GaAIAs-IR-Lumineszenzdiode (880 nm) GaAIAs Infrared Emitter (880 nm) Lead (Pb) Free Product - RoHS Compliant SFH 487 Wesentliche Merkmale Features * * * * * GaAlAs-LED mit sehr hohem Wirkungsgrad Hohe Zuverlassigkeit UL Version erhaltlich Hohe Impulsbelastbarkeit Gute spektrale Anpassung an Si-Fotoempfanger * Gehausegleich mit SFH 309, SFH 409 * * * * * * Anwendungen Applications * IR-Fernsteuerung von Fernseh-, Rundfunkund Videogeraten, Lichtdimmern * Lichtschranken bis 500 kHz * Munzzahler * Rauchmelder * Sensorik * Diskrete Optokoppler * IR remote control for hifi and TV sets, video tape recorder, dimmers * Light-reflection switches (max. 500 kHz) * Coin counters * Smoke detectors * Sensor technology * Discrete optocouplers I Very highly efficient GaAlAs-LED High reliability UL version available High pulse handling capability Good spectral match to silicon photodetectors Same package as SFH 309, SFH 409 Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1), Ie (mW/sr) SFH 487 Q62703Q1095 > 12.5 SFH 487-2 Q62703Q2174 20 ... 80 SFH 487-3 Q62703Q2175 31 ... 125 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2009-09-30 1 SFH 487 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 100 mA Stostrom, 10 s Surge current IFSM 2.5 A Verlustleistung Power dissipation Ptot 200 mW Warmewiderstand, freie Beinchenlange max. 10 mm Thermal resistance, lead length between package bottom and PC-board max. 10 mm RthJA 375 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 880 nm Spektrale Bandbreite bei 50% von Imax, IF = 100 mA Spectral bandwidth at 50% of Imax 80 nm Abstrahlwinkel Half angle 20 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top H 2.6 mm Kennwerte (TA = 25 C) Characteristics 2009-09-30 2 SFH 487 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit 0.6/0.5 s Co 15 pF VF 1.5 (< 1.8) 3.0 (< 3.8) V Sperrstrom Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsflu Total radiant flux IF = 100 mA, tp = 20 ms e 25 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -2 mV/K Temperaturkoeffizient von peak, IF = 100 mA Temperature coefficient of peak, IF = 100 mA TC 0.25 nm/K Schaltzeiten, Ie von 10% auf 90% und von 90% auf tr, tf 10%, bei IF = 100 mA, RL = 50 Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat Capacitance VR = 0 V, f = 1 MHz Durchlaspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2009-09-30 3 SFH 487 Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Wert Value Einheit Unit SFH 487-1 SFH 487-2 SFH 487-3 Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie 12.5 ... 25 20 ... 80 31 ... 125 mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ. - 270 - mW/sr 2009-09-30 4 SFH 487 e Radiant Intensity 100 mA = f (IF) e Single pulse, tp = 20 s Relative Spectral Emission rel = f () OHR00877 100 rel 10 e % IF = f (TA) 80 10 1 100 60 10 0 75 40 10 -1 50 20 10 -2 25 10 -3 800 850 900 950 nm 1000 Forward Current, IF = f (VF) Single pulse, tp = 20 s 10 0 10 1 10 2 10 3 mA 10 4 F Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter OHR00886 10 4 OHR00881 10 1 mA A OHR00880 125 F mA e (100mA) 0 750 F OHR00878 2 Max. Permissible Forward Current 0 0 20 40 60 80 C 100 T Forward Current vs. Lead Length between the Package Bottom and the PC-Board IF = f (I), TA = 25 C OHR00949 120 mA F D = 0.005 0.01 0.02 0.05 10 0 F 100 10 3 0.1 0.2 80 10 -1 60 0.5 10 2 DC 40 10 -2 D= 10 -3 0 1 2 3 4 5 6 V VF tp T tp T 10 1 -5 -4 -3 -2 10 10 10 10 10 -1 10 0 8 20 F 10 1 s 10 2 tp Radiation Characteristics Irel = f () 40 30 20 10 0 OHR01895 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2009-09-30 0.8 0.6 0.4 0 20 40 60 80 5 100 120 0 0 5 10 15 20 25 mm 30 SFH 487 Surface not flat 4.1 (0.161) 3.9 (0.154) 0.4 (0.016) 2 0.8 (0.031) 1.8 (0.071) 5.2 (0.205) 4.5 (0.177) 3.1 (0.122) 2.9 (0.114) 0.6 (0.024) 0.4 (0.016) 0.7 (0.028) 0.4 (0.016) 2.54 (0.100) spacing Mazeichnung Package Outlines 0.6 (0.024) 0.4 (0.016) 1 4.0 (0.157) 3.6 (0.142) Chip position 3.3 (0.130) 6.3 (0.248) 5.9 (0.232) 1.2 (0.047) GEMY6689 Mae in mm (inch) / Dimensions in mm (inch). . Gehause / Package 3mm, klares violettes Gehause 1/10 " violett colored transparent package Anschlubelegung pin configuration 1 = Anode / anode 2= Kathode / cathode Wellenloten (TTW) Recommended Solder Pad TTW Soldering 4.8 (0.189) Empfohlenes Lotpaddesign 4 (0.157) OHLPY985 Mae in mm (inch) / Dimensions in mm (inch). 2009-09-30 6 SFH 487 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2009-09-30 7