Power Management IC Series for Automotive Body Control High Voltage LDO Regulators BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP No.11036EBT02 Description BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30A (TYP).With these devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within 2% over the wide ambient temperature range (-40 to 125), and the short circuit protection is folded-type to minimize generation of heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to simplify the use with battery direct-coupled systems. Features 1) Ultra-low quiescent current: 30A (TYP.) 2) Low-saturation voltage type P-channel DMOS output transistors 3) High output voltage precision: 2%Iomax = 500 mA 4) Low-ESR ceramic capacitors can be used as output capacitors. 5) Vcc power supply voltage = 50 V 6) Built-in overcurrent protection circuit and thermal shutdown circuit 7) TO252-3, TO252-5, HRP5 Package Applications Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.) Line up matrix BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP Output voltage 3.3V 5.0 V Variable 3.3V 5.0 V Variable Symbol Limit Unit Supply voltage VCC 50 1 Switch Supply voltage VSW 50 2 IO 500 SW function Package FP:TO252-3,TO252-5 HFP:HRP5 Absolute maximum ratings (Ta=25) Parameter Output current V V mA 1.2 (TO252-3) 3 Power dissipation Pd 1.3 (TO252-5) 4 1.6 (HRP5) W 5 Operating temperature range Topr -40 to +125 Storage temperature range Maximum junction temperature Tstg -55 to +150 Tjmax 150 1 2 3 4 5 Not to exceed Pd and ASO. for ON/OFF SW Regulator only TO252-3: Reduced by 9.6 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). TO252-5: Reduced by 10.4 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). HRP5: Reduced by 12.8 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 1/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Operating Conditions Parameter Input voltage Symbol Min. Max. Unit V BD3570,3572,3573,3575FP/HFP VCC 4.5 6 36.0 BD3571,3574FP/HFP VCC 5.5 6 36.0 V Output current IO 500 mA Variable Output Voltage Range VO 2.8 12 V 6 Please consider that the Output voltage would be dropped (Dropout voltage) according to the output current. Electrical CharacteristicsUnless otherwise specified, Ta=-40 to125, VCC=13.2 V, SW=3V 7, VO settings is 5V 8 Parameter Symbol Limit Unit Conditions Min. Typ. Max. lshut 10 A SW=GND Bias current lb 30 50 A IO=0mA Output voltage VO VOx 0.98 VO VOx 1.02 V IO=200mA, VO:Please refer to Product line. VADJ 1.235 1.260 1.285 V IO=200mA Output current IO 0.5 A Dropout voltage Vd 0.25 0.48 V VCC=4.75V,lO=200mA Ripple rejection R.R. 45 55 dB f=120Hz,ein=1Vrms,IO=100mA Line Regulation Reg.I 10 30 mV VCCD10VCC25V IO = 0 mA Load Regulation Reg.L 20 40 mV 0AIO200A Shut Down Current ADJ Terminal voltage 8 Swith Threshold voltage H SWH 2.0 V IO=0 mA Swith Threshold voltage L SWL 0.5 V IO=0 mA SWI 22 60 A Swith Bias current 7 8 9 10 9 SW=5V,lO=0mA BD3573,3574,3575FP/HFP only BD3572,3575FP/HFP only BD3571,3572,3574,3575FP/HFP only BD3570,3573FP/HFP :VCCD=5.5V BD3571,3572,3574,3575FP/HFP :VCCD=6.5V This product is not designed for protection against radio active rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 2/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Reference Data: BD3574HFPUnless otherwise specified, Ta=25 30 Ta=125 20 Ta=25 10 Ta=-40 0 6 5 5 4 3 Ta=125 2 Ta=25 1 Ta=-40 0 0 5 10 15 20 25 5 RIPPLE REJECTION:R.R. [dB] 20 2 Ta=125 Ta=25 Ta=-40 300 500 400 1500 Ta=-40 30 20 10 5 Ta=25 4 Ta=125 3 2 Ta=-40 1 0 10 100 1000 10000 0 100000 1000000 0.5 1 1.5 OUTPUT CURRENT: IO[mA] FREQUENCY: f [Hz] SUPPLY VOLTAGE: VSW [V] Fig. 4 Dropout Voltage Fig. 5 Ripple rejection Fig. 6 Output Voltage VS SW Input Voltage 40 20 200 300 400 4 3 2 1 0 100 0 100 5 OUTPUT VOLTAGE: VO [V] OUTPUT VOLTAGE: VO [V] 60 500 120 140 160 180 5.25 5 4.75 4.5 -40 200 0 40 80 OUTPUT CURRENT: IO[mA] AMBIENT TEMPERATURE: Ta [] AMBIENT TEMPERATURE: Ta [] Fig. 7 Total Supply Current Classified by Load Fig. 8 Thermal Shutdown Circuit Fig. 9 Output Voltage VS Temperature 120 DROPOUT VOLTAGE:Vd [V] Ta=125 60 Ta=25 30 Ta=-40 0 0 5 10 15 20 SUPPLY VOLTAGE: VSW [V] Fig. 10 SW Bias current