122
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
SPPH1 1.5mm-travel Vertical Type
Vertical push switch with two types of knob available
Snap-in
4,000
Japan Export
2
Poles
Non shorting
Changeover
timing
PC
board
Mounting
method
2 N
3 N
Operating
force
Latching
Momentary
Latching
Momentary
Latching
Latching
Latching
Momentary
Momentary
Operation
Product Line
Straight
Snap-in
Straight
Terminal
type
800
Minimum order unit （pcs.）
1. 5
Standard
Standard
Standard
Short
Short
Short
Travel
（mm）
knob
style
2.5
Total travel
（mm）
SPPH110800
SPPH110300
SPPH120400
SPPH120100
SPPH130400
SPPH130100
SPPH140300
SPPH140100
Product No.
SPPH110900
SPPH130500
SPPH140400
1
2
1
2
1
2
Drawing
No.
■Typical Specifications
Items Specifications
Rating （max.）/（min.）
（Resistive load）
0.1A 30V DC / 50μA 3V DC
Contact resistance
（Initial/After operating life）
20mΩ max. / 40mΩ max.
Operating force
Refer to the products line
Operating life
Without load
10,000 cycles
With load
10,000 cycles （0.1A 30V DC）
Refer to P.130 for soldering conditions.
Number of packages （pcs.）
Export package measurements
（mm）
1 case / Japan
1 case / export packing
800 4,000 400×270×290
Packing Specifications
Bulk
＋1
− 0.7
＋1
− 0.7
123
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
SPPH1／1.5mm-travel Vertical Type
Style
0.35
13.5
5
(0.2)
8.5
3.5
0.6
1.5
2.5
10
7
2.2 20.4
Travel
Total travel
Terminal No.4
A
2.5 2.5
5
4
10
(1.5)
Travel
3.5
0.6
17.5
9
8.5
2.5
2.5
10
7
3.3
2.5
1.5
2.5
Total travel
A
2-R0.5
Terminal No.4
0.35
5
1
5
(0.2)
2
1
2.5
3.3
4
10
(1.8)
2-R0.5
ø0.9 hole
(5)
2.5 2.5
4.1
Thickness of PC board t=1.6mm
ø0.9 hole
5
2.5 2.5
Straight terminal Snap-in terminal
Dimensions Unit:mm
PC board mounting hole dimensions
（Viewed from the direction A）
No.
1
ø0.9 hole
(5)
2.5 2.5
4.1
Thickness of PC board t=1.6mm
ø0.9 hole
5
2.5 2.5
Straight terminal Snap-in terminal
2
0.35
(3.5)
5
3.9
R1
50.35
0.8
1.9
2.8
(3.5)
123
456
Circuit Diagram
（Viewed from Direction A）
Straight terminal Snap-in terminal
Terminal Configuration Unit:mm
109
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Series Vertical
SPEH SPEJ SPPH4 SPPH1
Photo
Dimensions
（mm）
W
6 7 6.5 10
D
6 7 8.5 10
H
55.95 8.5
Travel （mm）
— — 2.2 1. 5
Total travel （mm）
1. 6 1.7 32.5
Number of poles
1 2
Operating
temperature range
−40℃ to ＋90℃ −40℃ to ＋85℃ −10℃ to ＋60℃
Automotive use
●●—●
Life cycle
Rating （max.）
（Resistive load）
5 0 m A 16 V D C 0.2A 14V DC 0.1A 30V DC
Rating （min.）
（Resistive load）
10μA 1V D C —50μA 3V DC
Durability
Operating life
without load
100,000cycles
400mΩ max. 10,000cycles 150mΩ max. 10,000cycles
10 0 mΩ ma x .
10,000cycles
40mΩ max.
Operating life with load
（at max. rated load）
100,000cycles
400mΩ max. 10,000cycles 150mΩ max. 10,000cycles
10 0 mΩ ma x .
10,000cycles
40mΩ max.
Electrical
performance
Initial contact
resistance
200mΩ max. 15 0 mΩ ma x . 10 0 mΩ ma x . 20mΩ max.
Insulation
resistance
10 0 MΩ mi n . 10 0 V D C 100MΩ min. 500V DC
Voltage proof
250V AC for 1minute 5 0 0 V A C f o r 1m i n u t e
Mechanical
performance
Terminal
strength
— — 5 N f o r 1min u t e
Actuator
strength
Operating
direction
50N 49N 30N 50N
Pulling
direction
— — 10 N —
Environmental
performance
Cold
–40℃ 1000h –40℃ 500h –20℃ 96h
Dry heat
90℃ 1000h 85℃ 500h 85℃ 96h
Damp heat
60℃,
90 to 95%RH 1000h
60℃,
90 to 95%RH 500h 40℃, 90 to 95%RH 96h
Page
119 12 0 121 12 2
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 131
Note
● Indicates applicability to all products in the series.
130
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
260
Series（Reflow type）
230 40 18 0 15 0 12 0
SPEJ
SPEF
A（℃）
3s max. B（℃） C（s） D（℃） E（℃） F（s）
10 ±1s
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPPH4
SPUN
SPPJ3 10 0 ℃ ma x . 60s max. 260±5℃ 5 ±1s
10 0 ℃ ma x . 60s max. 260±5℃ 10 ±1s
—260±5℃ 5 ±1s
—260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
3 0 0 ±10 ℃
SPUJ 3 +1/ 0 s
350℃ max.
SPEH
SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用
Push Switches / Soldering Conditions
