1©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
General Description
The 87946I-147 is a low skew, ÷1, ÷2 LVCMOS/LVTTL Fanout
Buffer . The 87946I-147 has two selectable single ended clock inputs.
The single ended clock inputs accept LVCMOS or LVTTL input
levels. The low impedance LVCMOS/LVTTL outputs are designed to
drive 50 series or parallel terminated transmission line s . The
effective fanout can be increased from 10 to 20 by utilizing the ability
of the outputs to drive two series terminated lines.
The divide select inputs, DIV_SELx , control the output frequency of
each bank. The outputs can be utilized in the ÷1, ÷2 or a combination
of ÷1 and ÷2 modes. The master reset input, MR/nOE, resets the
internal freque ncy dividers and also controls the active and high
impedance states of all outputs.
The 87946I-147 is characterized at full 3.3V for input VDD, and mixed
3.3V and 2.5V for output operating supply mode. Guaranteed bank,
output and part-to-part skew characteristics make the 87946I-147
ideal for those clock distribution applications demanding well defined
performance and repeatability.
Features
Ten single ended LVCMOS/LVTTL outputs,
7 typical output impedance
Selectable LVCMOS/LVTTL CLK0 and CLK1 inputs
CLK0 and CLK1 can accept the following inp ut levels:
LVCMOS and LVTTL
Maximum input frequency: 250MHz
Bank skew: 30ps (maximum)
Output skew: 175ps (maximum)
Part-to-part skew: 850ps (maximum)
Multiple frequency skew: 200ps (maximum)
3.3V core, 3.3V or 2.5V output supply modes
-40°C to 85°C ambient operating temperature
Lead-free packaging
Block Diagram Pin Assignment
87946I-147
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
CLK0
CLK_SEL
CLK1
DIV_SELA
QA[0:2]
0
1
0
1
÷1
÷2
Pullup
Pullup
Pullup
Pulldown
Pulldown
DIV_SELB
DIV_SELC
QC[0:3]
0
1
Pulldown
MR/nOE Pulldown
QB[0:2]
0
1
0
1
Pulldown
3
3
4
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
CLK_SEL
VDD
CLK0
CLK1
D
IV_SELA
D
IV_SELB
D
IV_SELC
GND
GN
D
QB
0
VDD
B
QB
1
GN
D
QB
2
VDD
B
VDD
C
V
DDC
QC0
G
ND
QC1
V
DDC
QC2
G
ND
QC3
GND
QA0
VDDA
QA1
GND
QA2
VDDA
M
R/nOE
1-to-10 Low Skew, 1, 2 LVCMOS/LVTTL
2.5V, 3.3V Fanout Buffer 87946I-147
Datasheet
2©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Pin Descriptions and Characteristics
Table 1. Pin Descriptions
NOTE: Pullup and Pulldown refer to internal input resisto rs. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Number Name Type Description
1 CLK_SEL Input Pulldown Clock select input. When HIGH, selects CLK1.
When LOW, selects CLK0. LVCMOS / LVTTL interface levels.
2V
DD Power Positive supply pin.
3, 4 CLK0, CLK1 Input Pullup Single-ended clock inputs. LVCMOS/LVTTL interface levels.
5 DIV_SELA Input Pulldown Controls frequency division for Bank A outp uts. See Table 3
LVCMOS/LVTTL interface levels.
6 DIV_SELB Input Pulldown Controls frequency division for Bank B outputs. See Table 3.
LVCMOS/LVTTL interface levels.
7 DIV_SELC Input Pulldown Controls frequency division for Bank C outputs. See Table 3.
LVCMOS/LVTTL interface levels.
8, 11 , 15, 20,
24, 27, 31 GND Power Power supply ground.
9, 13, 17 VDDC Power Output supply pins for Bank C outputs.
10, 12,
14, 16 QC0, QC1,
QC2, QC3 Output Single-ended Bank C clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
18, 22 VDDB Power Output supply pins for Bank B outputs.
19,
21, 23 QB2,
QB1, QB0 Output Single-ended Bank B clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
25, 29 VDDA Power Output supply pins for Bank A outputs.
26,
28, 30 QA2,
QA1, QA0 Output Single-ended Bank A clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
32 MR/nOE Input Pulldown
Active HIGH Master Reset. Active LOW Output Enable. When logic HIGH,
the internal dividers are reset and the outputs are (High-Impedance). When
logic LOW, the internal dividers and the outputs are enabled. See Table 3.
LVCMOS/LVTTL interface levels.
