NO – Normally open
NC Normally closed
DBV OR DCK PACKAGE
(TOP VIEW)
NO IN
V+
COM
GND
NC
1
2
3 4
6
5
YZP PACKAGE
(BOTTOM VIEW)
NC
NO
GND
3
1
2
A1
B1
C1 COM
IN
V+
4
6
5
A2
B2
C2
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
1-SPDT ANALOG SWITCH
5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
Check for Samples: TS5A3159A
1FEATURES APPLICATIONS
Cell Phones
Isolation in Power-Down Mode, V+= 0 PDAs
Pin Compatible With TS5A3159 Portable Instrumentation
Specified Break-Before-Make Switching Audio and Video Signal Routing
Low On-State Resistance (1 Ω) Low-Voltage Data Acquisition Systems
Control Inputs Are 5.5-V Tolerant Communication Circuits
Low Charge Injection Modems
Excellent On-State Resistance Matching Hard Drives
Low Total Harmonic Distortion (THD) Computer Peripherals
1.65-V to 5.5-V Single-Supply Operation Wireless Terminals and Peripherals
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Performance Tested Per JESD
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
DESCRIPTION
The TS5A3159A is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers low on-state resistance and excellent on-state resistance matching with the
break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to
another. The device has an excellent total harmonic distortion (THD) performance and consumes very low
power. These features make this device suitable for portable audio applications.
FUNCTION TABLE
NC TO COM, NO TO COM,
IN COM TO NC COM TO NO
L ON OFF
H OFF ON
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
SUMMARY OF CHARACTERISTICS(1)
2:1 Multiplexer/
Configuration Demultiplexer
(1 × SPDT)
Number of channels 1
On-state resistance (ron) 1.1
On-state resistance match (Δron) 0.1
On-state resistance flatness (ron(flat)) 0.15
Turn-on/turn-off time (tON/tOFF) 20 ns/15 ns
Break-before-make time (tBBM) 12 ns
Charge injection (QC) –20 pC
Bandwidth (BW) 100 MHz
OFF isolation (OISO) –65 dB at 1 MHz
Crosstalk (XTALK) –66 dB at 1 MHz
Total harmonic distortion (THD) 0.01%
Leakage current (INO(OFF)/INC(OFF)) ±20 nA
Power-supply current (I+) 50 nA
Package options 6-pin DBV, DCK, or YZP
(1) V+= 5 V, TA= 25°C
ORDERING INFORMATION(1)
ORDERABLE TOP-SIDE
TAPACKAGE(2) PART NUMBER MARKING(3)
NanoFree™ WCSP (DSBGA) Reel of 3000 TS5A3159AYZPR _ _ _JJ_
0.23-mm Large Bump YZP (Pb-free)
–40°C to 85°C SOT (SOT-23) DBV Reel of 3000 TS5A3159ADBVR JAJ_
SOT (SC-70) DCK(3) Reel of 3000 TS5A3159ADCKR JJ_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
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TS5A3159A
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SCDS200C AUGUST 2005REVISED MAY 2010
Absolute Minimum and Maximum Ratings(1) (2)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
V+Supply voltage range(3) –0.5 6.5 V
VNO,
VNC Analog voltage range(3) (4) (5) –0.5 V++ 0.5 V
VCOM
IKAnalog port diode current VN C, VNO, VCOM < 0 –50 mA
IN O,On-state switch current VNO, VN C, VCOM = 0 to V+200 200 mA
IN C,
ICOM On-state peak switch current(6) VNO, VN C, VCOM = 0 to V+–400 400 mA
VIDigital input voltage range(3) (4) –0.5 6.5 V
IIK Digital input clamp current VI< 0 –50 mA
I+Continuous current through V+100 mA
IGND Continuous current through GND –100 100 mA
DBV package 165
qJA Package thermal impedance(7) DCK package 259 °C/W
YZP package 123
DBV or DCK package 150
TAAbsolute maximum operating temperature(8) °C
YZP package 125
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Pulse at 1-ms duration <10% duty cycle
(7) The package thermal impedance is calculated in accordance with JESD 51-7.
