A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 1.0 General Description The AMIS-41682 is implemented in I2T100 technology enabling both high-voltage analog circuitry and digital functionality to co-exist on the same chip. The new AMIS-4168x is an interface between the protocol controller and the physical wires of the bus lines in a control area network (CAN). The new AMIS-41683 is identical to the AMIS-41682 but has a true 3.3V digital interface to the CAN controller. This product consolidates the expertise of AMIS for in car multiplex transceivers and supports together with AMIS-30522 (VAN), AMIS30660 and AMIS-30663 (CAN High Speed), and AMIS-30600 (LIN) another widely used physical layer. The device provides differential transmit capability but will switch in error conditions to single-wire transmitter and/or receiver. Initially it will be used for low speed applications, up to 125kBaud, in passenger cars. 2.0 Key Features * Optimized for in-car low-speed communication Baud rate up to 125kBaud Up to 32 nodes can be connected Due to built-in slope control function and a very good matching of the CANL and CANH bus outputs this device realizes a very low electro magnetic emission (EME) Fully integrated receiver filters Permanent dominant monitoring of transmit data input Differential receiver with wide common-mode range for high electro magnetic susceptibility (EMS) in normal- and low-powermodes True 3.3V digital I/O interface to CAN controller for AMIS-41683 only * Management in case of bus failure In the event of bus failures, automatic switching to single-wire mode, even when the CANH bus wire is short circuited to VCC The device will automatically reset to differential mode if the bus failure is removed During failure modes there is full wake-up capability Un-powered nodes do not disturb bus lines * Protection issues Short circuit proof to battery and ground Thermal protection The bus lines are protected against transients in an automotive environment An un-powered node does not disturb the bus lines * Support for low power modes Low current sleep and standby mode with wake-up via the bus lines Power-on-reset flag on the output Two-edge sensitive wake-up input signal via pin SLEEP 3.0 Technical Characteristics Table 1: Technical Characteristics Symbol Parameter Conditions VCANH DC voltage at pin CANH, CANL 0 < VCC < 5.25V; no time limit Vbat Voltage at pin Vbat Load dump 4.0 Ordering Information Table 2: Ordering Information Ordering Code Marketing Name Package Temp Range D2CANM AMIS41682AGA SOIC-14 GREEN -40C...125C C2CANN AMIS41683AGA SOIC-14 GREEN -40C...125C AMI Semiconductor www.amis.com 1 Min. Max. Unit -40 +40 V +40 V A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 5.0 Block Diagram VBAT INH 1 WAKE STB EN 7 GND 14 ERR Mode & wake-up control 5 6 9 13 2 4 11 Thermal shutdown Driver control 12 8 Timer Failure handling Receiver RxD 10 POR VCC TxD VCC Filter 3 AMIS-4168x Figure 1: Block Diagram AMI Semiconductor www.amis.com 2 RTL CANH CANL RTH A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 6.0 Typical Application Schematic 6.1 Application Schematic OUT VCC VCC INH 10 CAN controller IN 5V-reg VBAT WAKE VBAT 14 1 EN 6 ERR 4 STB RxD AMIS-41682 5 7 9 RTL CANL 12 CANH 11 3 TxD 2 GND RTH 8 13 GND CAN BUS LINE PC20041029.3 Figure 2: Appplication Diagram AMIS-41682 OUT OUT 3.3Vreg IN 5V-reg IN VBAT 4.7 kW VCC VCC INH 10 3.3V CAN controller VBAT 14 1 EN 6 ERR 4 STB RxD 5 AMIS-41683 WAKE 7 9 12 11 3 TxD 2 13 8 RTL CANL CANH RTH GND GND CAN BUS LINE PC20041029.5 Figure 3: Application Diagram AMIS-41683 AMI Semiconductor www.amis.com 3 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 6.2 Pin Description 1 TxD 2 RxD 3 ERR 4 STB 5 EN 6 WAKE 7 AMIS-4168x INH 14 VBAT 13 GND 12 CANL 11 CANH 10 VCC 9 RTL 8 RTH PC20041029.1 Figure 4: Pin Configuration (top view) Table 3: Pin Description Pin Name Description 1 INH Inhibit output for external voltage regulator Transmit data input; internal pull-up current 2 TxD 3 RxD Receive data output 4 ERR-B Error; wake-up and