3TT250NKM17B31493 - Infineon Technologies

BipSTACK

Documentation and Operating Instructions

Product: BipSTACK

Application: Rectifiers and AC- Controllers

Revision: Rev. 1.1

10. March 2009

CONTENTS

1 Introduction ........................................................................................................................ 4

2 The BipSTACK overview.................................................................................................. 5

2.1 BipSTACK – what is it?............................................................................................. 5

2.2 Appropriate use .......................................................................................................... 6

2.3 Difference: Stack – Block – Component.................................................................... 6

3 The BipSTACK in detail.................................................................................................... 7

3.1 BipSTACK Type designation .................................................................................... 7

3.1.1 Detailed designation according to DIN41762 (old) ........................................... 7

3.1.2 Standardised type designation (New)................................................................. 7

3.1.3 Sales name.......................................................................................................... 7

3.2 BipSTACK Datasheet ................................................................................................ 8

3.3 Connection topologies.............................................................................................. 11

3.3.1 B-Circuits ......................................................................................................... 11

3.3.2 M-Circuits ........................................................................................................ 11

3.3.3 W-Circuits ........................................................................................................ 11

3.3.4 Pulsed-Power.................................................................................................... 11

3.4 Mechanical construction .......................................................................................... 11

3.4.1 BipSTACK with semiconductor modules........................................................ 11

3.4.2 BipSTACK with disc cells ............................................................................... 12

3.4.3 Special notes for water cooling ........................................................................ 14

3.5 Control and sensors .................................................................................................. 16

3.5.1 Protection against over-voltages ...................................................................... 16

3.5.2 Temperature switch.......................................................................................... 17

3.5.3 Fuses and fuse monitoring................................................................................ 17

3.5.4 Trigger transformer .......................................................................................... 18

4 Selection of the suitable BipSTACK ............................................................................... 19

4.1 Calculatory basics .................................................................................................... 19

4.1.1 Temperatures.................................................................................................... 19

4.1.2 Frequencies....................................................................................................... 19

4.1.3 Power dissipation (losses) ................................................................................ 19

4.1.4 Form factor and current load............................................................................ 19

4.1.5 Over-voltages, blocking voltage ...................................................................... 20

4.1.6 Parallel connection ........................................................................................... 20

4.2 Standard BipSTACK-series ..................................................................................... 20

4.3 Request an offer ....................................................................................................... 21

4.4 Extent of customer specific BipSTACK offers........................................................ 21

5 Safety notices ................................................................................................................... 22

5.1 Transport and storage ............................................................................................... 22

5.1.1 Transport .......................................................................................................... 22

5.1.2 Storage.............................................................................................................. 22

5.2 Commissioning......................................................................................................... 22

5.2.1 Notes for installation ........................................................................................ 22

5.2.2 Installation and commissioning........................................................................ 22

5.3 Maintenance ............................................................................................................. 23

5.3.1 General notices for maintenance ...................................................................... 23

5.3.2 Exchange of fuses............................................................................................. 23

5.3.3 Exchange of components in air cooled stacks.................................................. 23

5.3.4 Exchange of components in water cooled stacks ............................................. 28

6 Appendix .......................................................................................................................... 30

6.1 Calculation table for typical circuit types ................................................................ 30

6.2 Request for a technical offer .................................................................................... 32

6.3 Reference table for water cooling ............................................................................ 37

6.4 Further associated documentation............................................................................ 38

6.5 Indices ...................................................................................................................... 39

6.5.1 Index of terms................................................................................................... 39

6.5.2 List of figures ................................................................................................... 40

6.6 Conditions of use...................................................................................................... 41

6.7 Contact ..................................................................................................................... 42

1 Introduction

This is the documentation for the BipSTACK product group and it describes this with regard

to its technical features. It provides all hints and descriptions relevant to application and

selection of the BipSTACK suitable for the application, for the design-in as well as the safe

installation and commissioning of the BipSTACKs in their completed version. Further

technical information can be found in the datasheet of the individual BipSTACK. This takes

precedence over this document.

The documentation begins with the classification of the BipSTACKs within the world of

power electronics. Then, building on the technical descriptions and the associated application

options, all relevant details in dealing with the product family are described.

Contained are amongst others:

• Description of the various circuits

• Description of the mechanical construction

• Introduction of the protection concepts

• Basics of power rating

• Election of the suitable stacks

• As well as an introduction of other technical descriptions provided by Infineon

Please read this documentation completely before using an Infineon BipSTACK. Only in this

way can a flawless application be guaranteed. Also observe all safety notes.

Possibly other functions may be available, not described in this document. This fact, however, does not necessitate to provide

such functions with a new controller or at the time of maintenance.

