

Oscillator Start-up Timer (OST) .................................. 37, 263

Oscillator Switching............................................................. 34

Oscillator Transitions .......................................................... 37

Oscillator, Timer1 .............................................................. 131

P (Stop) Bit........................................................................ 206

Packaging Information ...................................................... 363

Details ....................................................................... 365

Marking ..................................................................... 363

PIE Registers .................................................................... 105

Pin Diagrams ........................................................................ 4

Pin Functions

MCLR/VPP................................................................... 16

MCLR/VPP/RE3........................................................... 19

OSC1/CLKI/RA7 ................................................... 16, 19

OSC2/CLKO/RA6 ................................................. 16, 19

RA0/AN0............................................................... 16, 20

RA1/AN1............................................................... 16, 20

RA2/AN2/VREF-/CAP1/INDX................................. 16, 20

RA3/AN3/VREF+/CAP2/QEA................................. 16, 20

RA4/AN4/CAP3/QEB............................................ 16, 20

RA5/AN5/LVDIN ......................................................... 20

RB0/PWM0 ........................................................... 17, 21

RB1/PWM1 ........................................................... 17, 21

RB2/PWM2 ........................................................... 17, 21

RB3/PWM3 ........................................................... 17, 21

RB4/KBIO/PWM5........................................................ 17

RB4/KBI0/PWM5 ........................................................ 21

RB5/KBI1/PWM4/PGM ......................................... 17, 21

RB6/KBI2/PGC ..................................................... 17, 21

RB7/KBI3/PGD ..................................................... 17, 21

RC0/T1OSO/T1CKI .............................................. 18, 22

RC1/T1OSI/CCP2/FLTA ....................................... 18, 22

RC2/CCP1 .................................................................. 18

RC2/CCP1/FLTB ........................................................ 22

RC3/T0CKI/T5CKI/INT0........................................ 18, 22

RC4/INT1/SDI/SDA............................................... 18, 22

RC5/INT2/SCK/SCL.............................................. 18, 22

RC6/TX/CK/SS ..................................................... 18, 22

RC7/RX/DT/SDO .................................................. 18, 22

RD0/T0CKI/T5CKI ...................................................... 23

RD1/SDO .................................................................... 23

RD2/SDI/SDA ............................................................. 23

RD3/SCK/SCL ............................................................ 23

RD4/FLTA................................................................... 23

RD5/PWM4................................................................. 23

RD6/PWM6................................................................. 23

RD7/PWM7................................................................. 23

RE0/AN6..................................................................... 24

RE1/AN7..................................................................... 24

RE2/AN8..................................................................... 24

VDD ....................................................................... 18, 24

VSS ....................................................................... 24, 18

Pinout I/O Descriptions

PIC18F2331/2431 ...................................................... 16

PIC18F4331/4431 ...................................................... 19

PIR Registers.................................................................... 102

PLL

HSPLL Mode .............................................................. 30

Multiplier ..................................................................... 30

POP .................................................................................. 312

POR. See Power-on Reset.

PORTA

Associated Registers ................................................ 115

LATA Register .......................................................... 113

PORTA Register....................................................... 113

TRISA Register......................................................... 113

PORTB

Associated Registers ................................................ 118

LATB Register .......................................................... 116

PORTB Register....................................................... 116

RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) ........ 116

TRISB Register......................................................... 116

PORTC

Associated Registers ................................................ 121

LATC Register .......................................................... 119

PORTC Register....................................................... 119

TRISC Register ........................................................ 119

PORTD

Associated Registers ................................................ 123

LATD Register .......................................................... 122

PORTD Register....................................................... 122

TRISD Register ........................................................ 122

PORTE

Associated Registers ................................................ 125

LATE Register .......................................................... 124

PORTE Register....................................................... 124

TRISE Register......................................................... 124

Postscaler, WDT

Assignment (PSA Bit) ............................................... 129

Rate Select (T0PS2:T0PS0 Bits).............................. 129

Power-Managed Modes...................................................... 39

Clock Sources ............................................................ 39

Clock Transitions and Status Indicators ..................... 40

Entering ...................................................................... 39

Exiting Idle and Sleep Modes ..................................... 45

By Interrupt ......................................................... 45

By Reset............................................................. 45

By WDT Time-out ............................................... 45

Without an Oscillator Start-up Delay .................. 46

Idle Modes .................................................................. 43

PRI_IDLE ........................................................... 44

RC_IDLE ............................................................ 45

SEC_IDLE .......................................................... 44

Multiple Sleep Commands.......................................... 40

PIC18F2331/2431/4331/4431

DS39616D-page 384  2010 Microchip Technology Inc.

