MM74HCT245WM - ON SEMICONDUCTOR

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is an Equal Opportunity/Afﬁrmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

Februa ry 198 4

Revised May 2005

MM74HCT245 Octal 3-STATE Transceiver

MM74HCT245

Octal 3-STATE Transceiver

General Descript ion

The MM74HCT245 3-STATE bi-directional buffer utilizes

advanced silicon-gate CMOS technology and is intended

for two-way asynchronous communication between data

buses. It has hi gh drive current o utputs which enable high

speed operation even when driving large bus capaci-

tances. Thi s circuit pos sesses the l ow power consumpt ion

of CMOS circuitry, yet has speeds comparable to low

power Schottky TTL circuits.

This de vice is TTL inpu t co mpat ib le a nd can drive up to 15

LS-TTL loads, and all inputs are protected from damage

due to static discharge by diodes to VCC and ground.

The MM74HCT245 has one active low enable input (G),

and a di r ectio n co ntr ol ( D IR) . W he n the DIR input is HIGH ,

data flows from the A inputs to the B out puts. When DI R is

LOW, data flows from B to A.

MM74HCT devices ar e intended to interfa ce betwe en TTL

and NMOS components and standard CMOS devices.

These parts are also plug-in replacements for LS-TTL

devices and can be used to red uce power consump tion in

existing designs.

Features

■TTL input compatible

■3-STATE outputs for connection to system busses

■High output drive current: 6 mA (min)

■High speed: 16 ns typi cal pro pagat i on dela y

■Low power: 80

A (74HCT Series)

Ordering Code:

Devices also available in Tape and R eel. Sp ec if y by appending the suffix lett er “X” to the orde ring code.

Connection Diagram

Pin Assignments for DIP, SOIC, SOP and TSSO P

Top View

Truth Table

HIGH Level

LOW Le vel

Irrelevant

Order Number Package Number Package Description

MM74HCT245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

MM74HCT245SJ M20D 20-Lead Small Outline Package (SOP) , EIAJ TYPE II, 5. 3mm Wide

MM7 4HC T 24 5M TC MTC2 0 20-Le ad T hin Shri nk S mal l Ou t l in e Pac k a ge (T S SOP), JEDE C MO - 153 , 4. 4 mm Wi d e

MM74HCT245N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide

Control Operation

Inputs

GDIR 245

L L B data to A bus

L H A data to B bus

H X isolation

www.fairchildsemi.com 2

MM74HCT245

Logic Diagram

3 www.fairchildsemi.com

MM74HCT245

Absolute Maxim um Ratings(Note 1)

(Note 2) Recommended Operating

Conditions

Note 1: Absolute Maximum Ratings are those values beyond which dam-

age to the device may occur.

Note 2: Unl es s ot herwise spe c if ied all voltages are referenced to ground.

Note 3: Power Dis sipation tem perature d erating — plastic “N” pac kage:



12 mW/

C from 65

C to 85

DC Electrical Characteristics

(VCC

10%, unless otherwise specified.)

Note 4: Measured per input. All other inputs at VCC or ground.

Supply Voltage (VCC)



0.5 to



7.0V

DC Input Voltage (VIN)



1.5 to VCC



1.5V

DC Output Voltage (VOUT)



0.5 to VCC



0.5V

Clamp Diode Current (IIK, IOK)

20 mA

DC Output Current,

35 mA

DC VCC or GND Current, per pin (ICC)

70 mA

Storage Temperature Range (TSTG)



C to



150

Power Dissipation (PD)

(Note 3) 600 mW

S.O. Package only 500 mW

Lead Temperature (TL)

(Soldering 10 seconds) 260

Min Max Units

Supply Voltage (VCC)4.55.5V

DC Input or Output Voltage

(VIN, VOUT)0V

CC V

Operati ng Tem per atu re R ang e (TA)