www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 25 120 50 2 90 2 5.5 6 80 2000 Fig. 3 Output Voltage VS Load Ta=25 40 500 1000 OUTPUT CURRENT: IO [mA] 6 50 100 0 Ta=125 0 0 200 1 25 CIRCUIT CURRENT: I cc [A] DROPOUT VOLTAGE:Vd[V] 15 Ta=125 60 0 CIRCUIT CURRENT: I CC [A] 10 70 100 Ta=25 2 Fig. 2 Output Voltage VS Power Supply Voltage 3 0 Ta=-40 3 SUPPLY VOLTAGE: VCC [V] Fig. 1 Total Supply Current 1 4 0 0 SUPPLY VOLTAGE: VCC [V] SW BIAS CURRENT: ISW [A] OUTPUT VOLTAGE: VO [V] OUTPUT VOLTAGE: VO [V] 40 6 OUTPUT VOLTAGE: VO [V] CIRCUIT CURRENT: I CC [A] 50 1.5 1 0.5 0 -40 0 40 80 120 40 30 20 10 0 -40 0 40 80 120 AMBIENT TEMPERATURE: Ta [] AMBIENT TEMPERATURE: Ta [] Fig. 11 Dropout voltage VS Temperature Fig. 12 Total Supply Current Temperature 3/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Block Diagram Vcc Vcc 1 Vcc 1 1 Cin Cin Cin Vref Vref SW Vo Vref OCP Co Vo 2 5 3 OCP SW Vo 2 5 Co OCP Co 1 GND 2 GND TSD Fin 3 N.C. Fig.13 TO252-3 Fin 4 N.C. ADJ (N.C. 4 ) Fig.15 HRP5 Fig.14 TO252-5 I/O Circuit diagram (All resistance values are typical.) 210K TSD 3 1) Vcc 1) ) Vcc Vo 1K ADJ (N.C. 1For Fixed Voltage Regulator only 2For adjustable Voltage Regulator only Cin0.33F1000F Co0.1F1000F SW 2 GND TSD Fin 2 1 Vo 1992K: BD3570, BD3573 3706K: BD3571, BD3574 200K 150 1250K Fig.17 5PIN[VO] BD3570,3571,3573,3574 Fig.16 2PIN[SW] Pin Assignments Fig.18 4.5PIN[ADJ,VO] BD3572,BD3575 FIN Pin No. TO252-3 1 2 3 Pin name Function 1 VCC Power supply pin 2 N.C. N.C. pin 3 VO Fin GND Voltage output pin GND pin Fig. 19 FIN Pin No. Pin name Function 5 VCC SW N.C. N.C. N.C. ADJ VO Power supply pin VO ON/OFF function pin N.C. pin(BD3572FP only) N.C. pin N.C. pin Output voltage setting pin(BD3572,3575FP only) Voltage output pin Fin GND GND pin Pin No. Pin name 1 5 VCC SW N.C. GND N.C. ADJ VO Power supply pin VO ON/OFF function pin (BD3573,3574,3575HFP only) N.C. pin GND pin N.C. pin Output voltage setting pin(BD3572,3575HFP only) Voltage output pin Fin GND GND pin 1 TO252-5 2 3 1 2345 Fig.20 FIN HRP5 4 2 3 1 23 45 Fig. 21 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 4 4/9 Function 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Output Voltage Adjustment Vo To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins, and pull-up resistor R2 between the VO and ADJ pins. R2 ADJ Vo = VADJx(R1+R2) / R1 [V] VADJ=1.26V(TYP.) R1 Fig.22 The recommended connection resistor for the ADJ-GND is 30k150k. Setting of Heat TO252-3 TO252-5 HRP5 2.0 2.0 1.2 W 1.2 0.8 0.4 0 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 96.2 (C/W) 1.6 POWER DISSIPATION: Pd [W] IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 104.2 (C/W) 1.6 POWER DISSIPATION: Pd [W] POWER DISSIPATION: Pd [W] 2.0 1.3W 1.2 0.8 0.4 25 50 75 100 125 150 1.2 0.8 0.4 0 0 0 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 78.1 (C/W) 1.6 W 1.6 0 25 50 75 100 125 AMBIENT TEMPERATURE: Ta [C] AMBIENT TEMPERATURE: Ta [] Fig. 23 Fig. 24 150 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [C] Fig. 25 Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where Ta 25. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W). Vcc : Input voltage Vo : Output voltage Io : Load current Icc : Total supply current PC=(VCC-VO)xIO+VCCxICC Power dissipation PdPC The load current IO is obtained to operate the IC within the power dissipation. Pd-VCCxICC Io (For more information about ICC, see page 12.) VCC-VO The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process. Calculation example Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85 IO 0.624-12xICC IO89mA 12-5 ja=104.2/W-9.6mAW/ 25=1.2W85=0.624W (ICC=30A) Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the power dissipation. The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from the following equation. Pc=VCCx(ICC+Ishort) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Ishort = Short current 5/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Peripheral Settings for Pins and Precautions 1) VCC pins Insert capacitors with a capacitance of 0.33F to 1000F between the VCC and GND pins. The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin. 2) Capacitors for stopping oscillation for output pins Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a capacitance range between 0.1F and 1000F. Since oscillation does not occur even for ESR values from 0.001 to 100, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output capacitor capacitance values should be determined after sufficient testing of the actual application. Operation Notes 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake fitting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. 