TCD1205D
2001-02-16 1/13
TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device)
TCD1205D
The TCD1205D is a high sensitive and low dark current
2048−elements linear image sensor. The sensor can be used for
POS handscanner.
The device is operated by only 5V power supply, and mounted in
22−pin cerdip package with hermetic sealed optical glass window.
The TCD1205D has electronic shutter function (ICG).
Electronic shutter function can keep always output voltage
constant that vary with the intensity of lights.
FEATURES
l Number of Image Sensing Elements : 2048
l Image Sensing Element Size : 14µm by 200µm on
14µm centers
l Photo Sensing Region : High sensitive and low
dark current pn photodiode
l Clock : 2 phase (5V)
l Internal Circuit : Electronic shutter function (ICG)
l Package : 22 pin cerdip
MAXIMUM RATINGS (Note 1)
CHARACTERISTIC SYMBOL RATING UNIT
Clock Pulse Voltage Vφ
Shift Pulse Voltage VSH
Reset, Boost Pulse Voltage VRS, VBT
Integration Clear Gate Pulse Voltage VICG
Power Supply Voltage VOD
−0.3~8 V
Operating Temperature Topr −25~60 °C
Storage Temperature Tstg −40~100 °C
Note 1: All voltage are with respect to SS terminals (Ground).
Weight: 4.4g (Typ.)
PIN CONNECTION
(TOP VIEW)
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury o
r
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction o
r
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energ
y
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this documen
t
shall be made at the customer’s own risk.
000707EBA2
TCD1205D
2001-02-16 2/13
CIRCUIT DIAGRAM
PIN NAMES
φ1 Clock (Phase 1)
φ2 Clock (Phase 2)
RS Reset Gate
SH Shift Gate
ICG Integration Clear Gate
BT Boost Gate
OS Signal Output
DOS Compensation Output
OD Power
SS Ground
NC Non Connection
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed b
y
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION o
r
others.
· The information contained herein is subject to change without notice.
000707EBA2
TCD1205D
2001-02-16 3/13
OPTICAL / ELECTRICAL CHARACTERISTICS
(Ta = 25°C, VOD = 5V, Vφ = VSH = VRS = VBT = 5V (Pulse), fφ = 0.5MHz, fRS = 1MHz,
Load Resistance = 100kΩ, tINT (Integration Time) = 10ms,
Light Source = Daylight Fluorescent Lamp)
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT NOTE
Sensitivity R 64 80 ― V / lx·s (Note 2)
Photo Response Non Uniformity PRNU ― ― 10 % (Note 3)
Saturation Output Voltage VSAT 0.55 0.8 ― V (Note 4)
Saturation Exposure SE 0.006 0.01 ― lx·s (Note 5)
Dark Signal Voltage VMDK ― 2 5 mV (Note 6)
DC Power Dissipation PD ― ― 25 mW
Total Transfer Efficiency TTE 92 95 ― %
Output Impedance Zo ― 0.5 1 kΩ
Dynamic Range DR ― 400 ― ― (Note 7)
DC Signal Output Voltage VOS 1.5 3.0 4.5 V (Note 8)
DC Compensation Output Voltage VDOS 1.5 3.0 4.5 V (Note 8)
DC Mismatch Voltage |VOS−VDOS|― ― 200 mV (Note 8)
Note 2: Sensitivity for LED (660nm) is 600V / lx·s (Typ.)
Note 3: Measured at 50% of SE (Typ.)
Definition of PRNU: PRNU =
%100´
c
cD
Where
? is average of total signal outputs and ?, is the maximum deviation from ? under uniform
illumination.
Note 4: VSAT is defined as minimum saturation output voltage of all effective pixels.
Note 5: Definition of SE : SE =
s·lx
R
SAT
V
Note 6: VMDK is defined as maximum dark signal voltage of all effective pixels.
Note 7: Definition of DR : DR =
MDK
V
SAT
V
V
MDK is proportional to tINT (Integration time).