The compliance of the document’s contents with the described hardware and software has been checked. Differences may still

exist, however; a guarantee for total convergence can not be given. The information contained in this document is reviewed on

a regular basis and changes required will be published with the next version. Recommendations for improvement are welcome.

The document is subject to change without prior notice.

Reproduction, circulation or use of this document or of its content is permitted only with written authorisation. Contravention will

be sued for damages. All rights are reserved including those arising from registered patents, trade names or designs.

2 The BipSTACK overview

This section provides an overview over the BipSTACK product family and classifies the

product group within power electronics in general.

2.1 BipSTACK – what is it?

The name of the product group BipSTACK requires some explanation. It has developed

historically.

“Bip” stands for bipolar. Diodes and thyristors (SCRs) are part of the bipolar components.

Strictly speaking, IGBTs would have to be classified too as bipolar components, the

segregation, however, has grown historically and is purely of administrative nature.

The term “Stack” signifies an assembly. This means merging of different components with

the aim to prepare one or more semiconductor components for an application. In this way

construction or circuitry is provides for measures such as cooling or over-voltage protection

during switching.

A BipSTACK consists of a diode or thyristor assembly which is equipped with extras

necessary (but not sufficient) for operation.

Figure 1: Example of a BipSTACK: 2B6C with input protection circuitry and busbars:

This assembly consists of 12 thyristors clamped into heatsinks. It is connected in such a way that two

independent B6C rectifier circuits result. A circuit input suppressor network each protects from over-

voltage. Copper busbars provide the AC and DC connections for the customer application.

2.2 Appropriate use

The BipSTACK can be implemented universally. Typical applications are:

• Rectifier in immobile drive systems

• Softstarter

• Wind energy turbine (typically synchronous generators)

• Galvanizing and plating plants

• Pulsed-Power applications (surge voltage systems, generation of high magnetic

intensity, linear accelerator…)

The power rating starts at around 100kVA The upper limit is defined by the maximum size of

semiconductor (usually disk cells) as well as the possible parallel connection in the MW range.

The BipSTACK may only be operated within the data and calculation sheet listed in this

document and the operating and safety conditions (3.2 BipSTACK Datasheet) explained.

Further, mounting and commissioning notes (section Safety notes) are to be observed. For

damages resulting from ignoring these, solely the user is responsible.

The electro-technical purpose of BipSTACKs is the explicit rectification or inversion of

electrical energy. The currents and voltages arising herby (depending on application either or,

or both) may not be exceeded continuously. Non-observance will jeopardize the operating

safety. Only especially trained and instructed personnel may commission, operate and

maintain BipSTACKs.

2.3 Difference: Stack – Block – Component

Figure 2: Difference: Stack – Block - Component

If components (diodes, thyristors) are mounted onto a heatsink, the resulting assembly is

called a block or also a cooling block. If several cooling blocks are interconnected and

clustered to a larger unit and a suppressor circuit wired to it, then this results in a stack. Only

stacks will have connection busbars, suppressor networks, fuses and trigger transformers and

such like.

3 The BipSTACK in detail

This section describes the technical details of the product group BipSTACKs.

3.1 BipSTACK Type designation

Two different type designations are in existence. The one historically developed according to

DIN41762, and the new one, based on standardised sizes.

3.1.1 Detailed designation according to DIN41762 (old)

The designation according to DIN41762 is application specific. In the main it is based on the

values of the rated operating points regarding current and voltage in continuous operation.

The DIN designation is no longer continued at Infineon. Exclusively the type designation

based on standardised sizes will have currency this is a type designation independent of the

operating point (see section 3.1.2). However it may happen that at the time of introduction of

the new type designation existing stacks the DIN-conform designation is still used (as

described further down in the datasheet descriptions).

3.1.2 Standardised type designation (New)

The standardised type designation is independent of the operating point. It describes the

BipSTACK with regard to the relevant components. The type designation can be found on the

nameplate and the datasheet, but has only informative purpose. In the datasheet DIN41762 is

further used to express rated values.

1 2 T 1 3 2 9 N2 2 K 0 0 8 B X X X

1 2 Number of switches

T 1 3 2 9 N2 2 Type designation of switches

K 0 0 8 Heatsink (here K0.08F)

B Circuit topology

B B6C/B6U

W W3C/W1C

A (B6C)A(B6C)

M M3/M6/M3.2

V Block (not stack)

0 0 Option for standard STACKs

B 0 1 SEB (input protection)

B 0 2 Snubber (suppressor) circuit

B 0 3 Snubber plus cell fuse

B 0 4 Snubber plus branch fuse

B 0 5 SEB plus cell fuse

B 0 6 SEB plus branch fuse

Add-Ons for Non-Standard

Stacks

3.1.3 Sales name

The sales name is the designation for selling the product and its description, similar to the

standardised type designation but without the aid of application parameters. The sales name is

relevant for ordering.

