AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 1 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Description
The AP2331 is single channel current-limited integrated high-side
power switches optimized for hot-swap applications. The devices
have fast short-circuit response time for improved overall system
robustness and provide a complete protection solution for application
subject to heavy capacitive loads and the prospect of short circuit. It
offers reverse-current blocking, over-current, over-temperature and
short-circuit protection, as well as controlled rise time and under-
voltage lockout functionality.
The device is available in SOT23 and SC59 packages.
Features
Input voltage range: 2.7V – 5.2V
Fast short-circuit response time
0.4A accurate current limiting
• 250m on-resistance
• Reverse-current blocking
Built-in soft-start with 0.7ms typical turn-on time
• Over-current protection
• Over-voltage protection
Short-circuit and thermal protection
ESD protection: 3KV HBM, 300V MM
Ambient temperature range: -40°C to +85°C
Available in “Green” molding compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL recognized, file number E322375
IEC60950-1 CB scheme certified
Pin Assignments
Applications
LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers
Printers, Docking Stations, HUBs
Smart phones, e-Readers
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes In corporated’s definitions of Halogen- and Antimony-free, "Green " and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl)
and <1000ppm antimony compounds
Typical Application Circuit
0.1µF
IN
GND
OUT
Power Supply
2.7V to 5.2V Load
0.1µF
(Top View)
(To p View)
SC59
SOT23
IN
IN
GND
GND
OUT
OUT
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 2 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Pin Descriptions
Pin Name Pin Number Descriptions
GND 1 GND
OUT 2 Switch output pin
IN 3 Voltage input pin
Absolute Maximum Ratings
Symbol Parameter Ratings Units
ESD HBM Human Body Model ESD Protection 3 KV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage relative to GND 6.5 V
VOUT Output Voltage relative to GND VIN +0.3 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJMAX Maximum Junction Temperature 150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions
Symbol Parameter Min Max Units
VIN Input voltage relative to GND 2.7 5.2 V
IOUT Output Current 0 0.2 A
TA Operating Ambient Temperature -40 +85 °C
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 3 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Electrical Characteristics (TA = 25°C, VIN = +5.0V, unless otherwise stated.)
Symbol Parameter Test Conditions (Note 5) Min Typ. Max Unit
VUVLO Input UVLO VIN rising 2.35 2.65 V
IQ Input quiescent current Above UVLO, IOUT = 0 85 125 µA
IREV Reverse leakage current VIN = 0V, VOUT = 5V, IREV at VIN 0.01 0.10 µA
RDS(ON) Switch on-resistance VIN = 5V, IOUT = 0.2A 100 250 350 m
ILIMIT Over-load current limit VIN = 5V, VOUT = 4V 0.3 0.4 0.5 A
IOS Short-circuit current OUT shorted to ground 0.3 0.4 0.5 A
IROCP Reverse-current trigger point VIN = 5.0V, VOUT = 5.2V 0.20 0.25 A
TTRIG Deglitch time from reverse current trigger
to MOSFET turn off (Note 6) 0.5 0.7 1.0 ms
VOVP Output over-voltage trip point (Note 7) 5.3 5.6 V
TOVP Debounce time from output over-voltage
to MOSFET turn off 15 µs
VREC Recovery after turn-off from ROCP and
OVP 101% VIN
TON Output turn-on time (Note 8) CL = 0.1µF, RLOAD = 20
(UVLO to 90% VOUT-NOM) 0.7 ms
TSHDN Thermal shutdown threshold VIN = 2.7V to 5.2V 150 °C
THYS Thermal shutdown hysteresis 20 °C
θJA Thermal Resistance Junction-to-Ambient
(Note 9) SOT23 215
oC/W
SC59 255
oC/W
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. When reverse current triggers at IROCP = 0.20A, the reverse current is continuously clamped at IROCP for 0.7ms deglitch time until MOSFET is
turned off.
7. During output over-voltage protection, the output draws approximately 60µA current.
8. Since the output turn-on slew rate is dependent on input supply slew rate, this limit is only applicable for input supply slew rate between VIN/0.2ms to
VIN/1ms.
9. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 4 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Typical Performance Characteristics
UVLO Increasing
1ms/div
UVLO Decreasing
5ms/div
Over-Load Current Limit
5ms/div
Short-Circuit Current Limit
100µs/div
Deglitch Time from Reverse-Current T rigger to
MOSFET Turn-Off
200µs/div
Reverse-Current Limit
200µs/div
550
µ
s
200m
A
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 5 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Typical Performance Characteristics (cont.)
Output Over-Voltage Trip Point
10ms/div
Output Turn-On Time
200µs/div
-40 -20 0 20 40 60 80
AMBIENT TEMPERA TURE ( C)
Fig. 1 Quiescent Supply Current vs.
Am bi ent Tem per at ur e
°
0
20
40
60
80
100
120
140
V = 5.2V
IN
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
SUPPLY CURRENT (µA)
-40 -20 0 20 40 60 80
AMBIENT TEMPERA TURE ( C)
Fi g. 2 Sho r t C i r c uit Cu r r ent Limit vs .
Am bi ent Tem per at ure
°
0.388
0.390
0.392
0.394
0.396
0.398
0.400
0.402
S
H
O
R
T
C
I
R
C
U
I
T
C
U
R
R
E
N
T
(mA )
0.404
0.406
0.408
V = 2.7V
IN
V = 3.3V
IN
V = 5V,
IN
V = 5.2V
IN
C = 10µF
L
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INP U T VOLTAGE (V)
Fig. 3 Output Turn On-Time vs. Input Voltage
O
U
T
P
U
T
T
U
R
N
O
N
-
T
IME (ms)
0.20
0.25
0.30
0.35
0.40
0.45
C = 1µF
R = 5
L
L
Ω
V = 5.5V
IN
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
-40 -20 0 20 40 60 80
AMBIENT TEMPERA TURE ( C)
Fig. 4 Switch On-Resistance vs.
Am bi ent Temperatur e
°
0
50
100
150
200
250
300
O
N
-S
T
A
T
E
R
ESIS
T
A
N
C
E (m )
Ω
350
400
450
500
OVP at 5.4V OVP recovery
at 5.1V
CL=0.1µF
Rload=20
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 6 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Typical Performance Characteristics (cont.)
-40 -20 0 20 40 60 80
AMBIENT TEMPERA TURE ( C)
Fig. 5 Current Limit Trip Threshold vs.
Am bi en t Temperature
°
0.388
0.390
0.392
0.394
0.396
0.398
0.400
0.402
S
U
P
P
L
Y
C
U
R
R
EN
T
(µA)
0
50
100
150
200
250
300
R
EVE
R
SE
C
U
R
R
EN
T
LIM I
T
(mA)
350
400
450
500
-40 -20 0 20 40 60 80
AMBIENT TEMPERA TURE ( C)
Fig . 6 Reverse C ur r ent Limit vs.
Am bi e nt Temperatu re
°
V = 5V
IN
V = 3.3V
IN
V = 2.7V
IN
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 7 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Application information
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) guarantees that the
internal power switch is initially off during start-up. The UVLO
functions only when the power supply has reached at least 2.5V
(TYP). Whenever the input voltage falls below approximately
2.5V, the power switch is turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power
switch before input power is removed.
Over-Current and Short-Circuit Protection
An internal sensing FET is employed to check for over current
conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an over
current condition is detected, the device maintains a constant
output current and reduces the output voltage accordingly.
Complete shutdown occurs only if the fault stays long enough to
activate thermal limiting.
The different overload conditions and the corresponding respons e
of the AP2331 are outlined below:
S.NO Conditions Explanation Behavior of the AP2331
1 Short-circuit condition at start-up Output is shorted before input
voltage is applied or before
the part is powered up.
The IC senses the short circuit and immediately clamps
output current to a certain safe level namely ILIMIT
2 Short-circuit or Over current
condition
Short-Circuit or Overload
condition that occurs when
the part is powered up and
above UVLO.
At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit
function can react.
After the current limit function has tripped (reached the
over-current trip threshold), the device switches into
current limiting mode and the current is clamped at ILIMIT.
3 Gradual increase from nominal
operating current to ILIMIT Load increases gradually until
the current-limit threshold.