Input Rise or Fall Times

(tr, tf) 500 ns

Symbol Parameter Conditions TA



40 to 85



55 to 125

CUnits

Typ Guaranteed Limits

VIH Minimum HIGH Level 2.0 2.0 2.0 V

Input Voltage

VIL Maximum LOW Level 0.8 0.8 0.8 V

Input Voltage

VOH Minimum HIGH Level VIN

VIH or VIL

Output Voltage |IOUT|

CC VCC



0.1 VCC



0.1 VCC



0.1 V

|IOUT|

6.0 mA, VCC

4.5V 4.2 3.98 3.84 3.7 V

|IOUT|

7.2 mA, VCC

5.5V 5.2 4.98 4.84 4.7 V

VOL Maximum LOW Level VIN

VIH or VIL

Voltage |IOUT|

A00.10.10.1V

|IOUT|

6.0 mA, VCC

4.5V 0.2 0.26 0.33 0.4 V

|IOUT|

7.2 mA, VCC

5.5V 0.2 0.26 0.33 0.4 V

IIN Maximum Input VIN

VCC or GND,

0.1

1.0

Current VIH or VIL, Pin 1 or 19

IOZ Maximum 3-STATE VOUT

VCC or GND

0.5

5.0

Output Leakage G

VIH

Current

ICC Maximum Quiescent VIN

VCC or GND 8 80 160

Supply Current IOUT

VIN

2.4V or 0.5V (Note 4) 0.6 1.0 1.3 1.5 mA

www.fairchildsemi.com 4

MM74HCT245

AC Electrical Characteristics

VCC

5.0V, tr

6 ns, TA

C (unless otherwise specified)

AC Electrical Characteristics

VCC

5.0V

10%, tr

6 ns (unless otherwise specified)

Note 5: CPD determines the no load pow er consum pt ion, PD

CPD VCC2 f



ICCVCC, and the no load dynamic current consumption,

CPD VCC f



ICC.

Symbol Parameter Conditions Typ Guaranteed Units

Limit

tPHL, tPLH Maximum Output CL

45 pF 16 20 ns

Propagation Delay

tPZL, tPZH Maximum Output CL

45 pF 29 40 ns

Enable T i me RL

1 k

tPLZ, tPHZ Maximum Output CL

5 pF 20 25 ns

Disable Time RL

1 k

Symbol Parameter Conditions TA



40 to 85



55 to 125

CUnits

Typ Guar ant eed Lim i ts

tPHL, tPLH Maximum Output CL

50 pF 17 23 29 34 ns

Propagation Delay CL

150 pF 24 30 38 45 ns

tPZL Maximum Output RL

1 k

31 42 53 63 ns

Enable Time CL

50 pF

tPZH Maximum Output RL

1 k

23 33 41 49 ns

Enable Time CL

50 pF

tPHZ, tPLZ Maximum Output RL

1 k

21 30 38 45 ns

Disable Time CL

50 pF

tTHL, tTLH Maximum Output CL

50 pF 8 12 15 18 ns

Rise and Fall Time

CIN Maximum Input 10 15 15 15 pF

Capacitance

COUT Maximum Output/Input 20 25 25 25 pF

Capacitance

CPD Power Dissipation G

VCC (Note 5) 7 pF

Capacitance G

GND 100 pF

5 www.fairchildsemi.com

MM74HCT245

Physical Dim ensions inches (millimeters) unless otherwise noted

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

Package Number M20B

www.fairchildsemi.com 6

MM74HCT245

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

20-Lead Small Outline Package (SOP ), EIAJ TYPE II, 5.3mm W ide

Package Number M20D

7 www.fairchildsemi.com

MM74HCT245

Physical Dim ensions inches (millimeters) unless otherwise noted (Continued)

20-Lea d Th in S hri nk Sm all Ou tlin e Pack age (TSSOP), JED EC MO-1 53, 4.4mm Wide

Package Number MTC20

www.fairchildsemi.com 8

MM74HCT245 Octal 3-STATE Transceiver

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide

Package Number N20A

Fairchild does no t assume any responsibility for use of any circui try described, no circuit patent licenses are implied and

Fairchild reserves the right at any time without notice to change said circuitry and specifications.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life suppor t de vices o r systems a re devices or syste ms

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instructions for use provided in the labeling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A critical compon ent in any componen t of a life support

device or system whose failure to perform can be rea-

sonabl y ex pect ed to cause the fa ilu re of the lif e su pp ort

device or system, or to affect it s safety or effectiveness.

www.fairchildsemi.com

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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