OLED SPECIFICATION
WEH001602ELPP5N00000
Model No:
SPECIFICATION Version: C
CUSTOMER :
MODULE NO. : WEH001602ELPP5N00000
APPROVED BY:
( FOR CUSTOMER USE ONLY )
SALES BY
APPROVED BY
CHECKED BY
PREPARED BY
ISSUED DATE:
MODLE NO：
RECORDS OF REVISION DOC. FIRST ISSUE
VERSION DATE REVISED
PAGE
NO.
SUMMARY
0
A
B
C
2010/04/20
2010/10/26
2010.12.13
2011.03.29
13
10
First issue
Correct Shift left
68 series only
Remove IC information.
1. Module Classification Information
W E H 001602 E L P P 5 N 00000
○
1 ○
2 ○
3 ○
4 ○
5 ○
6 ○
7 ○
8 ⑨ ⑩ ⑪⑫ ⑬
1 Brand：WINSTAR DISPLAY CORPORATION
2 E：OLED
3 Display Type：H→Character Type, G→Graphic Type
4 Display Font：Character 16 words, 2Lines.
5 Serials code
A：Amber R：RED
B：Blue C：Full color
G：Green W：White
6 Emitting Color
Y：Yellow Green L：Yellow
7 Polarizer P：With Polarizer; N: Without Polarizer
8 Display Mode
P：Passive Matrix ; A: Active Matrix
9 Driver Voltage 3: 3.0 V; 5: 5.0V
10 Touch Panel N：Without touch panel; T: With touch panel
11 Products type
0：Standard type
1. Sunlight Readable type
2. Transparent OLED (TOLED)
3. Flexible OLED
4. OLED for Lighting
12 Product grades
product grades:
0：Standard(A-level)
2：B-level
3：C-level
4：high class(AA-level)
5：Customer offerings
13 Serial No. Application serial number(00~ZZ)
2. General Specification
Item Dimension Unit
Number of Characters 16 characters x 2 Lines －
Module dimension 84.0 x 44.0 x 10.0(MAX) mm
View area 66.0 x 16.0 mm
Active area 56.95 x 11.85 mm
Dot size 0.55 x 0.65 mm
Dot pitch 0.60x 0.70 mm
Character size 2.95 x 5.55 mm
Character pitc h 3.6 x 6.3 mm
LCD type OLED , Yellow
Duty 1/16
3. Absolute Maximum Ratings
Item Symbol Min Max Unit Notes
Operating Temperature TOP -40 +80
℃
Storage Temperature TST -40 +80
℃
Input Voltage VI -0.3 VDD V
Supply Voltage For Logic VDD-VSS -0.3 5.3 V
4. Electrical Characteristics
Item Symbol Condition Min Typ Max Unit
Supply Voltage For Logic VDD-VSS － 3.0 5.0 5.3 V
Input High Volt. VIH － 0.9 VDD － VDD V
Input Low Volt. VIL － GND － 0.1VDD V
Output High Volt. VOH IOH=-0.5mA 0.8 VDD － VDD V
Output Low Volt. VOL IOL=0.5mA GND － 0.2 VDD V
Supply Current IDD VDD=5V － 30 － mA
CIEx(Yellow) x,y(CIE1931) 0.44 0.48 0.52
CIEy(Yellow) x,y(CIE1931) 0.46 0.50 0.54
5. Optical Characteristics
Item Symbol Condition Min Typ Max Unit
(V)θ 160 deg
View Angle (H)φ 160 deg
Contrast Ratio CR Dark 2000:1 － －
T rise － 10 µs
Response Time T fall － 10 µs
Supply Voltage For Logic 5V
50% Check Board Brightness
With polarizer
150mW(5V*30mA)
125 nits
Note1
Supply Voltage For Logic 3V
50% Check Board Brightness
With polarizer 80 nits
Notes: 1.When random texts pattern is running , averagely , at any instance , about 1/2 of pixels
will be on.
2. You can to use the display off mode to make long life.
6. Interface Pin Function
Pin No. Symbol Level Description
1 VSS 0V Ground
2 VDD 5.0V Supply Voltage for logic
3 NC －
4 RS H/L H: DATA, L: Instruction code
5 R/W H/L H: Read(MPU→Module) L: Write(MPU→Module)
6 E H,H→L Chip enable signal
7 DB0 H/L Data bit 0
8 DB1 H/L Data bit 1
9 DB2 H/L Data bit 2
10 DB3 H/L Data bit 3
11 DB4 H/L Data bit 4
12 DB5 H/L Data bit 5
13 DB6 H/L Data bit 6
14 DB7 H/L Data bit 7
15 NC －
16 NC －
7. Counter Drawing & Block Diagram
42.0
10.0Max
0.65
0.7
0.65
5.55
0.6
0.55
2.95
3.6
6.3
0.75
SCALE 5/1
DOT SIZES
66.0VA
9.0
16.0VA 7.825.2
6.4 71.2
The non-specified tolerance of dimension is ± 0.3 mm .