The current rises until ILIMIT. Once the threshold has been
reached, the device switches into its current limiting mode
and is clamped at ILIMIT.
Reverse-Current Protection
The USB specification does not allow an output device to source
current back into the USB port. In a normal MOSFET switch,
current will flow in reverse direction (from the output side to the
input side) when the output side voltage is higher than the input
side. A reverse current limit feature is implemented in the AP2 331
to limit such back currents. Reverse current limit is always active
in AP2331. Reverse current is limited at IROCP level and when
the fault exists for more than 700µs, output device is disabled and
shutdown. This is called the "Deglitch time from reverse current
trigger to MOSFET turn off”. Recovery from IROCP occurs when
the output voltage falls to 101% of input voltage.
Over-Voltage Protection
The device has an output over-voltage protection that triggers
when the output voltage reaches 5.3V(MIN). When this fault
condition stays on for longer than 15µs, (This is called the
“Debounce time from output over-voltage to MOSFET turn off”)
output device is disabled and shutdown. Recovery from ROVP
occurs when the output voltage falls to 101% of input voltage.
Thermal Protection
Thermal protection prevents the IC from damage when the die
temperature exceeds safe margins. This mainly occurs when
heavy-overload or short-circuit faults are present for extended
periods of time. The AP2331 implements a thermal sensing to
monitor the operating junction temperature of the power
distribution switch. Once the die temperature rises to
approximately +150°C, the Thermal protection feature gets
activated as follows: The internal thermal sense circuitry turns the
power switch off thus preventing the power switch from damage.
Hysteresis in the thermal sense circuit allows the device to cool
down to approximately +20°C before the outpu t is turned back on.
This built-in thermal hysteresis feature is an excellent feature, as it
avoids undesirable oscillations of the thermal protection circuit.
The switch continues to cycle in this manner until the load fault is
removed, resulting in a pulsed output.
Discharge Function
When input voltage falls below UVLO, the discharge function is
active. The output capacitor is discharged through an internal
NMOS that has a discharge resistance of 800. H ence, the output
voltage drops down to zero. The time taken for discharge is
dependent on the RC time constant of the resistance and the
output capacitor. Discharge time is calculated when UVLO falling
threshold is reached to output voltage reaching 300mV.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small
surface-mount packages to pass large current. Using the
maximum operating ambient temperature (TA) and RDS(ON), the
power dissipation can be calculated by:
PD = RDS(ON) × I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where: TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 8 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Ordering Information (cont.)
AP 2331 X - 7
7 : Tape & R eel
Package Packing
SA : SOT23
W : SC59
Device Package Code Packaging
(Note 10)
7” Tape and Reel
Quantity Part Number Suffix
AP2331SA-7 SA SOT23 3000/Tape & Reel -7
AP2331W-7 W SC59 3000/Tape & Reel -7
Note: 10. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Marking Information
(1) SOT23
Device Package Identification Code
AP2331SA-7 SOT23 KJ
(2) SC59
1 2
3
XX Y W X
( Top View )
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Internal code
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
Device Package Identification Code
AP2331W-7 SC59 KN
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 9 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Package Information (All Dimensions in mm)
Package Type:
(1) SOT23
(2) SC59
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
α 0° 8° -
All Dimensions in mm
SC59
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D - - 0.95
G - - 1.90
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
N 0.70 0.80 0.75
α 0° 8° -
All Dimensions in mm
A
M
JL
D
F
BC
H
K
G
K1
A
M
JL
D
BC
H
K
G
N
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 10 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
Suggested Pad Layout
(1) SOT23
(2) SC59
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C 2.0
E 1.35
Dimensions Value (in mm)
Z 3.4
X 0.8
Y 1.0
C 2.4
E 1.35
XE
Y
C
Z
X E
Y
C
Z
AP2331
0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH
AP2331
Document Number: DS35529 Rev. 4 - 2 11 of 11
www.diodes.com May 2012
© Diodes Incorporated
NEW PRODUCT
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any produc t described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated websit e, harmless agai nst all damages.
Diodes Incorporated does not warrant or accept any liabi lity whatsoever in respec t of any products purchased through unauthori zed
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any cl aim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or f oreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support devic e or to aff ect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated product s i n such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com