POE International Corp
M01-00-E-07
SPECIFICATION OF HIGH PRECISION THIN FILM CHIP RESISTOR
Ver: 1
Page: 6 of 8
TEST AND REQUIREMENTS
TEST PROCEDURE REQUIREMENT
Resistor
DC resistance DC resistance values measured at the test
voltages specified below : Within the specified tolerance ±0.5% & ±0.1%
Resistance <100Ω <1KΩ <10KΩ
Test voltage
0.3V 1.0V 3.0V
Resistance <100KΩ
<1MΩ <10MΩ
Test voltage
10V 25V 50V
Temperature
Coefficient of
Resistance
( TCR )
Natural resistance change per change in degree
centigrade.
( )
6
121
12 10×
−
ttR RR (ppm/°C)
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 25°C
Test temperature –55°C ~ +125°C
TCR: ≦±25 ppm/°C
Short time
overload
( STOL )
Permanent resistance change after a 5second
application of a voltage 2.5 times RCWV or the
maximum overload voltage specified in the
above list, whichever is less.
∆R/R max. ±(0.1%+0.05Ω)
Resistance to
soldering heat Unmounted chips 10±1 seconds, 260±5ºC no visible damage
∆ R/R max. ±(0.1%+0.05Ω)
Solderability Unmounted chips completely immersed for
3±1sec. in a lead-free solder bath at 245±5ºC
good tinning (>95% covered)
no visible damage
Temperature
cycling 1. 30 minutes at -55°C±3°C,
2. 2~3 minutes at room temperature,
3. 30 minutes at +155°±3°C,
4. 2~3 minutes at room temperature,
Total 5 continuous cycles
no visible damage
∆R/R max. ±(0.1%+0.05Ω)
Load life
(endurance) 70±2ºC, 1000 hours, loaded with RCWV or
Vmax,1.5 hours on and 0.5 hours off ∆R/R max. ±(0.5%+0.05Ω)
Load life in
Humidity 1000 hours, at rated continuous working voltage
in humidity chamber controller at 40°C±2°C and
90~95% relative humidity, 1.5hours on and 0.5
hours off
∆R/R max. ±(0.5%+0.05Ω)
Bending and
Termination
strength
Resistors mounted on a 90mm glass epoxy
resin PCB(FR4); bending : 3 mm, once for 10
seconds
Pulling test : 500grams
∆R/R max. ±(0.1%+0.05Ω)