Run Modes.................................................................. 40

PRI_RUN ............................................................ 40

RC_RUN ............................................................. 41

SEC_RUN........................................................... 40

Selecting ..................................................................... 39

Sleep Mode................................................................. 43

Summary (table) .........................................................39

Power-on Reset (POR) ............................................... 49, 263

Power-up Delays................................................................. 37

Power-up Timer (PWRT)............................................. 37, 263

Prescaler, Timer0.............................................................. 129

Assignment (PSA Bit) ............................................... 129

Rate Select (T0PS2:T0PS0 Bits) .............................. 129

Prescaler, Timer2.............................................................. 150

PRI_IDLE Mode ..................................................................44

PRI_RUN Mode .................................................................. 40

Program Counter (PC) ........................................................ 62

Program Memory

Instructions.................................................................. 66

Two-Word ........................................................... 66

Interrupt Vector ........................................................... 61

Map and Stack

PIC18F2331/4331............................................... 61

PIC18F2431/4431............................................... 61

Reset Vector ...............................................................61

Program Verification.......................................................... 279

Pulse-Width Modulation. See PWM (CCP Module).

PUSH ................................................................................ 312

PUSH and POP Instructions ............................................... 64

PWM

Associated Registers ................................................ 203

Complementary Operation........................................ 190

Control Registers ...................................................... 176

Dead-Time Generators ............................................. 191

Duty Cycle................................................................. 187

Center-Aligned .................................................. 189

Comparison....................................................... 187

Edge-Aligned .................................................... 188

Registers........................................................... 187

Fault Inputs ............................................................... 199

Functionality.............................................................. 176

Modes

Continuous Up/Down Count ............................. 180

Free-Running .................................................... 180

Single-Shot ....................................................... 180

Output and Polarity Control....................................... 198

Output Override ........................................................194

Single-Pulse Operation ............................................. 194

Special Event Trigger................................................ 202

Time Base................................................................. 176

Interrupts........................................................... 181

Continuous Up/Down

Count Mode ...................................... 182

Double Update Mode ................................ 184

Free-Running Mode.................................. 181

Single-Shot Mode ..................................... 182

Postscaler ......................................................... 181

Prescaler........................................................... 180

Update Lockout......................................................... 202

PWM (CCP Module)

Associated Registers ................................................ 150

CCPR1H:CCPR1L Registers.................................... 149

Duty Cycle ................................................................ 149

Example Frequencies/Resolutions ........................... 150

Period ....................................................................... 149

PR2 Register, Writing ............................................... 149

Setup for PWM Operation......................................... 150

TMR2 to PR2 Match ......................................... 136, 149

PWM Period...................................................................... 185

Q Clock ............................................................................. 150

QEI

and IC Shared Interrupts .......................................... 170

Configuration ............................................................ 162

Direction of Rotation ................................................. 163

Interrupts .................................................................. 164

Operation.................................................................. 163

Operation in Sleep Mode.......................................... 170

3x Input Capture ............................................... 170

Sampling Modes ....................................................... 163

Velocity Measurement .............................................. 167

Quadrature Encoder Interface (QEI)................................. 161

R/W Bit...................................................... 206, 213, 214, 215

RAM. See Data Memory.

