TECHNICAL NOTE Power Management Switch IC Series for PCs and Digital Consumer Product 1ch Small Current Output Power Management Switch ICs BD2202G, BD2206G Description The High-side switch for memory card slot is an IC High-side switch with a function of over-current protection used in the power supply line of a memory card slot. In the switch part an N channel MOSFET low ON resistance has been 1 circuit integrated. The switch goes OFF when the over-current condition lasts longer than the over-current shutdown time. The OFF switch is set on latch off mode. The operating voltage range is 2.7V to 3.6V and the current limit value is set on 400mA, 1A. Moreover, a soft start function, an under voltage lockout function and an over temperature protection function are integrated. Feature 1) Single low on-resistance (Typ. = 150m) Nch MOS FET 2) Continuous load current 0.2A(BD2202G) / 0.5A(BD2206G) 3) Control input logic: Active-High 4) Soft start function 5) Over current protection circuit 6) Over temperature protection circuit 7) Under voltage lockout 8) Power supply voltage range 2.7V3.6V 9) Operating temperature range -2585 Applications Memory card slots of STB, Digital still camera, Cell Phones, Notebook PC. Line up Parameter BD2202G BD2206G Continuous load current (A) 0.2 0.5 Short circuit current limit (A) 0.4 1.0 Logic Control input High High May 2008 Absolute Maximum Ratings Parameter Symbol Limits Unit Supply voltage VIN -0.3 to 6.0 V En voltage VEN -0.3 to 6.0 V OUT voltage VOUT -0.3 to VIN + 0.3 V Storage temperature TSTG -55 to 150 C Power dissipation *1 * * *1 PD 675 mW Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW/ for operating above Ta=25 Does not do radiation resistance design. There is no operation guarantee. Operating conditions BD2202G Parameter Operating voltage range Operating temperature range Operating load current Symbol Limits Unit VIN 2.7 to 3.6 V TOPR -25 to 85 C ILO 0 to 200 mA Symbol Limits Unit VIN 2.7 to 3.6 V TOPR -25 to 85 C ILO 0 to 500 mA BD2206G Parameter Operating voltage range Operating temperature range Operating load current 2/16 Electrical characteristics BD2202G (Unless otherwise specified, VIN = 3.3V, Ta = 25C) DC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Operating current IDD - 70 90 A VEN = 3.3V, VOUT = OPEN Standby current ISTB - 0.01 1 A VEN = 0V, OUT = OPEN EN input voltage VEN 2.0 - - V High level input - - 0.8 V Low level input EN input current IEN -1.0 0.01 1.0 A VEN = 0V or VEN = 3.3V ON resistance RON - 150 200 m IOUT = 50mA ISC 200 - 600 mA VOUT = 0V ILEAK - 0.01 10 A VEN = 0V, VOUT = 0V VTUVH 2.1 2.3 2.5 V VIN increasing VTUVL 2.0 2.2 2.4 V VIN decreasing Short-circuit output current Output leak current UVLO threshold AC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Output rise time TON1 0.25 1.2 6 ms ROUT=500, COUT=0.1F Output turn on time TON2 0.4 2 10 ms ROUT=500, COUT=0.1F Output fall time TOFF1 50 100 200 s ROUT=500, COUT=0.1F Output turn off time TOFF2 50 100 200 s ROUT=500, COUT=0.1F 5 10 15 ms At continuous over current 3 - 15 ms At discontinuous over current Over current shutdown time 1 Over current shutdown time 2 TBLANK 1 TBLANK 2 3/16 BD2206G (Unless otherwise specified, VIN = 3.3V, Ta = 25C) DC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Operating current IDD - 70 90 A VEN = 3.3V, VOUT = OPEN Standby current ISTB - 0.01 1 A VEN = 0V, OUT = OPEN EN input voltage VEN 2.0 - - V High level input - - 0.8 V Low level input EN input current IEN -1.0 0.01 1.0 A VEN = 0V or VEN = 3.3V ON resistance RON - 150 200 m IOUT = 50mA ISC 750 - 1350 mA VOUT = 0V ILEAK - 0.01 10 A VEN = 0V, VOUT = 0V VTUVH 2.1 2.3 2.5 V VIN increasing VTUVL 2.0 2.2 2.4 V VIN decreasing