1 2 T 1 3 2 9 N0 0 8 B 2 5 2 6 8 Sales name

1 2 Number of components

T 1 3 2 9 N Designation of the components

0 0 8 Heatsink (here Ko.08F)

0 0 5 K0,05F

0 0 2 4 K0,024W

K E 0 1 KE01

B Circuit (here Bx)

W W - circuit

Anti-parallel connection e.g.

(B6C)A(B6C)

M M - circuit

V Cooling block – no circuit

2 5 2 6 8 internal stack ID-number

The possible heatsinks are denoted only exemplarily here.

3.2 BipSTACK Datasheet

3.2.1.1 Headline

The headline can be found on each page of the datasheet.

1. - Technical information points out that the document is a datasheet. This specifies

technical data for the correct use.

– BipSTACK tells you which product family is concerned. (related product families:

ModSTACK™, PrimeSTACK, LightSTACK)

- Listing of the type designation (see also section: “BipSTACK Type designation”)

3.2.1.2 Cover sheet

1. Type of the characterised product

2. Listing of the various configuration variants of the characterised stack along with the

associated SAP number. The datasheet always describes the possible configuration

variants.

3. Details regarding the circuit topology of the power section (B6C, W1C etc.)

– Permitted load type

– Cooling type

– Possible area of application

– Supervision / monitoring

– Semicond. (Unit1): Listing the bipolar semiconductor components (Number of

semiconductors) x (Type of semiconductors used)

– Heatsink

– Fuse

– Required trigger pulse for SCRs

– Which Standards and regulations does the BipSTACK fulfil.

3.2.1.3 Electrical data (Definition according to DIN57558)

1. Type connection voltage

RMS Value of the sine shaped connection voltage. The mains voltage may be

exceeded by 10% continuously. Whilst the type rated current of the stack may not be

exceeded.

2. Type DC-voltage

Output DC-voltage (average value) of the controlled rectifier stacks, resulting at type

connection voltage, type DC-current and full conduction angle.

3. Type DC-current (for rectifier stacks)

Maximum average on-state current of the stack. This derived from the maximum

average on-state current of the components and the circuit. The in and outlet of the

cooling air may not be obstructed. The maximum average on-state current of the

components in controlled stacks is valid at full conduction mode and active load.

Controlled rectifiers may be loaded with the type DC-current over the entire control

range provided the DC-current is sufficiently filtered.

Type AC-current (with AC-controllers)

Analogously the same applies as for DC-current, however, the type current is given as

the RMS value. The AC-controller stacks may be loaded with the type current over a

wide area of conduction angle.

4. Permitted current load during cases of overload. The listed current value does not lead

to an exceedance of the maximum permitted junction temperature.

5. Power loss at rated operating point. Included in the calculation are only the on-state

losses; no switching losses (see also section 4.1 Calculative basics)

6. Permitted component data of the semiconductors used.

3.2.1.4 Cooling

Two basically different heatsinks exist: air cooled and water cooled. Depending on the

cooling method used for the BipSTACK, only one of the heatsinks and datasheet blocks will

appear.

1. Permissible (air or water) inlet temperatures at which, when they are exceeded, a

current derating has to be calculated. Additional specification of the Rthja (Junction –

Ambient) of a thyristor (single switch).

3.2.1.5 Options (add-ons)

Listing of the snubber and protective circuits integrated into the stack with their individually

most important characteristic values. Examples are:

1. - Temperature switches (normally closed or normally open)

– fuses

- fans

3.3 Connection topologies

The following describes the most important circuit topologies offered by Infineon BipSTACK.

Further down and in the addendum you will find additional information, particularly key

figures and parameters.

3.3.1 B-Circuits

B-Circuit (e.g.B2U, B6U, B6C) are bridges for rectification of AC. They are used the most in

rectifier applications as they require the least transformer power of all circuit types.

Alternatively B6C-circuits alone or in anti-parallel configuration (B6C)A(B6C) may also be

used in an inverter operation.

3.3.2 M-Circuits

M-Circuits (e.g.M3U, M3C) are center-tap circuits for rectification of AC. They are much

less commonly used in applications than B-circuits and are operated mainly with lower input

voltages.

3.3.3 W-Circuits

W-Circuits (e.g. W1C, W3C) are AC controllers to set the RMS value of the AC component

according to the requirements of the application or to switch short-term over-currents

electronically. Typical applications are Softstarters for drive systems.

3.3.4 Pulsed-Power

Pulsed-Power circuits may not be grouped to any other category. Their purpose is to provide a

current or voltage pulse of great intensity, typically in the two or three digit kA or kV range.

