Connector for microSDTM Card (Hinge Cover Type) SCHB Series Hinge cover type with improved card retention. For SD Memory Card For microSDTM Card For SIM Card 8pins For Memory Stick MicroTM Typical Specifications Combine Type Items Specifications Applicable media For W-SIM microSDTM Card Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Manual insertion/removal Structure Performance Operating temperature range -20 to 70 Voltage proof 500V AC 1minute Insulation resistance Initial 1,000M min. Contact resistance Initial 100m max. Insertion and removal cycle 5,000cycles Product Line Media ejection structure Mounting system Manual insertion/removal Standard mount Feature Stand-off mm Packing system 0 Taping Product No. Drawing No. SCHB1A0205 1 SCHB1B0100 2 Without switch With switch Packing Specifications Unit:mm Taping Reel size Number of packagespcs. Product No. Reel width mm 1 reel 1 case /Japan 1 case /export packing SCHB1A0205 1,400 4,200 8,400 330 SCHB1B0100 1,500 4,500 9,000 380 Tape width mm Export package measurements mm 353x353x249 24 380 24.4 403x403x249 Note Please place purchase orders per minimum order unit N (integer). 535 Refer to P.558 for soldering conditions. Connector for microSDTM Card (Hinge Cover Type) SCHB Series Dimensions Unit:mm No. PC board mounting hole dimensions Viewed from the mounting face side Style Without switch For SD Memory Card Connector center 7.6 7.6 For microSDTM Card 3.2 Pitch 1.93 5.1 3.8 13.65 10.1 For SIM Card 8pins For Memory Stick MicroTM 2 10.95 8.6 2 6.55 15 13.65 4-1.4 11.95 9.8 3.65 1.9 7-1.1 6.15 6.15 2.65 Area for vacuum 4 1 8-0.3 Combine Type 8-0.8 8 No. 7 No. 6 No. 4 5 No. No. 3 No. 2 No. No. 1 Pitch 13.2 7-1.1 For W-SIM 3.2 Connector center 14.6 13.2 Pin Assignment PIN No. SD Mode Name 1 DAT2 No parts area Land area 2 2 CD/DAT3 3 CMD 4 VDD 5 CLK 13 No.7 No.6-2 2 No.10 No.8 No.7 No.6-2 No.6-1 No.6-1 No.5 No.4 13.3 14.6 No.5 No.4 13.3 9-0.4 No.1 No.914.6 No.2 No.3 9-0.4 No.9 PIN No. No.1 microSD NO.1 DAT2 No.2 microSD NO.2 DAT3/CD microSD NO.4 No.6-2 No.7 No.8 microSD NO.7 PIN LAYOUT 1.6 3.75 9-0.8 9-0.8 Connector center 13.9 Connector center Composition of Detection (Cover and Card) Card Detect(SW-1) No.6-1 No.6-2 Vss (Card (GND) Card Detection/Switch Detect) 9.35 10.85 2-13 0.3 14.55 5.1 13.9 Card Installation: ON Non Card: OFF 1.6 3.75 Pitch 8-0.95 3.6 1.6 3.75 Land area Pitch 8-0.95 3.6NO parts area NO pattern area Land area NO parts area NO pattern area No.11 No.12 (Cover Detect) Card Installation: ON DAT0 When becming SW-1 and SW-2 on Card Installation Non Card: OFF DAT1 Card Detect(SW-2) No.9 No.10 Covers/Switch (GND) Lock: ON microSD NO.8 5.1 1.6 3.75 CMD Composition of Detection VDD (Cover and Card)Card Detect(SW-2) microSD Card NO.5 Detect(SW-1) CLK No.9 No.10 No.6-1 VSS No.6-2 Covers/Switch microSD NO.6 (GND) Vss CARD DETECT (Card ON microSD NO.6 (GND) Card Detection/Switch Detect) Lock: Unlock: OFF microSD NO.3 No.4 No.5 (1.7) (0.7) (1.7) PIN ASSIGNMENTS No.6-1 (0.7) No.2 No.3 CONNECTER TERMINAL NO. No.3 7.6 6.8 6.3 4.465 3.8 7 1.5 No.1 14.55 13.25 No.8 (1.35) 10.44 14.05 15.4 4-1.2 13 4.35 No.10 7.6 6.8 6.3 5.3 13.25 (1.35) 0.3 Lock position Unlock position 1.65 Pitch 0.95 No.11 10.44 14.05 15.4 13 4.35 No.12 Unlock position 7 1.5 Connector center 3.6 Lock position 1.65 Pitch 0.95 No.11 3.6 No.12 7.6 6.8 6.3 4.465 3.8 7.6 6.8 6.3 5.3 2-2 Connector center 2-4.35 With switch 2-2 DAT1 3.7 5.15 8 2-2 DAT0 3.7 5.15 VSS 7 2-2 2-4.35 9.35 10.85 2-13 6 No pattern area No.11 No.12 (Cover Detect) Unlock: OFF When becming SW-1 and SW-2 on Card Installation 536 Memory Card Connectors List of Varieties Applicable media For SD Memory Card For microSDTM Card For SIM Card 8pins SD For Memory Stick MicroTM SD Memory TMCard Combine Type