Short-circuit output current Output leak current UVLO threshold AC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Output rise time TON1 0.25 1.2 6 ms ROUT=500, COUT=0.1F Output turn on time TON2 0.4 2 10 ms ROUT=500, COUT=0.1F Output fall time TOFF1 50 100 200 s ROUT=500, COUT=0.1F Output turn off time TOFF2 50 100 200 s ROUT=500, COUT=0.1F 5 10 15 ms At continuous over current 3 - 15 ms At discontinuous over current Over current shutdown time 1 Over current shutdown time 2 TBLANK 1 TBLANK 2 4/16 Measurement circuits VIN VIN OUT GND GND EN EN NC Operating current VIN GND EN NC EN input voltage, Output rise / fall time OUT VIN OUT OUT GND NC EN ON resistance NC Over current protection characteristics Fig.1 Measurement circuits Timing diagrams VEN 50% 50% TON2 Over current detection TOFF2 90% VOUT 90% IOUT VOUT 10% TON1 10% TOFF1 TBLANK Fig.2 Switch Turn on / off time Fig.3 Over current limits characteristics 5/16 Reference data 90 80 OPERATING CURRENT : IDD [A] 70 60 50 40 30 20 70 60 50 40 30 20 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 4 0.4 0.2 0 50 2 100 AMBIENT TEMPERATURE : Ta [C] Fig.4 Operating current EN Enable Fig.5 Operating current EN Enable 0.4 0.2 0.0 Low to High 1.5 0.5 0.0 0.0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] -50 0 50 100 AMBIENT TEMPERATURE : Ta[] 4 Fig.9 EN input voltage Fig.8 EN input voltage Fig.7 Operating current EN Disable 250 250 0.6 Ta=25C SHORT CIRCUIT CURRENT : ISC[A] VIN=3.3V 200 ON RESISTANCE : RON[m] 200 150 100 150 100 50 50 0 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VDD[V] 4 0.3 0.2 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.13 Short circuit output current (BD2202G) 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4 Fig.12 Short circuit output current (BD2202G) 1.35 SHORT CIRCUIT CURRENT : ISC[A] 0.4 SHORT CIRCUIT CURRENT : ISC[A] 0.5 0.3 2 1.35 VIN=3.3V 0.4 0 50 100 AMBIENT TEMPERATURE : Ta [] Fig.11 ON resistance 0.6 Ta=25C 0.5 0.2 -50 Fig.10 ON resistance -50 High to Low 1.0 0.5 -50 0 50 100 AMBIENT TEMPERATURE : Ta [] Low to High 1.5 High to Low 1.0 VIN=3.3 V ENABLE INPUT VOLTAGE : VEN, V/EN[V] ENABLE INPUT VOLTAGE : VEN, V/EN[V] 0 Ta=25C 0.6 4 2.0 VIN=3.3V 0.8 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] Fig.6 Operating current EN Disable 2.0 1.0 OPERATING CURRENT : ISTB[uA] 0.6 0.0 0 0 ON RESISTANCE : RON[m] 0.8 10 10 SHORT CIRCUIT CURRENT : ISC[A] Ta=25C VIN=3.3V OPERATING CURRENT : ISTB[uA] 80 OPERATING CURRENT : IDD [A] 1.0 90 Ta=25C Ta=25C 1.25 1.15 1.05 0.95 0.85 0.75 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4 Fig.14 Short circuit output current (BD2206G) 6/16 VIN=3.3V 1.25 1.15 1.05 0.95 0.85 0.75 -50 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.15 Short circuit output current (BD2206G) 13 12 11 10 9 8 7 6 5 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] Ta=25C 13 2000 12 11 10 9 8 500 6 5 0 0 50 SUPPLY VOLTAGE : Ta[] 100 2 2000 TURN ON TIME : TON2 [us] TURN ON TIME : TON2 [ms] 1500 1000 0 2 Fig.19 Output rise time Fig.21 Output turn on time 200 TURN OFF TIME : TOFF2[us] VIN=3.3V 150 FALL TIME : TOFF1[us] FALL TIME : TOFF1 [us] 100 100 -50 4 2.5 UVLO HYSTERESIS VOLTAGE : VHYS[V] TURN OFF TIME : TOFF2[us] TURN OFF TIME : TOFF2 [us] 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.25 Output turn off time 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 0.20 VUVLOH 2.3 2.2 VUVLOL 2.1 -50 2 Fig.24 Output turn off time 2.4 50 100 Fig.23 Output fall time VIN=3.3V 100 150 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.22 Output fall time 150 Ta=25C 50 50 50 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 0 50 100 AMBIENT TEMPERATURE : Ta[] 4 200 150 200 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] Fig.20 