© Semiconductor Components Industries, LLC, 2006
October, 2006 Rev. 8
1Publication Order Number:
MC74AC10/D
MC74AC10, MC74ACT10
Triple 3−Input NAND Gate
Features
Outputs Source/Sink 24 mA
ACT10 Has TTL Compatible Inputs
PbFree Packages are Available
1314 12 11 10 9 8
21 34567
GND
VCC
Figure 1. Pinout: 14Lead Packages Conductors
(Top View)
MAXIMUM RATINGS
Rating Symbol Value Unit
DC Supply Voltage (Referenced to GND) VCC 0.5 to
+7.0
V
DC Input Voltage (Referenced to GND) Vin 0.5 to
VCC +0.5
V
DC Output Voltage (Referenced to GND) Vout 0.5 to
VCC +0.5
V
DC Input Current, per Pin Iin ±20 mA
DC Output Sink/Source Current, per Pin Iout ±50 mA
DC VCC or GND Current per Output Pin ICC ±50 mA
Storage Temperature Tstg 65 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
TSSOP14
DT SUFFIX
CASE 948G
1
14
SOEIAJ14
M SUFFIX
CASE 965
1
14
SOIC14
D SUFFIX
CASE 751A
1
14
1
14
PDIP14
N SUFFIX
CASE 646
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See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MC74AC10, MC74ACT10
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2
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage
AC 2.0 5.0 6.0
V
ACT 4.5 5.0 5.5
Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0VCC V
tr, tfInput Rise and Fall Time (Note 1)
AC Devices except Schmitt Inputs
VCC @ 3.0 V 150
VCC @ 4.5 V 40 ns/V
VCC @ 5.5 V 25
tr, tfInput Rise and Fall Time (Note 2)
ACT Devices except Schmitt Inputs
VCC @ 4.5 V 10
ns/V
VCC @ 5.5 V 8.0
TJJunction Temperature (PDIP) 140 °C
TAOperating Ambient Temperature Range 40 25 85 °C
IOH Output Current High 24 mA
IOL Output Current Low 24 mA
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74AC 74AC
Unit Conditions
TA = +25°C
TA =
40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
3.0 1.5 2.1 2.1 VOUT = 0.1 V
4.5 2.25 3.15 3.15 V or VCC 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level
Input Voltage
3.0 1.5 0.9 0.9 VOUT = 0.1 V
4.5 2.25 1.35 1.35 V or VCC 0.1 V
5.5 2.75 1.65 1.65
VOH Minimum High Level
Output Voltage
3.0 2.99 2.9 2.9 IOUT = 50 mA
4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
3.0 2.56 2.46 12 mA
4.5 3.86 3.76 IOH 24 mA
5.5 4.86 4.76 24 mA
VOL Maximum Low Level
Output Voltage
3.0 0.002 0.1 0.1 IOUT = 50 mA
4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
3.0 0.36 0.44 12 mA
4.5 0.36 0.44 IOL 24 mA
5.5 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 ±0.1 ±1.0 mAVI = VCC, GND
IOLD †Minimum Dynamic
Output Current
5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 4.0 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
MC74AC10, MC74ACT10
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3
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol Parameter VCC*
(V)
74AC 74AC
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = 40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay 3.3 1.5 6.0 9.5 1.0 10.5 ns 35
5.0 1.5 4.5 7.0 1.0 8.0
tPHL Propagation Delay 3.3 1.5 5.5 8.5 1.0 10.0 ns 35
5.0 1.5 4.0 6.0 1.0 6.5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74ACT 74ACT
Unit Conditions
TA = +25°C
TA =
40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
4.5 1.5 2.0 2.0 VVOUT = 0.1 V
5.5 1.5 2.0 2.0 or VCC 0.1 V
VIL Maximum Low Level
Input Voltage
4.5 1.5 0.8 0.8 VVOUT = 0.1 V
5.5 1.5 0.8 0.8 or VCC 0.1 V
VOH Minimum High Level
Output Voltage
4.5 4.49 4.4 4.4 VIOUT = 50 mA
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
4.5 3.86 3.76 V IOH
24 mA
5.5 4.86 4.76 24 mA
VOL Maximum Low Level
Output Voltage
4.5 0.001 0.1 0.1 VIOUT = 50 mA
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
4.5 0.36 0.44 V IOL
24 mA
5.5 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 ±0.1 ±1.0 mAVI = VCC, GND
DICCT Additional Max. ICC/Input 5.5 0.6 1.5 mA VI = VCC 2.1 V
IOLD †Minimum Dynamic
Output Current
5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 4.0 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
MC74AC10, MC74ACT10
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4
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol Parameter VCC*
(V)
74ACT 74ACT
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = 40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay 5.0 1.0 9.0 1.0 10.0 ns 35
tPHL Propagation Delay 5.0 1.0 9.0 1.0 9.5 ns 35
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value
Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 25 pF VCC = 5.0 V
MC74AC10, MC74ACT10
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5
MARKING DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = PbFree Package
PDIP14 SOIC14 TSSOP14
MC74AC10N
AWLYYWWG
MC74ACT10N
AWLYYWWG
SOEIAJ14
74ACT10
ALYWG
AC10G
AWLYWW
1
14
AC10G
AWLYWW
1
14
(Note: Microdot may be in either location)
ACT
10
ALYWG
G
ORDERING INFORMATION
Device Package Shipping
MC74AC10N PDIP14
25 Units/Rail
MC74AC10NG PDIP14
(PbFree Package)
MC74ACT10N PDIP14
MC74ACT10NG PDIP14
(PbFree Package)
MC74AC10D SOIC14
55 Units/Rail
MC74AC10DG SOIC14
(PbFree Package)
MC74AC10DR2 SOIC14
2500/Tape & Reel
MC74AC10DR2G SOIC14
(PbFree Package)
MC74ACT10D SOIC14 55 Units/Rail
MC74ACT10DR2 SOIC14
2500/Tape & Reel
MC74ACT10DR2G SOIC14
(PbFree Package)
MC74ACT10DTR2 TSSOP14*
MC74ACT10DTR2G TSSOP14*
MC74AC10M SOEIAJ14 50 Units/Rail
MC74ACT10MEL SOEIAJ14
2000/Tape & Reel
MC74ACT10MELG SOEIAJ14
(PbFree Package)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently PbFree.
MC74AC10, MC74ACT10
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6
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE P
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M−−− 10 −−− 10
N0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG D
K
C
SEATING
PLANE
N
T
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
MC74AC10, MC74ACT10
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7
PACKAGE DIMENSIONS
SOIC14
CASE 751A03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
A
B
G
P7 PL
14 8
7
1
M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
T
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
7X
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC10, MC74ACT10
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8
PACKAGE DIMENSIONS
TSSOP14
CASE 948G01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
LU
SEATING
PLANE
0.10 (0.004)
T
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION NN
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
V
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC10, MC74ACT10
http://onsemi.com
9
PACKAGE DIMENSIONS
SOEIAJ14
CASE 96501
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.004 0.008
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 1.42 −−− 0.056
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81357733850
MC74AC10/D
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