So the shorter tINT condition makes wider DR value.
Note 8: DC signal output voltage and DC compensation output voltage are defined as follows:
TCD1205D
2001-02-16 4/13
OPERATING CONDITION
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
“H” Level 4.5 5.0 5.5
Clock Pulse Voltage
“L” Level
Vφ 0 0.2 0.5
V
“H” Level 4.5 5.0 5.5
Shift Pulse Voltage
“L” Level
VSH 0 0.2 0.5
V
“H” Level 4.5 5.0 5.5
Reset, Boost Pulse
Voltage “L” Level
VRS, VBT 0 0.2 0.5
V
“H” Level 4.5 5.0 5.5
Integration Clear Gate
Voltage “L” Level
VICG 0 0.2 0.5
V
Power Supply Voltage VOD 4.5 5.0 5.5 V
CLOCK CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
Clock Pulse Frequency fφ 0.01 0.5 1.0 MHz
Reset Pulse Frequency fRS 0.02 1.0 2.0 MHz
Clock Capacitance CΦA ― 400 500 pF
BT Gate Capacitance CBT ― 10 25 pF
Shift Gate Capacitance CSH ― 200 250 pF
Reset Gate Capacitance CRS ― 10 25 pF
Integration Clear Gate Capacitance CICG ― 100 200 pF
TCD1205D
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TAIMING CHART
TCD1205D
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TAIMING CHART
(
EXAMPLE : USE ELECTRONIC SHUTTER
)
TCD1205D
2001-02-16 7/13
TIMING REQUIREMENTS
Note 10: If
φ1 & φ2 pulse cross point couldn't be kept over 2.5V, it should be 1.5V and t23 and t24 should be 60ns.
TCD1205D
2001-02-16 8/13
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
Pulse Timing of SH & φ1 t1 0 100 ― ns
Pulse Timing of SH &φ1 t5 2000 3000 ― ns
SH, ICG Pulse Rise & Fall Time t2, t4 0 50 ― ns
SH Pulse Width (Note 11) t3, t3' 1000 2000 ― ns
Pulse Timing of SH & ICG t6 50 100 * ns
Pulse Timing of SH & ICG t7 1000 ― t5 ns
Pulse Timing of ICG &φ1 t8 0 100 ― ns
Pulse Timing of ICG &φ1 t9 500 ― ― ns
φ1, φ2 Pulse Rise & Fall Time t10, t11 0 60 ― ns
RS, BT Pulse Rise & Fall Time t12, t14 0 60 ― ns
RS Pulse Width t13 60 260 ― ns
Pulse Timing ofφ1, φ2, RS t15 20 ― ― ns
Pulse Timing of RS & BT t16 50 100 ― ns
Pulse Timing of RS & BT t17 20 ― ― ns
Pulse Timing of RS & BT t18 40 ― ― ns
Pulse Timing of RS & BT t19 200 ― ― ns
BT Pulse Width t20 70 250 ― ns
Video Data Delay Time t21, t22 ― 80 ― ns
Note 11: Have to use t3 = t3'
* t6 = MAXIMUM TIMING
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2001-02-16 9/13
TCD1205D
2001-02-16 10/13
TCD1205D
2001-02-16 11/13
TYPICAL DRIVE CIRCUIT
TCD1205D
2001-02-16 12/13
CAUTION
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and
allow the glass to dry, by blowing with filtered dry N2.
Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage.
2. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
3. Incident Light
CCD sensor is sensitive to infrared light.
Note that infrared light component degrades resolution and PRNU of CCD sensor.
4. Lead Frame Forming
Since this package is not stout against mechanical stress, you should not reform the lead frame.
We recommend to use a IC−inserter when you assemble to PCB.
TCD1205D
2001-02-16 13/13
PACKAGE DIEMENSIONS
WDIP22−G−400−2.54A (D) Unit: mm
Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE.
Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE.
Note 3: GLASS THICKNES (n = 1.5)
Weight: 4.4g (Typ.)
