Reflowable Thermal Protection
Device
PRODUCT: RTP140R060S
DOCUMENT: SCD28140
REV LETTER: A
REV DATE: FEBRUARY 27, 2012
PAGE NO.: 1 OF 5
Specification Status: Released
PIN CONFIGURATION A ND DESCRIPTION:
Pin Configuration
(Bottom View of Device)
(Top View of Device)
TABLE 1. DIMENSIONS:
A B C
MIN MAX MIN MAX MIN MAX
mm 11.60 12.00 6.00 6.35 5.25 5.50
in: (0.46) (0.47) (0.24) (0.25) (0.21) (0.22)
TABLE 2. ABSOLUTE MAX RATINGS:
Absolute Max Ratings Max Units
Max AC Open Voltage 1 250 VAC
@ 120 VAC 80
@ 135 VAC 70
Max Interrupt Current 1
@ 250 VAC 40
A
ESD rating (Human Body Model) 25 kV
Dielectric Strength Between Contacts (post operation) 1.0 kVAC
Max Reflow Temperature (pre-arming) 260 °C
Operating temperature limits, post arming,
non-opening -40
+105 °C
1. Performance capability at these conditions can be influenced by board design. Performance should be
verified in the user’s system.
A
C
Note:
B2 is product code
хххх is Batch Code
P1 indicated by inmolded mark
P1 PTH ARM
B
B2 хххх
(Side View of Device)
Reflowable Thermal Protection
Device
PRODUCT: RTP140R060S
DOCUMENT: SCD28140
REV LETTER: A
REV DATE: FEBRUARY 27, 2012
PAGE NO.: 2 OF 5
TABLE 3. PERFORMANCE CHARACTERISTICS (Typical unless otherwise specified):
Resistance and Open Characteristics
P1 to PTH Min Typ Max Units
@ -40+/-3°C
@ 23+/-3°C 0.6
0.7
1.0
1.1
RPP (Resistance from P1 to PTH)
@ 105+/-3°C 0.9 1.2
mΩ
Operating Voltage 250 VAC
Open Temperature, post-arming IPP = 0 135 140 145 °C
Thermal Resistance: Junction to Case Case = PTH pad 0.5 °C/W
@ -40+/-3°C
@ 23+/-3°C
30
25
Installation dependent Operating Current, post-
arming 2, 3 @ 105+/-3°C 12
A
Moisture Sensitivity Level Rating 4 1
2. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz Cu traces, a 108
mm2, 2oz Cu heat spreader connected to the PTH pad, and a 131 mm2, Cu heat spreader connected to
the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet). Results are highly
installation-dependent. Users should confirm for their own applications.
3. Operating current is measured on the RTP test board (see the RTP Datasheet) at the specified
temperature. It is a highly dependent value. Users should confirm for their own applications.
4. As per JEDEC J-STD-020C
TABLE 4. ARMING CHARACTERISTICS:
Arming Characteristics
ARM Min Typ Max Units
Arming Type Electronically Armed
Pre-Arming 300 mΩ
RARM (Resistance from ARM to P1 or PTH) Post-Arming 10 kΩ
Arming Current (IARM) 5 @ 23 +/-3°C 2 5 A
@ 2A 0.10
Arming Time (@23 +/-3°C) 5 @ 5A 0.01 Sec
5. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz, Cu traces, a 108
mm2, 2oz Cu heat spreader connected to the PTH pad, and a 131 mm2, Cu heat spreader connected
to the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet.) Results are
highly installation dependent. Users should confirm for their own applications.
Reflowable Thermal Protection
Device
PRODUCT: RTP140R060S
DOCUMENT: SCD28140
REV LETTER: A
REV DATE: FEBRUARY 27, 2012
PAGE NO.: 3 OF 5
Solder Reflow Recommendation:
Recommended Pad Layout:
mm
Reflowable Thermal Protection
Device
PRODUCT: RTP140R060S
DOCUMENT: SCD28140
REV LETTER: A
REV DATE: FEBRUARY 27, 2012
PAGE NO.: 4 OF 5
Package Information:
E F W P1 P0 P2
mm
(in)
1.75±0.10
(0.069±0.004)
11.50±0.10
(0.453±0.004)
24.00±0.30
(0.945±0.012)
12.00±0.10
(0.472±0.004)
4.00±0.10
(0.157±0.004)
2.00±0.10
(0.079±0.004)
D0 D1 T A0 B0 K0
mm
(in)
1.50+0.10/-0.00
(0.059+0.004/-0.000)
1.50±0.10
(0.059±0.004)
0.46±0.046
(0.018±0.002)
5.70±0.18
(0.224±0.007)
12.40±0.18
(0.488±0.007)
6.50±0.18
(0.256±0.007)
B W1 W
2 Max
mm
(inch)
102.0 ± 2.0
(4.0 ± 0.079)
24
(0.945)
29
(1.14)
Reflowable Thermal Protection
Device
PRODUCT: RTP140R060S
DOCUMENT: SCD28140
REV LETTER: A
REV DATE: FEBRUARY 27, 2012
PAGE NO.: 5 OF 5
Precedence: This specification takes precedence over documents referenced herein.
Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid.
MATERIALS INFORMATION
RoHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test
each product selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of
companies (“TE”) reserves the right to change or update, without notice, any information contained in this publication; to change,
without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution
of any product. This publication supersedes and replaces all information previously supplied. Without express written consent by an
officer of TE, TE does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical
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not limited to, any implied warranties of merchantability or fitness for a particular purpose. TE’s only obligations are those in the TE
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© 2012 Tyco Electronics Corporation, a TE Connectivity Ltd. company. All rights reserved.
HF
