TD62594AFNG(5) - TOSHIBA - Datasheet.Live

TD62593,594,597,598AFNG

2007-07-23

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62593AFNG, TD62594AFNG, TD62597AFNG, TD62598AFNG

8CH SINGLE DRIVER : COMMON EMITTER

The TD62593, 4, 7, 8AFNG are comprised of eight NPN

Transistor Arrays.

Applications include relay, hammer, lamp and display (LED)

drivers.

The suffix (G) appended to the part number represents a Lead

(Pb)-Free product.

Features

z¢Package Type : SSOP18pin (0.65 mm pitch)

z¢High Sustaining Voltage Output : 50 V (MIN)

z¢Low Saturation Voltage : VCE (sat) = 0.8 V

@IOUT = 150 mA·Inputs Compatible with Various type Logic.

TD62593, TD62597AFNG : RIN = 2.7 kΩ TTL, 5 V CMOS

TD62594, TD62598AFNG : RIN = 10.5 kΩ 6~15 V PMOS, CMOS

Pin Connection (top view)

TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG

Schematics (each driver)

TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Weight: 0.09 g (typ.)

TD62593AFNGRIN=2.7kΩ

TD62594AFNG RIN=10.5k

TD62597AFNGRIN=2.7kΩ

TD62598AFNG RIN=10.5k

TD62593,594,597,598AFNG

2007-07-23

Absolute Maximum Ratings (Ta = 25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Collector−Emitter Voltage VCEO 50 V

Collector−Base Voltage VCBO 50 V

Clamp Diode Reverse Voltage VR (Note 1) 50 V

Collector Current IC 200 mA / ch

Input Voltage VIN −0.5~30 V

Power Dissipation PD (Note 2) 0.96 W

Operating Temperature Topr −40~85 °C

Storage Temperature Tstg −55~150 °C

Note 1: Except TD62593AFNG, TD62594AFNG

Note 2: On Glass Epoxy PCB (50 × 50 ×1.6 mm Cu 40%)

Recommended Operating Conditions (Ta = −40~85°C)

CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT

Collector−Emitter Voltage VCEO 0 ― 50 V

Collector−Base Voltage VCBO 0 ― 50 V

Collector Current IC 0 ― 150 mA /

Clamp Diode Reverse Voltage VR (Note 1) 7 ― 50 V

Input Voltage VIN 0 ― 25 V

Input Current IIN 0 ― 10 mA

TD62593AFNG

TD62597AFNG 2.4 ― 25

Input Voltage

(Output On) TD62594AFNG

TD62598AFNG

VIN (ON)

7.0 ― 25

Power Dissipation PD (Note 2) ― ― 0.4 W

Note 1: Except TD62593AFNG, TD62594AFNG

Note 2: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)

Electrical Characteristics (Ta = 25°C)

CHARACTERISTIC SYMBOL

TEST

CIR−

CUIT

TEST CONDITION MIN TYP. MAX UNIT

Output Leakage Current ICEX 1 VCE = 50 V, VIN = 0 ― ― 10 µA

IC = 10 mA, IIN = 0.4 mA ― ― 0.2

Output Saturation Voltage VCE (sat) 2

IC = 150 mA, IIN = 3.0 mA ― ― 0.8

DC Current Transfer Ratio hFE 2 VCE = 10 V, IC = 10 mA 50 ― ―

TD62593AFNG

TD62597AFNG VIN = 2.4 V, IC = 50 mA ― ― 0.9

Input Current

TD62594AFNG

TD62598AFNG

IIN (ON) 3

VIN = 7.0 V, IC = 50 mA ― ― 0.9

Turn−On Delay tON ― 0.1 ―

Turn−Off Delay tOFF

4 VOUT = 50 V, RL = 330 Ω

― 0.3 ―

µs

TD62593,594,597,598AFNG

2007-07-23

Test Circuit

1. ICEX 2. hFE, VCE (sat) 3. IIN (ON)

4. tON, tOFF

Note 1: Pulse Width 50 µs, Duty Cycle 10%

Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Note 2: See below

Input Condition

TYPE NUMBER RIN VIH

TD62593AFNG, TD62597AFNG 0 Ω 3 V

TD62594AFNG, TD62598AFNG 0 Ω 10 V

Note 3: CL includes probe and jig capacitance

Precautions for Using

This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.

Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that

excess current or voltage will not be applied to the IC.

Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to

short−circuit between outputs, air contamination fault, or fault by improper grounding.

TD62593,594,597,598AFNG

2007-07-23

TD62593AFNG

TD62597AFNG

TD62594AFNG

TD62598AFNG

TD62593,594,597,598AFNG

2007-07-23

Package Dimensions

SSOP18−P−225−0.65 Unit: mm

Weight: 0.09 g (Typ.)

TD62593,594,597,598AFNG

2007-07-23

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

TD62593,594,597,598AFNG

2007-07-23

Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In

addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

TD62593,594,597,598AFNG

2007-07-23

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

RESTRICTIONS ON PRODUCT USE 060116EBA

• The information contained herein is subject to change without notice. 021023_D

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc. 021023_A

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk. 021023_B

• The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of

TOSHIBA or others. 021023_C

• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E