power-on flag; active low 5 STB-B Standby digital control input; active low; pull-down resistor 6 EN Standby digital control input; active high; pull-down resistor 7 WAKE-B Enable digital control input; falling and rising edges are both detected 8 RTH Pin for external termination resistor at CANH 9 RTL VCC 5V supply input 10 Pin for external termination resistor at CANL 11 CANH Bus line; high in dominant state 12 CANL Bus line; low in dominant state 13 GND Ground 14 BAT Battery supply Note: Functional description and characteristics are made for the AMIS41682 but are also valid for the AMIS-41683. The difference between the two devices is explicitly mentioned in text. AMI Semiconductor www.amis.com 4 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 7.0 Functional Description 7.1 Description AMIS-41682 is a fault tolerant CAN transceiver which works as an interface between the CAN protocol controller and the physical wires of the CAN bus (see Figure 2). It is primarily intended for low speed applications, up to 125kBaud, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. The failure detection logic automatically selects a suitable transmission mode, differential or single-wire transmission. The AMIS-41683 has open-drain outputs (RXD and ERR-B pins) that allow the user to use external pull-up resistors to the required supply voltage; this can be 5V or 3.3V. A high common-mode range for the differential and single ended receiver guarantees reception under worst case conditions and together with the integrated filter the circuit realizes a excellent immunity against EMS. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode. Together with the transmission mode, the failure detector will configure the output stages in such a way that excessive current are avoided and that the circuit returns to normal operation when the error is removed. To reduce EME, the rise and fall slope are limited. Together with matched CANL and CANH output-stages, this allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. The symmetry of the outputs is guaranteed through the parameters VCMpeak and VCM-step. A timer has been integrated at pin TXD. This timer prevents the AMIS-41682 from driving the bus lines to a permanent dominant state. 7.2 Failure Detector When one of the bus failures 3, 5, 6, 6a, and 7 is detected, the defective bus wire is disabled by switching off the affected bus termination and the respective output stage. A wake-up from sleep mode via the bus is possible either via a dominant CANH or CANL line. This ensures that a wake-up is possible even if one of the failures 1 to 7 occurs. If any of the wiring failure occurs, the output signal on pin ERR will become low. On error recovery, the output signal on pin ERR will become high again. The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode. The different wiring failures are depicted in Figure 4. The figure also indicates the effect of the different wiring failures on the transmitter and the receiver. The detection circuit itself is not depicted. The differential receiver threshold voltage is typically set at 3V (VCC = 5V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 4, and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. During the failure, reception is still done by the differential receiver and the transmitter stays fully active. During all single-wire transmissions, the EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In the single-wire mode, LF noise cannot be distinguished from the required signal. To avoid false triggering by external RF influences the single-wire modes are activated after a certain delay time. When the bus failure disappears for an other time delay, the transceiver switches back to differential mode. AMI Semiconductor www.amis.com 5 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Failure 1 : CANH wire interrupted Vbat Data Sheet Failure 4 : CANL shorted to Gnd Vcc Vbat RTL RTL 0.6Vcc TxD RxD Vcc RTL CANL CANL CANH CANH ERR 0.6Vcc CL CD TxD RxD CH RxD ERR CANL CANL CANH CANH