(8) The lifetime of the device will be reduced if the device operates continually at this temperature.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Electrical Characteristics for 5-V Supply(1)
V+= 4.5 V to 5.5 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,0 V+V
range VNC 25°C 0.8 1.1
0(VNO or VNC)V+, Switch on,
Peak on resistance rpeak 4.5 V
ICOM = –100 mA, See Figure 15 Full 1.5
25°C 0.7 0.9
On-state VNO or VNC = 2.5 V, Switch on,
ron 4.5 V
resistance ICOM = –100 mA, See Figure 15 Full 1.1
On-state 25°C 0.05 0.1
VNO or VNC = 2.5 V, Switch on,
resistance match Δron 4.5 V
ICOM = –100 mA, See Figure 15 Full 0.1
between channels 0(VNO or VNC)V+, Switch on, 25°C 0.15
ICOM = –100 mA, See Figure 15
On-state ron(flat) 4.5 V
resistance flatness 25°C 0.1 0.25
VNO or VNC = 1 V, 1.5 V, 2.5 V, Switch on,
ICOM = –100 mA, See Figure 15 Full 0.25
VNC or VNO = 1 V, VCOM = 1 V to 4.5 V, 25°C –20 2 20
INC(OFF), Switch off,
or 5.5 V nA
INO(OFF) See Figure 16 Full –100 100
NC, NO VNC or VNO = 4.5 V, VCOM = 1 V to 4.5 V,
off leakage current 25°C –1 0.2 1
INC(PWROFF), VNC or VNO = 0 to 5.5 V, Switch off, 0 V mA
INO(PWROFF) VCOM = 5.5 V to 0, See Figure 16 Full –20 20
VNC or VNO = 1 V, VCOM = Open, 25°C –20 2 20
NC, NO INC(ON), Switch on,
or 5.5 V nA
on leakage current INO(ON) See Figure 17 Full –100 100
VNC or VNO = 4.5 V, VCOM = Open, 25° –1 0.1 1
COM VNC or VNO = 0 to 5.5 V, Switch off,
ICOM(PWROFF) 0 V mA
off leakage current VCOM = 5.5 V to 0, See Figure 16 Full –20 20
VNC or VNO = Open, VCOM = 1 V, 25°C –20 2 20
COM Switch on,
ICOM(ON) or 5.5 V nA
on leakage current See Figure 17 Full –100 100
VNC or VNO = Open, VCOM = 4.5 V,
Digital Input (IN)
Input logic high VIH Full 2.4 5.5 V
Input logic low VIL Full 0 0.8
25°C 5.5 V –2 2
Input leakage IIH, IIL VI= 5.5 V or 0 nA
current Full 100 100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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TS5A3159A
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SCDS200C AUGUST 2005REVISED MAY 2010
Electrical Characteristics for 5-V Supply(1) (Continued)
V+= 4.5 V to 5.5 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Dynamic
25°C 5 V 1 12 30
VCOM = V+, CL= 35 pF,
Turn-on time tON ns
4.5 V to
RL= 50 , See Figure 19 Full 1 35
5.5 V
25°C 5 V 1 5 20
VCOM = V+, CL= 35 pF,
Turn-off time tOFF ns
4.5 V to
RL= 50 , See Figure 19 Full 1 30
5.5 V
25°C 5 V 6
Break-before-make VNC = VNO = V+, CL= 35 pF,
tBBM ns
4.5 V to
time RL= 50 , See Figure 20 Full 1 20
5.5 V
VGEN = 0, CL= 1 nF,
Charge injection QC25°C 5 V –20 pC
RGEN = 0, See Figure 24
NC, NO CNC (OFF), VNC or VNO = V+or GND, See Figure 18 25°C 5 V 18 pF
off capacitance CNO(OFF) Switch off,
NC, NO CNC(ON), VNC or VNO = V+or GND, See Figure 18 25°C 5 V 55 pF
on capacitance CNO(ON) Switch on,
COM VCOM = V+or GND,
CCOM(ON) See Figure 18 25°C 5 V 55 pF
on capacitance Switch on,
Digital input CIVI= V+or GND, See Figure 18 25°C 5 V 2 pF
capacitance RL= 50 ,
Bandwidth BW See Figure 21 25°C 5 V 100 MHz
Switch on,
RL= 50 , Switch off,
Off isolation OISO 25°C 5 V –64 dB
f = 1 MHz, See Figure 22
RL= 50 , Switch on,
Crosstalk XTALK 25°C 5 V –64 dB
f = 1 MHz, See Figure 23
Total harmonic RL= 600 , f = 200 Hz to 20 kHz,
THD 25°C 5 V 0.004 %
distortion CL= 50 pF, See Figure 25
Supply
25°C 10 50