RC Oscillator....................................................................... 31

RCIO Oscillator Mode................................................. 31

RC_IDLE Mode................................................................... 45

RC_RUN Mode................................................................... 41

RCALL .............................................................................. 313

RCSTA Register

SPEN Bit................................................................... 217

Reader Response............................................................. 388

Registers

ADCHS (A/D Channel Select) .................................. 244

ADCON0 (A/D Control 0).......................................... 240

ADCON1 (A/D Control 1).......................................... 241

ADCON2 (A/D Control 2).......................................... 242

ADCON3 (A/D Control 3).......................................... 243

ANSEL0 (Analog Select 0) ....................................... 245

ANSEL1 (Analog Select 1) ....................................... 245

BAUDCON (Baud Rate Control)............................... 220

CAPxCON (Input Capture x Control)........................ 155

CCPxCON (CCPx Control)....................................... 145

CONFIG1H (Configuration 1 High)........................... 264

CONFIG2H (Configuration 2 High)........................... 266

CONFIG2L (Configuration 2 Low) ............................ 265

CONFIG3H (Configuration 3 High)........................... 268

CONFIG3L (Configuration 3 Low) ............................ 267

CONFIG4L (Configuration 4 Low) ............................ 269

CONFIG5H (Configuration 5 High)........................... 270

CONFIG5L (Configuration 5 Low) ............................ 270

CONFIG6H (Configuration 6 High)........................... 271

CONFIG6L (Configuration 6 Low) ............................ 271

CONFIG7H (Configuration 7 High)........................... 272

CONFIG7L (Configuration 7 Low) ............................ 272

DEVID1 (Device ID 1)............................................... 273

 2010 Microchip Technology Inc. DS39616D-page 385

PIC18F2331/2431/4331/4431

DEVID2 (Device ID 2) ............................................... 273

DFLTCON (Digital Filter Control) .............................. 169

DTCON (Dead-Time Control) ................................... 192

EECON1 (Data EEPROM Control 1) .......................... 87

EECON1 (EEPROM Control 1)................................... 80

FLTCONFIG (Fault Configuration)............................ 201

INTCON (Interrupt Control)......................................... 99

INTCON2 (Interrupt Control 2).................................. 100

INTCON3 (Interrupt Control 3).................................. 101

IPR1 (Peripheral Interrupt Priority 1)......................... 108

IPR2 (Peripheral Interrupt Priority 2)......................... 109

IPR3 (Peripheral Interrupt Priority 3)......................... 110

LVDCON (Low-Voltage Detect Control).................... 257

OSCCON (Oscillator Control) ..................................... 36

OSCTUNE (Oscillator Tuning) .................................... 33

OVDCOND (Output Override Control) ...................... 196

OVDCONS (Output State) ........................................ 196

PIE1 (Peripheral Interrupt Enable 1)......................... 105

PIE2 (Peripheral Interrupt Enable 2)......................... 106

PIE3 (Peripheral Interrupt Enable 3)......................... 107

PIR1 (Peripheral Interrupt Request (Flag) 1) ............ 102

PIR2 (Peripheral Interrupt Request (Flag) 2) ............ 103

PIR3 (Peripheral Interrupt Request (Flag) 3) ............ 104

PTCON0 (PWM Timer Control 0) ............................. 178

PTCON1 (PWM Timer Control 1) ............................. 178

PWMCON0 (PWM Control 0) ................................... 179

PWMCON1 (PWM Control 1) ................................... 180

QEICON (QEI Control).............................................. 162

RCON (Reset Control) ........................................ 48, 111

RCSTA (Receive Status and Control)....................... 219

SSPCON (SSP Control)............................................ 207

SSPSTAT (SSP Status)............................................ 206

STATUS...................................................................... 74

STKPTR (Stack Pointer)............................................. 63

Summary............................................................... 70–73

TRISE ....................................................................... 124

TXSTA (Transmit Status and Control) ...................... 218

T0CON (Timer0 Control)........................................... 127

T1CON (Timer1 Control)........................................... 131

T2CON (Timer2 Control)........................................... 136

T5CON (Timer5 Control)........................................... 139

WDTCON (Watchdog Timer Control) ....................... 275

RESET .............................................................................. 313

Reset................................................................................... 47

Resets............................................................................... 263

RETFIE ............................................................................. 314

RETLW ............................................................................. 314

RETURN ........................................................................... 315

Return Address Stack ......................................................... 62

Return Stack Pointer (STKPTR) ......................................... 62

Revision History ................................................................ 375

RLCF................................................................................. 315

RLNCF .............................................................................. 316

RRCF ................................................................................ 316

RRNCF ............................................................................. 317

S (Start) Bit ....................................................................... 206