ERR 0.6Vcc CL CD TxD RxD CH RxD ERR Vcc RTL 0.6Vcc CANL CANL CANH CANH ERR CD TxD RxD CH RxD ERR CANL CANL CANH CANH TxD CL CD RxD CH ERR 0.4Vcc RTH RTH RTH Error-detection: CL = CH more then 4 pulses Failure 7 : CANH shorted to CANL Vbat RTL CANL CANL CANH CANH ERR Vcc RTL 0.6Vcc RTL 0.6Vcc TxD CL CD TxD RxD CH RxD ERR CANL CANL CANH CANH ERR 0.4Vcc Vcc ERR RTL ERR Failure 3a : CANH shorted to Vcc Vcc Vbat Vcc RTH Vcc 0.6Vcc CL Error-detection: CANH > 2V longer then Tnd_f3 RxD CH RTH TxD 0.4Vcc TxD RxD Failure 6a : CANL shorted to Vcc Vbat RTL CANH TxD CL CD Error-detection: CANL>7V RTL Vbat CANH RTH Vcc RTH CANL 0.4Vcc RTH Failure 3 : CANH shorted to Vbat RxD CANL ERR Error-detection: CL = CH more then 4 pulses TxD RTL TxD 0.4Vcc RTL ERR RTH RTL 0.6Vcc Vbat RxD CH Failure 6 : CANL wire shorted to Vbat Vbat Vcc Vbat RTL RTH CANH TxD CL CD Error-detection: dominant longer then Tnd_f4 Vcc RxD CANH RTH Failure 2 : CANL wire interrupted TxD CANL 0.4Vcc RTH RTL CANL ERR Error-detection: CL = CH more then 4 pulses Vbat RTL TxD 0.4Vcc RTH GND RTH RxD CH ERR 0.4Vcc RTH Error-detection: CANH >2V longer then Tnd_f3 TxD CL CD RTH Error-detection: dominant longer then Tnd_f7 Failure 5 : CANH shorted to Gnd Vbat Vcc RTL RTL 0.6Vcc TxD RxD CANL CANL CANH CANH ERR TxD CL CD RxD CH ERR 0.4Vcc RTH GND RTH Error-detection: CL = CH more then 4 pulses Figure 5: Different Types of Wiring Failure 7.3 Low Power Modes The transceiver provides three low power modes, which can be entered and exited via pins STB and EN (see Figure 5). (Go-to-sleep mode is only a transition mode) voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided pins RXD and ERR will signal the wakeup interrupt signal. The sleep mode is the mode with the lowest power consumption. Pin INH is switched to high-impedance for deactivation of the external The standby mode will react the same as the sleep mode but with a high-level on pin INH. AMI Semiconductor www.amis.com 6 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver The power-on standby mode is the same as the standby mode with the battery power-on flag instead of the wake-up interrupt signal on pin ERR. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag. Data Sheet If VCC is provided the wake-up request can be read on the ERR or RXD outputs, so the external microcontroller can wake-up the transceiver (switch to normal operating mode) via pins STB and EN. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4, and 7. Wake-up request is detected by the following events: * Power-on (Vbat was below the battery POR-level of 1V) * Local wake-up: Rising or falling edge on input WAKE (Levels maintained for a certain period) * Remote wake-up: A message with five consecutive dominant bits The go-to-sleep-mode is only a transition mode. The pin INH stays active for a limited time. During this time the circuit can still go to an other low-power-mode. After this time the circuit go to the sleep-mode. Once VCC is below the threshold level of POR, the signals on pins STB and EN will internally be set to low-level to provide fail safe functionality. On a wake-up request the transceiver will set the output on pin INH high which can be used to activate the external supply voltage regulator. Power-On Stand-by STB EN High Low EN change state INH ERR RxD RTL Act PORflag WUint Vbat EN, STB change state STB change state Normal Mode STB EN High High INH ERR Act Errflag GoTo Sleep Mode STB change state RxD RTL Rec. out STB Vcc EN Low High EN, STB change state INH ERR RxD RTL Act 2) WUint WUint Vbat Time-out GoToSleep mode EN change state Sleep Mode Standby Mode STB Low EN Low INH ERR RxD RTL Act WUint WUint STB Vbat Local or Remote Wake-up 3) Power-On 1) Only when Vcc > POR_Vcc 2) INH active for a time = T_GoToSleep 3) Local Wake-up through pin Wake which change state for a time > T_wake_min Remote Wake-up through pin CANL or CANH when dominant for a time >TCANH_min or TCANL_min 4) Mode Change through pins STB and EN is only possible if Vcc > POR_Vcc Low EN Low INH ERR RxD RTL Hz WUint 