Output turn on time Ta=25C 2 1000 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[] 200 1500 500 500 0 4 VIN=3.3V Ta=25C 2000 500 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] Fig.18 Output rise time 2500 2500 1000 1000 Fig.17 Over current shutdown time VIN=3.3V 1500 1500 7 -50 2000 RISE TIME : TON1 [us] 2500 VIN=3.3V 14 4 Fig.16 Over current shutdown time 2500 15 RISE TIME : TON1 [us] Ta=25C 14 OVER CURRENT SHUTDOWN TIME : TBLANK1[ms] OVER CURRENT SHUTDOWN TIME : TBLANK1[ms] 15 2 -50 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.26 UVLO threshold voltage 7/16 0.16 0.12 0.08 0.04 0.00 -50 0 50 100 AMBIENT TEMPERATURE : Ta[] Fig.27 UVLO hysteresis voltage Waveform data IOUT (0.1A/div.) VOUT (1/div.) VOUT (1/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VIN=3.3V RL=500 CL=0.1uF V/EN (1/div.) VIN=3.3V RL=500 CL=0.1 V/EN (1/div.) VEN (1V/div.) TIME (0.5div.) TIME (0.5div.) TIME (2ms/div.) Fig.28 Output turn on response Fig.29 Output turn off response Fig.30 Current limit response Enable into short circuit (BD2202G) IOUT (0.2A/div.) IOUT (0.2A/div.) IOUT (0.2A/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VEN (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) TIME (2ms/div.) TIME (2ms/div.) TIME (2ms/div.) Fig.31 Current limit response Enable into short circuit (BD2206G) Fig.32 Current limit response Output shorted to GND (BD2202G) Fig.33 Current limit response Output shorted to GND (BD2206G) VIN (1V/div.) IOUT (0.2A/div.) IOUT (0.1A/div.) VOUT (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) RL=500 CL=0.1uF IOUT (10mA/div.) TIME (5ms/div.) TIME (5ms/div.) TIME (5ms/div.) Fig.34 Current limit response Ramped load (1A/10ms) (BD2202G) Fig.35 Current limit response Ramped load (1A/10ms) (BD2206G) Fig.36 UVLO VIN rising VIN (1V/div.) VOUT (1V/div.) RL=500 CL=0.1uF IOUT (10mA/div.) TIME (500ms/div.) Fig.37 UVLO VIN falling 8/16 Block diagram VIN Current limit GND Charge pump OUT VIN VOUT UVLO Control logic GND EN NC Thermal shutdown EN Fig.38 Block diagram Fig.39 Pin configuration Pin description Pin Number Pin Name I/O 1 VIN I 2 GND I 3 EN I 4 5 N.C VOUT O Pin function Power supply input terminal. Input terminal to the power switch and power supply input terminal of the internal circuit. Ground. Power Switch enable input. Active-High Switch on input. A logic high turns the switch on. No connection. Not internally connected. Power switch output I/O circuit Pin Name Pin Number EN 3 VOUT 5 Equivalent circuits 9/16 Operation description BD2202G and BD2206G are high side switch IC with over-current protection function. The operating voltage range is from 2.7V to 3.6V and the current limit value is set on 400mA, 1A. When an over-current condition lasts longer than an over-current shutdown time, the switch turns OFF. The OFF switch is set on latch mode. The switch set on latch mode returns (to normal) by toggling EN pin from High to Low to High. 1. Switch On/Off control VIN and VOUT pins are connected to each switch MOSFET drain and source. Moreover, VIN pin is also used as a power supply input for the internal control circuit. When the switch is turned on from EN control input, VIN and VOUT is connected by a 150m switch. In normal condition, the switch shows bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from VOUT to VIN. In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is off, when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN. 2. Over current detection (OCD) The over current detection circuit limits current when current flowing in switch MOSFET exceeds the current limit threshold. There are three types of response against over current. The over current detection circuit is in operation when the power switch is ON (when EN signal is active). 