56.95(AA)
84.0 0.5
2-O2.5 PTH
2-O5.0 PAD
13.23
14.48
11.85(AA)
44.0 0.5
4.0 76.0
DB512
15
16
14
13
NC
NC
DB7
DB6
Vss1
DB07
11
10
8
9
DB4
DB3
DB2
DB1
4
6
5
3
2
RS
E
R/W
NC
Vdd
4.036.0
2.5
10.2 38.1
16-O1.0 PTH
2.5
79.0
2-R1.25PTH
2-R2.5PAD
1.6
5.1
1.8
8. OLED Lifetime
ITEM Conditions Typ Remark
Operating
Life Time
Ta= 25 ℃
/Initial 50% check board
brightness 125nits
100,000 Hrs Note
Notes:
1. Simulation pattern for operation test: interchanging with 50% checkboard
The brightness decay does not exceed 50%.
2. You can use the display off mode to make long life.
3.The average operating lifetime at room temperature is estimated by the accelerated operation at
high temperature conditions.
9. Reliability
Content of Reliability Test
Environmenta l Test
Test Item Content of Test Test Condition Applicable
Standard
High
Temperature
storage
Endurance test applying the high
storage temperature for a long time.
80℃
240hrs ——
High
Temperature
Operation
Endurance test applying the electric
stress (Voltage & Current) and the
thermal stress to the element for a long
time.
80℃
240hrs ——
Low
Temperature
Operation
Endurance test applying the electric
stress under low temperature for a long
time.
-40℃
240hrs ——
High
Temperature/
Humidity
Storage
Endurance test applying the high
temperature and high humidity storage
for a long time.
60 ,90%RH℃
240hrs ——
Temperature
Cycle
Endurance test applying the low and
high temperature cycle.
-40 25 80℃℃ ℃
30min 5min 30min
1 cycle
-40 /80℃℃
100 cycles ——
Mechanical Test
Vibration test Endurance test applying the vibration
during transportation and using.
10~22Hz→1.5mmp-p
22~500Hz→1.5G
Total 0.5hrs
——
Shock test
Constructional and mechanical
endurance test applying the shock
during transportation.
50G Half sign
wave 11 msedc
3 times of each
direction
——
Atmospheric
pressure test
Endurance test applying the
atmospheric pressure during
transportation by air.
115mbar
40hrs ——
Others
Static
electricity test
Endurance test applying the electric
stress to the terminal.
VS=800V,RS=1.5kΩ
CS=100pF
1 time
——
***Supply voltage for logic system=5V. Supply voltage for LCD system =Operating voltage at
25℃
Test and measurement conditions
1. All measurements shall not be started until the specimens attain to temperature stability.
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
2. All-pixels-on is used as operation test pattern.
3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/
Humidity Storage, Temperature Cycle
Evaluation criteria
1. The function test is OK.
2. No observable defects.
3. Luminance: > 50% of initial value.
4. Current consumption: within ± 50% of initial value.
APPENDIX:
RESIDUE IMAGE
Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.