1) WUint 1) Vbat Mode Change 4) Figure 6: Low Power Modes 7.4 Power-on After power-on (VBAT switched on) the signal on pin INH will become high and an internal power-on flag will be set. This flag can be read in AMI Semiconductor www.amis.com the power-on standby mode via pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode. 7 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 7.5 Protections and hence a lower chip temperature. All other parts of the IC will remain operating. A current limiting circuit protects the transmitter output stages against short circuit to positive and negative battery voltage. If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment. 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (pin 13). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in this clause may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC Supply voltage on pin VCC -0.3 +6 V VBAT Battery voltage on pin BAT -0.3 +40 V Vdig DC voltage on pins EN, STB-B, ERR-B, TxD, RxD -0.3 VCC + 0.3 V VCANH-L DC voltage on pins CANH, CANL -40 +40 V Vtran-CAN Transient voltage on pins CANH and CANL (Figure 9) note 1 -350 VWAKE DC input voltage on pin WAKE +350 V VBAT + 0.3 V IWAKE DC input current on pin WAKE -15 VINH DC output voltage on pin INH -0.3 VBAT + 0.3 mA V VRTH-L DC voltage on pin RTH, RTL -40 40 RRTH Termination resistance on pin RTH 500 16000 V W RRTL Termination resistance on pin RTL 500 16000 W Tjunc Maximum junction temperature -40 +150 C Vesd Electrostatic discharge voltage (CANH and CANL pin) HBM; note 2 Electrostatic discharge voltage (other pins) HBM; note 2 Electrostatic discharge voltage; machine model; note 3 -8.0 -4.0 -500 +8.0 +4.0 +500 kV kV V Notes: 1. The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. 2. Equivalent to discharging a 100pF capacitor through a 1.5kOhm resistor. 3. Equivalent to discharging a 200pF capacitor through a 10Ohm resistor and a 0.75mH coil. 8.3 Thermal Characteristics Table 5: Thermal Characteristics Symbol Parameter Conditions Value Unit Rth (vj-a) Thermal resistance from junction to ambient in SSOP14 package (2 layer PCB) In free air 140 K/W Rth (vj-s) Thermal resistance from junction to substrate of bare die In free air 30 K/W AMI Semiconductor www.amis.com 8 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 8.4 Characteristics VCC = 4.75V to 5.25V; VBAT = 5V to 50V; Tjunc = -40C to 150C; unless otherwise specified. Table 6: Characteristics Symbol Parameter Supplies Vcc Vbat Conditions ICC Supply current Normal operating mode; VTXD = VCC (recessive) Normal operating mode; VTXD = 0V (dominant); no load LAG_Vcc Forced low power mode VCC rising VCC talling IBAT Battery current on pin BAT In all modes of operation; 500Ohm between RTL - CANL; 500Ohm between RTH - CANH; VBAT = WAKE = INH = 12V; VBAT = WAKE = INH = 5 to 50V ICC + IBAT Supply current plus battery current POR-level for pin Vbat FLAG_VBAT Min. Typ. Max. Unit 1 1 3.7 8 6.3 12 mA mA 4.5 V V 2.45 10 10 30 30 50 125 mA mA Low power modes; Vcc = 5V; VBAT = VWAKE = VINH = 12V 30 60 mA For setting power-on flag For not setting power-on flag 3.5 2.1 2.4 1 V V Pins STB, EN and TXD VIH High-level input voltage 0.7 x Vcc 6.0 V VIL Low-level input voltage -0.3 0.3 x Vcc I-PU-H High-level input current pin TXD TXD = 0.7 * Vcc -10 -200 V mA -800 mA 600 KW 0.75 4 5 50 ms ms I-PU-L Low-level input current pin TXD TXD = 0.3 * Vcc -80 R-PD Pull-down resistor at pin EN and STB-B 1V 190 T_Dis_TxD Dominant time-out for TxD Normal mode; VtxD = 0V T_GoToSleep Minimum hold-time for Go-To-Sleep mode 360 Pins RXD and ERR-B VOH High-level output voltage Isource = -1mA VCC - 0.9 VCC V Low-level output voltage Isink = 1.6mA Isink = 7.5mA 0 0 0.4 1.5 V V IIL Low-level input current VWAKE = 0V; VBAT = 27V -10 -1 mA Vth (WAKE) Wake-up threshold voltage VSTB-B = 0V 2.5 3.9 T_Wake_Min Minimum time on pin wake (debounce time) VBAT = 12V; low power mode; for rising and falling edge V ms Delta_VH High-level voltage drop IINH = 0.18mA I_leak Leakage current Sleep mode; VINH = 0V VOL Pin WAKE 