SCK................................................................................... 205

SCL ................................................................................... 212

SDI .................................................................................... 205

SDO .................................................................................. 205

SEC_IDLE Mode................................................................. 44

SEC_RUN Mode................................................................. 40

Serial Clock (SCK) Pin...................................................... 205

Serial Data In (SDI) Pin..................................................... 205

Serial Data Out (SDO) Pin................................................ 205

SETF ................................................................................ 317

Single-Supply ICSP Programming.................................... 282

Slave Select (SS) Pin ....................................................... 205

SLEEP .............................................................................. 318

Sleep

OSC1 and OSC2 Pin States....................................... 37

Software Simulator (MPLAB SIM) .................................... 327

Special Event Trigger. See Compare (CCP Module).

Special Features of the CPU ............................................ 263

Special Function Registers

Map............................................................................. 69

SPI Mode (SSP) ............................................................... 205

Associated Registers ................................................ 211

Serial Clock .............................................................. 205

Serial Data In............................................................ 205

Serial Data Out......................................................... 205

Slave Select.............................................................. 205

SS ..................................................................................... 205

SSP

Overview.

TMR2 Output for Clock Shift............................. 136, 137

SSPEN Bit ........................................................................ 207

SSPM<3:0> Bits ............................................................... 208

SSPOV Bit ........................................................................ 207

Stack Full/Underflow Resets............................................... 64

Status Bits, Significance and Initialization for

RCON Register........................................................... 53

SUBFWB .......................................................................... 318

SUBLW............................................................................. 319

SUBWF............................................................................. 319

SUBWFB .......................................................................... 320

SWAPF............................................................................. 320

Synchronous Serial Port. See SSP.

TABLAT Register................................................................ 88

Table Pointer Operations (table)......................................... 88

TBLPTR Register................................................................ 88

TBLRD.............................................................................. 321

TBLWT ............................................................................. 322

Time-out in Various Situations (table)................................. 50

Timer0 .............................................................................. 127

Associated Registers ................................................ 129

Clock Source Edge Select (T0SE Bit) ...................... 129

Clock Source Select (T0CS Bit) ............................... 129

Interrupt .................................................................... 129

Operation.................................................................. 129

Prescaler .................................................................. 129

Switching Assignment ...................................... 129

Prescaler. See Prescaler, Timer0.

16-Bit Mode Timer Reads and Writes ...................... 129

Timer1 .............................................................................. 131

Associated Registers ................................................ 135

Interrupt .................................................................... 134

Operation.................................................................. 132

Oscillator........................................................... 131, 133

Layout Considerations...................................... 133

Overflow Interrupt ..................................................... 131

Resetting, Using a Special Event Trigger

Output (CCP).................................................... 134

Special Event Trigger (CCP) .................................... 147

TMR1H Register....................................................... 131

TMR1L Register ....................................................... 131

Use as a Real-Time Clock (RTC)............................. 134

16-Bit Read/Write Mode ........................................... 134

PIC18F2331/2431/4331/4431

DS39616D-page 386  2010 Microchip Technology Inc.

Timer2 ............................................................................... 136

Associated Registers ................................................ 137

Interrupt..................................................................... 137

Operation .................................................................. 136

Postscaler. See Postscaler, Timer2.

Prescaler. See Prescaler, Timer2.

PR2 Register............................................................. 136

SSP Clock Shift................................................. 136, 137

TMR2 Register.......................................................... 136

TMR2 to PR2 Match Interrupt ........................... 136, 149

Timer5 ............................................................................... 139

Associated Registers ................................................ 143

Interrupt..................................................................... 142