3.4 Mechanical construction

The mechanical construction of BipSTACK can be coarsely categorised into two groups,

BipSTACKs with semiconductor modules for application in the lower voltage and current

range, and BipSTACKs with disc cells for applications in the range of low to higher voltages

in the medium to high power sector, up to extreme limits such as pulsed power applications.

Within the two major groups it can be further separated into air, water and oil cooling. In the

end the application will determine the component to be used and this in turn requires an

adequate heatsink. The heatsink portfolio is listed in the following.

3.4.1 BipSTACK with semiconductor modules

Semiconductor modules are packages with terminals to connect electrically the adjoining

circuitry, and a baseplate to thermally contact the semiconductor. Terminals and baseplate are

electrically isolated from each other. Therefore the electrical potential of the heatsink is

independent of the module power terminals within the limits as stated as permitted in the

insulation co-ordination.

BipSTACKs with modules are positioned in the lower three digit kW-range. With good

cooling not the semiconductor itself limits the power rather than the internal construction of

the modules limits the power through the maximum RMS on-state current. Above this current

(at sufficiently good cooling) the module package creates that much power losses that a heat

transfer back into the chip occurs.

3.4.1.1 Modules – Air cooling

• KM10

o For a single module

• KM11, KM14, KM17, KM18

o Heatsinks with the same profile but different lenths

o Standard

o Modules with baseplate width

 20 - 50mm  mounted across

 60 and 70mm  mounted longitudinally

3.4.1.2 Modules – water cooling

With closed cooling channels beneath the modules Using the through-hole technique modules

can be mounted on both sides.

• KW50, KW60, KW70

o 50, 60 and 70 describes the module width in mm

o Open water cooling, i.e. only the module baseplate seals the water circuit, once

it is mounted onto the heatsink.

• KW30, KW61, KW65

o As with KW50, 60, 70, but with closed cooler plate

o Utilising through-holes so modules can be mounted on both sides.

3.4.2 BipSTACK with disc cells

Disc cells have a double sided contact. They are mounted between two heatsink halves.

Depending on the type of heatsink and the size of the disc cell several semiconductor

components may be placed in a cooler heatsink.

3.4.2.1 Discs – Air and water cooling

All stacks for air cooling may also be used for oil cooling. The Rth achieved with oil cooling

equals that of forced air cooling. The use of additional (snubber) circuitry has to be checked

in each individual case, however.

Forced Air cooling

• General

o Standard fan is W2S130 if not otherwise specified.

o The naming of most of the air coolers for disc cells is based on the achievable

Rth C-A

• K0,05F, K0,08F, K0,11F

o For components 50 – 74mm diameter.

o Cooler for mains applications

o One standard fan per block

o Standard for forced cooling, but also suitable for convection cooling

o Denomination for higher voltages:

 “… .7” more creepage (e.g.: K0,08.7F)

o Outside dimensions of the blocks identical

Figure 3: Conceptual illustration of the Kx cooler family. Up to 3 discs are mounted onto one heatsink half.

The number of disc cells determines the number of heatsink counterparts and so defines the Rth, which in

turn provides the basis for the name.

• K0,048F

o For components 100 – 120mm diameter.

o Similar to K0,05F

o But other heatsink profile, so larger discs can be mounted

• K0,12F, K0,17F, K0,22F

o For components 41 – 60mm diameter.

o similar to the K0.05 series

o lower priced due to lower weight

o but higher Rth C-A at the same time

o For slim components with height up to 14mm

 K0.12: One component

 K0.17: two components side by side

 K0.22: two components on top of each other, separated by 4mm

aluminium sheet

• KE01, KE02

o For components 100 – 150mm diameter.

o Standard fan W2E200

 KE01: 1 component up to 150mm

 KE02: 2 components up to 120mm

o Not suitable for 172mm cells

Convection cooling

• General

o Especially suitable for short term operation.

o Short term operation = time wise between pulsed power operation and

transient times during which the heat capacity of the cooler is not filled.

o Characteristically: massive block directly on disc means high heat capacity

• K0,2S

o For components 57 – 75mm diameter.

o Dimensions similar to K0,05F, however, with optimised rib-structure for

convection cooling

• K0,18S

o For components 100 – 120mm diameter.

o Like K0,048F compared to K0,05F

o Profile like milled out K0.2S version

o Ideal for railway supply applications

• K0,36S and K0,65S

o Similar to K0.22F for 2 cells on top of each other, but for convection cooling

o For components 41 – 60mm diameter.

• K0,92S

o For components 57 – 75mm diameter.

o Similar to K0,08F

o Especially suitable for short term operation.

o Example: wind power turbines, to couple over-currents to the grid during start-

up of the synchronous generators

3.4.2.2 Discs – water cooling

Note: Stacks with water cooling are generally built without snubbering.