2-1 When the switch is turned on while the output is in short-circuit status When the switch is turned on while the output is in short-circuit status, the switch become current limit mode soon. 2-2 When the output short-circuits while the switch is on When the output short-circuits or heavy load is connected while the switch is on, very large current flows until the over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out. 2-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 3. Over current shutdown When the over-current detection circuit detects an over-current, TBLANK timer starts working. When the over-current condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over-current condition progresses to more than TBLANK1, the switch is shut off. The OFF switch is set on latch off mode. The latch is reset when EN terminal is toggled or when UVLO is detected. 4. Under voltage lockout (UVLO) UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation, if VIN voltage drops to 2.2V (Typ.), the power switch is set on OFF. UVLO has a 100mV hysteresis. The under voltage lock out circuit is in operation when power switch is ON (when EN signal is active). 10/16 5. Thermal shutdown When the chip temperature increases to 160C (Typ.), the thermal shut down circuit works and the power switch is turned OFF. When the chip temperature falls to 140C (Typ.), the power switch output returns (to normal). This operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch output is turned off. The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active). TBLANK2 TBLANK1 Output current ON OFF ON Switch status EN voltage Fig.40 Over-current detection, shutdown operation (return with EN input) TBLANK2 TBLANK1 Output current ON OFF ON Switch status VTUVL VIN voltage Fig.41 Over-current detection, shutdown operation (return with UVLO operation) 11/16 VTUVH Typical application circuit VIN Cin VIN Current limit Charge pump VOUT UVLO Control logic Cout EN OFF ON Rout Thermal shutdown GND Fig.42 Typical application circuit Application information When an excessive current flows because of an output short circuit, a noise caused by the inductance of power supply to the IC breaks out and it is possible that it influences negatively the IC operation. In order to avoid this problem, please connect CIN bypass capacitor close to the IC VIN and GND pins of the IC. More than 1F is recommended. Due to the internal body diode in the switch, a CIN greater than COUT is highly recommended. This system connection diagram does not guarantee operation as an application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. 12/16 Power dissipation characteristics (SSOP5) 800 POWER DISSIPATION : Pd [mW] 700 600 500 400 300 200 100 0 0 25 50 75 100 AMBIENT TEMPERATURE : Ta [] Fig.43 Power dissipation curve (Pd-Ta Curve) 13/16 125 150 Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 14/16 (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. 15/16 Order model name selection B D 2 Rohm model name 2 0 2 - G Product number 2202 2206 T Package type G = SSOP5 R Taping model name TR = embossed reel tape SSOP5 <Dimension> <Tape and Reel information> Tape 2.90.2 1 2 0.2Min. +0.2 4 1.6 -0.1 2.80.2 5 +6 4 -4 3 0.050.05 1.25Max. 1.10.05 0.13 Embossed carrier tape Quantity 3000pcs Direction of feed TR (The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand) +0.05 -0.03 0.42 +0.05 -0.04 0.95 X X X X X X 0.1 X X X X X X X X X X X X 1Pin X X X X X X X X X X X X Direction of feed Reel (Unit:mm) When you order , please order in times the amount of package quantity. 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