MADP-011034-10720T - M/A-COM Technology Solutions

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

Non-Magnetic MELF PIN Diode

Rev V2

MADP-011034-10720T

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

1. Exceeding these limits may cause permanent damage

2. Values will de-rate over temperature.

3. Infinite Heat Sink, de-rate to 0W @ +175 °C ,

by –40mW/°C from 25°C to +175 °C

Parameter Absolute

Maximum

Reverse DC & AC Voltage 1,2 |-150 V|

D.C. Forward Current1,2 0.5 A

C.W. Power Dissipation 1,2,3 6.0 W

Storage Temperature1,2 -65°C to +175°C

Mounting Temperature1,2 +260°C for 30 s

Peak A.C. Forward Surge

Current ( 8.3 mS Single

Half Sine Wave )1,2

2.5 A

Operating Temperature1,2 -65°C to +150°C

Absolute Maximum Ratings1,2,3@ 25°C

Features

♦ Non-Magnetic Package for MRI Applications

♦ Rectangular MELF Ceramic Package

♦ Hermetically Sealed

♦ RoHS Compliant

Description

The MADP-011034-10720T is a surface mount PIN

diode in a non-magnetic Metal Electrode Leadless

Faced (MELF) package. The MADP-011034-10720T

is manufactured using M/A-COM Technology

Solutions time proven HIPAX technology. The result

is a low inductance ceramic package with no ribbons

or wires. The package utilizes a unique non-magnetic

plating process that provides for a hermetically sealed

component that has extremely low electromagnetic

permeability. Incorporated in the package is a glass

passivated CERMA chip that is full face bonded on

the cathode and anode which maximizes the surface

contact area to minimize the electrical and thermal

resistances. The chip and package have been

comprehensively characterized both electrically and

mechanically to ensure repeatable and predictable

performance.

Application

The MADP-011034-10720T is designed for circuit

protection and the tuning of RF coil designs in MRI

applications. When connected in an anti-parallel

configuration these PIN diodes provide excellent

protection from long RF pulses and transient voltage

spikes.

Package Style 1072

Designed for Automated Assembly

This easy to use package design makes automatic

pick and place, indexing and assembly, extremely

easy. The parallel flat surfaces are well suited for

most key jaw or vacuum pick-up techniques. All of the

solderable surfaces are tin plated and compatible with

industry standard reflow and vapor phase soldering

processes.

RoHS

The MADP-011034-10720T is fully RoHS compliant

meaning that it contains less than the maximum

allowable concentration of 0.1% by weight for lead,

PBB, PBDE, and 0.01% of cadmium and hexavalent

chromium at raw homogeneous materials level.

There is less than 100ppm of mercury and no

mercury was intentionally added to the component.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

Non-Magnetic MELF PIN Diode

Rev V2

MADP-011034-10720T

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

Typical Performance at Ambient = +25°C

Electrical Specifications @ TAMB = +25°C

Parameter Units Conditions Min Typ Max

| -VB | V -10µA | -100 | | -150 |

VF V 10mA 0.8 0.9

VF V 100mA 0.9 1.0

VF V 1000mA 1.1 1.3

| -IR | nA Vr = -20V | -10 | | -20 |

| -IR | nA Vr = -50V | -20 | | -100 |

CT pF VR = 0V/ Freq. = 1 MHz 1.0 1.5

RP KΩ VR = 0V/ Freq. = 64 MHz 100 400

Gp µS VR = 0V/ Freq. = 64 MHz 2.5 10

RS Ω IF = 10mA / Freq. = 100 MHz 0.4 0.5

TL nS IF = 10mA / IR = -6mA 300 500

I region Thickness µm 11

C.W. Power Dissipation W Infinite Heatsink 6.0 6.0

C.W. Thermal Resistance °C/W 25 30

1.000

1.010

1.020

1.030

1.040

1.050

1.060

1.070

118

140

163

185

208

230

253

275

298

320

343

365

388

410

433

455

478

500

MHz

T0V

vs. Freq.

100

200

300

400

500

600

700

118

140

163

185

208

230

253

275

298

320

343

365

388

410

433

455

478

500

KΩ

MHz

P0V

vs.Freq

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

Non-Magnetic MELF PIN Diode

Rev V2

MADP-011034-10720T

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

Typical Non-Magnetic Performance

Comparison of Magnetic Moment vs H Field for MA4P7461F-1072T & MA4P1250-1072T Devices

-2.50E-02

-2.00E-02

-1.50E-02

-1.00E-02

-5.00E-03

0.00E+00

5.00E-03

1.00E-02

1.50E-02

2.00E-02

2.50E-02

-1.0E+04 -8.0E+03 -6.0E+03 -4.0E+03 -2.0E+03 0.0E+00 2.0E+03 4.0E+03 6.0E+03 8.0E+03 1.0E+04

H Field ( Oersteads )

MA4P1250-1072T Magnetic

MA4P7461F-1072T Non-Magnetic

MADP-011034-1072T (non-magnetic)

MA4P504-1072T (magnetic)

Device Magnetic Moment (EMU)

Comparison of Magnetic Moment vs. H Field for MA4P504-1072T & MADP-011034-1072T

Magnetic Property MADP-011034-1072T MA4P504-1072T

Saturation Moment (EMU) @ H = HMAX Oersteads 2.3 x E-4 2.1 x E-2

Remanance Moment (EMU)@ H = 0 Oersteads 4.2 x E-8 7.1 x E-3

Coercivity (Oersteads)@ EMU = 0 Moment 1 59.2

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

Non-Magnetic MELF PIN Diode

Rev V2

MADP-011034-10720T

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

Solderable

Surfaces

Cathode

Case Style A (sq)

Min./Max.

1072 0.080/0.095

(2.032/2.413)

0.115/0.135

(2.921/3.429)

0.008/0.030

(.203/.762)

Size Inches (mm)

All tolerances are ± .001” (± .025 mm).

Cleanliness and Storage

♦ These devices should be handled and stored in a clean environment.

♦ Ends of the device are tin plated for greater solderability.

♦ Continuous exposure to high humidity (>80%) for extended periods may cause the surface to oxidize.

Caution should be taken when storing devices for long periods.

ESD

♦ These devices are susceptible to ESD and are rated Class 0, HBM.

General Handling

♦ Device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-

place equipment.

MELF Assembly Recommendations

♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. MELF devices are plated

bright tin, 50 μm minimum thickness, to ensure an optimum connection.

Circuit Pad Layout

Dimension

Package Style

1072

inches mm

A 0.093 2.36

B 0.050 1.27

C 0.060 1.52

1072 Package Dimensions

Ordering Information

(Diodes are available in tape and reel in quantities shown below)

Part Number Quantity (7” Reel)

MADP-011034-10720T 1500

Tape and reel information can be found on the M/A-COM Technology Solutions website at :

http://www.macom.com/Application%20Notes/pdf/M513.pdf