• KA20, KC20, KD20

o For components 41 – 60mm diameter.

o Water cooler capsule with integrated connection terminal

o Compact design

o Difference in naming: number of cooling capsules per block

• K53, K63, K84

o For components 100 – 172mm diameter.

o With connection terminal bars in different varieties.

o K53

 Discs with a diameter 110 and 120mm

o K63

 Discs with a diameter 150mm

o K84

 Discs with a diameter 172mm

• K0,024W

o Up to 75mm disc diameter

o the cooling capsule with V-hole is not isolated

o Possibilities of insulation:

 Iso-disc (Significantly increased Rth) or with so called “ISO” blocks!

Caution likelihood of confusion!

 Open isolation with AlN-discs (only up to 70V!)

Coding “I”

3.4.3 Special notes for water cooling

Higher power losses may economically only be dissipated using water cooling blocks.

Water cooling shows the following advantages over forced air cooling:

• less semiconductor components, as they may be used to a higher current.

• no costly air-water coolers and air filters in closed circuit systems.

• no noise pollution due to fan noise

• no treatment of cooling air necessary if the atmosphere is aggressive or dirty

On the other side the following disadvantages exist:

• low overload capability of the components, as a high base load is already prevalent

with water cooling

• if the water quality is poor, often a separate water circuit with heat exchanger is

necessary

• Water connections, hose connections, water flow control and temperature monitoring

for the cooling capsules

According to DIN50930 high requirements are placed on the water quality in water cooling,

which in practical operation are not always possible to adhere to. It has therefore to be

checked which deviations are permissible without jeopardising the operational safety.

In the addendum (section 6.3 “Note-table for water cooling”) different water types are

appraised, such as totally desalinated water, distilled water, monitored boiler-feed water and

general process water. The operating mode and the material of the cooling capsule with nipple

decide which water quality may be suitable for the system. The water quantity depends on the

cooling block and is in the magnitude of 2-10 l/min. With this cooling water quantity it needs

to be taken care of the hose diameter, in order to stay within around 2m/s flow velocity.

Higher flow velocities may contribute to the corrosion and material degradation. The flow

quantity may be checked with a flow monitor. The hose length between two heatsink

potentials depends on the voltage difference and the electric conductivity of the water. One

formula with which the hose length may be estimated is as follows:

QUkL DS ⋅⋅≈

where:

LS = hose length in mm

k = constant

0.8 for systems with heat exchanger (re-cooling)

1.4 for systems with fresh water

UD = DC-voltage in V

Q = hose cross section in cm2

For normal industrial applications Parker clip-connection hoses can be recommended. The

water temperature may be monitored with a contact thermometer or with a thermo-switch at

the cooling capsule. The water temperature lift may be calculated with via the dissipated

power loss with the following formula:

min]/[

103,14][

][

−

⋅⋅

=°∆

where:

P = dissipated power loss

vL = water quantity per one component

Water cooling is almost inevitably associated with electrolytic material degradation. In these

cases systems where AC is switched are less critical than rectifiers. The material degradation

becomes more critical with increased conductivity of the water and the magnitude of the

electrolytic current. When using demineralised water it needs to be considered that no brass

parts may be used in the water path. Due to the dissolving of zinc portions occurrence of

damage is likely. Critical applications with water cooling may be mitigated by a potential free

water circuit. For this, Infineon offers a complete programme of insulation discs on request.

Infineon insulation discs feature an excellent heat conductivity and a high breakdown voltage.

For insulation purposes environmentally friendly aluminium-nitrite is used. We recommend

to use ISO-discs where-ever high DC voltages in combination with poor water quality are

being used.

3.5 Control and sensors

3.5.1 Protection against over-voltages

Snubber circuits serve to protect semiconductor components against over-voltages. Basically

it is differentiated between input protection (SEB) and partial circuit surge suppression (TSE).

Protection circuitry is optional equipment and needs to be ordered explicitly, unless they are

already integrated into the stack (standard BipSTACKs in particular). The latter can be

recognised by the stack type designation.

For the design criteria of the snubbers the following is presumed:

• Nominal operating conditions according to DIN57558

• The type nominal power of the rectifier transformer equals approximately that of the

connected rectifier stack. Here the short circuit impedance voltage uK of the

transformer incl. grid is approximately 4%.

• For AC-controllers the snubber circuit is set approximately to one load circuit with a

phase angle of φ ≤ 30° (cos φ ≥ 0,866).