Positive supply I+VI= V+or GND, Switch on or off 5.5 V nA
current Full 500
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
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TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Electrical Characteristics for 3.3-V Supply(1)
V+= 3 V to 3.6 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,0 V+V
range VNC 25°C 1.3 1.6
Peak on 0 (VNO or VNC)V+, Switch on,
rpeak 3 V
resistance ICOM = –100 mA, See Figure 15 Full 2
25°C 1.2 1.5
On-state VNO or VNC = 2 V, Switch on,
ron 3 V
resistance ICOM = –100 mA, See Figure 15 Full 1.7
On-state 25°C 0.1 0.15
resistance match VNO or VNC = 2 V, 0.8 V, Switch on,
Δron 3 V
between ICOM = –100 mA, See Figure 15 Full 0.15
channels 0(VNO or VNC)V+, Switch on, 25°C 0.2
On-state ICOM = –100 mA, See Figure 15
resistance ron(flat) 3 V
25°C 0.15 0.3
VNO or VNC = 2 V, 0.8 V, Switch on,
flatness ICOM = –100 mA, See Figure 15 Full 0.3
VNC or VNO = 1 V, VCOM = 1 V to 3 V, 25°C –20 2 20
INC(OFF), Switch off,
or 3.6 V nA
NC, NO INO(OFF) See Figure 16 Full –50 50
VNC or VNO = 3 V, VCOM = 1 V to 3 V,
off leakage
current 25°C –1 0.2 1
INC(PWROFF), VNC or VNO = 0 to 3.6 V, Switch off, 0 V mA
INO(PWROFF) VCOM = 3.6 V to 0, See Figure 16 Full –15 15
NC, NO VNC or VNO = 1 V, VCOM = Open, 25°C –10 2 10
INC(ON), Switch on,
on leakage or 3.6 V nA
INO(ON) See Figure 17 Full –20 20
current VNC or VNO = 3 V, VCOM = Open,
COM 25° –1 0.2 1
VNC or VNO = 3.6 V to 0, Switch off,
off leakage ICOM(PWROFF) 0 V mA
VCOM = 0 to 3.6 V, See Figure 16 Full –15 15
current
COM VNC or VNO = Open, VCOM = 1 V, 25°C –10 2 10
Switch on,
on leakage ICOM(ON) or 3.6 V nA
See Figure 17 Full –20 20
current VNC or VNO = Open, VCOM = 3 V,
Digital Input (IN)
Input logic high VIH Full 2.4 5.5 V
Input logic low VIL Full 0 0.8
25°C –2 2
Input leakage IIH, IIL VI= 5.5 V or 0 3.6 V nA
current Full –100 100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
6Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
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TS5A3159A
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SCDS200C AUGUST 2005REVISED MAY 2010
Electrical Characteristics for 3.3-V Supply(1) (Continued)
V+= 3 V to 3.6 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Dynamic
25°C 3.3 V 5 16 35
VCOM = V+, CL= 35 pF,
Turn-on time tON ns
3 V to
RL= 50 , See Figure 19 Full 3 50
3.6 V
25°C 3.3 V 1 9 20
VCOM = V+, CL= 35 pF,
Turn-off time tOFF ns
3 V to
RL= 50 , See Figure 19 Full 1 30
3.6 V
25°C 3.3 V 9
Break-before-make VNC = VNO = V+, CL= 35 pF,
tBBM ns
3 V to
time RL= 50 , See Figure 20 Full 1 40
3.6 V
VGEN = 0, CL= 1 nF,
Charge injection QC25°C 3.3 V –11 pC
RGEN = 0, See Figure 24
NC, NO CNC (OFF), VNC or VNO = V+or GND, See Figure 18 25°C 3.3 V 18 pF
off capacitance CNO(OFF) Switch off,
NC, NO CNC(ON), VNC or VNO = V+or GND, See Figure 18 25°C 3.3 V 55 pF
on capacitance CNO(ON) Switch on,
COM VCOM = V+or GND,
CCOM(ON) See Figure 18 25°C 3.3 V 55 pF
on capacitance Switch on,
Digital input CIVI= V+or GND, See Figure 18 25°C 3.3 V 2 pF
capacitance RL= 50 ,
Bandwidth BW See Figure 21 25°C 3.3 V 100 MHz
Switch on,
RL= 50 , Switch off,
Off isolation OISO 25°C 3.3 V –64 dB
f = 1 MHz, See Figure 22
RL= 50 , Switch on,
Crosstalk XTALK 25°C 3.3 V –64 dB
f = 1 MHz, See Figure 23
Total harmonic RL= 600 , f = 20 Hz to 20 kHz,
