2015-12-23 Infrared Emitter Arrays (940 nm) Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Features: * Wavelength 950nm * Leadframe arrays, available from 2 to 10 Emitters per array * Short switching times * Same package dimensions as BPX 80 series * Miniature package Applications * Miniature photointerrupters * Barcode reader * Industrial electronics * For control and drive circuits * Sensor technology * Speed controller Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. 2015-12-23 1 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF = 40 mA, tp = 20 ms SFH 4942 50 ( 16) Q65111A6679 SFH 4943 50 ( 16) Q65111A6680 SFH 4944 50 ( 16) Q65111A6681 SFH 4945 50 ( 16) Q65111A6682 SFH 4946 50 ( 16) Q65111A6683 SFH 4947 50 ( 16) Q65111A6684 SFH 4948 50 ( 16) Q65111A6685 SFH 4949 50 ( 16) Q65111A6686 SFH 4940 50 ( 16) Q65111A6687 Note: measured at a solid angle of = 0.001 sr 2015-12-23 2 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Maximum Ratings (TA = 25 C) Parameter Symbol Values Unit Operation and storage temperature range Top; Tstg -40 ... 80 C Reverse voltage VR 5 V Forward current IF 40 mA Surge current (tp 40 s, D = 0) IFSM 1 A Power consumption Ptot 70 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 kV Thermal resistance junction - ambient 1) page 9 RthJA 750 K/W Thermal resistance junction - soldering point RthJS 650 K/W Characteristics (TA = 25 C) Parameter Symbol Values Unit Peak wavelength (IF = 40 mA, tp = 20 ms) (typ) peak 950 nm Centroid wavelength (IF = 40 mA, tp = 20 ms) (typ) centroid 940 nm Spectral bandwidth at 50% of Imax (IF = 40 mA, tp = 20 ms) (typ) 42 nm Half angle (typ) 10 Dimensions of active chip area (typ) LxW 0.3 x 0.3 mm x mm Distance chip surface to lens top (min .. max) H 1.3 ... 1.9 mm Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 40 mA, RL = 50 ) (typ) tr, tf Forward voltage (IF = 40 mA, tp = 20 ms) Forward voltage (IF = 1 A, tp = 100 s) 12 ns (typ (max)) VF 1.35 ( 1.7) V (typ (max)) VF 3.6 ( 4.6) V Reverse current (VR = 5 V) Total radiant flux (IF=40 mA, tp=20 ms) 2015-12-23 (typ) 3 IR not designed for reverse operation A e 30 mW Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Parameter Symbol Values Unit Temperature coefficient of Ie or e (IF = 40 mA, tp = 20 ms) (typ) TCI -0.3 %/K Temperature coefficient of VF (IF = 40 mA, tp = 20 ms) (typ) TCV -0.8 mV / K Temperature coefficient of wavelength (IF = 40 mA, tp = 20 ms) (typ) TC 0.3 nm / K Grouping (TA = 25 C) Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF = 40 mA, tp = 20 ms IF = 40 mA, tp = 20 ms IF = 1 A, tp = 40 s Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] 125 520 SFH 4942/3/4/5/6/7/8/9/0 16 Note: measured at a solid angle of = 0.01 sr Relative Spectral Emission 2) page 9 Irel = f(), TA = 25C Radiant Intensity 2) page 9 Ie / Ie(40 mA) = f(IF), single pulse, tp = 40 s, TA= 25C OHF04134 100 OHF05660 102 I rel % e e (40 mA) 80 101 60 100 40 10-1 20 0 800 850 900 950 nm 1025 10-2 0 10 101 102 mA 103 IF 2015-12-23 4 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Forward Current 2) page 9 IF = f(VF), single pulse, tp = 40 s, TA= 25C Max. Permissible Forward Current IF, max = f(TA), RthJA = 750 K / W OHF05661 45 mA IF 40 IF OHF05642 103 mA 35 102 30 25 20 101 15 10 5 0 0 20 40 60 100 80 C 100 TA IF OHF05662 tP D= T 0.9 0.8 0.7 0.6 0.5 0.4 tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.3 0.2 0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 2015-12-23 1 2 3 V 4 VF Permissible Pulse Handling Capability IF = f(tp), TC = 25 C, duty cycle D = parameter 1.1 A 0 5 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Radiation Characteristics 2) page 9 Irel = f(), TA= 25C 40 30 20 10 0 OHF05663 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 Package Outline Dimensions in mm. 2015-12-23 6 20 40 60 80 100 120 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Type: IRED per Row Dimension "B" SFH 4942 2 4.5 ... 4.9 SFH 4943 3 7.0 ... 7.4 SFH 4944 4 9.6 ... 10.0 SFH 4945 5 12.1 ... 12.5 SFH 4946 6 14.6 ... 16.0 SFH 4947 7 17.2 ... 17.6 SFH 4948 8 19.7 ... 20.1 SFH 4949 9 22.3 ... 22.7 SFH 4940 10 24.8 ... 25.2 Package Miniature Array, Epoxy Approximate Weight: 0.2 g Recommended Solder Pad Dimensions in mm. 2015-12-23 7 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave C T 250 235 C - 260 C First wave Second wave Continuous line: typical process Dotted line: process limits T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 C 120 C 100 C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-12-23 8 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-12-23 9 Version 1.2 SFH 4942/ 4943/ 4944/ 4945/ 4946/ 4947/ 4948/ 4949/ 4940 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 2015-12-23 10