7 3.2 38 Pin INH AMI Semiconductor www.amis.com 9 0.8 1 V mA A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet Table 6: Characteristics Continued Symbol Parameter Pins CANH and CANL (receiver) Conditions Vdiff Differential receiver threshold voltage VseCANH Min. Typ. Max. Unit No failures and bus failures 1, 2, 3, and 6a; see Figure 4 VCC = 5V VCC = 4.75V to 5.25V -3.25 0.65 x Vcc -3 0.6 x Vcc -2.75 0.55 x Vcc V V Single-ended receiver threshold voltage on pin CANH Normal operating mode and failures 4, 6 and 7 VCC = 5V VCC = 4.75V to 5.25V 1.6 1.775 1.95 0.32 x Vcc 0.355 x Vcc 0.39 x Vcc V V VseCANL Single-ended receiver threshold voltage on pin CANL Normal operating mode and failures 3 and 3a VCC = 5V VCC = 4.75V to 5.25V 3 3.2 3.4 0.61 x Vcc 0.645 x Vcc 0.68 x Vcc V V Vdet(CANL) Detection threshold voltage for short circuit Normal operating mode to battery voltage on pin CANL Vth(wake) Wake-up threshold voltage On pin CANL On pin CANH DVth(wake) Difference of wake-up threshold voltages 6.5 7.3 8 V Low power modes Low power modes 2.5 1.1 3.2 1.8 3.9 2.25 V V Low power modes 0.8 1.4 V Pins CANH and CANL (transmitter) VO(reces) Recessive output voltage On pin CANH On pin CANL VTXD = VCC RRTH < 4kW RRTL < 4kW VO(dom) Dominant output voltage On pin CANH On pin CANL VTXD = 0V; VEN = VCC ICANH = -40mA ICANL = 40mA IO(CANH) Output current on pin CANH Normal operating mode; VCANH = 0V; VTXD = 0V Low power modes: VCANH = 0V; VCC = 5V IO(CANL) Output current on pin CANL 0.2 Vcc - 0.2 Normal operating mode; VCANL = 14V; VTXD = 0V Low power modes; VCANL = 12V; VBAT = 12V Vcc - 1.4 V V 1.4 V V -100 -80 -45 mA -1 0 1 mA 45 80 110 mA -1 0 1 mA Pins RTH and RTL Rsw(RTL) Switch-on resistance between pin RTL and VCC Normal operating mode; I(RTL) > -10mA 100 W Rsw(RTH) Switch-on resistance between pin RTH and ground Normal operating mode; I(RTH) > 10mA 100 W VO(RTH) Output voltage on pin RTH Low power modes; IO = 1mA IO(RTL) Output current on pin RTL Low power modes; VRTL = 0V Ipu(RTL) Pull-up current on pin RTL Normal operating mode and failures 4, 5 and 7; VRTL = 0V -75 mA Ipd(RTH) Pull-down durrent on pin RTH Normal operating mode and failures 3 and 3a -75 mA Junction temperature For shutdown -1.25 1.0 V -0.3 mA Thermal shutdown Tj AMI Semiconductor www.amis.com 10 150 180 C A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 8.5 Timing Characteristics VCC = 4.75V to 5.25V; VBAT = 5V to 27V; VSTB = VCC; Tjunc = -40C to 150C; unless otherwise specified. Table 7: Timing Characteristics Symbol tt(r-d) tt(d-r) tPD(L) tPD(H) tCANH(min) tCANL(min) tdet Parameter CANL and CANH output transition time for recessive-to-dominant CANL and CANH output transition time for dominant-to-recessive Propagation delay TXD to RXD (LOW) Propagation delay TXD to RXD (HIGH) Minimum dominant time for wake-up on pin CANH Minimum dominant time for wake-up on pin CANL Failure detection time trec Failure recovery time Dpc Pulse-count difference between CANH and CANL Conditions 10% to 90%; C1 = 10nF; C2 = 0; R1 = 100W; see Figure 6 10% to 90%; C1 = 1nF; C2 = 0; R1 = 100W; see Figure 5 No failures and failures 1, 2, 4, and 6a; see Figure 6, 7 C1 = 1nF; C2 = 0; R1 = 100W C1 = C2 - 3.3nF; R1 = 100W Min. Typ. Max. Unit 0.35 0.6 1.4 ms 0.2 0.3 0.7 ms 0.75 1.00 1.5 1.75 ms ms Failures 3, 3a, 5, 6, and 7; see Figure 6, 7 C1 = 1nF; C2 = 0; R1 = 100W C1 = C2 - 3.3nF; R1 = 100W 0.85 1.1 1.85 1.7 ms ms No failures and failures 1, 2, 4, and 6a; see Figure 6, 7 C1 = 1nF; C2 = 0; R1 = 100W C1 = C2 - 3.3nF; R1 = 100W 1.2 2.5 1.9 3.3 ms ms Failures 3, 3a, 5, 6, and 7; see Figure 6, 7 C1 = 1nF; C2 = 0; R1 = 100W C1 = C2 - 3.3nF; R1 = 100W 1.1 1.5 1.7 2.2 ms ms Low power modes; VBAT = 12V 7 38 ms Low power modes; VBAT = 12V 7 38 ms 1.6 0.3 8.0 1.6 ms ms 1.6 0.3 8.0 1.6 ms ms 0.3 7 125 1.6 38 750 ms ms ms 1.6 ms Normal mode Failure 3 and 3a Failure 4, 6 and7 Low power modes; VBAT = 12V Failure 3 and 3a Failure 5 and 7 Normal mode Failure 3 and 3a Failure 4 and 7 Failure 6 Low power modes; VBAT = 12V Failures 3, 3a, 5, and 7 Normal