3.5.1.1 Snubber - partial circuit surge suppression (TSE)

Partial circuit surge suppressions (TSE) are dependent on the components. Each

semiconductor component in the BipSTACK has its own snubber. Partial circuit surge

suppression (TSE) are RC-networks, connected in parallel to the semiconductor. The

selection of the partial circuit surge suppression is done according to the semiconductor

specific parameters:

• Blocking voltage VRRM

• Commutation voltage (see datasheet. Typically based on main voltage)

• Reverse recovery charge QR

Figure 4: Partial circuit surge suppression (TSE)

3.5.1.2 Input protection

Input protection (SEB) depends on the stack. It exists once per three-phase assembly. As the

name suggests, they are connected to the AC power terminals of a rectifier.

It consists of an auxiliary rectifier circuit (B6U) connected to the three-phase input, charging

into a capacitor. It is connected between the actual rectifier and the mains and suppresses

over-voltages, related to nominal operation, into a capacitor. This in turn is permanently

discharged by a resistor in parallel, to be ready for the next voltage pulse.

Figure 5: Input protection (SEB)

3.5.2 Temperature switch

Temperature switches serve to monitor the fan. These are temperature sensors which when a

certain pre-set temperature threshold has been reached, will close an electrical auxiliary

circuit if the switch is “normally open” or conversely open the circuit if the switch is “normally

closed”. The terminals of the circuit are made available to the user and can be used to trigger

an action. An actual temperature value is not given.

The temperature threshold is selected stack specific. The temp. switch is only used with

forced air cooling, and with water cooling perhaps as water flow check. It serves to prevent a

thermal overload of the semiconductor during low load operation without fan (e.g.: after its

failure). By opening or closing of the circuit the user receives a notification only that (with

little headroom) should the temperature of the semiconductor or the entire BipSTACK rise,

the specification will be infringed.

Temperature switches are positioned directly onto the heatsink or near the component. They

comply with the requirements for the individual insulation co-ordination and are tested

accordingly. Temperature switches are optional equipment and needs to be ordered explicitly,

unless they are already integrated into the stack (BipSTACKs with forced cooling in

particular).

3.5.3 Fuses and fuse monitoring.

Fuses serve to protect the BipSTACK in case of a short circuit. These are semiconductor rated

fuses.

It is differentiated between branch fuses and cell fuses. Branch fuses protect the relevant half-

bridge. They are looped directly into the AC-connection and are typically used with

BipSTACKs with modules. They do not protect from internal short circuit.

Cell fuses, instead, are connected directly to the semiconductor component. They are used

mainly with disc cells. Depending on the nominal current but also according to application

specific parameters up to two fuses per cell may be connected in parallel.

Vital design criteria:

• The arc voltage of the fuse does not exceed the maximum permissible peak reverse

voltage of the components.

• The components are loaded with nominal current during permanent operation

• The short circuit impedance voltage of the feeding mains or transformer is uK ≥ 2%

relative to the point of coupling, nominal voltage and current of the stack.

• Correction factors (e.g.: ambient temperature)

Fuses are optional equipment and needs to be ordered explicitly, unless they are already

integrated into the stack (in standard BipSTACKs in particular).

Fused disc stacks are generally equipped with fuse monitoring. The indicator triggers the

mounted micro-switch via a mechanical monitoring set.

Fuses with inverter operation

With disc cell stacks in B6C- and (B6C)A(B6C) topology rectifier operation with phase

angles > 90° is possible. During failures in this operating mode the turn-off voltage may rise

to the 1.8 fold of the feeding voltage. Therefore catalogued fuses with nominal voltages of

690V may only be used for a feed voltage of 400V.

For stacks with 500V and 690V feed voltage we recommend to use the fuses with the

following nominal voltages in rectifier mode:

Feed voltage Fuse voltage

500V ≥ 900V

690V ≥ 1250V

The power loss of the fuses is not shown in the power loss calculation of the stack.

3.5.4 Trigger transformer

Trigger transformers are used in thyristor stacks. Their purpose is the galvanic separation of

the thyristor gate from the driver in order to enable a potential free firing control.

Trigger transformers are always optional supplies and have to be ordered explicitly.

4 Selection of the suitable BipSTACK

The user is able to select the suitable stack largely himself. This section serves this purpose. It

is described which data are necessary as a basis for a design and which technical

supplementary conditions are relevant.

4.1 Calculatory basics

4.1.1 Temperatures

If not otherwise specified or required by the customer, standard values are used to calculate.

The following standard temperatures are valid for the cooling medium at the inlet point of the

heatsink (Tinlet)

• Convection cooling (“S”)  45°C

• Forced Air cooling(“F”)  35°C

• Water cooling (“W”)  25°C @ 4 l/min

The nominal current of the BipSTACK mentioned in the datasheet and in the type designation

relates back to the Tinlet.