5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Be sure to turn power off when mounting or dismounting jigs at the inspection stage. Furthermore, for countermeasures against static electricity, ground the equipment at the assembling stage and pay utmost attention at the time of transportation or storing the product. 7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junction is formed by the P layer and the N layer of each element, and a variety of parasitic elements will be constituted. For example, when a resistor and transistor are connected to pins as shown in Fig. 19, the P/N junction functions as a parasitic diode when GND>Pin A for the resistor or GND>Pin B for the transistor (NPN). Similarly, when GNDPin B for the transistor (NPN), the parasitic diode described above combines with the N layer of other adjacent elements to operate as a parasitic NPN transistor. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 6/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Resistor Transistor (NPN) (Pin B) (Pin A) (Pin B) B C E B C E P P+ P+ P P+ N N N P N N Parasitic element GND Parasitic element or transistor GND P+ Parasitic element or transistor N P substr t GND (Pin A) Parasitic elements Fig. 26 Example of a Simple Monolithic IC Architecture 8) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external parts, either. 9) SW Pin Do not apply the voltage to SW pin when the VCC is not applied. And when the VCC is applied, the voltage of SW pin must not exceed VCC. 10) Thermal shutdown circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit automatically resets once the chip's temperature Tj drops. The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never design sets on the premise of using the thermal shutdown circuit. (See Fig. 8) 11) Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. (See Fig. 3) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 7/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Ordering Part Number B D 3 5 7 4 H Part number 35703.3V output no include SW 35715.0V output no include SW 3572variable output no include SW 35733.3V output include SW 35745.0V output include SW 3575variable output include SW F P Package FP TO252-3, TO252-5 HFP HRP5 - T R Packaging and forming specification E2: Embossed tape and reel (TO252-3,TO252-5) TR: Embossed tape and reel (HRP5) TO252-3 <Tape and Reel information> 6.50.2 C0.5 1.50.2 +0.2 5.1 -0.1 Tape Embossed carrier tape Quantity 2000pcs 2.30.2 0.50.1 The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand 1.5 2 3 0.8 1 0.65 ) 2.5 9.50.5 5.50.2 FIN E2 Direction of feed 0.65 0.50.1 0.75 2.30.2 1.00.2 2.30.2 1pin Reel (Unit : mm) Direction of feed Order quantity needs to be multiple of the minimum quantity. TO252-5 <Tape and Reel information> 2.30.2 6.50.2 C0.5 1.50.2 +0.2 5.1 -0.1 0.50.1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.5 4 5 0.8 1 2 3 2.5 9.50.5 5.50.2 FIN E2 0.50.1 0.5 1.27 1.00.2 1pin Reel (Unit : mm) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 8/9 Direction of feed Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note HRP5 <Tape and Reel information> 8.82 0.1 (6.5) 0.080.05 1.2575 1 2 3 4 0.8350.2 1.5230.15 8.00.13 (7.49) 1.9050.1 10.540.13 1.0170.2 9.3950.125 (MAX 9.745 include BURR) Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR direction is the 1pin of product is at the upper right when you hold ( The ) reel on the left hand and you pull out the tape on the right hand 1pin 5 +5.5 4.5-4.5 +0.1 0.27 -0.05 1.72 0.730.1 0.08 S S www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Direction of feed Reel (Unit : mm) 9/9 Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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