1. Product profile
1.1 General description
Single high-speed switching diodes, fabricated in planar technology, and encapsulated in
small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages.
1.2 Features
nHigh switching speed: trr ≤4ns
nReverse voltage: VR≤75 V
nRepetitive peak reverse voltage: VRRM ≤100 V
nRepetitive peak forward current: IFRM ≤450 mA
nSmall hermetically sealed glass SMD package
1.3 Applications
nHigh-speed switching
nReverse polarity protection
1.4 Quick reference data
PMLL4148L; PMLL4448
High-speed switching diodes
Rev. 07 — 31 January 2007 Product data sheet
Table 1. Product overview
Type number Package Configuration
PMLL4148L SOD80C single
PMLL4448
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current [1] - - 200 mA
IFRM repetitive peak forward
current - - 450 mA
VRreverse voltage - - 75 V
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 2 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] When switched from IF= 10 mA to IR= 60 mA; RL= 100 Ω; measured at IR= 1 mA.
2. Pinning information
[1] The marking band indicates the cathode.
3. Ordering information
4. Marking
[1] black: made in Philippines
brown: made in China
VFforward voltage
PMLL4148L IF=50mA --1V
PMLL4448 IF= 5 mA 620 - 720 mV
IF= 100 mA - - 1 V
trr reverse recovery time [2] --4ns
Table 2. Quick reference data
…continued
Symbol Parameter Conditions Min Typ Max Unit
Table 3. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode ka
sym006
Table 4. Ordering information
Type number Package
Name Description Version
PMLL4148L - hermetically sealed glass surface-mounted package;
2 connectors SOD80C
PMLL4448
Table 5. Marking codes
Type number Marking code[1]
PMLL4148L marking band
PMLL4448 marking band
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 3 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
5. Limiting values
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Tj=25°C prior to surge.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse
voltage - 100 V
VRreverse voltage - 75 V
IFforward current [1] - 200 mA
IFRM repetitive peak forward
current - 450 mA
IFSM non-repetitive peak forward
current square wave [2]
tp=1µs-4A
tp=1ms - 1 A
tp= 1 s - 0.5 A
Ptot total power dissipation Tamb =25°C[1] - 500 mW
Tjjunction temperature - 200 °C
Tamb ambient temperature −65 +200 °C
Tstg storage temperature −65 +200 °C
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 350 K/W
Rth(j-sp) thermal resistance from
junction to solder point - - 300 K/W
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 4 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
7. Characteristics
[1] When switched from IF= 10 mA to IR= 60 mA; RL= 100 Ω; measured at IR= 1 mA.
[2] When switched from IF= 50 mA; tr=20ns.
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage
PMLL4148L IF=50mA --1V
PMLL4448 IF= 5 mA 620 - 720 mV
IF= 100 mA - - 1 V
IRreverse current VR=20V --25nA
VR= 20 V; Tj= 150 °C --50µA
IRreverse current
PMLL4448 VR= 20 V; Tj= 100 °C --3µA
Cddiode capacitance VR= 0 V; f = 1 MHz - - 4 pF
trr reverse recovery time [1] --4ns
VFR forward recovery voltage [2] - - 2.5 V
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 5 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
FR4 PCB, standard footprint (1) Tj= 175 °C; typical values
(2) Tj=25°C; typical values
(3) Tj=25°C; maximum values
Fig 1. Forward current as a function of ambient
temperature; derating curve Fig 2. Forward current as a function of forward
voltage
Based on square wave currents.
Tj=25°C; prior to surge (1) VR= 75 V; maximum values
(2) VR= 75 V; typical values
(3) VR= 20 V; typical values
Fig 3. Non-repetitive peak forward current as a
function of pulse duration; maximum values Fig 4. Reverse current as a function of junction
temperature
0 100 200
300
200
0
100
mbg451
Tamb (°C)
IF
(mA)
012
600
0
200
400
mbg464
VF (V)
IF
(mA)
(1) (2) (3)
mbg704
10
1
102
IFSM
(A)
10−1
tp (µs)
110
4
103
10 1020 100 Tj (°C) 200
103
102
10−1
10−2
10 (1) (2)
1
IR
(µA)
mgd006
(3)
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 6 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
8. Test information
f = 1 MHz; Tj=25°C
Fig 5. Diode capacitance as a function of reverse voltage; typical values
01020
1.2
1.0
0.6
0.4
0.8
mgd004
VR (V)
Cd
(pF)
(1) IR=1mA
Input signal: reverse pulse rise time tr= 0.6 ns; reverse voltage pulse duration tp= 100 ns; duty cycle δ≤0.05
Oscilloscope: rise time tr= 0.35 ns
Fig 6. Reverse recovery time test circuit and waveforms
Input signal: forward pulse rise time tr= 20 ns; forward current pulse duration tp≥100 ns; duty cycle δ≤0.005
Fig 7. Forward recovery voltage test circuit and waveforms
trr
(1)
+ IFt
output signal
trtpt
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50 ΩIF
D.U.T.
Ri = 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
trt
tp
10 %
90 %
I
input signal
RS = 50 Ω
I
Ri = 50 Ω
OSCILLOSCOPE
1 kΩ450 Ω
D.U.T.
mga882
VFR
t
output signal
V
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 7 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 8. Package outline SOD80C
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
Note
1. The marking band indicates the cathode.
SOD80C 100H01 05-01-26
06-03-16
Hermetically sealed glass surface-mounted package; 2 connectors SOD80C
UNIT D
mm 1.60
1.45 3.7
3.3 0.3
HL
DIMENSIONS (mm are the original dimensions)
H
D
LL
(1)
0 1 2 mm
scale
ka
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
2500 10000
PMLL4148L SOD80C 4 mm pitch, 8 mm tape and reel -115 -135
PMLL4448
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 8 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
11. Soldering
Fig 9. Reflow soldering footprint SOD80C
Fig 10. Wave soldering footprint SOD80C
sod080c
2.30
4.30
4.55
1.601.702.25
0.90
(2x)
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
sod080c
2.70
4.90
6.30
1.702.90
1.90
solder lands
tracks
solder resist
occupied area
Dimensions in mm
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 9 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMLL4148L_PMLL4448_7 20070131 Product data sheet - PMLL4148L_PMLL4448_6
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Section 1.2 “Features”: adapted
•Section 1.3 “Applications”: amended
•Table 2 “Quick reference data”: VF conditions for PMLL4148L updated
•Table 8 “Characteristics”: VF conditions for PMLL4148L updated
•Figure 4: unit for IR in axis description amended to µA
•Section 13 “Legal information”: updated
PMLL4148L_PMLL4448_6 20050404 Product data sheet - PMLL4148L_4448_5
PMLL4148L_4448_5 20020123 Product specification - PMLL4148L_4448_4
PMLL4148L_4448_4 20001115 Product specification - PMLL4148_3
PMLL4148_3 19990527 Product specification - PMLL4148_2
PMLL4148_2 19960918 Product specification - PMLL4148_1
PMLL4148_1 19960423 Product specification - -
PMLL4148L_PMLL4448_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 31 January 2007 10 of 11
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PMLL4148L; PMLL4448
High-speed switching diodes
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 January 2007
Document identifier: PMLL4148L_PMLL4448_7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 7
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
14 Contact information. . . . . . . . . . . . . . . . . . . . . 10
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