THD 25°C 3.3 V 0.01 %
distortion CL= 50 pF, See Figure 25
Supply
25°C 10 25
Positive supply I+VI= V+or GND, Switch on or off 3.6 V nA
current Full 100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Electrical Characteristics for 2.5-V Supply(1)
V+= 2.3 V to 2.7, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,0 V+V
range VNC 25°C 1.8 2.5
Peak on 0 (VNO or VNC)V+, Switch on,
rpeak 2.3 V
resistance ICOM = –8 mA, See Figure 15 Full 2.7
25°C 1.5 2
On-state VNO or VNC = 1.8 V, Switch on,
ron 2.3 V
resistance ICOM = –8 mA, See Figure 15 Full 2.4
On-state 25°C 0.15 0.2
resistance match VNO or VNC = 1.8 V, Switch on,
Δron 2.3 V
between ICOM = –8 mA, See Figure 15 Full 0.2
channels 0(VNO or VNC)V+, Switch on, 25°C 0.6
On-state ICOM = –8 mA, See Figure 15
resistance ron(flat) 2.3 V
25°C 0.6 1
VNO or VNC = 0.8 V, 1.8 V, Switch on,
flatness ICOM = –8 mA, See Figure 15 Full 1
VNC or VNO = 0.5 V, VCOM = 0.5 V to 2.3 V, 25°C –20 2 20
INC(OFF), Switch off,
or 2.7 V nA
NC, NO INO(OFF) See Figure 16 Full –50 50
VNC or VNO = 2.3 V, VCOM = 0.5 V to 2.3 V,
off leakage
current 25°C –1 0.1 1
INC(PWROFF), VNC or VNO = 0 to 3.6 V, Switch off, 0 V mA
INO(PWROFF) VCOM = 3.6 V to 0, See Figure 16 Full –10 10
NC, NO VNC or VNO = 0.5 V, VCOM = Open, 25°C –10 2 10
INC(ON), Switch on,
on leakage or 2.7 V nA
INO(ON) See Figure 17 Full –20 20
current VNC or VNO = 2.2 V, VCOM = Open,
COM 25° –1 0.1 10
VNC or VNO = 2.7 V to 0, Switch off,
off leakage ICOM(PWROFF) 0 V mA
VCOM = 0 to 2.7 V, See Figure 16 Full –10 20
current
COM VNC or VNO = Open, VCOM = 0.5 V, 25°C –10 2 10
Switch on,
on leakage ICOM(ON) or 2.7 V nA
See Figure 17 Full –20 20
current VNC or VNO = Open, VCOM = 2.2 V,
Digital Input (IN)
Input logic high VIH Full 1.8 5.5 V
Input logic low VIL Full 0 0.6
25°C –2 2
Input leakage IIH, IIL VI= 5.5 V or 0 2.7 V nA
current Full 20 20
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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SCDS200C AUGUST 2005REVISED MAY 2010
Electrical Characteristics for 2.5-V Supply(1) (Continued)
V+= 2.3 V to 2.7, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Dynamic
25°C 2.5 V 5 22 40
VCOM = V+, CL= 35 pF,
Turn-on time tON ns
2.3 V to
RL= 50 , See Figure 19 Full 5 50
2.7 V
25°C 2.5 V 2 6 35
VCOM = V+, CL= 35 pF,
Turn-off time tOFF ns
2.3 V to
RL= 50 , See Figure 19 Full 2 50
2.7 V
25°C 2.5 V 2 13 35
Break-before-make VNC = VNO = V+, CL= 35 pF,
tBBM ns
2.3 V to
time RL= 50 , See Figure 20 Full 2 45
2.7 V
VGEN = 0, CL= 1 nF,
Charge injection QC25°C 2.5 V –7 pC
RGEN = 0, See Figure 24
NC, NO CNC (OFF), VNC or VNO = V+or GND, See Figure 18 25°C 2.5 V 18 pF
off capacitance CNO(OFF) Switch off,
NC, NO CNC(ON), VNC or VNO = V+or GND, See Figure 18 25°C 2.5 V 55 pF
on capacitance CNO(ON) Switch on,
COM VCOM = V+or GND,
CCOM(ON) See Figure 18 25°C 2.5 V 55 pF
on capacitance Switch on,
Digital input CIVI= V+or GND, See Figure 18 25°C 2.5 V 2 pF
capacitance RL= 50 ,
Bandwidth BW See Figure 21 25°C 2.5 V 100 MHz
Switch on,
RL= 50 , Switch off,
Off isolation OISO 25°C 2.5 V –64 dB
f = 1 MHz, See Figure 22
RL= 50 , Switch on,
Crosstalk XTALK 25°C 2.5 V –64 dB
f = 1 MHz, See Figure 23
Total harmonic RL= 600 , f = 20 Hz to 20 kHz,
THD 25°C 2.5 V 0.02 %
distortion CL= 50 pF, See Figure 25
Supply
