HIGH FREQUENCY MULTILAYER CHIP BEAD
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ACHB-0402
STANDARD SPECIFICATIONS:
OPTIONS AND PART IDENTIFICATION:
(Left blank if standard)
APPLICATIONS:
FEATURES:
1.0 x 0.5 x 0.5mm
Pb
RoHS
Compliant
PARAMETERS
ABRACON P/N: ACHB-0402x-xxx Series
Operating temperature: -55°C to + 125°C
Storage temperature: -55°C to + 125°C
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
30332
Esperanza, Rancho Santa Margarita, California
92688
tel 949-546-8000 | fax 949-546-8001 | www.abracon.com
Revised: 10.05.07
Visit www.abracon.com for Terms & Conditions of Sale
• High frequency noise countermeasure
• Multilayer monolithic construction yields high reliability
• Suitable for ultra high speed circuit
• Computer mobile communication system product
• Noise supression in ultra high spec circuit
OUTLINE DRAWING:
Length (L) 0.04±0.006
(1.00±0.15)
Width (W) 0.02±0.006
(0.50±0.15)
Thickness (T) 0.02±0.006
(0.50±0.15)
a1,a2 (BW) 0.01±0.004
(0.25±0.10)
Please refer to the tables
above.
S
KTTape and
Reel
Impedance
ACHB - 0402 -
Material Code Packaging
-
Ir is the rated currrent applied when the
chip surface temperature rise 20ºC
Z (ΩΩ), ±25%
DC I
@100MHz ΩΩ
Max mA Max
120 0.7 300
220 0.9 300
300 1.2 200
600 1.5 100
120 1 300
220 1.3 300
300 1.5 200
600 1.9 100
Dimension: Inches (mm)
ACHB-0402S-121
Part
ACHB-0402K-221
Number
ACHB-0402K-301
ACHB-0402S-221
ACHB-0402S-301
ACHB-0402S-601
ACHB-0402K-121
ACHB-0402K-601