LM140K
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SNVS994 JULY 2013
LM140K 3-Terminal Positive Regulator
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1FEATURES DESCRIPTION
The LM140K monolithic 3-terminal positive voltage
2 Complete Specifications at 1A Load regulator employs internal current-limiting, thermal
Output Voltage Tolerances of ±4% at Tj= 25°C shutdown and safe-area compensation, making them
Internal Thermal Overload Protection essentially indestructible. If adequate heat sinking is
provided, they can deliver over 1.0A output current.
Internal Short-circuit Current Limit They are intended as fixed voltage regulators in a
Output Transistor Safe Area Protection wide range of applications including local (on-card)
P+Product Enhancement Tested regulation for elimination of noise and distribution
problems associated with single-point regulation. In
addition to use as fixed voltage regulators, these
devices can be used with external components to
obtain adjustable output voltages and currents.
Considerable effort was expended to make the entire
series of regulators easy to use and minimize the
number of external components. It is not necessary to
bypass the output, although this does improve
transient response. Input bypassing is needed only if
the regulator is located far from the filter capacitor of
the power supply.
The LM140K is available in 5V, 12V and 15V options
in the steel TO-3 power package.
Typical Applications
*Required if the regulator is located far from VOUT = 5V + (5V/R1 + IQ) R2 5V/R1 > 3 IQ,
the power supply filter. load regulation (Lr)[(R1 + R2)/R1] (Lrof
**Although no output capacitor is needed LM140K-5.0).
for stability, it does help transient response.
(If needed, use 0.1 μF, ceramic disc). Figure 2. Adjustable Output Regulator
Figure 1. Fixed Output Regulator
ΔIQ= 1.3 mA over line and load changes.
Figure 3. Current Regulator
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM140K
SNVS994 JULY 2013
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Connection Diagrams
Figure 4. TO-3 Metal Can (Bottom View)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)
DC Input Voltage 35V
Internal Power Dissipation(4) Internally Limited
Maximum Junction Temperature 150°C
Storage Temperature Range 65°C to +150°C
Lead Temperature (Soldering, 10 sec.) TO-3 Package (NDS) 300°C
ESD Susceptibility(5) 2 kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
(2) Specifications and availability for military grade LM140H/883 and LM140K/883 can be found in the LM140QML datasheet (SNVS382).
Specifications and availability for military and space grade LM140H/JAN and LM140K/JAN can be found in the LM140JAN datasheet
(SNVS399).
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX
TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3
package and the case-to-ambient thermal resistance of the heatsink.
(5) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions(1)
Temperature Range (TA)(2) LM140 55°C to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
(2) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX
TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3
package and the case-to-ambient thermal resistance of the heatsink.
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LM140 Electrical Characteristics
55°C TJ+ 150°C unless otherwise specified(1)
Output Voltage 5V 12V 15V
Symbol Input Voltage (unless otherwise noted) 10V 19V 23V Units
Parameter Conditions Min Typ Max Min Typ Max Min Typ Max
VOOutput TJ= 25°C, 5 mA IO1A 4.9 5 5.1 11.75 12 12.25 14.7 15 15.3 V
Voltage PD15W, 5 mA IO1A 4.8 5.2 11.5 12.5 14.4 15.6 V
VMIN VIN VMAX (7.5 VIN 20) (14.8 VIN 27) (17.9 VIN 30) V
ΔVOLine IO= 500 mA 10 18 22 mV
Regulation TJ= 25°C, ΔVIN,55°C TJ(7.5 VIN 20) (14.8 VIN 27) (17.9 VIN 30) V
+150°C
TJ= 25°C 3 10 4 18 4 22 mV
ΔVIN,55°C TJ+150°C (7.5 VIN 20) (14.5 VIN 27) (17.5 VIN 30) V
TJ= 25°C 4 9 10 mV
Over Temperature 12 30 30 mV
ΔVIN (8 VIN 12) (16 VIN 22) (20 VIN 26) V
ΔVOLoad TJ= 5 mA IO1.5A 10 25 12 32 12 35 mV
Regulation 25°C 250 mA IO15 19 21 mV
750 mA
Over Temperature, 25 60 75 mV
5 mA IO1A
IQQuiescent TJ= 25°C 6 6 6 mA
Current Over Temperature 6.5 6.5 6.5 mA
ΔIQQuiescent 5 mA IO1A 0.5 0.5 0.5 mA
Current TJ= 25°C, IO= 1A 0.8 0.8 0.8 mA
Change VMIN VIN VMAX (7.5 VIN 20) (14.8 VIN 27) (17.9 VIN 30) V
IO= 500 mA 0.8 0.8 0.8 mA
VMIN VIN VMAX (8 VIN 25) (15 VIN 30) (17.9 VIN 30) V
VNOutput Noise TA= 25°C, 10 Hz f100 40 75 90 μV
Voltage kHz
Ripple TJ= 25°C, f = 120 Hz, IO= 68 80 61 72 60 70 dB
Rejection 1A
or f = 120 Hz, IO= 500 mA, 68 61 60 dB
Over Temperature,
VMIN VIN VMAX (8 VIN 18) (15 VIN 25) (18.5 VIN 28.5) V
RODropout TJ= 25°C, IO= 1A 2.0 2.0 2.0 V
Voltage
Output f = 1 kHz 8 18 19 mΩ
Resistance
Short-Circuit TJ= 25°C 2.1 1.5 1.2 A
Current
Peak Output TJ= 25°C 2.4 2.4 2.4 A
Current
Average TC Min, TJ= 0°C, IO= 5 mA 0.6 1.5 1.8 mV/°C
of VO
VIN Input Voltage TJ= 25°C
Required to 7.5 14.5 17.5 V
Maintain Line
Regulation
(1) All characteristics are measured with a 0.22 μF capacitor from input to ground and a 0.1 μF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw10 ms, duty cycle 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
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Typical Performance Characteristics
Maximum Average Power Dissipation Output Voltage (Normalized to 1V at TJ= 25°C)
Figure 5. Figure 6.