Symbol Parameter Tes t Conditio ns Minimum Typical Maximum Units
CIN Input Capacitance 4pF
CPD
Power Dissipation Capacitance
V
DD
= V
DDA
= V
DDB
= V
DDC
= 3.6V
25 pF
RPULLUP Input Pullup Resistor 51 k
RPULLDOWN Input Pulldown Resistor 51 k
ROUT Output Impedance 7
3©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Function Tables
Table 3. Clock Input Function Table
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress
specifications only. Functional operation of the product at these conditions or any conditions beyond those listed in the DC Characteristics or
AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = VDDA = VDDB = VDDC = 3.3V ± 0.3V, TA = -40°C to 85°C
Inputs Outputs
MR/nOE DIV_SELA DIV_SELB DIV_SELC QA0:QA2 QB0:QB2 QC0:QC3
1 X X X High-Impedance High-Impedance High-Impedance
00XXf
IN/1 Active Active
01XXf
IN/2 Active Active
0 X 0 X Active fIN/1 Active
0 X 1 X Active fIN/2 Active
0 X X 0 Active Active fIN/1
0 X X 1 Active Active fIN/2
Item Rating
Supply Voltage, VDD 4.6V
Inputs, VI-0.5V to VDD + 0.5V
Outputs, VO -0.5V to VDDX+ 0.5V
Package Thermal Impedance, JA 47.9C/W (0 lfpm)
Storage Temp erature, TSTG -65C to 150C
Junction Temperature 125°C
Symbol Parameter Tes t Conditio ns Minimum Typical Maximum Units
VDD Positive Supply Voltage 3.0 3.3 3.6 V
VDDA, VDDB, VDDC Output Supply Voltage 3.0 3.3 3.6 V
IDD Power Supply Current 55 mA
IDDA, IDDB, IDDC Output Supply Current 23 mA
4©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Table 4B. Power Supply DC Characteristics, VDD = 3.3V ± 5%, VDDA = VDDB = VDDC = 2.5V ± 5%, TA = -40°C to 85°C
Table 4C. LVCMOS/LVTTL DC Characteristics, VDD = VDDA = VDDB = VDDC = 3.3V ± 0.3V, TA = -40°C to 85°C
NOTE 1: Outputs terminated with 50 to VDDx/2. See Parameter Measurement Information section. Load Test Circuit diagrams.
Symbol Parameter Tes t Conditio ns Minimum Typical Maximum Units
VDD Positive Supply Voltage 3.135 3.3 3.465 V
VDDA, VDDB, VDDC Output Supply Voltage 2.375 2.5 2.625 V
IDD Power Supply Current 55 mA
IDDA, IDDB, IDDC Output Supply Current 22 mA
Symbol Parameter Te st Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL
Input
Low
Voltage
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL -0.3 0.8 V
CLK0, CLK1 -0.3 1.3 V
IIH
Input
High
Current
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL VDD = VIN = 3.6V 150 µA
CLK0, CLK1 VDD = VIN = 3.6V 5 µA
IIL
Input
Low
Current
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL VDD = 3.6V, VIN = 0V -5 µA
CLK0, CLK1 VDD = 3.6V, VIN = 0V -150 µA
VOH Output High Voltage; NOTE 1 VDDA = VDDB = VDDC = 3.6V 2.6 V
VOL Output Low Voltage; NOTE 1 VDDA = VDDB = VDDC = 3.63V 0.5 V
IOZL Output Hi-Z Current Low VDDA = VDDB = VDDC = 3. 63V -5 µA
IOZH Output Hi-Z Current High VDDA = VDDB = VDDC = 3.63V 5 µ A
5©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Table 4D. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V ± 5%, VDDA = VDDB = VDDC = 2.5V ± 5%, TA = -40°C to 85°C
NOTE 1: Outputs terminated with 50 to VDDx/2. See Parameter Measurement Information section. Load Test Circuit diagrams.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL
Input
Low
Voltage
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL -0.3 0.8 V
CLK0, CLK1 -0.3 1.3 V
IIH
Input
High
Current
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL VDD = VIN = 3.465V 150 µA
CLK0, CLK1 VDD = VIN = 3.465V 5 µA
IIL
Input
Low
Current
MR/nOE,
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL VDD = 3.465V, VIN = 0V -5 µA
CLK0, CLK1 VDD = 3.465V, VIN = 0V -150 µA
VOH Output High Voltage;
NOTE 1 VDDA = VDDB = VDDC = 2.625V 1.8 V
VOL Output Low Voltage; NOTE 1 VDDA = VDDB = VDDC = 2.625V 0.5 V
IOZL Output Hi-Z Current Low VDDA = VDDB = VDDC = 2.625V -5 µA
IOZH Output Hi-Z Current High VDDA = VDDB = VDDC = 2.625V 5 µA
6©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
AC Electrical Characteristics
Table 5A. AC Characteristics, VDD = VDDA = VDDB = VDDC = 3.3V ± 0.3V, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed ov er the specified ambient operating temperature range, which is established when the device
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
NOTE 1: Measured from VDD/2 of the input to VDDX/2 of the output.