Product No. Photo Media ejection structure Mounting style Features SCDA9A0400 Inner tail Card eject stroke 5mm SCDA8A0201 Inner tail Card eject stroke 8mm Standard mount Stand-off mm Card eject stroke 8mm Multi-MediaCardTM Page 0 SCDA7A0101 SCDA7A0200 Auto motive use SCDA7A1201 1.5 527 1.8 For W-SIM SCDAAA0100 Push-push type 0 Reverse mount Outer tail SCDAAA0601 1.8 SCHA4B0100 With switch Standard mount With switches and fly-out protection. SCHA4B0400 Reverse mount SCHA5B0200 microSDTM Card With switch Hinge cover type Without switch SCHB1A0205 532 0 535 Hinge cover type With switch SCHB1B0100 Standard mount SCHD1A0101 Manual insertion/ removal Header type 537 Adapter 539 SCHD3A0100 SCHH1D0100 Note marks in "Available for automotive use" indicate that some of the series products can work at the operating temperature range from -40 to +85. 525 Memory Card Connectors Note Please place purchase orders per minimum order unit N (integer). Soldering Conditions Example of Reflow Soldering ConditionReference 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CAK or CCTat soldering portion. 3. Temperature profile For SD Memory Card Temperature (C ) 240(max.) For microSDTM Card 230(min.) 200 For SIM Card 8pins 180 150 For Memory Stick MicroTM 100 Room temperature Time (s) Pre-heating 9030 sec. Heating time 10 sec.(max.) Combine Type For W-SIM sec. Please refer to each product's specification sheet to confirm temperature profile. Cautions for using this product 1.Connector hamdling precautions (1) Safeguard the connector assembly against flux penetration from its top side. (2) This product is designed on the assumption that they will not be washed after soldering. If youwash it,it may be cause deterioration of mechanically and electrically. If washing is necessary,pleasemake contact with us beforehand. 2.When soldering terminals,there is a danger that load placed on the terminals may cause rattle,deformayion or electrical degradation to occur depending on the conditioms. Caution is therefore required. 3.When soldering, do not use water soluble flux because this may corrode the product. 4.regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 5.As P.W.B. warping may alter characteristics,please take this into consideration when designing pattern and layout. 6.Please do not solder at the ejector pushing position. 7.To prevent contact disturbance by the sulfuration or oxidation of the conyact and terminal, and deterioration of solder ability by thin film on the terminal, please note following. Storage in the atmosphere of high temperature at 60 degrees or more, high humidity,corrosive gases such as sulfur or chlorinate gas, and excessive piling up of the carton boxes shall be avoided. Connectors shall be stored as the package not opened and in the normal temperature and normal humidity, and the connectors shall be used preferably within 3 months, at least within 6 months. When the connectors are stored after opening the package, the connectors shall be sealed with a polyethylene bag etc. and stored in dark and cool place, avoiding direct sunlight. Bag etc. and stored in dark and cool place, avoiding direct sunlight. The connectors shall be used as soon as possible. 8.Don't push or hold down the metal cover of the connector, otherwise there is a possibolity that the card would not be ejected or influences to other function. 9.Please attention following items to prevent connector from miss operation, such as bounding caused by ON/OFF switching and chattering by vibration. Repeated reading/writing. Establish delay time-recommended 400msec min. Establish CR accumulation circuit. 10.This product does not operate normally when the card which does not conform to the specification is used occasionally. 558