Ripple Rejection Ripple Rejection
Figure 7. Figure 8.
Output Impedance Dropout Characteristics
Figure 9. Figure 10.
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Typical Performance Characteristics (continued)
Quiescent Current Peak Output Current
Figure 11. Figure 12.
Dropout Voltage Quiescent Current
Figure 13. Figure 14.
Line Regulation Line Regulation
140K, IOUT = 1A, TA= 25°C 140K, VIN = 10V, TA= 25°C
Figure 15. Figure 16.
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Equivalent Schematic
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APPLICATION HINTS
The LM140K is designed with thermal protection, output short-circuit protection and output transistor safe area
protection. However, as with any IC regulator, it becomes necessary to take precautions to assure that the
regulator is not inadvertently damaged. The following describes possible misapplications and methods to prevent
damage to the regulator.
SHORTING THE REGULATOR INPUT
When using large capacitors at the output of these regulators, a protection diode connected input to output
(Figure 17) may be required if the input is shorted to ground. Without the protection diode, an input short will
cause the input to rapidly approach ground potential, while the output remains near the initial VOUTbecause of the
stored charge in the large output capacitor. The capacitor will then discharge through a large internal input to
output diode and parasitic transistors. If the energy released by the capacitor is large enough, this diode, low
current metal and the regulator will be destroyed. The fast diode in Figure 17 will shunt most of the capacitors
discharge current around the regulator. Generally no protection diode is required for values of output capacitance
10 μF.
RAISING THE OUTPUT VOLTAGE ABOVE THE INPUT VOLTAGE
Since the output of the device does not sink current, forcing the output high can cause damage to internal low
current paths in a manner similar to that just described in the “Shorting the Regulator Input” section.
REGULATOR FLOATING GROUND (Figure 18)
When the ground pin alone becomes disconnected, the output approaches the unregulated input, causing
possible damage to other circuits connected to VOUT. If ground is reconnected with power “ON”, damage may
also occur to the regulator. This fault is most likely to occur when plugging in regulators or modules with on card
regulators into powered up sockets. Power should be turned off first, thermal limit ceases operating, or ground
should be connected first if power must be left on.
TRANSIENT VOLTAGES
If transients exceed the maximum rated input voltage of the device, or reach more than 0.8V below ground and
have sufficient energy, they will damage the regulator. The solution is to use a large input capacitor, a series
input breakdown diode, a choke, a transient suppressor or a combination of these.
Figure 17. Input Short
Figure 18. Regulator Floating Ground
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0.1 PF
(NOTE 1)
0.22 PF
OUTPUTINPUT
GND
VO
VI
0.1 PF0.22 PF
OUTPUTINPUT
GND
VO
VI++
LM140K
SNVS994 JULY 2013
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Figure 19. Transients
When a value for θ(H–A) is found using the equation shown, a heatsink must be selected that has a value that is
less than or equal to this number.
θ(H–A) is specified numerically by the heatsink manufacturer in this catalog, or shown in a curve that plots
temperature rise vs power dissipation for the heatsink.
Typical Applications
Bypass capacitors are recommended for optimum stability and transient response, and should be located as close as
possible to the regulator.
Figure 20. Fixed Output Regulator
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0.1 PF
0.22 PF
OUTPUT
INPUT
GND
OUT
R1
3.0:
Q1
2N6132
IN
RSC
Q2
2N6124
0.1 PF
0.22 PF
OUTPUT
INPUT
GND
VO
R1
3.0:
Q1
2N6133
IO MAX
IQ1
IREG
VI
0.1 PF
0.22 PF
OUTPUTINPUT
GND
VO
VI
LM140K
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SNVS994 JULY 2013
Figure 21. High Input Voltage Circuits
Figure 22. High Current Voltage Regulator
Figure 23. High Output Current, Short Circuit Protected
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0.1 PF
OUTPUTINPUT
GND
+ OUT
+ +
0.1 PF
OUTPUTINPUT
GND
- OUT
+ +
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SNVS994 JULY 2013
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Figure 24. Positive and Negative Regulator
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM140K-12 ACTIVE TO-3 NDS 2 50 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 LM140K
12P+
LM140K-12/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K
12P+
LM140K-15 ACTIVE TO-3 NDS 2 50 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 LM140K
15P+
LM140K-15/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K
15P+
LM140K-5.0 ACTIVE TO-3 NDS 2 50 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 LM140K
5.0P+
LM140K-5.0/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K
5.0P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
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