25°C 10 20
Positive supply I+VI= V+or GND, Switch on or off 2.7 V nA
current Full 50
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TS5A3159A
0
0.5
1
1.5
2
2.5
3
2.3 2.7 3 3.6 4.5 5.5
PowerSupply V
Vt+
Vt-
ThresholdVoltage V
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Figure 1. Logic Threshold vs Power Supply
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Product Folder Link(s): TS5A3159A
TS5A3159A
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SCDS200C AUGUST 2005REVISED MAY 2010
Electrical Characteristics for 1.8-V Supply(1)
V+= 1.65 V to 1.95 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,0 V+V
range VNC 25°C 5
Peak on 0 (VNO or VNC)V+, Switch on,
rpeak 1.65 V
resistance ICOM = –2 mA, See Figure 15 Full 15
25°C 2 2.5
On-state VNO or VNC = 1.5 V, Switch on,
ron 1.65 V
resistance ICOM = –2 mA, See Figure 15 Full 3.5
On-state 25°C 0.15 0.4
resistance match VNO or VNC = 1.5 V, Switch on,
Δron 1.65 V
between ICOM = –2 mA, See Figure 15 Full 0.4
channels 0(VNO or VNC)V+, Switch on, 25°C 5
On-state ICOM = –8 mA, See Figure 15
resistance ron(flat) 1.65 V
25°C 4.5
VNO or VNC = 0.6 V, 1.5 V, Switch on,
flatness ICOM = –2 mA, See Figure 15 Full
VNC or VNO = 0.3 V, 25°C –5 2 5
VCOM = 0.3 V to 1.65 V,
INC(OFF), Switch off,
or 1.95 V nA
NC, NO INO(OFF) See Figure 16 Full –20 20
VNC or VNO = 1.65 V,
off leakage VCOM = 0.3 V to 1.65 V,
current 25°C –1 0.1 1
INC(PWROFF) VNC or VNO = 0 to 1.95 V, Switch off, 0 V mA
INO(PWROFF) VCOM = 1.95 V to 0, See Figure 16 Full –5 5
NC, NO VNC or VNO = 0.3 V, VCOM = Open, 25°C –5 2 5
INC(ON), Switch on,
on leakage or 1.95 V nA
INO(ON) See Figure 17 Full –20 20
current VNC or VNO = 1.65 V, VCOM = Open,
COM 25° –1 0.1 7
VNC or VNO = 1.95 V to 0, Switch off,
off leakage ICOM(PWROFF) 0 V mA
VCOM = 0 to 1.95 V, See Figure 16 Full –5 5
current
COM VNC or VNO = Open, VCOM = 0.3 V, 25°C –5 2 5
Switch on,
on leakage ICOM(ON) or 1.95 V nA
See Figure 17 Full –20 20
current VNC or VNO = Open, VCOM = 1.65 V,
Digital Input (IN)
Input logic high VIH Full 1.5 5.5 V
Input logic low VIL Full 0 0.6
25°C –2 2
Input leakage IIH, IIL VI= 5.5 V or 0 1.95 V nA
current Full 20 20
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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SCDS200C AUGUST 2005REVISED MAY 2010
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Electrical Characteristics for 1.8-V Supply(1) (Continued)
V+= 1.65 V to 1.95 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP MAX UNIT
Dynamic
25°C 1.8 V 10 35 70
VCOM = V+, CL= 35 pF,
Turn-on time tON ns
1.65 V to
RL= 50 , See Figure 19 Full 10 75
1.95 V
25°C 1.8 V 2 15 40
VCOM = V+, CL= 35 pF,
Turn-off time tOFF ns
1.65 V to
RL= 50 , See Figure 19 Full 2 50
1.95 V
25°C 1.8 V 22
Break-before-make VNC = VNO = V+, CL= 35 pF,
tBBM ns
1.65 V to
time RL= 50 , See Figure 20 Full 2 70
1.95 V
VGEN = 0, CL= 1 nF,
Charge injection QC25°C 1.8 V –4 pC
RGEN = 0, See Figure 24
NC, NO CNC (OFF), VNC or VNO = V+or GND, See Figure 18 25°C 1.8 V 18 pF
off capacitance CNO(OFF) Switch off,
NC, NO CNC(ON), VNC or VNO = V+or GND, See Figure 18 25°C 1.8 V 55 pF
on capacitance CNO(ON) Switch on,
COM VCOM = V+or GND,
CCOM(ON) See Figure 18 25°C 1.8 V 55 pF
on capacitance Switch on,
Digital input CIVI= V+or GND, See Figure 18 25°C 1.8 V 2 pF