Noise Filter................................................................142

Operation .................................................................. 140

Continuous Count and Single-Shot................... 141

Sleep Mode....................................................... 142

Prescaler................................................................... 141

Special Event Trigger

Output ............................................................... 142

Reset Input........................................................ 142

16-Bit Read/Write and Write Modes ......................... 141

16-Bit Read-Modify-Write..........................................141

Timing Diagrams

Automatic Baud Rate Calculation ............................. 225

Auto-Wake-up Bit (WUE) During

Normal Operation..............................................231

Auto-Wake-up Bit (WUE) During Sleep .................... 231

Brown-out Reset (BOR) ............................................349

Capture/Compare/PWM (All CCP Modules) ............. 352

CAPx Interrupts and IC1 Special Event Trigger........ 159

CLKO and I/O ........................................................... 348

Clock, Instruction Cycle .............................................. 65

Dead-Time Insertion for Complementary PWM ........ 191

Duty Cycle Update Times in Continuous

Up/Down Count Mode....................................... 188

Duty Cycle Update Times in Continuous

Up/Down Count Mode with

Double Updates ................................................ 189

Edge Capture Mode.................................................. 156

Edge-Aligned PWM................................................... 188

EUSART Asynchronous Reception ..........................230

EUSART Asynchronous Transmission ..................... 227

EUSART Asynchronous Transmission

(Back to Back)...................................................227

EUSART Synchronous Receive (Master/Slave) ....... 360

EUSART Synchronous Reception

(Master Mode, SREN)....................................... 235

EUSART Synchronous Transmission ....................... 233

EUSART Synchronous Transmission

(Through TXEN)................................................ 234

EUSART SynchronousTransmission

(Master/Slave)................................................... 360

Example SPI Master Mode (CKE = 0) ...................... 353

Example SPI Master Mode (CKE = 1) ...................... 354

Example SPI Slave Mode (CKE = 0) ........................ 355

Example SPI Slave Mode (CKE = 1) ........................ 356

External Clock (All Modes Except PLL) .................... 346

Fail-Safe Clock Monitor.............................................278

Input Capture on State Change, Hall Effect

Sensor Mode.................................................... 158

I2C Bus Data ............................................................. 357

I2C Bus Start/Stop Bits.............................................. 357

I2C Reception (7-Bit Address)................................... 214

I2C Transmission (7-Bit Address) ............................. 215

Low-Voltage Detect .................................................. 260

Low-Voltage Detect Characteristics.......................... 342

Noise Filter................................................................ 170

Pulse-Width Measurement Mode ............................. 157

PWM Output ............................................................. 149

PWM Output Override (Example 1) .......................... 197

PWM Output Override (Example 2) .......................... 197

PWM Override Bits in Complementary Mode ........... 195

PWM Period Buffer Updates in

Continuous Up/Down Count Mode ................... 186

PWM Period Buffer Updates in

Free-Running Mode.......................................... 186

PWM Time Base Interrupt, Continuous

Up/Down Count Mode ...................................... 183

PWM Time Base Interrupt, Continuous

Up/Down Count Mode with

Double Updates................................................ 184

PWM Time Base Interrupt, Free-Running Mode ...... 181

PWM Time Base Interrupt, Single-Shot Mode.......... 182

QEI Inputs When Sampled by Filter ......................... 165

QEI Reset on Period Match...................................... 165

QEI Reset with the Index Input ................................. 166

Reset, Watchdog Timer (WDT), Oscillator

Start-up Timer (OST), Power-up

Timer (PWRT) .................................................. 349

Send Break Character Sequence............................. 232

Slow Rise Time (MCLR Tied to VDD,

VDD Rise > TPWRT) ............................................. 52

SPI Mode (Master Mode).......................................... 210

SPI Mode (Slave Mode with CKE = 0)...................... 210

SPI Mode (Slave Mode with CKE = 1)...................... 211

Start of Center-Aligned PWM ................................... 189

Time-out Sequence on POR w/PLL Enabled

(MCLR Tied to VDD) ........................................... 53

Time-out Sequence on Power-up

(MCLR Not Tied to VDD): Case 1 ....................... 51

Time-out Sequence on Power-up

(MCLR Not Tied to VDD): Case 2 ....................... 52

Time-out Sequence on Power-up

(MCLR Tied to VDD, VDD Rise TPWRT) ............... 51

Timer0 and Timer1 External Clock ........................... 351

Transition for Entry to Idle Mode................................. 44