4.1.2 Frequencies

It is not differentiated between 50Hz and 60Hz applications. These are the typical application

frequencies used in mains connections. Only in the area of ship building frequencies of 400Hz

are calculated with for historical reasons. In those cases the switching losses have to be

considered in addition to the conduction losses.

4.1.3 Power dissipation (losses)

Via the construction related thermal resistance power dissipation losses cause heat. To limit

the calculation work when selecting a stack and in consideration of the negligible switching

losses, only the conduction losses are taken for the calculation of junction and case

temperatures.

Approximation means that only conduction losses are relevant. These are calculated using the

equivalent line approximation (current, contact resistance, threshold voltage).

Permissible area for simplified determination of the maximum temperatures:

• Typical mains frequencies (50…60Hz)

• Actually occurring blocking voltages <2kV or mains voltages <690V

If the permitted area is exceeded, the turn-off losses too need to be considered. These consist

in the main of the storage charge to be dispersed.

4.1.4 Form factor and current load

A bipolar component carries a current for a variable time. The form factor is the relation

between the RMS value and the rectified average value of the current through the component.

The form factor can be calculated. Important: Calculations done by Infineon always presume

ideal conditions, i.e.: valid is a 120° square wave current loading the component of a B6x.

Thus results in a form factor of 1.73, building the basis for further calculations.

Drastic variations from the ideal values on behalf of the customer have to be considered

regarding the circuitry. For example a contactor controlled charge resistor for the DC-bus to

limit the load current.

This approach assures the comparability between stacks and is still sufficiently precise.

4.1.5 Over-voltages, blocking voltage

Over-voltages may be buffered using the snubber (TSE) or input protective circuitry (SEB)

described above and hence reduced for the semiconductor. Typically one or the other is used.

In some exceptions both may be used.

The losses produced in the snubber or protective networks are not considered in the loss

calculation and not shown in the datasheet. The reason is that if the snubber is designed

correctly the heat management is sufficient and the losses are negligible.

4.1.6 Parallel connection

When paralleling components the following current derating is recommended:

• 10% when fuses are placed in series with the semiconductors

• 20% for hard parallel

• 30% for modules, whilst paralleling of modules is generally not recommended!

4.2 Standard BipSTACK-series

The type range of BipSTACKs is extremely wide due to the possibility to combine

components with heatsinks and additional circuits. The standard BipSTACKs serve to give

reference points which combinations of heatsinks, semiconductors and additional circuitry is

sensible for the different power ranges and typical applications.

The most widely used rectifier and AC-controller circuits B6U, B6C and W1C or W3C are

covered.

The standard Bip-STACK series is limited to air-cooled stacks and blocks. The reason is the

intensely application specific variation of water-cooled BipSTACKs. A standardisation is not

possible. Enquiries for water-cooled systems will require a custom specific design.

The standard BipSTACK series features the following characteristics:

• 2 voltage classes 500V and 690V mains

• Range steps according to current only within a voltage class

• T (temperature switch) standard with forced air-cooling

• L (fan) standard for stacks with forced air-cooling

• Optional circuitry in limited combination

o RC1-snubber (TSE)

o RC2-Input protection (SEB)

o S (fuses)

• No bus-bars of the AC or DC side (except the mounting of the optional fuses)

Information regarding the standard BipSTACKs may be found in the following sources:

• This product documentation

• The datasheet (available in the Internet)

• The short form catalogue (available in the Internet)

4.3 Request an offer

A suitable standard BipSTACK may be chosen autonomously for typical rectifiers and AC-

controllers when entering the most important data. If the requirements exceed this, the data

serve to request and calculate a customer specific offer. The required data can be found in

section 6.2.

The calculation of a technical offer by Infineon can usually be handled rapidly and without

the need for queries when the offer request sheet is filled in completely. The “Checklist for

Bipolar Assemblies” can be downloaded from the Internet. It is also contained in the

addendum of section 6.2 “Request for a technical offer”. To request the offer, it can be

printed out, filled in and sent to the sales representative for your area (see short form

catalogue or Internet). Alternatively it may be sent directly to:

• info@infineon.com (email)

• 0049 (0) 2902 764 1102 (fax)

4.4 Extent of customer specific BipSTACK offers

If the features of the standard ΒipSTACKs do not match the requirements, customer specific

solutions can be compiled. The extent of the offer depends in this case on the application and

the customer’s requirements. It is based on the idea to work without the creation of a

datasheet and to be able to rapidly implement requested changes to the (technical) offer.

Typical extent of an offer is:

• Calculation sheet for continuous operation

• Dimensional drawing of a comparable product

Depending on application and customer request further information may be added:

• Calculation sheet for short term operation (based on the duty cycle specification by the

customer).