capacitance RL= 50 ,
Bandwidth BW See Figure 21 25°C 1.8 V 105 MHz
Switch on,
RL= 50 , Switch off,
Off isolation OISO 25°C 1.8 V 64 dB
f = 1 MHz, See Figure 22
RL= 50 , Switch on,
Crosstalk XTALK 25°C 1.8 V 64 dB
f = 1 MHz, See Figure 23
Total harmonic RL= 600 , f = 20 Hz to 20 kHz,
THD 25°C 1.8 V 0.06 %
distortion CL= 50 pF, See Figure 25
Supply
25°C 5 15
Positive supply I+VI= V+or GND, Switch on or off 1.95 V mA
current Full 50
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
12 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
01234
TA = 85°C
TA = 25°C
TA = −40°C
VCOM (V)
ron (Ω)
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0.0 0.5 1.0 1.5 2.0
ron (Ω)
VCOM (V)
V+ = 1.8 V
V+ = 2.5 V
V+ = 3.3 V
V+ = 5 V
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 1 2 3 4 5 6
TA = 85°C
TA = 25°C
TA = −40°C
VCOM (V)
ron (Ω)
−40
−20
0
20
−60 −40 −20 0 20 40 60 80 100
Temperature (°C)
Leakage (nA)
NO/NC (off)
COM (on)
NO/NC (on)
−30
−20
−10
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6
Bias Voltage (V)
Charge Injection (pC)
V+ = 5 V
V+ = 3 V
−500
0
500
1000
1500
2000
2500
3000
3500
−60 −40 −20 0 20 40 60 80 100
Temperature (°C)
Leakage (nA)
NO/NC (pwroff)
COM (pwroff)
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
TYPICAL PERFORMANCE
Figure 2. ron vs VCOM Figure 3. ron vs VCOM (V+= 3.3 V)
Figure 4. ron vs VCOM (V+= 5 V) Figure 5. Leakage Current vs Temperature
(V+= 3.3 V)
Figure 6. Leakage Current vs Temperature Figure 7. Charge Injection vs Bias Voltage
(V+= 5 V)
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TS5A3159A
0
5
10
15
20
25
30
35
40
45
0123456
V+ (V)
tON/tOFF (ns)
tON
tOFF
−14
−12
−10
−8
−6
−4
−2
0
Gain (dB)
Frequency (MHz)
0.1 1 100010 100
0.0
0.5
1.0
1.5
2.0
2.5
−40°C 25°C 85°C
I+ (µA)
TA (5C)
VIN rising
VIN falling
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
Attenuation (dB)
Frequency (MHz)
0.1 1 100010 100
0.001
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
0.010
0
THD + (%)
Frequency (Hz)
10 100 1000001000 10000
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
TYPICAL PERFORMANCE (continued)
Figure 8. tON and tOFF vs Supply Voltage Figure 9. I+vs Temperature
Figure 10. I+vs Temperature Figure 11. Bandwidth (V+= 5 V)
Figure 12. Attenuation vs Frequency Figure 13. Total Harmonic Distortion vs Frequency
(V+= 5 V)
14 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
-20
0
20
40
60
80
100
120
140
160
180
-40°C 25°C 85°C
I(nA)
+
T (°C)
A
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
TYPICAL PERFORMANCE (continued)
Figure 14. Power-Supply Current vs Temperature
(V+= 5 V)
PIN DESCRIPTION
NO. NAME DESCRIPTION
1 NO Normally open
2 GND Digital ground
3 NC Normally closed
4 COM Common
5 V+Power supply
6 IN Digital control to connect COM to NO
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
PARAMETER DESCRIPTION
SYMBOL DESCRIPTION
VCOM Voltage at COM
VNC Voltage at NC
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports when the channel is on
rpeak Peak on-state resistance over a specified voltage range
Δron Difference of ron between channels
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the off state under
INC(OFF) worst-case input and output conditions
INC(PWROFF) Leakage current measured at the NC port during the power-down condition, V+= 0
