HDSP-A4xC Series
Alphanumeric Display, 0.54" (13.7 mm)
4 Character As AlInGaP Red
Data Sheet
Features
• As AlInGaP red color
• Gray face paint - Gray package gives optimum con-
trast
• Design exibility - Common anode or common
cathode
Applications
• Suitable for alphanumeric
• Operating temperature range –40°C to 105°C
Devices
As AlInGaP Red Description
HDSP-A42C Common Anode
HDSP-A47C Common Cathode
Description
These 0.54” (13.7 mm) AS AlInGaP displays are available in
either common anode or common cathode.
Package Dimensions
3.70 (0.140)
7.00 (0.276)
2.37
(0.093)
0.50
(0.020)
5.59
(0.220)
48.6
(1.913)
12.70
(0.500)
12.70
(0.500)
12.70
(0.500)
1.84
(0.072) 50.96
(2.006)
8.17
(0.322)
5°
13.80
(0.543)
21.15
(0.833)
15.24
(0.600)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.
1.60
(0.063)
PIN 1
1.20
(0.047)
6.00 (0.236)
0.30
(0.012)
2
Part Numbering System
Notes:
1. For codes not listed in the gure above, please refer to the respective datasheet or contact your nearest Avago representative for details.
2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1 bin per tube (exceptions may apply).
Please refer to respective datasheet for specic bin limit information.
5082 -X XX X-X X X XX
HDSP-X XX X-X X X XX
Mechanical Options [1]
00: No Mechanical Option
Color Bin Options [1,2]
0: No Color Bin Limitation
Maximum Intensity Bin [1,2]
0: No Maximum Intensity Bin Limitation
Minimum Intensity Bin [1,2]
0: No Minimum Intensity Bin Limitation
Device Conguration/Color [1]
C: AlInGaP Red
Device Specic Conguration [1]
Refer to Respective Datasheet
Package [1]
Refer to Respective Datasheet
3
Internal Circuit
Pin
Pin Conguration A
Common Anode
Pin Conguration B
Common Cathode
1 1E/2E Cathode 1E/2E Anode
2 1M/2M Cathode 1M/2M Anode
3 No Connection No Connection
4 1L/2L Cathode 1L/2L Anode
5 1K/2K Cathode 1K/2K Anode
6 1J/2J Cathode 1J/2J Anode
7 1D/2D Cathode 1D/2D Anode
8 DP2 Cathode DP2 Anode
9 1C/2C Cathode 1C/2C Anode
10 3E/4E Cathode 3E/4E Anode
11 DIGIT No. 3 Common Anode DIGIT No. 3 Common Cathode
12 3D/4D Cathode 3D/4D Anode
13 3J/4J Cathode 3J/4J Anode
14 3M/4M Cathode 3M/4M Anode
15 3L/4L Cathode 3L/4L Anode
16 DIGIT No. 4 Common Anode DIGIT No. 4 Common Cathode
17 3K/4K Cathode 3K/4K Anode
18 3C/4C Cathode 3C/4C Anode
Pin
Pin Conguration A
Common Anode
Pin Conguration B
Common Cathode
1 9 3B/4B Cathode 3B/4B Anode
20 3H/4H Cathode 3H/4H Anode
21 No Connection No Connection
22 3G/4G Cathode 3G/4G Anode
23 3P/4P Cathode 3P/4P Anode
24 3N/4N Cathode 3N/4N Anode
25 3A/4A Cathode 3A/4A Anode
26 DP1 Cathode DP1 Anode
27 3F/4F Cathode 3F/4F Anode
28 1B/2B Cathode 1B/2B Anode
29 DIGIT No. 2 Common Anode DIGIT No. 2 Common Cathode
30 1A/2A Cathode 1A/2A Anode
31 1N/2N Cathode 1N/2N Anode
32 1H/2H Cathode 1H/2H Anode
33 1G/2G Cathode 1G/2G Anode
34 DIGIT No. 1 Common Anode DIGIT No. 1 Common Cathode
35 1P/2P Cathode 1P/2P Anode
36 1F/2F Cathode 1F/2F Anode
DIG 1 DIG 2 DIG 3 DIG 4
DP1
DP2
A
FB
EC
D
G
L
NJ
H
P
MK
COMMON ANODE
COMMON CATHODE
30 28 9 7 1 36 33 32 6 5 4 2 31 35 8
30 28 9 7 1 36 33 32 6 5 4 2 31 35 8
COM 1
DIG 1
34 29
A B C D E F G H J K L M N P
A B C D E F G H J K L M N PDP2
A B C D E F G HJ K L M N P
A B C D E F G H J K L M N PDP2
