172
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Highly reliable IC-size type
with gold contact supports automatic insertion
2 to 10 Circuits-designed Type
SSGM
SSGM780103
Japan Export
Product Line
Insertion
Reflow
Standard
Flat
Standard
Flat
Stick
1
2
3
4
Soldering Actuator
configuration Packaging style Drawing No.
SSGM120100
SSGM130100
SSGM140100
SSGM150100
SSGM160100
SSGM170100
SSGM180100
SSGM190100
SSGM1A0100
SSGM240100
SSGM260100
SSGM280100
SSGM2A0100
Taping
2
3
4
5
6
7
8
9
10
4
6
8
10
4
8
2
4
6
8
Poles
7,000
5,200
4,000
3,300
2,800
2,500
2,200
1, 9 0 0
1, 8 0 0
4,000
2,800
2,200
1, 8 0 0
3,200
800
1, 6 0 0
4,000
1,000
2,000
Minimum order unit（pcs.）
SSGM640200
SSGM680200
SSGM720101
SSGM740101
SSGM760102
Product No.
■Typical Specifications
Items Specifications
Rating （max.）/（min.）
（Resistive load）
25mA 24V DC （At opening and closing）
0.1A 50V DC （When energized） / 50μA 3V DC
Contact resistance
（Initial performance / After lifetime）
50mΩmax. / 100mΩ max.
Operating force
3.5±2.5N
Operating life
Without load
3,000 cycles
With load
3,000 cycles （25mA 24V DC）
Refer to P.175 for soldering conditions.
1, 4 0 0
1, 0 4 0
800
660
560
500
440
380
360
800
560
440
360
173
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Stick
Product No. Number of packages（pcs.）
Export package measurements
（mm）
1 stick
1 case /Japan
1 case /export packing
SSGM120100 70 1, 4 0 0 7,000
5 7 8 ×18 0 × 2 0 2
SSGM130100 52 1, 0 4 0 5,200
SSGM140100
SSGM240100 40 800 4,000
SSGM150100 33 660 3,300
SSGM160100
SSGM260100 28 560 2,800
SSGM170100 25 500 2,500
SSGM180100
SSGM280100 22 440 2,200
SSGM190100 19 380 1, 9 0 0
SSGM1A0100
SSGM2A0100 18 360 1, 8 0 0
Unit:mm
Reel size
Packing specifications
Taping
Product No. Number of packages（pcs.）
Reel width
W（mm）
Tape width
（mm）
Export package
measurements （mm）
1 reel
1 case /Japan
1 case /export packing
SSGM640200
800
1, 6 0 0 3,200 25.4 24
406×406×190
SSGM680200 800 1, 6 0 0 45.4 44
SSGM720101
SSGM740101
1,000
2,000 4,000 25.4 24
SSGM760102
1,000 2,000
33.4 32
SSGM780103 45.4 44
SSGM／2 to 10 Circuits-designed Type
174
Detector Slide Push Rotary Power
Dual-in-line
Package Type
9
9
1
1.5
2.54
0.6
1
TerminalNo.9
4
L
A
PCboardmountingface
10.7
7.62
0.25
4.5
1.2
1.2
6.8
0.8
1
0.6
2.54
1
Terminal No.9
L
4
0.8
B
A
PC board mounting face
1.2 1.2
0.25
4.5
10.7
7.62
6.8
B-B
Travel
0.8
1
B
Circuit Diagram（Viewed from Direction A）
Dimensions
Unit:mm
Style PC board mounting hole dimensions
（Viewed from direction A）
No.
1
2
3
4
12345678
9!11 !3 !4!2!0 !5 !6
N-ø1 hole
2.54 2.54 2.54
2.54 2.54 2.54
2.54
7.62
N-ø1 hole
2.54 2.54 2.54
2.54 2.54 2.54
2.54
7.62
P=2.54
11.2
7.5
1.1
P=2.54
11.2
7.5
1.1
Standard
Flat
Standard
Flat
Number of Poles and Outline Dimension（L）
Number of poles（N）
L（mm）
2
6.9 9.4 11 . 9 14 . 5 17 19 . 6 2 2 .1 24.6 2 7. 2
3 4 5 6 7 8 9 10
2 to 10 Circuits-designed Type
SSGM
171
Detector Slide Push Rotary Power
Dual-in-line
Package Type
List of Varieties
Dual In-line Package Type Switches
Series
SSGM
Photo
Operating temperature range
−40℃ to ＋85℃
Automotive use
—
Life cycle
Rating（max.）/（min.）
（Resistive load）
25mA 24V DC（At opening and closing）, 0.1A 50V DC（When energized）, 50μA 3V DC
Durability
Operating
life
Without
load
3,000 cycles
With load
3,000 cycles（25mA 24V DC）
Electrical
performance
Contact resistance
（Initial performance / After life time）
50mΩ max. / 100mΩ max.
Insulation
resistance
100MΩ min. 500V DC
Voltage proof
500V AC for 1minute　　　　　
Mechanical
performance
Terminal strength
5 N f o r 1mi n u t e
Actuator
strength
Operating
direction
10 N
Pulling
direction
10 N
Environmental
performance
Cold
−40℃ 250h
Dry heat
85℃ 250h
Damp heat
60℃, 90 to 95%RH 250h
Page
17 2
Dual In-line Package Type Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 175
Dual In-line Package Type Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 176
175
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Soldering time
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2.
Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
C
Time (s)
20 max.
E max.
Pre-heating
D max.
F
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated
conditions shall also apply to switch surface temperatures.
2.
Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
SSGM
F（s）Series（Reflow type）
250 240 ---- ----
15 0 18 0
A（℃）
3s max. B（℃） C（℃） D（s） E（s）
Dip soldering
Soldering temperature Duration of immersionPreheating temperature Preheating time
350±5℃
12 0 ℃ ma x . 90s max.
5s max.
270±5℃ 10 ±1s m a x .
Soldering temperature
Items
Reference for Hand Soldering Condition
Reference for Dip Soldering Condition
(For insertion terminal types)
Dual In-line Package Type Switches / Soldering Conditions