MMBF0201NLT3 - Motorola / Freescale Semiconductor

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA Order this document

by MM BF0201 NLT1/D

GREEN o‘a LINETM

aLow ~~~(~n) Small-Signal MOSFETS =

TMOS Sing16 N-Channel

Field Effect ~ansistors

Pan of the GreenLineTM Potifolio of devices with energy–con-

serving traits.

These miniature surface mount MOSFETS utilize Motorola’s High

Cell Density, HDTMOS process. Low rDS(~n) assures minimal

power loss and consewes energy, making this device ideal for use

in small power management circuitry. Typical applications are

de-de converters, power management in portable and battery–

powered products such as computers, printers, PCMCIA cards,

cellular and cordless telephones.

●Low rDS(on) Provides Higher Efficiency and Extends Battery Life

oMiniature SOT–23 Surface Mount Package Saves Board Space ,~

\*,,,

,R,$lyg,&;~’ Symbol Value Unit

‘, .,.

Drain–to–Source Voltage ..:3,;,,.

,/,, \*:,~~,lj~-

,:~.:,..’.~,,,4*.,vDSS 20 Vdc

VGS f20 Vdc

ID 300 mAdc

ID 240

IDM 750

Total Power Dissipation pD 225 mW

Operating and Stora@’~Jernp;rature Range TJ ,Tstg –55to 150 “c

Thermal Resist@c$#$~nction–t&Ambient ReJA 625 ‘cm

..,.>.,.

Maximum Ld@%@rnperature for Soldering Purposes, 1/8 from case for 10 seconds

.,.:, ~“,.e TL 260 ‘c

.... ,.-

,<!,,. ORDERING INFORMATION

Device Reel Size Tape Width Quantity

MMBF0201NLT1 T12 mm embossed tape 3000

MMBF0201NLT3 lY 12 mm embossed tape 10,000

eGreenLine is atrademark of Motorola, Inc.

HDTMOS is atrademark of Motorola, Inc. TMOS is aregistered trademark of Motorola, Inc.

Thermal Clad is aregistered trademark of the Berquist Company.

Preferred devices are Motorola recommended choices for future use and best overall value.

(Replaces MMBF0201 N/D)

@Motorola, Inc. 1995 @

MMBF0201NLTI

ELECTRICAL CHARACTERISTICS (TA =25°C unless otherwise noted)

Characteristic Symbol Min Typ IMax Unit

OFF CHARACTERISTICS

Drain-to-Source Breakdown Voltage v(BR)DSS 20 ——Vdc

(VGS =OVdc, ID =10 wA)

Zero Gate Voltage Drain Current

(VDS’= 16 Vdc, VGS =OVdc)

(VDS =16 Vdc, VGS =OVdc, TJ =125°C)

Gate–Body Leakage Current (VGS =*20 Vdc, VDS =O)

,. .

ON CHARACTERISTICSI1 )W,,

,,,,,:*C

Gate Threshold Voltage ...! .,.

vGS(th) 1.0 1.7

(VDS =VGS, iD =250 ~Adc)

Static Drain-to–Source On-Resistance rDS(on) Ohms

(VGS =10 Vdc, ID= 300 mAdc) —

(VGS =4.5 Vdc, ID =100 mAdc) —

Forward Transconductance (VDS =10 Vdc, ID =200 mAdc) 9FS mMhos

DYNAMIC CHARACTERISTICS !!,.;,.:

,~:,,,,{,,,ir

::!.t.,.

,a,.~‘,,,.,* .*-

Input Capacitance (VDS =5.0 V)

—Ciss ..~. ‘“:~ ‘J 45 —pF

Output Capacitance (VDS =5.0 V) Co:$gil$< >~: —25 —

,\..,,

Transfer Capacitance (VDG =5.0 V) ‘* ~s+””l –5.0 –

SWITCHING CHARACTERISTICS(2) $,<!~,<,:‘“ ‘

+:i~,,

+.,-+

TurwOn Delay Time .s>~s$ JI.

,~?w$$ td(on) —2.5 —ns

.,.;

,.*

Rise Time (VDD =15 Vdc, ID =300 m~~’$ tr —2.5 —

Turn–Off Delay Time RL =50 *) ,‘it:~:~,~

,%$J\$*.,\..,y&, td(off) —15 —

,~t..,,

Fall Time “4*<.* tf —

.>> 0.8 —

Gate Charge (See Figure 5) ,.,~

,,”$$4

t,$ ,!*QT “— 1400 —pc

SOURCE-DRAIN DIODE CHARACTERISTICS !:l .“\.-,

,J::’\.~l/~h\..:<:+\.,

Continuous Current ::! ‘‘

.jl?.:$”,. +,,~t~. Is — —

s!%,+,*”,’,.~0.3 A

Pulsed Current .:*:.X.}~\’v..

