High Surge Film
Surface Mount Metal GlazeTM
HSF Series
150°C maximum operang temperature
RoHS - compable components available
Up to triple the surge rang of the rugged CHP1
Replaces costly surface-mount wirewound resistors
General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal GlazeTM
thick fi lm element
fi red at 1000°C
to solid ceramic
Solder over
nickel barrier
High
temperature
dielectric
coating
Electrical Data
• 1 Watt and 1/2 Watt power rating
• 150°C maximum operating temperature
• RoHS - Compatible Components Available
• Up to triple the surge rating of the rugged CHP1
• Replaces costly surface-mount wirewound resistors
Industry
Footprint Type Maximum
Power Rating Working
Voltage
Resistance
Range (Ω)
Tolerance
(±%)
TCR
(ppm/°C)
Product
Category
2512 HSF-1 1W @ 70°C 350
3612 HSF-2 2W @ 25°C 500 8R2, 22R, 300R
5R9, 6R8, 11R, 27R,
12R, 68R, 270R
Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request.
High Surge±20010
High Surge±20010
Environmental Data
dohteM tseTegnahC mumixaMscitsiretcarahC
Temperature Coeffi cient As specifi ed MIL-R-55342H Par 4.7.9 (-55°C +125°C)
Thermal Shock ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles)
Low Temperature Operation ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding
Exposure ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (refl ow soldered to board at 260°C for 10 seconds)
Solderability 95% min. coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent)
Terminal Adhesion Strength ±1% +0.01 ohm
no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds
Resistance to Board bending ±1% +0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, defl ected 5mm so
as to exert pull on chip contacts for 10 seconds
√
HSF
High Surge Film
Surface Mount Metal GlazeTM
HSF-1 Series Issue October 2010 Sheet 1 of 4
1
1
Resistors
Metal GlazeTM
lm element
red at 1000˚C
to solid ceramic
Solder over
nickel barrier
High
temperature
dielectric
coating
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
All Pb-free parts comply with EU Direcve 2011/65/EU amended by (EU) 2015/863 (RoHS3)All Pb-free parts comply with EU Direcve 2011/65/EU amended by (EU) 2015/863 (RoHS3)
High Surge Film
Surface Mount Metal Glaze™
HSF Series
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Dimensions (Inches and (mm))
Industry
Footprint Type L
(Length)
W
(Width/Diameter)
C
(Termination Width)
2512 HSF-1 0.251 ± 0.010
(6.38 ± 0.25)
0.079 ± 0.006
(2.01 ± 0.15)
0.040 ± 0.010
(1.02 ± 0.25)
3612 HSF-2 0.367 ± 0.010
(9.32 ± 0.25)
0.105 ± 0.006
(2.67 ± 0.15)
0.050 ± 0.010
(1.27 ± 0.25)
Physical Data
Recommended Solder Pad Dimensions (Refl ow):
Industry
Footprint
Dimensions (Inches and mm))
ABCD E F
HSF 1 2512 0.121
(3.07)
0.126
(3.20)
0.127
(3.23)
0.183
(4.65)
0.040
(1.02)
0.369
(9.37)
HSF 2 3610 0.17
(4.32)
0.16
(4.06)
0.213
(5.41)
0.273
(6.93)
0.044
(1.12)
0.553
(14.05)
F
E
B
D
ACA
L
C
W
HSF
High Surge Film
Surface Mount Metal GlazeTM
HSF-1 Series Issue October 2010 Sheet 2 of 4
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
High Surge Film
Surface Mount Metal Glaze™
HSF Series
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Note 2: The maximum component temperature
reached during re ow depends on package
thickness and volume. The use of convection
re ow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD pack-
ages may still exist.
Note 3: Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and pro les
de ned in Table 1, 2 and re ow pro le whether
or not lead-free.
Tabel 1: SnPb Eutectic Process -
Package Peak Refl ow Temperatures
Package
Thickness Volume mm3 < 350 Volume mm3 ≥ 350
< 2.5 mm 240 +0/-5°C 225 +0/-5°C
≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C
Tabel 2: Pb-free Process -
Package Peak Refl ow Temperatures
Package
Thickness
Volume mm3
< 350
Volume mm3
350 - 2000
Volume mm3
> 2000
< 1.6 mm 260°C * 260°C * 260°C *
1.6 mm - 2.5 mm 260°C * 250°C * 245°C *
≥ 2.5 mm 250°C * 245°C * 245°C *
* Tolerance: The device manufacturer/supplier shall assure process compat-
ibility up to and including the stated classi cation temperature at the rated MSL
level.
Note 1: All temperatures refer
to topside of the package,
measured on the package
body surface.
Note 2: Time within 5 °C of
actual peak temperature (tp)
speci ed for the re ow pro les
is a “supplier” minimum and a
“user” maximum.
Profi le Feature Sn-Pb Eutectic
Assembly
Pb-Free
Assembly
Average Ramp-up rate (Tsmax to Tp) 3°C / second max. 3°C / second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100°C
150°C
60 -120 seconds
150°C
200°C
60 -180 seconds
Time maintained above
- Temperature (TL)
- Time (tL)
183°C
60 - 150 seconds
217°C
60 - 150 seconds
Peak Temperature (TP) See Table 1 See Table 2
Time within 5°C of actual Peak Temperature (tp)210 - 30 seconds 20 - 40 seconds
Ramp-down Rate 6°C / second max. 6°C / second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Sn-Pb Eutectic and Pb-Free Reflow Profiles
Time
Temperature
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t 25°C to Peak
T
P
T
L
T
smax
T
smin
t
s
Preheat
t
L
25
t
P
* Based on Industry Standards and IPC recommendations
IRC Solder Refl ow Recommendations
HSF
High Surge Film
Surface Mount Metal GlazeTM
HSF-1 Series Issue October 2010 Sheet 3 of 4
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Surge Capability Data
Power Derating Curve
Ambient Temperature (C)
010 20 30 40 50 60 70 80 90 100 110 120 130 140 150
100
80
60
40
20
0
Percent of Rated Power
Note: Use for low repetitive pulses where the average power
dissipation is not to exceed the component rating at 70°C.
Surge handling capacity for low-repetitive surges may be
signifi cantly greater than shown above. Contact factory
Ordering Data
Sample Part No.
Type
HSF-1 or HSF-2
Temperature Coeffi cient
200 = ±200ppm/°C (standard)
Note – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at
selected values on request.
Resistance Value
Standard 4-digit resistance code.
Tolerance
K = 10%
Lead-Free Construction
Packaging Code
BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel
HSF-1 200 11R0 K LF 13
HSF
High Surge Film
Surface Mount Metal GlazeTM
HSF-1 Series Issue October 2010 Sheet 4 of 4
Omit for SnPb.
1
10
100
1000
10000
100000
1000000
1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00
Peak Power (Watts)
Surge or Pulse Duration (Seconds)
2512 CHP, HSF SURGE CAPABILITY
for Non-repetitive or Low Repetition Rate Surges
1
10
100
1,000
10,000
100,000
1,000,000
1.E-09 1.E-08 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Peak Power (watts)
Surge or Pulse Duration (seconds)
For Non-repetitive or Low Repetitive Rate Surges on HSF-1
High Surge Film
Surface Mount Metal Glaze™
HSF Series
06.18
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronics.com/resistors
BI Technologies IRC Welwyn