5 Safety notices

5.1 Transport and storage

5.1.1 Transport

• Min. transport temperature: – 30°C

• Relative humidity: ≤ 95 %

• Max. transport temperature + 70 °C

• Normal loading on board, transport on good roads, no free fall, occasional stroke up to 10

g max. acceleration permitted.

• Truck or railway transport according to the usual transport requirements

5.1.2 Storage

• Lower storage temperature - 30°C

• Upper storage temperature + 70 °C

• Relative humidity: ≤ 95 %

• Packaging in cardboard carton, mounted on pallet

• Permissible heat radiation

• Low air movement 5m/s

• Usual industrial area

• Storage not near sand and dust sources

• Storage in non-aggressive atmosphere

• Storage with just noticeable but low vibrations and strokes, for example through passing

traffic

• Storage time: max. 1a

5.2 Commissioning

5.2.1 Notes for installation

Employment of the BipSTACK would typically be inside switchboard cabinets. The

BipSTACKs are to be integrated into the protection measures of the entire system.

When installing a BipSTACK the following has to be taken into account:

• The operation of the BipSTACK is only permitted within the defined conditions of the

valid documents (datasheet, this documentation….).

• For air convection cooling it is necessary to mount the BipStack vertically in order to have

the air pass unobstructed through the heatsink.

• Aeration of the switchboards has to be arranged such that the quoted power losses may be

dispersed safely.

• Max. altitude 1000m. When operating above that level a current/voltage derating is

recommended

5.2.2 Installation and commissioning

• The power cables are to be strain relieved in order to have no force exerted onto the

construction of the BipSTACK.

The connection points have to guarantee safe contact.

BipSTACKs are subject to a 100% production test. When commissioning a BipSTACK it is

recommended to carry out the following additional checks:

1. Visual check of:

• Observance of the mounting and cooling conditions (see above)

• Transport damage

• Foreign bodies in the stack

• Proper and correct connection (see above)

• Integration of the BipSTACK into the protection measures of the entire system

2. Measuring the insulation resistance

• of the BipSTACK mounted in the switchboard according to EN50178 or IEC61800.

5.3 Maintenance

5.3.1 General notices for maintenance

The components inside the stacks are non-moving and hence virtually maintenance free. Due

to the open construction the isolation tracks are not protected from humidity and dust. In an

intensely dusty area the components and heatsinks are to be cleaned from time to time in

order not to degrade the insulation capability and heat dispersion.

5.3.2 Exchange of fuses

When exchanging fuses, care has to be taken that under no circumstances arbitrary fuses are

used. Instead only the originally supplied or technically comparable with equal fusing

characteristics and equal overall turn-off integral must be used.

5.3.3 Exchange of components in air cooled stacks

We do not recommend to exchange components in disc cell stacks yourself. Appropriate

mounting can normally only be achieved with a special jig. If a component change on-site can

not be avoided, continue as follows:

• Removal of the component by alternating loosening of the clamping bolts

• Cleaning of the contact surfaces of heatsink and component. Apply contact surfaces

with fresh heat transfer compound (approx. 100µm). That may be done with a rubber

roller.

• Arrange and centre components, equivalent to the original stacking

• Turn nuts of the clamping bolts carefully by hand until the clamping parts have just

closed force.

• Check position of the components and arrange if necessary.

• Adjust clamping force according to the datasheet of the related semiconductor

component with the aid of Figure 6 Fehler! Verweisquelle konnte nicht gefunden

werden.and Figure 7.

• Re-attach the mounting sheets to the heatsinks

These instructions should only be used in exceptional circumstances We point out (warn) that

in case of such a manual assembly impermissible side forces may occur.

Setting the clamping force

1.) Determining the clamping force FS:

FS=0.8Fmax

if FS>FSK,

then FS=FSK

FS = requires clamping force for diode / thyristor in the heatsink

Fmax = max. clamping force for diode / thyristor according to table xx

FSK = max. clamping force of the spring packet

fS = travel of the spring packet

2.) Determining the travel of the spring packet

2.1) Compare existing spring layers with layers 1-8

2.2) Read travel 1-8 in the diagram

3.) Set travel fS by several alternating tightening

Example:

Spring travel fS = 1.4mm

Thread M8: s = 1.25mm

Number of nut turns:

1.4mm : 1.25mm = 1.12 turns

Per nut turn the following spring travel occurs:

- thread M6: s = 1mm

- thread M8: s = 1.25mm

Number of nut turns = fS : pitch s

Spring travel should be determined and checked resulting

from the deference between column height clamped and

column height unclamped (0-set point) with appropriate

vernier callipers.

FSK = 4.5kN

2 spring columns per component with 3 springs each

spring column Belleville spring washer 18x6.2x0.8

FSK = 3.5kN