Phycomp Product specification
Surface-mount ceramic
multilayer capacitors
Class 2, X7R
10 V
2005 Jan 14 Rev.9 8 www.yageo.com
TESTS AND REQUIREMENTS
Table 3 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
no visible damage
4.5 visual inspection and
dimension check
any applicable method using
×10 magnification
in accordance with
specification
4.6.1 capacitance f = 1 kHz; measuring voltage
1 Vrms at 20 °C
within specified tolerance
4.6.2 tan
δ f = 1 kHz; measuring voltage
1 Vrms at 20 °C
in accordance with
specification
4.6.3 insulation resistance at UR (DC) for 1 minute in accordance with
specification
4.6.4 voltage proof
2.5 × UR for 1 minute; no breakdown or
flashover
4.7.1 temperature
characteristic
between minimum and
maximum temperature
in accordance with
specification
4.8 adhesion a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
mounted in accordance with
CECC 32 100, paragraph 4.4
no visible damage 4.9 bond strength of
plating on end face
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig. 340 mm
∆C/C: ≤10%
resistance to
soldering heat
precondition:
120 to 150 °C for 1 minute;
260 ±5 °C for 10 ±0.5 s
the terminations shall be
well tinned after recovery
∆C/C: ≤10%
4.10 Tb
resistance to
leaching; jig clamps
to the second
component in the
longitudinal line
260 ±5 °C for 30 ±1 s
in a static solder bath
using visual enlargement
of ×10, dissolution of the
terminations shall not
exceed 10%