..*.

<.“.. ‘+ ]SM — — 0.75

.Li’;>,. ‘1;.’*!*.

Forward Voltage(2) J, ‘:*,,-..,;,{P:

-‘,.~1.. .,}.,, VSD —0.85 —

,,,, v

~,-.,,$?

(1) Pulse Test Pulse Width <300 US,:@’we <270.

(2) Switching characteristics are inde~,n~$nt of operating junction temperature.

~.+,.,, ..%.~.,,

.:\J,“*<:.,

,/. ,

●

2Motorola Small–Signal Transistors, FETs and Diodes Device Data

INFORMATION

MMBF0201 NLTI

FOR USING THE SOT-23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Sutiace mount board layout is acritical portion of the total interface between the board and the package. With the

design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when

be the correct size to insure proper solder connection subjected to asolder reflow process.

The power dissipation of the SOT-23 is afunction ~$,~.,?

drain pad size. This can vary from the minimum pad ~@sF

soldering to a pad size given for maximum power dis:ipa~on.

Power dissipation for asurface mount device,~s dekrmined

by TJ(max), the maximum rated junction te@~p&$qtureof the

die, ROJA, the thermal resistance from t~@,*~e junction to

i:.,..

ambient, and the operating tempe~~~ TA. Using the

values provided on the data sheet f@.J&80T–23 package,

?:,,,.V.:f$>$

PD can be calculated as follow$;,+w,~, ‘“

.&.“*:\’-

..(~,>~

~~:,.,

:~~t,\$

The values fo,~w~~fiation are found in the maximum

ratings table qn t~&@fa sheet. Substituting these values into

the equatiQ@~;~~ambient temperature TA of 25°C, one can

calcula~~~t~’’;~dtier dissipation of the device which in this

.*,

case.~~~~~tiill iwatts.

. .

,b.}.$

.,kjl,.,,, .}

:,:;,,...,.$..., The 556°CM for the SOT–23 package assumes the use

.,,<.,>..>X,,.!

~.~,.

,.. of the recommended footprint on a glass epoxy printed circuit

board to achieve apower dissipation of 225 milliwatts. There

are other alternatives to achieving higher power dissipation

from the SOT–23 package. Another alternative would be to

use aceramic substrate or an aluminum core board such as

Thermal Clad’”. Using aboard material such as Thermal

Clad, an aluminum core board, the power dissipation can be

doubled using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to ahigh temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

●

Always preheat the device.

The delta temperature between the preheat and soldering

should be 10O°C or less.*

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference shall be a maximum of 10°C.

The soldering temperature and time shall not exceed

260”C for more than 10 seconds.

When shifting from preheating to soldering, the maximum

temperature gradient shall be 5°C or less.

After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

Mechanical stress or shock should not be applied during

cooling.

Soldering adevice without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

Motorola Small–Signal Transistors, FETs and Diodes Device Data 5

MMBF0201NLTI

TYPICAL ELECTRICAL CHARACTERISTICS

1.8 \II

1.6

1.4

1,2 /

1.0

0,8

0.6

-50 -25 0 25 50 75 100 125 150

TJ,JUNCTIONTEMPERATURE~C)

Figure 7. On-Resistance versus

Junction Temperature

i00

0.6 0.9 1.2 1.4

4Motorola Small–Signal Transistors, FETsand Diodes Device Data

TYPICAL ELECTRICAL CHARACTERISTICS

“o 123456

VGS, GATE-TNOURCEVOLTAGE (VOLTS)

Figure 1. Transfer Characteristics

1,5

I I I I I I I I I

MMBF0201 NLT1

an “o 510 15 20

VGS, GATE-T&SOURCE VOLTAGE (VOLTS)

Figure 4. On-Resistance versus

Gate-to-Source Voltage

1.10

1.05 \.

1.00

:0.95

:0.90

~0,85

~0.80 \

p0.75

0.70

0.65

0.60-25 025 50 75 100 125 150

TEMPERATURE (“C)

Figure 6. Threshold Voltage Variance

Over Temperature

Motorola Small–Signal Transistors, FETs and Diodes Device Data 3

MMBF0201NLT1

PACKAGE DIMENSIONS

ISOT-2?. (*-236AB)

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Motorola -~tfie right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the s~#Iti~~ its products for any particular purpose, nor does Motorola assume any Kabihty arising out of the apphcation or use Ofany product or circuit,

an,~$~$ifi@lly disclaime any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vay in different

,~~a,~$. All operating parameters, incluting ‘Typicals” must be vatidated for each customer application by customer’s technical experts, Motorola does

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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal inju~ or death

associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part,

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@MOTOROLA o2PHX34W6F+ PRINTEO IN USA &95 IMPERIAL LITHO 13980 6,000 SMALL SIGNAL YBAe~ MMBF0201 NLTIID

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