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the off state under
INO(OFF) worst-case input and output conditions
INO(PWROFF) Leakage current measured at the NO port during the power-down condition, V+= 0
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the on state and the
INC(ON) output (COM) being open
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the on state and the
INO(ON) output (COM) being open
Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the on
ICOM(ON) state and the output (NC or NO) being open
ICOM(PWROFF) Leakage current measured at the COM port during the power-down condition, V+= 0
VIH Minimum input voltage for logic high for the control input (IN)
VIL Maximum input voltage for logic low for the control input (IN)
VIVoltage at (IN)
IIH, IIL Leakage current measured at (IN)
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the
tON propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning on.
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the
tOFF propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning off.
Break-before-make time. This parameter is measured under the specified range of conditions and by the
tBBM propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal
changes state.
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO,
or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the
QCcontrol input. Charge injection, QC= CL×ΔVO, CLis the load capacitance and ΔVOis the change in analog output
voltage.
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is off
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is off
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is on
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is on
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is on
CIN Capacitance of (IN)
OFF isolation of the switch is a measurement off-state switch impedance. This is measured in dB in a specific
OISO frequency, with the corresponding channel (NC to COM or NO to COM) in the off state.
Crosstalk is a measurement of unwanted signal coupling from an on channel to an off channel (NC to NO or NO to
XTALK NC). This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an on channel is –3 dB below the DC gain.
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio or
THD root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the
fundamental harmonic.
I+Static power supply current with the control (IN) pin at V+or GND
16 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
V+
ICOM
ron +VCOM *VNO or VNC
ICOM
W
GND
Channel On
NC
VI
NO
COM VCOM
VI = VIH or VIL
VNO
VNC
+
+
IN
Channel Off
Off-State Leakage Current
VI = VIH or VIL
V+
GND
NC
VI
NO
COM VCOM
VNO
VNC
+
+
+
IN
Channel On
On-State Leakage Current
VI = VIH or VIL
V+
GND
NC
VI
NO
COM VCOM
VNO
VNC
+
+
IN
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
PARAMETER MEASUREMENT INFORMATION
Figure 15. On-State Resistance (ron)
Figure 16. OFF-State Leakage Current (INC(OFF), INC(PWROFF), INO(OFF), INO(PWROFF), ICOM(OFF), ICOM(PWROFF))
Figure 17. On-State Leakage Current (ICOM(ON), INC(ON), INO(ON))
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TS5A3159A
V+
GND
VBIAS VI
VI = V+ or GND
VBIAS = V+ or GND
Capacitance is measured at NC,
NO, COM, and IN inputs during
on and off conditions.
