MOTOROLA SEMICONDUCTOR Order this document by MM BF0201 NLT1/D DATA `a o LINETM GREEN a TECHNICAL Small-Signal MOSFETS = I TMOS Sing16 N-Channel Field Effect ~ansistors Low ~~~(~n) Pan of the GreenLineTM serving Potifolio of devices with I energy-con- traits. These miniature surface mount MOSFETS utilize Motorola's High Cell Density, HDTMOS process. Low rDS(~n) assures minimal power loss and consewes energy, making this device ideal for use in small power management circuitry. Typical applications are de-de converters, power management in portable and battery- powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. Low rDS(on) Provides Higher Efficiency and Extends Battery Life o Miniature SOT-23 Surface Mount Package Saves Board Space ,~ ,. \*,,, ,R,$lyg,&;~' Drain-to-Source Symbol Value Unit vDSS 20 Vdc VGS f 20 Vdc ID ID IDM 300 mAdc 240 750 `, .,. . :3,;,,. ,/,, \*:,~~,lj~,: ~.:,..'. ~,,,4*. , Voltage pD Total Power Dissipation Operating and Stora@'~Jernp;rature Range TJ , Tstg Thermal Resist@c$#$~nction-t&Ambient ..,.> .,. Maximum Ld@%@rnperature for Soldering Purposes, 1/8 from case for 10 seconds .,.:, ~",.e .... ,.- ,< !,,. ORDERING Device e INFORMATION Reel Size Tape Width MMBF0201NLT1 T 12 mm embossed tape 3000 MMBF0201NLT3 lY 12 mm embossed tape 10,000 Quantity GreenLine is a trademark of Motorola, Inc. HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. (Replaces MMBF0201 @ Motorola, Inc. 1995 N/D) @ 225 -55to mW 150 "c ReJA 625 `cm TL 260 `c MMBF0201NLTI ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ v(BR)DSS 20 -- I Max Unit OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = OVdc, ID = 10 wA) Zero Gate Voltage Drain Current (VDS'= 16 Vdc, VGS = O Vdc) (VDS = 16 Vdc, VGS = O Vdc, TJ = 125C) Leakage Current (VGS = * 20 Vdc, VDS = O) ,. . ON CHARACTERISTICSI1 ) Gate Threshold Voltage (VDS = VGS, iD = 250 ~Adc) vGS(th) Static Drain-to-Source On-Resistance (VGS = 10 Vdc, ID= 300 mAdc) (VGS = 4.5 Vdc, ID = 100 mAdc) rDS(on) Forward Transconductance ...! 1.0 .,. 1.7 Ohms mMhos !!,.;,.: ,{,,,ir .,.,*,~:,,, ,a,. ~::!.t `,,,. .*- (VDS = 5.0 V) Output Capacitance (VDS = 5.0 V) (VDG = 5.0 V) Ciss ..~. `":~ `J Co:$gil$< >~: -- ,\..,, `* ~s+""l $,<! ~,<,:`" ` +:i~,, SWITCHING CHARACTERISTICS(2) +.,-+ .s>~s$ JI. ,~?w$$ td(on) TurwOn Delay Time .,.; , .* Rise Time tr (VDD = 15 Vdc, ID = 300 m~~'$ RL = 50 *) , `it:~:~,~ Turn-Off Delay Time td(off) ,%$J\$* .,\.., y&, ,~t..,, "4*<.* Fall Time tf .>> ,.,~ ,,"$$4 Gate Charge (See Figure 5) QT t,$ ,!* ."\.-, !:l SOURCE-DRAIN DIODE CHARACTERISTICS ,J::'\.~l/~h\..: <:+\., `` .jl?.:$" ,. ::!+,,~t~. Continuous Current Is s!%,+,*",',. ~ .:*:.X.} ~\' v. . .*. <.".. `+ ]SM Pulsed Current .Li';> ,. `1;.'*!*. J, `:*,,-..,;,{P: -`,.~1. . .,}.,, Forward Voltage(2) VSD ,,,, ~,-.,,$? 2 ,,,,,:*C 9FS Transfer Capacitance (1) Pulse Test Pulse Width <300 US,:@'we (2) Switching characteristics are inde~,n~$nt ~.+,. ,, ..%.~. ,, .:\J, " *<:., ,/. , a -- -- (VDS = 10 Vdc, ID = 200 mAdc) DYNAMIC CHARACTERISTICS -- Input Capacitance ,, W Gate-Body Vdc -- 45 -- pF 25 -- 5.0 - -- 2.5 -- -- 2.5 -- -- 15 -- -- 0.8 -- 1400 -- pc -- -- 0.3 A -- -- 0.75 -- 0.85 -- - "-- ns v <270. of operating junction temperature. Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBF0201 NLTI INFORMATION FOR USING THE SOT-23 MINIMUM RECOMMENDED FOOTPRINT Sutiace mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection The power dissipation of the SOT-23 :~~t ,\$ are found in the maximum ratings table qn t~&@fa sheet. Substituting these values into the equatiQ@~;~~ambient temperature TA of 25C, one can calcula~~~t~'';~dtier dissipation of the device which in this .*, case.