NOTE 2: Defined as skew within a bank of ou tputs at the same supply voltage and with eq ual load conditions.
NOTE 3: Defined as skew across banks of outputs at the same supply voltage and with equal load conditions. Measured at VDDX/2.
NOTE 4: Defined as skew across banks of outputs operating at different frequencies with the same supply voltage and equal load conditions.
NOTE 5: Defined as skew between outputs on different devices operating at the same supply voltage and with equal load conditions. Using
the same type of inputs on each device, the outputs are measured at VDDX/2.
NOTE 6: These parameters are guaranteed by characterization. Not tested in production.
NOTE 7: This parameter is defined in accordance with JEDEC Standard 65.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fMAX Output Frequency 250 MHz
tPD Propagation Delay;
NOTE 1 ƒ 250MHz 2 5 ns
tsk(b) Bank Skew, NOTE 2, 7 Measured on rising edge at VDDX/2 30 ps
tsk(o) Output Skew; NOTE 3, 7 M easured on rising edge at VDDX/2 175 ps
tsk(w) Multiple Frequency Skew;
NOTE 4, 7 Measured on rising edge at VDDX/2 275 ps
tsk(pp) Part-to-Part Skew;
NOTE 5, 7 Measured on rising edge at VDDX/2 850 ps
tR / tFOutput Rise/Fall Time; NOTE 6 20% to 80% 400 950 ps
tPW Output Pulse Width tPERIOD/2 - 1 tPERIOD/2 tPERIOD/2 + 1 %
tEN Output Enable Time;
NOTE 6 ƒ = 10MHz 3 ns
tDIS Output Disable Time; NOTE 6 ƒ = 10MHz 3 ns
7©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Table 5B. AC Characteristics, VDD = 3.3V ± 5%, VDDA = VDDB = VDDC = 2.5V ± 5%, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed ov er the specified ambient operating temperature range, which is established when the device
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
NOTE 1: Measured from VDD/2 of the input to VDDX/2 of the output.
NOTE 2: Defined as skew within a bank of ou tputs at the same supply voltage and with eq ual load conditions.
NOTE 3: Defined as skew across banks of outputs at the same supply voltage and with equal load conditions. Measured at VDDX/2.
NOTE 4: Defined as skew across banks of outputs operating at different frequencies with the same supply voltage and equal load conditions.
NOTE 5: Defined as skew between outputs on different devices operating at the same supply voltage and with equal load conditions. Using
the same type of inputs on each device, the outputs are measured at VDDX/2.
NOTE 6: These parameters are guaranteed by characterization. Not tested in production.
NOTE 7: This parameter is defined in accordance with JEDEC Standard 65.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fMAX Output Frequency 250 MHz
tPD Propagation Delay;
NOTE 1 ƒ 250MHz 2 5 ns
tsk(b) Bank Skew, NOTE 2, 7 Measured on rising edge at VDDX/2 35 ps
tsk(o) Output Skew; NOTE 3, 7 M easured on rising edge at VDDX/2 175 ps
tsk(w) Multiple Frequency Skew;
NOTE 4, 7 Measured on rising edge at VDDX/2 200 ps
tsk(pp) Part-to-Part Skew;
NOTE 5, 7 Measured on rising edge at VDDX/2 875 ps
tR / tFOutput Rise/Fall Time; NOTE 6 20% to 80% 400 950 ps
tPW Output Pulse Width tPERIOD/2 - 1 tPERIOD/2 tPERIOD/2 + 1 %
tEN Output Enable Time;
NOTE 6 ƒ = 10MHz 3 ns
tDIS Output Disable Time; NOTE 6 ƒ = 10MHz 3 ns
8©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Parameter Measurement Information
3.3V Core/3.3V Output Load AC Test Circuit
Output Skew
Bank Skew
3.3V Core/2.5V Output Load AC Test Circuit
Part-to-Part Skew
Multiple Frequency Skew
SCOPE
Qx
GND
1.65V±0.15V
-1.65V±0.15V
VDD,
VDDA,
VDDB,
VDDC
tsk(o)
VDDO
2
VDDO
2
Qx
Qy
tsk(b)
VDDx
2
VDDx
2
Where X = Bank A, B or C
QX0:QXx
QX0:QXx
SCOPE
Qx
GND
-1.25V± 5%
VDD
1.25V± 5%
2.05V± 5%
VDDA,
VDDB, VDDC
tsk(pp)
VDDO
2
VDDO
2
Part 1
Part 2
Qx
Qy
tsk(ω)
QBx, QCx
QAx
9©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Parameter Measurement Information, continued
tPW & tPERIOD
Output Rise/Fall Time
Propagation Delay
tPW
tPERIOD
VDDx
2
VDDx
2VDDx
2
tPW
tPERIOD
odc =
QAx,
QBx, QCx
QAx,
QBx, QCx
tPD
VDDx
2
VDDx
2
CLK0, CLK1
QAx,
QBx, QCx
10©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Applications Information
Recommendations for Unused Input and Output Pins
Inputs:
LVCMOS Control Pins
All control pins have internal pulldowns; additional resistance is not
required but can be added for additional protection. A 1k resistor
can be used.