A B C D E F G H J K L M N P
A B C D E F G H J K L M N P
A B C D E F G H J K L M N P
DP1
A B C D E F G H J K L M N P
DP1
COM 2
DIG 2
COM 3
DIG 3
COM 4
DIG 4
11 16 26
11 16 26 25 19 18 12 10 27 22 20 13 17 15 14 24 23
29
COM 2
DIG 2
COM 1
DIG 1
34
COM 3
DIG 3
COM 4
DIG 4
25 19 18 12 10 27 22 20 13 17 15 14 24 23
4
Absolute Maximum Ratings at TA = 25˚C
Description Symbol HDSP-A42C/HDSP-A47C Units
DC Forward Current per Segment or DP [1,2,3] IF 50 mA
Peak Forward Current per Segment or DP [2,3] IPEAK 100 mA
Average Forward Current [3] IAVE 30 mA
Reverse Voltage per Segment or DP (IR = 100 µA) VR 5 V
Operating Temperature TO –40 to +105 ˚C
Storage Temperature TS –40 to +120 ˚C
Wave Soldering Conditions Temperature 250 ˚C
Time 3 s
Notes:
1. Derate linearly as shown in Figure 1.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more in-
formation on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Bin Name Min.[2] Max.[2]
T 18.0 25.0
U 25.0 36.0
Notes:
1. Bin categories are established for classi-
cation of products. Products may not be
available in all bin categories.
2. Tolerance for each bin limit is ± 10%.
Optical/Electrical Characteristics at TA = 25˚C
Device
Series
HDSP- Parameter Symbol Min. Typ. Max. Units Test Conditions
A42C Forward Voltage IV 1.70 1.90 2.20 V IF = 20 mA
A47C Reverse Voltage VR 5 20 V IF = 100 µA
Peak Wavelength λPEAK 635 nm Peak Wavelength
of Spectral Distri-
bution at IF = 20 mA
Dominant Wavelength [3] λd 622.5 626 630 nm
Spectral Halfwidth ∆λ1/2 17 nm Wavelength Width
at Spectral Distri-
bution 1/2 Power
Point at IF = 20 mA
Speed of Response τs 20 ns Exponential Time
Constant, e-tτs
Capacitance C 40 pF VF = 0, f = 1 MHz
Intensity Bin Limits [1]
(mcd at 10 mA)
Contrast Enhancement
For information on contrast enhancement, please see
Application Note 1015.
Figure 1. Maximum forward current vs. ambient
temperature. Derating based on TJMAX = 130˚C.
Figure 2. Forward current vs. forwrad voltage.
I
F
– MAXIMUM AVERAGE CURRENT – mA
0
0
T
A
– AMBIENT TEMPERATURE – ˚C
60
30
120
40
10
20
20
40
50
60 80 100
IF – FORWARD CURRENT PER SEGMENT – mA
0.0
0
VF – FORWARD VOLTAGE – V
120
60
2.0 3.0
80
20
1.0 2.5
40
1.5
100
Figure 3. Relative luminous intensity vs. DC forward current. Figure 4. Relative eciency (luminous intensity
per unit current) vs. peak current.
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 10 mA)
0
0
I
F
– FORWARD CURRENT PER SEGMENT – m
A
3.5
3.0
1.5
1.0
4020 6010 30 50
HDSP-A4xC fig 3
2.5
2.0
0.5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 10 mA)
0
0
I
F
– FORWARD CURRENT PER SEGMENT – m
3.5
3.0
1.5
1.0
4020 6010 30 50
HDSP-A4xC fig 3
2.5
2.0
0.5
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5988-9665EN
AV02-1103EN - April 2, 2008
Soldering/Cleaning
Cleaning agents from ketone family (acetone, methyl
ethyl ketone, etc.) and from the chlorinated hydrocarbon
family (methylene chloride, trichloroethylene, carbon
tetrachloride, etc.) are not recommended for cleaning
LED parts. All of these various solvents attack or dissolve
the encapsulating epoxies used to form the package of
plastic LED parts.
For information on soldering LEDs, please refer to Applica-
tion Note 1027.