mode and failures 1, 2, 3, and 6a Failure detection (pin ERR becomes LOW) Failure recovery 0.3 4 4 BATTERY +5V VCC INH 10 VBAT 1 14 EN 6 ERR 4 STB RxD 20 pF 5 AMIS-4168x WAKE 7 9 12 11 3 TxD 2 8 13 RTL C1 R1 10 KW CANL C3 CANH RTH R2 10 KW C2 GND PC20041029.4 Figure 7: Test Circuit for Dynamic Characteristics AMI Semiconductor www.amis.com 11 Common Mode voltage V A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Recessive Data Sheet Dominant Recessive VTXD VCC 0V VCANL 3.6 V 5V 1.4 V VCANH 0V 2.2 V -3.2 V VDIFF= VCANHVCANL VDIFF -5 V RXD 0.3VCC 0.7VCC TPD(L) TPD(H) Figure 8: Timing Diagram for AC Characteristics (See Measurement Setup Figure 7) CANL CANH r e c e s s iv e d o mi n a n t V c o mmo n -mo de v o lta g e r e c e s s iv e V C M - st e p CM- pe a k V CM- pe a k Figure 9: Timing Diagram for Common-Mode Voltage (See Measurement Setup Figure 7) BATTERY +5V 14 EN 6 ERR 4 STB RxD 20 pF 5 AMIS-4168x WAKE 7 9 12 11 3 TxD 2 8 13 GND 1 nF RTL CANL 511 W VBAT 1 Transient Generator RTH 125 W PC20041029.5 Figure 10: Test Circuit for Schaffner Tests AMI Semiconductor www.amis.com 12 1 nF CANH 511 W VCC INH 10 1 nF 1 nF A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 9.0 Package Outline Symbol A A1 A2 B C D E e H h L N a Variations Common Dimensions Min. Nom. Max. .061 .064 .068 .004 .006 0.010 .055 .058 .061 .0138 .016 .020 .0075 .008 .0098 See Variations .150 .155 .157 .050 BSC .230 .236 .244 .010 .013 .016 .016 .025 .035 See Variations 0 5 8 Notes: 1. Maximum die thickness allowable is .015 2. Dimensioning and tolerances per ANSI.Y14.5M - 1982. 1 3. "L" is the length of terminal for soldering to a substrate 4. "N" is the number of terminal positions 5. Formed leads shall be planar with respect to one another within .003 inches at seating plane 6. Country of origin location and ejector pin on package 2 bottom is optional and depend on assemble location 7. Controlling dimension: inches 1 D Note AA AB AC Note Min. .189 .337 .386 2 N Nom. .194 .342 .391 Max. .196 .344 .393 8 14 6 Figure 11: SOIC-14 - Plastic Small Outline; 14 Leads; Body Width 150 mil; JEDEC: MS-012 AMI Semiconductor www.amis.com 13 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet 10.0 Soldering 10.1 Introduction Introduction to soldering surface mount packages. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 10.2 Reflow soldering soldering and cooling) vary between 100 and 200 seconds depending on heating method. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Typical reflow peak temperatures range from 215 to 250C. The topsurface temperature of the packages should preferably be kept below 230 C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, 10.3 Wave Soldering parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printedcircuit board; smaller than 1.27mm, the footprint longitudinal axis must be Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. AMI Semiconductor www.amis.com 12 A M I S - 4 1 6 8 x Fault Tolerant CAN Transceiver Data Sheet Table 8: Soldering Soldering Method Package Wave R e f l o w (1) BGA, SQFP Not suitable Suitable HLQFP,HSQFP, HSOP, HTSSOP, SMS Not suitable PLCC (3), SO, SOJ Suitable LQFP, QFP, TQFP Not recommended SSOP, TSSOP, VSO Not recommended (5) (2) Suitable Suitable (3)(4) Suitable Suitable Notes: 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." 2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). AMI Semiconductor www.amis.com 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. 14 (c) 2004 AMI Semiconductor, Inc. AMI Semiconductor makes no warranty for the use of its products, other than those expressly contained in the company's standard warranty contained in AMI Semiconductor's Terms and Conditions. The company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of AMI Semiconductor are granted by the company in connection with the sale of AMI Semiconductor products, expressly or by implication. I2C is a licensed trademark of Philips Electronics, N.V. AMI Semiconductor reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. KM