CLK Inputs
For applications not requiring the use of a clock input, it can be left
floating. Though not required, but for additional protection, a 1k
resistor can be tied from the CLK input to ground.
OUTputs:
LVCMOS Outputs
All unused LVCMOS output can be left floating. There should be no
trace attached.
Reliability Information
Table 6. JA vs. Air Flow Table for a 32-Lead LQFP
Tr ansistor Count
The transistor count for 87946I-147 is: 1204
Pin compatible to the MPC9446 and MPC946
JA vs. Air Flow
Linear Feet per Minute 0200500
Single-Layer PCB, JEDEC Standard Te st Boards 67.8°C/W 55.9°C/W 50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
11©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Package Outline and Package Dimensions
Package Outline - Y Suffix for 32-Lead LQFP
Table 7. Package Dimensions for 32-Lead LQFP
Reference Document: JEDEC Publication 95, MS-026
JEDEC Variation: BBC - HD
All Dimensions in Millimeters
Symbol Minimum Nominal Maximum
N32
A1.60
A1 0.05 0.10 0.15
A2 1.35 1.40 1.45
b0.30 0.37 0.45
c0.09 0.20
D & E 9.00 Basic
D1 & E1 7.00 Basic
D2 & E2 5.60 Ref.
e0.80 Basic
L0.45 0.60 0.75
ccc 0.10
12©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Ordering Information
Table 8. Ordering Information
Part/Order Number Marking Package Shipping Packaging Temperature
87946AYI-147LF ICS7946AI147L “Lead-Free” 32-Lead LQFP Tray -40C to 85C
87946AYI-147LFT ICS7946AI147L “Le ad-Free” 32-Lead LQFP Tape & Reel -40C to 85C
87946AYI-147LF/W ICS7946AI147L “Lead-Free” 32-Lead LQFP Tape & Reel,
Pin1 Orientation: EIA-481-D -40C to 85C
13©2016 Inte grate d Dev ice T echno logy, Inc. Revision C, S eptemb er 1 9, 2 016
87946I-147 D ata sheet
Revision History Sheet
Rev Table Page Description of Change Date
A
T2
T8
1
2
8
10
12
Features se cti on ad ded Lead-Free bullet.
Pin Description Table - corrected description for V DDA, VDDB and VDDC.
Parameter Measurement Information Section - added part-to-part skew, bank
skew, and multiple frequency ske w diagrams.
Application Section - added Recommendations for Unused Input and Output Pins.
Ordering Information Table - added lead-free marking.
Updated format throughout the datasheet.
7/22/08
A
T5A - T5B
T8 6 - 7
12 AC Tables - added thermal note.
Ordering Information Table - corrected the Part/Order Numbers and corrected the
non-LF marking.
Updated Header/Footer of the datasheet.
8/7/09
A T8 12 Removed leaded orderable parts from Ordering Information table 11/15/12
AT8 12
14 Ordering Information Table - Added 87946AYI-147LF/W Ordering option.
Updated Technical Support Contact Info to: clocks@idt.com 4/30/14
B3 Absolute Maximum Ratings Table - added Junction Temperature.
Updated datasheet header/footer.
Deleted “ICS” prefix from part number. 2/24/16
C1 Corrected datashe et title.
Corrected General Description, first sentence from Clock Generator to Fanout
Buffer.
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this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined
in the indepe ndent stat e and are n ot gua rant eed to per form th e same w ay when insta lled i n cu stomer p rodu cts. The info rmati on con tain ed he re in is provi ded with out rep resen tati on or wa rranty o f a ny kin d, w hethe r
express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantabil ity, or n on-infrin gement of th e intell ectual prop erty righ ts of others . This
document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in applications involving extreme environmental cond it ions or in life suppo rt systems o r similar devices where the fa ilu re or malfun ctio n of an IDT product can be rea son ab ly
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
While the information presented herein has been ch ecked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or
other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications, such as
those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any
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Integrated Device Te chn olog y, IDT and the IDT logo are reg i stered tr ad em ar ks o f IDT. Product specification subj e ct to cha ng e w ith out notice. Other trade mar ks an d service marks used he re in , i n clu di ng protected
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