Capacitance
Meter
VCOM
VNO
VNC
COM
NO
NC
IN
CL(2) RL
VCOM
V+
GND
NC or NO VNC or VNO
VI
NC or NO
COM
Logic
Input(1)
V+
VCOM
50
RLCL
35 pF
tON
TEST
V+
50 35 pFtOFF
50%
tON tOFF
50%
90% 90%
Logic
Input
(VI)
V+
Switch
Output
(VNC or VNO)
0
CL(2) RL
IN
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Figure 18. Capacitance (CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
A. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 , tr< 5 ns,
tf< 5 ns.
B. CLincludes probe and jig capacitance.
Figure 19. Turn-On (tON) and Turn-Off Time (tOFF)
18 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
V+
GND
NC or NO
VNC or VNO
VI
NC or NO COM VCOM
CL(2) RL
tBBM
50%
90% 90%
VNC or VNO = V+
RL = 50
CL = 35 pF
Logic
Input(1)
Logic
Input
(VI)
Switch
Output
(VCOM)
V+
0
IN
V+
GND
NC
VI
NO
COM
50 W
50 W
VNC
VCOM
Channel On: NC to COM
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
+
VI = V+ or GND
IN
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
A. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 , tr< 5 ns,
tf< 5 ns.
B. CLincludes probe and jig capacitance.
Figure 20. Break-Before-Make Time (tBBM)
Figure 21. Bandwidth (BW)
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TS5A3159A
NC
NO
COM
VNC
VCOM
Channel Off: NC to COM
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V+
GND
50 W
50 W
Network Analyzer
Source
Signal
VI
+
VI = V+ or GND
IN
NC
NO
50 W
50 W
VNC VCOM
Channel On: NC to COM
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V+
GND
VNO
Source
Signal
Channel Off: NO to COM
Network Analyzer
VI
+
VI = V+ or GND
IN
TS5A3159A
SCDS200C AUGUST 2005REVISED MAY 2010
www.ti.com
Figure 22. OFF Isolation (OISO)
Figure 23. Crosstalk (XTALK)
20 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
V+
GND
NC or NO
IN
RGEN
VI
NC or NO
COM VCOM
CL(2)
OFF
VCOM
ON OFF
VCOM
VGEN +
VI = VIH or VIL
CL = 1 nF
VGEN = 0 to V+
RGEN = 0
QC = CL × VCOM
Logic
Input(1)
VIH
VIL
Logic
Input
(VI)
V+
GND
NO
COM
10 mF
CL(1)
RL
V+/2
10 mF
IN
VI
600 W600 W
600 W
Audio Analyzer
Source
Signal
RL = 600
CL = 50 pF
VSOURCE = V+ P-P fSOURCE = 20 Hz to 20 kHz
Channel On: COM to NC VI = VIH or VIL
NC
TS5A3159A
www.ti.com
SCDS200C AUGUST 2005REVISED MAY 2010
A. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 , tr< 5 ns,
tf< 5 ns.
B. CLincludes probe and jig capacitance.
Figure 24. Charge Injection (QC)
A. CLincludes probe and jig capacitance.
Figure 25. Total Harmonic Distortion (THD)
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Link(s): TS5A3159A
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TS5A3159ADBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADBVTE4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159ADCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159AYZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com 26-Apr-2010
Addendum-Page 1
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 26-Apr-2010
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS5A3159ADBVR SOT-23 DBV 6 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TS5A3159ADBVT SOT-23 DBV 6 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TS5A3159ADCKR SC70 DCK 6 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TS5A3159ADCKT SC70 DCK 6 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TS5A3159AYZPR DSBGA YZP 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Oct-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS5A3159ADBVR SOT-23 DBV 6 3000 205.0 200.0 33.0
TS5A3159ADBVT SOT-23 DBV 6 250 205.0 200.0 33.0
TS5A3159ADCKR SC70 DCK 6 3000 205.0 200.0 33.0
TS5A3159ADCKT SC70 DCK 6 250 205.0 200.0 33.0
TS5A3159AYZPR DSBGA YZP 6 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Oct-2011
Pack Materials-Page 2
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