~~~~~tiill .. FOR SURFACE MOUNTED iwatts. SOLDERING When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. e After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. o Mechanical cooling. .,kjl,.,,, :,:;,,...,.$..., .} The 556CM for the SOT-23 package assumes the use .,,<.,>..>X,,.! ~.~,. of the recommended footprint on a glass epoxy printed circuit ,.. board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad'". Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. Transistors, PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. e Always preheat the device. e The delta temperature between the preheat and soldering should be 10OC or less.* e When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260"C for more than 10 seconds. ,b.}.$ Motorola Small-Signal APPLICATIONS interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. is a function ~$,~.,? drain pad size. This can vary from the minimum pad ~@sF soldering to a pad size given for maximum power dis:ipa~on. Power dissipation for a surface mount device,~s dekrmined by TJ(max), the maximum rated junction te@~p&$qtureof the die, ROJA, the thermal resistance from t~@,*~e junction to i:.,.. ambient, and the operating tempe~~~ TA. Using the values provided on the data sheet f@.J&80T-23 package, ?:,,,. V.:f$>$ PD can be calculated as follow$;,+w,~, `" .&."*:\'~~:,.,..(~,>~ The values fo,~w~~fiation SURFACE MOUNT PACKAGE FETs and Diodes Device Data stress or shock should not be applied during * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 5 MMBF0201 NLTI TYPICAL ELECTRICAL CHARACTERISTICS i 00 1.8 \ I I 1.6 80 1.4 60 1,2 / 40 1.0 20 \ 0,8 0.6 -50 n -25 0 25 50 75 100 125 20 150 TJ,JUNCTION TEMPERATURE ~C) Figure 7. On-Resistance versus Junction Temperature 0.6 4 0.9 Motorola Small-Signal 1.2 1.4 Transistors, FETsand Diodes Device Data MMBF0201 NLT1 TYPICAL ELECTRICAL CHARACTERISTICS "o 1 2 4 3 6 5 VGS, GATE-TNOURCEVOLTAGE (VOLTS) Figure 1. Transfer Characteristics 1,5 I I I I I I I I I -. an "o 10 5 VGS, GATE-T&SOURCE 20 15 VOLTAGE (VOLTS) Figure 4. On-Resistance versus Gate-to-Source Voltage 1.10 1.05 \. 1.00 : 0.95 : 0.90 ~ 0,85 ~ 0.80 p 0.75 \ 0.70 0.65 0.60 -25 0 25 50 100 75 TEMPERATURE 150 125 ("C) Figure 6. Threshold Voltage Variance Over Temperature Motorola Small-Signal Transistors, FETs and Diodes Device Data 3 MMBF0201NLT1 PACKAGE DIMENSIONS SOT-2?. (*-236AB) I ?:~l ~', .~<.>.`.x ,..,.'m:<tt,i,i ~J-\,?,\*L* ~ ,lJ `}$:< ~',!, , ,>,6, ~ `:f.<i;.wv~~ *<,.: ,,.}, ~ ~i:$ s$~.::f,, . ,1,.. ~i?tl,,,., .,:.. ~,:,.:' ..:*.! ii, t:<$w ~. ,<? ..a:,\, `<i,: ~,y~ :p, ~,. , .], , ,*,> \*li ,.1$. ` "i;>, ,,,... ..... Motorola -~tfie right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the s~#Iti~~ its products for any particular purpose, nor does Motorola assume any Kabihty arising out of the apphcation or use Of any product or circuit, an,~$~$ifi@lly disclaime any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vay in different ,~~a,~$. All operating parameters, incluting `Typicals" must be vatidated for each customer application by customer's technical experts, Motorola does ..~ @VO~eY anY license under its Patent fights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in ` >~~~ms intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of "k$fi# Motorola product could create a situation where personal injury or death may occur. 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H.K, Ltd.; Sihcon Harbour Center, No, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T,, Hong Kong, MFAX: RMFAXO@email.sps. mot.com -TOUCHTONE (602) 24W609 INTERNET http//Design-NET, com MOTOROLA @ o 2PHX34W6F+ PRINTEO IN USA &95 IMPERIAL LITHO 13980 6,000 SMALL SIGNAL YBAe~ MMBF0201 NLTIID lllllllllllllllllllllllllllllllllllllllllllllllllllllllllll 111111111111