10. Inspection specification
NO Item Criterion AQL
01 Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
02 Black or
white
spots on
OLED
(display
only)
2.1 White and black spots on display ≦0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within
3mm. 2.5
03 OLED
black
spots,
white
spots,
contamina
tion
(non-displ
ay)
3.1 Round type : As following drawing
Φ=( x + y ) / 2
2.5
3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
--- W≦0.02 Accept no dense
L≦3.0 0.02＜W≦0.03
L≦2.5 0.03＜W≦0.05 2
--- 0.05＜W As round type
2.5
04 Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size Φ Acceptable Q TY
Φ≦0.20 Accept no dense
0.20＜Φ≦0.50 3
0.50＜Φ≦1.00 2
1.00＜Φ 0
Tota l Q TY 3
2.5
NO Item Criterion AQL
05 Scratches Follow NO.3 OLED black spots, white spots, contamination
06 Chipped
glass
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t Not over viewing
area
x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t Not over viewing
area
x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
2.5
NO Item Criterion AQL
06 Glass
crack
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width x: Chip length z: Chip thickness
y≦0.5mm x≦1/8a 0 ＜ z ≦ t
6.2.2 Non-conductive portion:
y: Chip width x: Chip length z: Chip
thickness
y≦ L x≦1/8a 0 ＜ z ≦ t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
y≦1/3L x ≦ a
2.5
NO Item Criterion AQL
07 Cracked
glass The OLCD with extensive crack is not acceptable. 2.5
08 Backlight
elements
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
0.65
09 Bezel
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10 PCB、COB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside
the seal area on the PCB. And there should be no more
than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
11 Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
2.5
0.65
NO Item Criterion AQL
12 General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 OLED pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Check Item Classification Criteria
No Display
Major
Missing Line
Major
Pixel Short
Major
Darker Short
Major
Wrong Display
Major
Un-uniform
B/A x 100% < 70%
A/C x 100% < 70%
Major
11. Precautions in use of OLED Modules-1
Modules
(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components
of OLED module.
(3)Don’t disassemble the OLEDM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist OLEDM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
17.1 Handling Precautions
(1) Since the display panel is being made of glass, do not apply mechanical impacts such us
dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out, be
careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module, the
cell structure may be damaged and be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
Please be careful when handling the OLED display module.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent
such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Hold OLED display module very carefully when placing OLED display module into the
System housing. Do not apply excessive stress or pressure to OLED display module. And, do
not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient rigidity for the
outer cases.
(7) Do not apply stress to the LSI chips and the surrounding molded sections.
(8) Do not disassemble nor modify the OLED display module.
(9) Do not apply input signals while the logic power is off.
(10) Pay sufficient attention to the working environments when handing OLED display
modules to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when exfoliating the protective
film.
(11) Protection film is being applied to the surface of the display panel and removes the
protection film before assembling it. At this time, if the OLED display module has been stored
for a long period of time, residue adhesive material of the protection film may remain on the
surface of the display panel after removed of the film. In such case, remove the residue
material by the method introduced in the above Section 5.
(12) If electric current is applied when the OLED display module is being dewed or when it is
placed under high humidity environments, the electrodes may be corroded and be careful to
avoid the above.
8.2 Storage Precautions
(1) When storing OLED display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding
high temperature and high humidity environment or low temperature (less than 0°C)
environments.
(We recommend you to store these modules in the packaged state when they were shipped
from Winstar Technology Inc.
At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur
with them.
(2) If electric current is applied when water drops are adhering to the surface of the OLED
display module, when the OLED display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful about the above.
8.3 Designing Precautions
(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED
display module, and if these values are exceeded, panel damage may be happen.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specifications and, at the same time, to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power
circuit (VDD). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
(5) As for EMI, take necessary measures on the equipment side basically.
(6) When fastening the OLED display module, fasten the external plastic housing section.
(7) If power supply to the OLED display module is forcibly shut down by such errors as taking
out the main battery while the OLED display panel is in operation, we cannot guarantee the
quality of this OLED display module.
* Connection (contact) to any other potential than the above may lead to rupture of the IC.
8.4 Precautions when disposing of the OLED display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic laws
and regulations.
8.5 Other Precautions
(1) When an OLED display module is operated for a long of time with fixed pattern may remain as
an after image or slight contrast deviation may occur.
Nonetheless, if the operation is interrupted and left unused for a while, normal state can be
restored. Also, there will be no problem in the reliability of the module.
(2) To protect OLED display modules from performance drops by static electricity rapture, etc., do
not touch the following sections whenever possible while handling the OLED display modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(3) With this OLED display module, the OLED driver is being exposed. Generally speaking,
semiconductor elements change their characteristics when light is radiated according to the
principle of the solar battery. Consequently, if this OLED driver is exposed to light, malfunctioning
may occur.
* Design the product and installation method so that the OLED driver may be shielded from light in
actual usage.
* Design the product and installation method so that the OLED driver may be shielded from light
during the inspection processes.
(4) Although this OLED display module stores the operation state data by the commands and the
indication data, when excessive external noise, etc. enters into the module, the internal status
may be changed. It therefore is necessary to take appropriate measures to suppress noise
generation or to protect from influences of noise on the system design.
(5) We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.
(6)Resistors,capacitors and other passive components will have different appearance and color
caused by the different supplier.
(7)Our company will has the right to upgrade and modify the product function.