Transition for Entry to SEC_RUN Mode ..................... 41

Transition for Entry to Sleep Mode ............................. 43

Transition for Two-Speed Start-up

(INTOSC to HSPLL) ......................................... 276

Transition for Wake From Idle to Run Mode............... 44

Transition for Wake From Sleep (HSPLL) .................. 43

Transition From RC_RUN Mode to

PRI_RUN Mode.................................................. 42

Transition From SEC_RUN Mode to

PRI_RUN Mode (HSPLL) ................................... 41

Transition to RC_RUN Mode ...................................... 42

Velocity Measurement .............................................. 168

Timing Diagrams and Specifications ................................ 346

Capture/Compare/PWM Requirements

(All CCP Modules) ............................................ 352

CLKO and I/O Requirements.................................... 348

EUSART Synchronous Receive Requirements........ 360

EUSART Synchronous Transmission

Requirements ................................................... 360

Example SPI Mode Requirements

(Master Mode, CKE = 0)................................... 353

Example SPI Mode Requirements

(Master Mode, CKE = 1)................................... 354

 2010 Microchip Technology Inc. DS39616D-page 387

PIC18F2331/2431/4331/4431

Example SPI Mode Requirements

(Slave Mode, CKE = 0) ..................................... 355

Example SPI Slave Mode Requirements

(CKE = 1).......................................................... 356

External Clock Requirements ................................... 346

Internal RC Accuracy ................................................ 347

I2C Bus Data Requirements (Slave Mode) ............... 358

I2C Bus Start/Stop Bits Requirements

(Slave Mode) .................................................... 357

PLL Clock.................................................................. 347

Reset, Watchdog Timer, Oscillator Start-up

Timer, Power-up Timer and Brown-out

Reset Requirements ......................................... 350

SSP I2C Bus Data Requirements ............................. 359

Timer0 and Timer1 External Clock

Requirements ................................................... 351

Top-of-Stack Access........................................................... 62

TSTFSZ ............................................................................ 323

Two-Speed Start-up .................................................. 263, 276

Two-Word Instructions

Example Cases........................................................... 66

TXSTA Register

BRGH Bit .................................................................. 221

T0CON Register

PSA Bit...................................................................... 129

T0CS Bit.................................................................... 129

T0PS2:T0PS0 Bits.................................................... 129

T0SE Bit.................................................................... 129

UA Bit ............................................................................... 206

Watchdog Timer (WDT)............................................ 263, 274

Associated Registers ................................................ 275

Control Register........................................................ 274

During Oscillator Failure ........................................... 277

Programming Considerations ................................... 274

WWW Address ................................................................. 387

WWW, On-Line Support ....................................................... 9

XORLW ............................................................................ 323

XORWF ............................................................................ 324

PIC18F2331/2431/4331/4431

DS39616D-page 388  2010 Microchip Technology Inc.

NOTES:

 2010 Microchip Technology Inc. DS39616D-page 389

PIC18F2331/2431/4331/4431

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PIC18F2331/2431/4331/4431

DS39616D-page 390  2010 Microchip Technology Inc.

READER RESP ONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

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DS39616DPIC18F2331/2431/4331/4431

1. What are the best features of this document?

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 2010 Microchip Technology Inc. DS39616D-page 391

PIC18F2331/2431/4331/4431

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X/XX XXX

PatternPackageTemperature

Range

Device

Device PIC18F2331/2431/4331/4431(1),

PIC18F2331/2431/4331/4431T(1,2);

VDD range 4.2V to 5.5V

PIC18LF2331/2431/4331/4431(1),

PIC18LF2331/2431/4331/44310T(1,2);

VDD range 2.0V to 5.5V

Temperature

Range I= -40C to +85C (Industrial)

E= -40C to +125C (Extended)

Package PT = TQFP (Thin Quad Flatpack)

SO = SOIC

SP = Skinny Plastic DIP

P=PDIP

ML = QFN

Pattern QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) PIC18LF4431-I/P 301 = Industrial temp.,

PDIP package, Extended VDD limits,

QTP pattern #301.

b) PIC18LF2331-I/SO = Industrial temp.,

SOIC package, Extended VDD limits.

c) PIC18F4331-I/P = Industrial temp., PDIP

package, normal VDD limits.

Note 1: F = Standard Voltage Range

LF = Wide Voltage Range

2: T = in Tape and Reel – SOIC

and TQFP Packages only.

DS39616D-page 392  2010 Microchip Technology Inc.

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08/04/10