1
SEMICONDUCTORS
ZXM64P03X
ISSUE 1 - OCTOBER 2005
30V P-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
V(BR)DSS=-30V; RDS(ON)=0.075 ID=-3.8A
DESCRIPTION
This new generation of high density MOSFETs from Zetex utilizes a unique
structure that combines the benefits of low on-resistance with fast switching
speed. This makes them ideal for high efficiency, low voltage, power
management applications.
FEATURES
•Low on-resistance
•Fast switching speed
•Low threshold
•Low gate drive
•Low profile SOIC package
APPLICATIONS
•DC - DC converters
•Power management functions
•Disconnect switches
•Motor control
ORDERING INFORMATION
DEVICE REEL SIZE
(inches)
TAPE WIDTH
(mm)
QUANTITY
PER REEL
ZXM64P03XTA 7 12 embossed 1,000
ZXM64P03XTC 13 12 embossed 4,000
DEVICE MARKING
ZXM4P03
MSOP8
S
S
S
G
D
D
D
D
1
Pin out
Top view
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
2
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a) RθJA 113 °C/W
Junction to Ambient (b) RθJA 70 °C/W
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDSS -30 V
Gate- Source Voltage VGS ⫾20 V
Continuous Drain Current
(VGS=4.5V; TA=25°C)(b)
(VGS=4.5V; TA=70°C)(b)
ID-3.8
-3.0
A
Pulsed Drain Current (c) IDM -19 A
Continuous Source Current (Body Diode)(b) IS-2.3 A
Pulsed Source Current (Body Diode)(c) ISM -19 A
Power Dissipation at TA=25°C(a)
Linear Derating Factor
PD1.1
8.8
W
mW/°C
Power Dissipation at TA=25°C(b)
Linear Derating Factor
PD1.8
14.4
W
mW/°C
Operating and Storage Temperature Range Tj:Tstg -55 to +150 °C
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
3
CHARACTERISTICS
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
4
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS
STATIC
Drain-Source Breakdown Voltage V(BR)DSS -30 V ID=-250µA, VGS=0V
Zero Gate Voltage Drain Current IDSS -1 µAVDS=-30V, VGS=0V
Gate-Body Leakage IGSS ±100 nA VGS=±20V, VDS=0V
Gate-Source Threshold Voltage VGS(th) -1.0 V ID=-250µA,
VDS=V
GS
Static Drain-Source On-State Resistance
(1)
RDS(on) 0.075
0.100
Ω
Ω
VGS=-10V, ID=-2.4A
VGS=-4.5V, ID=-1.2A
Forward Transconductance (3) gfs 2.3 S VDS=-10V,ID=-1.2A
DYNAMIC (3)
Input Capacitance Ciss 825 pF
VDS=-25 V, VGS=0V,
f=1MHz
Output Capacitance Coss 250 pF
Reverse Transfer Capacitance Crss 80 pF
SWITCHING(2) (3)
Turn-On Delay Time td(on) 4.4 ns
VDD =-15V, ID=-2.4A
RG=6.2Ω,R
D=6.2Ω
(Refer to test
circuit)
Rise Time tr6.2 ns
Turn-Off Delay Time td(off) 40 ns
Fall Time tf29.2 ns
Total Gate Charge Qg46 nC
VDS=-24V,VGS=-10V,
ID=-2.4A
(Refer to test
circuit)
Gate-Source Charge Qgs 9nC
Gate Drain Charge Qgd 11.5 nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1) VSD -0.95 V Tj=25°C, IS=-2.4A,
VGS=0V
Reverse Recovery Time (3) trr 30.2 ns Tj=25°C, IF=-2.4A,
di/dt= 100A/µs
Reverse Recovery Charge(3) Qrr 27.8 nC
NOTES:
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
5
TYPICAL CHARACTERISTICS
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
6
TYPICAL CHARACTERISTICS
ZXM64P03X
SEMICONDUCTORS
ISSUE 1 - OCTOBER 2005
7
Europe
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park
Chadderton, Oldham, OL9 9LL
United Kingdom
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
© Zetex Semiconductors plc 2005
1
ec
EE1
D
bA1
A
A2
R1
R
L
PACKAGE DETAILS
1.02
0.040
4.8
0.189
0.41
0.016 0.65
0.023
mm
inches
PAD LAYOUT DETAILS
DIM Millimeters Inches
MIN MAX MIN MAX
A 0.91 1.11 0.036 0.044
A1 0.10 0.20 0.004 0.008
B 0.25 0.36 0.010 0.014
C 0.13 0.18 0.005 0.007
D 2.95 3.05 0.116 0.120
e 0.65NOM 0.0256
e1 0.33NOM 0.0128
E 2.95 3.05 0.116 0.120
H 4.78 5.03 0.188 0.198
L 0.41 0.66 0.016 0.026
°0° 6° 0° 6°
PACKAGE DIMENSIONS
