AA-3021VBS-D - KINGBRIGHT CORPORATION

DESCRIPTIONS

The Blue source color devices are made with InGaN

Light Emitting Diode

Electrostatic discharge and power surge could

damage the LEDs

It is recommended to use a wrist band or

anti-electrostatic glove when handling the LEDs

All devices, equipments and machineries must be

electrically grounded

FEATURES

3.0 mm x 2.0 mm, 1.3 mm high, only minimum

space required

 Suitable for compact optoelectronic applications

Low power consumption

Package: 2000 pcs / reel

Moisture sensitivity level: 3

RoHS compliant

APPLICATIONS

Backlight

Status indicator

Home and smart appliances

Wearable and portable devices

Healthcare applications

ATTENTION

Observe precautions for handling

electrostatic discharge sensitive devices

PACKAGE DIMENSIONS

SELECTION GUIDE

AA3021VBS/D

3.0 x 2.0 mm Surface Mount LED Lamp

RECOMMENDED SOLDERING PATTERN

(units : mm; tolerance : ± 0.1)

Part Number Emitting Color

(Material) Lens Type

Iv (mcd) @ 20mA [2] Viewing Angle [1]

Min. Typ. 2θ1/2

AA3021VBS/D ■ Blue (InGaN) Water Clear 200 450 120°

Notes:

1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Luminous intensity / luminous flux: +/-15%.

3. Luminous intensity value is traceable to CIE127-2007 standards.

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.2(0.008") unless otherwise noted.

3. The specifications, characteristics and technical data described in the datasheet are subject to

change without prior notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

AA3021VBS/D

Parameter Symbol Emitting Color

Value

Unit

Typ. Max.

Wavelength at Peak Emission IF = 20mA λpeak Blue 465 - nm

Dominant Wavelength IF = 20mA λdom [1] Blue 470 - nm

Spectral Bandwidth at 50% Φ REL MAX

IF = 20mA Δλ Blue 22 - nm

Capacitance C Blue 100 - pF

Forward Voltage IF = 20mA VF [2] Blue 3.3 4.0 V

Reverse Current (VR = 5V) IR Blue - 50 uA

Parameter Symbol Value Unit

Power Dissipation PD 120 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 115 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 30 mA

Peak Forward Current IFM [1] 100 mA

Electrostatic Discharge Threshold (HBM) - 250 V

Notes:

1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )

2. Forward voltage: ±0.1V.

3. Wavelength value is traceable to CIE127-2007 standards.

4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

Notes:

1. 1/10 Duty Cycle, 0.1ms Pulse Width.

2. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

0.5 0.50.0

-90°

-75°

-60°

-45°

-30°

-15°

75°

60°

45°

30°

0° 15°

90°

1.0 1.0

= 25 °C

2.0 2.4 2.8 3.2 3.6 4.0

Ta = 25 °C

Forward voltage (V)

Forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

0 1020304050

Ta = 25 °C

Forward current (mA)

Luminous intensity normalised

at 20 mA

-40-20 0 20406080100

Ambient temperature (°C)

Permissible forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

-40-20 0 20406080100

Ambient temperature (°C)

Luminous intensity normalised

at T a = 25 °C

20%

40%

60%

80%

100%

350 400 450 500 550 600 650 700 750 800

= 25 °C

Wavelength (nm)

Relative Intensity (a. u.)

Blue

TECHNICAL DATA

RELATIVE INTENSITY vs. WAVELENGTH

BLUE

TAPE SPECIFICATIONS (units : mm)

REEL DIMENSION (units : mm)

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

SPATIAL DISTRIBUTION

AA3021VBS/D

Forward Current vs.

Forward Voltage

Luminous Intensity vs.

Forward Current

Forward Current Derating Curve Luminous Intensity vs.

Ambient Temperature

Notes:

1. Don't cause stress to the LEDs while it is exposed to high temperature.

2. The maximum number of reflow soldering passes is 2 times.

3. Reflow soldering is recommended. Other soldering methods are not recommended as they might

cause damage to the product.

PACKING & LABEL SPECIFICATIONS

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes

HANDLING PRECAUTIONS

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is

more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone

encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.

2. Do not directly touch or handle the silicone lens

surface. It may damage the internal circuitry.

1. Handle the component along the

side surfaces by using forceps or

appropriate tools.

4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.

4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure

precise pickup and avoid damage during production.

5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver

plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such

substances.

3. Do not stack together assembled

PCBs containing exposed LEDs.

Impact may scratch the silicone lens

or damage the internal circuitry.

AA3021VBS/D